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DDR4 - MODULE - Part Number Decoder - May 2019

The document provides specifications for SK Hynix DRAM memory products, detailing various product families, speeds, densities, and module types. It includes information on operating temperature, data width, and package types, as well as die generations. The document serves as a comprehensive guide for understanding the features and classifications of SK Hynix memory products.

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0% found this document useful (0 votes)
185 views1 page

DDR4 - MODULE - Part Number Decoder - May 2019

The document provides specifications for SK Hynix DRAM memory products, detailing various product families, speeds, densities, and module types. It includes information on operating temperature, data width, and package types, as well as die generations. The document serves as a comprehensive guide for understanding the features and classifications of SK Hynix memory products.

Uploaded by

ryrutdavis2
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Last updated: May.

2019

H M A X XX X X X X X X X - XX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

SK Hynix MEMORY

PRODUCT FAMILY
M : DRAM MODULE SPEED(tCL-tRCD-tRP)
UH : DDR4-2400 17-17-17
UL : DDR4-2400 20-18-18
PRODUCT MODE VK : DDR4-2666 19-19-19
VN : DDR4-2666 22-19-19
A : DDR4 SDRAM WM : DDR4-2933 21-21-21
WR : DDR4-2933 24-21-21
XN : DDR4-3200 22-22-22
COMPONENT DENSITY XS : DDR4-3200 26-22-22

4 : 4Gb
8 : 8Gb
A : 16Gb OPERATING TEMPERATURE & VDD
B : 32Gb
N : Commercial Temp(0°C ~ 85°C) &
C : 64Gb 1.2V
MEMORY DEPTH
51 : 512Mb
1G : 1Gb
2G : 2Gb
4G : 4Gb
8G : 8Gb
AG : 16Gb
BG : 32Gb

ORGANIZATION
MODULE TYPE 4 : x4
8 : x8
U : 288 pin Unbuffered DIMM
6 : x16
S : 260 pin Small Outline DIMM
R : 288 pin Registered DIMM
L : 288 pin Load Reduction DIMM
PACKAGE MATERIAL
R : Lead Free & Halogen Free
DATA WIDTH & MODULE HEIGHT
(RoHS Compliant)
6 : x64/LP 7 : x72/LP
1 : x64/VLP 8 : x72/VLP
2 : x64/ULP 9 : x72/ULP
PACKAGE TYPE

F : FBGA
DIE GENERATION
J : Flipchip SDP
M : 1st D : 5th B : CoC DDP
A : 2nd E : 6th M : FBGA DDP
B : 3rd F : 7th P : Flipchip Planar DDP
C : 4th G : 8th 2 : TSV 2 high stack
4 : TSV 4 high stack

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