Development of Low-Loss Broad-Band Planar Baluns
Development of Low-Loss Broad-Band Planar Baluns
Abstract—
Index Terms—
A. Bandwidth Calculation
Based on the above assumptions, the bandwidth of the TEM
balun has been traditionally calculated [12] by matching with
the source impedance
(1)
where is the impedance looking into the balun at the gap point,
as shown in Fig. 1, and is the sum of the load impedances
and . The bandwidth can also be found from an explicit
expression of derived from the TEM model of the balun
(2a)
(7a)
Fig. 6. Maximum in-band phase imbalance versus " for the broadside
coupled balun. Simulation conditions are the same as those used for generating
(7b) Fig. 4.
Fig. 9. Detailed network model for the multilayered microstrip balun. The model is based on normal mode and physical parameters (Z = 166 ; =
3 ;L = 0:01 nH, and L = 0:03 nH).
Fig. 10. Fabricated: (a) single balun and (b) pair of back-to-back connected
baluns.
B. Time-Domain Measurement
Phase distortion or, equivalently, dispersion across the balun
will cause distortion of signals passing through it even as a linear
device. Taking the derivative of from (2a)–(2c) with re-
spect to frequency leads to a nonzero result, indicating a non-
linear phase response and a certain amount of phase distortion
even for the ideal TEM balun. The amount of phase distortion
is greatest at the lower and higher ends of the passband.
The amount of dispersion can be calculated from the group
delay data taken during the -parameter frequency-domain
Fig. 12. Measured and modeled amplitude and phase imbalances of a single
balun. measurements. Group delay, also known as signal delay and
envelope delay, can be written as
TABLE I
PARAMETERS USED IN DETAILED MODEL OF THE BALUN
(8)
where is the amount of phase delay over the signal path. Phase
constant is the amount of phase change per unit length, and is
expressed as
(9)
(10)
(11)
(12)
For small values of GVD and short path lengths of a balun, the
amount of Gaussian pulse widening of signals passing through
Fig. 13. Measured bandwidth and insertion-loss comparison between a single the balun is expected to be nearly zero. Dispersion characteris-
and twin-thickness thin-film balun. BCB thickness used for the single- and tics and distortion [17] were also confirmed through time-do-
twin-thickness baluns are 10 and 20 m, respectively.
main measurements to be compared with those predicted and
calculated by frequency-domain measurements (Fig. 14). The
Amplitude and phase imbalance of the balun are directly measurement setup consists of an Agilent E8267C PSG vector
calculated from the measured three-port -parameters of signal generator to generate a Gaussian-like modulated pulse
a single balun. The amplitude imbalance is calculated as input signal into the unbalanced port with the balanced port out-
- , and is smaller than 0.5 dB for 4–20 GHz, puts sampled by an HP 54750A digitizing oscilloscope. The sig-
as shown in Fig. 12. The phase imbalance is calculated as nals have a center frequency swept from 4 to 20 GHz, modulated
180 , and is shown to be less than 5 . by the Gaussian-like pulse. The output waveforms are compared
The measured and modeled phase and amplitude imbalances to that of a short through line in substitute of the balun under test.
are correlated. Table I lists the parameters used in the detailed The GVD can be back calculated by substituting the difference
model for the modeled results plotted out in Figs. 11 and value back into (12). Time-domain measurement waveforms are
12. Fig. 13 compares the insertion loss of a balun using twin plotted out as shown in Fig. 15, indicating an indistinguishable
thin-film thickness versus that using a single thickness. A amount of pulse widening and near-zero dispersion.
3654 IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 53, NO. 11, NOVEMBER 2005
ACKNOWLEDGMENT
The authors wish to thank the reviewers of this paper for
their helpful comments. The authors would also like to thank
Prof. A. Knoesen and Q. Chen, both with the Department of
Electrical and Computer Engineering, University of California
at Davis, for their assistance in the time-domain measurements.
Fig. 14. Group delay and dispersion characteristics predicted from
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The low insertion loss was achieved by the usage of wide
metal traces. Low-cost printed circuit dielectric materials with
similar dielectric constants were selected to equalize the - and Andy C. Chen (M’97) received the B.S. degree in electro-physics from Na-
-mode phase velocities and preserve a wide bandwidth. Low tional Chiao-Tung University, Taiwan, R.O.C., in 1997, the M.S. degree in elec-
trical engineering from San Jose State University, CA, in 2001, and is currently
amplitude and phase imbalances of 0.5 dB and 5 were achieved working toward the Ph.D. degree at the University of California at Davis.
through the usage of the multilayered broadside coupled mi- From 1997 to 2003, he was with Atelic Systems Inc., San Jose, CA, as a main
crostrip lines, suppressing the -mode wave propagation within CMOS Design Engineer involved in the development of mixed-signal integrated
circuits (ICs) and digital signal processors (DSPs). His current research interests
the transmission lines. The in-band phase imbalance is con- include RF integrated circuit (RFIC), microwave, and high-speed digital circuit
cluded to be lower for baluns using broadside coupled lines design and packaging.
CHEN et al.: DEVELOPMENT OF LOW-LOSS BROAD-BAND PLANAR BALUNS USING MULTILAYERED ORGANIC THIN FILMS 3655
Anh-Vu Pham (SM’03) received the B.E.E. (with highest honors), M.S., and Robert E. Leoni III (M’98) received the B.S. degree in electrical engineering,
Ph.D. degrees from the Georgia Institute of Technology, Atlanta, in 1995, 1997, B.S. degree in physics, and M.S., and Ph.D. degrees in electrical engineering
and 1999, respectively. from Lehigh University, Bethlehem, PA, in 1992, 1993, 1995, and 1998, re-
In 1997, he cofounded RF Solutions LLC, an RFIC company that was ac- spectively.
quired by Anadigics in 2003. He has held faculty positions with Clemson Uni- He is currently a Senior Scientist with the RF Components Division,
versity and the University of California at Davis, where he is currently an Asso- Raytheon Company, Andover, MA. He has authored or coauthored over 30
ciate Professor. He is also an active consultant to industry. He has authored or technical papers. He was the editor of High Performance Devices—Proceedings
coauthored over 50 technical journal and conference papers. His research inter- of the 2004 IEEE Lester Eastman Conference.
ests are in the area of RF and high-speed packaging and signal integrity, RFIC
design, and wireless sensors.
Dr. Pham serves as a member of the IEEE Microwave Theory and Techniques
Society (IEEE MTT-S) International Microwave Symposium (IMS) Technical
Program Committee (TPC) on Power Amplifiers and Integrated Circuits. He
has been the chair of the IEEE MTT-12 Microwave and Millimeter Wave Pack-
aging and Manufacturing Technical Committee of the IEEE MTT-S. He was
the recipient of the 2001 National Science Foundation CAREER Award on mil-
limeter-wave organic packaging.