ZT3L Module Datasheet

Hardware Product Development > Network Modules > Zigbee Module

> ZT Series Module

Version: 20210108

Online Version
 Contents

Contents

1 Product overview 2
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2 Module interfaces 3
2.1 Dimensions and package . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3 Electrical parameters 9
3.1 Absolute electrical parameters . . . . . . . . . . . . . . . . . . . . . 9
3.2 Normal working conditions . . . . . . . . . . . . . . . . . . . . . . . 9
3.3 TX and RX power consumption . . . . . . . . . . . . . . . . . . . . . 10
3.4 Working current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4 RF parameters 11
4.1 Basic RF features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2 TX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3 RX performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5 Antenna information 13
5.1 Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2 Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . 13

6 Packaging information and production instructions 14

6.1 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.2 Side view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.3 The schematic diagram of a packaging . . . . . . . . . . . . . . . . . 15
6.4 The diagram of PCB packaging-pin header . . . . . . . . . . . . . . . 15
6.5 Production instructions . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.6 Recommended oven temperature curve . . . . . . . . . . . . . . . . . 19
6.7 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7 MOQ and packaging information 21

i
 Contents

8 Appendix: Statement 21

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 Contents

ZT3L is a low-power embedded Zigbee module that Tuya has developed. It consists
of a highly integrated RF processing chip (TLSR8258F1KAT32), a few peripherals, a
built-in 802.15.4 PHY/MAC Zigbee network protocol stack, and rich library functions.
ZT3L is embedded with a low-power 32-bit CPU, 1-MB flash program memory, a 64-
KB RAM, and abundant peripheral resources.

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 1 PRODUCT OVERVIEW

1 Product overview

ZT3L is a FreeRTOS platform that integrates all function libraries of the Zigbee MAC
and TCP/IP protocols. You can develop embedded Zigbee products as required.

1.1 Features

• Embedded with low-power 32-bit CPU and ARM Cortex-M33 processor

• The clock rate: 48 MHz
• Wide working voltage: 1.8 to 3.6 V
• Peripherals: 9 general-purpose input/output (GPIO), 1 universal asynchronous
receiver/transmitter (UART), and 1 analog-to-digital converter (ADC)
• Zigbee connectivity

– Support 802.15.4 MAC/PHY

– Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250
Kbps
– Up to +10dBm output power and dynamic output power > 35 dB
– The terminal equipment connects to the network actively.
– Built-in onboard PCB antenna, Ipex connector reserved
– Onboard PCB antenna with a gain of 3.09 dBi
– Working temperature: -40℃ to 125℃
– Support hardware encryption and AES 128

1.2 Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

1.3 Change history

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 2 MODULE INTERFACES

Version after
Date Updated content update

11/24/2020 This is the first V1.0.0

release.

2 Module interfaces

2.1 Dimensions and package

ZT3L has two rows of pins with a 2±0.1 mm pin spacing.

The ZT3L dimensions are 24±0.35 mm (L)×16±0.35 mm (W) ×2.8±0.15 mm (H).

The dimensions of ZT3L are as follows:

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 2 MODULE INTERFACES

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 2 MODULE INTERFACES

2.2 Pin definition

Pin number Symbol I/O type Function

1 RST I Hardware reset

pin; by default,
high level; active
low

2 C4 I/O ADC pin, which

corresponds to C4
(Pin 24) on the
internal IC

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 2 MODULE INTERFACES

Pin number Symbol I/O type Function

3 EN I The enabling pin

and the RST pin
are connected
together and a
pull-up resistor is
connected to
them inside the
module.

4 D7 I/O Common I/O pin,

which
corresponds to D7
(Pin 2) on the
internal IC

5 D2 I/O Support hardware

PWM and
correspond to D2
(Pin 31) on the
internal IC

6 C3 I/O Support hardware

PWM and
correspond to C3
(Pin 23) on the
internal IC

7 C2 I/O Support hardware

PWM and
correspond to C2
(Pin 22) on the
internal IC

8 3V3 P Power supply pin

of the module
(The typical
power supply
voltage: 3.3V

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 2 MODULE INTERFACES

Pin number Symbol I/O type Function

9 GND P Power supply

reference ground

10 C0 I/O Common I/O pin,

which
corresponds to C0
(Pin 20) on the
internal IC

11 D4 I/O Common I/O pin,

which
corresponds to D4
(Pin 1) on the
internal IC

12 A0 I/O Common I/O pin,

which
corresponds to A0
(Pin 3) on the
internal IC

13 B4 I/O Support hardware

PWM and
correspond to B4
(Pin 14) on the
internal IC

14 B5 I/O Support hardware

PWM and
correspond to B5
(Pin 15) on the
internal IC

15 RXD I/O Uart_RXD, which

corresponds to B7
(Pin 17) on the
internal IC

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 2 MODULE INTERFACES

Pin number Symbol I/O type Function

16 TXD I/O Uart_TXD, which

corresponds to B1
(Pin 6) of the IC

17 SWS I/O Burning pin,

which
corresponds to
SWS (Pin 5) on
the internal IC

Note: P indicates a power supply pin and I/O indicates an input/output pin.

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 3 ELECTRICAL PARAMETERS

3 Electrical parameters

3.1 Absolute electrical parameters

Minimum Maximum
Parameter Description value value Unit

Ta Working -40 125 ℃

temperature

VBAT Power supply 1.8 3.6 V

voltage

Static TAMB-25℃ - 2 KV
electricity
discharge
voltage
(human body
model)

Static TAMB-25℃ - 0.5 KV

electricity
discharge
voltage
(machine
model)

3.2 Normal working conditions

Minimum Typical Maximum

Parameter Description Value Value Value Unit

Ta Working -40 - 125 ℃

tempera-
ture

VCC Working 1.8 3.3 3.6 V

voltage

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 3 ELECTRICAL PARAMETERS

Minimum Typical Maximum

Parameter Description Value Value Value Unit

VIL I/O low - - VDD*0.3 V

level input

VIH I/O high VDD*0.7 - - V

level input

VOL I/O low - - VDD*0.2 V

level
output

VOH I/O high VDD*0.8 - - V

level
output

3.3 TX and RX power consumption

Peak
Transmit value
Working power/re- Average (Typical
status Mode Rate ceive value value)) Unit

Transmit - 250 Kbps +10 dBm 18 38 mA

Transmit - 250 Kbps +0 dBm 6 34 mA

Receive - 250 Kbps Constantly 5.3 38 mA

receive

3.4 Working current

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 4 RF PARAMETERS

Working Maximum
Working status, Ta = Average value (Typical
mode 25°C value value) Unit

Quick The module is 3 34 mA

connection in the fast
network state network
connection
state

Network The module is 6 38 mA

connection connected to
state the network

Deep sleep Deep sleep 1.4 - uA

mode mode,
reserve 32-KB
SRAM

4 RF parameters

4.1 Basic RF features

Parameter Description

Working frequency 2.405 to 2.480 GHz

Zigbee standard IEEE 802.15.4

Data transmission rate 250 Kbps

Antenna type PCB antenna with a gain of 3.09 dBi,

ipex optional

4.2 TX performance

TX performance

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 4 RF PARAMETERS

Minimum Maximum
Parameter value Typical value value Unit

Maximum - 10 - dBm
output power
(250Kbps)

Minimum - -25 - dBm

output power
(250Kbps)

Output power - 0.5 1 dBm

adjustment
stepping

Output - -31 - dBc

spectrum
adjacent
channel
suppression

Frequency -15 - 15 ppm

error

4.3 RX performance

RX sensitivity

Minimum Maximum
Parameter value Typical value value Unit

PER<8%, RX -102 -101 -99 dBm

sensitivity
(250 Kbps)

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 5 ANTENNA INFORMATION

5 Antenna information

5.1 Antenna type

ZT3L only uses the onboard PCB antenna.

5.2 Antenna interference reduction

To ensure the optimal Wi-Fi performance when the Zigbee module uses an onboard
PCB antenna, it is recommended that the antenna be at least 15 mm away from
other metal parts.

To prevent an adverse impact on the antenna radiation performance, avoid copper

or traces along the antenna area on the PCB.

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 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

6 Packaging information and production instructions

6.1 Mechanical dimensions

The PCB dimensions are 24±0.35 mm (L)×16±0.35 mm (W) ×2.8±0.15 mm (H).

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 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

6.2 Side view

6.3 The schematic diagram of a packaging

6.4 The diagram of PCB packaging-pin header

ZT3L can choose SMT placement or pin header plug-in. The dimensions of the plug-
in are as follows:

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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

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 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

6.4.1 PCB packaging diagram-SMT

6.5 Production instructions

1. Mount Tuya’s stamp hole package module with an SMT machine within 24 hours
after unpacking and burning the firmware. Otherwise, the module must be
packaged again under vacuum. The module must be baked before mounting.

• SMT equipment:
– Reflow soldering machine
– Automated optical inspection (AOI) equipment
– Nozzle with a 6 to 8 mm diameter

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 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

• Baking equipment:
– Cabinet oven
– Anti-static heat-resistant trays
– Anti-static heat-resistant gloves

2. Storage conditions for a delivered module are as follows:

• The moisture-proof bag must be placed in an environment where the tem-

perature is below 30°C and the relative humidity is lower than 70%.
• The shelf life of a dry-packaged product is 6 months from the date when
the product is packaged and sealed.
• The package contains a humidity indicator card (HIC).

3. Bake a module based on HIC status as follows when you unpack the module
package:

• If the 30%, 40%, and 50% circles are blue, bake the module for 2 consec-
utive hours.
• If the 30% circle is pink, bake the module for 4 consecutive hours.
• If the 30% and 40% circles are pink, bake the module for 6 consecutive
hours.
• If the 30%, 40%, and 50% circles are pink, bake the module for 12 consec-
utive hours.

4. Baking settings:

• Baking temperature: 125±5°C

• Alarm temperature: 130°C
• SMT ready temperature: naturally cooling temperature: < 36°C
• The number of drying times: 1
• Rebaking condition: The module is not soldered within 12 hours after bak-
ing.

5. Do not use SMT to process modules that have been unpacked for more than
3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs

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 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

and they are seriously oxidized for over 3 months. SMT is very likely to cause
pseudo and missing soldering. Tuya is not liable for such problems and conse-
quences.

6. Before using SMT, take electrostatic discharge (ESD) protective measures.

7. To reduce the reflow defect rate, draw 10% of the products for visual inspection
and AOI before the first mounting, to determine the rationality of oven temper-
ature control and component attachment and placement manners. Draw 5 to
10 modules from subsequent batches each hour for visual inspection and AOI.

6.6 Recommended oven temperature curve

Perform SMT based on the following reflow oven temperature curve. The highest
temperature is 245°C. The reflow temperature curve is as below:

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 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS

6.7 Storage conditions

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 8 APPENDIX: STATEMENT

7 MOQ and packaging information

Shipping The number The number

Product packaging of modules of reels per
number MOQ (pcs) method per reel carton

ZT3L 4000 Tape reel 1000 4

8 Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class
B digital device, according to part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if
not installed and used following the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which
can be determined by turning the device off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled

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 8 APPENDIX: STATEMENT

rolled environment. This device should be installed and operated with a minimum
distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously
with other radios in the host system except following FCC multi-transmitter product
procedures. Additional testing and device authorization may be required to operate
simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are
country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC
rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing
with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as

shown in this manual, including “This product must be installed and operated with
a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-ZT3L. The end product must be labeled in a vis-
ible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZT3L”.

This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna
and users, and 2) The transmitter module may not be co-located with any other
transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product
for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module
product is in compliance with essential requirements and other relevant provisions

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 8 APPENDIX: STATEMENT

of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be

found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with
the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU).
Instead, it should be disposed of by returning it to the point of sale, or to a municipal
recycling collection point.

The device could be used with a separation distance of 20cm to the human body.

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