Chapter 2

Single-node Architecture
Outline

 2.1. Sensor Node Architecture

 2.2. Introduction of Sensor Hardware Platform
 2.3. Energy Consumption of Sensor Node
 2.4. Network Architecture
 2.5. Challenges of Sensor Nodes
 2.6. Summary
2.1. Sensor Node Architecture
Main Architecture of Sensor Node
 The main architecture of sensor node includes
following components:
 Controller module
 Memory module
 Communication module
 Sensing modules
 Power supply module

Memory

Communication Controller Sensors

Power supply
Main Components of a Sensor Node ：
Controller module
 Main options:
 MCUs (Microcontrollers) Memory
 The processor for general purposes
 Optimized for embedded applications
 Low energy consumption Communication Controller Sensors

 DSPs (Digital Signal Processors)

 Optimized for signal processing
Power supply
 Low cost
 High processing speed
 Not suitable for sensor node
 FPGAs (Field Programmable Gate Arrays)
 Suitable for product development and testing
 Cost higher than DSPs
 High energy consumption
 Processing speed lower than ASICs
 ASICs (Application-Specific Integrated Circuits)
 Only when peak performance is needed
 For special purpose
 Not flexable
Main Components of a Sensor Node ：
Controller module
 Example of microcontrollers are recently used in Senor Node
 ATMega128L, Atmel
 8-bit controller
 128KB program memory (flash)
 512KB additional data flash memory
 larger memory than MSP430
 slower
 MSP430, TI (Texas Instruments)
 16-bit RISC core
 8MHz
 48KB Flash
 10KB RAM
 several DACs
 RT clock
 8051 in CC2430 & CC2431, TI (Texas Instruments)
 8-bit MCU
 32/64/128 KB program memory
 8 KB RAM
Main Components of a Sensor Node ：
Communication module
 The communication module of a Memory

sensor node is called “Radio

Transceiver”
Communication Controller Sensors

 The essentially tasks of transceiver Power supply

is to “transmit” and “receive” data

between a pair of nodes
 Which characteristics of the
transceiver should be consider for
sensor nodes?
 Capabilities
 Energy characteristics
 Radio performance
Main Components of a Sensor Node ：
Communication module
 Transceiver characteristics
 Capabilities
 Interface to upper layers (most notably to the MAC layer)
 bit, byte or packet?
 Supported frequency range?
 Typically, somewhere in 433 MHz – 2.4 GHz, ISM band
 Supported multiple channels?
 Transmission data rates?
 Communication range?
 Energy characteristics
 Power consumption to send/receive data?
 Time and energy consumption to change between different states?
 Supported transmission power control?
 Power efficiency (which percentage of consumed power is radiated?)
Main Components of a Sensor Node ：
Communication module
 Radio performance
 Modulation
 ASK, FSK, PSK, QPSK…
 Noise figure: SNR
 Gain: the ratio of the output signal power to the input power signal
 Carrier sensing and RSSI characteristics
 Frequency stability (Ex: towards temperature changes)
 Voltage range
Main Components of a Sensor Node ：
Communication module
 Transceivers typically has several different states/modes :
 Transmit mode
 Transmitting data

 Receive mode
 Receiving data

 Idle mode
 Ready to receive, but not doing so
 Some functions in hardware can be switched off
 Reducing energy consumption a little

 Sleep mode
 Significant parts of the transceiver are switched off
 Not able to immediately receive something
 Recovery time and startup energy in sleep state can be significant
Main Components of a Sensor Node ：
Communication module
 Example of transceivers are recently used in Senor Node
 RFM TR1000 family  Chipcon CC 2400
 916 or 868 MHz  Ex: TI CC2420
 400 kHz bandwidth  Implements 802.15.4
 Up to 115,2 kbps  2.4 GHz, DSSS modem
 On/off keying or ASK  250 kbps
 Dynamically tuneable output  Higher power consumption
power than above transceivers
 Maximum power about 1.4 mW
 Low power consumption  Infineon TDA 525x family
 E.g., 5250: 868 MHz
 Chipcon CC1000  ASK or FSK modulation
 Range 300 to 1000 MHz,  RSSI, highly efficient power
programmable in 250 Hz steps amplifier
 FSK modulation  Intelligent power down, “self-
 Provides RSSI polling” mechanism
 Excellent blocking
performance
Main Components of a Sensor Node ：
Communication module
 TI CC 2431
 8051 MCU core
 128KB in-system programmable flash
 8KB SRAM
 Powerful DMA
 One IEEE 802.15.4 MAC timer
 2.4GHz IEEE 802.15.4 compliant RF
 RX (27mA), TX (27mA), MCU running at 32MHz
 0.3uA current consumption in power down mode
 Wide supply voltage range (2.0V-3.6V)
 CSMA/CA hardware support
 Digital RSSI/LQI support
 12-bit ADC with up to eight inputs and configuration resolution
 Two USARTs with support for several serial protocols
 128-bit AES security coprocessor
Main Components of a Sensor Node ：
Sensing module
 Sensor’s main categories [1] Memory

Communication Controller Sensors

 Passive vs. Active
Power supply
 Directional vs. Omidirectional
 Some sensor examples
 Passive & Omnidirectional
 light, thermometer, microphones, hygrometer, …
 Passive & Directional
 electronic compass, gyroscope , …
 Passive & Narrow-beam
 CCD Camera, triple axis accelerometer, infar sensor …
 Active sensors
 Radar, Ultrasonic, …
Main Components of a Sensor Node ：
Sensing module
 Example of sensors are integrated with Senor Node

Infar sensor
Triple axis accelerometer
Electronic compass

Ultrasonic

Temperature and
Humidity Sensor
Pressure Sensor
Gyroscope
Main Components of a Sensor Node ：
Power supply module

Memory
Power supply module
 provides as much energy as possible Communication Controller Sensors

 includes following requirements Power supply

 Longevity (long shelf live)

 Low self-discharge
 Voltage stability
 Smallest cost
 High capacity/volume
 Efficient recharging at low current
 Shorter recharge time
 Options of power supply module
 Primary batteries
 not rechargeable
 Secondary batteries
 rechargeable
 In WSN, recharging may or may not be an option
Main Components of a Sensor Node ：
Power supply module
 Examples of primary and secondary battery [2]
 Energy per volume : J/cm3 (Joule per cubic centimeter)

Primary batteries
Chemistry Zinc-air Lithium Polymer Cell Alkaline

Energy (J/cm3) 3780 2880 1200

Secondary batteries
Chemistry Lithium Polymer Cell Ni-MH Ni-Cd

Energy (J/cm3) 1080 860 650

Main Components of a Sensor Node ：
Memory module
 The memory module of a sensor node has two major tasks
 To store intermediate sensor readings, packets from other nodes, and so on.
 To store program code Memory

 For the first task Communication Controller Sensors

 Random Access Memory (RAM) is suitable

Power supply
 The advantage of RAM is fast
 The main disadvantage is that it loses its content if power supply is
interrupted
 For the second task
 Read-Only Memory (ROM)
 Electrically Erasable Programmable Read-Only Memory (EEPROM)
 Flash memory (allowing data to be erased or written in blocks)
 can also serve as intermediate storage of data in case RAM is insufficient or
when the power supply of RAM should be shut down for some time
 long read and write access delays
 high required energy
2.2. Introduction of Sensor
Hardware Platform
Overview of Sensor Node Platforms
 Some modules developed by U.C. Berkeley & Crossbow Tech.
 MICA2
 8-bit Atmel ATmega128L microcontroller MICA2
 (4 KB SRAM + 128 KB Flash)
 RF: CC1000 (data rate: 38.4kbits/s)
 MICAz
 8-bit Atmel ATmega128L microcontroller
 RF: CC2420 (data rate: 250kbits/s) MICAz
 TelosB
 16-bit MSP430 microcontroller
 (10 KB RAM + 48KB Flash) + 1MB Flash TelosB
 RF: CC2420 (data rate: 250kbits/s)
 IRIS
 8-bit Atmel ATmega1281 microcontroller
 (8 KB RAM + 128KB Flash) + 512KB Flash
 RF: RF230, data rate: 250kbits/s IRIS
Overview of Sensor Node Platforms
 Octopus modules were developed by NTHU
 Octopus I (Compatible with MICAz)
 8-bit Atmel ATmega128L microcontroller
 RF: CC2420 (data rate: 250kbits/s)

Octopus I
 Octopus II
 16-bit MSP430 microcontroller
 10 KB RAM + 48KB Flash) + 1MB Flash
 RF: CC2420 (data rate: 250kbits/s)

Octopus II
 Octopus X
 8-bit 8051 microcontroller
 128KB in-system programmable flash
 8KB RAM + 4KB EEPROM
 RF: CC2430, EEE 802.15.4 compliant RF transceiver
Octopus X
Introduction of Octopus X Hardware Platform
 Octopus X includes three models
 Octopus X-A
 CC2431 + Inverted F Antenna
 Octopus X-B
 CC2431 + SMA Type Antenna Octopus X-A Octopus X-B Octopus X-C
 Octopus X-C
 CC2431 + Inverted F and SMA Type Antenna + USB interface
 Peripherals of Octopus X
USB dongle
 Octopus X-USB dongle
 Octopus X-Sensor board
Temperature
 Temperature sensor
sensor
 Gyroscope
 Three axis accelerometer
Three axis
 Electronic Compass
accelerometer
Introduction of Octopus X Hardware Platform

Octopus X-A Octopus X-B

(28mm × 28mm) (28mm × 28mm)

Octopus X-C
(57mm ×
 Features of Octopus X-A
Size: 28mm × 28mm  MCU (CC2431)
Inverted-F
Antenna  Inverted-F antenna
 RF transmission range ≒ 100m
 External crystal
(32MHz+32.768KHz)
30-Pin  30-Pin expansion connector
expansion CC2431(MCU+RF)
connector  Polymer batter (3.7V 300mAh)

Height: 7mm Polymer battery

 Features of Octopus X-B
Size: 28mm × 28mm SMA Type  MCU (CC2431)
Antenna
 SMA type antenna
 RF transmission range ≒ 150m
 External crystal
(32MHz+32.768KHz)
30-Pin  30-Pin expansion connector
expansion connector CC2431(MCU+RF)
 Polymer batter (3.7V 300mAh)

Height: 7mm Polymer battery

 Features of Octopus X-C
Size: 57mm × 31mm  MCU (CC2431)
 SMA type and Inverted-F antenna
30-Pin expansion
Temperature connector  Humidity & Temperature sensor
Sensor SMA antenna  Humidity 0~100%RH (0.03%RH)
 Temperature -40oC~120oC (0.01oC)
 External flash memory (2MB)
 MicroSD socket (up to 8GB)
 USB Interface
USB IC CC2431 Inverted F
antenna  Programming
 Debugging
External memory with 2MB
 Data collection

MicroSD
socket
Features of Octopus X - USB Dongle
USB  Octopus X-USB dongle
Dongle provides an easy-to-use USB
protocol for
 Programming
 Debugging
 Data collections

USB IC Octopus X-A

Features of Octopus X - Sensor Boards
Front view of Octopus X-sensor board
Size: 28mm × 18mm

Temperature
sensor

Electronic
Compass
Back view of Octopus X-sensor
board

Sensor board
(Gyroscope + Triple axis accelerometer )
 Features of Octopus X - Dock
Size: 60mm × 71mm  USB interface
 Programming with our flash
USB interface programmer
Debug interface
Power switch
 Data collections
 Debug interface
Test points  Programming with TI
SmartRF04EB
3 LEDs  30-Pin expansion connector
 User switch and reset switch
 Test points
 DC power switch
 3 LEDs
Switches Expansion connector
Summary of Octopus X
 Octopus X is not only compatible with IAR embedded
workbench but also “Keil C ” software

 Octopus X is of 2-Layer design to reduce production cost

 Octopus X can be not only programmed from USB

interface but also TI programming board

 RF transmission range of Octopus X is up to 150m

 Expansion connector design on Octopus X provides a

user interface for sensor boards and dock
Introduction of Octopus II Hardware Platform
 Octopus II includes two models
 Octopus II-A
 MSP430F1611 + USB Interface + Inverted F and SMA Type Antenna
 Octopus II-B
 Octopus II-A + External Power Amplifier
 Peripherals of Octopus II
 Octopus II-Sensor board
 Temperature sensor
 Light sensors
 Gyroscope Octopus II-A Octopus II-B
 Three axis accelerometer

Octopus II-Sensor board

Introduction of Octopus II Hardware Platform
Octopus II
Size: 65mm × 31mm

Sensor Board
Size: 50mm × 31mm
Introduction of Octopus II Hardware Platform
 Octopus II block diagram
 Introduction of Octopus II Hardware Platform
 Octopus II block diagram

Light Sensor
USB
USB Chip MSP430 Temperature
Connector
Sensor

CC2420
LEDs IEEE 802.15.4

Connecto
USB r
16-bit MSP430 microcontroller core 8MHz
48 KB in-system programmable flash
10 KB RAM
ADC 12-Bit 8 Channels
Batterie Temperatur Antenna
 Features of Octopus II-A
 MCU (MSP430F1611)
 Flash Memory (48 KB + 256 KB)
 RAM (10 KB)
 External Flash (1 MB)
 External Crystal (4 MHz + 32.768 KHz)
 Serial Communication Interface (USART, SPI or I2C)
 Low Supply-Voltage Range (1.8V ~ 3.6V)
 Five Power-Saving Modes
 Sensors
 Humidity & Temperature sensor
 Humidity 0 ~ 100%RH (0.03%RH)
 Temperature -40oC ~ 120oC (0.01oC)
 Light sensors
Features of Octopus II-A
 Radio (CC2420)
 2.4GHz IEEE 802.15.4 compliant RF
 Data rate (250 Kbps)
 Rx (18.8 mA), Tx (17.4 mA)
 Programmable output power
 Digital RSSI/LQI support
 Hardware MAC encryption
 Battery monitor
 RF transmission range ≒ 250m
 Serial number ID
 50-Pin expansion connector
 External DC power connector
Features of Octopus II-A
 Front view of Octopus II-A Size: 65mm × 31mm
Features of Octopus II-A
 Back view of Octopus II-A
 Features of Octopus II-B
Size: 80mm × 31mm
 RF transmission range ≒ 450m
 CC2420 with external power
Processor amplifier
(MSP430F1611)
 Maximum output power: ~10dBm
 Compliance with IEEE 802.15.4
(ZigBee)

RF(CC242
0) Power
Amplifier
 Features of Octopus II - Sensor board
Size: 50mm × 31mm  Sensors
Light sensors Temperature sensor  Humidity & Temperature sensor
 Humidity 0-100%RH (0.03%RH)
 Temperature -40oC~120oC (0.01oC)
 Light sensors
 Gyroscope
 Integrated X and Y-axis gyro
Gyroscope Three axis
 Three axis accelerometer
accelerometer
 Selectable sensitivity (1.5g/2g/4g/6g)
Octopus II Sensor board
 Low current consumption (600uA)
 Sleep mode (3uA)
 Low voltage operation (2.2V-3.6V)
 High sensitivity (800mV/g @ 1.5g)
 Features of Octopus II - Dock
Size: 90mm × 54mm  Easy-to-develop WSN
applications
Debug
Expansion interface  Debug interface
connector B DC power (>7V)  Programming with TI flash
programmer
Power  DC power input
switch
 Power switch
 3 power LEDs
 4 user LEDs
 User switch and reset switch
Switches  2 row expansion connectors
Expansion 4 LEDs
Power LEDS
connector A
Summary of Octopus II
 Octopus II is not only compatible with TinyOS but also
standard C programming
 Octopus II is of 2-Layer design to reduce production cost
 Octopus II can be programmed from USB interface
 Octopus II has two kinds of antennas, SMA type and
inverted F type
 RF transmission range of Octopus II is up to 450m
 Expansion connector design on Octopus II provides a
user interface for sensor boards and dock
2.3. Energy Consumption of
Sensor Node
The Main Consumers of Energy
 Microcontroller
 Radio front ends
 RF transceiver IC
 RF antenna
 Degree of Memory
 RAM
 EEPROM
 Flash memory
 Depending on the type of sensors
 Temperature sensor
 Humidity sensor
 Other components
 LED
 External Crystal
 USB IC
Energy consumption of Microcontroller
 A “back of the envelope” estimation for energy consumption
 It means “energy consumption” is easily to estimate
 Number of instructions
 Energy per instruction: 1 nJ [4]
 Small battery (“smart dust”): 1 J = 1 Ws
 Corresponds: 109 instructions!
 Lifetime
 Require a single day operational lifetime
= 24hr × 60mins × 60secs = 86400 secs
 1 Ws / 86400s ≒ 11.5 W as max. sustained power consumption!
 Not feasible!
 Most of the time a wireless sensor node has nothing to do
 Hence, it is best to turn it off
Multiple power consumption modes
 Way out: Do not run sensor node at full operation all the time
 If nothing to do, switch to power safe mode
 Question: When to throttle down? How to wake up again?

 Typical modes
 Microcontroller
 Active, Idle, Sleep
 Radio mode
 Turn on/off transmitter/receiver or Both

 Multiple modes possible, “deeper” sleep modes

 Strongly depends on hardware
 Ex: TI MSP 430
 Four different sleep modes
 Atmel ATMega
 Six different modes
Some Energy Consumption Figures
 Microcontroller power consumption
 TI MSP 430 (@ 1 MHz, 3V) [6]
 Fully operation : 1.2 mW
 Deepest sleep mode : 0.3 W
 Only woken up by external interrupts (not even timer is running any more)

 Atmel ATMega128L [7]

 Operational mode:
 Active : 15 mW
 Idle : 6 mW
 Sleep mode : 75 W
Some Energy Consumption Figures
 TI CC2430[8] & 2431 [9]
 MCU Active Mode, static : 492 μA
 No radio, crystals, or peripherals

 MCU Active Mode, dynamic : 210μA/MHz

 No radio, crystals, or peripherals

 MCU Active Mode, highest speed : 7.0 mA

 MCU running at full speed (32MHz)
 No peripherals

 Power mode 1 : 296μA

 RAM retention

 Power mode 2 : 0.9 μA

 RAM retention

 Power mode 3: 0.6μA

 No clocks, RAM retention
Some Energy Consumption Figures
 Memory power consumption
 Power for RAM almost negligible
 FLASH memory is crucial part

 FLASH writing/erasing is expensive

 Example: FLASH on Mica motes
 Reading: ≒ 1.1 nAh per byte
 Writing: ≒ 83.3 nAh per byte
Switching between Modes
 Simplest idea: Greedily switch to lower mode whenever
possible
 Problem: Time and power consumption required to reach
higher modes not negligible
 Introduces overhead
 Switching only pays off if Esaved > Eoverhead
 Example:
Event-triggered wake up from sleep mode
 Scheduling problem with uncertainty
Esaved Eoverhead

Pactive

Psleep

t1 tevent time
τdown τup
Switching between Modes
 Esaved = (tevent − t1) × Pactive − (τdown × (Pactive + Psleep) / 2 +
(tevent − t1 − τdown) × Psleep)

 Eoverhead = τup × (Pactive + Psleep) / 2

Esaved Eoverhead

Pactive

Psleep

t1 tevent time
τdown τup
Power Consumption vs. Transmission Distance
 Free space loss: direct-path signal

 2
Ar At
Pr  Pt Gr Gt 
4  d 
2 2
d  2

 d = distance between transmitter and receiver

 Pt = transmitting power
 Pr = receiving power
 Gt = gain of transmitting antenna
 Gr = gain of receiving antenna
 At = effective area of transmitting antenna
 Ar = effective area of receiving antenna
Power Consumption vs. Transmission Distance
 Two-path model

Pr  Pt Gr Gt ( )hthr 2
d 2

 ht and hr are the height of the transmitter and receiver

 The general form

 2 1
Pr  Pt Gr Gt ( )4 d 

  is the propagation coefficient that varies 2 ~ 5

Computation vs. Communication Energy Cost
 Tradeoff ?
 It’s not possible to directly compare
computation/communication energy cost
 Energy ratio of “sending one bit” vs. “computing one
instruction”
 Communicate (send & receive) 1 KB ≒ Computing
3,000,000 (3 million) instructions [10]
 Hence
 Try to compute instead of communicate whenever possible
 Key technique in WSN
 In-network processing
 Exploit data centric/aggregation, data compression,
intelligent coding, signal processing …
2.4. Network Architecture
Difference between Ad hoc and Sensor Network
 (Mobile) Ad hoc Scenarios
 Nodes communicate with each other
 That means each node can be a source node or destination node
 Nodes can communicate “some” node in another network
 Ex: Access to Web/Mail/DNS server on the Internet
 Typically requires some connection to the fixed network

 Applications of Ad hoc network

 Traditional data (http, ftp, collaborative apps, …)
 Multimedia (voice, video)
Difference between Ad hoc and Sensor Network
 (Mobile) Ad hoc Scenarios
ITS system Disaster area

Ad hoc network
Difference between Ad hoc and Sensor Network
 Sensor Network Scenarios
 Sources: Any sensor node that provides sensing
data/measurements
 Sinks: Sensor nodes where information is required
 Belongs to the sensor network
 Could be the same sensor node or an external entity such
PDA/NB/Table PC
 Is part of an external network (e.g., internet), somehow connected to
the WSN

 Applications of Sensor Network

 Usually, machine to machine
 Often limited amounts of data
 Different notions of importance
Difference between Ad hoc and Sensor Network
 Sensor Network Scenarios

Sourc
e

Sink Sink

Sink Interne
Single-hop vs. Multi-hop Networks
 One common problem: limited range of wireless
communication
 Limited transmission power
 Path loss
 Obstacles
 Solution: multi-hop networks
 Send packets to an intermediate node
 Intermediate node forwards packet to its destination
 Store-and-forward multi-hop network
 Basic technique applies to both WSN and MANET
 Note:
 Store-and-forward multi-hopping NOT the only possible
solution
 Ex: Collaborative networking, Network coding [11] [12].…
Single-hop vs. Multi-hop Networks

Single-hop networks

Sink

Sourc Obstacle
Multi-hop networks e
Multiple Sinks, Multiple Sources WSN

Sink
In-network Processing
 MANETs are supposed to deliver bits from one end to
the other

 WSNs, on the other end, are expected to provide

information, not necessarily original bits
 Ex: manipulate or process the data in the network

 Main example: aggregation

 Apply composable [13] aggregation functions to a
convergecast tree in a network
 Typical functions: minimum, maximum, average, sum, …
In-network Processing
 Processing Aggregation example
 The simplest in-network processing technique
 Reduce number of transmitted bits/packets by applying an
aggregation function in the network Data

1 1

1 1

3 1
1 1
6 1
1 1

Sink Sink
Gateway concepts for WSN/MANET
 Gateways are necessary to the Internet for remote
access to/from the WSN
 For ad hoc networks
 Additional complications due to mobility
 Ex: Change route to the gateway, use different gateways

 For WSN
 Additionally bridge the gap between different interaction semantics in
the gateway
Gateway concepts for WSN/MANET
 Gateway support for different radios/protocols, …

Wireless sensor Remote

network user

PC

Remote
Internet user
Gateway Tablet PC
node

Remote
user
PDA
WSN to Internet communication
 Scenario: Deliver an alarm message to an Internet host
 Problems
 Need to find a gateway (integrates routing & service discovery)
 Choose “best” gateway if several are available
 How to find John or John’s IP address?

Alert
John
John’s PC

Internet
Gateway John’s Tablet PC
node

John’s PDA
Wireless sensor
Internet to WSN communication
 How to find the right WSN to answer a need?
 How to translate from IP protocols to WSN protocols,
semantics?
Remote requester

Gateway Internet Gateway

node node
WSN tunneling
 The idea is to build a larger, “Virtual” WSN
 Use the Internet to “tunnel” WSN packets between two remote
WSNs

Internet
Gatewa
Gatewa y
y nodes
nodes
WSN tunneling
 Example of WSN tunneling
 WSNs Testbed

Inter
net
Users

Web Server

Wireless Sensor Network Wireless Sensor Network

#1 #2
NCU NTHU
Emulating Server

Internet / Ethernet
WSN tunneling
 Example of WSN tunneling
 Testbed scenario
2.5. Challenges of Sensor Nodes
Challenges of Wireless Sensor Node
 More energy-efficient
 Self-sufficiency in power supply such as the installation of
solar collector panels
 Design more energy-efficient of the circuit, or to adopt more
energy-efficient electronic components

 Integrating more sensors

 For multiple purposes such as detecting human’s motion,
temperature, blood pressure and heartbeat at the same time

 Higher processing performance

 In future, more complex application need more powerful
computation
Challenges of Wireless Sensor Node
 More Robust and Secure
 Not easy damaged or be destroyed
 Secure transmission of sensing data and not easy being tapped

 Easy to buy and deployment

 Low price and easy to use
2.6. Summary
Summary
 For WSN, the need to build cheap, low-energy,
(small) devices has various consequences for system
design
 Radio frontends and controllers are much simpler than in
conventional mobile networks
 Energy supply and scavenging are still (and for the
foreseeable future) a premium resource
 Power management (switching off or throttling down
devices) crucial
 Unique programming challenges of embedded
systems
 Concurrency without support, protection
 Actual standard: TinyOS
Reference
 [1] V. Raghunathan, C. Schurgers, S. Park, and M. B. Srivastava. Energy-
Aware Wireless Microsensor Networks. IEEE Signal Processing Magazine,
19: 40–50, 2002.
 [2] S. Roundy, D. Steingart, L. Frechette, P. Wright, and J. Rabaey. Power
Sources for Wireless Sensor Networks. In H. Karl, A. Willig, and A. Wolisz,
editors, Proceedings of 1st European Workshop on Wireless Sensor
Networks (EWSN), pp. 1-17. LNCS, Springer, Berlin, Germany, Vol. 2920,
Jan. 2004.
 [3] J. M. Rabaey, M. J. Ammer, J. L. da Silva, D. Patel, and S. Roundy.
PicoRadio Supports Ad Hoc Ultra-Low Power Wireless Networking. IEEE
Computer, 33(7): 42–48, 2000.
 [4] J. M. Kahn, R. H. Katz, and K. S. J. Pister. Emerging Challenges:
Mobile Networking for Smart Dust. Journal of Communications and
Networks, 2(3): 188–196, 2000.
 [5] J. M. Kahn, R. H. Katz, and K. S. J. Pister. Next Century Challenges:
Mobile Networking for “Smart Dust”. In Proceedings of ACM/IEEE
International Conference on Mobile Computing and Networking (MobiCom
99), Seattle, WA, Aug. 1999.
 [6] MSP430x1xx Family User’s Guide. Texas Instruments product
documentation. 2004.
Reference
 [7] ATmega 128(L) Preliminary Complete. ATmel product documentation,
2004.
 [8] TI CC2430, http://focus.ti.com/docs/prod/folders/print/cc2430.html
 [9] TI CC2431, http://focus.ti.com/docs/prod/folders/print/cc2431.html
 [10] G. J. Pottie and W. J. Kaiser. Embedding the Internet: Wireless
Integrated Network Sensors. Communications of the ACM, 43(5): 51–58,
2000.
 [11] R. Ahlswede, N. Cai, S.-Y. R. Li, and R. W. Yeung. Network
Information Flow. IEEE Transaction on Information Theory, 46(4): 1204–
1216, 2000.
 [12] S.-Y. R. Li, R. W. Yeung, and N. Cai. Linear Network Coding. IEEE
Transactions on Information Theory, 49(2): 371–381, 2003.
 [13] I. Gupta, R. van Renesse, and K. P. Birman. Scalable Fault-Tolerant
Aggregation in Large Process Groups. In Proceedings of the International
Conference on Dependable Systems and Networks, Goteborg, Sweden, July
2001. http://www.cs.cornell.edu/gupta/gupta_aggregn_dsn01.ps.
Recommend Reading
 Wireless sensor node concept
 G.J. Pottie and W.J. Kaiser, Wireless Integrated Network
Sensors, Communication of the ACM, Vol.43, No.3, pp. 121-
133, 2001.
 Network coding
 R. Ahlswede, N. Cai, S.-Y. R. Li, and R. W. Yeung. Network
Information Flow. IEEE Transaction on Information Theory,
46(4): 1204–1216, 2000.
 WSN Testbed
 J.-P. Sheu, C.-C. Chang, and W.-S. Yang, “A Distributed
Wireless Sensor Network Testbed with Energy Consumption
Estimation,” International Journal of Ad Hoc and
Ubiquitous Computing (accepted). Download