KB2855SGD

8.89 mm x 8.89 mm LED Light Bar

DESCRIPTION PACKAGE DIMENSIONS

The Super Bright Green source color devices are
made with Gallium Phosphide Green Light Emitting
Diode

FEATURES

Uniform light emitting area

Easily mounted on P.C. boards

Flush mountable

Excellent on/off contrast

Can be used with panels and legend mounts

RoHS compliant

APPLICATIONS

Home and smart appliances

Display time and digital combination

Industrial and instrumental applications

Numeric status

Notes:
1. All dimensions are in millimeters (inches), Tolerance is ±0.25(0.01")unless otherwise noted.
2. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.

SELECTION GUIDE
Emitting Color Iv (mcd) @ 20mA [1]
Part Number Lens Type
(Material) Min. Typ.

40 70
KB2855SGD ■ Super Bright Green (GaP) Green Diffused
*8 *20

Notes:
1. Luminous intensity / luminous Flux: +/-15%.
* Luminous intensity value is traceable to CIE127-2007 standards.

© 2020 Kingbright. All Rights Reserved. Spec No: DSAD1453 / 1334000195 Rev No: V.7A Date: 03/04/2020 Page 1 / 4
 KB2855SGD
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Value
Parameter Symbol Emitting Color Unit
Typ. Max.

Wavelength at Peak Emission IF = 20mA λpeak Super Bright Green 565 - nm

Dominant Wavelength IF = 20mA λdom [1] Super Bright Green 568 - nm

Spectral Bandwidth at 50% Φ REL MAX

∆λ Super Bright Green 30 - nm
IF = 20mA

Capacitance C Super Bright Green 15 - pF

Forward Voltage IF = 20mA VF [2] Super Bright Green 2.2 2.5 V

Reverse Current (VR = 5V) IR Super Bright Green - 10 µA

Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

ABSOLUTE MAXIMUM RATINGS at TA=25°C

Parameter Symbol Value Unit

Power Dissipation PD 62.5 mW

Reverse Voltage VR 5 V

Junction Temperature Tj 110 °C

Operating Temperature Top -40 to +85 °C

Storage Temperature Tstg -40 to +85 °C

DC Forward Current IF 25 mA

Peak Forward Current IFM [1] 140 mA

Electrostatic Discharge Threshold (HBM) - 8000 V

Lead Solder Temperature [2] 260°C For 3-5 Seconds

Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. 2mm below package base.
3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

© 2020 Kingbright. All Rights Reserved. Spec No: DSAD1453 / 1334000195 Rev No: V.7A Date: 03/04/2020 Page 2 / 4
 KB2855SGD
TECHNICAL DATA
RELATIVE INTENSITY vs. WAVELENGTH

Green
100%
Ta = 25 °C
Relative Intensity (a. u.)

80%

60%

40%

20%

0%
350 400 450 500 550 600 650 700 750 800
Wavelength (nm)

SUPER BRIGHT GREEN

Forward Current vs. Luminous Intensity vs. Forward Current Derating Curve Luminous Intensity vs.
Forward Voltage Forward Current Ambient Temperature
50 2.5 50 2.5
Permissible forward current (mA)
Luminous intensity normalised at

Luminous intensity normalised

Ta = 25 °C Ta = 25 °C
Forward current (mA)

40 2.0 40 2.0

at Ta = 25 °C
30 1.5 30 1.5
20 mA

20 1.0 20 1.0

10 0.5 10 0.5

0 0.0 0 0.0
1.7 1.9 2.1 2.3 2.5 2.7 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C)

RECOMMENDED WAVE SOLDERING PROFILE Soldering General Notes

1. Through-hole displays are incompatible with reflow soldering.
2. If components will undergo multiple soldering processes,
or other processes where the components may be subjected
to intense heat, please check with Kingbright for compatibility.

CLEANING
1. Mild "no-clean" fluxes are recommended for use in soldering.
2. If cleaning is required, Kingbright recommends to wash
components with water only. Do not use harsh organic
solvents for cleaning because they may damage the plastic
parts .
3. The cleaning process should take place at room temperature
and the devices should not be washed for more than one
minute.
Notes: 4. When water is used in the cleaning process, Immediately
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath remove excess moisture from the component with forced-air
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°Cfor 3 sec (5 sec max). drying afterwards.
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
7. During wave soldering, the PCB top-surface temperature should be kept below 105°C.

© 2020 Kingbright. All Rights Reserved. Spec No: DSAD1453 / 1334000195 Rev No: V.7A Date: 03/04/2020 Page 3 / 4
 KB2855SGD
PACKING & LABEL SPECIFICATIONS

THROUGH HOLE DISPLAY MOUNTING METHOD

Lead Forming
Do not bend the component leads by hand without
proper tools. The leads should be bent by clinching the
upper part of the lead firmly such that the bending force
is not exerted on the plastic body.

Installation
1. The installation process should not apply stress to the lead terminals.
2. When inserting for assembly, ensure the terminal pitch matches the substrate board's hole pitch to prevent spreading or pinching
the lead terminals. (Fig.1)
3. The component shall be placed at least 5mm from edge of PCB to avoid damage caused excessive heat during
wave soldering.(Fig.2)

CIRCUIT DESIGN NOTES

1. Protective current-limiting resistors may be necessary to operate the LEDs within the specified range.
2. LEDs mounted in parallel should each be placed in series with its own current-limiting resistor.(Fig.3)
3. The driving circuit should be designed to protect the LED against reverse
voltages and transient voltage spikes when the circuit is powered up
or shut down.
4. The safe operating current should be chosen after considering the
maximum ambient temperature of the operating environment.
5. Prolonged reverse bias should be avoided, as it could cause metal
migration, leading to an increase in leakage current or causing
a short circuit.

PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. When any special process such as potting is required for LED assembly, please consult with Kingbright representative before proceeding.
7. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes

© 2020 Kingbright. All Rights Reserved. Spec No: DSAD1453 / 1334000195 Rev No: V.7A Date: 03/04/2020 Page 4 / 4