ESP32­S3­WROOM­1

ESP32­S3­WROOM­1U

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Datasheet

VI C AR
RE R IN
2.4 GHz Wi­Fi (802.11 b/g/n) and Bluetooth® 5 (LE) module

O P
Built around ESP32­S3 series of SoCs, Xtensa® dual­core 32­bit LX7 microprocessor
Flash up to 16 MB, PSRAM up to 8 MB
SI HI
FO IM

36 GPIOs, rich set of peripherals

0
On­board PCB antenna or external antenna connector
EL

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ESP32­S3­WROOM­1 ESP32­S3­WROOM­1U

Pre-release v0.5.1
Espressif Systems
Copyright © 2021

www.espressif.com
1 Module Overview

1 Module Overview
Note:

Check the link or the QR code to make sure that you use the latest version of this document:
https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_datasheet_en.pdf

1.1 Features
CPU and On­Chip Memory • Channel selection algorithm #2

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• ESP32-S3 series of SoCs embedded, Xtensa® Peripherals
dual-core 32-bit LX7 microprocessor, up to 240
MHz • GPIO, SPI, LCD interface, Camera interface,
UART, I2C, I2S, remote control, pulse counter,
• 384 KB ROM
LED PWM, USB 1.1 OTG, USB Serial/JTAG

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• 512 KB SRAM controller, MCPWM, SDIO host, GDMA, TWAI®
controller (compatible with ISO 11898-1), ADC,
• 16 KB SRAM in RTC
touch sensor, temperature sensor, timers and
• Up to 8 MB PSRAM
IN watchdogs

Wi­Fi Integrated Components on Module

IM
• 802.11 b/g/n • 40 MHz crystal oscillator
• Bit rate: 802.11n up to 150 Mbps • Up to 16 MB SPI flash

• A-MPDU and A-MSDU aggregation

Antenna Options
• 0.4 µs guard interval support • On-board PCB antenna (ESP32-S3-WROOM-1)
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• Center frequency range of operating channel: • External antenna via a connector

2412 ~ 2484 MHz (ESP32-S3-WROOM-1U)

Bluetooth Operating Conditions

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• Bluetooth LE: Bluetooth 5, Bluetooth mesh • Operating voltage/Power supply: 3.0 ~ 3.6 V

• 2 Mbps PHY • Operating ambient temperature:

• Long range mode – 85 °C version: –40 ~ 85 °C

• Advertising extensions – 105 °C version: –40 ~ 105 °C

• Multiple advertisement sets • Dimensions: See Table 1

1.2 Description
ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU
modules that have a rich set of peripherals. They provide acceleration for neural network computing and signal
processing workloads. They are an ideal choice for a wide variety of application scenarios related to AI and

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1 Module Overview

Artificial Intelligence of Things (AIoT), such as wake word detection, speech commands recognition, face
detection and recognition, smart home, smart appliances, smart control panel, smart speaker, etc.

ESP32-S3-WROOM-1 comes with a PCB antenna. ESP32-S3-WROOM-1U comes with an external antenna
connector. A wide selection of module variants are available for customers as shown in Table 1. All the module
variants operate at –40 ~ 85 °C ambient temperature, except for ESP32-S3-WROOM-1-H4 and
ESP32-S3-WROOM-1U-H4 that operate at –40 ~ 105 °C ambient temperature.

Table 1: Ordering Information

Ordering Code Chip Embedded Flash (MB) PSRAM (MB) Dimensions (mm)
ESP32-S3-WROOM-1-N4 ESP32-S3 4 0

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ESP32-S3-WROOM-1-N8 ESP32-S3 8 0
ESP32-S3-WROOM-1-N16 ESP32-S3 16 0
ESP32-S3-WROOM-1-H4 (105 °C) ESP32-S3 4 0
ESP32-S3-WROOM-1-N4R2 ESP32-S3R2 4 2 (Quad SPI)
18 × 25.5 × 3.1
ESP32-S3-WROOM-1-N8R2 ESP32-S3R2 8 2 (Quad SPI)
ESP32-S3-WROOM-1-N16R2 ESP32-S3R2 16 2 (Quad SPI)

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ESP32-S3-WROOM-1-N4R8 ESP32-S3R8 4 8 (Octal SPI)
ESP32-S3-WROOM-1-N8R8 ESP32-S3R8 8 8 (Octal SPI)
ESP32-S3-WROOM-1-N16R8 ESP32-S3R8 16 8 (Octal SPI)
ESP32-S3-WROOM-1U-N4
ESP32-S3-WROOM-1U-N8
ESP32-S3
ESP32-S3
IN 4
8
0
0
ESP32-S3-WROOM-1U-N16 ESP32-S3 16 0
ESP32-S3-WROOM-1U-H4 (105 °C) ESP32-S3 4 0
IM
ESP32-S3-WROOM-1U-N4R2 ESP32-S3R2 4 2 (Quad SPI)
18 × 19.2 × 3.2
ESP32-S3-WROOM-1U-N8R2 ESP32-S3R2 8 2 (Quad SPI)
ESP32-S3-WROOM-1U-N16R2 ESP32-S3R2 16 2 (Quad SPI)
ESP32-S3-WROOM-1U-N4R8 ESP32-S3R8 4 8 (Octal SPI)
ESP32-S3-WROOM-1U-N8R8 ESP32-S3R8 8 8 (Octal SPI)
EL

ESP32-S3-WROOM-1U-N16R8 ESP32-S3R8 16 8 (Octal SPI)

At the core of the modules is an ESP32-S3 series of SoC *, an Xtensa® 32-bit LX7 CPU that operates at up to
240 MHz. You can power off the CPU and make use of the low-power co-processor to constantly monitor the
peripherals for changes or crossing of thresholds.
PR

ESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote
control, pulse counter, LED PWM, USB Serial/JTAG controller, MCPWM, SDIO host, GDMA, TWAI® controller
(compatible with ISO 11898-1), ADC, touch sensor, temperature sensor, timers and watchdogs, as well as up to
45 GPIOs. It also includes a full-speed USB 1.1 On-The-Go (OTG) interface to enable USB
communication.

Note:
* For more information on ESP32-S3 series of SoCs, please refer to ESP32-S3 Series Datasheet.

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1 Module Overview

1.3 Applications
• Generic Low-power IoT Sensor Hub • Smart Building

• Generic Low-power IoT Data Loggers • Industrial Automation

• Cameras for Video Streaming
• Smart Agriculture
• Over-the-top (OTT) Devices
• Audio Applications
• USB Devices
• Health Care Applications
• Speech Recognition
• Wi-Fi-enabled Toys
• Image Recognition

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• Mesh Network • Wearable Electronics

• Home Automation • Retail & Catering Applications

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IN
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Contents

Contents

1 Module Overview 2
1.1 Features 2
1.2 Description 2
1.3 Applications 4

2 Block Diagram 8

3 Pin Definitions 9

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3.1 Pin Layout 9
3.2 Pin Description 9
3.3 Strapping Pins 11

4 Electrical Characteristics 14

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4.1 Absolute Maximum Ratings 14
4.2 Recommended Operating Conditions 14
4.3 DC Characteristics (3.3 V, 25 °C) 14
4.4
4.5
Current Consumption Characteristics
Wi-Fi RF Characteristics
IN 15
15
4.5.1 Wi-Fi RF Standards 15
4.5.2 Wi-Fi RF Transmitter (TX) Specifications 16
4.5.3 Wi-Fi RF Receiver (RX) Specifications
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17
4.6 Bluetooth LE Radio 18
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications 18
4.6.2 Bluetooth LE RF Receiver (RX) Specifications 20

5 Module Schematics
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23

6 Peripheral Schematics 25

7 Physical Dimensions and PCB Land Pattern 26

7.1 Physical Dimensions 26
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7.2 Recommended PCB Land Pattern 27

7.3 Dimensions of External Antenna Connector 29

8 Product Handling 30
8.1 Storage Conditions 30
8.2 Electrostatic Discharge (ESD) 30
8.3 Reflow Profile 30

9 Related Documentation and Resources 31

Revision History 32

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List of Tables

List of Tables
1 Ordering Information 3
2 Pin Definitions 10
3 Strapping Pins 12
4 Parameter Descriptions of Setup and Hold Times for the Strapping Pin 13
5 Absolute Maximum Ratings 14
6 Recommended Operating Conditions 14
7 DC Characteristics (3.3 V, 25 °C) 14
8 Current Consumption Depending on RF Modes 15
9 Current Consumption Depending on Work Modes 15

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10 Wi-Fi RF Standards 16
11 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 16
12 TX EVM Test 16
13 RX Sensitivity 17
14 Maximum RX Level 17

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15 RX Adjacent Channel Rejection 18
16 Bluetooth LE Frequency 18
17 Transmitter Characteristics - Bluetooth LE 1 Mbps 18
18
19
IN
Transmitter Characteristics - Bluetooth LE 2 Mbps
Transmitter Characteristics - Bluetooth LE 125 Kbps
19
19
20 Transmitter Characteristics - Bluetooth LE 500 Kbps 19
21 Receiver Characteristics - Bluetooth LE 1 Mbps 20
22 Receiver Characteristics - Bluetooth LE 2 Mbps 20
IM
23 Receiver Characteristics - Bluetooth LE 125 Kbps 21
24 Receiver Characteristics - Bluetooth LE 500 Kbps 21
EL
PR

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List of Figures

List of Figures
1 ESP32-S3-WROOM-1 Block Diagram 8
2 ESP32-S3-WROOM-1U Block Diagram 8
3 Pin Layout (Top View) 9
4 Setup and Hold Times for the Strapping Pin 13
5 ESP32-S3-WROOM-1 Schematics 23
6 ESP32-S3-WROOM-1U Schematics 24
7 Peripheral Schematics 25
8 ESP32-S3-WROOM-1 Physical Dimensions 26
9 ESP32-S3-WROOM-1U Physical Dimensions 26

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10 ESP32-S3-WROOM-1 Recommended PCB Land Pattern 27
11 ESP32-S3-WROOM-1U Recommended PCB Land Pattern 28
12 Dimensions of External Antenna Connector 29
13 Reflow Profile 30

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IN
IM
EL
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2 Block Diagram

2 Block Diagram

ESP32-S3-WROOM-1
40 MHz
3V3 Crystal Antenna

RF Matching
ESP32-S3
ESP32-S3R2
EN ESP32-S3R8 GPIOs
PSRAM(opt.)
(QSPI/OSPI)

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VDD_SPI
SPICS0
SPICLK

SPIWP
SPIHD
SPIQ
SPID

QSPI Flash

A
Figure 1: ESP32­S3­WROOM­1 Block Diagram
IN
40 MHz
ESP32-S3-WROOM-1U
3V3 Crystal Antenna
IM
RF Matching
ESP32-S3
ESP32-S3R2
EN ESP32-S3R8 GPIOs
PSRAM(opt.)
(QSPI/OSPI)
VDD_SPI
EL SPICS0
SPICLK

SPIWP
SPIHD
SPIQ
SPID

QSPI Flash
PR

Figure 2: ESP32­S3­WROOM­1U Block Diagram

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3 Pin Definitions

3 Pin Definitions

3.1 Pin Layout

The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.

The pin diagram is applicable for ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U, but the latter has no
keepout zone.

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Keepout Zone

A
GND 1 40 GND

3V3 2 39 IO1

EN 3
IN 38 IO2

IO4 4 37 TXD0

IO5 5 36 RXD0
IM
IO6 6 GND GND GND 35 IO42

IO7 7 GND
41
GND
GND 34 IO41

IO15 8 GND GND GND 33 IO40

IO16 9 32 IO39

IO17 10 31 IO38
EL

IO18 11 30 IO37

IO8 12 29 IO36

IO19 13 28 IO35

IO20 14 27 IO0
21

22
20

24

26
23

25
16

17

18

19
15
PR
IO11

IO21
IO12
IO10

IO14
IO3

IO46

IO9

IO13

IO47

IO48

IO45

Figure 3: Pin Layout (Top View)

3.2 Pin Description

The module has 41 pins. See pin definitions in Table 2.

For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to
ESP32-S3 Series Datasheet.

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3 Pin Definitions

Table 2: Pin Definitions

Name No. Type a Function

GND 1 P GND
3V3 2 P Power supply
High: on, enables the chip.
EN 3 I Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
IO4 4 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
IO5 5 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
IO6 6 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5

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IO7 7 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
IO15 8 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16 9 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 10 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
IO18 11 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1

A
IO19 13 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
IO20 14 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO3 15 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
IO46 16 I/O/T GPIO46
IN
IO9 17 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4,
IO10 18 I/O/T
SUBSPICS0
IM
RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5,
IO11 19 I/O/T
SUBSPID
RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6,
IO12 20 I/O/T
SUBSPICLK
EL

RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7,

IO13 21 I/O/T
SUBSPIQ
RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS,
IO14 22 I/O/T
SUBSPIWP
IO21 23 I/O/T RTC_GPIO21, GPIO21
PR

IO47 24 I/O/T SPICLK_P_DIFF,GPIO47, SUBSPICLK_P_DIFF

IO48 25 I/O/T SPICLK_N_DIFF,GPIO48, SUBSPICLK_N_DIFF
IO45 26 I/O/T GPIO45
IO0 27 I/O/T RTC_GPIO0, GPIO0
b
IO35 28 I/O/T SPIIO6, GPIO35, FSPID, SUBSPID
b
IO36 29 I/O/T SPIIO7, GPIO36, FSPICLK, SUBSPICLK
b
IO37 30 I/O/T SPIDQS, GPIO37, FSPIQ, SUBSPIQ
IO38 31 I/O/T GPIO38, FSPIWP, SUBSPIWP
IO39 32 I/O/T MTCK, GPIO39, CLK_OUT3, SUBSPICS1
IO40 33 I/O/T MTDO, GPIO40, CLK_OUT2
IO41 34 I/O/T MTDI, GPIO41, CLK_OUT1
Cont’d on next page

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3 Pin Definitions

Table 2 – cont’d from previous page

a
Name No. Type Function
IO42 35 I/O/T MTMS, GPIO42
RXD0 36 I/O/T U0RXD, GPIO44, CLK_OUT2
TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1
IO2 38 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
IO1 39 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
GND 40 P GND
EPAD 41 P GND
a
P: power supply; I: input; O: output; T: high impedance. Pin functions in bold font are the default
pin functions.

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b
In module variants that have embedded OSPI PSRAM, i.e., that embed ESP32-S3R8, pins IO35,
IO36, and IO37 connect to the OSPI PSRAM and are not available for other uses.

3.3 Strapping Pins

A
Note:
The content below is excerpted from Section Strapping Pins in ESP32-S3 Series Datasheet. For the strapping pin map-
ping between the chip and modules, please refer to Chapter 5 Module Schematics.

ESP32-S3 has four strapping pins:

IN
• GPIO0
IM
• GPIO45

• GPIO46

• GPIO3

Software can read the values of corresponding bits from register ”GPIO_STRAPPING”.
EL

During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as
strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down.

GPIO0, GPIO45 and GPIO46 are connected to the chip’s internal weak pull-up/pull-down during the chip reset.
PR

Consequently, if they are unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of these strapping pins.

GPIO3 is floating by default. When EFUSE_STRAP_JTAG_SEL is set, the strapping value of GPIO3 determines
the source of the JTAG signal inside the CPU. In this case, the strapping value is controlled by the external circuit
that cannot be in a high impedance state.

• When GPIO3 strapping value is 0, the JTAG signal comes from the on-chip JTAG pin.

• When GPIO3 strapping value is 1, the JTAG signal comes from the USB Serial/JTAG controller.

When EFUSE_STRAP_JTAG_SEL is 0, the JTAG signal comes from the USB Serial/JTAG controller.

To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S3.

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3 Pin Definitions

After reset, the strapping pins work as normal-function pins.

Refer to Table 3 for a detailed configuration of the strapping pins.

Table 3: Strapping Pins

VDD_SPI Voltage 1
Pin Default 3.3 V 1.8 V
GPIO45 Pull-down 0 1
2
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0

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GPIO46 Pull-down Don’t care 0
Enabling/Disabling ROM Messages Print During Booting 3 4

Pin Default Enabled Disabled

GPIO46 Pull-down See the fourth note See the fourth note
JTAG Signal Selection
Pin Default EFUSE_STRAP_JTAG_SEL=0 EFUSE_STRAP_JTAG_SEL=1

A
Strapping value:
GPIO3 N/A USB Serial/JTAG 0: PAD JTAG 5
1: USB Serial/JTAG 5
IN
Note:

1. The functionality of strapping pin GPIO45 to select VDD_SPI voltage may be disabled by setting VDD_SPI_FORCE
IM
eFuse to 1. In such a case the voltage is selected with eFuse bit VDD_SPI_TIEH.

2. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior.

3. ROM boot messages can be printed over U0TXD (by default) or GPIO17, depending on the eFuse bit.

4. When both EFUSE_DIS_USB_DEVICE and USB_DIS_USB are 0, ROM boot messages will be printed to the
EL

USB Serial/JTAG controller. Otherwise, the messages will be printed to UART, controlled by GPIO46 and eFuse
UART_PRINT_CONTROL. Specifically, when eFuse UART_PRINT_CONTROL value is:
0, print is normal during boot and not controlled by GPIO46.
1 and GPIO46 is 0, print is normal during boot; but if GPIO46 is 1, print is disabled.
2 and GPIO46 is 0, print is disabled; but if GPIO46 is 1, print is normal.
3, print is disabled and not controlled by GPIO46.
PR

5. PAD JTAG: JTAG signal comes from the on-chip JTAG pin;
USB Serial/JTAG: JTAG signal comes from the USB Serial/JTAG controller.

Figure 4 shows the setup and hold times for the strapping pin before and after the CHIP_PU signal goes high.
Details about the parameters are listed in Table 4.

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3 Pin Definitions

tSU tHD

VIL_nRST
CHIP_PU

VIH

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Strapping pin

Figure 4: Setup and Hold Times for the Strapping Pin

Table 4: Parameter Descriptions of Setup and Hold Times for the Strapping Pin

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Parameter Description Min (µs)
tSU Setup time before CHIP_PU goes from low to high 0
tHD Hold time after CHIP_PU goes high
IN 3
IM
EL
PR

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4 Electrical Characteristics

4 Electrical Characteristics
The values presented in this section are preliminary and may change with the final release of this
datasheet.

4.1 Absolute Maximum Ratings

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.

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Table 5: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C

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4.2 Recommended Operating Conditions IN
Table 6: Recommended Operating Conditions

Symbol Parameter Min Typ Max Unit

VDD33 Power supply voltage 3.0 3.3 3.6 V
IM
IV DD Current delivered by external power supply 0.5 — — A
85 °C version 85
TA Operating ambient temperature –40 — °C
105 °C version 105
Humidity Humidity condition — — 85 %RH
EL

4.3 DC Characteristics (3.3 V, 25 °C)

Table 7: DC Characteristics (3.3 V, 25 °C)

Symbol Parameter Min Typ Max Unit

PR

CIN Pin capacitance — 2 — pF

1 1
VIH High-level input voltage 0.75 × VDD — VDD + 0.3 V
1
VIL Low-level input voltage –0.3 — 0.25 × VDD V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
2 1
VOH High-level output voltage 0.8 × VDD — — V
2 1
VOL Low-level output voltage — — 0.1 × VDD V
1
High-level source current (VDD = 3.3 V, VOH >=
IOH — 40 — mA
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
IOL — 28 — mA
0.495 V, PAD_DRIVER = 3)
Cont’d on next page

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4 Electrical Characteristics

Table 7 – cont’d from previous page

Symbol Parameter Min Typ Max Unit
RP U Internal weak pull-up resistor — 45 — kΩ
RP D Internal weak pull-down resistor — 45 — kΩ
Chip reset release voltage (EN voltage is within
VIH_nRST 0.75 × VDD1 — VDD1+ 0.3 V
the specified range)
Chip reset voltage (EN voltage is within the
VIL_nRST –0.3 — 0.25 × VDD1 V
specified range)
1
VDD is the I/O voltage for pins of a particular power domain.
2
VOH and VOL are measured using high-impedance load.

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4.4 Current Consumption Characteristics
Owing to the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section RTC and Low-Power Management
in ESP32-S3 Series Datasheet.

A
Table 8: Current Consumption Depending on RF Modes

Work mode Description Peak (mA)

IN
802.11b, 1 Mbps, @20.5 dBm
802.11g, 54 Mbps, @18 dBm
330
280
TX
802.11n, HT20, MCS7, @17.5 dBm 273
Active (RF working)
802.11n, HT40, MCS7, @17 dBm 278
IM
802.11b/g/n, HT20 97
RX
802.11n, HT40 100
1
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
EL

2
The current consumption figures in RX mode are for cases where the peripherals are disabled
and the CPU idle.

Note that the data in Table 9 only applies to the module variants that embed ESP32-S3.

Table 9: Current Consumption Depending on Work Modes

PR

Work mode Description Typ Unit

Light-sleep — 240 µA
Deep-sleep RTC memory and RTC peripherals are powered on. 8 µA
Hibernation RTC memory is powered on. RTC peripherals are powered off. 7 µA
Power off CHIP_PU is set to low level. The chip is powered off. 1 µA

4.5 Wi­Fi RF Characteristics

4.5.1 Wi­Fi RF Standards

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4 Electrical Characteristics

Table 10: Wi­Fi RF Standards

Name Description
1
Center frequency range of operating channel 2412 ~ 2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
11b: 1, 2, 5.5 and 11 Mbps
20 MHz 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Data rate
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, external antenna via the connector
1
Device should operate in the center frequency range allocated by regional regulatory authorities. Target

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center frequency range is configurable by software.
2
For the modules that use external antennas, the output impedance is 50 Ω. For other modules without
external antennas, the output impedance is irrelevant.

4.5.2 Wi­Fi RF Transmitter (TX) Specifications

A
Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 11. IN
Table 11: TX Power with Spectral Mask and EVM Meeting 802.11 Standards

Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps — 20.5 —
IM
802.11b, 11 Mbps — 20.5 —
802.11g, 6 Mbps — 20.0 —
802.11g, 54 Mbps — 18.0 —
802.11n, HT20, MCS0 — 19.0 —
EL

802.11n, HT20, MCS7 — 17.5 —

802.11n, HT40, MCS0 — 18.5 —
802.11n, HT40, MCS7 — 17.0 —

Table 12: TX EVM Test

PR

Min Typ SL1

Rate (dB) (dB) (dB)
802.11b, 1 Mbps, @20.5 dBm — –24.5 –10
802.11b, 11 Mbps, @20.5 dBm — –24.5 –10
802.11g, 6 Mbps, @20 dBm — –21.5 –5
802.11g, 54 Mbps, @18 dBm — –27.5 –25
802.11n, HT20, MCS0, @19 dBm — –22.0 –5
802.11n, HT20, MCS7, @17.5 dBm — –29.2 –27
802.11n, HT40, MCS0, @18.5 dBm — –22.0 –5
802.11n, HT40, MCS7, @17 dBm — –28.0 –27
1
SL stands for standard limit value.

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4 Electrical Characteristics

4.5.3 Wi­Fi RF Receiver (RX) Specifications

Table 13: RX Sensitivity

Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps — –98.4 —
802.11b, 2 Mbps — –95.3 —
802.11b, 5.5 Mbps — –92.8 —
802.11b, 11 Mbps — –88.5 —
802.11g, 6 Mbps — –93.0 —

RY
802.11g, 9 Mbps — –92.0 —
802.11g, 12 Mbps — –90.8 —
802.11g, 18 Mbps — –88.5 —
802.11g, 24 Mbps — –85.5 —
802.11g, 36 Mbps — –82.0 —
802.11g, 48 Mbps — –78.0 —

A
802.11g, 54 Mbps — –76.2 —
802.11n, HT20, MCS0 — –92.6 —
802.11n, HT20, MCS1 — –90.6 —
802.11n, HT20, MCS2
802.11n, HT20, MCS3
IN —
—
–88.0
–84.8
—
—
802.11n, HT20, MCS4 — –81.6 —
802.11n, HT20, MCS5 — –77.4 —
IM
802.11n, HT20, MCS6 — –75.2 —
802.11n, HT20, MCS7 — –74.0 —
802.11n, HT40, MCS0 — –90.0 —
802.11n, HT40, MCS1 — –87.6 —
EL

802.11n, HT40, MCS2 — –84.8 —

802.11n, HT40, MCS3 — –81.8 —
802.11n, HT40, MCS4 — –78.4 —
802.11n, HT40, MCS5 — –74.2 —
802.11n, HT40, MCS6 — –72.2 —
PR

802.11n, HT40, MCS7 — –71.0 —

Table 14: Maximum RX Level

Min Typ Max

Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps — 5 —
802.11b, 11 Mbps — 5 —
802.11g, 6 Mbps — 5 —
802.11g, 54 Mbps — 0 —
802.11n, HT20, MCS0 — 5 —
802.11n, HT20, MCS7 — 0 —
Cont’d on next page

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4 Electrical Characteristics

Table 14 – cont’d from previous page

Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11n, HT40, MCS0 — 5 —
802.11n, HT40, MCS7 — 0 —

Table 15: RX Adjacent Channel Rejection

Min Typ Max

Rate (dB) (dB) (dB)
802.11b, 1 Mbps — 35 —

RY
802.11b, 11 Mbps — 35 —
802.11g, 6 Mbps — 31 —
802.11g, 54 Mbps — 14 —
802.11n, HT20, MCS0 — 31 —
802.11n, HT20, MCS7 — 13 —

A
802.11n, HT40, MCS0 — 19 —
802.11n, HT40, MCS7 — 8 —

4.6 Bluetooth LE Radio

IN
Table 16: Bluetooth LE Frequency
IM
Min Typ Max
Parameter (MHz) (MHz) (MHz)
Center frequency of operating channel 2402 — 2480
EL

4.6.1 Bluetooth LE RF Transmitter (TX) Specifications

Table 17: Transmitter Characteristics ­ Bluetooth LE 1 Mbps

Parameter Description Min Typ Max Unit

PR

RF power control range –25.00 0 20.00 dBm

RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 15.00 — kHz
Max |f0 − fn | — 3.00 — kHz
Carrier frequency offset and drift
Max |fn − fn−5 | — 1.80 — kHz
|f1 − f0 | — 1.00 — kHz
∆ f 1avg — 250.00 — kHz
Min ∆ f 2max (for at least
Modulation characteristics — 190.00 — kHz
99.9% of all ∆ f 2max )
∆ f 2avg /∆ f 1avg — 0.86 — —
±2 MHz offset — –36.20 — dBm
In-band spurious emissions ±3 MHz offset — –41.20 — dBm
Cont’d on next page

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4 Electrical Characteristics

Table 17 – cont’d from previous page

Parameter Description Min Typ Max Unit
>±3 MHz offset — –44.60 — dBm

Table 18: Transmitter Characteristics ­ Bluetooth LE 2 Mbps

Parameter Description Min Typ Max Unit

RF power control range –25.00 0 20.00 dBm
RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 15.00 — kHz
Max |f0 − fn | — 2.50 — kHz

RY
Carrier frequency offset and drift
Max |fn − fn−5 | — 1.80 — kHz
|f1 − f0 | — 1.00 — kHz
∆ f 1avg — 498.00 — kHz
Min ∆ f 2max (for at least
Modulation characteristics — 420.00 — kHz
99.9% of all ∆ f 2max )

A
∆ f 2avg /∆ f 1avg — 0.93 — —
±2 MHz offset — –43.70 — dBm
In-band spurious emissions ±3 MHz offset — –45.80 — dBm
>±3 MHz offset
IN — –47.00 — dBm

Table 19: Transmitter Characteristics ­ Bluetooth LE 125 Kbps

IM
Parameter Description Min Typ Max Unit
RF power control range –25.00 0 20.00 dBm
RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 15.00 — kHz
Max |f0 − fn | — 0.90 — kHz
EL

Carrier frequency offset and drift

|fn − fn−3 | — 0.40 — kHz
|f0 − f3 | — 0.65 — kHz
∆ f 1avg — 250.00 — kHz
Modulation characteristics Min ∆ f 1max (for at least
— 210.00 — kHz
99.9% of all∆ f 2max )
PR

±2 MHz offset — –36.20 — dBm

In-band spurious emissions ±3 MHz offset — –41.20 — dBm
>±3 MHz offset — –44.60 — dBm

Table 20: Transmitter Characteristics ­ Bluetooth LE 500 Kbps

Parameter Description Min Typ Max Unit

RF power control range –25.00 0 20.00 dBm
RF transmit power
Gain control step — 3.00 — dB
Max |fn |n=0, 1, 2, ..k — 15.00 — kHz
Max |f0 − fn | — 0.90 — kHz
Carrier frequency offset and drift
Cont’d on next page

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4 Electrical Characteristics

Table 20 – cont’d from previous page

Parameter Description Min Typ Max Unit
|fn − fn−3 | — 0.46 — kHz
|f0 − f3 | — 0.80 — kHz
∆ f 2avg — 210.00 — kHz
Modulation characteristics Min ∆ f 2max (for at least
— 174.00 — kHz
99.9% of all ∆ f 2max )
±2 MHz offset — –36.20 — dBm
In-band spurious emissions ±3 MHz offset — –41.20 — dBm
>±3 MHz offset — –44.60 — dBm

RY
4.6.2 Bluetooth LE RF Receiver (RX) Specifications

Table 21: Receiver Characteristics ­ Bluetooth LE 1 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –97 — dBm

A
Maximum received signal @30.8% PER — — 5 — dBm
Co-channel C/I F = F0 MHz — 9 — dB
IN
F = F0 + 1 MHz
F = F0 – 1 MHz
—
—
–3
–3
—
—
dB
dB
F = F0 + 2 MHz — –28 — dB
F = F0 – 2 MHz — –36 — dB
Adjacent channel selectivity C/I
IM
F = F0 + 3 MHz — –33 — dB
F = F0 – 3 MHz — –35 — dB
F > F0 + 3 MHz — –31 — dB
F > F0 – 3 MHz — –38 — dB
Image frequency — — –31 — dB
EL

F = Fimage + 1 MHz — –39 — dB

Adjacent channel to image frequency
F = Fimage – 1 MHz — –33 — dB
30 MHz ~ 2000 MHz — –5 — dBm
2003 MHz ~ 2399 MHz — –19 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –17 — dBm
PR

3000 MHz ~ 12.75 GHz — –5 — dBm

Intermodulation — — –26 — dBm

Table 22: Receiver Characteristics ­ Bluetooth LE 2 Mbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –93 — dBm
Maximum received signal @30.8% PER — — 3 — dBm
Co-channel C/I F = F0 MHz — 11 — dB
F = F0 + 2 MHz — –7 — dB
F = F0 – 2 MHz — –6 — dB
Cont’d on next page

Adjacent channel selectivity C/I

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4 Electrical Characteristics

Table 22 – cont’d from previous page

Parameter Description Min Typ Max Unit
F = F0 + 4 MHz — –29 — dB
F = F0 – 4 MHz — –35 — dB
F = F0 + 6 MHz — –39 — dB
F = F0 – 6 MHz — –39 — dB
F > F0 + 6 MHz — –42 — dB
F > F0 – 6 MHz — –42 — dB
Image frequency — — –29 — dB
F = Fimage + 2 MHz — –39 — dB
Adjacent channel to image frequency
F = Fimage – 2 MHz — –7 — dB

RY
30 MHz ~ 2000 MHz — –5 — dBm
2003 MHz ~ 2399 MHz — –29 — dBm
Out-of-band blocking performance
2484 MHz ~ 2997 MHz — –26 — dBm
3000 MHz ~ 12.75 GHz — –5 — dBm
Intermodulation — — –29 — dBm

A
Table 23: Receiver Characteristics ­ Bluetooth LE 125 Kbps
IN
Parameter Description Min Typ Max Unit
Sensitivity @30.8% PER — — –104.5 — dBm
Maximum received signal @30.8% PER — — 5 — dBm
Co-channel C/I F = F0 MHz — 7 — dB
IM
F = F0 + 1 MHz — –5 — dB
F = F0 – 1 MHz — –6 — dB
F = F0 + 2 MHz — –32 — dB
F = F0 – 2 MHz — –40 — dB
Adjacent channel selectivity C/I
F = F0 + 3 MHz — –44 — dB
EL

F = F0 – 3 MHz — –47 — dB
F > F0 + 3 MHz — –33 — dB
F > F0 – 3 MHz — –50 — dB
Image frequency — — –33 — dB
F = Fimage + 1 MHz — –46 — dB
Adjacent channel to image frequency
PR

F = Fimage – 1 MHz — –44 — dB

Table 24: Receiver Characteristics ­ Bluetooth LE 500 Kbps

Parameter Description Min Typ Max Unit

Sensitivity @30.8% PER — — –100.5 — dBm
Maximum received signal @30.8% PER — — 5 — dBm
Co-channel C/I F = F0 MHz — 4 — dB
F = F0 + 1 MHz — –4 — dB
F = F0 – 1 MHz — –6 — dB
F = F0 + 2 MHz — –32 — dB
Cont’d on next page
Adjacent channel selectivity C/I

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4 Electrical Characteristics

Table 24 – cont’d from previous page

Parameter Description Min Typ Max Unit
F = F0 – 2 MHz — –36 — dB
F = F0 + 3 MHz — –37 — dB
F = F0 – 3 MHz — –40 — dB
F > F0 + 3 MHz — –35 — dB
F > F0 – 3 MHz — –43 — dB
Image frequency — — –35 — dB
F = Fimage + 1 MHz — –43 — dB
Adjacent channel to image frequency
F = Fimage – 1 MHz — –37 — dB

A RY
IN
IM
EL
PR

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 Espressif Systems

5 Module Schematics
5 Module Schematics
This is the reference design
5 of the module. 4 3 2 1

PR GND
GND

GND

4
Y1

GND XOUT

GND
D C1 C4 D
VDD33 VDD33 GND GND

XIN
TBD TBD U3 ESP32-S3-WROOM-1
41
1 EPAD 40
The values of C1 and C4 vary with

1
2 GND GND 39 GPIO1
R1

EL
the selection of the crystal. CHIP_PU 3 3V3 IO1 38 GPIO2
10K(NC) GPIO4 4 EN IO2 37 U0TXD
The value of R4 varies with the actual GND GPIO5 5 IO4 TXD0 36 U0RXD
D1 GPIO6 6 IO5 RXD0 35
VDD33 PCB board. 40MHz(±10ppm) GPIO46
IO6 IO42
GPIO42
GPIO45 ESD GPIO7 7 34 GPIO41
U0RXD GPIO15 8 IO7 IO41 33 GPIO40
R3 499 U0TXD GPIO16 9 IO15 IO40 32 GPIO39
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C3 C2 GPIO42 GPIO17 10 IO16 IO39 31 GPIO38

IO17 IO38

0
GPIO41 GPIO18 11 30 GPIO37
1uF 10nF GPIO40 GND GPIO8 12 IO18 IO37 29 GPIO36
GPIO39 GPIO19 13 IO8 IO36 28 GPIO35
VDD33 GND GPIO38 GPIO20 14 IO19 IO35 27 GPIO0
IO20 IO0

R4
GND GND
L1 0

IM

IO46

IO10
IO11
IO12
IO13
IO14
IO21
IO47
IO48
IO45
IO3

IO9
C C10 C
C6 C7 C8 C9 VDD33

57

56
55
54
53
52
51
50
49
48
47
46
45
44
43
0.1uF

15
16
17
18
19
20
21
22
23
24
25
26
23

10uF 1uF 0.1uF 0.1uF

GND

VDDA
VDDA
XTAL_N
XTAL_P
GPIO46
GPIO45
U0RXD
U0TXD
MTMS

MTDO
MTCK
GPIO38
MTDI
VDD3P3_CPU
GND

GPIO46

GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO21
GPIO47
GPIO48
GPIO45
GPIO3

GPIO9
GND GND GND GND
ANT1
1 RF_ANT L2 TBD LNA_IN 1 42 GPIO37
2 2 LNA_IN GPIO37 41 GPIO36
3 VDD3P3 GPIO36 40 GPIO35
C11 C12
CHIP_PU VDD3P3 GPIO35 ESP32-S3-WROOM-1(pin-out)
PCB_ANT 4 39
TBD TBD GPIO0 5 CHIP_PU GPIO34 38

IN
ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1

GPIO1 6 GPIO0 GPIO33 37 GPIO47

GPIO2 7 GPIO1 SPICLK_P 36 GPIO48 VDD_SPI
GND GND GND GPIO3 8 GPIO2 SPICLK_N 35 R16 0 SPID
GPIO4 9 GPIO3 SPID 34 R15 0 SPIQ
GPIO4 SPIQ

8
GPIO5 10 33 R10 0 SPICLK
GPIO6 11 GPIO5 SPICLK 32 SPICS0
The values of C11, L2 and C12

VDD
GPIO7 12 GPIO6 SPICS0 31 R14 0 SPIWP SPICS0 1 5 SPID
vary with the actual PCB board. GPIO8 13 GPIO7 SPIWP 30 R13 0 SPIHD /CS DI
B B
GPIO9 14 GPIO8 SPIHD 29 SPICLK 6 2 SPIQ
NC: No component.
VDD3P3_RTC

GPIO9 VDD_SPI CLK DO

XTAL_32K_N
XTAL_32K_P

SPIHD 7 3 SPIWP

GND
/HOLD /WP

A
C14 VDD_SPI
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO17
GPIO18
GPIO19
GPIO20
GPIO21

C13
SPICS1

0.1uF 1uF U2 FLASH-3V3

4
U1 ESP32-S3
15
16
17
18
19
20
21
22
23
24
25
26
27
28

VDD33 ESP32-S3R2 GND GND GND

ESP32-S3R8

RY
C15
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21

0.1uF

GND

A A

Figure 5: ESP32­S3­WROOM­1 Schematics

Title
<ESP32-S3-WROOM-1>

Size Page Name Rev

A4 <02_ESP32-S3-WROOM-1> Confidential and Proprietary
V1.1
Date: Tuesday, July 20, 2021 Sheet 2 of 2
5 4 3 2 1
 5 4 3 2 1
Espressif Systems

5 Module Schematics
GND

GND GND

4
Y1

GND XOUT

GND
PR
D C1 C4 D
VDD33 VDD33 GND GND

XIN
TBD TBD U3 ESP32-S3-WROOM-1U
41
1 EPAD 40
The values of C1 and C4 vary with

1
2 GND GND 39 GPIO1
the selection of the crystal. R1
CHIP_PU 3 3V3 IO1 38 GPIO2
10K(NC) GPIO4 4 EN IO2 37 U0TXD
The value of R4 varies with the actual GND GPIO5 5 IO4 TXD0 36 U0RXD
D1 GPIO6 6 IO5 RXD0 35
VDD33 PCB board. 40MHz(±10ppm) GPIO46
IO6 IO42
GPIO42
GPIO45 ESD GPIO7 7 34 GPIO41
U0RXD GPIO15 8 IO7 IO41 33 GPIO40
R3 499 U0TXD GPIO16 9 IO15 IO40 32 GPIO39
C3 C2 GPIO42 GPIO17 10 IO16 IO39 31 GPIO38
IO17 IO38

0
GPIO41 GPIO18 11 30 GPIO37
1uF 10nF GPIO40 GND GPIO8 12 IO18 IO37 29 GPIO36
GPIO39 GPIO19 13 IO8 IO36 28 GPIO35

EL
VDD33 GND GPIO38 GPIO20 14 IO19 IO35 27 GPIO0
IO20 IO0

R4
GND GND
L1 0

IO46

IO10
IO11
IO12
IO13
IO14
IO21
IO47
IO48
IO45
IO3

IO9
C C10 C
C6 C7 C8 C9 VDD33

57

56
55
54
53
52
51
50
49
48
47
46
45
44
43
0.1uF

15
16
17
18
19
20
21
22
23
24
25
26
10uF 1uF 0.1uF 0.1uF
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GND

VDDA
VDDA
XTAL_N
XTAL_P
GPIO46
GPIO45
U0RXD
U0TXD
MTMS
MTDI
VDD3P3_CPU
MTDO
MTCK
GPIO38
GND

GPIO46

GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO21
GPIO47
GPIO48
GPIO45
GPIO3

GPIO9
GND GND GND GND

1 RF_ANT L2 TBD LNA_IN 1 42 GPIO37

2 LNA_IN GPIO37 41 GPIO36
3 VDD3P3 GPIO36 40 GPIO35 ESP32-S3-WROOM-1U(pin-out)

IM
ANT1 C11 C12
2

CHIP_PU 4 VDD3P3 GPIO35 39

CONN TBD TBD GPIO0 5 CHIP_PU GPIO34 38
GPIO1 6 GPIO0 GPIO33 37 GPIO47
GPIO1 SPICLK_P
24

GPIO2 7 36 GPIO48 VDD_SPI

GND GND GND GPIO3 8 GPIO2 SPICLK_N 35 R16 0 SPID
GPIO4 9 GPIO3 SPID 34 R15 0 SPIQ
GPIO4 SPIQ

8
GPIO5 10 33 R10 0 SPICLK
GPIO6 11 GPIO5 SPICLK 32 SPICS0
The values of C11, L2 and C12

VDD
GPIO7 12 GPIO6 SPICS0 31 R14 0 SPIWP SPICS0 1 5 SPID
vary with the actual PCB board. GPIO8 13 GPIO7 SPIWP 30 R13 0 SPIHD /CS DI
B B
GPIO9 14 GPIO8 SPIHD 29 SPICLK 6 2 SPIQ
NC: No component.

VDD3P3_RTC
GPIO9 VDD_SPI CLK DO

XTAL_32K_N
XTAL_32K_P
SPIHD 7 3 SPIWP

IN

GND
ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1

C14 VDD_SPI /HOLD /WP

GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
C13

SPICS1
0.1uF 1uF U2 FLASH-3V3

4
U1 ESP32-S3
15
16
17
18
19
20
21
22
23
24
25
26
27
28
VDD33 ESP32-S3R2 GND GND GND
ESP32-S3R8

C15
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14

GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21

A
0.1uF

GND

A A

Figure 6: ESP32­S3­WROOM­1U Schematics

RY
Title
<ESP32-S3-WROOM-1U>

Size Page Name Rev

A4 <02_ESP32-S3-WROOM-1U> Confidential and Proprietary
V1.2
Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 V byDate:
defaultTuesday,
(outputJuly 20,by
2021VDD_SPI). Please
Sheet 2 omake
f 2 sure IO45 is
5 4 3 2 1

not pulled high when the module is powered up by external circuit.

 6 Peripheral Schematics

6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).

VDD33 GND GND VDD33

JP1
ESP32-S3-WROOM-1/ESP32-S3-WROOM-1U 1
41 2 1
C1 C3 R1 TBD 1 EPAD 40 3 2
2 GND GND 39 IO1 4 3
22uF 0.1uF C2 TBD EN 3 3V3 IO1 38 IO2 4
GND
IO4 4 EN IO2 37 RXD0 UART
GND GND IO5 5 IO4 TXD0 36 TXD0 GND JP2
C4 12pF(NC) IO6 6 IO5 RXD0 35 IO42 TMS 1
GND X1: ESR = Max. 70 KΩ IO7 7 IO6 IO42 34 1
R2

IO41 TDI 2
8 IO7 IO41 33 2
1

RY
X1 R3 0(NC) IO15 IO40 TDO 3
R5 0(NC) IO16 9 IO15 IO40 32 IO39 TCK 4 3
32.768KHz(NC) IO16 IO39 31 4
IO17 10 IO38
NC
2

IO18 11 IO17 IO38 30 IO37 GND JTAG

GND
C7 12pF(NC) IO8 12 IO18 IO37 29 IO36 JP4
IO19 13 IO8 IO36 28 IO35 2
IO20 14 IO19 IO35 27 IO0 1 2
JP3 IO20 IO0 1
1 USB_D- R6 0 Boot Option
IO46

IO10
IO11
IO12
IO13
IO14
IO21
IO47
IO48
IO45
1 USB_D+ IO3

IO9
2 R4 0
2 SW1
USB OTG C6 C5 NC: No component. U1 R7 0 EN

A
15
16
17
18
19
20
21
22
23
24
25
26
TBD TBD C8 0.1uF
IO46

IO10
IO11
IO12
IO13
IO14
IO21
IO47
IO48
IO45
IO3

IO9

GNDGND GND
IN
Figure 7: Peripheral Schematics

• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
IM
performance. If you choose to solder it, please apply the correct amount of soldering paste.

• To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence
EL

timing diagram, please refer to Section Power Scheme in ESP32-S3 Series Datasheet.
PR

5 4 3 2

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7 Physical Dimensions and PCB Land Pattern

7 Physical Dimensions and PCB Land Pattern

7.1 Physical Dimensions

Unit: mm

18±0.15 3.1±0.15
0.8
6

RY
15.8 0.9
25.5±0.15

0.5
40 x 0.9

40 x Ø0.55
16.51

3.7
17.6
1.27

40 x 0.9

0.9
3.7
5
0.
Ø

10.5
1.5

1.05

10.29
A
13.97 1.27 2.015
40 x 0.45 1 40 x 0.85

Top View
IN Side View Bottom View

Figure 8: ESP32­S3­WROOM­1 Physical Dimensions

IM
Unit: mm

18±0.15 3.2±0.15
3 0.8
EL

10.75 0.9
40 x 0.9

0.5
2.46

40 x Ø0.55
19.2±0.15
16.51

3.7

15.65
1.27

40 x 0.9

0.9
13.1

3.7
17.5
5

10.5
PR1.5

0.

10.29
1.1
Ø

13.97 1.27 2.015

40 x 0.45 1.08 40 x 0.85

Top View Side View Bottom View

Figure 9: ESP32­S3­WROOM­1U Physical Dimensions

Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.

Espressif Systems 26 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1

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7 Physical Dimensions and PCB Land Pattern

7.2 Recommended PCB Land Pattern

Unit: mm
Via for thermal pad
Copper

18

RY7.49
Antenna Area

6
40 x1.5

1 40
0.9

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40 x0.9

0.5

25.5
16.51

3.7

IN
1.27
0.9

3.7
10.29

7.50
1.5
0.5

IM
15 26

0.5 1.27
2.015 2.015
EL

17.5

Figure 10: ESP32­S3­WROOM­1 Recommended PCB Land Pattern

PR

Espressif Systems 27 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1

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7 Physical Dimensions and PCB Land Pattern

Unit: mm
Via for thermal pad
Copper
18
40 x1.5

1 40
0.9

1.19

RY
40 x0.9

0.5
16.51

3.7

19.2
1.27
0.90
3.7

10.29
0.5
1.5

A
7.5

15 26
IN
0.5 1.27
2.015 2.015
IM
17.5

Figure 11: ESP32­S3­WROOM­1U Recommended PCB Land Pattern

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Espressif Systems 28 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1

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7 Physical Dimensions and PCB Land Pattern

7.3 Dimensions of External Antenna Connector

ESP32-S3-WROOM-1U uses the first generation external antenna connector as shown in Figure 12. This
connector is compatible with the following connectors:

• U.FL Series connector from Hirose

• MHF I connector from I-PEX

• AMC connector from Amphenol

Unit: mm

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Figure 12: Dimensions of External Antenna Connector

Espressif Systems 29 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1

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8 Product Handling

8 Product Handling

8.1 Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.

After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
/60%RH. If the above conditions are not met, the module needs to be baked.

8.2 Electrostatic Discharge (ESD)

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• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V

8.3 Reflow Profile

Solder the module in a single reflow.

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Temperature (℃)

IN
Peak Temp.
235 ~ 250 ℃
IM
250
Preheating zone Reflow zone Cooling zone
150 ~ 200 ℃ 60 ~ 120 s 217 ℃ 60 ~ 90 s –1 ~ –5 ℃/s
217
200
Soldering time
> 30 s
EL

Ramp-up zone
1 ~ 3 ℃/s
100

50
PR

25
Time (sec.)
0
0 50 100 150 200 250

Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s

Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy

Figure 13: Reflow Profile

Espressif Systems 30 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1

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9 Related Documentation and Resources

9 Related Documentation and Resources

Related Documentation
• ESP32-S3 Technical Reference Manual – Detailed information on how to use the ESP32-S3 memory and peripherals.
• ESP32-S3 Series Datasheet – Specifications of the ESP32-S3 hardware.
• Certificates
http://espressif.com/en/support/documents/certificates
• Documentation Updates and Update Notification Subscription
http://espressif.com/en/support/download/documents

Developer Zone

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• ESP-IDF and other development frameworks on GitHub.
http://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
http://esp32.com/

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• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
http://medium.com/the-esp-journal
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
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http://espressif.com/en/support/download/sdks-demos

Products
• ESP32-S3 Series SoCs – Browse through all ESP32-S3 SoCs.
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http://espressif.com/en/products/socs?id=ESP32-S3
• ESP32-S3 Series Modules – Browse through all ESP32-S3-based modules.
http://espressif.com/en/products/modules?id=ESP32-S3
• ESP32-S3 Series DevKits – Browse through all ESP32-S3-based devkits.
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http://espressif.com/en/products/devkits?id=ESP32-S3
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
http://products.espressif.com/#/product-selector?language=en

Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
PR

(Online stores), Become Our Supplier, Comments & Suggestions.

http://espressif.com/en/contact-us/sales-questions

Espressif Systems 31 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1

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Revision History

Revision History

Date Version Release notes

2021-07-19 v0.5.1 Preliminary release, for chip revision 0

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Espressif Systems 32 ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1

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