Modular I/O System

DeviceNet
750-346

Manual

Technical Description,
Installation and
Configuration

Version 1.0.1
ii • General

Copyright © 2007 by WAGO Kontakttechnik GmbH & Co. KG

All rights reserved.

WAGO Kontakttechnik GmbH & Co. KG

Hansastraße 27
D-32423 Minden
Phone: +49 (0) 571/8 87 – 0
Fax: +49 (0) 571/8 87 – 1 69
E-Mail: info@wago.com
Web: http://www.wago.com

Technical Support
Phone: +49 (0) 571/8 87 – 5 55
Fax: +49 (0) 571/8 87 – 85 55
E-Mail: support@wago.com

Every conceivable measure has been taken to ensure the correctness and com-
pleteness of this documentation. However, as errors can never be fully ex-
cluded we would appreciate any information or ideas at any time.

E-Mail: documentation@wago.com

We wish to point out that the software and hardware terms as well as the
trademarks of companies used and/or mentioned in the present manual are
generally trademark or patent protected.

WAGO-I/O-SYSTEM 750
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 Table of Contents • iii

TABLE OF CONTENTS

1 Important Notes .......................................................................................... 6

1.1 Legal Principles........................................................................................ 6
1.1.1 Copyright ............................................................................................. 6
1.1.2 Personnel Qualification ....................................................................... 6
1.1.3 Conforming Use of Series 750 ............................................................ 7
1.1.4 Technical Condition of the Devices .................................................... 7
1.2 Standards and Regulations for Operating the 750 Series ......................... 7
1.3 Symbols .................................................................................................... 8
1.4 Safety Information.................................................................................... 9
1.5 Font Conventions ................................................................................... 10
1.6 Number Notation.................................................................................... 10
1.7 Scope ...................................................................................................... 10
1.8 Abbreviation........................................................................................... 11

2 The WAGO-I/O-SYSTEM 750 ................................................................ 12

2.1 System Description................................................................................. 12
2.2 Technical Data........................................................................................ 13
2.3 Manufacturing Number .......................................................................... 16
2.4 Component Update................................................................................. 17
2.5 Storage, Assembly and Transport .......................................................... 18
2.6 Mechanical Setup ................................................................................... 18
2.6.1 Installation Position ........................................................................... 18
2.6.2 Total Expansion ................................................................................. 18
2.6.3 Assembly onto Carrier Rail ............................................................... 19
2.6.3.1 Carrier rail properties.................................................................... 19
2.6.3.2 WAGO DIN Rail .......................................................................... 20
2.6.4 Spacing .............................................................................................. 20
2.6.5 Plugging and Removal of the Components ....................................... 21
2.6.6 Assembly Sequence ........................................................................... 22
2.6.7 Internal Bus / Data Contacts .............................................................. 23
2.6.8 Power Contacts .................................................................................. 24
2.6.9 Wire connection................................................................................. 25
2.7 Power Supply ......................................................................................... 26
2.7.1 Isolation ............................................................................................. 26
2.7.2 System Supply ................................................................................... 27
2.7.2.1 Connection .................................................................................... 27
2.7.2.2 Alignment ..................................................................................... 28
2.7.3 Field Supply....................................................................................... 30
2.7.3.1 Connection .................................................................................... 30
2.7.3.2 Fusing............................................................................................ 31
2.7.4 Supply example ................................................................................. 34
2.7.5 Power Supply Unit............................................................................. 35
2.8 Grounding............................................................................................... 36
2.8.1 Grounding the DIN Rail .................................................................... 36
2.8.1.1 Framework Assembly ................................................................... 36
2.8.1.2 Insulated Assembly....................................................................... 36

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iv • Table of Contents

2.8.2 Grounding Function........................................................................... 37

2.8.3 Grounding Protection......................................................................... 38
2.9 Shielding (Screening) ............................................................................. 39
2.9.1 General............................................................................................... 39
2.9.2 Bus Conductors.................................................................................. 39
2.9.3 Signal Conductors.............................................................................. 39
2.9.4 WAGO Shield (Screen) Connecting System..................................... 40
2.10 Assembly Guidelines / Standards........................................................... 40

3 Fieldbus Coupler ....................................................................................... 42

3.1 Fieldbus Coupler 750-346 ...................................................................... 42
3.1.1 Description......................................................................................... 43
3.1.2 Hardware............................................................................................ 44
3.1.2.1 View .............................................................................................. 44
3.1.2.2 Device Supply ............................................................................... 45
3.1.2.3 Fieldbus Connection ..................................................................... 45
3.1.2.4 Display Elements .......................................................................... 46
3.1.2.5 Configuration Interface ................................................................. 47
3.1.2.6 Hardware Address (MAC ID)....................................................... 47
3.1.2.7 Setting the Baud Rate.................................................................... 48
3.1.3 Operating System............................................................................... 48
3.1.4 Process Image .................................................................................... 49
3.1.5 Data Exchange ................................................................................... 50
3.1.5.1 Communication Interfaces ............................................................ 51
3.1.5.2 Memory Areas .............................................................................. 51
3.1.5.3 Addressing .................................................................................... 52
3.1.6 Configuration Software ..................................................................... 54
3.1.7 Starting up DeviceNet Fieldbus Nodes.............................................. 54
3.1.7.1 Connecting the PC and Fieldbus Node ......................................... 54
3.1.7.2 Setting the MAC ID and Baud Rate ............................................. 54
3.1.7.3 Configuration with Static Assembly ............................................. 55
3.1.8 LED Display ...................................................................................... 59
3.1.8.1 Node status – Blink code from the 'I/O' LED ............................... 60
3.1.9 Technical Data ................................................................................... 67

4 DeviceNet ................................................................................................... 68
4.1 Description ............................................................................................. 68
4.2 Network Architecture ............................................................................. 69
4.2.1 Transmission Media........................................................................... 69
4.2.1.1 Type of Cable................................................................................ 69
4.2.1.2 Cable Types .................................................................................. 69
4.2.1.3 Maximum Bus Length .................................................................. 70
4.2.2 Cabling............................................................................................... 70
4.2.3 Network Topology............................................................................. 72
4.2.4 Network Grounding ........................................................................... 73
4.2.5 Interface Modules .............................................................................. 73
4.3 Network Communication ....................................................................... 74
4.3.1 Objects, Classes, Instances and Attributes ........................................ 74
4.4 Module Characteristics........................................................................... 75
4.4.1 Communication Model ...................................................................... 75
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 Table of Contents • v

4.4.1.1 Message Groups............................................................................ 75

4.4.1.2 Message Types.............................................................................. 75
4.4.2 I/O Messaging Connections............................................................... 76
4.5 Process data and Diagnostic Status ........................................................ 76
4.5.1 Process Image .................................................................................... 76
4.5.1.1 Assembly Instances....................................................................... 77
4.6 Configuration / Parametering with the Object Model ............................ 79
4.6.1 EDS Files ........................................................................................... 79
4.6.2 Object Model ..................................................................................... 80
4.6.2.1 Object Model for Coupler 750-346............................................... 81

5 I/O Modules ............................................................................................... 98

5.1 Overview ................................................................................................ 98
5.1.1 Digital Input Modules........................................................................ 98
5.1.2 Digital Output Modules ................................................................... 100
5.1.3 Analog Intput Modules .................................................................... 101
5.1.4 Analog Output Modules .................................................................. 102
5.1.5 Special Modules............................................................................... 103
5.1.6 System Modules .............................................................................. 104
5.2 Process Data Architecture for DeviceNet ............................................ 105
5.2.1 Digital Input Modules...................................................................... 105
5.2.2 Digital Output Modules ................................................................... 107
5.2.3 Analog Input Modules ..................................................................... 111
5.2.4 Analog Output Modules .................................................................. 113
5.2.5 Specialty Modules ........................................................................... 114
5.2.6 System Modules .............................................................................. 126

6 Glossary.................................................................................................... 127

7 Literature List ......................................................................................... 128

8 Index ......................................................................................................... 129

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6 • Important Notes
Legal Principles

1 Important Notes
This section provides only a summary of the most important safety require-
ments and notes which will be mentioned in the individual sections. To protect
your health and prevent damage to the devices, it is essential to read and care-
fully follow the safety guidelines.

1.1 Legal Principles

1.1.1 Copyright
This manual including all figures and illustrations contained therein is subject
to copyright. Any use of this manual which infringes the copyright provisions
stipulated herein, is not permitted. Reproduction, translation and electronic
and phototechnical archiving and amendments require the written consent of
WAGO Kontakttechnik GmbH & Co. KG, Minden. Non-observance will en-
tail the right of claims for damages.

WAGO Kontakttechnik GmbH & Co. KG reserves the right of changes serv-
ing technical progress.
All rights developing from the issue of a patent or the legal protection of util-
ity patents are reserved to WAGO Kontakttechnik GmbH & Co. KG. Third-
party products are always indicated without any notes concerning patent
rights. Thus, the existence of such rights must not be excluded.

1.1.2 Personnel Qualification

The use of the product described in this manual requires special qualifications,
as shown in the following table:

Specialists**) having
Instructed person-
Activity Electrical specialist qualifications in PLC
nel*)
programming
Assembly X X
Commissioning X X
Programming X
Maintenance X X
Troubleshooting X
Disassembly X X

*) Instructed persons have been trained by qualified personnel or electrical specialists.

**) A specialist is someone who, through technical training, knowledge and experience,
demonstrates the ability to meet the relevant specifications and identify potential dangers in
the mentioned field of activity.

All personnel must be familiar with the applicable standards.

WAGO Kontakttechnik GmbH & Co. KG declines any liability resulting from

WAGO-I/O-SYSTEM 750
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 Important Notes • 7
Standards and Regulations for Operating the 750 Series

improper action and damage to WAGO products and third party products due to
non-observance of the information contained in this manual.

1.1.3 Conforming Use of Series 750

The couplers and controllers of the modular I/O System 750 receive digital
and analog signals from the I/O modules and sensors and transmit them to the
actuators or higher level control systems. Using the WAGO controllers, the
signals can also be (pre-)processed.

The device is designed for IP20 protection class. It is protected against finger
touch and solid impurities up to 12.5mm diameter, but not against water pene-
tration. Unless otherwise specified, the device must not be operated in wet and
dusty environments.

1.1.4 Technical Condition of the Devices

For each individual application, the components are supplied from the factory
with a dedicated hardware and software configuration. Changes in hardware,
software and firmware are only admitted within the framework of the possi-
bilities documented in the manuals. All changes to the hardware or software
and the non-conforming use of the components entail the exclusion of liability
on the part of WAGO Kontakttechnik GmbH & Co. KG.

Please direct any requirements pertaining to a modified and/or new hardware

or software configuration directly to WAGO Kontakttechnik GmbH & Co.
KG.

1.2 Standards and Regulations for Operating the 750 Series

Please observe the standards and regulations that are relevant to your installa-
tion:

• The data and power lines must be connected and installed in compliance
with the standards to avoid failures on your installation and eliminate any
danger to personnel.
• For installation, startup, maintenance and repair, please observe the acci-
dent prevention regulations of your machine (e.g. BGV A 3, "Electrical In-
stallations and Equipment").
• Emergency stop functions and equipment must not be made ineffective.
See relevant standards (e.g. DIN EN 418).
• Your installation must be equipped in accordance to the EMC guidelines so
that electromagnetic interferences can be eliminated.
• Operating 750 Series components in home applications without further
measures is only permitted if they meet the emission limits (emissions of
interference) according to EN 61000-6-3. You will find the relevant in-
formation in the section on "WAGO-I/O-SYSTEM 750" Æ "System De-
scription" Æ "Technical Data".

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8 • Important Notes
Symbols

• Please observe the safety measures against electrostatic discharge accord-

ing to DIN EN 61340-5-1/-3. When handling the modules, ensure that the
environment (persons, workplace and packing) is well grounded.
• The relevant valid and applicable standards and guidelines concerning the
installation of switch cabinets are to be observed.

1.3 Symbols
Danger
Always observe this information to protect persons from injury.

Warning
Always observe this information to prevent damage to the device.

Attention
Marginal conditions that must always be observed to ensure smooth and effi-
cient operation.

ESD (Electrostatic Discharge)

Warning of damage to the components through electrostatic discharge. Ob-
serve the precautionary measure for handling components at risk of electro-
static discharge.

Note
Make important notes that are to be complied with so that a trouble-free and
efficient device operation can be guaranteed.

Additional Information
References to additional literature, manuals, data sheets and INTERNET
pages.

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 Important Notes • 9
Safety Information

1.4 Safety Information

When connecting the device to your installation and during operation, the fol-
lowing safety notes must be observed:

Danger
The WAGO-I/O-SYSTEM 750 and its components are an open system. It
must only be assembled in housings, cabinets or in electrical operation
rooms. Access is only permitted via a key or tool to authorized qualified per-
sonnel.

Danger
All power sources to the device must always be switched off before carrying
out any installation, repair or maintenance work.

Warning
Replace defective or damaged device/module (e.g. in the event of deformed
contacts), as the functionality of fieldbus station in question can no longer be
ensured on a long-term basis.

Warning
The components are not resistant against materials having seeping and insu-
lating properties. Belonging to this group of materials is: e.g. aerosols, sili-
cones, triglycerides (found in some hand creams). If it cannot be ruled out
that these materials appear in the component environment, then the compo-
nents must be installed in an enclosure that is resistant against the above men-
tioned materials. Clean tools and materials are generally required to operate
the device/module.

Warning
Soiled contacts must be cleaned using oil-free compressed air or with ethyl
alcohol and leather cloths.

Warning
Do not use contact sprays, which could possibly impair the functioning of the
contact area.

Warning
Avoid reverse polarity of data and power lines, as this may damage the de-
vices.

ESD (Electrostatic Discharge)

The devices are equipped with electronic components that may be destroyed
by electrostatic discharge when touched.

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10 • Important Notes
Font Conventions

1.5 Font Conventions

italic Names of paths and files are marked in italic.
e.g.: C:\Programs\WAGO-IO-CHECK

italic Menu items are marked in bold italic.

e.g.: Save

\ A backslash between two names characterizes the selec-

tion of a menu point from a menu.
e.g.: File \ New

END Press buttons are marked as bold with small capitals

e.g.: ENTER

<> Keys are marked bold within angle brackets

e.g.: <F5>

Courier The print font for program codes is Courier.

e.g.: END_VAR

1.6 Number Notation

Number code Example Note
Decimal 100 Normal notation
Hexadecimal 0x64 C notation
Binary '100' Within ',
'0110.0100' Nibble separated with dots

1.7 Scope
This manual describes the modular WAGO-I/O-SYSTEM 750 with the
DeviceNet ECO fieldbus coupler.

Item-No. Description
750-346 DeviceNet ECO fieldbus coupler, 125 kBaud ... 500 kBaud;
digital and analog signals

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 Important Notes • 11
Abbreviation

1.8 Abbreviation
AI Analog Input
AO Analog Output
CAL CAN Application Layer
CAN Controller Area Network
DI Digital Input
DIP Dual In-line Package
DO Digital Output
EDS Electronic Data Sheets
I/O Input/Output
ID Identifier, Identification
Idx Index
ISO/ OSI International Organization for Standardization /
Open Systems Interconnection (model)
HB High Byte
HW Hardware
LB Low Byte
MAC ID Media Access Control Identifier (nodeaddress)
MS Module Status
NMT Network Management
NS Network Status
RO Read Only
RW Read/Write
SW Software

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12 • The WAGO-I/O-SYSTEM 750
System Description

2 The WAGO-I/O-SYSTEM 750

2.1 System Description
The WAGO-I/O-SYSTEM 750 is a modular, fieldbus independent I/O system.
In this description, it is comprised of an ECO fieldbus coupler (1) and up to
64 connected fieldbus modules (2) for any type of signal. Together, these
make up the fieldbus node. The end module (3) completes the node.

Fig. 2-1: Fieldbus node g0xxx14x

ECO Couplers for fieldbus systems such as PROFIBUS, INTERBUS,

CANopen and DeviceNet are available.

The ECO coupler contains the fieldbus interface, electronics and a power sup-
ply for the system. The fieldbus interface forms the physical interface to the
relevant fieldbus. The electronics process the data of the bus modules and
make it available for the fieldbus communication. The 24 V system supply is
fed in via the voltage supply.

The ECO coupler is primarily conceived for applications with digital I/O func-
tions. In addition, modules for most different digital and analog I/O functions
as well as special functions can be connected to the ECO coupler. The com-
munication between the ECO coupler and the bus modules is carried out via
an internal bus.

The WAGO-I/O-SYSTEM 750 has a clear port level with LEDs for status in-
dication, insertable mini WSB markers and pullout group marker carriers. The
3-wire technology supplemented by a ground wire connection allows for direct
sensor/actuator wiring.

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 The WAGO-I/O-SYSTEM 750 • 13
Technical Data

2.2 Technical Data

Mechanic
Material Polycarbonate, Polyamide 6.6
Dimensions
- ECO coupler - 50 mm x 65* mm x 100 mm
- I/O module, single - 12 mm x 64* mm x 100 mm
- I/O module, double - 24 mm x 64* mm x 100 mm

* from upper edge of DIN 35 rail

Installation on DIN 35 with interlock
modular by double featherkey-dovetail
Mounting position any position
Length of entire node ≤ 830 mm
Marking marking label type 247 and 248
paper marking label 8 x 47 mm
Wire range
Wire range CAGE CLAMP® Connection
0,08 mm² ... 2.5 mm²
AWG 28-14
8 – 9 mm Stripped length
Contacts
Power jumpers contacts blade/spring contact
self-cleaning
Current via power contactsmax 10 A
Voltage drop at Imax < 1 V/64 modules
Data contacts slide contact, hard gold plated
1,5µm, self-cleaning
Climatic environmental conditions
Operating temperature 0 °C ... 55 °C
Storage temperature -20 °C ... +85 °C
Relative humidity 5% to 95 % without condensation
Resistance to harmful substances acc. To IEC 60068-2-42 and IEC 60068-2-43
Maximum pollutant concentration at SO2 ≤ 25 ppm
relative humidity < 75% H2S ≤ 10 ppm
Special conditions Ensure that additional measures for components are
taken, which are used in an environment involving:
– dust, caustic vapors or gasses
– ionization radiation.

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14 • The WAGO-I/O-SYSTEM 750
Technical Data

Mechanical strength
Vibration resistance acc. to IEC 60068-2-6
Comment to the vibration restistance:
a) Type of oscillation:
sweep with a rate of change of 1 octave per minute
10 Hz ≤ f < 57 Hz, const. Amplitude 0,075 mm
57 Hz ≤ f < 150 Hz, const. Acceleration 1 g
b) Period of oscillation:
10 sweep per axis in each of the 3 vertical axes
Shock resistance acc. to IEC 60068-2-27
Comment to the shock restistance:
a) Type of impulse: half sinusoidal
b) Intensity of impulse:
15 g peak value, 11 ms maintenance time
c) Route of impulse:
3 impulses in each pos. And neg. direction of the
3 vertical axes of the test object, this means
18 impulses in all
Free fall acc. to IEC 60068-2-32
≤ 1m (module in original packing)
Safe electrical isolation
Air and creepage distance acc. to IEC 60664-1
Degree of pollution 2
acc. to IEC 61131-2
Degree of protection
Degree of protection IP 20
Electromagnetic compatibility*
Directive Test values Strength Evaluation
class criteria
Immunity to interference acc. to EN 50082-2 (96)
EN 61000-4-2 4kV/8kV (2/4) B
EN 61000-4-3 10V/m 80% AM (3) A
EN 61000-4-4 2kV (3/4) B
EN 61000-4-6 10V/m 80% AM (3) A
Emission of interference acc. to Measuring Class
EN 50081-2 (94) distance
EN 55011 30 dBµV/m (30m) A
37 dBµV/m
Emission of interference acc. to Measuring Class
EN 50081-1 (93) distance
EN 55022 30 dBµV/m (10m) B
37 dBµV/m
* Exception: 750-630, 750-631

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 The WAGO-I/O-SYSTEM 750 • 15
Technical Data

Range of applica- Required specification Required specification

tion emission of interference immunity to interference
Industrial areas EN 50081-2 : 1993 EN 50082-2 : 1996
Residential areas EN 50081-1 : 1993*) EN 50082-1 : 1992
*) The system meets the requirements on emission of interference in residential areas with
the fieldbus coupler/controller for:
ETHERNET 750-342/-842
LonWorks 750-319/-819
CANopen 750-337/-837
DeviceNet 750-306/-806
MODBUS 750-312/-314/ -315/ -316
750-812/-814/ -815/ -816
With a special permit, the system can also be implemented with other fieldbus cou-
plers/controllers in residential areas (housing, commercial and business areas, small-scale
enterprises). The special permit can be obtained from an authority or inspection office. In
Germany, the Federal Office for Post and Telecommunications and its branch offices
issues the permit.
It is possible to use other field bus couplers / controllers under certain boundary condi-
tions. Please contact WAGO Kontakttechnik GmbH.

Maximum power dissipation of the components

Bus modules 0.8 W / bus terminal (total power dissipation, sys-
tem/field)
ECO fieldbus coupler 2.0 W / coupler

Warning
The power dissipation of all installed components must not exceed the maxi-
mum conductible power of the housing (cabinet).

When dimensioning the housing, care is to be taken that even under high ex-
ternal temperatures, the temperature inside the housing does not exceed the
permissible ambient temperature of 55 °C.

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16 • The WAGO-I/O-SYSTEM 750
Manufacturing Number

Dimensions

A A A A
C C C C
B B B B
D D D D

100
35

50 12 24
65

64

Side view Dimensions in mm

Fig. 2-2: Dimensions g0xxx15e

2.3 Manufacturing Number

The manufacturing number indicates the delivery status directly after produc-
tion.
This number is part of the lateral marking on the component.
In addition, starting from calender week 43/2000 the manufacturing number is
also printed on the cover of the configuration interface of the fieldbus coupler.

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 The WAGO-I/O-SYSTEM 750 • 17
Component Update

PROFIBUS

ITEM-NO.:750-333
PROFIBUS DP 12 MBd /DPV1

55°C max ambient

GL Hansastr. 27
D-32423 Minden

0 1 0 3 0 0 0 2 0 3 - B 0 60 0 60 0 60
AWG 28-14
24V DC

LISTED 22ZA AND 22XM

72072
- 24 V
+ 0V
Power Supply Power Supply
Field Electronic

WAGO - I/O - SYSTEM

FWL
HW
SW
NO
DS
PATENTS PENDING
II 3 GD
DEMKO 02 ATEX132273 X

750-333
EEx nA II T4

Manufacturing Number
01030002 0 1 0 3 0 0 0 2 0 3 - B 0 6 0 6 0 6
03-B
060606
72072

Calendar Year Software Hardware Firmware Loader Internal

week version version version Number

Fig. 2-3: Example: Manufacturing Number of a PROFIBUS fieldbus coupler 750-333

G01xx15e

The manufacturing number consists of the production week and year, the
software version (if available), the hardware version of the component, the
firmware loader (if available) and further internal information for
WAGO Kontakttechnik GmbH.

2.4 Component Update

For the case of an Update of one component, the lateral marking on each com-
ponent contains a prepared matrix.
This matrix makes columns available for altogether three updates to the entry
of the current update data, like production order number (NO; starting from
calendar week 13/2004), update date (DS), software version (SW), hardware
version (HW) and the firmware loader version (FWL, if available).

Update Matrix
Current Version data for: 1. Update 2. Update 3. Update
Production Order NO <- Only starting from Calen-
Number dar week 13/2004
Datestamp DS
Software index SW
Hardware index HW
Firmware loader FWL <- Only for coupler/controller
index

If the update of a component took place, the current version data are registered
into the columns of the matrix.
Additionally with the update of a ECO fieldbus coupler also the cover of the
configuration interface of the coupler is printed on with the current manufac-
turing and production order number.
The original manufacturing data on the housing of the component remain
thereby.
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18 • The WAGO-I/O-SYSTEM 750
Storage, Assembly and Transport

2.5 Storage, Assembly and Transport

Wherever possible, the components are to be stored in their original packag-
ing. Likewise, the original packaging provides optimal protection during
transport.

When assembling or repacking the components, the contacts must not be

soiled or damaged. The components must be stored and transported in appro-
priate containers/packaging. Thereby, the ESD information is to be regarded.

Statically shielded transport bags with metal coatings are to be used for the
transport of open components for which soiling with amine, amide and sili-
cone has been ruled out, e.g. 3M 1900E.

2.6 Mechanical Setup

2.6.1 Installation Position
Along with horizontal and vertical installation, all other installation positions
are allowed.

Attention
In the case of vertical assembly, an end stop has to be mounted as an addi-
tional safeguard against slipping.
WAGO item 249-116 End stop for DIN 35 rail, 6 mm wide
WAGO item 249-117 End stop for DIN 35 rail, 10 mm wide

2.6.2 Total Expansion

The maximum total expansion of a node is calculated as follows:

Quantity Width Components

1 50 mm ECO coupler
64 12 mm bus modules
- inputs / outputs
- power supply modules
- etc.
1 12 mm end module
sum 830 mm

Warning
The maximal total expansion of a node must not exceed 830 mm

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 The WAGO-I/O-SYSTEM 750 • 19
Mechanical Setup

2.6.3 Assembly onto Carrier Rail

2.6.3.1 Carrier rail properties

All system components can be snapped directly onto a carrier rail in accor-
dance with the European standard EN 50022 (DIN 35).

Warning
WAGO supplies standardized carrier rails that are optimal for use with the
I/O system. If other carrier rails are used, then a technical inspection and ap-
proval of the rail by WAGO Kontakttechnik GmbH should take place.

Carrier rails have different mechanical and electrical properties. For the opti-
mal system setup on a carrier rail, certain guidelines must be observed:

• The material must be non-corrosive.

• Most components have a contact to the carrier rail to ground electro-

magnetic disturbances. In order to avoid corrosion, this tin-plated carrier
rail contact must not form a galvanic cell with the material of the carrier
rail which generates a differential voltage above 0.5 V (saline solution of
0.3% at 20°C) .

• The carrier rail must optimally support the EMC measures integrated into
the system and the shielding of the bus module connections.

• A sufficiently stable carrier rail should be selected and, if necessary, sev-

eral mounting points (every 20 cm) should be used in order to prevent
bending and twisting (torsion).

• The geometry of the carrier rail must not be altered in order to secure the
safe hold of the components. In particular, when shortening or mounting
the carrier rail, it must not be crushed or bent.

• The base of the I/O components extends into the profile of the carrier rail.
For carrier rails with a height of 7.5 mm, mounting points are to be riveted
under the node in the carrier rail (slotted head captive screws or blind riv-
ets).

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20 • The WAGO-I/O-SYSTEM 750
Mechanical Setup

2.6.3.2 WAGO DIN Rail

WAGO carrier rails meet the electrical and mechanical requirements.

Item Number Description

210-113 /-112 35 x 7.5; 1 mm; steel yellow chromated; slotted/unslotted
210-114 /-197 35 x 15; 1.5 mm; steel yellow chromated; slotted/unslotted
210-118 35 x 15; 2.3 mm; steel yellow chromated; unslotted
210-198 35 x 15; 2.3 mm; copper; unslotted
210-196 35 x 7.5; 1 mm; aluminum; unslotted

2.6.4 Spacing
The spacing between adjacent components, cable conduits, casing and frame
sides must be maintained for the complete field bus node.

Fig. 2-4: Spacing g01xx13x

The spacing creates room for heat transfer, installation or wiring. The spacing
to cable conduits also prevents conducted electromagnetic interferences from
influencing the operation.

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 The WAGO-I/O-SYSTEM 750 • 21
Mechanical Setup

2.6.5 Plugging and Removal of the Components

Warning
Before work is done on the components, the voltage supply must be turned
off.

In order to safeguard the ECO coupler from jamming, it should be fixed onto
the carrier rail with the locking disc. To do so, push on the upper groove of the
locking disc using a screwdriver.

To pull out the ECO fieldbus coupler, release the locking disc by pressing on
the bottom groove with a screwdriver and then pulling the orange colored
unlocking lug.

Fig. 2-5: Coupler and unlocking lug g0xxx18e

It is also possible to release an individual I/O module from the unit by pulling
an unlocking lug.

Fig. 2-6: removing bus terminal p0xxx01x

Danger
Ensure that an interruption of the PE will not result in a condition which
could endanger a person or equipment!
For planning the ring feeding of the ground wire, please see chapter 2.6.3.

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22 • The WAGO-I/O-SYSTEM 750
Mechanical Setup

2.6.6 Assembly Sequence

All system components can be snapped directly on a carrier rail in accordance
with the European standard EN 50022 (DIN 35).

The reliable positioning and connection is made using a tongue and groove
system. Due to the automatic locking, the individual components are securely
seated on the rail after installing.

Starting with the ECO coupler, the bus modules are assembled adjacent to
each other according to the project planning. Errors in the planning of the node
in terms of the potential groups (connection via the power contacts) are recog-
nized, as the bus modules with power contacts (male contacts) cannot be
linked to bus modules with fewer power contacts.

Attention
Always link the bus modules with the ECO coupler, and always plug from
above.

Warning
Never plug bus modules from the direction of the end terminal. A ground
wire power contact, which is inserted into a terminal without contacts, e.g. a
4-channel digital input module, has a decreased air and creepage distance to
the neighboring contact in the example DI4.

Always terminate the fieldbus node with an end module (750-600).

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 The WAGO-I/O-SYSTEM 750 • 23
Mechanical Setup

2.6.7 Internal Bus / Data Contacts

Communication between the ECO coupler and the bus modules as well as the
system supply of the bus modules is carried out via the internal bus. It is com-
prised of 6 data contacts, which are available as self-cleaning gold spring con-
tacts.

Fig. 2-7: Data contacts p0xxx07x

Warning
Do not touch the gold spring contacts on the I/O modules in order to avoid
soiling or scratching!

ESD (Electrostatic Discharge)

The modules are equipped with electronic components that may be destroyed
by electrostatic discharge. When handling the modules, ensure that the envi-
ronment (persons, workplace and packing) is well grounded. Avoid touching
conductive components, e.g. gold contacts.

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24 • The WAGO-I/O-SYSTEM 750
Mechanical Setup

2.6.8 Power Contacts

Self-cleaning power contacts , are situated on the side of some components
which further conduct the supply voltage for the field side. These contacts
come as touchproof spring contacts on the right side of the bus modules. As
fitting counterparts the module has male contacts on the left side.

Danger
The power contacts are sharp-edged. Handle the module carefully to prevent
injury.

Attention
Please take into consideration that some bus modules have no or only a few
power jumper contacts. The design of some modules does not allow them to
be physically assembled in rows, as the grooves for the male contacts are
closed at the top.

Fig. 2-8: Example for the arrangement of power contacts g0xxx05e

Recommendation
With the WAGO ProServe® Software smartDESIGNER, the assembly of a
fieldbus node can be configured. The configuration can be tested via the inte-
grated accuracy check.

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 The WAGO-I/O-SYSTEM 750 • 25
Mechanical Setup

2.6.9 Wire connection

All components have CAGE CLAMP® connections.

The WAGO CAGE CLAMP® connection is appropriate for solid, stranded

and fine–stranded conductors. Each clamping unit accommodates one conduc-
tor.

Fig. 2-9: CAGE CLAMP® Connection g0xxx08x

The operating tool is inserted into the opening above the connection. This
opens the CAGE CLAMP®. Subsequently the conductor can be inserted into
the opening. After removing the operating tool, the conductor is safely
clamped.

More than one conductor per connection is not permissible. If several conduc-
tors have to be made at one connection point, then they should be made away
from the connection point using WAGO Terminal Blocks. The terminal blocks
may be jumpered together and a single wire brought back to the I/O module
connection point.

Attention
If it is unavoidable to jointly connect 2 conductors, then a ferrule must be
used to join the wires together.
Ferrule:
Length 8 mm
Nominal cross sectionmax. 1 mm2 for 2 conductors with 0.5 mm2
each
WAGO Product 216-103
or products with comparable properties

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26 • The WAGO-I/O-SYSTEM 750
Power Supply

2.7 Power Supply

2.7.1 Isolation
Within the fieldbus node, there are three electrically isolated potentials.

• Operational voltage for the fieldbus interface.

• Electronics of the ECO coupler and the bus modules (internal bus).

• All bus modules have an electrical isolation between the electronics (inter-
nal bus, logic) and the field electronics. Some analog input modules have
each channel electrically isolated, please see catalog.
Potential of the system supply
Electrical isolation
to the field level

T 6,3 A per module

250 V
Interface
Fieldbus

per channel
Elektronic

DC
DC

Potential Potentials
Fieldbus interface in the field level
Fig. 2-10: Isolation g0xxx11e

Attention
The ground wire connection must be present in each group. In order that all
protective conductor functions are maintained under all circumstances, it is
recommended that a ground wire be connected at the beginning and end of a
potential group. (ring format, please see chapter "2.8.3"). Thus, if a bus mod-
ule comes loose from a composite during servicing, then the protective con-
ductor connection is still guaranteed for all connected field devices.

When using a joint power supply unit for the 24 V system supply and the
24 V field supply, the electrical isolation between the internal bus and the
field level is eliminated for the potential group.

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 The WAGO-I/O-SYSTEM 750 • 27
Power Supply

2.7.2 System Supply

2.7.2.1 Connection

The WAGO-I/O-SYSTEM 750 requires a 24 V direct current system supply

(-15% or +20 %). The power supply is provided via the ECO coupler and, if
necessary, in addition via the internal system supply modules (750-613). The
voltage supply is reverse voltage protected.

Attention
The use of an incorrect supply voltage or frequency can cause severe damage
to the component.

Fig. 2-11: System Supply g0xxx16e

The direct current supplies all internal system components, e.g. ECO coupler
electronics, fieldbus interface and bus modules via the internal bus (5 V sys-
tem voltage). The 5 V system voltage is electrically connected to the 24 V sys-
tem supply.
750-343…346 750-613

DC 5 V
DC
0V
DC
Interface
Fieldbus

Electronic

DC
DC

DC 24 V
(-15% / + 20%)

Fig. 2-12: System Voltage g0xxx12e

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28 • The WAGO-I/O-SYSTEM 750
Power Supply

Attention
Resetting the system by switching on and off the system supply, must take
place simultaneously for all supply modules (ECO coupler and 750-613).

2.7.2.2 Alignment

Recommendation
A stable network supply cannot be taken for granted always and everywhere.
Therefore, regulated power supply units should be used in order to guarantee
the quality of the supply voltage.

The supply capacity of the ECO coupler or the internal system supply module
(750-613) can be taken from the technical data of the components.

Internal current consumption*) Current consumption via system voltage:

5 V for electronics of the bus modules and ECO
coupler
Residual current for bus termi- Available current for the bus modules. Provided by
nals*) the bus power supply unit. See ECO coupler and
internal system supply module (750-613)
*) cf. catalogue W4 Volume 3, manuals or Internet
Example ECO Coupler:
internal current consumption:350 mA at 5V
residual current for
bus modules: 650 mA at 5V
sum I(5V) total : 1000 mA at 5V

The internal current consumption is indicated in the technical data for each bus
terminal. In order to determine the overall requirement, add together the val-
ues of all bus modules in the node.

Attention
If the sum of the internal current consumption exceeds the residual current for
bus modules, then an internal system supply module (750-613) must be
placed before the module where the permissible residual current was ex-
ceeded.

Example: A node with a PROFIBUS ECO Coupler consists of 10 relay modules

(750-517) and 20 digital input modules (750-405).
Current consumption:
10* 90 mA = 900 mA
20* 2 mA = 40 mA
Sum 940 mA
The ECO coupler can provide 650 mA for the bus modules. Conse-
quently, an internal system supply module (750-613), e.g. in the mid-
dle of the node, should be added.

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 The WAGO-I/O-SYSTEM 750 • 29
Power Supply

Recommendation
With the WAGO ProServe® Software smartDESIGNER, the assembly of a
fieldbus node can be configured. The configuration can be tested via the inte-
grated accuracy check.

The maximum input current of the 24 V system supply is 260 mA. The exact
electrical consumption (I(24 V)) can be determined with the following formulas:

ECO Coupler
I(5 V) total = Sum of all the internal current consumption of the connected
bus modules
+ internal current consumption coupler

750-613
I(5 V) total = Sum of all the internal current consumption of the connected
bus modules

Input current I(24 V) = 5 V / 24 V * I(5 V) total / η

η = 0.80 (at nominal load)

Note
If the electrical consumption of the power supply point for the 24 V-system
supply of the ECO coupler exceeds 260 mA or 500 mA for the 750-613, then
the cause may be an improperly aligned node or a defect.

During the test, all outputs, in particular those of the relay modules, must be
active.

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30 • The WAGO-I/O-SYSTEM 750
Power Supply

2.7.3 Field Supply

2.7.3.1 Connection

Sensors and actuators can be directly connected to the relevant channel of the
bus module in 1-/4 conductor connection technology. The bus module supplies
power to the sensors and actuators. The input and output drivers of some bus
modules require the field side supply voltage.

The power supply modules provide field side power (DC 24V). In this case it
is a passive power supply without protection equipment. Power supply mod-
ules are available for different potentials, e.g. DC 24 V, AC 230 V or others.
Likewise, with the aid of the power supply modules, various potentials can be
set up. The connections are linked in pairs with a power contact.

Fig. 2-13: Field Supply (Sensor / Actuator) g0xxx17e

Note
The 24 V field supply can be connected also directly to a bus module, if the
connection points are not needed for the peripheral device supply. In this
case, the connection points need the connection to the power jumper contacts.

The supply voltage for the field side is automatically passed to the next mod-
ule via the power jumper contacts when assembling the bus modules .

The current load of the power contacts must not exceed 10 A on a continual
basis. The current load capacity between two connection terminals is identical
to the load capacity of the connection wires.

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 The WAGO-I/O-SYSTEM 750 • 31
Power Supply

By inserting an additional power supply module, the field supply via the
power contacts is disrupted. From there a new power supply occurs which
may also contain a new voltage potential.

Attention
Some bus modules have no or very few power contacts (depending on the I/O
function). Due to this, the passing through of the relevant potential is dis-
rupted. If a field supply is required for subsequent bus modules, then a power
supply module must be used.
Note the data sheets of the bus modules.

In the case of a node setup with different potentials, e.g. the alteration from
DC 24 V to AC 230V, a spacer module should be used. The optical separa-
tion of the potentials acts as a warning to heed caution in the case of wiring
and maintenance works. Thus, the results of wiring errors can be prevented.

2.7.3.2 Fusing

Internal fusing of the field supply is possible for various field voltages via an
appropriate power supply module.

750-601 24 V DC, Supply / Fuse

750-609 230 V AC, Supply / Fuse
750-615 120 V AC, Supply / Fuse
750-610 24 V DC, Supply / Fuse / Diagnosis
750-611 230 V AC, Supply / Fuse / Diagnosis

Fig. 2-14: Supply module with fuse carrier (Example 750-610) g0xxx09e

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32 • The WAGO-I/O-SYSTEM 750
Power Supply

Warning
In the case of power supply modules with fuse holders, only fuses with a
maximum dissipation of 1.6 W (IEC 127) must be used.

For UL approved systems only use UL approved fuses.

In order to insert or change a fuse, or to switch off the voltage in succeeding

bus modules, the fuse holder may be pulled out. In order to do this, use a
screwdriver for example, to reach into one of the slits (one on both sides) and
pull out the holder.

Fig. 2-15: Removing the fuse carrier p0xxx05x

Lifting the cover to the side opens the fuse carrier.

Fig. 2-16: Opening the fuse carrier p0xxx03x

Fig. 2-17: Change fuse p0xxx04x

After changing the fuse, the fuse carrier is pushed back into its original posi-
tion.

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 The WAGO-I/O-SYSTEM 750 • 33
Power Supply

Alternatively, fusing can be done externally. The fuse modules of the WAGO
series 281 and 282 are suitable for this purpose.

Fig. 2-18: Fuse modules for automotive fuses, Series 282 pf66800x

Fig. 2-19: Fuse modules with pivotable fuse carrier, Series 281 pe61100x

Fig. 2-20: Fuse modules, Series 282 pf12400x

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34 • The WAGO-I/O-SYSTEM 750
Power Supply

2.7.4 Supply example

Note
The system supply and the field supply should be separated in order to ensure
bus operation in the event of a short-circuit on the actuator side.
L1
L2
L3
N
PE

b) 1) 1) d)
a) c)

750-612 750-410 750-401 750-613 750-616 750-612 750-512 750-512 750-513 750-616 750-610 750-552 750-630 750-600

2) 2)
Shield (screen) bus

Main ground bus

10 A

System
Supply

230V

24V

Field
Supply
230V

24V

Field
Supply 1) Separation module
recommended
2) Ring-feeding
10 A recommended

a) Power Supply
on coupler via external
Supply Module
b) Internal System
Supply Module
c) Supply Module
passive
d) Supply Module
with fuse carrier/
diagnostics

Fig. 2-21: Supply example g0xxx13e

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 The WAGO-I/O-SYSTEM 750 • 35
Power Supply

2.7.5 Power Supply Unit

The WAGO-I/O-SYSTEM 750 requires a 24 V direct current system supply
with a maximum deviation of -15% or +20 %.

Recommendation
A stable network supply cannot be taken for granted always and everywhere.
Therefore, regulated power supply units should be used in order to guarantee
the quality of the supply voltage.

A buffer (200 µF per 1 A current load) should be provided for brief voltage
dips. The I/O system buffers for approx 1 ms.

The electrical requirement for the field supply is to be determined individually

for each power supply point. Thereby all loads through the field devices and
bus modules should be considered. The field supply as well influences the bus
modules, as the inputs and outputs of some bus modules require the voltage of
the field supply.

Note
The system supply and the field supply should be isolated from the power
supplies in order to ensure bus operation in the event of short circuits on the
actuator side.

WAGO products Description

Article No.
787-903 Primary switched - mode, DC 24 V, 5 A
wide input voltage range AC 85-264 V
PFC (Power Factor Correction)
787-904 Primary switched - mode, DC 24 V, 10 A
wide input voltage range AC 85-264 V
PFC (Power Factor Correction)
787-912 Primary switched - mode, DC 24 V, 2 A
wide input voltage range AC 85-264 V
PFC (Power Factor Correction)
Rail-mounted modules with universal mounting carrier
288-809 AC 115 V / DC 24 V; 0,5 A
288-810 AC 230 V / DC 24 V; 0,5 A
288-812 AC 230 V / DC 24 V; 2 A
288-813 AC 115 V / DC 24 V; 2 A

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36 • The WAGO-I/O-SYSTEM 750
Grounding

2.8 Grounding
2.8.1 Grounding the DIN Rail
2.8.1.1 Framework Assembly

When setting up the framework, the carrier rail must be screwed together with
the electrically conducting cabinet or housing frame. The framework or the
housing must be grounded. The electronic connection is established via the
screw. Thus, the carrier rail is grounded.

Attention
Care must be taken to ensure the flawless electrical connection between the
carrier rail and the frame or housing in order to guarantee sufficient ground-
ing.

2.8.1.2 Insulated Assembly

Insulated assembly has been achieved when there is constructively no direct

conduction connection between the cabinet frame or machine parts and the
carrier rail. Here the earth must be set up via an electrical conductor.

The connected grounding conductor should have a cross section of at least

4 mm2.

Recommendation
The optimal insulated setup is a metallic assembly plate with grounding con-
nection with an electrical conductive link with the carrier rail.

The separate grounding of the carrier rail can be easily set up with the aid of
the WAGO ground wire terminals.

Article No. Description

283-609 Single-conductor ground (earth) terminal block make an automatic
contact to the carrier rail; conductor cross section: 0.2 -16 mm2
Note: Also order the end and intermediate plate (283-320)

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 The WAGO-I/O-SYSTEM 750 • 37
Grounding

2.8.2 Grounding Function

The grounding function increases the resistance against disturbances from
electro-magnetic interferences. Some components in the I/O system have a
carrier rail contact that dissipates electro-magnetic disturbances to the carrier
rail.

Fig. 2-22: Carrier rail contact g0xxx10e

Attention
Care must be taken to ensure the direct electrical connection between the car-
rier rail contact and the carrier rail.

The carrier rail must be grounded.

For information on carrier rail properties, please see chapter 2.6.3.2.

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38 • The WAGO-I/O-SYSTEM 750
Grounding

2.8.3 Grounding Protection

For the field side, the ground wire is connected to the lowest connection ter-
minals of the power supply module. The ground connection is then connected
to the next module via the Power Jumper Contact (PJC). If the bus module has
the lower power jumper contact, then the ground wire connection of the field
devices can be directly connected to the lower connection terminals of the bus
module.

Attention
Should the ground conductor connection of the power jumper contacts within
the node become disrupted, e.g. due to a 4-channel bus terminal, the ground
connection will need to be re-established.

The ring feeding of the grounding potential will increase the system safety.
When one bus module is removed from the group, the grounding connection
will remain intact.

The ring feeding method has the grounding conductor connected to the begin-
ning and end of each potential group.

Fig. 2-23: Ring-feeding g0xxx07e

Attention
The regulations relating to the place of assembly as well as the national regu-
lations for maintenance and inspection of the grounding protection must be
observed.

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 The WAGO-I/O-SYSTEM 750 • 39
Shielding (Screening)

2.9 Shielding (Screening)

2.9.1 General
The shielding of the data and signal conductors reduces electromagnetic inter-
ferences thereby increasing the signal quality. Measurement errors, data
transmission errors and even disturbances caused by overvoltage can be
avoided.

Attention
Constant shielding is absolutely required in order to ensure the technical
specifications in terms of the measurement accuracy.

The data and signal conductors should be separated from all high-voltage
cables.

The cable shield should be potential. With this, incoming disturbances can be
easily diverted.

The shielding should be placed over the entrance of the cabinet or housing in
order to already repel disturbances at the entrance.

2.9.2 Bus Conductors

The shielding of the bus conductor is described in the relevant assembly
guideline of the bus system.

2.9.3 Signal Conductors

Bus modules for most analog signals along with many of the interface bus
modules include a connection for the shield.

Note
For better shield performance, the shield should have previously been placed
over a large area. The WAGO shield connection system is suggested for such
an application.
This suggestion is especially applicable when the equipment can have even
current or high impulse formed currents running through it (for example
through atmospheric end loading).

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40 • The WAGO-I/O-SYSTEM 750
Assembly Guidelines / Standards

2.9.4 WAGO Shield (Screen) Connecting System

The WAGO Shield Connecting system includes a shield clamping saddle, a
collection of rails and a variety of mounting feet. Together these allow many
dfferent possibilities. See catalog W4 volume 3 chapter 10.

Fig. 2-24: WAGO Shield (Screen) Connecting System p0xxx08x, p0xxx09x, and p0xxx10x

Fig. 2-25: Application of the WAGO Shield (Screen) Connecting System p0xxx11x

2.10 Assembly Guidelines / Standards

DIN 60204, Electrical equipping of machines

DIN EN 50178 Equipping of high-voltage systems with electronic

components (replacement for VDE 0160)

EN 60439 Low voltage – switch box combinations

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 The WAGO-I/O-SYSTEM 750 • 41
Assembly Guidelines / Standards

WAGO-I/O-SYSTEM 750
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42 • Fieldbus Coupler
Fieldbus Coupler 750-346

3 Fieldbus Coupler
3.1 Fieldbus Coupler 750-346
This chapter includes:

3.1.1 Description......................................................................................... 43
3.1.2 Hardware............................................................................................ 44
3.1.2.1 View .............................................................................................. 44
3.1.2.2 Device Supply ............................................................................... 45
3.1.2.3 Fieldbus Connection ..................................................................... 45
3.1.2.4 Display Elements .......................................................................... 46
3.1.2.5 Configuration Interface ................................................................. 47
3.1.2.6 Hardware Address (MAC ID)....................................................... 47
3.1.2.7 Setting the Baud Rate.................................................................... 48
3.1.3 Operating System............................................................................... 48
3.1.4 Process Image .................................................................................... 49
3.1.5 Data Exchange ................................................................................... 50
3.1.5.1 Communication Interfaces ............................................................ 51
3.1.5.2 Memory Areas .............................................................................. 51
3.1.5.3 Addressing .................................................................................... 52
3.1.5.3.1 Fieldbus Specific........................................................................... 52
3.1.6 Configuration Software ..................................................................... 54
3.1.7 Starting up DeviceNet Fieldbus Nodes.............................................. 54
3.1.7.1 Connecting the PC and Fieldbus Node ......................................... 54
3.1.7.2 Setting the MAC ID and Baud Rate ............................................. 54
3.1.7.3 Configuration with Static Assembly ............................................. 55
3.1.8 LED Display ...................................................................................... 59
3.1.8.1 Node status – Blink code from the 'I/O' LED ............................... 60
3.1.9 Technical Data ................................................................................... 67

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 Fieldbus Coupler • 43
Fieldbus Coupler 750-346

3.1.1 Description
The ECO fieldbus coupler is designed for applications with a reduced scale
I/O requirement. By using digital only process data, or small amounts of ana-
log data, the ECO Fieldbus coupler retains all of the choices that are offered
by the Series 750 I/O.

The coupler has an integrated supply terminal for the system voltage. The field
power jumper contacts are supplied via a separate supply module.

The DeviceNet bus coupler is capable of supporting all I/O modules and au-
tomatically configures, creating a local process image.
DeviceNet allows the storing of the process image in the corresponding Mas-
ter control (PLC, PC or NC).

The local process image is divided into two data zones containing the data re-
ceived and the data to be sent.
The process data can be sent via the DeviceNet fieldbus to the PLC, PC or NC
for further processing, and received from the field via DeviceNet TM.

The data of the analog modules is stored in the process image which is created
automatically according to the order in which the modules are connected to the
buscoupler. The bits of the digital modules are sent byte by byte and added to
the analog data. If the amount of digital information exceeds 8 bits, the bus-
coupler automatically starts with a new byte.

WAGO-I/O-SYSTEM 750
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44 • Fieldbus Coupler
Fieldbus Coupler 750-346

3.1.2 Hardware
3.1.2.1 View

DEVICENET Status indication

1 2 3 4 5 6 7 8
OVERFL -Fieldbus
DIP switch MS

750-346
RUN
-Fieldbus node
for MAC ID
and baud rate BUS OFF Data contacts
NS

ON
CONNECT
I/O

01 02 03 04

Marking area
Fieldbus
connection
Series 231
(MCS)

Configuration
Supply interface
24 V
0V

Fig. 3-1: ECO fieldbus coupler 750-346 DeviceNet g034600e

The fieldbus coupler comprises of:

• Supply module with internal system supply module for the system supply

• Fieldbus interface with the bus connection

• Display elements (LED's) for status display of the operation, the bus com-
munication, the operating voltages as well as for fault messages and diag-
nosics

• Configuration interface

• Electronics for communication with the I/O modules (internal bus) and the
fieldbus interface

WAGO-I/O-SYSTEM 750
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 Fieldbus Coupler • 45
Fieldbus Coupler 750-346

3.1.2.2 Device Supply

The supply is made via terminal blocks with CAGE CLAMP® connection.
The device supply is intended for the system unit.

I/O Modules

1/2
24 V
24 V
10 nF Electronic
5V
3/4
0V
Electronic
Interface
Fieldbus

24 V Fieldbus
Interface
5V
10 nF 1) 2)

24 V 0V 1) 1M
2) 10nF/500V

1 2 3 4

750-346

Fig. 3-2: Device supply g034631e

The integrated internal system supply module generates the necessary voltage
to supply the electronics of the coupler and the connected I/O modules.

The fieldbus interface is supplied by the fieldbus.

3.1.2.3 Fieldbus Connection

For the field bus connection, the DeviceNet interface is equipped with a 5 pole
header, its counter-piece being a plug connector (Open Style Connector).

The scope of delivery includes the plug connector 231-305/010-000/050-000

from the WAGO MULTI CONNECTION SYSTEM. The connector has gold
plated contacts and has the signal designations printed at its clamping units.

The table below shows the connection diagram, the colors resulting in accor-
dance with the DeviceNet specification and are identical to the conductor col-
ors of the DeviceNet cables.

Pin Signal Code Description

5 V+ red 11 ... 25 V
V+

Fieldbus CAN_High 4 CAN_H white CAN Signal High

connection
drain
Series 231
(MCS) CAN_Low
3 Shield Shield connection
V-
2 CAN_L blue CAN Signal Low
1 V- black 0V
Fig. 3-3: Fieldbus connection, MCS g012500e

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46 • Fieldbus Coupler
Fieldbus Coupler 750-346

For the connection of small conductor cross sections, we recommend to insert

an insulation stop from series 231-670 (white), 231-671 (light grey) or 231-
672 (dark grey) due to the low kink resistance. This insulation stop prevents a
conductor from kinking when it hits the conductor contact point, and as such
the conductor insulation from also being entered into and clamped in the con-
nection point. Connector marking and housing components, test connectors
including cables and header connectors for cable extensions are available.

The connection point is lowered in such a way that after a connector is in-
serted, installation in an 80 mm high switchbox is possible.

The electrical isolation between the fieldbus system and the electronics is
made via the DC/DC converter and the optocoupler in the fieldbus.

3.1.2.4 Display Elements

The operating condition of the fieldbus coupler or node is signalled via light
diodes (LED).

Four LEDs specific for DeviceNet (OVERFL, RUN, BUSOFF, CONNECT)

indicate the module status (MS) and the network status (NS).

DEVICENET
OVERFL
MS
750-346

RUN
BUS OFF
NS
CONNECT
I/O

Fig. 3-4: Display elements 750-346 g034602x

LED Color Meaning

OVERFL red Errors or faults at the fieldbus coupler.
RUN green Fieldbus coupler is ready for operation.
BUS OFF red Error or malfunction at network
CONNECT green Fieldbus coupler is ready for network communication.
I/O red/ The ‚I/O‘-LED indicates the operation of the node and signals faults
green/ encountered.
orange

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 47
Fieldbus Coupler 750-346

3.1.2.5 Configuration Interface

The configuration interface used for the communication with

WAGO-I/O-CHECK or for firmware transfer is located behind the cover flap.

open
flap

Configuration
interface
Fig. 3-5: Configuration interface g01xx06e

The communication cable (750-920) is connected to the 4 pole header.

Warning
The communication cable 750-920 must not be connected or disconnected
while the coupler/controller is powered on!

3.1.2.6 Hardware Address (MAC ID)

The DIP switch is used both for parametrizing (setting the baud rate) of the
fieldbus coupler and for setting the MAC ID.

The MAC-ID (node address) is set with the DIP switches 1 to 6 by 'sliding' the
desired DIP switch to 'ON'.
The binary significance of the individual DIP switches increases according to
the switch number. DIP switch 1 being the lowest bit with the value 20 and
switch 6 the highest bit with the value 25. Therefore the MAC ID 1 is set with
DIP1 = ON, the MAC ID 8 with DIP4 = ON, etc.

For the DeviceNet fieldbus nodes the node address can be set within the range
from 0 to 63.
8
1 2 3 4 5 6 7 8

7
6
ON 5
4
3
2
ON

Fig. 3-6: Example: Setting of station (node) address MAC ID 1 (DIP 1 = ON) g012548x

The configuration is only read during the power up sequence. Changing the
switch position during operation does not change the configuration of the bus-
coupler. Turn off and on the power supply for the fieldbus coupler to accept
the DIP switch change.

The default setting is MAC ID 1.

WAGO-I/O-SYSTEM 750
DeviceNet
48 • Fieldbus Coupler
Fieldbus Coupler 750-346

3.1.2.7 Setting the Baud Rate

The bus coupler supports 3 different Baud rates, 125 kBaud, 250 kBaud and
500 kBaud. DIP switches 7 and 8 are used to set the baud rate.
8 Baudrate DIP7 DIP8

1 2 3 4 5 6 7 8
7 *)
6 125 kBaud OFF OFF
ON 5
4 250 kBaud ON OFF
3
2 500 kBaud OFF ON
ON

1
not allowed ON ON
g012549x *)
Presetting
Fig. 3-7: Example: Setting the baud
rate 250 kBaud (DIP 7 = ON) on a
station (node) with the address MAC
ID 1.
The configuration is only read during the power up sequence. Changing the
switch position during operation does not change the configuration of the bus-
coupler. Turn off and on the power supply for the fieldbus coupler to accept
the DIP switch change.
The default setting is Baud rate 125 kB.

3.1.3 Operating System

Following is the configuration of the master activation and the electrical in-
stallation of the fieldbus station.
After switching on the supply voltage, the coupler performs a self test of all
functions of its devices, the I/O module and the fieldbus interface. Following
this the I/O modules and the present configuration is determined, whereby an
external not visible list is generated.
In the event of a fault the coupler changes to the "Stop" condition. The "I/O"
LED flashes red. After clearing the fault and cycling power, the coupler
changes to the "Fieldbus start" status and the "I/O" LED lights up green.

Fig. 3-8: Operating system - Power on g012113e

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 49
Fieldbus Coupler 750-346

3.1.4 Process Image

After powering up, the coupler recognizes all I/O modules plugged into the
node which supply or wait for data (data width/bit width > 0). In the nodes
analog and digital I/O modules can be mixed.

The coupler produces an internal process image from the data width and the
type of I/O module as well as the position of the I/O modules in the node. It is
divided into an input and an output data area.

The data of the digital I/O modules is bit orientated, i.e. the data exchange is
made bit for bit. The analog I/O modules are all byte orientated I/O modules,
i.e. modules where the data exchange is made byte for byte. These I/O mod-
ules include for example the counter modules, I/O modules for angle and path
measurement as well as the communication modules.

Note
For the number of input and output bits or bytes of the individual I/O modules
please refer to the corresponding I/O module description.

The data of the I/O modules is separated for the local input and output process
image in the sequence of their position after the coupler in the individual proc-
ess image.
In the respective I/O area, analog modules are mapped first, then all digital
modules, even if the order of the connected analog and digital modules does
not comply with this order. The digital channels are grouped, each of these
groups having a data width of 1 byte. Should the number of digital I/Os ex-
ceed 8 bits, the coupler automatically starts another byte.

Note
A process image restructuring may result if a node is changed or extended. In
this case the process data addresses also change in comparison with earlier
ones. In the event of adding a module, take the process data of all previous
modules into account.

WAGO-I/O-SYSTEM 750
DeviceNet
50 • Fieldbus Coupler
Fieldbus Coupler 750-346

3.1.5 Data Exchange

With DeviceNet, the transmission and exchange of data is made using objects.

For a network access on the single objects of the coupler, it is necessary to

create a connection between the desired participants and to allocate connection
objects.

For an easy and quick set-up of a connection the DeviceNet fieldbus coupler
750-346 uses the "Predefined Master/Slave Connection Set", which contains 4
pre-defined connections. For the access on the coupler the connections only
need to be allocated. The "Predefined Master/Slave Connection Set" confines
itself to pure Master/Slave relationships.
The DeviceNet fieldbus coupler 750-346 can only communicate via its as-
signed client and it is a so-called "Group 2 Only Server". The Group 2 Only
Server communicating is only possible via the Group 2 Only Unconnected
Explicit Message Port. These slaves exclusively receive messages defined in
message group 2.

The object configuration for the data transmission is defined by an Assembly

Object. The Assembly Object can be used to group data (e.g. I/O data) into
blocks (mapping) and send this data via one single communication connection.
This mapping results in a reduced number of accesses to the network.
A differentiation is made between "Input-Assemblies" and "Output-
Assemblies".
An Input-Assembly reads in data from the application via the network or pro-
duces data on the network respectively.
An Output-Assembly writes data to the application or consumes data from the
network respectively.

Various Assembly instances are permanently programmed (static assembly) in

the fieldbus coupler.

Further information
The Assembly instances for the static assembly are described in chapter
"4.5.1.1Assembly Instance".

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 51
Fieldbus Coupler 750-346

3.1.5.1 Communication Interfaces

For a data exchange, the DeviceNet fieldbus coupler is equipped with two inter-
faces:
• the interface to fieldbus (-master) and
• the interface to the bus modules.

Data exchange takes place between the fieldbus master and the bus modules.
Access from the fieldbus side is fieldbus specific.

3.1.5.2 Memory Areas

The coupler uses a memory space of 32 bytes for the physical input and 32
bytes for the physical output data.
fieldbus coupler

memory area
fieldbus for input data
I/O modules
1

input
modules

memory area
for output data
2

output
modules
I O

Fig. 3-9: Memory areas and data exchange for a fieldbus coupler g012447e

The coupler process image contains the physical data of the bus modules in a
storage area for input data and in a storage area for output data (32 bytes each).

1 The input module data can be read from the fieldbus side.

2 In the same manner, writing to the output modules is possible from the
fieldbus side.

WAGO-I/O-SYSTEM 750
DeviceNet
52 • Fieldbus Coupler
Fieldbus Coupler 750-346

3.1.5.3 Addressing

3.1.5.3.1 Fieldbus Specific

Once the supply voltage is applied, the Assembly Object maps data from the
process image. As soon as a connection is established, a DeviceNet-Master
(Scanner) can address and access the data by "Class", "Instance" and "Attrib-
ute".
Data mapping depends on the selected Assembly Instance of the static Assem-
bly.

Further information
The Assembly Instances of the static Assembly are described in chapter
"4.5.1.1 Assembly Instance".
Fieldbus coupler

memory area
for input data
1 I/O modules

Assembly Application input

Connection
Object Object modules
Object
Producer
Input-
Assemly

fieldbus
master Consumer
memory area
for output data
Output-
Assemly 2

output
modules
I O

Fig. 3-1: Fieldbus specific data exchange for a DeviceNet fieldbus coupler g012547e

Note
For the number of input and output bits or bytes of the individual I/O modules,
please refer to the corresponding I/O module description.

Note
A process image restructuring may result if a node is changed or extended. In
this case the process data addresses also change in comparison with earlier
ones. In the event of adding a module, take the process data of all previous
modules into account.

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 53
Fieldbus Coupler 750-346

Example for static assembly (default assembly):

The default assembly is:

Output1 (I/O Assembly Instance 1)

Input1 (I/O Assembly Instance 4)

In this example, the fieldbus node arrangement looks like this:

1) 1 ECO fieldbus coupler DeviceNet (750-346),

2) 1 digital 4-channel input modules (i. e. 750-402),
3) 1 digital 4- channel output module (i. e. 750-504),
4) 1 analog 2- channel output module with 2 bytes per channel
(i. e. 750-552),
5) 1 analog 2- channel input module with 2 bytes per channel
(i. e. 750-456),
6) 1 End module (750-600).

Input process image:

Default process data, input image (Assembly Class, Instance 4)

Byte .7 .6 .5 .4 .3 .2 .1 .0
0 low byte channel 1
1 high byte channel 1
2 low byte channel 2
3 high byte channel 2
4 not used DI041) DI031) DI021) DI011)
5 CS08 2) CS07 2) CS06 2) CS05 2) CS04 2) CS03 2) CS02 2) CS01 2)
1)
DI = = Digital Input
2)
CS = Coupler Status (The last byte in the input process image is the Status Byte
of the Coupler, CS01...CS08, see also Object 0x64, Instance 1, Attribute 5)
CS01 =1: internal bus error (0x01)
CS02 =1: module communication error (0x02)
CS04 =1: module diagnostic (0x08)
CS08 =1: fieldbus error (0x80)
Output process image:
Default process data, output image (Assembly Class, Instance 1)

Byte .7 .6 .5 .4 .3 .2 .1 .0
0 low byte channel 1
1 high byte channel 1
2 low byte channel 2
3 high byte channel 2
4 not used DO041) DO031) DO021) DO011)
1)
DO = Digital Output

WAGO-I/O-SYSTEM 750
DeviceNet
54 • Fieldbus Coupler
Fieldbus Coupler 750-346

3.1.6 Configuration Software

To enable a connection between the PLC and the fieldbus devices, the inter-
face modules have to be configured with the individual station data.

To this effect, the scope of delivery of WAGO-I/O-SYSTEM 758 includes the

WAGO NETCON software intended for design and configuration, start-up and
diagnosis.
Further configuration software of different manufacturers include, for in-
stance, RSNetWorx.

3.1.7 Starting up DeviceNet Fieldbus Nodes

This chapter shows the step-by-step procedure for starting up a
WAGO DeviceNet fieldbus node.
Attention
This description is given as an example and is limited to the execution of a
local start-up of an individual DeviceNet fieldbus node.

The procedure contains the following steps:

1. Connecting the PC and fieldbus node

2. Setting the MAC ID and baud rate
Configuration with static Assembly

3.1.7.1 Connecting the PC and Fieldbus Node

1. Connect the fitted DeviceNet fieldbus node to the DeviceNet fieldbus PCB in
your PC via a fieldbus cable.
The 24 V field bus supply is fed by an external fieldbus network power supply
over the connections V+, V- of the 5-pin fieldbus connector (MCS Series 231).
2. Start your PC.
3.1.7.2 Setting the MAC ID and Baud Rate

3. Use the DIP switches 1...6 to set the desired node address (MAC ID). The bina-
ry significance of the individual DIP switches increases according to the switch
number.
8 DIP switch Value
1 2 3 4 5 6 7 8

7
6 1 20
ON 5
4 2 21
3
2 3 22
ON

1
g012550x
4 23
Fig. 3-10: Example: Setting the
5 24
MAC ID 4 (DIP 3 = ON).
6 25

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 55
Fieldbus Coupler 750-346

4. DIP switches 7 and 8 are used to set the desired baud rate.
8 Baud rate DIP7 DIP8

1 2 3 4 5 6 7 8
7
6 125 kBaud*) OFF OFF
ON 5
4 250 kBaud ON OFF
3
2 500 kBaud OFF ON

ON
1
g012551x
not allowed ON ON
Fig. 3-11: Example: Setting the baud *)
rate 250 kBaud (DIP 7 = ON) of the Presetting
station with MAC ID 1.

5. Then switch on the coupler supply voltage.

3.1.7.3 Configuration with Static Assembly

In this example, the software WAGO NETCON is used for the configuration.

The node in the example consists of the following I/O modules:

1 2 3 4 5 6 7
DI DI DODO DODO DODO AI AI AO AO
1 2 3 4 5 6 7 8
ON

402 516 516 516 467 550 600

Fig. 3.1.7-12 Example Fieldbus node g012554x

1. Starting Software and EDS file load

6. Start the configuration software WAGO NETCON.

7. Load an EDS file for the fieldbus coupler in WAGO NETCON, i. e. "750-
346.EDS".
For this click on "File/ Copy EDS" and choose the EDS-file to load.
Note
You can download the EDS files for the fieldbus coupler from the Internet
under: www.wago.com.

8. Upon downloading the EDS file into WAGO NETCON, you can create a new
project and start configuring your network.

WAGO-I/O-SYSTEM 750
DeviceNet
56 • Fieldbus Coupler
Fieldbus Coupler 750-346

2. Create a New Project

1. Enter the "File" menu and click on menu point "New".

2. Select "DeviceNet" as the fieldbus system and confirm your selection by

clicking on the "OK" button.

Fig. 3-13: Select fieldbus p112501d

3. Enter Master

1. Enter a fieldbus master on the surface by clicking on the „Master“ menu

point in the "Insert" menu.

A dialog window opens in which you can select the DeviceNet fieldbus card
in your PC.

Fig. 3-14: Select the DeviceNet fieldbus PCB / Insert Master p112502d

2. For the DeviceNet Master interface card, click in the left-hand selection
window on the corresponding entry to mark it.

3. Take the Master into the right-hand window by clicking on the "Add" but-
ton and confirm by clicking on the "OK" button.

Now the fieldbus master is shown on the surface as a graphic.

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 57
Fieldbus Coupler 750-346

4. Add a Slave

1. Enter a fieldbus slave on the surface by clicking on the “Device” menu

point in the "Insert" menu.

The mouse pointer changes to the letter D with an arrow.

2. Move this mouse pointer to the graphic display of the fieldbus, then click
on the left-hand mouse key.

A dialog window opens permitting you to select a DeviceNet device.

Fig.
3-15: Insert slave g012503d

3. For the fieldbus coupler 750-346 click in the left-hand selection window on
the corresponding entry to mark it.

4. Take this into the right-hand window by clicking on the "Add" button and
confirm by clicking on the "OK" button.

The configuration is displayed on the surface as a graphic.

Fig. 3-16: Configuration p012504d

WAGO-I/O-SYSTEM 750
DeviceNet
58 • Fieldbus Coupler
Fieldbus Coupler 750-346

5. Device Configuration

1. To configure the device, click on its graphic to mark it, then click on the
menu point “Device configuration” in the "Settings" menu.

A dialog window opens permitting you to proceed with the desired set-
tings.

Fig. 3-17: Device Configuration p012506d

6. Load Configuration

1. To load the set configuration in the interface card, click on the master’s
graphic to mark it, then click on the “Download” menu point in the "On-
line" menu.

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 59
Fieldbus Coupler 750-346

3.1.8 LED Display

The coupler possesses several LEDs for on site display of the coupler operat-
ing status or the complete node.

DEVICENET
OVERFL
750-346 MS
RUN
BUS OFF
NS
CONNECT
I/O

Fig. 3-18: Display elements 750-346 g034602x

The module status (MS) and the network status (NS) can be displayed by the
top 4 LED’s. They react as described in the table.

Module status
OVERFL RUN State of device Meaning
(red) (green)
off off no power No power supply to the device.
off on device operational The device operates correctly.
off blinking device in standby The device needs to be configured or has been partly
configured.
blinking off minor fault A minor fault has occurred. It exists a diagnostics.
on off unrecoverable fault The device is defective, needs to be serviced or
replaced.
blinking blinking device self testing The device performs a built-in check.

Table 3-1: Fault and status displays: MS

Network status
BUSOFF CONNECT State of device Meaning
(red) (green)
off off not powered, not online No power supply to the device / fieldbus supply /
DeviceNet cable not connected and „Duplicate MAC
ID detection“ is not yet completed.
off blinking online, not connected The device operates correctly at the fieldbus. How-
ever, it has not yet been integrated by a scanner.
off on link ok online, con- The device operates correctly at the fieldbus. At
nected least one connection to another device has been
established.
blinking off connection time out A minor fault has occurred.
on off critical link failure The device has detected a fault. It is unable to per-
form any more functions in the network.

Table 3-2: Fault and status displays: NS

WAGO-I/O-SYSTEM 750
DeviceNet
60 • Fieldbus Coupler
Fieldbus Coupler 750-346

3.1.8.1 Node status – Blink code from the 'I/O' LED

LED Color Meaning

IO red /green The 'I/O' LED indicates the node operation and signals faults occur-
/ orange ring.
The coupler starts up after switching on the supply voltage. The "I/O" LED
blinks. The "I/O" LED has a steady light following a fault free start-up.
In the case of a fault the "I/O" LED continues blinking. The fault is cyclically
displayed by the blink code.

Detailed fault messages are displayed with the aid of a blink code. A fault is
cyclically displayed with up to 3 blink sequences.

• The first blink sequence (approx. 10 Hz) starts the fault display.

• The second blink sequence (approx. 1 Hz) following a pause. The

number of blink pulses indicates the fault code.

• The third blink sequence (approx. 1 Hz) follows after a further pause.
The number of blink pulses indicates the fault argument.

Fig. 3-19: Signalling the LED's node status g012111e

After overcoming a fault, restart the coupler by cycling the power.

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 61
Fieldbus Coupler 750-346

I/O Meaning
green Data cycle on the internal bus
off No data cycle on the internal bus
red Coupler hardware defective
red When starting: internal bus is initialized
blinks During operation: general internal bus fault
red Fault message during internal bus reset and internal fault:
blinks cyclically

Fault message of the ‘I/O‘-LED

1 st flash sequence: Start of the Fault message

2 nd flash sequence: Fault code
3 rd flash sequence: Fault argument

Fault code 1: "Hardware and Configuration fault"

Fault argument Fault description Trouble shooting
1 Overflow of the internal buffer Turn off the power supply of the
memory for the inline code node, reduce number of I/O mod-
ules and turn the power supply on
again. If the error still exists,
exchange the bus coupler.
2 I/O module(s) with unsupported Detect faulty I/O module as fol-
data type lows: turn off the power supply.
Place the end module in the mid-
dle of the fieldbus node. Turn the
power supply on again.
– If the LED is still blinking, turn
off the power supply and place the
end module in the middle of the
first half of the node (towards the
coupler).
– If the LED doesn’t blink, turn
off the power supply and place the
end module in the middle of the
second half of the node (away
from the coupler).
Turn the power supply on again.
Repeat this procedure until the
faulty I/O module is detected.
Replace the faulty I/O module.
Ask about a firmware update for
the fieldbus coupler.
3 Invalid EEPROM checksum Turn off the power supply of the
node, reduce number of I/O mod-
ules and turn the power supply on
again
4 Error occurred when writing to Turn off the power supply of the
serial EEPROM node, exchange fieldbus coupler
and turn the power supply on
again.

WAGO-I/O-SYSTEM 750
DeviceNet
62 • Fieldbus Coupler
Fieldbus Coupler 750-346

5 Error occurred with read access Turn off the power supply of the
to serial EEPROM node, exchange fieldbus coupler
and turn the power supply on
again.
6 Changed I/O module configura- Restart the fieldbus coupler by
tion determined after turning the power supply off and
AUTORESET on again.
7 Firmware does not run on exist- Turn off the power supply of the
ing hardware node, exchange fieldbus coupler
and turn the power supply on
again.
8 Time limit exceeded for access- Turn off the power supply of the
ing the serial EEPROM node, exchange fieldbus coupler
and turn the power supply on
again.
14 Maximum number of Gateway or Turn off the power supply of the
Mailbox I/O modules exceeded node, reduce number of Gateway
or Mailbox I/O modules and turn
the power supply on again.
Fault code 2 -Process Image Fault -
Fault argument Fault description Trouble shooting
1 Process image not activ Access on invalid process image.
Please contact the WAGO I/O-
Support (Note the version number
and the configuration)
2 Prozess image is larger than size Reduce the number of I/O modules
of buffer
3 Prozess image is zero Please contact the WAGO I/O-
Support (Note the version number
and the configuration)

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 63
Fieldbus Coupler 750-346

Fault code 3: "Internal bus protocol fault"

Fault argument Fault description Trouble shooting
- Internal bus communication If the fieldbus node comprises
malfunction; faulty device can’t internal system supply modules
be detected (750-613), make sure first that the
power supply of these modules is
functioning. This is indicated by
the status LEDs. If all I/O modules
are connected correctly or if the
fieldbus node doesn’t comprise
750-613 modules you can detect
the faulty I/O module as follows:
turn off the power supply of the
node. Place the end module in the
middle of the fieldbus node. Turn
the power supply on again.
– If the LED is still blinking, turn
off the power supply and place the
end module in the middle of the
first half of the node (towards the
coupler).
– If the LED doesn’t blink, turn off
the power supply and place the end
module in the middle of the second
half of the node (away from the
coupler).
Turn the power supply on again.
Repeat this procedure until the
faulty I/O module is detected.
Replace the faulty I/O module. If
there is only one I/O module left
but the LED is still blinking, then
this I/O module or the coupler is
defective. Replace defective com-
ponent.

WAGO-I/O-SYSTEM 750
DeviceNet
64 • Fieldbus Coupler
Fieldbus Coupler 750-346

Fault code 4: "Internal bus physical fault"

Fault argument Fault description Trouble shooting
- Error in internal bus data com- Turn off the power supply of the
munication or interruption of the node. Place an I/O module with
internal bus at the coupler process data behind the coupler
and note the error argument after
the power supply is turned on. If
no error argument is given by the
I/O LED, replace the coupler.
Otherwise detect faulty I/O module
as follows: turn off the power
supply. Place the end module in
the middle of the fieldbus node.
Turn the power supply on again.
– If the LED is still blinking, turn
off the power supply and place the
end module in the middle of the
first half of the node (towards the
coupler).
– If the LED doesn’t blink, turn off
the power supply and place the end
module in the middle of the second
half of the node (away from the
coupler).
Turn the power supply on again.
Repeat this procedure until the
faulty I/O module is detected.
Replace the faulty I/O module.
If there is only one I/O module left
but the LED is still blinking, then
this I/O module or the coupler is
defective. Replace defective com-
ponent.
n* Interruption of the internal bus Turn off the power supply of the
after the nth process data module. node, exchange the (n+1)th process
data module and turn the power
supply on again.

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 65
Fieldbus Coupler 750-346

Fault code 5: "Internal bus initialization fault"

Fault argument Fault description Trouble shooting
n* Error in register communication Turn off the power supply of the
during internal bus initialization node and replace nth process data
module and turn the power supply
on again.
Fault code 6 –Node configuration fault-
Fault argument Fault description Trouble shooting
- Number of I/O modules is ex- Reduce the number of I/O mod-
ceeded, ules on the node
the Process image is bigger than
the available cache
Fault code 7 -not used-
Fault argument Fault description Trouble shooting
- not used -
Fault code 8 -not used-
Fault argument Fault description Trouble shooting
- not used -
Fault code 9 -not used-
Fault argument Fault description Trouble shooting
- not used -
Fault code 10 -not used-
Fault argument Fault description Trouble shooting
- not used -
Fault code 11: "Gateway-/Mailbox I/O module fault"
Fault argument Fault description Trouble shooting
1 Maximum number of Gateway Turn off the power supply of the
modules exceeded node, reduce number of Gateway
modules and turn the power supply
on again.
2 Maximum size of Mailbox ex- Reduce the Mailbox size.
ceeded
3 Maximum size of process image Reduce the data width of the
exceeded due to the put Gateway Gateway modules.
modules
* The number of blink pulses (n) indicates the position of the I/O module. I/O modules
without data are not counted (e.g. supply module without diagnosis)

WAGO-I/O-SYSTEM 750
DeviceNet
66 • Fieldbus Coupler
Fieldbus Coupler 750-346

Example for a fault message; Fault: The 13th I/O module has been removed
1. The "I/O" LED starts the fault display with the first blink sequence (approx. 10
flashes/second).
2. The second blink sequence (1 flash/second) follows the first pause. The "I/O" LED
blinks four times and thus signals the fault code 4 (internal bus data fault).
3. The third blink sequence follows the second pause. The "I/O " LED blinks twelve
times. The fault argument 12 means that the internal bus is interrupted after the 12th
I/O module.

WAGO-I/O-SYSTEM 750
DeviceNet
 Fieldbus Coupler • 67
Fieldbus Coupler 750-346

3.1.9 Technical Data

System data
Max. no. of nodes 64 with scanner
Max. no. of I/O points ca. 6000 (depends on master)
Transmission medium shielded Cu cable,
trunk line: AWG 15, 18 (2x 0.82mm2 +2x1.7mm2)
drop line: AWG 22, 24 (2x0.2mm2 +2x0.32mm2)
Max. length of bus line 100 m ... 500 m
(depends on baud rate / on the cable)
Baud rate 125 kBaud, 250 kBaud, 500 kBaud
Buscoupler connection 5-pole male connector, series 231 (MCS)
female connector 231-305/010-000/050-000
is included
Standards and approvals
UL E175199, UL508
DEMKO 02 ATEX 132273 X
II 3 GD EEx nA II T4
Conformity marking CE
Accessories
EDS files Download: www.wago.com
Miniature WSB quick marking system
Technical data
Max. number of I/O modules 64
Fieldbus
Input process image max. 32 Byte
Output process image max. 32 Byte
Configuration via PC or PLC
Voltage supply DC 24 V (-15 % / + 20 %)
Current consumption
- via power supply terminal typ. at no- 260 mA at 24 V
minal load
- via DeviceNet interface <120 mA at 11 V
Efficiency of the power supply typ. at 80 %
nominal load
Internal current consumption 350 mA at 5 V
Total current for I/O modules 650 mA at 5 V
Dimensions (mm) W x H x L 50 x 65* x 97
(*from top edge of mounting rail)
Weight ca. 120 g
EMC interference resistance gem. EN 61000-6-2 (2)
EMC interference transmission gem. EN 50081-2 (94)

WAGO-I/O-SYSTEM 750
DeviceNet
68 • DeviceNet
Description

4 DeviceNet
4.1 Description
DeviceNet is a networking concept in the device level based on the serial bus
system CAN (Controller Area Network). It is particularly distinguished by the
problem-free addition and removal of devices, from simple light barriers up to
complex motor controls during operation. DeviceNet is mainly used in indus-
trial automation and for robot controls.
The Data Link Layer, i.e. the physical and data storage layer, is defined in the
CAN specification. The telegram architecture is described. However, there is
no information about the application layer.
This is where DeviceNet comes into play. It describes the defined meaning of
the data transmitted in the application layer.
The Open DeviceNet Vendor Association (abridged: ODVA) is the user or-
ganisation for DeviceNet. In a specification, the ODVA DeviceNet is defined
as a uniform application layer and it lays down technical and functional fea-
tures for device networking.
A maximum of 64 fieldbus nodes can be operated in one DeviceNet network.
The extension of the network depends on the selected baud rate (125 kBaud,
250 kBaud or 500 kBaud).
In contrast to other fieldbus systems, CAN does not address the modules con-
nected to the bus but identifies the messages. Whenever the bus is free, sub-
scribers are allowed to send messages. Each bus subscriber decides on its own
when it wants to send data or instigate other bus subscribers to send data. This
permits a communication without a bus master assembly group.
Bus conflicts are solved in that the messages are assigned a certain priority.
This priority is defined by the CAN identifier, called Connection ID in De-
viceNet. The following rule applies: the smaller the identifier, the higher the
priority.
A general distinction between high priority process messages (I/O Messages)
and low priority management messages (Explicit Messages) is done before.
Messages having a data length of more than 8 bytes can be fragmented.
The communication with DeviceNet occurs always connection-referenced
(connection based). All data and functions of a device are described by means
of an object model. Therefore, for a message exchange directly after switching
on a device, the connections to the desired subscriber have to be established
first and communication objects be created or allocated. Message distribution
is according to the broadcast system, data exchange according to the producer
consumer model.
A transmitting DeviceNet node produces data that is either consumed via a
point-to-point connection (1 to 1) by one receiving node, or via a multicast
connection (1 to n) by several receiving nodes.

WAGO-I/O-SYSTEM 750
DeviceNet
 DeviceNet • 69
Network Architecture

Further information
The Open DeviceNet Vendor Association (ODVA) provides further docu-
ments in the Internet under: http://www.odva.org

4.2 Network Architecture

4.2.1 Transmission Media
4.2.1.1 Type of Cable

A bus medium forms the basis for the physical realization of a network using
DeviceNet.
According to the line specification, a double 2-conductor twisted pair cable
(twisted pair, screened cable) is recommended to be used as a medium.
It consists of two screened twisted pair cables with a wire in the middle of the
cable. Further screening extended at the outside.
The blue and the white twisted pair cable is used for signal transmission, the
black and red one for the supply voltage.

4.2.1.2 Cable Types

The DeviceNet bus is configured using a remote bus cable as the trunk line
and several drop lines.

For this purpose, the DeviceNet specification distinguishes between 2 cable

types:

• Thick Cable
For the trunk line of maximum 8 A or for networks extending over more
than 100 m.
The trunk line topology is linear, i.e. the remote bus cables are not further
branched. On each end of the remote bus cable, terminating resistors are
required.

• Thin Cable
For drop lines with maximum 3 A or for networks extending less than
100 m.
One or more nodes can be connected to the drop lines, in other words,
branching is permitted here. The length of the individual drop lines is
measured from the branching point of the node and can be up to 6 m. The
entire length of the drop line depends on the Baud rate.

WAGO-I/O-SYSTEM 750
DeviceNet
70 • DeviceNet
Network Architecture

Note
If possible, route the data line separately from all high current carrying ca-
bles.

Further information
For a detailed specification regarding the cable types, please refer to the
INTERNET under: http://www.odva.org.

4.2.1.3 Maximum Bus Length

In the following table, the permitted cable length is represented in dependence of the Baud
rate. Here, a differentiation is made between the maximum length for a transmission using a
thick and a thin cable.

Baud rate Bus length Tap line length

Thick + Thin Cable only only maximal cumulated
Thick Thin
Cable Cable
500 kbit/s LTick + LThin ≤ 100 m (328 ft) 100 m 100 m 6 m (19,6 ft) 39 m (127,9 ft)
(328 ft) (328 ft)
250 kbit/s LTick + 2,5 • LThin ≤ 250 m (820,2 ft) 250 m 100 m 6 m (19,6 ft) 78 m (255,9 ft)
(820,2 ft) (328 ft)
125 kbit/s LTick + 5 • LThin ≤ 500 m (1640,4 ft) 500 m 100 m 6 m (19,6 ft) 156 m (511,8 ft)
(1640,4 ft) (328 ft)

Tab. 4-1: Maximum bus length dependent on the set Baud rate

When specifying the maximum cable lengths, it is made sure that communica-
tion is possible between two nodes located at maximum distance to each other
(worst case).

4.2.2 Cabling
The connection of a WAGO fieldbus node to the DeviceNet bus cable is made
by the supplied 5-pole plug (Multi Connector 231).

V+

Fieldbus CAN_High
connection
drain
Series 231
(MCS) CAN_Low

V-

Fig. 4-1: Plug assignment for the fieldbus connection

For wiring using a screened cable, the plus is assigned the connections V+, V-
for the voltage supply and with CAN_High, CAN_Low for data transmission.
The 24 V field bus supply is fed by an external fieldbus network power sup-
ply.
WAGO-I/O-SYSTEM 750
DeviceNet
 DeviceNet • 71
Network Architecture

CAN_High and CAN_Low are two physically different bus levels.

The cable screen is connected to the drain connection.
This is terminated with a 1 MΩ resistor to the DIN rail via the clip on the bot-
tom of the Coupler/Controller. The DIN rail must then be directly connected
to the Grounding Stud that must be connected to Earth Ground. We strongly
recommend a central Earth Ground for the entire DeviceNet Bus conductor
screening. A low Ohm connection of the screening on PE terminal can only be
made externally.

Note
WAGO offers the screen connection system (series 790) for an optimum con-
nection between fieldbus cable screening and functional earth.

Each DeviceNet node forms the differential voltage UDiff with: UDiff =
UCAN_High - UCAN_Low. using the bus levels CAN_High and CAN_Low.
Differential signal transmission offers the advantage of an insensitivity com-
pared to common mode malfunctions and ground offset between the nodes.

Note

At its conductor ends, the bus cable must always be connected with a match-
ing resistor of 120 Ohm to avoid reflections and, as a result, transmission
problems.
This is also required for very short conductor lengths.

The CAN bus is a 2-wire bus and bus error management can detect a cable
break or a short-circuit by the asymmetric operation.

Further information
The CiA provides documents regarding specifications, especially cable specifi-
cations on the Internet under:

http://www.can-cia.de

WAGO-I/O-SYSTEM 750
DeviceNet
72 • DeviceNet
Network Architecture

4.2.3 Network Topology

To build a simple DeviceNet network, you need a scanner (PC with a De-
viceNet fieldbus PCB card), a connection cable and a DC 24 V power pack to
ensure the power supply in addition to a DeviceNet fieldbus node.

The CANopen network is constructed as a line structure with matching resis-

tors (120 Ohm).
Termination Termination
120

120
WAGO Scanner Busnetz-
I/ O teil

In systems accommodating more than two stations, all subscribers are wired in
parallel. Node connection to the remote bus cable (trunk line) is made by
means of drop lines. For this purpose, the bus cable has to be looped without
interruption. A maximum length of 6 m for a drop line should not be ex-
ceeded.

The following is a topology example:

Power Supply

WAGO-I/O-SYSTEM 750
DeviceNet
 DeviceNet • 73
Network Architecture

WAGO Kontakttechnik GmbH has developed a Multi-Port DeviceNet Tap to

connect the nodes to permit the connection of remote bus cables and drop lines
using the CAGE CLAMP® technology. This achieves a reliable, fast and vi-
bration and corrosion resistant connection.
The DeviceNet taps are available in 2 designs.
Article Description
810-900/000-001 Enclosed design with connection possibilities for 6 lines.
The housing provides a protection in difficult environ-
mental conditions.
810-901/000-001 Open design to which 2 drop lines and 2 remote bus lines
(trunk lines) can be connected.

All subscribers in the network communicate at the same Baud rate. The bus
structure permits the interference-free connection and disconnection of sta-
tions or a stepped start-up of the system.
Future extensions have no influence on the stations already in operation.
Should a subscriber fail or be added to the network as a new one, it is auto-
matically deteced by the system.

4.2.4 Network Grounding

The devices can either be power supplied via the DevicNet bus or have their
own power supply.

Prerequisite being, however, that the network is only grounded at one point.
Preferably, grounding is in the network center (V and screen drain with round
media) to optimize the capacity and minimize interference.

Not permitted are ground loops via devices that are not disconnected from the
power supply. The device must either be insulated or, if this is not possible,
the power must be correspondingly disconnected in the device.

4.2.5 Interface Modules

In a network, all WAGO DeviceNet fieldbus nodes are delivered to operate as
slaves. The master operation is taken over by a central control system, such as
PLC, NC or RC.

Note
The programmable fieldbus Controller 750-806 can assume the master op-
eration when being extended by the "DevNet.lib" library.

The connection to fieldbus devices is made via interface modules.

As an interface module, WAGO offers the PC interface PCBs for DeviceNet,
ISA DeviceNet Master 7KByte (order No. 758-340), PC104 DeviceNet Mas-
ter 7KByte D-Sub,straight, angled (order No. 758-341) and PCI DeviceNet
Master 7 Kbyte (order No. 758-342) from the WAGO-I/O-SYSTEM 758 Se-
ries.

WAGO-I/O-SYSTEM 750
DeviceNet
74 • DeviceNet
Network Communication

Other interface modules for programmable logic controls (PLCs) are also of-
fered by other manufacturers.

4.3 Network Communication

4.3.1 Objects, Classes, Instances and Attributes
Protocol processing of DeviceNet is object oriented. Each node in the network
is represented as a collection of objects. In the following, several terms con-
nected with them are defined:

• Object:
Object is an abstract representation of individual components within a de-
vice belonging to each other. It is defined by its data or attributes, its ex-
ternal functions or services available, and by its defined behaviour.

• Class:
A class includes objects of a product belonging together, it is organized in
instances, e.g. Identity Class, DeviceNet Class.

• Instance:
An instance is composed of various variables (attributes). Differing in-
stances of a class have the same services, the same behaviour and the same
variables (attributes). However, they can have different variable values,
e.g. different connection instances: Expilict Message, Poll I/O or Bit-
Strobe connection instance.

• Attributes:
The attributes represent data provided by a device via DeviceNet. They
contain the current values, e.g. a configuration of an input, such as, for in-
stance Vendor ID, Device Type or Product Name.

• Service:
Services can be applied to classes and attributes. They perform defined ac-
tions, e.g. reading of variables (attributes) or resetting a class.

• Behaviour:
The behaviour defines how a device reacts as a consequence of external
events, such as changed process data, or as a consequence of internal
events, such as expiring timers.

WAGO-I/O-SYSTEM 750
DeviceNet
 DeviceNet • 75
Module Characteristics

4.4 Module Characteristics

The I/O module is defined by vendor ID and device type.

Vendor ID 0x28 (40)

Device Type 0x0C (12), Communication Adapter
4.4.1 Communication Model
4.4.1.1 Message Groups

CAN messages are divided into several groups in order to achieve different
priorities.

• message group 1 serves to exchange I/O data via I/O messages

• message group 2 is reserved for Master/Slave applications

• message group 3 serves to exchange configurations data via explicit mes-

sages

• message group 4 is reserved for system administration (i. e. Offline Con-

nection Set)

The CAN Identifier (Connection ID) and with it the priority is built via differ-
ent message groups and the MAC ID.

4.4.1.2 Message Types

DeviceNet has 2 types of messages:

• I/O Messages and

• Explicite Messages
4.4.1.2.1 I/O Messaging

I/O messages are sent by a node and can be received by one or several other
nodes. Only I/O data is transmitted and no protocol data is specified by this
way.

4.4.1.2.2 Explicit Messaging

Explicit messages are sent directly from one node to another. They consist of a
request and an answer. Therefore services can be requested directly from an-
other node. The data field consists of the service identification and the destina-
tion address. The format of the explicit messages is defined. Via explicit mes-
sages devices can be configured or a dynamic built-up of message connections
can be made.

WAGO-I/O-SYSTEM 750
DeviceNet
76 • DeviceNet
Process data and Diagnostic Status

4.4.2 I/O Messaging Connections

The transfer or exchange of process data between the scanner and the I/O de-
vice is made via a „Polled I/O Connection“, „Change of State/Cyclic“ or „Bit
Strobe“.

Polled I/O Connection Slaves are cyclically polled by the master.

Strobe Function All slaves are polled by the master by means of

a command.

Change of State Messages are transmitted either cyclically by

the master or the slave, or in the event of a state
change.

4.5 Process data and Diagnostic Status

The data is transmitted between master and slave in the form of objects, a dif-
ferentiation being made between input and output objects. The object architec-
ture is defined by assembly objects which serve to group attributes of differing
application objects. I/O data of different objects can, for this reason, be
grouped to form a data block and transmitted by a message connection.

4.5.1 Process Image

The process image is differentiated according to input and output process im-
ages. The assembly object makes a statically configured process image avail-
able in the instances 1 ... 9.

The desired process image can be selected by setting the Produced Connection
Path and the Consumed Connection Path of the individual I/O connections
(Poll, Bit Strobe, Change of State or Change of Value).

The architecture of the individual instances of the assembly object is described

in the following.

WAGO-I/O-SYSTEM 750
DeviceNet
 DeviceNet • 77
Process data and Diagnostic Status

4.5.1.1 Assembly Instances

Permanently pre-programmed (static) assemblies in the device permit an easy

and rapid transmission of input and output images from the fieldbus Cou-
pler/Controller to the master. For this purpose, various assembly instances are
provided in the fieldbus Coupler/Controller:

Output 1 (I/O Assembly Instance 1):

The entire output data image is transmitted from the master to the Controller
via the corresponding I/O message connection. In this case, the data length
corresponds to the number of output data in bytes. Analog output data come
before digital output data.

Output 2 (I/O Assembly Instance 2):

The digital output data image is transmitted from the master to the Controller
via the corresponding I/O message connection. The data length is equivalent to
the number of digital output data and is rounded up to full bytes.

Output 3 (I/O Assembly Instance 3):

The analog output data image is transmitted from the master to the Controller
via the corresponding I/O message connection. The data length is equivalent to
the number of analog output data in bytes.

Input 1 (I/O Assembly Instance 4):

The entire input data image and one status byte are transmitted to the master
via the corresponding I/O message connection. The data length is equivalent to
the number of input data in bytes and one status byte.

Input 2 (I/O Assembly Instance 5):

The digital input data image and one status byte are transmitted to the master
via the corresponding I/O message connection. The data length is equivalent to
the number of digital input data and rounded up to full bytes. In addition, a
status byte is inserted.

Input 3 (I/O Assembly Instance 6):

The analog input data image and one status byte are transmitted to the master
via the corresponding I/O message connection. The data length is equivalent to
the number of analog input data in bytes and one status byte.

Input 1 (I/O Assembly Instance 7):

The entire input data image is transmitted to the master via the corresponding
I/O message connection. The data length is equivalent to the number of input
data in byte.

WAGO-I/O-SYSTEM 750
DeviceNet
78 • DeviceNet
Process data and Diagnostic Status

Input 2 (I/O Assembly Instance 8):

The digital input data image is transmitted to the master via the corresponding
I/O message connection. The data length is equivalent to the number of digital
input data and is rounded up to full bytes.

Input 3 (I/O Assembly Instance 9):

The analog input data image is transmitted to the master via the corresponding
I/O message connection. The data length is equivalent to the number of analog
input data in bytes.

WAGO-I/O-SYSTEM 750
DeviceNet
 DeviceNet • 79
Configuration / Parametering with the Object Model

4.6 Configuration / Parametering with the Object Model

4.6.1 EDS Files
In DeviceNet, the capacity characteristics of the devices are documented by
the manufacturers in the form of an EDS file (Electronic Data Sheet) and
made available to the user.

Architecture, contents and coding of the EDS files are standardized which
permits design and configuration with devices of different manufacturers.

The EDS file is read by the configuration software and corresponding settings
transmitted. For required entries and handling steps for this purpose, please re-
fer to the software user manuals.

Further information
ODVA informs about the EDS files of all listed manufacturers.

http://www.odva.org

EDS and symbol files to configure the I/O modules are available under the
order numberr 750-912 on a floppy disk or on the WAGO INTERNET home-
page.

http://www.wago.com

WAGO-I/O-SYSTEM 750
DeviceNet
80 • DeviceNet
Configuration / Parametering with the Object Model

4.6.2 Object Model

For network communication DeviceNet uses an object model describing all
device functions and data.

System Support Objects (general Management Objects)

• Identity Object
• Message Router Object
Communication Objects (Communications Objects for Data exchange)
• DeviceNet Object
• Connection Object
Application Objects
(Application Objects, to determine device function and/or configuration)
• Application Object(s)
• Assembly Object
• Parameter Object

Table 4-1: Object model

Communication can be made exclusively connection oriented. For access by

the network to the individual objects, first of all make connections between the
desired subscribers and provide or allocate connection objects.

Data Type
USINT Unsigned Short INTeger (8 Bit)
UINT Unsigned INTeger (16 Bit)
USINT Unsigned Short INTeger (8 Bit)
UDINT Unsigned Double INTeger (32 Bit)
BOOL Boolean, True (1) or False (0)
STRUCT Structure of ...
ARRAY Array of ...

WAGO-I/O-SYSTEM 750
DeviceNet
 DeviceNet • 81
Configuration / Parametering with the Object Model

4.6.2.1 Object Model for Coupler 750-346

4.6.2.1.1 Classes of Coupler:

Object Class Instance Description
Identity 0x01 1 Device type, vendor ID, serial number etc.
Message Router 0x02 1 Routes explicit messages to the proper destination.
DeviceNet 0x03 1 Maintains the physical connection to DeviceNet. This object
also allocates/deallocates the Master/Slave connection set.
Assembly 0x04 9 Allows Data transmission of different objects over a single
connection, by binding attributes of multiple objects.
Connection class 0x05 3 Allows explicit messages to be conducted.
Acknowledge handler 0x2B 1 The Acknowledge Handler Object is used to manage the
reception of messages acknowledgements. This object com-
municates with a message producing application object
within a device. The Acknowledge Handler Object notifies
the producing application of acknowledge reception, ac-
knowledge timeouts amd production retry limit.
Coupler configuration object 0x64 1 Coupler and module configuration
Discrete input point 0x65 0...255 Digital input channel objects
Discrete output point 0x66 0...255 Digital output channel objects
Analog input point 0x67 0...16 Analog input channel objects
Analog output point 0x68 0...16 Analog output channel objects
Module configuration 0x80 1...65 Objects for module configuration

4.6.2.1.2 Identity Class (0x01):

Instance 0:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 required get Revision UINT Revision of the Identity Object, 0x0001
Range 1-65535, class definition
upon which the implementation
is based.
2 optional get Max UINT Maximum instance number 0x0001
Instance

Instance 1:
Attribute Used in Access Name Data type Description Default
ID buscoupler rule Value
1 required get Vendor UINT Identification of vendor 40 (0x28)
2 required get Device UINT Indication of general type of 12 (0x0C)
Type product
3 required get Product UINT Identification of particular i. e. 346
Code product of an individual vendor (0x15A),
for the
750-346
4 required get Revision Stuct: Revision of the item the Identity i. e. {1;2}
Major/ USINT, object represents for the
Minor USINT 750-346
5 required get Status WORD status of device -
6 required get Serial_ UDINT Serial number of device -
number
7 required get Product SHORT_ Human readable identification i. e.
name STRING „750-346“
(num,char for the
char...) 750-346
10 optional get Heartbeat USINT The nominal interval between 0
Interval heartbeat messages in seconds

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Returns the contents of the specified attribute
0x05 Reset Invokes the reset service for the device

WAGO-I/O-SYSTEM 750
DeviceNet
82 • DeviceNet
Configuration / Parametering with the Object Model

4.6.2.1.3 Message Router (0x02):

no attribute, no services

4.6.2.1.4 DeviceNet Object (0x03):

Instance 0:
Attribute Used in Access Name Data type Description Default
ID buscoupler rule Value
1 required get Revision UINT Revision of the Identity Object, 0x02
Range 1-65535, class definition
upon which the implementation
is based.

Instance 1:
Attribute Used in Access Name Data type Description Default
ID buscoupler rule Value
1 Optional get/set MAC ID USINT Node address 0 - 63
2 Optional get Baud Rate USINT Baud rate 0-2
3 Optional get/set BOI BOOL Bus-off Interrupt 0/1
4 Optional get/set Bus-Off USINT Number of times CAN went to 0 - 255
Counter the bus-off state
5 Optional get Allocation Struct of: s. MAC ID of Master (from 0 - 63, 255
Informa- BYTE, Allocate)
tion USINT
Allocation
Choice
Byte
Master`s
ID

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read a DeviceNet Object attribute value
0x10 Set_Attribute_Single Used to modify a DeviceNet object attribute value
0x4B Allocate_Master/Slave_Connection Requests the use of the predefined Master/Slave
connection
0x4C Release_Group_2_Identifier_Set Indicates that the specified connections within the
predefined Master/Slave connection set are no
longer desired. These connections are to be released
(deleted)

WAGO-I/O-SYSTEM 750
DeviceNet
 DeviceNet • 83
Configuration / Parametering with the Object Model

4.6.2.1.5 Assembly Object (0x04):

Instance 0:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 required get Revision UINT Revision of the Assembly Object, 0x0002
Range 1-65535, class definition
upon which the implementation is
based.

Description of the Instances:

Instance Description
ID
1 References to the process image containing analog and digital output data.
2 References to the process image containing only digital output data.
3 References to the process image containing only analog output data.
4 References to the process image containing containing analog and digital input data plus status.
5 References to the process image containing only digital input data plus status.
6 References to the process image containing only analog input data plus status.
7 References to the process image containing analog and digital input data.
8 References to the process image containing only analog input data.
9 References to the process image containing only analog input data.

12 References to the process image: analog and digital input data plus Error Code
13 References to the process image: analog and digital input data plus Error Code and Error Argument
14 References to the process image: analog and digital input data plus Error Code and Error Argument,
Status
15 References to the process image: Status plus three zero bytes and analog and digital input data

Instance 1:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get/set Process Array of process image, collection of all
of connected image Byte modules process output data.
modules

Instance 2:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get/set Process Array of process image, collection of all
of connected image Byte modules process output data.
modules

Instance 3:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get/set Process Array of process image, collection of all
of connected image Byte analog modules process output
modules data.

Instance 4:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Process Array of process image, collection of all
of connected image Byte modules process input data plus
modules status byte.

WAGO-I/O-SYSTEM 750
DeviceNet
84 • DeviceNet
Configuration / Parametering with the Object Model

Instance 5:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Process Array of process image, collection of all
of connected image Byte digital modules process input data
modules plus status byte.
Instance 6:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Process Array of process image, collection of all
of connected image Byte analog modules process input data
modules plus status byte.

Instance 7:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Process Array of process image, collection of all
of connected image Byte modules process input data
modules

Instance 8:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Process Array of process image, collection of all
of connected image Byte digital modules process input data
modules

Instance 9:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Process Array of process image, collection of all
of connected image Byte analog modules process input data
modules

Instance 12:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Process Array of process image, collection of all
of connected image + Byte analog modules process input data
modules Error plus Error Code (Cl. 100/Inst. 1/
Code Attr. 45)

Instance 13:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Process Array of process image, collection of all
of connected image + Byte analog modules process input data
modules Error plus Error Code (Cl. 100/Inst. 1/
Code + Attr. 45)
Error plus Error Argument (Cl. 100/Inst.
Argument 1/ Attr. 46)

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 DeviceNet • 85
Configuration / Parametering with the Object Model

Instance 14:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Process Array of process image, collection of all
of connected image + Byte analog modules process input data
modules Error plus Error Code (Cl. 100/Inst. 1/
Code + Attr. 45)
Error plus Error Argument (Cl. 100/Inst.
Argument 1/ Attr. 46)
+ Status plus Status (Cl. 100/Inst. 1/Attr. 5)

Instance 15:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
3 dep. on kind get Status Array of Status (Cl. 100/Inst. 1/Attr. 5)
of connected + first zero Byte plus three bytes, which are always
modules byte (‘0’) zero plus analog and digital input
+ second data
zero byte
(‘0’)
+ third
zero byte
(‘0’)
+ Process
image

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read a DeviceNet Object attribute value
0x10 Set_Attribute_Single Used to modify a DeviceNet object attribute value

4.6.2.1.6 Connection Object (0x05):

Instance 0:
Attribute Used in Access Name Data type Description Default
ID buscoupler rule Value
1 required get Revision UINT Revision of the Connection 0x0001
Object, Range 1-65535, class
definition upon which the im-
plementation is based.

Description of the instances:

Instance ID Description
1 References the Explicit Messaging Connection into the Server
2 References the Poll I/O Connection
3 References Bit-Strobe I/O Connection
4 References the Slave´s Change of State or Cyclic I/O Connection
5 Reserved for „Reserved Identifier“, Message ID 1

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Configuration / Parametering with the Object Model

Instance 1 (explicit messaging):

Attribute Used in Access Name Data type Description
ID buscoupler rule
1 available get state USINT State of the object
2 required get instance_ USINT Indicates either I/O or Messaging Connection
type
3 required get transport- USINT defines behaviour of the connection
Class_
trigger
4 required get produced_ UINT CAN Identifier field when the connection
connec- transmits
tion_id
5 required get con- UINT CAN Identifier field value that denotes mes-
sumed_co sage to be received
nnec-
tion_id
6 required get ini- USINT Defines the message groups across which
tial_comm productions and consumptions associated
_character with this connection occur
istics
7 required get pro- UINT maximum number of Bytes transmitted across
duced_con this connection
nec-
tion_size
8 required get con- UINT maximum number of Bytes transmitted across
sumed_co this connection
nnec-
tion_size
9 required get/set ex- UINT defines timing associated with this connnec-
pected_pa tion
cket_rate
10-11 N/A get N/A N/A not used
12 required get watch- USINT defines how to handle inactivity/watchdog
dog_timeo timeouts
ut_action
13 required get pro- UINT number of Bytes in pro-
duced_con duced_connection_path attribute
nec-
tion_path_
length
14 required get/set pro- Array of specifies the application objects which data is
duced_con USINT to be produced by this connection object
nec-
tion_path
15 required get con- UINT number of Bytes in con-
sumed_co sumed_connection_path attribute
nnec-
tion_path_
length
16 required get con- Array of specifies the application objects that are to
sumed_co USINT receive the data consumed by this connection
nnec- object
tion_path
17 required get produc- USINT defines minimum time between new data
tion_inhibi production
t_time

Instance 2 (Poll I/O Connection):

Attribute Used in Access Name Data type Description
ID buscoupler rule
1 available get state USINT State of the object
2 required get instance_ USINT Indicates either I/O or Messaging Connection
type
3 required get transport- USINT Defines behaviour of the connection
Class_
trigger
4 required get produced_ UINT CAN Identifier field when the connection

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 DeviceNet • 87
Configuration / Parametering with the Object Model

connec- transmits
tion_id
5 required get con- UINT CAN Identifier field value that denotes mes-
sumed_co sage to be received
nnec-
tion_id
6 required get ini- USINT Defines the message groups across which
tial_comm productions and consumptions associated
_character with this connection occur
istics
7 required get pro- UINT maximum number of Bytes transmitted across
duced_con this connection
nec-
tion_size
8 required get con- UINT maximum number of Bytes received across
sumed_co this connection
nnec-
tion_size
9 required get/set ex- UINT defines timing associated with this connnec-
pected_pa tion
cket_rate
10-11 N/A get N/A N/A not used
12 required get watch- USINT defines how to handle inactivity/watchdog
dog_timeo timeouts
ut_action
13 required get pro- UINT number of Bytes in pro-
duced_con duced_connection_path attribute
nec-
tion_path_
length
14 required get/set pro- Array of specifies the application objects which data is
duced_con USINT to be produced by this connection object
nec-
tion_path
15 required get con- UINT number of Bytes in con-
sumed_co sumed_connection_path attribute
nnec-
tion_path_
length
16 required get/set con- Array of specifies the application objects that are to
sumed_co USINT receive the data consumed by this connection
nnec- object
tion_path
17 required get produc- USINT defines minimum time between new data
tion_inhibi production
t_time

Instance 3 (Bit-Strobe I/O Connection):

Attribute Used in Access Name Data type Description
ID buscoupler rule
1 available get state USINT State of the object
2 required get instance_ USINT Indicates either I/O or Messaging Connection
type
3 required get transport- USINT defines behaviour of the connection
Class_
trigger
4 required get produced_ UINT CAN Identifier field when the connection
connec- transmits
tion_id
5 required get con- UINT CAN Identifier field value that denotes mes-
sumed_co sage to be received
nnec-
tion_id
6 required get ini- USINT Defines the message groups across which
tial_comm productions and consumptions associated
_character with this connection occur
istics
7 required get pro- UINT maximum number of Bytes transmitted across
duced_con this connection

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Configuration / Parametering with the Object Model

nec-
tion_size
8 required get con- UINT maximum number of Bytes received across
sumed_co this connection
nnec-
tion_size
9 required get/set ex- UINT defines timing associated with this connnec-
pected_pa tion
cket_rate
10-11 N/A get N/A N/A not used
12 required get watch- USINT defines how to handle inactivity/watchdog
dog_timeo timeouts
ut_action
13 required get pro- UINT number of Bytes in pro-
duced_con duced_connection_path attribute
nec-
tion_path_
length
14 required get pro- Array of specifies the application objects which data is
duced_con USINT to be produced by this connection object
nec-
tion_path
15 required get con- UINT number of Bytes in con-
sumed_co sumed_connection_path attribute
nnec-
tion_path_
length
16 required get con- Array of specifies the application objects that are to
sumed_co USINT receive the data consumed by this connection
nnec- object
tion_path
17 required get produc- USINT defines minimum time between new data
tion_inhibi production
t_time

Instance 4 (Change of State and Cyclic I/O Connection):

Attribute Used in Access Name Data type Description
ID buscoupler rule
1 available get state USINT State of the object
2 required get instance_ USINT Indicates either I/O or Messaging Connection
type
3 required get transport- USINT defines behaviour of the connection
Class_
trigger
4 required get produced_ UINT CAN Identifier field when the connection
connec- transmits
tion_id
5 required get con- UINT CAN Identifier field value that denotes mes-
sumed_co sage to be received
nnec-
tion_id
6 required get ini- USINT Defines the message groups across which
tial_comm productions and consumptions associated
_character with this connection occur
istics
7 required get pro- UINT maximum number of Bytes transmitted across
duced_con this connection
nec-
tion_size
8 required get con- UINT maximum number of Bytes received across
sumed_co this connection
nnec-
tion_size
9 required get/set ex- UINT defines timing associated with this connnec-
pected_pa tion
cket_rate
10-11 N/A get N/A N/A not used
12 required get watch- USINT defines how to handle inactivity/watchdog
dog timeo timeouts

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 DeviceNet • 89
Configuration / Parametering with the Object Model

ut_action
13 required get pro- UINT number of Bytes in pro-
duced_con duced_connection_path attribute
nec-
tion_path_
length
14 required get/set pro- Array of specifies the application objects which data is
duced_con USINT to be produced by this connection object
nec-
tion_path
15 required get con- UINT number of Bytes in con-
sumed_co sumed_connection_path attribute
nnec-
tion_path_
length
16 required get con- Array of specifies the application objects that are to
sumed_co USINT receive the data consumed by this connection
nnec- object
tion_path
17 required get/set produc- USINT defines minimum time between new data
tion_inhibi production
t_time

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read a DeviceNet Object attribute value
0x10 Set_Attribute_Single Used to modify a DeviceNet object attribute value
0x05 Reset Restores connection default values.

The instances are not available if the connection is in state „non existent“.

I/O Connection Object State

Delete from any state

Non-Existent

Create Get_Atribute/Set_Attribute

Get_Atribute/ Waiting for Apply Atributes

Apply_Atributes
Set_Attribute/ Configuring
Apply_Attributes Connection ID
Apply_Atributes

Get_Atribute/
Set_Attribute/ Established
Apply_Attributes/
Reset/Message
Produced/Consumed Inactivity/Watchdog
Reset Timeout & watchdog_timeout_action =
Transition to Time Out

Delete
Timed Out

Fig. 4-1: Status of I/O Connection Objects g012546x

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Configuration / Parametering with the Object Model

4.6.2.1.7 Acknowledge Handler Object (0x2B):

Instance 0:
Attribute Used in Access Name Data type Description Wert
ID buscoupler rule
1 required get Revision UINT Revision of the Acknowledge 0x0001
Handler Object, Range 1-65535,
class definition upon which the
implementation is based.
2 required get Max UINT maximum instance number of an 0x0001
instance object currently created in this
class level of device
Instance 1:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 required get/set Acknowl- UINT time to wait for acknowledge before resend-
edge timer ing range 1-65,535 ms (0 invalid), default 16
ms
2 required get/set Retry limit USINT number of ack timeouts to wait before inform-
ing the producing application of a Re-
tryLimit_Reached event default=1, range 0-
255; default 16 ms
3 required get COS UINT 0x04, connection instance which contains the
Producing path of the producing I/O application object
Connec- which will be notified of ack handler objects
tion
Instance
4 optinal Get Ack List BYTE Maximum number of members in Ack List.
Size
5 Optinal Get Ack List BYTE List of active connection instances which are
Array of receiving Acks.
UINT
6 Optinal Get Data with BYTE Maximum number of members in Data with
Ack Path Ack Path List.
List Size
7 optinal get Data with BYTE List of active connection instance/consuming
Ack Path Array of application object pairs. This attribute is used
List UINT to forward data received with acknowledg-
USINT ment.
Array of
USINT

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read a DeviceNet Object attribute
value
0x10 Set_Attribute_Single Used to modify a DeviceNet object attribute
value

4.6.2.1.8 Coupler Configuration Object (0x64):

Instance 0:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 required get Revision UINT Revision of the Coupler Configu- 0x01
ration Object, Range 1-65535,
class definition upon which the
implementation is based.
2 required get Max UINT maximum instance number of an 0x01
instance object currently created in this
class level of device

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Configuration / Parametering with the Object Model

Instance 1:
Attribute Used in Access Name Data Description
ID buscoupler rule type
1 specific get/set Bk_Module USINT module number: 0-coupler, 1- first module, 2-
No 2.module
2 specific get/set Bk_TableNo USINT table number: 0 ... 256; not all existing
3 specific get/set Bk_Register USINT Register number: 0...255 for the coupler
No (0...63 for modules)
4 specific get/set Bk_Data UINT Register data , Status
5 specific get ProcessState USINT coupler status: 0x01 module communication
error, 0x02 internal bus error, 0x08: module
diagnostic , 0x80 fieldbus error
6 specific get DNS_i_Trm UINT Module status, 0x8000 to decode a message,
nldia (**) High Byte (Bit14...8): channel number, Low
Byte (Bit7..0) Module number
(**) Object 100 (0x64) Instance 1 Attribute 6
The attribute DNS_i_Trmndia is set depending on the state of the node, i. e.it will be execute a
diagnostic evaluation. This word will only supply valid data, if bit 3 (count up from 0) in Proc-
essState (class 100/Inst1/Attr.5) is set. This bit indicates, that a new diagnostic notification is present
(see description ProcessState).
The diagnostic evaluation is done by bit 15 in the attribute DNS_i_Trmndia.
If a diagnostic error appears, bit 15 is set.
If an error is rectifyed, bit 15 is reset.
As long as at least one diagnostic error is present, the MS LED is blinking red.
If there are a lot of diagnostic notifications at the same time, with every readout of this attribute you
get the next diagnostic notification. If DNS_i_Trmndia = 0, there is current no new diagnostic notifi-
cation. The MS LED changes on green again, not until the readout of the last diagnostic notification
(only if the diagnostic reason is solved).
7 specific get CnfLen. UINT number of I/O Bits for analog output data
AnalogOut words
8 specific get CnfLen. UINT number of I/O Bits for analog input data
AnalogInp words
9 specific get CnfLen. UINT number of I/O Bits for digital output data bits
DigitalOut
10 specific get CnfLen. UINT number of I/O Bits for digital input data bits
DigitalInp
11 specific get/set BK_FAULT USINT An enumerator used to specify fieldbus error
_REACTIO handling
N 0: stop local I/O cycles (default)
1: switch all outputs to 0
2: do nothing
12 specific get/set BK_SEL_S UINT Non volatile power up value for the polled I/O
TORED_PO produced connection path. The attribute is
LL_P_PAT used to hold an enumerator for the assembly
H path and the class and instance for the mod-
ules object (discrete input point...) paths.
Write only instance values that are available
for couplers present module configuration.
(e.g. do not use analog input points if only
digital modules are fixed to the coupler.)
4:analog and digital input data,status
5: only digital input data plus status
6: only analog input data plus status
7: analog and digital input data
8: only digital input data
9: only analog input data
12: analog and digital input data plus
BK_LED_ERR_CODE (C 100, I 1, A45)
13: analog and digital input data plus
BK_LED_ERR_CODE (C 100, I 1, A45) plus
BK_LED_ERR_ARG (C 100, I 1, A46)
14: analog and digital input data plus
BK_LED_ERR_CODE (C 100, I 1, A45) plus
BK_LED_ERR_ARG (C 100, I 1, A46) plus
Status (C 100, I 1 A 5) plus DNS_i_Trmnldia
(C 100, I 1, A6) plus BK_DIAG_VALUE (C
100, I 1, A47)
15: Status (C 100, I 1 A 5) plus three bytes,
which are always zero plus analog and digital
input data
13 specific get/set BK_SEL_S UINT Non volatile power up value for the polled I/O
TORED_PO consumed connection path. The attribute is

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Configuration / Parametering with the Object Model

LL_C_PAT used to hold an enumerator for the assembly

H path and the class and instance for modules
object (discrete input point ...) paths. Write
only instance values that are available for
couplers present module configuration (e.g.
do not use analog input points if only digital
modules are fixed to the coupler.
14 specific get/set BK_SEL_S UINT Non volatile power up value for the change of
TORED_CO state and cyclic connection path. The attribute
SCYC_C_P is used to hold an enumerator for the assem-
ATH bly path and the class and instance for mod-
ules object (discrete input point...) paths.
Write only instance values that are available
for couplers present module configuration (e.g
not use analog input points if only digital
modules are fixed to the coupler.)
4:analog and digital input data plus Status,
5: digital input data plus Status,
6: analog input data plus Status,
7:analog and digital input data,
8:digital input data
9: analog input data,
12: analog and digital input data plus
BK_LED_ERR_CODE (C 100, I 1, A45)
13: analog and digital input data plus
BK_LED_ERR_CODE (C 100, I 1, A45) plus
BK_LED_ERR_ARG (C 100, I 1, A46)
14: analog and digital input data plus
BK_LED_ERR_CODE (C 100, I 1, A45) plus
BK_LED_ERR_ARG (C 100, I 1, A46) plus
Status (C 100, I 1 A 5) plus DNS_i_Trmnldia
(C 100, I 1, A6) plus BK_DIAG_VALUE
(C 100, I 1, A47)
15: Status (C 100, I 1 A 5) plus three bytes,
which are always zero plus analog and digital
input data
15 specific get/set BK_EM_ex UINT Defines the default timing associated with
pected_pac this Explicit Messaging Connection
ket_rate
16 specific get/set BK_EM_wa USINT Defines how to handle Inactivity/Watchdog
tchdog_tim Explicit Messaging Connection timeouts
eout_action
17 specific get/set BK_PIO_ex UINT Defines the default timing associated with
pected_pac this Poll I/O Connection Connection
ket_rate
18 specific get/set BK_PIO_w USINT Defines how to handle Inactivity/Watchdog
atch- Poll I/O Connection Connection timeouts
dog_timeou
t_action
19 specific get/set BK_BS_ex UINT Defines the default timing associated with
pected_pac this Bit–Strobe I/O Connection Connection
ket_rate
20 specific get/set BK_BS_wa USINT Defines how to handle Inactivity/Watchdog
tchdog_tim Bit–Strobe I/O Connection Connection time-
eout_action outs
21 specific get/set BK_COS_e UINT Defines the default timing associated with
xpected_pa this Change of State and Cyclic I/O Connec-
cket_rate tion
22 specific get/set BK_COS_ USINT Defines how to handle Inactivity/Watchdog
watch- Change of State and Cyclic I/O Connection
dog_timeou timeouts
t_action
23 specific get/set BK_BOI USINT Defines the default value for BOI(Obj0x3
Inst. 1 Att. 3. It handles the CAN Bus-Off
situation.
0: Hold the CAN chip in its bus-off (reset)
state upon detection of a bus-off indication
1: If possible, fully reset the CAN chip and
continue communicating upon detectionof a
bus-off indication
24 specific get/set BK_DO_FA USINT Defines the behavior after de allocation the
ULT_REAC polled I/O connection
TION_ON_ 0: (default) do nothing

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Configuration / Parametering with the Object Model

RELEASE_ 1: Process the coupler fault reaction

PIO
25 specific get/set BK_DO_FA USINT Defines the behavior after de allocation the
ULT_REAC Change of State and Cyclic I/O Connection
TION_ON_ 0: (default) do nothing
RELEASE_ 1: Process the coupler fault reaction
COS
26 specific get/set BK_DO_FA USINT Defines the behavior after de allocation the
ULT_REAC strobed Connection
TION_ON_ 0: (default) do nothing
RELEASE_ 1: Process the coupler fault reaction
ST

40 specific get/set BK_static_ UINT Defines how to calculate the values for the
ana- number of analog and digital input bits.
log_digital_i 0000: All bits are digital
nput_mappi 0016: One word is analog remaining bits are
ng digital
0032: Two words are analog remaining bits
are digital
...
0xFFFF: All bits are handled like module type
(default)

41 specific get/set BK_static_ UINT Defines how to calculate the values for the
ana- number of analog and digital input bits.
log_digital_ 0000: All bits are digital
out- 0016: One word is analog remaining bits are
put_mappin digital
g 0032: Two words are analog remaining bits
are digital
...
0xFFFF: All bits are handled like module type
(default)
(If the number of analog bits exceeds the size
of the process image all bits are mapped to
analog bits.
42 specific get/set BK_specific UINT Defines the couplers functionality.
_coupler_b 0xFFFF: All possible functions are enabled.
ehavior (resetting a bit to 0 disables the assigned
functionality).
It is only possible to reduce the functionality.
Resetting to „1“ is ignored.
43 specific get/set BK_revisio UINT Defines the couplers major and minor revision
n_setting attribute.
0xFFFF: The major and minor revison Attrib-
utes are set by the firmware.
(This is the default behavior).
0x??00: The minor revison is set to 0.
0x03??: The mjor revison is set to 3.
All other values are valid to.

45 specific get BK_LED_ER UINT Defines the Error Code, displayed by the
R_CODE blink code of the I/O LED.
46 specific get BK_LED_ER UINT Defines the Error Argument, displayed by the
R_ARG blink code of the I/O LED.
47 specific get BK_DIAG_V UINT Defines the Diagnostic information, supplied
ALUE by the IO Module. This attribute must be read
out before attribute 6 of this class. Only if
attribute 6 contains valid data, it contains also
valid data.
48 specific get/set BK_FIXED_P USIN Fixed width of the ProduceConnectionSize
ROD_SIZE T (input data) 0xFFFF(default): ProduceCon-
nectionSize corresponds to the data width of
the connected input modules 0 – 32 (
PI_LIMIT ): Fixed width of the ProduceCon-
nectionSize, independent of the input mod-
ules. PI_LIMIT – 0xFFFE: These values
These values cannot be set and led to fault
messages. The adjusted value become only on
valid with next switching.
49 specific get/set BK_FIXED_C USIN Fixed width of the ConsumedConnectionSize
ONS_SIZE T (output data)

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Configuration / Parametering with the Object Model

0xFFFF(default): ConsumedConnectionSize
corresponds to the data width of the con-
nected output modules 0 – 32 ( PI_LIMIT ):
Fixed width of the ConsumedConnectionSize,
independent of the output modules.
PI_LIMIT – 0xFFFE: These values These
values cannot be set and led to fault messages.
The adjusted value become only on valid with
next switching.
50 specific get/set reserved UINT 0xFFFF
51 specific get/set BK_FBC_CF UINT Defines configuration settings
G Bit 0: =1 switches off global the announce-
ment of active diagnostic messages via the
MS LED. The diagnostic messages are trans-
ferred however further over the fieldbus. A
change of this attitude becomes only active
after a PowerOn cycle.
Bit 1..15 reserved.

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read a DeviceNet Object attribute
value
0x10 Set_Attribute_Single Used to modify a DeviceNet object attribute
value

4.6.2.1.9 Discrete Input Point Object (0x65):

Instance 0:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 required get Revision UINT Revision of the Discrete Input 0x01
Point Object, Range 1-65535, class
definition upon which the imple-
mentation is based.
2 optional get Max UINT maximum number of instances of 0x00ff
instance an object currently created in this
class level of the device
Description of the instances:
Instance ID Description
1 Reference to the first digital input point
2 Reference to the next digital input point
...
255 Reference to the last possible digital input point
Instance 1 to 255:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 dep. on kind get DIPOBJ_ BIT digital input bit 0:off
of connected VALUE 1:on
modules

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read an object attribute value.

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 DeviceNet • 95
Configuration / Parametering with the Object Model

4.6.2.1.10 Discrete Output Point Object (0x66):

Instance 0:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 required get Revision UINT Revision of the Discrete Output 0x01
Point Object, Range 1-65535, class
definition upon which the imple-
mentation is based.
2 optional get Max UINT maximum instance number of an 0x00ff
instance object currently created in this
class level of device

Description of the instances:

Instance ID Description
1 Reference to the first digital output point
2 Reference to the next digital output point
...
255 Reference to the last possible digital output point

Instance 1 to 255:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 dep. on kind get/set DOPOBJ_ BIT digital output bit 0:off
of connected VALUE 1:on
modules

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read a DeviceNet Object attribute
value
0x10 Set_Attribute_Single Used to modify a DeviceNet object attribute
value

4.6.2.1.11 Analog Input Point Object (0x67):

Instance 0:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 required get Revision UINT Revision of the Analog Input Point 0x0001
Object, Range 1-65535, class
definition upon which the imple-
mentation is based.
2 optional get Max UINT maximum instance number of an 0x0010
instance object currently created in this
class level of device

Description of the instances:

Instance ID Description
1 reference to the first analog input point
2 reference to the next analog input point
...
16 reference to the last possible analog input point

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Configuration / Parametering with the Object Model

Instance 1 to 16:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 dep. on kind get AIPOBJ_ Array of Input data actual
of connected VALUE Byte input
modules Values
2 dep. on kind get AIPOBJ_ USINT Input data length Number
of connected VALUE of Bytes
modules

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read a DeviceNet Object attribute
value
0x10 Set_Attribute_Single Used to modify a DeviceNet object attribute
value

4.6.2.1.12 Analog Output Point Object (0x68):

Instance 0:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 required get Revision UINT Revision of the Analog Output 0x01
Point Object, Range 1-65535, class
definition upon which the imple-
mentation is based.
2 optional get Max UINT maximum instance number of an 0x0010
instance object currently created in this
class level of device

Description of the instances:

Instance ID Description
1 reference to the first analog output point
2 reference to the next analog output point
...
16 reference to the last possible analog output point

Instance 1 to 16:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 dep. on kind get AOPOBJ_ Array of output data actual
of connected VALUE Byte output
modules value
2 dep. on kind get AOPOBJ_ USINT output data length number
of connected VALUE of Bytes
modules

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read a DeviceNet Object attribute
value
0x10 Set_Attribute_Single Used to modify a DeviceNet object attribute
value

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 DeviceNet • 97
Configuration / Parametering with the Object Model

4.6.2.1.13 Module Configuration (0x80):

Instance 0:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 required get Revision UINT Revision of this Object. 1 (0x0001)
2 optional get Max UINT maximum number of instances -
instance

Description of the instances:

Instance ID Description
1 reference to the first analog module (coupler/controller)
2 reference to the next connected module (I/O module)
...
16 reference to the last possible connected module (I/O module)

Instance 1 to 65:
Attribute Used in Access Name Data type Description Value
ID buscoupler rule
1 dep. on kind get ModulDe- WORD Description of the connected actual
of connected scription modules output
modules (Instance 1 = Coupler/Controller, value
Instance 2 = Module 1,...)
Bit 0: Module with inputs,
Bit 1: Module with outputs,
Bit 8-14: Data width internal in
bits
Bit 15: 0/1 Analog/Digital module,
For analog modules the bits 1-14
describe the type of module i. e.
460 for the module 750-460

Services:
Service Code Service Name Description
0x0E Get_Attribute_Single Used to read a DeviceNet Object attribute
value

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DeviceNet
98 • I/O Modules

5 I/O Modules
5.1 Overview
All listed bus modules, in the overview below, are available for modular ap-
plications with the WAGO-I/O-SYSTEM 750.
For detailed information on the I/O modules and the module variations, please
refer to the manuals for the I/O modules.
You will find these manuals on CD ROM „ELECTRONICC Tools and Docs“
(Item-no.: 0888-0412) or on the web pages:
www.wago.com Æ Service Æ Download Æ Documentation.

More Information
Current information on the modular WAGO-I/O-SYSTEM is available in the
Internet under:
www.wago.com

5.1.1 Digital Input Modules

DI DC 5 V
750-414 4 Channel, DC 5 V, 0.2 ms, 2- to 3-conductor connection,
high-side switching
DI DC 5(12) V
753-434 8 Channel, DC 5(12) V, 0.2 ms, 1-conductor connection,
high-side switching
DI DC 24 V
750-400, 753-400 2 Channel, DC 24 V, 3.0 ms, 2- to 4-conductor connection;
high-side switching
750-401, 753-401 2 Channel, DC 24 V, 0.2 ms, 2- to 4-conductor connection;
high-side switching
750-410, 753-410 2 Channel, DC 24 V, 3.0 ms, 2- to 4-conductor connection;
high-side switching
750-411, 753-411 2 Channel, DC 24 V, 0.2 ms, 2- to 4-conductor connection;
high-side switching
750-418, 753-418 2 Channel, DC 24 V, 3.0 ms, 2- to 3-conductor connection;
high-side switching; diagnostic
750-419 2 Channel, DC 24 V, 3.0 ms, 2- to 3-conductor connection;
high-side switching; diagnostic
750-421, 753-421 2 Channel, DC 24 V, 3.0 ms, 2- to 3-conductor connection;
high-side switching; diagnostic
750-402, 753-402 4 Channel, DC 24 V, 3.0 ms, 2- to 3-conductor connection;
high-side switching
750-432, 753-432 4 Channel, DC 24 V, 3.0 ms, 2-conductor connection;
high-side switching
750-403, 753-403 4 Channel, DC 24 V, 0.2 ms, 2- to 3-conductor connection;
high-side switching

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 I/O Modules • 99

750-433, 753-433 4 Channel, DC 24 V, 0.2 ms, 2-conductor connection;

high-side switching
750-422, 753-422 4 Channel, DC 24 V, 2- to 3-conductor connection;
high-side switching; 10 ms pulse extension
750-408, 753-408 4 Channel, DC 24 V, 3.0 ms, 2- to 3-conductor connection;
low-side switching
750-409, 753-409 4 Channel, DC 24 V, 0.2 ms, 2- to 3-conductor connection;
low-side switching
750-430, 753-430 8 Channel, DC 24 V, 3.0 ms, 1-conductor connection;
high-side switching
750-431, 753-431 8 Channel, DC 24 V, 0.2 ms, 1-conductor connection;
high-side switching
750-436 8 Channel, DC 24 V, 3.0 ms, 1-conductor connection;
lowside switching
750-437 8 Channel, DC 24 V, 0.2 ms, 1-conductor connection;
low-side switching
DI AC/DC 24 V
750-415, 753-415 4 Channel, AC/DC 24 V, 2-conductor connection
750-423, 753-423 4 Channel, AC/DC 24 V, 2- to 3-conductor connection;
with power jumper contacts
DI AC/DC 42 V
750-428, 753-428 4 Channel, AC/DC 42 V, 2-conductor connection
DI DC 48 V
750-412, 753-412 2 Channel, DC 48 V, 3.0ms, 2- to 4-conductor connection;
high-side switching
DI DC 110 V
750-427, 753-427 2 Channel, DC 110 V, Configurable high-side or low-side switching
DI AC 120 V
750-406, 753-406 2 Channel, AC 120 V, 2- to 4-conductor connection;
high-side switching
DI AC 120(230) V
753-440 4 Channel, AC 120(230) V, 2-conductor connection;
high-side switching
DI AC 230 V
750-405, 753-405 2 Channel, AC 230 V, 2- to 4-conductor connection;
high-side switching
DI NAMUR
750-435 1 Channel, NAMUR EEx i, Proximity switch acc. to DIN EN 50227
750-425, 753-425 2 Channel, NAMUR, Proximity switch acc. to DIN EN 50227
750-438 2 Channel, NAMUR EEx i, Proximity switch acc. to DIN EN 50227
DI Intruder Detection
750-424, 753-424 2 Channel, DC 24 V, Intruder Detection

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100 • I/O Modules

5.1.2 Digital Output Modules

DO DC 5 V
750-519 4 Channel, DC 5 V, 20mA, short-circuit-protected; high-side switching
DO DC 12(14) V
753-534 8 Channel, DC 12(14) V, 1A, short-circuit-protected; high-side switching
DO DC 24 V
750-501, 753-501 2 Channel, DC 24 V, 0.5 A, short-circuit-protected; high-side switching
750-502, 753-502 2 Channel, DC 24 V, 2.0 A, short-circuit-protected; high-side switching
750-506, 753-506 2 Channel, DC 24 V, 0.5 A, short-circuit-protected;
high-side switching; with diagnostics
750-507, 753-507 2 Channel, DC 24 V, 2.0 A, short-circuit-protected;
high-side switching; with diagnostics; No longer available, replaced by
750-508
750-508 2 Channel, DC 24 V, 2.0 A, short-circuit-protected;
high-side switching; with diagnostics; Replacement for 750-508
750-535 2 Channel, DC 24 V, EEx i, short-circuit-protected;
PNP-positive switching
750-504, 753-504 4 Channel, DC 24 V, 0.5 A, short-circuit-protected; high-side switching
750-531, 753-531 4 Channel, DC 24 V, 0.5 A, short-circuit-protected; high-side switching
750-516, 753-516 4 Channel, DC 24 V, 0.5 A, short-circuit-protected; low-side switching
750-530, 753-530 8 Channel, DC 24 V, 0.5 A, short-circuit-protected; high-side switching
750-537 8 Channel, DC 24 V, 0.5 A, short-circuit-protected; high-side switching;
with diagnostics
750-536 8 Channel, DC 24 V, 0.5 A, short-circuit-protected; low-side switching
DO AC 120(230) V
753-540 4 Channel, AC 120(230) V, 0.25 A, short-circuit-protected;
high-side switching
DO AC/DC 230 V
750-509, 753-509 2 Channel Solid State Relay, AC/DC 230 V, 300 mA
750-522 2 Channel Solid State Relay, AC/DC 230 V, 500 mA, 3 A (< 30 s)
DO Relay
750-523 1 Channel, AC 230 V, AC 16 A, isolated output, 1 make contact, bista-
ble, manual operation
750-514, 753-514 2 Channel, AC 125 V , AC 0.5 A , DC 30 V, DC 1 A,
isolated outputs, 2 changeover contacts
750-517, 753-517 2 Channel, AC 230 V, 1 A, isolated outputs, 2 changeover contacts
750-512, 753-512 2 Channel, AC 230 V, DC 30 V, AC/DC 2 A, non-floating, 2 make con-
tacts
750-513, 753-513 2 Channel, AC 230 V, DC 30 V, AC/DC 2 A, isolated outputs, 2 make
contacts

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 I/O Modules • 101

5.1.3 Analog Intput Modules

AI 0 - 20 mA
750-452, 753-452 2 Channel, 0 - 20 mA, Differential Inputs
750-465, 753-465 2 Channel, 0 - 20 mA, single-ended (S.E.)
750-472, 753-472 2-channel, 0 - 20 mA, 16 Bit, single-ended (S.E.)
750-480 2-channel, 0 - 20 mA ,Differential Inputs
750-453, 753-453 4 Channel, 0 - 20 mA, single-ended (S.E.)
AI 4 - 20 mA
750-454, 753-454 2 Channel, 4 - 20 mA,Differential Inputs
750-474, 753-474 2 Channel, 4 - 20 mA, 16 Bit, single-ended (S.E.)
750-466, 753-466 2 Channel, 4 - 20 mA, single ended (S.E.)
750-485 2 Channel, 4 - 20 mA, EEx i, single ended (S.E.)
750-492, 753-492 2 Channel, 4 - 20 mA, Isolated Differential Inputs
750-455, 753-455 4 Channel, 4 - 20 mA, single ended (S.E.)
AI 0 - 1 A
750-475, 753-475 2-channel, 0 - 1 A AC/DC ,Differential Inputs
AI 0 - 5 A
750-475/020-000, 2-channel, 0 - 5 A AC/DC ,Differential Inputs
753-475/020-000
AI 0 - 10 V
750-467, 753-467 2 Channel, DC 0 - 10 V, single-ended (S.E.)
750-477, 753-477 2 Channel, AC/DC 0 - 10 V,Differential Inputs
750-478, 753-478 2 Channel, DC 0 - 10 V, single-ended (S.E.)
750-459, 753-459 4 Channel, DC 0 - 10 V, single-ended (S.E.)
750-468 4 Channel, DC 0 - 10 V, single-ended (S.E.)
AI DC ± 10 V
750-456, 753-456 2 Channel, DC ± 10 V,Differential Inputs
750-479, 753-479 2 Channel, DC ± 10 V,Differential Measurement Input
750-476, 753-476 2 Channel, DC ± 10 V, single-ended (S.E.)
750-457, 753-457 4 Channel, DC ± 10 V, single-ended (S.E.)
AI DC 0 - 30 V
750-483, 753-483 2 Channel, DC 0 -30 V,Differential Measurement Input
AI Resistance Sensors
750-461, 753-461 2 Channel, Resistance Sensors, PT100 / RTD
750-481/003-000 2 Channel, Resistance Sensors, PT100 / RTD, EEx i
750-460 4 Channel, Resistance Sensors, PT100 / RTD
AI Thermocouples
750-462 2 Channel, thermocouples with diagnostics
Sensor types: J, K, B, E, N, R, S, T, U
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102 • I/O Modules

750-469, 753-469 2 Channel, thermocouples with diagnostics

Sensor types: J, K, B, E, N, R, S, T, U, L
AI Others
750-491 1 Channel for Resistor Bridges (Strain Gauge)

5.1.4 Analog Output Modules

AO 0 - 20 mA
750-552, 753-552 2 Channel, 0 - 20 mA
750-585 2 Channel, 0 - 20 mA, EEx i
750-553, 753-553 4 Channel, 0 - 20 mA
AO 4 - 20 mA
750-554, 753-554 2-channel, 4 - 20 mA
750-554, 753-554 4-channel, 4 - 20 mA
AO DC 0 - 10 V
750-550, 753-550 2 Channel, DC 0 - 10 V
750-560 2 Channel, DC 0 - 10 V, 10 Bit, 100 mW, 24 V
750-559, 753-559 4 Channel, DC 0 - 10 V
AO DC ± 10 V
750-556, 753-556 2 Channel, DC ± 10 V
750-557, 753-557 4 Channel, DC ± 10 V

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 I/O Modules • 103

5.1.5 Special Modules

Counter Modules
750-404, 753-404 Up / Down Counter, DC 24 V, 100 kHz
750-638, 753-638 2 Channel, Up / Down Counter, DC 24 V/ 16Bit / 500 Hz
Frequency Measuring
750-404/000-003, Frequency Measuring
753-404/000-003
Pulse Width Module
750-511 2-channel Pulse Width Module, DC 24 V,
short-circuit-protected, high-side switching
Distance and Angle Measurement Modules
750-630 SSI Transmitter Interface
750-631 Incremental Encor Interface, TTL level squarewave
750-634 Incremental Encor Interface, DC 24 V
750-637 Incremental Encor Interface RS 422, cam outputs
750-635, 753-635 Digital Pulse Interface
Serial Interfaces
750-650, 753 Serial Interface RS 232 C
750-653, 753 Serial Interface RS 485
750-651 TTY-Serial Interface, 20 mA Current Loop
750-654 Data Exchange Module
DALI / DSI Master Module
750-641 DALI / DSI Master Module
AS interface Master Module
750-655 AS interface Master Module
Radio Receiver Module
750-642 Radio Receiver EnOcean
MP Bus Master Module
750-643 MP Bus (Multi Point Bus) Master Module
Vibration Monitoring
750-645 2-Channel Vibration Velocity / Bearing Condition Monitoring VIB I/O
PROFIsafe Modules
750-660/000-001 8FDI 24V DC PROFIsafe
750-665/000-001 4FDO 0.5A / 4FDI 24V DC PROFIsafe
750-666/000-001 1FDO 10A / 2FDO 0.5A / 2FDI 24V PROFIsafe
RTC Module
750-640 RTC Module

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104 • I/O Modules

5.1.6 System Modules

Module Bus Extension
750-627 Module Bus Extension, End Module
750-628 Module Bus Extension, Coupler Module
DC 24 V Power Supply Modules
750-602 DC 24 V, passiv
750-601 DC 24 V, max. 6.3 A,without diagnostics, with fuse-holder
750-610 DC 24 V, max. 6.3 A, with diagnostics, with fuse-holder
750-625 DC 24 V, EEx i, with fuse-holder
DC 24 V Power Supply Modules with bus power supply
750-613 Bus power supply, 24 V DC
AC 120 V Power Supply Modules
750-615 AC 120 V, max. 6.3 A without diagnostics, with fuse-holder
AC 230 V Power Supply Modules
750-612 AC/DC 230 V without diagnostics, passiv
750-609 AC 230 V, max. 6.3 A without diagnostics, with fuse-holder
750-611 AC 230 V, max. 6.3 A with diagnostics, with fuse-holder
Filter Modules
750-624 Filter Module for field side power supply
750-626 Filter Module for system and field side power supply
Field Side Connection Module
750-603, 753-603 Field Side Connection Module, DC 24 V
750-604, 753-604 Field Side Connection Module, DC 0 V
750-614, 753-614 Field Side Connection Module, AC/DC 0 ... 230 V
Separation Modules
750-616 Separation Module
750-621 Separation Module with Power Contacts
Binary Spacer Module
750-622 Binary Spacer Module
End Module
750-600 End Module, to loop the internal bus

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 I/O Modules • 105

5.2 Process Data Architecture for DeviceNet

With some I/O modules, the structure of the process data is fieldbus specific.

In the case of a DeviceNet coupler/controller, the process image uses a byte

structure (without word alignment). The internal mapping method for data
greater than one byte conforms to the Intel format.

The following section describes the process image for various

WAGO-I/O-SYSTEM 750 and 753 I/O modules when using a DeviceNet cou-
pler/controller.

Note
Depending on the specific position of an I/O module in the fieldbus node,
the process data of all previous byte or bit-oriented modules must be
taken into account to determine its location in the process data map.
For the PFC process image of the programmable fieldbus controller is the
structure of the process data mapping identical.

5.2.1 Digital Input Modules

Digital input modules supply one bit of data per channel to specify the signal
state for the corresponding channel. These bits are mapped into the Input
Process Image.

When analog input modules are also present in the node, the digital data is al-
ways appended after the analog data in the Input Process Image, grouped into
bytes.

Some digital modules have an additional diagnostic bit per channel in the In-
put Process Image. The diagnostic bit is used for detecting faults that occur
(e.g., wire breaks and/or short circuits).

Each input channel seizes one Instance in the Discrete Input Point Object
(Class 0x65).

1 Channel Digital Input Module with Diagnostics

750-435

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Diagnostic bit Data bit
S1 DI 1
The input modules seize 2 Instances in Class (0x65).

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106 • I/O Modules

2 Channel Digital Input Modules

750-400, -401, -405, -406, -410, -411, -412, -427, -438, (and all variations),
753-400, -401, -405, -406, -410, -411, -412, -427

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Data bit Data bit
DI 2 DI 1
Channel Channel
2 1
The input modules seize 2 Instances in Class (0x65).

2 Channel Digital Input Modules with Diagnostics

750-419, -421, -424, -425, 753-421, -424, -425

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Diagnostic Diagnostic Data bit Data bit
bit S 2 bit S 1 DI 2 DI 1
Channel 2 Channel 1 Channel Channel
2 1
The input modules seize 4 Instances in Class (0x65).

2 Channel Digital Input Module with Diagnostics and Output Process

Data

750-418, 753-418

The 750-418, 753-418 digital input module supplies a diagnostic and ac-
knowledge bit for each input channel. If a fault condition occurs, the diagnos-
tic bit is set. After the fault condition is cleared, an acknowledge bit must be
set to re-activate the input. The diagnostic data and input data bit is mapped in
the Input Process Image, while the acknowledge bit is in the Output Process
Image.

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Diagnostic Diagnostic Data bit Data bit
bit S 2 bit S 1 DI 2 DI 1
Channel 2 Channel 1 Channel Channel
2 1
The input modules seize 4 Instances in Class (0x65).

Output Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Acknowl- Acknowl-
edgement bit edgement bit
0 0
Q2 Q1
Channel 2 Channel 1
And the input modules seize 4 Instances in Class (0x66).

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 I/O Modules • 107

4 Channel Digital Input Modules

750-402, -403, -408, -409, -414, -415, -422, -423, -428, -432, -433,
753-402, -403, -408, -409, -415, -422, -423, -428, -432, -433, -440

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Data bit Data bit Data bit Data bit
DI 4 DI 3 DI 2 DI 1
Channel Channel Channel Channel
4 3 2 1
The input modules seize 4 Instances in Class (0x65).

8 Channel Digital Input Modules

750-430, -431, -436, -437, 753-430, -431, -434

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Data bit Data bit Data bit Data bit Data bit Data bit Data bit Data bit
DI 8 DI 7 DI 6 DI 5 DI 4 DI 3 DI 2 DI 1
Channel Channel Channel Channel Channel Channel Channel Channel
8 7 6 5 4 3 2 1
The input modules seize 8 Instances in Class (0x65).

5.2.2 Digital Output Modules

Digital output modules use one bit of data per channel to control the output of
the corresponding channel. These bits are mapped into the Output Process Im-
age.

When analog output modules are also present in the node, the digital image
data is always appended after the analog data in the Output Process Image,
grouped into bytes.

Each output channel seizes one Instance in the Discrete Output Point Object
(Class 0x66).

1 Channel Digital Output Module with Input Process Data

750-523

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Status bit
not
„Manual
used
Operation“
The output modules seize 2 Instances in Class (0x65).

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108 • I/O Modules

Output Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
controls
not
DO 1
used
Channel 1
And the output modules seize 2 Instances in Class (0x66).

2 Channel Digital Output Modules

750-501, -502, -509, -512, -513, -514, -517, -535, (and all variations),
753-501, -502, -509, -512, -513, -514, -517
Output Process Image
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
controls controls
DO 2 DO 1
Channel Channel
2 1
The output modules seize 2 Instances in Class (0x66).

2 Channel Digital Input Modules with Diagnostics and Input Process

Data

750-507 (-508), -522, 753-507

The 750-507 (-508), -522 and 753-507 digital output modules have a diagnos-
tic bit for each output channel. When an output fault condition occurs (i.e.,
overload, short circuit, or broken wire), a diagnostic bit is set. The diagnostic
data is mapped into the Input Process Image, while the output control bits are
in the Output Process Image.

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Diagnostic Diagnostic
bit S 2 bit S 1
Channel 2 Channel 1
The output modules seize 2 Instances in Class (0x65).

Output Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
controls controls
DO 2 DO 1
Channel 2 Channel 1
And the output modules seize 2 Instances in Class (0x66).

WAGO-I/O-SYSTEM 750
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 I/O Modules • 109

750-506, 753-506

The 750-506, 753-506 digital output module has 2-bits of diagnostic informa-
tion for each output channel. The 2-bit diagnostic information can then be de-
coded to determine the exact fault condition of the module (i.e., overload, a
short circuit, or a broken wire). The 4-bits of diagnostic data are mapped into
the Input Process Image, while the output control bits are in the Output Proc-
ess Image.

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Diagnostic Diagnostic Diagnostic Diagnostic
bit S 3 bit S 2 bit S 1 bit S 0
Channel 2 Channel 2 Channel 1 Channel 1
The output modules seize 4 Instances in Class (0x65).

Output Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
controls controls
not used not used DO 2 DO 1
Channel 2 Channel 1
And the output modules seize 4 Instances in Class (0x66).

4 Channel Digital Output Modules

750-504, -516, -519, -531, 753-504, -516, -531, -540

Output Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
controls controls controls controls
DO 4 DO 3 DO 2 DO 1
Channel Channel Channel Channel
4 3 2 1
The output modules seize 4 Instances in Class (0x66).

4 Channel Digital Output Modules with Diagnostics and Input Process

Data

750-532

The 750-532 digital output modules have a diagnostic bit for each output
channel. When an output fault condition occurs (i.e., overload, short circuit, or
broken wire), a diagnostic bit is set. The diagnostic data is mapped into the
Input Process Image, while the output control bits are in the Output Process
Image.

WAGO-I/O-SYSTEM 750
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110 • I/O Modules

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Diagnos- Diagnos- Diagnos-
Diagnos-
tic bit S tic bit S tic bit S
tic bit S 0
3 2 1
Channel
Channel Channel Channel
1
4 3 2
Diagnostic bit S = '0' no Error
Diagnostic bit S = '1' overload, short circuit, or broken wire
The output modules seize 4 Instances in Class (0x65).

Output Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
controls controls controls controls
DO 4 DO 3 DO 2 DO 1
Channel Channel Channel Channel
4 3 2 1
And the output modules seize 4 Instances in Class (0x66).

8 Channel Digital Output Module

750-530, -536, 753-530, -434

Output Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
controls controls controls controls controls controls controls controls
DO 8 DO 7 DO 6 DO 5 DO 4 DO 3 DO 2 DO 1
Channel Channel Channel Channel Channel Channel Channel Channel
8 7 6 5 4 3 2 1
The output modules seize 8 Instances in Class (0x66).

8 Channel Digital Output Modules with Diagnostics and Input Process

Data

750-537

The 750-537 digital output modules have a diagnostic bit for each output
channel. When an output fault condition occurs (i.e., overload, short circuit, or
broken wire), a diagnostic bit is set. The diagnostic data is mapped into the
Input Process Image, while the output control bits are in the Output Process
Image.

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Diagnos- Diagnos- Diagnos- Diagnos- Diagnos- Diagnos-
Diagnos- Diagnos-
tic bit S tic bit S tic bit S tic bit S tic bit S tic bit S
tic bit S 7 tic bit S 0
6 5 4 3 2 1
Channel Channel
Channel Channel Channel Channel Channel Channel
8 1
7 6 5 4 3 2
Diagnostic bit S = ‘0’ no Error
Diagnostic bit S = ‘1’ overload, short circuit, or broken wire

WAGO-I/O-SYSTEM 750
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 I/O Modules • 111

The output modules seize 8 Instances in Class (0x65).

Output Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
controls controls controls controls controls controls controls controls
DO 8 DO 7 DO 6 DO 5 DO 4 DO 3 DO 2 DO 1
Channel Channel Channel Channel Channel Channel Channel Channel
8 7 6 5 4 3 2 1
And the output modules seize 8 Instances in Class (0x66).

5.2.3 Analog Input Modules

The hardware of an analog input module has 16 bits of measured analog data
per channel and 8 bits of control/status. However, the DeviceNet cou-
pler/controller does not have access to the 8 control/status bits. Therefore, the
DeviceNet coupler/controller can only access the 16 bits of analog input data
per channel mapped in Intel format in the Input Process Image.
When digital input modules are also present in the node, the analog input data
is always mapped into the Input Process Image in front of the digital data.
Each input channel seizes one Instance in the Analog Input Point Object
(Class 0x67).

1 Channel Analog Input Module

750-491, (and all variations)

Input Process Image

Instance Byte Destination Remark
D0
n Measured Value UD
D1
D2
n+1 Measured Value Uref
D3
The input modules represent 2x2 bytes and seize 2 Instances in Class (0x67).

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112 • I/O Modules

2 Channel Analog Input Modules

750-452, -454, -456, -461, -462, -465, -466, -467, -469, -472, -474, -475, -476,
-477, -478, -479, -480, -481, -483, -485, -492, (and all variations),
753-452, -454, -456, -461, -465, -466, -467, -469, -472, -474, -475, -476, -477,
-478, -479, -483, -492, (and all variations)
Input Process Image
Instance Byte Destination Remark
D0
n Measured Value Channel 1
D1
D2
n+1 Measured Value Channel 2
D3
The input modules represent 2x2 bytes and seize 2 Instances in Class (0x67).

4 Channel Analog Input Modules

750-453, -455, -457, -459, -460, -468, (and all variations),

753-453, -455, -457, -459
Input Process Image
Instance Byte Destination Remark
D0
n Measured Value Channel 1
D1
D2
n+1 Measured Value Channel 2
D3
D4
n+2 Measured Value Channel 3
D5
D6
n+3 Measured Value Channel 4
D7
The input modules represent 4x2 bytes and seize 4 Instances in Class (0x67).

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 I/O Modules • 113

5.2.4 Analog Output Modules

The hardware of an analog output module has 16 bits of measured analog data
per channel and 8 bits of control/status. However, the DeviceNet cou-
pler/controller does not have access to the 8 control/status bits. Therefore, the
DeviceNet coupler/controller can only access the 16 bits of analog output data
per channel mapped in Intel format in the Output Process Image.

When digital output modules are also present in the node, the analog output
data is always mapped into the Output Process Image in front of the digital
data.

Each output channel seizes one Instance in the Analog Output Point Object
(Class 0x68).

2 Channel Analog Output Modules

750-550, -552, -554, -556, -560, -585, (and all variations),

753-550, -552, -554, -556

Output Process Image

Instance Byte Destination Remark
D0
n Output Value Channel 1
D1
D2
n+1 Output Value Channel 2
D3
The output modules represent 2x2 bytes and seize 2 Instances in Class (0x68).

4 Channel Analog Output Modules

750-553, -555, -557, -559, 753-553, -555, -557, -559

Output Process Image

Instance Byte Destination Remark
D0
n Output Value Channel 1
D1
D2
n+1 Output Value Channel 2
D3
D4
n+2 Output Value Channel 3
D5
D6
n+3 Output Value Channel 4
D7
The output modules represent 4x2 bytes and seize 4 Instances in Class (0x68).

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114 • I/O Modules

5.2.5 Specialty Modules

WAGO has a host of Specialty I/O modules that perform various functions.
With individual modules beside the data bytes also the control/status byte is
mapped in the process image. The control/status byte is required for the bi-
directional data exchange of the module with the higher-ranking control sys-
tem. The control byte is transmitted from the control system to the module and
the status byte from the module to the control system.

This allows, for example, setting of a counter with the control byte or display-
ing of overshooting or undershooting of the range with the status byte.

Further information
For detailed information about the structure of a particular module’s con-
trol/status byte, please refer to that module’s manual. Manuals for each
module can be found on the Internet under:
http://www.wago.com.

The Specialty Modules represent as analog modules.

For this, the process input data of the Specialty Modules seize one Instance per
channel in the Analog Input Point Object (Class 0x67) and the process output
data seize one Instance seize one Instance in the Analog Input Point Object
(Class 0x67) per channel in the Analog Output Point Object (Class 0x68).

Counter Modules

750-404, (and all variations except of /000-005),

753-404, (and variation /000-003)

The above Counter Modules have a total of 5 bytes of user data in both the In-
put and Output Process Image (4 bytes of counter data and 1 byte of con-
trol/status). The counter value is supplied as 32 bits. The following tables il-
lustrate the Input and Output Process Image, which has a total of 6 bytes
mapped into each image.

Input Process Image

Instance Byte Destination Remark
S Status byte
- not used
D0
n
D1
Counter Value
D2
D3
The specialty modules represent 1x6 bytes input data and seize 1 Instance in
Class (0x67).

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 I/O Modules • 115

Output Process Image

Instance Byte Destination Remark
C Control byte
- not used
D0
n
D1
Counter Setting Value
D2
D3
And the specialty modules represent 1x6 bytes output data and seize 1 In-
stance in Class (0x68).

750-404/000-005

The above Counter Modules have a total of 5 bytes of user data in both the In-
put and Output Process Image (4 bytes of counter data and 1 byte of con-
trol/status). The two counter values are supplied as 16 bits. The following ta-
bles illustrate the Input and Output Process Image, which has a total of 6 bytes
mapped into each image.

Input Process Image

Instance Byte Destination Remark
S Status byte
- not used
D0
n Counter Value of Counter 1
D1
D2
Counter Value of Counter 2
D3
The specialty modules represent 1x6 bytes input data and seize 1 Instance in
Class (0x67).

Output Process Image

Instance Byte Destination Remark
C Control byte
- not used
D0
n Counter Setting Value of Counter 1
D1
D2
Counter Setting Value of Counter 2
D3
And the specialty modules represent 1x6 bytes output data and seize 1 In-
stance in Class (0x68).

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116 • I/O Modules

750-638, 753-638

The above Counter Modules have a total of 6 bytes of user data in both the In-
put and Output Process Image (4 bytes of counter data and 2 bytes of con-
trol/status). The two counter values are supplied as 16 bits. The following ta-
bles illustrate the Input and Output Process Image, which has a total of 6 bytes
mapped into each image.

Input Process Image

Instance Byte Destination Remark
S0 Status byte of Counter 1
n D0
Counter Value of Counter 1
D1
S1 Status byte of Counter 2
n+1 D2
Counter Value of Counter 2
D3
The specialty modules represent 2x3 bytes input data and seize 2 Instances in
Class (0x67).

Output Process Image

Instance Byte Destination Remark
C0 Control byte of Counter 1
n D0
Counter Setting Value of Counter 1
D1
S1 Control byte of Counter 2
n+1 D2
Counter Setting Value of Counter 2
D3
And the specialty modules represent 2x3 bytes output data and seize 2 In-
stances in Class (0x68).

Pulse Width Modules

750-511, (and all variations)

The above Pulse Width modules have a total of 6 bytes of user data in both the
Input and Output Process Image (4 bytes of channel data and 2 bytes of con-
trol/status). The two channel values are supplied as 16 bits. Each channel has
its own control/status byte. The following table illustrates the Input and Output
Process Image, which has a total of 6 bytes mapped into each image.

WAGO-I/O-SYSTEM 750
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 I/O Modules • 117

Input and Output Process Image

Instance Byte Destination Remark
C0/S0 Control/Status byte of Channel 1
n D0
Data Value of Channel 1
D1
C1/S1 Control/Status byte of Channel 2
n+1 D2
Data Value of Channel 2
D3
The specialty modules represent 2x3 bytes input and output data and seize 2
Instances in Class (0x67) and 2 Instances in Class (0x68).

Serial Interface Modules with alternative Data Format

750-650, (and the variations /000-002, -004, -006, -009, -010, -011, -012,
-013)
750-651, (and the variations /000-002, -003)
750-653, (and the variations /000-002, -007)

Note:
With the freely parametrizable variations /003 000 of the serial interface
modules, the desired operation mode can be set. Dependent on it, the
process image of these modules is then the same, as from the appropriate
variation.

The above Serial Interface Modules with alternative data format have a total of
4 bytes of user data in both the Input and Output Process Image (3 bytes of se-
rial data and 1 byte of control/status). The following table illustrates the Input
and Output Process Image, which have a total of 4 bytes mapped into each im-
age.

Input and Output Process Image

Instance Byte Destination Remark
C/S Control/Status byte
n
D0
D1 Data bytes
n+1
D2
The specialty modules represent 2x2 bytes input and output data and seize 2
Instances in Class (0x67) and 2 Instances in Class (0x68).

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118 • I/O Modules

Serial Interface Modules with Standard Data Format

750-650/000-001, -014, -015, -016
750-651/000-001
750-653/000-001, -006

The above Serial Interface Modules with Standard Data Format have a total of
6 bytes of user data in both the Input and Output Process Image (5 bytes of se-
rial data and 1 byte of control/status). The following table illustrates the Input
and Output Process Image, which have a total of 6 bytes mapped into each im-
age.

Input and Output Process Image

Instance Byte Destination Remark
C/S Control/Status byte
D0
D1
n
D2 Data bytes
D3
D4
The specialty modules represent 1x6 bytes input and output data and seize 1
Instance in Class (0x67) and 1 Instance in Class (0x68).

Data Exchange Module

750-654, (and the variation /000-001)

The Data Exchange modules have a total of 4 bytes of user data in both the In-
put and Output Process Image. The following tables illustrate the Input and
Output Process Image, which has a total of 4 bytes mapped into each image.

Input and Output Process Image

Instance Byte Destination Remark
D0
n
D1
Data bytes
D2
n+1
D3
The specialty modules represent 2x2 bytes input and output data and seize 2
Instances in Class (0x67) and 2 Instances in Class (0x68).

SSI Transmitter Interface Modules

750-630 (and the variations /000-001, -002, -006, -008, -009, -011, -012,
-013)

The above SSI Transmitter Interface modules have a total of 4 bytes of user
data in the Input Process Image, which has 4 bytes mapped into the image.

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 I/O Modules • 119

Input Process Image

Instance Byte Destination Remark
D0
n
D1
Data bytes
D2
n+1
D3
The specialty modules represent 2x2 bytes input data and seize 2 Instances in
Class (0x67).

750-630/000-004, -005, -007

The above SSI Transmitter Interface modules with status have a total of 5
bytes of user data in the Input Process Image, which has 6 bytes mapped into
the image.

Input Process Image

Instance Byte Destination Remark
S Status byte
- not used
D0
n
D1
Data bytes
D2
D3
The specialty modules represent 1x6 bytes input data and seize 1 Instance in
Class (0x67).

Incremental Encoder Interface Modules

750-631

The above Incremental Encoder Interface modules have 5 bytes of input data
and 3 bytes of output data. The following tables illustrate the Input and Output
Process Image, which have 6 bytes into each image.
Input Process Image
Instance Byte Destination Remark
S Status byte
D0
Counter word
D1
n
- not used
D2
Latch word
D3
The specialty modules represent 1x6 bytes input data and seize 1 Instance in
Class (0x67).

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120 • I/O Modules

Output Process Image

Instance Byte Destination Remark
C Control byte
D0
Counter Setting word
D1
n
-
- not used
-
And the specialty modules represent 1x6 bytes output data and seize 1 In-
stance in Class (0x68).

750-634

The above Incremental Encoder Interface module has 5 bytes of input data (6
bytes in cycle duration measurement mode) and 3 bytes of output data. The
following tables illustrate the Input and Output Process Image, which has 6
bytes mapped into each image.
Input Process Image
Instance Byte Destination Remark
S Status byte
D0
Counter word
D1
n
(D2)*) (Periodic time)
D3
Latch word
D4
*) If cycle duration measurement mode is enabled in the control byte, the cycle
duration is given as a 24-bit value that is stored in D2 together with D3/D4.
The specialty modules represent 1x6 bytes input data and seize 1 Instance in
Class (0x67).

Output Process Image

Instance Byte Destination Remark
C Control byte
D0
Counter Setting word
D1
n
-
- not used
-
And the specialty modules represent 1x6 bytes output data and seize 1 In-
stance in Class (0x68).

WAGO-I/O-SYSTEM 750
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 I/O Modules • 121

750-637

The above Incremental Encoder Interface Module has a total of 6 bytes of user
data in both the Input and Output Process Image (4 bytes of encoder data and
2 bytes of control/status). The following table illustrates the Input and Output
Process Image, which have 6 bytes mapped into each image.
Input and Output Process Image
Instance Byte Destination Remark
C0/S0 Control/Status byte of Channel 1
n D0
Data Value of Channel 1
D1
C1/S1 Control/Status byte of Channel 2
n+1 D2
Data Value of Channel 2
D3
The specialty modules represent 2x3 bytes input and output data and seize 2
Instances in Class (0x67) and 2 Instances in Class (0x68).

750-635, 753-635

The above Digital Pulse Interface module has a total of 4 bytes of user data in
both the Input and Output Process Image (3 bytes of module data and 1 byte of
control/status). The following table illustrates the Input and Output Process
Image, which have 4 bytes mapped into each image.
Input and Output Process Image
Instance Byte Destination Remark
C0/S0 Control/Status byte
D0
n
D1 Data bytes
D2
The specialty modules represent 1x4 bytes input and output data and seize 1
Instance in Class (0x67) and 1 Instance in Class (0x68).

RTC Module

750-640

The above RTC module has a total of 6 bytes of user data in both the Input
and Output Process Image (4 bytes of module data and 1 byte of control/status
and 1 byte ID for command). The following table illustrates the Input and
Output Process Image, which have 6 bytes mapped into each image.

WAGO-I/O-SYSTEM 750
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122 • I/O Modules

Input and Output Process Image

Instance Byte Destination Remark
C/S Control/Status byte
ID Command byte
D0
n
D1
Data bytes
D2
D3
The specialty modules represent 1x6 bytes input data and seize 1 Instance in
Class (0x67).and seize 1 Instance in Class (0x68).

DALI/DSI Master Module

750-641

The DALI/DSI Master module has a total of 6 bytes of user data in both the
Input and Output Process Image (5 bytes of module data and 1 byte of con-
trol/status). The following tables illustrate the Input and Output Process Im-
age, which have 6 bytes mapped into each image.

Input Process Image

Instance Byte Destination Remark
S Status byte
D0 DALI response
D1 DALI address
n
D2 Message 3
D3 Message 2
D4 Message 1
The specialty modules represent 1x6 bytes input data and seize 1 Instance in
Class (0x67).

Output Process Image

Instance Byte Destination Remark
C Control byte
D0 DALI command, DSI dimming value
D1 DALI address
n
D2 Parameter 2
D3 Parameter 1
D4 Command-Extension
And the specialty modules represent 1x6 bytes output data and seize 1
Instance in Class (0x68).

WAGO-I/O-SYSTEM 750
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 I/O Modules • 123

EnOcean Radio Receiver

750-642

The EnOcean radio receiver has a total of 4 bytes of user data in both the Input
and Output Process Image (3 bytes of module data and 1 byte of con-
trol/status). The following tables illustrate the Input and Output Process Im-
age, which have 4 bytes mapped into each image.

Input Process Image

Instance Byte Destination Remark
S Status byte
n
D0
D1 Data bytes
n+1
D2

Output Process Image

Instance Byte Destination Remark
C Control byte
n
-
- Not used
n+1
-
The specialty modules represent 2x2 bytes input and output data and seize 2
Instances in Class (0x67) and 2 Instances in Class (0x68).

MP Bus Master Module

750-643

The MP Bus Master Module has a total of 8 bytes of user data in both the In-
put and Output Process Image (6 bytes of module data and 2 bytes of con-
trol/status). The following table illustrates the Input and Output Process Im-
age, which have 8 bytes mapped into each image.

WAGO-I/O-SYSTEM 750
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124 • I/O Modules

Input and Output Process Image

Instance Byte Destination Remark
C0/S0 Control/Status byte
C1/S1 extended Control/Status byte
D0
D1
n
D2
Data bytes
D3
D4
D5
The specialty modules represent 1x8 bytes input and output data and seize 1
Instance in Class (0x67) and 1 Instance in Class (0x68).

Vibration Velocity/Bearing Condition Monitoring VIB I/O

750-645

The Vibration Velocity/Bearing Condition Monitoring VIB I/O has a total of

12 bytes of user data in both the Input and Output Process Image (8 bytes of
module data and 4 bytes of control/status). The following table illustrates the
Input and Output Process Image, which have 12 bytes mapped into each im-
age.

Input and Output Process Image

Instance Byte Destination Remark
C0/S0 Control/Status byte
(log. Channel 1, Sensor input 1)
n
D0 Data bytes
D1 (log. Channel 1, Sensor input 1)

C1/S1 Control/Status byte

(log. Channel 2, Sensor input 2)
n+1
D2 Data bytes
D3 (log. Channel 2, Sensor input 2)

C2/S2 Control/Status byte

(log. Channel 3, Sensor input 1)
n+2
D4 Data bytes
D5 (log. Channel 3, Sensor input 1)

C3/S3 Control/Status byte

(log. Channel 4, Sensor input 2)
n+3
D6 Data bytes
D7 (log. Channel 4, Sensor input 2)

WAGO-I/O-SYSTEM 750
DeviceNet
 I/O Modules • 125

The specialty modules represent 4x3 bytes input and output data and seize 4
Instances in Class (0x67) and 4 Instances in Class (0x68).

AS-interface Master Module

750-655

The length of the process image of the AS-interface master module can be set
to fixed sizes of 12, 20, 24, 32, 40 or 48 bytes.
It consists of a control or status byte, a mailbox with a size of 0, 6, 10, 12 or
18 bytes and the AS-interface process data, which can range from 0 to 32
bytes.

The AS-interface master module has a total of 12 to maximally 48 bytes data

in both the Input and Output Process Image.

The first Input and output byte, which is assigned to an AS-interface master
module, contains the status / control byte, the second byte is one empty byte.
Subsequently the mailbox data are mapped, when the mailbox is permanently
superimposed (Mode 1).

In the operating mode with suppressable mailbox (Mode 2), the mailbox and
the cyclical process data are mapped next.
The following bytes contain the remaining process data.

Input and Output Process Image

Instance Byte Destination Remark
C0/S0 Control/Status byte
- Not used
D0
n D1
Mailbox (0,6, 10, 12 or 18 bytes) /
D2
Process data (0-32 bytes)
...
D46
The specialty modules represent 1x 12...48 bytes input and output data and
seize 1 Instance in Class (0x67) and 1 Instance in Class (0x68).

WAGO-I/O-SYSTEM 750
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126 • I/O Modules

5.2.6 System Modules

System Modules with Diagnostics

750-610, -611

The 750-610 and 750-611 Supply Modules provide 2 bits of diagnostics in the
Input Process Image for monitoring of the internal power supply.

Input Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Diagnostic bit S 2 Diagnostic bit S 1
Fuse Voltage
The system modules seize 2 Instances in Class (0x65).

Binary Space Module

750-622

The Binary Space Modules 750-622 behave alternatively like 2 channel digital
input modules or output modules and occupy depending upon the selected set-
tings 1, 2, 3 or 4 bits per channel. According to this, 2, 4, 6 or 8 bits are occu-
pied then either in the process input or the process output image.

Input or Output Process Image

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
(Data bit (Data bit (Data bit (Data bit (Data bit (Data bit Data bit Data bit
DI 8) DI 7) DI 6) DI 5) DI 4) DI 3) DI 2 DI 1
The Binary Space Modules seize 2, 4, 6 or 8 Instances in class (0x65) or in
class (0x66).

WAGO-I/O-SYSTEM 750
DeviceNet
 Glossary • 127

6 Glossary
Bit Smallest information unit. Its value can either be 1 or
0.

Bitrate Number of bits transmitted within a time unit.

Bootstrap Operating mode of the fieldbus Coupler / Controllers.

Device expects a firmware upload.

Bus A structure used to transmit data. There are two

types, serial and parallel. A serial bus transmits data
bit by bit, whereas a parallel bus transmits many bits
at one time.

Byte Binary Yoked Transfer Element. A byte generally

contains 8 bits.

Data bus see Bus.

Fieldbus System for serial information transmission between

devices of automation technology in the process-
related field area.

Hardware Electronic, electrical and mechanic components of a

module/subassembly.

Operating system Software which links the application programs to the

hardware.

Segment Typically, a network is divided up into different

physical network segments by way of routers or re-
peaters.

Server Device providing services within a client/server sys-

tem. The service is requested by the Client.

Subnet A portion of a network that shares the same network

address as the other portions. These subnets are dis-
tinguished through the subnet mask.

WAGO-I/O-SYSTEM 750
DeviceNet
128 • Literature List

7 Literature List
Controller-Area-Network
Grundlagen, Protokolle, Bausteine, Anwendungen
Konrad Etschberger
2., völlig überarbeitete Auflage
2000 Carl Hanser Verlag München Wien
ISBN 3-4446-19431-2

Further information on web pages:

The ODVA provides further documentation on DeviceNet.

www.odva.org

CAN in Automation (CiA) provides further documentation on CAN.

can-cia.de

WAGO-I/O-SYSTEM 750
DeviceNet
 Index • 129

8 Index
C L
carrier rail ................................................................................. 19, 22 Light diodes ...................................................................................45
contacts locking disc.....................................................................................21
data- .......................................................................................... 23
power-................................................................................. 30, 31 P
D Power contacts ..........................................................................24, 30
not carried out...........................................................................31
data contacts ................................................................................... 23
S
E
Subnet ...........................................................................................137
Electrical isolation.......................................................................... 45
U
F
unlocking lug ..................................................................................21
Fieldbus node ................................................................................. 77
W
I
word-alignment.............................................................................115
I/O Modules.................................................................................. 108

WAGO-I/O-SYSTEM 750
DeviceNet
WAGO Kontakttechnik GmbH & Co. KG

Postfach 2880 • D-32385 Minden

Hansastraße 27 • D-32423 Minden
Phone: 05 71/8 87 – 0
Fax: 05 71/8 87 – 1 69
E-Mail: info@wago.com

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