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TPS92663-Q1
SLUSD34 – JULY 2018

TPS92663-Q1 High-Brightness LED Matrix Manager for Automotive Headlight Systems

1 Features The device includes two sub-strings of three series-
connected integrated switches for bypassing
1• AEC-Q100 Qualified for Automotive Applications individual LEDs. The individual sub-strings allow the
– Device Temperature Grade 1: –40°C to 125°C, device to accept either single or multiple current
TA sources. It also allows a parallel connection of two
– Device HBM Classification Level: H1C switches to bypass high-current LEDs.
– Device CDM Classification Level: C5 A master microcontroller may be used to control and
• Input Voltage Range: 4.5 V to 60 V manage the TPS92663-Q1 devices via a multi-drop
universal asynchronous receiver transmitter (UART)
• Six Integrated Bypass Switches serial interface. The serial interface supports the use
– Two Sub-Strings of Three Series Switches of CAN transceivers for a more robust physical layer.
– 20 V (Maximum) Across Switch An application can use the TPS92663-Q1 device and
the TPS92662-Q1 device on the same bus.
– 62 V (Maximum) Switch to GND
• Multi-Drop UART Communication Interface An on-device, 8 bit ADC with two multiplexed inputs
can be used for system temperature compensation
– Up to 16 Addressable Devices and used to measure a binning value which allows for
– Integrates on same bus with the TPS92662 LED binning and coding.
• Compatible with CAN Physical Layer The internal charge pump rail supplies the gate drive
– Minimum Number of Wires in Cable Harness voltage for the LED bypass switches. The low on-
• 8-bit ADC with Two MUX Inputs resistance (RDS(on)) of the bypass switch minimizes
conduction loss and power dissipation.
• Crystal Oscillator Driver
• Programmable 10-bit PWM Dimming The phase shift and pulse width for each individual
LED in the string are programmable. The device uses
– Individual Phase Shift and Pulse Width an internal register to adjust the PWM frequency.
– Device-to-device Synchronization Multiple devices can be synchronized. The switch
• LED Open and Short Detection and Protection transitions during PWM dimming operation have a
programmable slew rate to mitigate EMI concerns.
2 Applications The device features open LED protection with
• Automotive headlight systems programmable threshold. The serial interface reports
open LED and short LED faults.
• High-Brightness LED Matrix Systems
• ADB or Glare-Free High Beam Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
3 Description TPS92663-Q1 PWP (24) 7.70 mm × 4.40 mm
The TPS92663-Q1 LED matrix manager device
(1) For all available packages, see the orderable addendum at
enables fully dynamic adaptive lighting solutions by the end of the data sheet.
providing individual pixel-level LED control.
Simplified Application
VBAT
Boost Buck

VIN
CPPx
XTALI
TPS92663
XTALO
MCU
BIN ADCx
UART
RX
CAN CAN
ECU TX LEDx

VDD GND

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS92663-Q1
SLUSD34 – JULY 2018 www.ti.com

Table of Contents
1 Features .................................................................. 1 5.2 Community Resources.............................................. 3
2 Applications ........................................................... 1 5.3 Trademarks ............................................................... 3
3 Description ............................................................. 1 5.4 Electrostatic Discharge Caution ................................ 3
5.5 Glossary .................................................................... 3
4 Revision History..................................................... 2
5 Device and Documentation Support.................... 3 6 Mechanical, Packaging, and Orderable
Information ............................................................. 4
5.1 Receiving Notification of Documentation Updates.... 3

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE REVISION NOTES

July 2018 * Initial release.

2 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: TPS92663-Q1

 TPS92663-Q1
www.ti.com SLUSD34 – JULY 2018

5 Device and Documentation Support

5.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

5.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

5.3 Trademarks
E2E is a trademark of Texas Instruments.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

5.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: TPS92663-Q1
TPS92663-Q1
SLUSD34 – JULY 2018 www.ti.com

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

4 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: TPS92663-Q1

 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

TPS92663QPWPRQ1 ACTIVE HTSSOP PWP 24 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 TPS92663Q

TPS92663QPWPTQ1 ACTIVE HTSSOP PWP 24 250 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 TPS92663Q

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Dec-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92663QPWPRQ1 HTSSOP PWP 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Dec-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS92663QPWPRQ1 HTSSOP PWP 24 2000 350.0 350.0 43.0

Pack Materials-Page 2
 GENERIC PACKAGE VIEW
TM
PWP 24 PowerPAD TSSOP - 1.2 mm max height
4.4 x 7.6, 0.65 mm pitch PLASTIC SMALL OUTLINE

This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4224742/B

www.ti.com
 PACKAGE OUTLINE
PWP0024B SCALE 2.200
PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE

6.6 SEATING PLANE

TYP C
6.2
PIN 1 ID
A AREA 0.1 C
22X 0.65
24
1

7.9 2X
7.7 7.15
NOTE 3

12
13
0.30
4.5 24X
B 0.19
4.3
0.1 C A B

(0.15) TYP

SEE DETAIL A

4X (0.2) MAX
2X (0.95) MAX NOTE 5
NOTE 5

EXPOSED
THERMAL PAD

0.25
5.16
4.12 GAGE PLANE 1.2 MAX

0.15
0 -8 0.05
0.75
0.50 DETAIL A
(1) TYPICAL
2.40
1.65
4222709/A 02/2016
PowerPAD is a trademark of Texas Instruments.
NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may not be present and may vary.

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 EXAMPLE BOARD LAYOUT
PWP0024B PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE

(3.4)
NOTE 9 SOLDER MASK
(2.4) DEFINED PAD
24X (1.5) SYMM
SEE DETAILS
1
24

24X (0.45)

(R0.05)
TYP

(1.1) (7.8)
SYMM TYP NOTE 9

(5.16)

22X (0.65)

( 0.2) TYP
VIA

12 13

METAL COVERED (1) TYP

BY SOLDER MASK
(5.8)

LAND PATTERN EXAMPLE

SCALE:10X

METAL UNDER SOLDER MASK

SOLDER MASK METAL SOLDER MASK OPENING
OPENING

0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

PADS 1-24
4222709/A 02/2016

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.

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 EXAMPLE STENCIL DESIGN
PWP0024B PowerPAD TM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE

(2.4)
BASED ON
24X (1.5) 0.125 THICK
STENCIL
(R0.05) TYP
1
24

24X (0.45)

(5.16)
SYMM BASED ON
0.125 THICK
STENCIL

22X (0.65)

12 13

SYMM
METAL COVERED
BY SOLDER MASK SEE TABLE FOR
DIFFERENT OPENINGS
(5.8) FOR OTHER STENCIL
THICKNESSES

SOLDER PASTE EXAMPLE

EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:10X

STENCIL SOLDER STENCIL

THICKNESS OPENING
0.1 2.68 X 5.77
0.125 2.4 X 5.16 (SHOWN)
0.15 2.19 X 4.71
0.175 2.03 X 4.36

4222709/A 02/2016

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.

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