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Formative Assessment 1

The document outlines questions related to the manufacturing process of silicon chips as seen in the video SILICON RUN II, emphasizing the importance of testing throughout production, the need for high-stress condition testing, and the automation involved in chip assembly. It also discusses the differences between surface mount and through-hole processes, the roles of computer components, and the advantages of multichip units and tape automated bonding. Overall, it highlights key manufacturing concepts and practices in the semiconductor industry.

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Glenn Virrey
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17 views1 page

Formative Assessment 1

The document outlines questions related to the manufacturing process of silicon chips as seen in the video SILICON RUN II, emphasizing the importance of testing throughout production, the need for high-stress condition testing, and the automation involved in chip assembly. It also discusses the differences between surface mount and through-hole processes, the roles of computer components, and the advantages of multichip units and tape automated bonding. Overall, it highlights key manufacturing concepts and practices in the semiconductor industry.

Uploaded by

Glenn Virrey
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Formative Assessment 1: Answer the following questions regarding the videos of Silicon Run

IC fabrication.

1. In SILICON RUN II we saw individual chips placed into packages followed by the assembly of
packaged chips onto printed circuit boards and finally the assembly of complete systems from a
set of printed circuit boards, power supplies, and other components. We also saw that testing
occurred at several stages of this process. Why is testing done throughout the manufacturing
process rather than simply after final system assembly?

2. Some of the electrical testing was performed at higher-than-normal temperatures or at higher-


than-normal voltages. Why would this testing be performed under such stressful conditions even
before the chips, boards, or systems have left the manufacturing area?

3. Virtually all of the automated pieces of manufacturing equipment shown in SILICON RUN II
are controlled by computers. For example, the die attach machine uses a computer-controlled
camera to "look at" the individual dice that are mounted on the sticky tape and then uses a
computer-controlled arm to pick up the selected die and mount it on the adhesive of the lead frame.
Describe a number of the decisions and actions that the computer must control to successfully
complete this process.

4. Printed circuit boards were assembled using both surface mount and through-hole processes.
Describe the differences between these two mounting approaches.

5. The four basic elements of a computer are input devices, output devices, the memory, and the
central processing unit. Which of these units is generally thought of as being the "brain" of the
computer? Which of these units is used to store the data and program instructions?

6. List several examples of "input devices" that send signals to the computers that control the
automated manufacturing equipment shown in SILICON RUN II. What are examples of "output
devices" on these same pieces of equipment?

7. Application software programs control the computer so that it performs tasks that are of interest
or used to the person using the computer. List a variety of tasks performed by application programs.

8. With their large number of solder bonding pads and high-density signal carrier substrates,
multichip units (MCUs) allow chips to be packaged closer to one another when compared to
conventional printed circuits boards. Why is that an advantage in high-speed computer systems?

9. We saw two processes used for electrically connecting signals on the chip to the
interconnection wires closest to the chip: wire bonding and tape automated bonding (TAB).
What are some advantages of tape automated bonding compared to conventional wire bonding?

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