XCL233 Series ETR28023-001a

Ultra-Low Quiescent Current, Inductor Built-in Step-Down DC/DC Converter

with Output voltage selectable function
☆Green Operation compatible

■GENERAL DESCRIPTION
The XCL233 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in
one tiny package. It uses an ultra-low current consumption circuit and PFM control. The control IC and coil are integrated to
achieve miniaturization, and a space-saving power supply can be configured simply by adding two external capacitors. the
ultra-low current consumption circuit and PFM control method realize high efficiency with a light load.
Additionally two-preset output voltage switchover function is available with using VSET pin.
This function can select an appropriate output voltage based on the MCU behavior mode and contribute a power
consumption reduction for a total system. An operating voltage range of 1.8V to 6.0V enables support for applications that
require an internally fixed output voltage from 0.5V to 3.6V.

■APPLICATIONS ■FEATURES
Input Voltage Range : 1.8V ~ 6.0V
● Smart meter
Output Voltage Setting : 0.5V ~ 1.9V (0.05V increments)
● Low Power RF 2.0V ~ 3.6V (0.1V increments)
● Sensor Module Output Voltage Accuracy ±20mV (VOUT1,2≦1.0V)
● Wearable Devices ±2.0% (VOUT1,2＞1.0V)
Output Current : 150mA
● Energy Harvest devices
Supply Current : 200nA @ VOUT=1.8V
● Back-up power supply circuit
Control Method : PFM control
● Smart card Efficiency 86% (VIN=3.6V, VOUT=1.8V, Iout=10mA)
● Devices with 1 Lithium cell Function : Output Voltage selectable function
CL Discharge (D Type)
UVLO
Protection Functions : Short Protection
Input / Output Capacitor : Ceramic Capacitor Compatible
Operation Ambient Temperature : -40 ~ 85℃
Package : CL-2025-03 (2.5 x 2.0 x 1.04 mm)
Environmentally Friendly EU RoHS compliant, Pb Free

■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE

CHARACTERISTICS
VOUT =1.8V, CIN=10μF, CL=20μF, Ta=25℃
100
90
VIN L1
VIN Lｘ
80
Efficiency : EFFI (%)

70
VSET
VSE T GND 60
VOUT 50
VCE
CE VOUT
L2 40 Vin=3.3V
30 Vin=4.2V
CIN CL
20 Vin=5.0V
10
0
0.001 0.01 0.1 1 10 100
Output Current : IOUT (mA)

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 XCL233 Series
■ BLOCK DIAGRAM

L1 L2
Inductor

VOUT

Control Signa l M1

Short Current
VOUT protection Sense
VSE T
VSET Controller VIN
Logic PFM
Comparator
FB -

+ PFM
Controller
Synch
Buffer Lx
CE CE Controller Logic VREF Driver

UVLO GND
Start-up
Controller

* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
XCL233B does not have CL Discharge function.

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 XC9140 (Design Target) XCL233
Series

■PRODUCT CLASSIFICATION
1) Ordering information
XCL233①②③④⑤⑥-⑦
DESIGNATOR ITEM SYMBOL DESCRIPTION
B Without CL Discharge
① Product Type
D With CL Discharge
Output Voltage combination
VOUT1 : 0.50V ~ 3.60V
②③④ (*2) Output Voltage Refer to the table VOUT2 : 0.50V ~ 3.60V
(VOUT1,2 ≦1.9V : 0.05V increments,
VOUT1,2 ＞ 1.9V : 0.1V increments)
Packages
⑤⑥-⑦ (*1) KR-G CL-2025-03(*3) (3,000pcs/Reel)
(Order Unit)
(*1)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2)
The standard specification is VOUT1 ＜ VOUT2.
With regard to other voltage, please contact our sales representative.
(*3)
CL-2025-03 Reels are shipped in moisture-proof packaging.

2) Selection Guide
B TYPE D TYPE
FUNCTION VOUT1 or VOUT2 VOUT1 or VOUT2
VOUT1,2 ≧1.2V VOUT1,2 ≧1.2V
＜1.2V ＜1.2V
Output Voltage Output voltage selectable by VSET pin
Short Protection - Yes - Yes
CL Discharge - Yes
Chip Enable Yes
UVLO Yes

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 XCL233 Series

●Symbols ②③④ : Output voltage and part number combination

When using output voltage switching function Standard part number

VOUT1 (V)
②③④
0.50 0.60 0.65 0.70 0.80 0.90 1.00 1.10 1.20 1.30 1.50 1.80 1.85 2.00 2.20 2.50 3.00
0.50 - - R04 - R16 - - - - - - - - - - - -
0.60 N02 - - - - - - - - - - - - - - - -
0.65 N03 001 - - - - - - - - - - - - - - -
0.70 N04 002 061 - - - - - - - - - - - - - -
0.80 N06 004 063 121 - - - - - - - - - - - - -
0.90 N08 006 065 123 236 - - - - - - - - - - - -
1.00 N10 008 067 125 238 347 - - - - - - - - - - -
1.10 N12 010 069 127 240 349 454 - - - - - - - - - -
VOUT2 (V)

1.20 N14 012 071 129 242 351 456 557 - - - - - - - - -

1.30 N16 014 073 131 244 353 458 559 656 - - - - - - - -
1.50 N20 018 077 135 248 357 462 563 660 753 - - - - - - -
1.80 N26 024 083 141 254 363 468 569 666 759 933 - - - - - -
1.85 N27 025 084 142 255 364 469 570 667 760 934 B67 - - - - -
2.00 N30 028 087 145 258 367 472 573 670 763 937 B70 C06 - - - -
2.20 N34 032 091 149 262 371 476 577 674 767 941 B74 C10 D10 - - -
2.50 N40 038 097 155 268 377 482 583 680 773 947 B80 C16 D16 E35 - -
3.00 N50 048 107 165 278 387 492 593 690 783 957 B90 C26 D26 E45 F93 -
3.30 N56 054 113 171 284 393 498 599 696 789 963 B96 C32 D32 E51 F99 K66
With regard to other voltage, please contact our sales representative.

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 XC9140 (Design Target) XCL233
Series

■PIN CONFIGURATION
L1
7

VIN 6 1 Lx

VSET 5 9 2 GN D

CE 4 3 VOUT

8
L2

CL-2025-03
< BOTTOM VIEW >

■PIN ASSIGNMENT
PIN NUMBER PIN NAME FUNCTION
1 Lx Switching
2 GND Ground
3 VOUT Output Voltage
4 CE Chip Enable
5 VSET Output Voltage Control
6 VIN Input Voltage
7 L1 Inductor Electrodes
8 L2 Inductor Electrodes
Exposed thermal pad.
9 EP
The Exposed pad must be connected to GND(Pin2).

■ FUNCTION
PIN NAME SIGNAL STATUS
H Active
CE L Stand-by
OPEN Undefined State (*1)
(*1) Please do not leave the CE pin open.

PIN NAME SIGNAL STATUS

H VOUT2
VSET L VOUT1
OPEN Undefined State (*2)
(*2) Please do not leave the VSET pin open.

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 XCL233 Series
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER SYMBOL RATINGS UNITS
VIN Pin Voltage VIN -0.3 ~ 7.0 V
Lx Pin Voltage VLX -0.3 ~ VIN + 0.3 or 7.0 (*1) V
VOUT Pin Voltage VOUT -0.3 ~ VIN + 0.3 or 7.0 (*1) V
CE Pin Voltage VCE -0.3 ~ 7.0 V
VSET Pin Voltage VSET -0.3 ~ 7.0 V
Power Dissipation Pd 800 (40mm × 40mm standard board) (*2) mW
Junction Temperature Tj -40 ~ 125 ℃
Storage Temperature Tstg -55 ~ 125 ℃
* All voltages are described based on the GND pin.
(*1) The maximum value should be either V +0.3V or 7.0V in the lowest.
IN
(*2) The power dissipation figure shown is PCB mounted and is for reference only.

Please refer to PACKAGING INFORMATION for the mounting condition.

■RECOMMENDED OPERATING CONDITIONS

PARAMETER SYMBOL MIN. TYP. MAX. UNITS
VIN Pin Voltage VIN 1.8 ~ 6.0 V
IOUT Current IOUT 0 ~ 150 mA
CE Pin Voltage VCE 0.0 ~ 6.0 V
VSET Pin Voltage VSET 0.0 ~ 6.0 V
Operating Ambient Temperature Topr -40 ~ 85 ℃
Junction Temperature Tj -40 ~ 105 ℃
* All voltages are described based on the GND pin.

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 XC9140 (Design Target) XCL233
Series

■ELECTRICAL CHARACTERISTICS
Ta=25℃
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT

When connected to external components,

Output Voltage1(*1) VOUT1 - <T-1> - V ①
VSET = 0.0V , IOUT = 30mA

VSET = 0.0V, Voltage which LX pin changes “H” to “L” level

Output Voltage1-2 VOUT1-2 <E-1> <E-2> <E-3> V ②
while VOUT is increase. (*5)

When connected to external components,

Output Voltage2(*1) VOUT2 - <T-1> - V ①
VSET = VIN , IOUT = 30mA

VSET = VIN, Voltage which LX pin changes “H” to “L” level

Output Voltage2-2 VOUT2-2 <E-1> <E-2> <E-3> V ②
while VOUT is increase. (*5)

Operating Voltage Range VIN - 1.8 - 6.0 V ①

Maximum Output Current IOUTMAX When connected to external components (*2)

150 - - mA ①

VOUT = 0.0V , VCE = VSET = 1.8V Ta=25℃

UVLO Release Voltage VUVLOR - 1.50 1.78 V ②
Voltage which Lx pin holding "H" level(*5) Ta=-40~85℃(*3)

VOUT = 0.0V , VCE = VSET = 1.8V Ta=25℃

UVLO Detect Voltage VUVLOD 1.00 1.40 - V ②
Voltage which Lx pin holding "L" level (*5)
Ta=-40~85℃(*3)

Quiescent Current Iq VIN= VCE =<C-1>, VSET = 0.0V , VOUT = VOUT1×1.05 - <E-4> <E-5> nA ③

Stand-by Current ISTB VIN = 6.0V , VCE = VOUT =0.0V - 0.0 0.1 μA ③

When connected to external components,

PFM Switching Current IPFM - 400 600 mA ①
VIN = VOUT(T) + 2.0V, IOUT = 10mA

Lx SW ”H” ON Resistance RLXH VOUT = 0.0V, VIN = VCE = VSET = 5.0V, ILx = 50mA - 0.40 0.50 Ω ④

Lx SW ”L” ON Resistance(*3) RLXL VIN = 5.0V - 0.35 0.45 Ω -

Lx SW ”H” Leakage Current ILeakH VIN = 6.0V , VOUT = VCE = VSET = 0.0V , VLx = 6.0V - 0.0 0.1 μA ④

Lx SW ”L” Leakage Current ILeakL VIN = 6.0V , VOUT = VCE = VSET = 0.0V , VLx = 0.0V - 0.0 0.1 μA ④
Output Voltage
⊿VOUT/ IOUT = 30mA ppm/
Temperature - ±100 - ①
(VOUT ・⊿Topr) -40℃ ≦ Topr ≦ 85℃ ℃
Characteristics

Unless otherwise stated, VIN=5V, VCE=5V, VOUT(T)=Nominal Value

(*1) VOUT1 and VOUT2 are the average values of the output voltage considering the ripple voltage and they are set so that they can be a setting output voltage with
this evaluation condition.
(*2) The maximum output current performance varies based on a voltage difference between an input voltage and an output voltage, and external components and
so on. Regarding detail of this variation, please refer to OPERATIONAL EXPLANATION and NOTE ON USE section.
(*3) Design value
(*4) SHORT PROTECTION with LATCH is not available if VOUT1 or VOUT2 is 1.2V or less.
(*5) "H" = VIN ~ VIN -1.2V, "L" = 0.1V ~ -0.1V

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 XCL233 Series
■ELECTRICAL CHARACTERISTICS
Ta=25℃
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT

VSET = VIN , VOUT = 0.0V, Ta=25℃

CE "H" Voltage VCEH 1.2 - 6.0 V ②
Voltage which Lx pin holding “H” level(*5) Ta=-40~85℃(*3)

VSET = VIN , VOUT = 0.0V, Ta=25℃

CE "L" Voltage VCEL GND - 0.3 V ②
Voltage which Lx pin holding “L” level (*5)
Ta=-40~85℃(*3)

CE “H” Current ICEH VIN = 6.0V, VOUT = 0.0V , VCE = 6.0V, VSET = 6.0V -0.1 0.0 0.1 μA ④

CE “L” Current ICEL VIN = 6.0V, VOUT = 0.0V , VCE = 0.0V, VSET = 6.0V -0.1 0.0 0.1 μA ④
VOUT = (VOUT1 + VOUT2) / 2 , Ta=25℃
VOUT1＜VOUT2
VSET "H" Voltage VSETH →Voltage which Lx pin holding “H” level(*5) 1.2 - 6.0 ② ②
Ta=-40~85℃(*3)
VOUT1＞VOUT2
→Voltage which Lx pin holding “L” level(*5)
VOUT = (VOUT1 + VOUT2) / 2 , Ta=25℃
VOUT1＜VOUT2
VSET "L" Voltage VSETL →Voltage which Lx pin holding “L” level(*5) GND - 0.3 ② ②
Ta=-40~85℃(*3)
VOUT1＞VOUT2
→Voltage which Lx pin holding “H” level(*5)

VSET “H” Current IVSETH VIN = 6.0V, VOUT = 0.0V , VCE = 6.0V, VSET = 6.0V -0.1 0.0 0.1 μA ④

VSET “L” Current IVSETL VIN = 6.0V, VOUT = 0.0V , VCE = 6.0V, VSET = 0.0V -0.1 0.0 0.1 μA ④

Short Protection VSET = 5.0V, Ta=25℃

VSHORT 0.10 0.54 0.80 ② ②
Threshold Voltage (*4) Voltage which Lx pin holding “L” level(*5) Ta=-40~85℃(*3)

CL Discharge (Type D) RDCHG VIN = 5.0V, VCE = 0.0V, VOUT =0.1V, VSET =5.0V 29 45 60 Ω ②

Inductance Value L Test Frequency=1MHz - 2.2 - μH

ΔT=+40℃
Inductor Rated Current IDC_L Current value that raises the temperature by 40℃ with - 850 - mA
DC current

Unless otherwise stated, VIN=5V, VCE=5V, VOUT(T)=Nominal Value

(*1) VOUT are the average values of the output voltage considering the ripple voltage and they are set so that they can be a setting output voltage with
this evaluation condition.
(*2) The maximum output current performance varies based on a voltage difference between an input voltage and an output voltage, and external components and
so on. Regarding detail of this variation, please refer to OPERATIONAL EXPLANATION and NOTE ON USE section.
(*3) Design value
(*4) SHORT PROTECTION with LATCH is not available if VOUT1 or VOUT2 is 1.2V or less.
(*5) "H" = VIN ~ VIN -1.2V, "L" = 0.1V ~ -0.1V

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 XC9140 (Design Target) XCL233
Series

■ELECTRICAL CHARACTERISTICS
SPEC Table

Nominal VOUT (V) VOUT1-2 (V) VIN (V) Iq (nA)

Output Voltage <T-1> <E-1> <E-2> <E-3> <C-1> <E-4> <E-5>
VOUT(T) TYP. MIN. TYP. MAX. VIN TYP. MAX.
0.50 0.500 0.460 0.480 0.500 1.80 200 600
0.60 0.600 0.560 0.580 0.600 1.80 200 600
0.70 0.700 0.660 0.680 0.700 1.80 200 600
0.80 0.800 0.760 0.780 0.800 1.80 200 600
0.90 0.900 0.860 0.880 0.900 1.80 200 600
1.00 1.000 0.960 0.980 1.000 1.80 200 600
1.10 1.100 1.058 1.080 1.102 1.80 200 600
1.20 1.200 1.156 1.180 1.204 1.80 200 600
1.30 1.300 1.254 1.280 1.306 1.80 200 600
1.40 1.400 1.352 1.380 1.408 1.90 200 600
1.50 1.500 1.450 1.480 1.510 2.00 200 600
1.60 1.600 1.548 1.580 1.612 2.10 200 600
1.70 1.700 1.646 1.680 1.714 2.20 200 600
1.80 1.800 1.744 1.780 1.816 2.30 200 600
1.90 1.900 1.842 1.880 1.918 2.40 200 600
2.00 2.000 1.940 1.980 2.020 2.50 210 630
2.10 2.100 2.038 2.080 2.122 2.60 210 630
2.20 2.200 2.136 2.180 2.224 2.70 210 630
2.30 2.300 2.234 2.280 2.326 2.80 210 630
2.40 2.400 2.332 2.380 2.428 2.90 210 630
2.50 2.500 2.430 2.480 2.530 3.00 220 660
2.60 2.600 2.528 2.580 2.632 3.10 220 660
2.70 2.700 2.626 2.680 2.734 3.20 220 660
2.80 2.800 2.724 2.780 2.836 3.30 220 660
2.90 2.900 2.822 2.880 2.938 3.40 230 690
3.00 3.000 2.920 2.980 3.040 3.50 230 690
3.10 3.100 3.018 3.080 3.142 3.60 230 690
3.20 3.200 3.116 3.180 3.244 3.70 240 720
3.30 3.300 3.214 3.280 3.346 3.80 240 720
3.40 3.400 3.312 3.380 3.448 3.90 240 720
3.50 3.500 3.410 3.480 3.550 4.00 250 750
3.60 3.600 3.508 3.580 3.652 4.10 250 750
With regard to other voltage, please contact our sales representative.

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 XCL233 Series
■TEST CIRCUITS
< Test Circuit No.① > < Test Circuit No.② >
Wave Form Measure Point
L Wave Form Measure Point

L1 L1
IOUT

Lx VOUT Lx VOUT

VIN VSE T VIN VSE T

Rpulldown
A V

V A CE GND CL V A CE GND
V VOUT

VIN CIN VCE

L2 VIN CIN VCE
L2 VSE T
VSE T
V V

※ External Components ※ External Components

L : 2.2μH(For test process) CIN : 10μF

CIN : 10μF Rpulldown : 100Ω
CL : 10μF

< Test Circuit No.③ > < Test Circuit No.④ >

L1 L1

Lx VOUT Lx VOUT

VIN VSE T VIN VSE T

A V A
A
A CE GND VSE T VOUT
V A CE GND VLX
IS A
L2 VIN CIN L2
VIN CIN VCE VSE T
VCE

※ External Components ※ External Components

CIN : 10μF CIN : 0.1μF

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 XC9140 (Design Target) XCL233
Series

■TYPICAL APPLICATION CIRCUIT

VIN L1
VIN Lｘ

VSET
VSE T GND
VOUT
VCE
CE VOUT
L2

CIN CL

(NOTES):
The coil is exclusively for this product.
Please do not use it for any purpose other than this product.

【Typical Examples】
Manufacturer Product Number Value Size
Murata GRM188R61A106ME69
CIN Taiyo Yuden MSASL168BB5106MTNB33 10μF/10V 1.6 x 0.8 x 1.0mm
TDK C1608X5R1A106M
GRM188R61A106ME69 10μF/10V
Murata
GRM188R61A226ME15 22μF/10V
MSASL168BB5106MTNB33 10μF/10V
CL Taiyo Yuden MSASL168BB5226MTNA01 22μF/10V 1.6 x 0.8 x 1.0mm
MSASJ168BB5226MTNA01 22μF/6.3V
C1608X5R1A106M 10μF/10V
TDK
C1608X5R1A226M 22μF/10V

* Please select the components taking into consideration the rated voltage, rated current, and ceramic capacitor DC bias characteristics, etc.

* Use a ceramic capacitor with an execution capacitance value equal to or higher than the recommended component.
If a capacitor with a low effective capacitance value is used, the output voltage may become unstable.

* Please increase a capacitance value for CL in order to reduce output ripple voltages.
CL such as tantalum capacitors which have a larger ESR value can increase output ripple voltages.
If large-capacity capacitors such as electrolytic capacitors are connected in parallel, the inrush current may increase
at startup and the output voltage may become unstable.

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 XCL233 Series
■OPERATIONAL EXPLANATION
The XCL233 series consists of a reference voltage supply, PFM comparator, Pch driver FET, Nch driver FET,
current sensing circuit, PFM control circuit, CE control circuit, and others.

L1 L2
Inductor

VOUT

Control Signa l M1

Short Current
VOUT protection Sense
VSE T
VSET Controller VIN
Logic PFM
Comparator
FB -

+ PFM
Controller
Synch
Buffer Lx
CE CE Controller Logic VREF Driver

UVLO GND
Start-up
Controller

< BLOCK DIAGRAM >

The efficiency performance at a light load current is significantly improved compared to existing Torex products by implementing
a current limit PFM as a control method and reducing a consumption current by IC itself.

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 XC9140 (Design Target) XCL233
Series

■OPERATIONAL EXPLANATION (Continued)

<Normal operation>
This IC controls the output voltage by adjusting the following ①~③ operation intervals in response to the output current.
The VOUT1 and VOUT2 output voltage average values during actual operation depend on VOUT1-2, VOUT2-2 and the ripple voltage
during actual operation and are calculated as follows. For this reason, if the ripple voltage changes due to the influence of the
input voltage, output voltage, or peripheral components, etc., the output voltage average value will change.

VOUT1 = VOUT1-2 + Ripple Voltage x 1/2(VSET= ”L”)

VOUT2 = VOUT2-2 + Ripple Voltage x 1/2(VSET= ”H”)

①The feedback voltage (FB voltage) is the voltage that results from dividing the output voltage with the VOUT Controller logic
circuit. The PFM comparator compares this FB voltage to VREF. When the FB voltage is lower than VREF,
the PFM comparator sends a signal to the PFM control circuit to turn on the Pch driver FET.

The On Time to Pch driver FET can be obtained by the following equation.

tON = L × IPFM / (VIN - VOUT)

②When the Pch driver FET turns on, the coil current increases until the coil current reaches PFM Switching Current (IPFM).
When the coil current reaches IPFM, the Pch driver FET turns off and then the Nch driver FET turns on.

③ After the Nch driver FET turns on, the coil current will decrease and when the coil current goes down to approx. 0mA, the Nch
driver FET will turn off.
The Pch driver FET and Nch driver FET remain off until the FB voltage becomes lower than the reference voltage VREF.

The above ①~③ switching operations increase the FB voltage accompanying the output voltage increase, but if the PFM
comparator determines the FB voltage is lower than the reference voltage VREF before the coil current reaches 0mA, the Nch
driver FET turns off and the status moves to ①.

VOUT1 Ripple
Ripple Voltage x 1/2 Voltage
VOUT1-2

VOUT
@VSET=”L”

0V

tON tON

Lx

0V

IPFM

Coil
Curren t

IOUT
0mA

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 XCL233 Series
■OPERATIONAL EXPLANATION (Continued)
<Maximum on-time function, 100% Duty operation>
When the input / output potential difference decreases, the on-time required for the coil current to reach IPFM increases, and the
output ripple voltage tends to increase. Therefore, under conditions where the input / output potential difference is small, excessive
ripple voltage is suppressed by limiting the maximum on-time that the Pch driver FET can turn on after the FB voltage becomes
higher than the reference voltage VREF to 3.0μs (TYP.).
If the input / output potential difference is further reduced, the FB voltage is always lower than the reference voltage VREF, so the
100% duty operation is performed and the Pch driver FET is always on.

At 100% duty, the current consumption of the IC increases compared to normal operation.

VOUT1 Ripple
Ripple Voltage x 1/2 Voltage
VOUT1-2

VOUT
@VSET=”L”

0V

tON_MAX tON_MAX

Lx

0V

IPFM

Coil
Curren t

IOUT
0mA

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 XC9140 (Design Target) XCL233
Series

■OPERATIONAL EXPLANATION (Continued)

<CE function>
When "H" voltage (VCEH) is fed to the CE pin, normal operation starts after raising the output voltage with Start-up Mode.
When the "L" voltage (VCEL) is fed to the CE pin, it enters the stand-by state and the current consumption is suppressed to
0.0μA (TYP.). Additionally, Pch MOS driver FET and Nch MOS driver FET are turned off.

<Start-up Mode>
After “H” voltage (VCEH) is fed to CE pin and UVLO function is released, by the time when FB voltage goes up to 0.9 x VREF, the
startup mode operates.

Unlike the normal operation, the start-up mode stops the operation of the short-circuit protection function and prevents the IC
from being inadvertently stopped.
In order to suppress the inrush current, the peak current of the coil is limited to 0.7 x IPFM, and the Nch driver FET does not turn
on and the coil current flows through the parasitic diode of the Nch driver FET.
The rise time of the output voltage depends on the output capacitance and output current.

Start-up Mode
(Start-up time Depend on CL,Iout) Normal operation Stand-by

0.9 x VOUT(T)
VOUT B Type
(Fall time depends on Iout)
D Type

0V

0.9 x VREF
FB B Type
Voltage
D Type
0V

Coil IPF M
Curren t 0.7 x IPF M

0mA

VCE
VCEH
VCEL
0V

<UVLO function>
When the VIN voltage becomes UVLO Detect Voltage (VUVLOD) or less, the UVLO function operates to forcibly turn off the Pch
MOS driver FET to prevent erroneous pulse output due to operation instability of the internal circuit.
During the UVLO function, the Pch driver FET and Nch driver FET turn off, and the Nch FET M1 between the VOUT pin and GND
pin turns on to discharge the output capacitance and make the output voltage be lower.

When the VIN voltage becomes UVLO Release Voltage (VUVLOR) or more, the UVLO function is canceled. After the UVLO function
is canceled, the output voltage rises with the startup mode, and then the normal operation is performed.

Moreover, during the UVLO operation, the current consumption increases because the internal circuit is operating and the
switching operation is stopped, not the stand-by state.

15/30
 XCL233 Series
■OPERATIONAL EXPLANATION (Continued)
<Short protection function>
・Case (a) : VOUT1,2 ≧1.2V
The short-circuit protection function monitors the VOUT pin voltage, and if the VOUT pin voltage drops below the Short Protection
Threshold Voltage (VSHORT) due to a short circuit or overcurrent, the short circuit protection function operates.
When the short-circuit protection function is activated, the Pch driver FET and Nch driver FET are held off. If the VOUT pin voltage
exceeds the Short Protection Threshold Voltage (VSHORT) after the short-circuit protection function is activated, normal operation
resumes.
To cancel the short-circuit protection function, it is necessary to start the IC after putting the IC in the standby state with the CE
function, or to raise the input voltage after setting the input voltage below the UVLO detection voltage (VUVLOD).

Short or Overcurrent Start-up & Short or Overcurrent Start-up &

Normal operation
Condition Normal operation Condition Normal operation

VOUT VOUT (T)

VSHOR T
0V

IPF M
0.7 x IPF M
Coil
Curren t 0mA

RLo ad

0Ω

VCE VCEH
VCEL
0V

Restart

VUVLOH
VIN VUVLOD

0V
Restart

・Case (b) : VOUT1 or VOUT2 ＜1.2V

The short-circuit protection function is not implemented in the part numbers where VOUT1 or VOUT2 is less than 1.2V. If a short
circuit or overcurrent occurs, the output voltage will drop and switching operation will continue.
When the short-circuit state or excessive output current is released, the output voltage rises quickly to the set output voltage.

Normal operation Short or Overcurrent Condition Normal operation

VOUT VOUT (T)

VSHOR T
0V

IPF M

Coil
Curren t 0mA

RLo ad

0Ω

16/30
 XC9140 (Design Target) XCL233
Series

■OPERATIONAL EXPLANATION (Continued)

<CL Discharge function (D type)>
On the XCL233 series, a CL discharge function is available as an option.

CL discharge function turns on the Nch FET M1 between the VOUT pin and GND pin when the stand-by condition in order to
discharge the output capacitance quickly and make the output voltage be lower.
This prevents malfunctioning of the application in the event that a charge remains on CL when the IC is stand-by state.

The discharge time is determined by CL and the CL discharge resistance RDCHG, including the Nch FET M1.
the discharge time of the output voltage is calculated by means of the equation below.

V = VOUT(T) × e - t /τ
t=τIn(VOUT(T) / V)

V : Output voltage during discharge

VOUT(T) : Output voltage
t : Discharge time
CL : Effective capacitance of Output capacitor
RDCHG : CL auto-discharge resistance
τ : CL × RDCHG

<Output Voltage selectable function>

When "H" voltage (VSETH) is fed to the VSET pin, the set output voltage operates as VOUT2, and when "L" voltage (VSETL) is
fed, the set output voltage operates as VOUT1.

When the VSET pin voltage is switched during normal operation, the set output voltage is changed to the changed output voltage
after a certain period.

VSET SIGNAL Output Voltage Comment

VOUT2
H -
(Higher Set Voltage)
VOUT1
L -
(Lower Set Voltage)
VOUT2 → VOUT1 Output voltage starts to drop to VOUT1 30μs after “L” input.
(VOUT1 ＜ VOUT2) Falling speed depends on output current.
H → L
VOUT2 → VOUT1 Output voltage starts to rise to VOUT2 30μs after “L” input.
(VOUT1 ＞ VOUT2) Rise speed depends on IPFM.
VOUT1 → VOUT2 Output voltage starts to rise to VOUT2 30μs after “H” input.
(VOUT1 ＜ VOUT2) Rise speed depends on IPFM.
L → H
VOUT1 → VOUT2 Output voltage starts to drop to VOUT1 30μs after “H” input.
(VOUT1 ＞ VOUT2) Falling speed depends on output current.

17/30
 XCL233 Series
■NOTE ON USE
1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC.
If it exceeds the absolute maximum rating, it may deteriorate or be destroyed.
Also, if used under conditions outside the recommended operating range, the IC may not operate normally or may cause
deterioration.

2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally
connected components, so refer to EXTERNAL COMPONENTS SELECTION and the specifications of each component and
be careful when selecting the components. Be especially careful of the characteristics of the capacitor used for the load
capacity CL and use a capacitor with B characteristics (JIS Standard) or an X7R/X5R (EIA Standard) ceramic capacitor.

3. The CE pin and VSET pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin and
VSET pin.
If an intermediate voltage is fed to the CE and VSET pins, a through current will flow through the input stage of the CE and
VSET pins, increasing current consumption.

4. At light loads or when IC operation is stopped, leakage current from the Pch driver FET may cause the output voltage to rise.

5. Switching operation may be performed continuously due to internal delay or input offset of the PFM comparator circuit.
If the switching operation continues, the output ripple voltage increases and the output voltage rises as the ripple voltage
increases.

6. When the input / output potential difference is small, the ripple voltage increases and the output voltage may increase.

7. Since the short-circuit protection function is not implemented in the part number where both of or either VOUT1 or VOUT2 is less
than 1.2V, the coil current may be superposed under the condition of high input voltage and excessive output current.

8. During start-up mode, the peak current of the coil is set lower than in normal operation, so the output voltage may not rise under
conditions where the output current is large during start-up.

9. To suppress current consumption, UVLO detection is performed only for a certain period after the Pch driver FET is turned on.
For this reason, the UVLO function may not operate if the VIN pin voltage instantaneously drops below the UVLO detection
voltage (VUVLOD).

10. Under the conditions of Vin≦2.7V, set output voltage ≦1.0V and Ta≧65℃, the efficiency can drastically drop.
Normally after the Nch driver FET turns on, the coil current falls to 0mA, and then Nch driver FET turns off.
Under the above conditions, however, before the coil current falls to 0mA, Nch driver FET turns off and its loss increases, which
leads to the drop of efficiency.

11. This IC is an Inductor Built-in product, do not place it in an environment with a strong magnetic field such as near a magnet.
The influence of a strong magnetic field may cause a decrease in inductance value, deterioration of efficiency, and abnormal
operation of the IC.

12. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.

13. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs
and post-aging protection treatment when using Torex products in their systems.

18/30
 XC9140 (Design Target) XCL233
Series

■NOTE ON USE (Continued)

14. Instructions of pattern layouts

(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to
the VIN & GND pins.

(2) Please mount each external component as close to the IC as possible.

(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.

(4) Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground
currents at the time of switching may result in instability of the IC.

(5) The IC is a heat-generating component, and heat dissipation measures may be required depending on the conditions of use.
If necessary, perform thermal design with PCB layout, etc.

< Reference pattern layout >

Layer 1 Layer 2

Layer 3 Layer 4

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 XCL233 Series
■Notes on handling of product
(1) The coil mounted on this product complies with the general surface mount type chip inductor specifications, and may have
scratches, flux stains, etc.

(2) Do not use this product in the following environments. Places exposed to water or salt water, places where condensation
occurs, places where toxic gases (hydrogen sulfide, zinc acid, chlorine, ammonia, etc.) are present.

(3)Please do not wash this product with solvent.

■Notes on mounting
(1) Please set the mounting position accuracy within 0.05 mm.

(2) The proper position of mounting is based on the coil terminal

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 XC9140 (Design Target) XCL233
Series

■ TYPICAL PERFORMANCE CHARACTERISTICS

(1) Efficiency vs. Output Current

V OUT=1.8V V OUT=3.3V
CIN = MSASL168BB5106MTNB33(10μF/10V) CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASJ168BB5226MTNA01(22μF/6.3V) CL = MSASJ168BB5226MTNA01(22μF/6.3V)

100 100
90 90
80 80

Efficiency: EFFI (%)

Efficiency: EFFI (%)

70 70
VIN = 5.0V 60
60
VIN = 4.2V VIN = 5.0V
50 50
40 VIN = 3.3V 40 VIN = 4.2V
30 30
20 20
10 10
0 0
0.001 0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100

Output Current: IOUT (mA) Output Current: IOUT (mA)

(2) Output Voltage vs. Output Current

V OUT=1.8V V OUT=3.3V
CIN = MSASL168BB5106MTNB33(10μF/10V) CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASJ168BB5226MTNA01(22μF/6.3V) CL = MSASJ168BB5226MTNA01(22μF/6.3V)

2.05 3.70
2.00
VIN = 5.0V 3.65 VIN = 5.0V
VIN = 4.2V 3.60
1.95 3.55
VIN = 3.3V VIN = 4.2V
3.50
Output Voltage: V OUT (V)
Output Voltage: V OUT (V)

1.90
3.45
1.85
3.40
1.80 3.35
1.75 3.30
3.25
1.70 3.20
1.65 3.15
3.10
1.60
3.05
1.55 3.00
0.001 0.01 0.1 1 10 100 0.001 0.01 0.1 1 10 100

Output Current: IOUT (mA) Output Current: IOUT (mA)

(3) Ripple Voltage vs. Output Current

V OUT=1.8V V OUT=3.3V
CIN = MSASL168BB5106MTNB33(10μF/10V) CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASJ168BB5226MTNA01(22μF/6.3V) CL = MSASJ168BB5226MTNA01(22μF/6.3V)

100 100
90 VIN = 5.0V 90 VIN = 5.0V
VIN = 4.2V VIN = 4.2V
80 80
Ripple Voltage: Vr (mV)

Ripple Voltage: Vr (mV)

VIN = 3.3V
70 70
60 60
50 50
40 40
30 30
20 20
10 10
0 0
0.1 1 10 100 0.1 1 10 100

Output Current: IOUT (mA) Output Current: IOUT (mA)

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 XCL233 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(4) Output Voltage vs. Ambient (5) UVLO Voltage vs. Ambient
V OUT=1.8V

IOUT = 30mA
1.90 1.8
1.88
Output Voltage: V OUT (V)

1.7 UVLO Release Voltage

1.86
1.6

UVLO Voltage (V)

UVLO Detect Voltage
1.84
1.5
1.82
1.80 1.4
1.78 1.3
1.76 1.2
1.74
1.1
1.72
1.70 1.0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100

Ambient Temperature: Ta (℃) Ambient Temperature: Ta (℃)

(6) Quiescent Current vs. Ambient Temperature (7) Stand-by Current vs. Ambient Temperature

V OUT=0.6V

500 1.0
450 VIN=4.2V
Standby Current: ISTB (μA)
Quiescent Current: Iq (nA)

400 VIN=3.6V 0.8

350
VIN=1.8V
300 0.6
250
200 0.4
150
100 0.2 V IN = 6.0V
50
0 0.0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃) Ambient Temperature: Ta (℃)

(8) PFM Switching Current vs. Ambient Temperature (9) Lx SW ”H” ON Resistance vs. Ambient Temperature

V OUT=0.6V

CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASL168BB5226MTNA01(22μF/10V) ×2

IOUT = 30mA
Lx SW ”H” ON Resistance: R LxH (mΩ)

600 1000
VIN = 5.0V
PFM Sw itching Current: IPFM (mA)

500 VIN = 5.0V 800 VIN = 3.6V

400 VIN = 1.8V

600
300
400
200

100 200

0 0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃) Ambient Temperature: Ta (℃)

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 XC9140 (Design Target) XCL233
Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(10) Lx SW ”L” ON Resistanc vs. Ambient Temperature (11) Lx SW ”H” Leakage Current vs. Ambient Temperature

Lx SW ”H” Leakage Current: ILeakH (μA)

Lx SW ”L” ON Resistanc: RLxL (mΩ)

1000 1.0
VIN = 5.0V 0.9
800 VIN = 3.6V 0.8
VIN = 1.8V 0.7
600 0.6
0.5
400 0.4
0.3 VIN = 6.0V
200 0.2
0.1
0 0.0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100

Ambient Temperature: Ta (℃) Ambient Temperature : Ta (℃)

(12) Lx SW ”L” Leakage Current vs. Ambient Temperature (13) CE ”H” Voltage vs. Ambient Temperature
Lx SW ”L” Leakage Current: ILeakL (μA)

1.0 1.2
0.9 VIN = 5.0V
1.0
CE ”H” Voltage : V CEH (V)

0.8 VIN = 3.6V

0.7 0.8 VIN = 1.8V
0.6
0.5 0.6
0.4
0.3 0.4
0.2 V IN = 6.0V
0.2
0.1
0.0 0.0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100

Ambient Temperature : Ta (℃) Ambient Temperature: Ta (℃)

(14) CE ”L” Voltage vs. Ambient Temperature (15) Short Protection Threshold vs. Ambient Temperature
Short Protection Threshold Voltage : V SHORT (V)

1.2 1.4
VIN = 5.0V VIN = 5.0V
1.0 1.2
CE ”L” Voltage : V CEL (V)

VIN = 3.6V VIN = 3.6V

1.0
0.8 VIN = 1.8V VIN = 1.8V
0.8
0.6
0.6
0.4 0.4

0.2 0.2

0.0 0.0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100

Ambient Temperature: Ta (℃) Ambient Temperature: Ta (℃)

23/30
 XCL233 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(16) VSET "H" Voltage vs. Ambient Temperature (17) VSET "L" Voltage vs. Ambient Temperature

1.2 1.2
VIN = 5.0V VIN = 5.0V
VSET "H" Voltage : VSETH (V)

VSET "L" Voltage : VSETL (V)

1.0 1.0
VIN = 3.6V VIN = 3.6V

0.8 VIN = 1.8V 0.8 VIN = 1.8V

0.6 0.6

0.4 0.4

0.2 0.2

0.0 0.0
-50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100

Ambient Temperature: Ta (℃) Ambient Temperature: Ta (℃)

(18) CL Discharge Resistance vs. Ambient Temperature

200
180 VIN = 5.0V
CL Discharge : RDCHG (Ω)

160
VIN = 3.6V
140
120 VIN = 1.8V

100
80
60
40
20
0
-50 -25 0 25 50 75 100

Ambient Temperature: Ta (℃)

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 XC9140 (Design Target) XCL233
Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(19) Load Transient Respones

V OUT=1.8V V OUT=1.8V
V IN = 3.6V ,IOUT = 10μA ⇒ 50mA ,tr = 5μs V IN = 3.6V ,IOUT = 50mA ⇒ 10μA ,tf = 5μs
CIN = MSASL168BB5106MTNB33(10μF/10V) CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASL168BB5226MTNA01(22μF/10V) ×2 CL = MSASL168BB5226MTNA01(22μF/10V) ×2

IOUT : 50mA IOUT : 50mA

IOUT : 10μA IOUT : 10μA

IOUT : 50mA/div IOUT : 50mA/div

VOUT : 200mV/div VOUT : 200mV/div

20μs/div 20μs/div

V OUT=3.0V V OUT=3.0V
V IN = 3.6V ,IOUT = 10μA ⇒ 50mA ,tr = 5μs V IN = 3.6V ,IOUT = 50mA ⇒ 10μA ,tf = 5μs
CIN = MSASL168BB5106MTNB33(10μF/10V) CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASL168BB5226MTNA01(22μF/10V) ×2 CL = MSASL168BB5226MTNA01(22μF/10V) ×2

IOUT : 50mA IOUT : 50mA

IOUT : 10μA IOUT : 10μA

IOUT : 50mA/div IOUT : 50mA/div

VOUT : 200mV/div VOUT : 200mV/div

20μs/div 20μs/div

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 XCL233 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(20) Startup Mode

V OUT=1.8V V OUT=3.0V
V IN = 3.6V, V CE = 0.0V ⇒ 3.6V, tr = 5μs, RL = 36Ω V IN = 3.6V, V CE = 0.0V ⇒ 3.6V, tr = 5μs, RL = 60Ω
CIN = MSASL168BB5106MTNB33(10μF/10V) CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASL168BB5226MTNA01(22μF/10V) ×2 CL = MSASL168BB5226MTNA01(22μF/10V) ×2

VCE : 2V/div VCE : 2V/div

VOUT : 2V/div VOUT : 2V/div

200μs/div 200μs/div

(21) Falling waveform

XCL233BB90KR-G( Without CL Discharge) XCL233DB90KR-G( With CL Discharge)
V IN = 5.0V, VSET=5.0V, V OUT = 3.0V, RL = 30kΩ V IN = 5.0V, VSET=5.0V, V OUT = 3.0V, RL = 30kΩ
V CE = 5.0V ⇒ 0V, tf = 5μs V CE = 5.0V ⇒ 0V, tf = 5μs
CIN = MSASL168BB5106MTNB33(10μF/10V) CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASL168BB5226MTNA01(22μF/10V) ×2 CL = MSASL168BB5226MTNA01(22μF/10V) ×2

V CE = 5.0V V CE = 5.0V

V CE = 0V V CE = 0V

VCE : 2.0V/div VCE : 2.0V/div

V OUT = 3.0V V OUT = 3.0V

VOUT : 1.0V/div 200ms/div VOUT : 1.0V/div 1.0ms/div

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 XC9140 (Design Target) XCL233
Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(22) Output voltage selectable function
XCL233BB90KR-G XCL233BB90KR-G
V IN = 3.6V, V OUT = 1.8V ⇒ 3.0V, RL = 180kΩ V IN = 3.6V, V OUT = 3.0V ⇒ 1.8V, RL = 180kΩ
VSET = 0V ⇒ 3.6V, tr = 5μs VSET = 3.6V ⇒ 0V, tf = 5μs
CIN = MSASL168BB5106MTNB33(10μF/10V) CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASL168BB5226MTNA01(22μF/10V) ×2 CL = MSASL168BB5226MTNA01(22μF/10V) ×2

VSET : 2.0V/div VSET : 2.0V/div

V OUT = 3.6V V OUT = 3.6V

VOUT : 500mV/div V OUT = 1.8V

V OUT = 1.8V

VOUT : 500mV/div 40μs/div 400ms/div

XCL233BB90KR-G XCL233BB90KR-G
V IN = 3.6V, V OUT = 1.8V ⇒ 3.0V, RL = 36Ω V IN = 3.6V, V OUT = 3.0V ⇒ 1.8V, RL = 36Ω
VSET = 0V ⇒ 3.6V, tr = 5μs VSET = 3.6V ⇒ 0V, tf = 5μs
CIN = MSASL168BB5106MTNB33(10μF/10V) CIN = MSASL168BB5106MTNB33(10μF/10V)
CL = MSASL168BB5226MTNA01(22μF/10V) ×2 CL = MSASL168BB5226MTNA01(22μF/10V) ×2

VSET : 2.0V/div VSET : 2.0V/div

V OUT = 3.6V V OUT = 3.6V

V OUT = 1.8V VOUT : 500mV/div V OUT = 1.8V

VOUT : 500mV/div 40μs/div 400ms/div

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 XCL233 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages

PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS

CL-2025-03 CL-2025-03 PKG CL-2025-03 Power Dissipation

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 XC9140 (Design Target) XCL233
Series

■MARKING RULE
① represents products series
MARK PRODUCT SERIES
B XCL233******-G

②,③ represents internal sequential number

01～09、 10～99、 A0～A9、 B0～B9・ ・ ・ Z0～Z9、 AA～AZ、 BA～BZ・ ・ ・ ZA～ZZ repeated.
(G, I, J, O, Q, W excluded)

④⑤ represents production lot number

01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded)
* No character inversion used.

CL-2025-03

1 6
①

2 5
④

3 4
⑤

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 XCL233 Series

1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm
that the information in this datasheet is up to date.

2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any
intellectual property rights of ours or any third party concerning with the information in this
datasheet.

3. Applicable export control laws and regulations should be complied and the procedures required
by such laws and regulations should also be followed, when the product or any information
contained in this datasheet is exported.

4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause
loss of human life, bodily injury, serious property damage including but not limited to devices or
equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile
industry and other transportation industry and 5) safety devices and safety equipment to control
combustions and explosions. Do not use the product for the above use unless agreed by us in
writing in advance.

5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent
personal injury and/or property damage resulting from such failure, customers are required to
incorporate adequate safety measures in their designs, such as system fail safes, redundancy
and fire prevention features.

6. Our products are not designed to be Radiation-resistant.

7. Please use the product listed in this datasheet within the specified ranges.

8. We assume no responsibility for damage or loss due to abnormal use.

9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.

TOREX SEMICONDUCTOR LTD.

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