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En Product-Information Xradia Context MicroCT Rel1-2

The ZEISS Xradia Context microCT is a large field-of-view, nondestructive 3D X-ray imaging system designed for diverse applications in research and industry, offering high resolution and efficient workflows. Built on the proven Xradia platform, it ensures excellent image quality and allows for future upgrades, including conversion to an X-ray microscope. Key features include advanced reconstruction technologies, automated sample handling, and the capability for in situ 4D imaging, enhancing its versatility and usability.
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0% found this document useful (0 votes)
6 views19 pages

En Product-Information Xradia Context MicroCT Rel1-2

The ZEISS Xradia Context microCT is a large field-of-view, nondestructive 3D X-ray imaging system designed for diverse applications in research and industry, offering high resolution and efficient workflows. Built on the proven Xradia platform, it ensures excellent image quality and allows for future upgrades, including conversion to an X-ray microscope. Key features include advanced reconstruction technologies, automated sample handling, and the capability for in situ 4D imaging, enhancing its versatility and usability.
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 19

Your 3D X-ray System

for Today with Assurance


for Tomorrow
ZEISS Xradia Context microCT
Your X-ray System for Today with Assurance for Tomorrow

› In Brief
The ZEISS X-ray imaging portfolio is expanding with the
introduction of Xradia Context microCT, a large field of
› The Advantages
view, nondestructive 3D X-ray micro-computed tomography
› The Applications system. ZEISS Xradia Context is your imaging solution
› The System for a variety of 3D characterization and inspection needs,
spanning from large intact samples to reveal interior
› Technology and Details
details in their full 3D context, as well as small samples
› Service
at maximum geometric magnification to resolve fine
features with high resolution and high contrast. Built on
the proven ZEISS Xradia platform, Xradia Context provides
you with superb image quality, stability, and usability,
along with an efficient workflow environment and high
throughput scanning. Enter the ZEISS Xradia ecosystem
with a robust X-ray system to address your needs today,
and receive assurance for tomorrow through future
upgrades or field conversion of your Xradia Context
microCT to an Xradia Versa X-ray microscope.

2
Simpler. More Intelligent. More Integrated.

Full Context 3D Imaging Guaranteed Data Quality Based on Extendable with Options and
› In Brief
Proven Xradia Platform Convertible to an X-ray Microscope
› The Advantages ZEISS Xradia Context is a large field-of-view, non- ZEISS Xradia Context provides superb data quality ZEISS is committed to protecting its customer's
destructive 3D X-ray microcomputed tomography for a range of 3D imaging needs and is built upon investment in X-ray imaging technology by
› The Applications
system built to address a wide spectrum of the same base platform as the highly-regarded providing extendibility of systems in the field.
› The System imaging needs in research and industrial appli- Xradia Versa series of X-ray microscopes. As a Xradia Context now joins this family and pro-
cations. With a robust stage, flexible software- result, Xradia Context microCT receives the benefit vides 3D tomographic imaging that’s ready to
› Technology and Details
controlled source/detector positioning, and a of years of developments and technological grow with your needs. Upgrade your system with
› Service large array detector, you can scan entire objects advancements targeted at ensuring unprecedent- Autoloader for the automated handling and scan-
or devices to reveal interior details in their full 3D ed system stability and continuous improvement ning of up to 14 samples without intervention.
context. Further extend your field of view with in high resolution, high quality data acquisition Or add the In Situ Interface Kit and load stages to
integrated vertical stitching functionality. Maxi- and reconstruction. Use a selection of filters to investigate material evolution in 4D. And as your
mize geometric magnification with small samples tune the X-ray beam specifically for your sample. applications move beyond the limits of microCT,
to identify and characterize micron-scale struc- Experience the same workflow-based efficiency Xradia Context can be converted in the field to an
tures with high contrast and clarity. From sample with Scout-and-Scan control software. Advanced Xradia 510 Versa + FPX X-ray microscope, offering
mounting to scan preparation, acquisition, reconstruction technologies powered by iterative unmatched flexibility and performance in spatial
multiGPU reconstruction, and image processing and artificial intelligence algorithms help further resolution and advanced contrast and acquisition
and analysis, experience an efficient high through- enhance image quality and throughput with methods.
put workflow that gets you to results quickly. optional ZEISS OptiRecon and DeepRecon
modules.

3
Your Insight into the Technology Behind It

Full Context 3D Imaging for


› In Brief
Samples Both Large and Small
› The Advantages Using a large array, 6MP flat panel detector,
Xradia Context can image large samples up to
› The Applications
140 mm wide and 93 mm tall in a single scan.
› The System Further extend this field of view using automated
stitching, providing up to 165 mm vertically.
› Technology and Details
Image large samples and devices nondestructively
› Service to evaluate internal structures, ideal for quality
control, failure analysis, or inspection tasks.
The high pixel density 3k x 2k detector with small
pixel sizes ensures resolution even at relatively
large fields of view. With short exposure times
and multiGPU fast reconstruction, you can
collect scans and get to 3D data quickly.

Maximize geometric magnification by working


with small samples at short working distances,
enabling you to identify and characterize fine fea-
tures like cracks, voids, or impurities within your
samples at sub-micron resolution.

Through nondestructive X-ray imaging, you pre-


serve your samples for future use or experimen-
tation, or further microscopic investigaton using
20 mm
complementary but destructive techniques like
cross-sectional optical or electron microscopy. 3D scan of an intact catalytic converter. Virtual cross sections allow investigation of the interior structure.

4
Your Insight into the Technology Behind It

Image Quality Based on the Proven


› In Brief
Xradia Platform
› The Advantages Excellent data quality relies on a number
of factors including source characteristics,
› The Applications
beam energy tuning, detector geometry and
› The System sensitivity, environmental control, motion and
vibrational stability, careful system calibration, 100 µm
› Technology and Details
and reconstruction accuracy. To address these
› Service challenges, Xradia Context microCT is built
on the same platform as the proven Xradia Versa
X-ray microscope series, inheriting the same Achieve high resolution on small samples, such as this 3D reconstruction of an aged lithium ion battery cathode.
Sample courtesy of: Prof. D. U. Sauer and Prof. E. Figgemeier, ISEA, RWTH Aachen University
stabilization mechanisms and data quality
advancements that helped Xradia Versa set
the standard in high performance 3D X-ray
imaging in the laboratory. Experience excellent
contrast and image clarity, enabling easy
differentiation of different phases and features
to support downstream segmentation and
quantification of your data.

Advantages
• Superior high purity X-ray filters (three materials,
varying thicknesses) to match samples for beam
hardening control
• Enhanced automated drift correction modes
• Advanced beam hardening reduction algorithms
100 µm
• Additional proprietary advanced algorithms
to ensure optimal image quality
Virtual cross section through a heterogeneous rock sample

5
Your Insight into the Technology Behind It

A Closer Look at Spatial Resolution


› In Brief
ZEISS microCT and X-ray microscopy systems Other terms such as “voxel,” “spot size,” Therefore, to provide an indication of the
› The Advantages are specified on true spatial resolution, the most “detail detectability,” and “nominal resolution” operating space, Xradia Context also specifies
meaningful measurement of your instrument’s do not convey your system's full performance. the achievable voxel size at different working
› The Applications
performance. distances.
› The System Xradia Context microCT specifies spatial resolu-
Spatial resolution refers to the minimum separa- tion at short source-sample working distance As the leader in X-ray imaging, ZEISS provides
› Technology and Details
tion at which your imaging system can resolve indicative of results for a very small sample, this transparency to true system performance.
› Service a feature pair. You would typically measure it by as is practice in the industry. For larger working
imaging a standardized resolution target with distances/samples, all CT and microCT systems
progressively smaller line-space pairs. Spatial relying on a projection-based architecture
resolution accounts for critical characteristics such will have magnification that is strongly dependent
as X-ray source spot size, detector resolution, on the working distance (in contrast to X-ray
magnification geometry, and vibrational, electrical microscopy, where spatial resolution is not
and thermal stability. strongly dependent on working distance).

Imaging Specifications
Spatial Resolution [a] 0.95 μm
Minimum Achievable Voxel [b] 0.5 µm
Achievable Voxel at Working Distance [b,c] 0.5 µm / 0.5 mm
0.8 µm / 2.5 mm
2.5 µm / 12.5 mm
4.0 µm / 25 mm
12.1 µm / 100 mm ZEISS Xradia resolution target, used to evaluate sub-micron
spatial resolution. Minimum voxel size of 0.5 μm.
[a] Spatial resolution measured with ZEISS Xradia 2D resolution target.
[b] Voxel is a geometric term that contributes to but does not determine resolution, and is provided here only for comparison.
ZEISS specifies resolution via spatial resolution, the true overall measurement of instrument resolution.
[c] Working distance defined as clearance around axis of rotation. This value can be interpreted as the radius of the sample.

6
Your Insight into the Technology Behind It

Simple Control System to Create


› In Brief
Efficient Workflows
› The Advantages All of the features of ZEISS Xradia Context are
seamlessly integrated within the Scout-and-Scan
› The Applications
Control System, an efficient workflow environ-
› The System ment that provides full control over the system
hardware and allows you to easily position a re-
› Technology and Details
gion of interest, specify scanning parameters, and
› Service begin scans. The easy-to-use interface is ideal for
a central lab-type setting where your users may
have a wide variety of experience levels, enabling
even novice users to begin collecting data quickly.
The interface maintains the flexibility for which
Xradia systems are known, enabling you to
set-up scans with ease and with recipe-based
repeatability, especially useful for your in situ
and 4D research or repetitive sample scanning.

Workflow-based Scout-and-Scan control system

Advantages
• Internal camera for sample viewing • Easy set-up to stich multiple scans of
• Smart positioning sample navigation stage large objects with vertical stitching
to easily position your region of interest • Automated reconstruction
on the tomography rotation axis • Collision avoidance for system set-up,
• Recipe control (set, save, recall) to enable custom models, and disable feature
multiple scans with different parameters for highest resolution scans
allowing batch mode • Integrated in situ recipe control for
Deben chambers

7
Your Insight into the Technology Behind It

Simplify Your Sample Setup for a


› In Brief
Delightful Instrument Experience
› The Advantages Maximize your instrument’s capabilities with SmartShield wizard helps the user create a protec-
SmartShield. An automated collision avoidance tive digital shield that helps operators choose
› The Applications
system that works within Scout and Scan to the right scan parameters with confidence.
› The System create a digital envelope to protect the sample SmartShield brings you closer to the optimum
and microscope, enabling faster setup and scan parameters more quickly to get the best
› Technology and Details
enhanced navigation of your Xradia Context. results fast.
› Service

8
Your Insight into the Technology Behind It

Advanced Reconstruction Toolbox ZEISS DeepRecon ZEISS OptiRecon


› In Brief
The Advanced Reconstruction Toolbox is an The first commercially available deep learning A fast and efficient algorithm-based technology
› The Advantages innovative platform on which you can con- reconstruction technology enables you to increase that delivers iterative reconstruction from your
tinuously access advanced reconstruction tech- throughput by an order of magnitude (up to 10×) desktop,allowing you to achieve up to 4× faster
› The Applications
nologies from ZEISS to enrich your research for repetitive workflow applications. scan times or enhanced image quality at similar
› The System and increase the return on investment of your DeepRecon uniquely harvests the hidden oppor- throughput. OptiRecon offers superior interior
ZEISS Xradia Context microCT. These unique tunities in big data generated by your XRM and tomography or throughput on a broad class of
› Technology and Details
offerings from ZEISS leverage deep understanding provides significant AI-driven speed or image samples.
› Service of both X-ray physics and customer applications quality improvement.
to solve some of the hardest imaging challenges
in new and innovative ways. These optional
modules are workstation-based solutions that
provide easy access and usability.

FDK OptiRecon DeepRecon


Standard Iterative Deep-Learning
Analytical Reconstruction based
Reconstruction ReconstructioN

Throughput 1× up to 4× up to 10×
Image Quality* Standard Better Best
Applicability Repetitive and Repetitive and Repetitive
non-repetitive non-repetitive workflows
workflows workflows
* Image quality refers to the contrast-to-noise ratio and the relative performance
of reconstruction technologies is shown.

5 mm 5 mm

DeepRecon offers superior imaging and up to 10× greater Standard reconstruction OptiRecon
throughput on repetitive workflow samples. Scan time: 3.5 hours (2880 projections) Scan time: 50 minutes (720 projections)
OptiRecon offers improved imaging and up to 4× greater
throughput on a wide variety of samples.
Carburetor assembly
OptiRecon enables 4× throughput at acceptable image quality compared to standard reconstruction

9
Expand Your Possibilities

In Situ Kit – Advancing Discovery Autoloader – Increase Your Sample


› In Brief
with 4D Imaging Handling Efficiency
› The Advantages Moving beyond the three dimensions of Maximize your instrument’s utilization by
space, leverage the nondestructive nature of minimizing user intervention with the optional
› The Applications
X-ray investigation to extend your studies into Autoloader, available for ZEISS Xradia Context
› The System the dimension of time with 4D experiments. microCT and ZEISS Xradia Versa X-ray micro-
Xradia Context can accommodate a variety scopes. Reduce the frequency of user interaction
› Technology and Details
of in situ rigs, from high pressure flow cells and increase productivity by enabling multiple
› Service to tension, compression and thermal jobs to run unattended. Load up to 14 samples,
stages, to user-customized designs. You can queue, and allow to run all day, or off-shift.
add the optional In Situ Interface Kit to The software provides you with the flexibility to
ZEISS Xradia Context microCT and ZEISS Xradia re-order or stop the queue to insert a high priority
Versa XRM instruments, which includes a sample at any time. An e-mail notification feature
mechanical integration kit, a robust cabling in the Scout-and-Scan user interface provides
guide and other facilities (feed-throughs) along timely updates on queue progress. Autoloader Autoloader option enables you to program up to 14 samples
at a time to run sequentially
with recipe-based software that simplifies your also enables a workflow solution for high volume
control from within the Scout-and-Scan user repetitive scanning of like samples.
interface. When your needs require pushing
the resolution limits of your in situ experiments,
convert your Xradia Context to an Xradia 510
Versa X-ray microscope to leverage Resolution at
a Distance (RaaD) technology for the maximum
performance tomographic imaging of samples
within in situ chambers or rigs.

Note: Autoloader and In Situ Interface Kit are not simultaneously compatible

10
Expand Your Possibilities

3D Tomographic Imaging Key XRM Advantages of Converting from • Advanced acquisition methods including high
› In Brief
That’s Ready to Grow When You Are Context microCT to Xradia 510 Versa aspect ratio tomography (HART), Dual Scan
› The Advantages ZEISS Xradia Context provides high quality • Resolution at a Distance (RaaD) technology – Contrast Visualizer (DSCoVer) for dual energy
3D imaging for a wide variety of applications used to maintain high spatial resolution at scanning, wide field mode horizontal stitching,
› The Applications
spanning from academic research to industrial in- large working distances, valuable for imaging and OptiRecon for image acquisition in one
› The System spection and failure analysis. As your needs evolve the interior of large objects, multiscale fourth the time for “sparse“ geological-type
and higher resolution or advanced imaging modes scout-and-zoom workflows, or for samples samples
› Technology and Details
become a priority, your Xradia Context microCT is enclosed within in situ chambers
› Service ready to grow and meet your demands. ZEISS Xradia Context is the microCT system that
• Additional contrast modalities including protects your initial investment and provides
Xradia Context is the world’s only microCT system propagation phase contrast and optional assurance that you will continue to meet your
that can be converted in the field to an X-ray diffraction contrast tomography (LabDCT) growing needs well into the future.
microscope. When you convert your Xradia
Context to Xradia 510 Versa, you greatly extend
your imaging capabilities with all of the award-
winning ZEISS X-ray microscope differentiators.

Flat Panel FPX Flat Panel

Xradia Context microCT Xradia 510 Versa + FPX


X-ray Microscope Detector

Sample
Source Source
Sample

b b

a a
Optical Magnification
Geometric Magnification = ( a + b ) / a
Geometric Magnification = ( a + b ) / a

11
Expand Your Possibilities

ZEN Intellesis – Integrated, Easy to Use,


› In Brief
Powerful Segmentation
› The Advantages Segmentation is often the most challenging step
in extracting quantitative information from image
› The Applications
data. ZEISS ZEN Intellesis is a powerful machine
› The System learning image segmentation tool for both 2D
and 3D data. Simply load your image, define your
› Technology and Details
classes, label objects, train your model and check
› Service it, and segment. When you’re satisfied, you can
use your trained model to segment and ana-
lyze full datasets. Let ZEISS ZEN Intellesis do the
tedious processing so you can get back to your
research.

ZEISS ZEN Intellesis uses machine learning to make it easy to segment even your challenging 2D and 3D image data.
Dragonfly Pro – Your Visual Pathway
to Quantitative Answers
Dragonfly Pro is an advanced 3D visualization
and analysis software from Object Research
Systems (ORS). It is offered exclusively by ZEISS
for processing SEM, FIB-SEM, Helium-ion,
and XRM data. Using advanced visualization
techniques and state-of-the-art volume
rendering, Dragonfly Pro enables high defini-
tion exploration and quantification of the
details and properties of your sample. Align
multiple datasets within the same workspace,
easily manipulate your 2D and 3D data with
an extensive image processing feature set,
and precisely isolate and analyze specific
regions of interest within your data. Perform advanced 3D image processing and visualization tasks with ORS Dragonfly Pro.

12
Precisely Tailored to Your Applications

› In Brief Task ZEISS Xradia Context offers


Materials Research Characterize material features including pores, cracks, voids, and other subsurface defects Nondestructive views into interior microstructures not visible by
› The Advantages surface imaging methods such as optical or scanning electron
Analyze heterogeneity in composites and other multiphase functional materials microscopy
› The Applications
Visualize and quantify microstructural change with 4D imaging Segment and analyze data to obtain quantitative, 3D descriptions
of structure
› The System
Use nondestructive 3D datasets to identify regions of interest for further investigation
Perform 4D imaging through ex situ or in situ experiments to see
› Technology and Details how materials evolve, for example through mechanical load or
corrosion
› Service
Life Sciences Perform virtual histology on a range of sample sizes from clusters of cells to whole animals Image either stained or unstained hard and soft tissues and
biological microstructure
Expand your views in developmental biology with high resolution, high contrast images of
cellular structure Quick and nondestructive verification of sample staining
and location of features for subsequent imaging using 3D electron
Image large intact samples such as brains, large bones, and whole animals microscopy

Explore 3D organization of plants, from root networks in soil to stem and leaf structure

Analyze 3D structure of biomaterials and implants

Raw Materials Research the effect of processing variables to improve materials performance Export real 3D structures for physics simulations: predict materials
properties (mechanical, thermal, etc. ) or digital rock simulations
Characterize heterogeneity at core plug scale and quantify pore structures using non-destructive 3D tomography data

Perform failure analysis – identify the cause of failure and identify defects/inclusions Imaging, characterization, and modeling of rock cores (up to 4”)
for root cause identification with high throughput

Advance mining processes: analyze tailings to maximize mining efforts; conduct High contrast 3D imaging for in situ flow studies or 3D mineralogy
thermodynamic leaching studies; perform QA/QC of mining products such as
iron ore pellets

Manufacturing and Assembly 3D imaging of components and devices for inspection or failure analysis Accommodate a range of sample sizes including large objects in
their full 3D context
Optimize process development for electronics, automotive, and medical device industries
High throughput scanning of intact devices with fast time to results
Evaluate internal surface roughness of additive manufactured parts
Complement or replace physical cross sectioning and eliminate the
need to sacrifice your sample

13
ZEISS Xradia Context microCT at Work

› In Brief

› The Advantages

› The Applications

› The System

› Technology and Details

› Service

200 µm 5 mm

Evaluate orientation and distribution of fibers, defects, and Cutaway view of 3D rendering of a mouse embryo embedded
voids in carbon and glass fiber-reinforced polymer composites. in paraffin. Internal structures are visible with high contrast.
Sample courtesy of Massachusetts General Hospital.

100 µm 200 µm

Virtual cross section through a heterogeneous rock sample 3D imaging of the degradation of electrode particles and
revealing multiple phases and porosity current collector within a cycled and depackaged lithium ion
battery cathode. Sample courtesy of: Prof. D. U. Sauer and
Prof. E. Figgemeier, ISEA, RWTH Aachen University

14
Your microCT Imaging Solution

› In Brief 8 Autoloader Option (not pictured)


6 5 • Maximize productivity by reducing user intervention
10
› The Advantages 2
11
3
• Programmable handling of up to 14 samples
• Automated workflows for high volume, repetitive scanning
› The Applications 9
4 8
› The System 9 Sample Stage
• Smart positioning sample navigation stage for ROI targeting
› Technology and Details • 25 kg sample mass capacity

7
› Service 10 X-ray Filters
1
12 13
• Set of 13 filters to tune beam based on sample size and
density

11 In Situ and 4D Solutions


• Integrated in situ recipe control for Deben stages
1 X-ray microCT 5 System Flexibility for Diverse Range
• In Situ Interface Kit option (not pictured)
• Large field-of-view, non-destructive 3D X-ray of Sample Sizes
• Custom in situ flow interface kit by special order
microcomputed tomography system • Variable scanning geometry
• Tunable voxel sizes
12 Instrument Workstation
2 X-ray Source • Vertical stitching for joining multiple
• Powerful workstation with fast reconstruction
• High performance, spot-stabilized sealed transmission source tomographies vertically
• Dual NVIDIA CUDA-based GPU
(30 – 160 kV, maximum 10 W)
• Multi-core CPU
6 Smartshield for Sample Protection and
• 24” display monitor
3 Detector System Setup Optimization
• High speed, large array CMOS flat panel detector • Fully integrated rapid envelope creation within Scout-and-
13 Software
(3072 × 1944 pixels) for large field of view and high Scan control system
• Acquisition: ZEISS Scout-and-Scan Control System
throughput • Sample and instrument safety in 3D
• Reconstruction: ZEISS Xradia XMReconstructor
• Enhanced operator efficiency during experiment setup
• Viewer: XM3DViewer
4 System Stability for Highest Resolution
• Compatible with wide breadth of 3D viewers and analysis
• Granite base vibrational isolation 7 Advanced Reconstruction Toolbox
software programs
• Thermal environment stabilization for enhanced performance
• ZEISS ZEN Intellesis for image segmentation (optional)
• Low noise detector • Optional ZEISS OptiRecon for iterative reconstruction for opti-
• ORS Dragonfly Pro for 3D visualization and analysis (optional)
• Advanced proprietary stabilization mechanisms mized tomographic imaging on broad class of samples
• Optional ZEISS DeepRecon for deep learning-based recon-
struction for significant image quality/throughput improve-
ment in repetitive workflows

15
Technical Specifications

› In Brief Imaging
Spatial Resolution [a] 0.95 μm
› The Advantages Minimum Achievable Voxel [b] 0.5 µm
Achievable Voxel at Working Distance [b,c] 0.5 µm / 0.5 mm; 0.8 µm / 2.5 mm; 2.5 µm / 12.5 mm; 4.0 µm / 25 mm; 12.1 µm / 100 mm
› The Applications [a] Spatial resolution measured with ZEISS Xradia 2D resolution target. [b] Voxel is a geometric term that contributes to but does not determine resolution, and is provided here only for comparison. ZEISS specifies resolution via spatial resolution,
the true overall measurement of instrument resolution. [c] Working distance defined as clearance around axis of rotation. This value can be interpreted as the radius of the sample.

› The System
X-ray Source
Type Spot Stabilized, Sealed Transmission
› Technology and Details
Tube Voltage Range 30 – 160 kV
Maximum Output 10 W
› Service

Detector System
High Speed, Large Array CMOS Flat Panel 3072 ×️ 1944 pixels
Single Field of View (diameter / height) 140 mm / 93 mm
Maximum Field of View (diameter / height) 140 mm / 165 mm

Stages
Sample Stage (load capacity) 25 kg
Sample Stage Travel (x, y, z) 50, 100, 50 mm
Stage Travel (rotation) 360º
Source Travel (z) 190 mm
Detector Travel (z) 475 mm
Sample Size Limit 300 mm

16
Technical Specifications

› In Brief Additional Features


Scout-and-Scan Control System •
› The Advantages Absorption Contrast •
Vertical Stitching •
› The Applications GPU CUDA-based Reconstruction Dual
ZEISS SmartShield •
› The System Autoloader* Optional
In Situ Interface Kit* Optional
› Technology and Details ZEISS OptiRecon Optional
ZEISS DeepRecon Optional
› Service ZEISS ZEN Intellesis Optional
ORS Dragonfly Pro Optional
* Autoloader and In Situ Interface Kit cannot be installed simultaneously on the same system

Product Field Conversion


Field Conversion to Xradia 510 Versa + FPX X-ray Microscope Optional

X-ray Safety Standards


Safety Standards Compliance UL /CSA 61010-1, SEMI S2-0712, SEMI S8-0712, CE Mark
Radiation Safety (measured 25 mm above surface of enclosure) < 1 μS/hr (equivalent to 0.10 mRem/hr)

17
Count on Service in the True Sense of the Word

Because the ZEISS microscope system is one of your most important tools, we make sure it is always ready
› In Brief
to perform. What’s more, we’ll see to it that you are employing all the options that get the best from your
› The Advantages microscope. You can choose from a range of service products, each delivered by highly qualified ZEISS
specialists who will support you long beyond the purchase of your system. Our aim is to enable you to
› The Applications
experience those special moments that inspire your work.
› The System
Repair. Maintain. Optimize.
› Technology and Details
Attain maximum uptime with your microscope. A ZEISS Protect Service Agreement lets you budget for
› Service operating costs, all the while reducing costly downtime and achieving the best results through the improved
performance of your system. Choose from service agreements designed to give you a range of options and
control levels. We’ll work with you to select the service program that addresses your system needs and
usage requirements, in line with your organization’s standard practices.

Our service on-demand also brings you distinct advantages. ZEISS service staff will analyze issues at hand
and resolve them – whether using remote maintenance software or working on site.

Enhance Your Microscope System.


Your ZEISS microscope system is designed for a variety of updates: open interfaces allow you to maintain
a high technological level at all times. As a result you’ll work more efficiently now, while extending the
productive lifetime of your microscope as new update possibilities come on stream.

Profit from the optimized performance of your microscope


system with services from ZEISS – now and for years to come.

>> www.zeiss.com/microservice

18
07745 Jena, Germany
microscopy@zeiss.com
www.zeiss.com/microCT
Carl Zeiss Microscopy GmbH

Not for therapeutic use, treatment or medical diagnostic evidence. Not all products are available in every country. Contact your local ZEISS representative for more information.
EN_44_011_050 | CZ 08-2020 | Release 1.2 | Design, scope of delivery and technical progress subject to change without notice. | © Carl Zeiss Microscopy GmbH

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