AMC1200

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Fully-Differential Isolation Amplifier

Check for Samples: AMC1200
1

FEATURES
250-mV Input Voltage Range Optimized for Shunt Resistors Very Low Nonlinearity: 0.075% max at 5 V Low Offset Error: 1.5 mV max Low Noise: 3.1 mVRMS typ Low High-Side Supply Current: 8 mA max at 5V Input Bandwidth: 60 kHz min Fixed Gain: 8 (0.5% accuracy) High Common-Mode Rejection Ratio: 108 dB 3.3-V Operation on Low-Side Certified Galvanic Isolation: UL1577 and IEC60747-5-2 Approved Isolation Voltage: 4000 VPEAK Working Voltage: 1200 VPEAK Transient Immunity: 10 kV/s min Typical 10-Year Lifespan at Rated Working Voltage (see Application Report SLLA197) Fully Specified Over the Extended Industrial Temperature Range

DESCRIPTION
The AMC1200 is a precision isolation amplifier with an output separated from the input circuitry by a silicon dioxide (SiO2) barrier that is highly resistant to magnetic interference. This barrier has been certified to provide galvanic isolation of up to 4000 VPEAK according to UL1577 and IEC60747-5-2. Used in conjunction with isolated power supplies, this device prevents noise currents on a high common-mode voltage line from entering the local ground and interfering with or damaging sensitive circuitry. The input of the AMC1200 is optimized for direct connection to shunt resistors or other low voltage level signal sources. The excellent performance of the device supports accurate current control resulting in system-level power saving and, especially in motor-control applications, lower torque ripple. The common-mode voltage of the output signal is automatically adjusted to either the 3-V or 5-V low-side supply. The AMC1200 is fully specified over the extended industrial temperature range of 40 C to +105 C and is available in the SMD-type, gullwing-8 package.

APPLICATIONS
Shunt Resistor Based Current Sensing in: Motor Control Green Energy Frequency Inverters Uninterruptible Power Supplies
VDD1 VDD2 5V 2.55 V VINP VOUTP 2V

0V

250 mV 3.3 V VINN VOUTN 1.29 V 2V

GND1

GND2

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners.
Copyright 2011, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

AMC1200
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder on www.ti.com.

ABSOLUTE MAXIMUM RATINGS (1)

Over the operating ambient temperature range, unless otherwise noted.
AMC1200 Supply voltage, VDD1 to GND1 or VDD2 to GND2 Analog input voltage at VINP, VINN Input current to any pin except supply pins Maximum junction temperature, TJ Max Human body model (HBM) JEDEC standard 22, test method A114-C.01 Charged device model (CDM) JEDEC standard 22, test method C101 0.5 to 6 GND1 0.5 to VDD1 + 0.5 10 +150 2500 UNIT V V mA C V

Electrostatic discharge (ESD) ratings, all pins

1000

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION
AMC1200 THERMAL METRIC JA JCtop JB JT JB JCbot (1) Junction-to-ambient thermal resistance Junction-to-case (top) thermal resistance Junction-to-board thermal resistance Junction-to-top characterization parameter Junction-to-board characterization parameter Junction-to-case (bottom) thermal resistance
(1)

DUB (SOP) 8 PINS 75.1 61.6 39.8 27.2 39.4 N/A

UNITS

C/W

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

REGULATORY INFORMATION
VDE/IEC Certified according to IEC 60747-5-2 File number: 40016131 UL Recognized under 1577 component recognition program File number: E181974

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AMC1200
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IEC 60747-5-2 INSULATION CHARACTERISTICS

Over operating free-air temperature range (unless otherwise noted).
PARAMETER VIORM Maximum working insulation voltage Qualification test: after Input/Output Safety Test Subgroup 2/3 VPR = VIORM x 1.2, t = 10 s, partial discharge < 5 pC VPR Input to output test voltage Qualification test: method a, after environmental tests subgroup 1, VPR = VIORM x 1.6, t = 10 s, partial discharge < 5 pC 100% production test: method b1, VPR = VIORM x 1.875, t = 1 s, partial discharge < 5 pC VIOTM VISO RS PD Transient overvoltage Insulation voltage per UL Insulation resistance Pollution degree Qualification test: t = 60 s Qualification test: VTEST = VISO , t = 60 s 100% production test: VTEST = 1.2 x VISO , t = 1 s VIO = 500 V at TS TEST CONDITIONS VALUE 1200 1140 UNIT VPEAK VPEAK

1920 2250 4000 4000 4800 > 109 2

VPEAK VPEAK VPEAK VPEAK VPEAK

IEC SAFETY LIMITING VALUES

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry. A failure of the I/O circuitry can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system failures. The safety-limiting constraint is the operating virtual junction temperature range specified in the Absolute Maximum Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determine the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.
PARAMETER IS TC Safety input, output, or supply current Maximum case temperature TEST CONDITIONS JA = 246C/W, VIN = 5.5 V, TJ = +150C, TA = +25C MIN TYP MAX 10 +150 UNIT mA C

IEC 61000-4-5 RATINGS

PARAMETER VIOSM Surge immunity TEST CONDITIONS 1.2-s/50-s voltage surge and 8-s/20-s current surge VALUE 6000 UNIT V

IEC 60664-1 RATINGS

PARAMETER Basic isolation group TEST CONDITIONS Material group Rated mains voltage 150 VRMS Installation classification Rated mains voltage 300 VRMS Rated mains voltage 400 VRMS Rated mains voltage < 600 VRMS SPECIFICATION II I-IV I-IV I-III I-III

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AMC1200
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PACKAGE CHARACTERISTICS (1)

PARAMETER L(I01) L(I02) CTI Minimum air gap (clearance) Minimum external tracking (creepage) Tracking resistance (comparative tracking index) Minimum internal gap (internal clearance) TEST CONDITIONS Shortest terminal to terminal distance through air Shortest terminal to terminal distance across the package surface DIN IEC 60112/VDE 0303 part 1 Distance through the insulation Input to output, VIO = 500 V, all pins on each side of the barrier tied together to create a two-terminal device, TA < +85C Input to output, VIO = 500 V, +85C TA < TA max CIO CI (1) Barrier capacitance input to output Input capacitance to ground VI = 0.5 VPP at 1 MHz VI = 0.5 VPP at 1 MHz MIN 7 7 175 0.014 > 1012 > 1011 1.2 3 TYP MAX UNIT mm mm V mm pF pF

RIO

Isolation resistance

Creepage and clearance requirements should be applied according to the specific equipment isolation standards of a specific application. Care should be taken to maintain the creepage and clearance distance of the board design to ensure that the mounting pads of the isolator on the printed circuit board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal according to the measurement techniques shown in the Isolation Glossary section. Techniques such as inserting grooves and/or ribs on the PCB are used to help increase these specifications.

ELECTRICAL CHARACTERISTICS
All minimum/maximum specifications at TA = 40C to +105C and within the specified voltage range, unless otherwise noted. Typical values are at TA = +25C, VDD1 = 5 V, and VDD2 = 3.3 V.
AMC1200 PARAMETER INPUT Maximum input voltage before clipping Differential input voltage VCM VOS TCVOS CMRR CIN CIND RIN OUTPUT Nominal gain GERR TCGERR Gain error Gain error thermal drift Nonlinearity Nonlinearity thermal drift Output noise PSRR Power-supply rejection ratio Rise/fall time VINP = VINN = 0 V vs VDD1, 10-kHz ripple vs VDD2, 10-kHz ripple 0.5-V step, 10% to 90% 4.5 V VDD2 5.5 V 2.7 V VDD2 3.6 V 0.075 0.1 Initial, at TA = +25C 0.5 1 8 0.05 0.05 56 0.015 0.023 2.4 3.1 80 61 3.66 6.6 +0.075 +0.1 +0.5 +1 % % ppm/K % % ppm/K mVRMS dB dB s Common-mode operating range Input offset voltage Input offset thermal drift Common-mode rejection ratio Input capacitance to GND1 Differential input capacitance Differential input resistance Small-signal bandwidth 60 VIN from 0 V to 5 V at 0 Hz VIN from 0 V to 5 V at 50 kHz VINP or VINN VINP VINN VINP VINN 250 -0.16 1.5 10 0.2 1.5 108 95 3 3.6 28 100 320 +250 VDD1 +1.5 +10 mV mV V mV V/K dB dB pF pF k kHz TEST CONDITIONS MIN TYP MAX UNIT

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ELECTRICAL CHARACTERISTICS (continued)

All minimum/maximum specifications at TA = 40C to +105C and within the specified voltage range, unless otherwise noted. Typical values are at TA = +25C, VDD1 = 5 V, and VDD2 = 3.3 V.
AMC1200 PARAMETER VIN to VOUT signal delay Common-mode transient immunity Output common-mode voltage Short-circuit current ROUT VDD1 VDD2 IDD1 IDD2 PDD1 PDD2 Output resistance High-side supply voltage Low-side supply voltage High-side supply current Low-side supply current High-side power dissipation Low-side power dissipation 2.7 V < VDD2 < 3.6 V 4.5 V < VDD2 < 5.5 V 2.7 V < VDD2 < 3.6 V 4.5 V < VDD2 < 5.5 V 4.5 2.7 POWER SUPPLY 5.0 5.0 5.4 3.8 4.4 27.0 11.4 22.0 5.5 5.5 8 6 7 44.0 21.6 38.5 V V mA mA mA mW mW mW TEST CONDITIONS 0.5-V step, 50% to 10%, unfiltered output 0.5-V step, 50% to 50%, unfiltered output 0.5-V step, 50% to 90%, unfiltered output CMTI VCM = 1 kV 2.7 V VDD2 3.6 V 4.5 V VDD2 5.5 V 10 1.15 2.4 MIN TYP 1.6 3.15 5.26 15 1.29 2.55 20 2.5 1.45 2.7 MAX 3.3 5.6 9.9 UNIT s s s kV/s V V mA

PIN CONFIGURATION
DUB PACKAGE SOP-8 (TOP VIEW)
VDD1 VINP VINN GND1 1 2 3 4 8 7 6 5 VDD2 VOUTP VOUTN GND2

PIN DESCRIPTIONS
PIN # 1 2 3 4 5 6 7 8 PIN NAME VDD1 VINP VINN GND1 GND2 VOUTN VOUTP VDD2 FUNCTION Power Analog input Analog input Power Power Analog output Analog output Power High-side power supply Noninverting analog input Inverting analog input High-side analog ground Low-side analog ground Inverting analog output Noninverting analog output Low-side power supply DESCRIPTION

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AMC1200
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TYPICAL CHARACTERISTICS
At VDD1 = VDD2 = 5 V, VINP = 250 mV to +250 mV, and VINN = 0 V, unless otherwise noted.
INPUT OFFSET vs HIGH-SIDE SUPPLY VOLTAGE
2 1.5 1 Input Offset (mV) 0.5 0 0.5 1 1.5 2 4.5 4.75 5 VDD1 (V) 5.25 5.5 Input Offset (mV) 2 VDD2 = 2.7 V to 3.6 V 1.5 1 0.5 0 0.5 1 1.5 2 2.7 3 VDD2 (V) 3.3 3.6

INPUT OFFSET vs LOW-SIDE SUPPLY VOLTAGE

Figure 1. INPUT OFFSET vs LOW-SIDE SUPPLY VOLTAGE

2 VDD2 = 4.5 V to 5.5 V 1.5 1 Input Offset (mV) 0.5 0 0.5 1 1.5 2 4.5 4.75 5 VDD2 (V) 5.25 5.5 Input Offset (mV) 1.5 1 0.5 0 0.5 1 1.5 2 40 25 10 5 2

Figure 2. INPUT OFFSET vs TEMPERATURE

20 35 50 65 Temperature (C)

80

95

110 125

Figure 3. COMMON-MODE REJECTION RATIO vs INPUT FREQUENCY

130 120 110 CMRR (dB) 100 90 80 70 60 50 0.1 1 10 Input Frequency (kHz) 100 Input Current (A) 40 30 20 10 0 10 20 30 40 400 300 200

Figure 4. INPUT CURRENT vs INPUT VOLTAGE

100 0 100 Input Voltage (mV)

200

300

400

Figure 5.

Figure 6.

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AMC1200
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TYPICAL CHARACTERISTICS (continued)

At VDD1 = VDD2 = 5 V, VINP = 250 mV to +250 mV, and VINN = 0 V, unless otherwise noted.
INPUT BANDWIDTH vs TEMPERATURE
120 110 Input Bandwidth (kHz) 100 90 80 70 60 40 25 10 1 0.8 0.6 0.4 Gain Error (%) 0.2 0 0.2 0.4 0.6 0.8 5 20 35 50 65 Temperature (C) 80 95 110 125 1 4.5 4.75 5 VDD1 (V) 5.25 5.5

GAIN ERROR vs HIGH-SIDE SUPPLY VOLTAGE

Figure 7. GAIN ERROR vs LOW-SIDE SUPPLY VOLTAGE

1 0.8 0.6 0.4 Gain Error (%) 0.2 0 0.2 0.4 0.6 0.8 1 2.7 3 VDD2 (V) 3.3 3.6 Gain Error (%) VDD2 = 2.7 V to 3.6 V 1 0.8 0.6 0.4 0.2 0 0.2 0.4 0.6 0.8 1 4.5 4.75

Figure 8. GAIN ERROR vs LOW-SIDE SUPPLY VOLTAGE

VDD2 = 4.5 V to 5.5 V

5 VDD2 (V)

5.25

5.5

Figure 9. GAIN ERROR vs TEMPERATURE

1 0.8 0.6 0.4 Gain Error (%) 0.2 0 0.2 0.4 0.6 0.8 1 40 25 10 5 20 35 50 65 Temperature (C) 80 95 110 125 Normalized Gain (dB) 10 0 10 20 30 40 50 60 70 80 1

Figure 10. NORMALIZED GAIN vs INPUT FREQUENCY

10 100 Input Frequency (kHz)

500

Figure 11.

Figure 12.

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AMC1200
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TYPICAL CHARACTERISTICS (continued)

At VDD1 = VDD2 = 5 V, VINP = 250 mV to +250 mV, and VINN = 0 V, unless otherwise noted.
OUTPUT PHASE vs INPUT FREQUENCY
0 30 60 90 120 150 180 210 240 270 300 330 360 1 10 100 Input Frequency (kHz) 1000 1 0.5 0 400 300 200 100 0 100 Input Voltage (mV) 200 300 400 Output Voltage (V) Output Phase () 3.5 3 2.5 2 1.5 5 4.5 4 VOUTP VOUTN

OUTPUT VOLTAGE vs INPUT VOLTAGE

Figure 13. OUTPUT VOLTAGE vs INPUT VOLTAGE

3.6 3.3 3 2.7 Output Voltage (V) Nonlinearity (%) 2.4 2.1 1.8 1.5 1.2 0.9 0.6 0.3 0 400 300 200 100 0 100 Input Voltage (mV) 200 300 400 0.06 0.08 0.1 4.5 4.75 0.04 0.02 0 0.02 0.04 VDD2 = 2.7 V to 3.6 V VOUTP VOUTN 0.1 0.08 0.06

Figure 14. NONLINEARITY vs HIGH-SIDE SUPPLY VOLTAGE

5 VDD1 (V)

5.25

5.5

Figure 15. NONLINEARITY vs LOW-SIDE SUPPLY VOLTAGE

0.1 0.08 0.06 Nonlinearity (%) Nonlinearity (%) 0.04 0.02 0 0.02 0.04 0.06 0.08 0.1 2.7 3 VDD2 (V) 3.3 3.6 VDD2 = 2.7 V to 3.6 V 0.1 0.08 0.06 0.04 0.02 0 0.02 0.04 0.06 0.08 0.1 4.5 4.75

Figure 16. NONLINEARITY vs LOW-SIDE SUPPLY VOLTAGE

VDD2 = 4.5 V to 5.5 V

5 VDD2 (V)

5.25

5.5

Figure 17.

Figure 18.

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AMC1200
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TYPICAL CHARACTERISTICS (continued)

At VDD1 = VDD2 = 5 V, VINP = 250 mV to +250 mV, and VINN = 0 V, unless otherwise noted.
NONLINEARITY vs INPUT VOLTAGE
0.1 0.08 0.06 Nonlinearity (%) Nonlinearity (%) 0.04 0.02 0 0.02 0.04 0.06 0.08 0.1 250 200 150 100 50 0 50 100 Input Voltage (mV) 150 200 250 VDD2 = 3 V VDD2 = 5 V 0.1 0.08 0.06 0.04 0.02 0 0.02 0.04 0.06 0.08 0.1 40 25 10 5 20 35 50 65 Temperature (C) 80 95 110 125

NONLINEARITY vs TEMPERATURE

Figure 19. OUTPUT NOISE DENSITY vs FREQUENCY

2600 2400 2200 Noise (nV/sqrt(Hz)) 2000 1800 1600 1400 1200 1000 800 600 0.1 1 Frequency (kHz) 10 100 PSRR (dB) 100 90 80 70 60 50 40 30 20 10 0 1

Figure 20. POWER-SUPPLY REJECTION RATIO vs RIPPLE FREQUENCY

VDD1 VDD2

10 Ripple Frequency (kHz)

100

Figure 21. OUTPUT RISE/FALL TIME vs TEMPERATURE

10 9 Output Rise/Fall Time (s) 8 7 6 5 4 3 2 1 0 40 25 10 5 20 35 50 65 Temperature (C) 80 95 110 125
500 mV/div 200 mV/div 500 mV/div

Figure 22. FULL-SCALE STEP RESPONSE

Time (2 ms/div)

Figure 23.

Figure 24.

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TYPICAL CHARACTERISTICS (continued)

At VDD1 = VDD2 = 5 V, VINP = 250 mV to +250 mV, and VINN = 0 V, unless otherwise noted.
OUTPUT DELAY TIME vs TEMPERATURE
10 Output CommonMode Voltage (V) 9 8 Signal Delay (s) 7 6 5 4 3 2 1 0 40 25 10 5 20 35 50 65 Temperature (C) 80 95 110 125 50% to 10% 50% to 50% 50% to 90% 5 VDD2 rising VDD2 falling 4

OUTPUT COMMON-MODE VOLTAGE vs LOW-SIDE SUPPLY VOLTAGE

0 3.5

3.6

3.7

3.8

3.9 4 4.1 VDD2 (V)

4.2

4.3

4.4

4.5

Figure 25. OUTPUT COMMON-MODE VOLTAGE vs TEMPERATURE

5 Output CommonMode Voltage (V) VDD2 = 2.7 V to 3.6 V VDD2 = 4.5 V to 5.5 V 4 Supply Current (mA) 6 5 4 3 2 1 0 40 25 10 5 20 35 50 65 Temperature (C) 80 95 110 125 0 4.5 4.75 8 7

Figure 26. SUPPLY CURRENT vs SUPPLY VOLTAGE

IDD1 IDD2

5 Supply Voltage (V)

5.25

5.5

Figure 27. LOW-SIDE SUPPLY CURRENT vs LOW-SIDE SUPPLY VOLTAGE

8 VDD2 = 2.7 V to 3.6 V 7 Supply Current (mA) 6 IDD2 (mA) 5 4 3 2 1 0 2.7 3 VDD2 (V) 3.3 3.6 7 6 5 4 3 2 1 0 40 25 10 5 8

Figure 28. SUPPLY CURRENT vs TEMPERATURE

IDD1 IDD2 20 35 50 65 Temperature (C) 80 95 110 125

Figure 29.

Figure 30.

10

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THEORY OF OPERATION INTRODUCTION

The differential analog input of the AMC1200 is a switched-capacitor circuit based on a second-order modulator stage that digitizes the input signal into a 1-bit output stream. The device compares the differential input signal (VIN = VINP VINN) against the internal reference of 2.5 V using internal capacitors that are continuously charged and discharged with a typical frequency of 10 MHz. With the S1 switches closed, CIND charges to the voltage difference across VINP and VINN. For the discharge phase, both S1 switches open first and then both S2 switches close. CIND discharges to approximately AGND + 0.8V during this phase. Figure 31 shows the simplified equivalent input circuitry.
VDD1 GND1 GND1 CINP = 3pF 400W VINP S1 CIND = 3.6pF S1 VINN CINN = 3pF RIN = 1 fCLK CDIFF GND1 400W S2 AGND + 0.8V VINN 3pF S2 AGND + 0.8V Equivalent Circuit VINP RIN = 28kW 3pF

GND1

GND1

(fCLK = 10MHz)

Figure 31. Equivalent Input Circuit The analog input range is tailored to directly accommodate a voltage drop across a shunt resistor used for current sensing. However, there are two restrictions on the analog input signals, VINP and VINN. If the input voltage exceeds the range AGND 0.5 V to AVDD + 0.5 V, the input current must be limited to 10 mA to prevent the implemented input protection diodes from damage. In addition, the linearity and the noise performance of the device are ensured only when the differential analog input voltage remains within 250 mV. The isolated digital bit stream is processed by a third-order analog filter on the low-side and presented as a differential output of the device. The SiO2-based capacitive isolation barrier supports a high level of magnetic field immunity, as described in application report SLLA181, ISO72x Digital Isolator Magnetic-Field Immunity (available for download at www.ti.com).

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APPLICATION INFORMATION MOTOR CONTROL

A typical operation of the AMC1200 in a motor-control application is shown in Figure 32. Measurement of the motor phase current is done through the shunt resistor, RSHUNT (in this case, a two-terminal shunt). For better performance, the differential signal is filtered using RC filters (components R2, R3, and C2). Optionally, C3 and C4 can be used to reduce charge dumping from the inputs. In this case, care should be taken when choosing the quality of these capacitors; mismatch in values of these capacitors leads to a common-mode error at the input of the modulator.
HV+ Floating Power Supply Isolation Barrier

Gated Drive Circuit

R1 AMC1200 VDD1 D1 5.1V R2 12W R3 12W C2(1) 330pF C3 10pF (optional) C4 10pF (optional) VINN VOUTN C1(1) 0.1mF VINP VOUTP VDD2 C5(1) 0.1mF

TMC320 C/F28xxx

RSHUNT To Load Power Supply

ADC

GND1

GND2

Gated Drive Circuit

HV-

(1)

Place these capacitors as close as possible to the AMC1200.

Figure 32. Typical Application Diagram for the AMC1200 The high-side power supply for the AMC1200 (VDD1) is derived from the power supply of the upper gate driver. For lowest cost, a Zener diode can be used to limit the voltage to 5 V 10%. A decoupling capacitor of 0.1 F is recommended for filtering this power-supply path. This capacitor (C1 in Figure 32) should be placed as close as possible to the VDD1 pin for best performance. If better filtering is required, an additional 1-F to 10-F capacitor can be used. The floating ground reference (GND1) is derived from the end of the shunt resistor, which is connected to the negative input of the AMC1200 (VINN). If a four-terminal shunt is used, the inputs of AMC1200 are connected to the inner leads, while GND1 is connected to one of the outer leads of the shunt. The high transient immunity of the AMC1200 ensures reliable and accurate operation even in high-noise environments such as the power stages of the motor drives. The differential output of the AMC1200 can either directly drive an analog-to-digital converter (ADC) input or can be further filtered before being processed by the ADC. As shown in Figure 33, it is recommended to place the bypass and filter capacitors as close as possible to the AMC1200 to ensure best performance.

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Top View

VDD1

VDD2

12 W SMD 0603 To Shunt 12 W SMD 0603

VINP 330 pF SMD 0603 0.1 mF SMD 1206 VINN

VOUTP

0.1mF SMD 1206

0.1 mF SMD 1206 To Filter or ADC

AMC1200
VOUTN

GND1

GND2

LEGEND Top layer; copper pour and traces High-side area Controller-side area Via

Clearance area. Keep free of any conductive materials.

Figure 33. AMC1200 Layout Recommendation To maintain the isolation barrier and the high CMTI of the device, the distance between the high-side ground (GND1) and the low-side ground (GND2) should be kept at maximum; that is, the entire area underneath the device should be kept free of any conducting materials.

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VOLTAGE MEASUREMENT
The AMC1200 can also be used for isolated voltage measurement applications, as shown in a simplified way in Figure 34. In such applications, usually a resistor divider (R1 and R2 in Figure 34) is used to match the relatively small input voltage range of the AMC1200. R2 and the input resistance RIN of the AMC1200 also create a resistance divider that results in additional gain error. With the assumption that R1 and RIN have a considerably higher value than R2, the resulting total gain error can be estimated using Equation 1: R GERRTOT = GERR + 2 RIN Where GERR = the gain error of AMC1200.
(1)
L1

R1

R2

RIN

L2

Figure 34. Voltage Measurement Application

14

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ISOLATION GLOSSARY
Creepage Distance: The shortest path between two conductive input to output leads measured along the surface of the insulation. The shortest distance path is found around the end of the package body.

Clearance: The shortest distance between two conductive input to output leads measured through air (line of sight).

Input-to-Output Barrier Capacitance: The total capacitance between all input terminals connected together, and all output terminals connected together. Input-to-Output Barrier Resistance: The total resistance between all input terminals connected together, and all output terminals connected together. Primary Circuit: An internal circuit directly connected to an external supply mains or other equivalent source that supplies the primary circuit electric power. Secondary Circuit: A circuit with no direct connection to primary power that derives its power from a separate isolated source. Comparative Tracking Index (CTI): CTI is an index used for electrical insulating materials. It is defined as the numerical value of the voltage that causes failure by tracking during standard testing. Tracking is the process that produces a partially conducting path of localized deterioration on or through the surface of an insulating material as a result of the action of electric discharges on or close to an insulation surface. The higher CTI value of the insulating material, the smaller the minimum creepage distance. Generally, insulation breakdown occurs either through the material, over its surface, or both. Surface failure may arise from flashover or from the progressive degradation of the insulation surface by small localized sparks. Such sparks are the result of the breaking of a surface film of conducting contaminant on the insulation. The resulting break in the leakage current produces an overvoltage at the site of the discontinuity, and an electric spark is generated. These sparks often cause carbonization on insulation material and lead to a carbon track between points of different potential. This process is known as tracking. Insulation: Operational insulationInsulation needed for the correct operation of the equipment. Basic insulationInsulation to provide basic protection against electric shock. Supplementary insulationIndependent insulation applied in addition to basic insulation in order to ensure protection against electric shock in the event of a failure of the basic insulation. Double insulationInsulation comprising both basic and supplementary insulation. Reinforced insulationA single insulation system that provides a degree of protection against electric shock equivalent to double insulation.

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AMC1200
SBAS542A APRIL 2011 REVISED AUGUST 2011 www.ti.com

Pollution Degree: Pollution Degree 1No pollution, or only dry, nonconductive pollution occurs. The pollution has no influence on device performance. Pollution Degree 2Normally, only nonconductive pollution occurs. However, a temporary conductivity caused by condensation is to be expected. Pollution Degree 3Conductive pollution, or dry nonconductive pollution that becomes conductive because of condensation, occurs. Condensation is to be expected. Pollution Degree 4Continuous conductivity occurs as a result of conductive dust, rain, or other wet conditions. Installation Category: Overvoltage CategoryThis section is directed at insulation coordination by identifying the transient overvoltages that may occur, and by assigning four different levels as indicated in IEC 60664. 1. Signal Level: Special equipment or parts of equipment. 2. Local Level: Portable equipment, etc. 3. Distribution Level: Fixed installation. 4. Primary Supply Level: Overhead lines, cable systems. Each category should be subject to smaller transients than the previous category.

16

Copyright 2011, Texas Instruments Incorporated

AMC1200
www.ti.com SBAS542A APRIL 2011 REVISED AUGUST 2011

REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (April 2011) to Revision A Page

Changed sign for maximum junction temperature from minus to plus (typo) ....................................................................... 2 Changed surge immunity parameter from 4000 to 6000 .................................................................................................. 3 Added "0.5-V step" to test condition for Rise/fall time parameter ......................................................................................... 4 Changed Figure 12 ............................................................................................................................................................... 7 Changed Figure 13 ............................................................................................................................................................... 8

Copyright 2011, Texas Instruments Incorporated

17

PACKAGE OPTION ADDENDUM

www.ti.com

22-Oct-2011

PACKAGING INFORMATION
Orderable Device AMC1200SDUB AMC1200SDUBR Status
(1)

Package Type Package Drawing SOP SOP DUB DUB

Pins 8 8

Package Qty 50 350

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-3-260C-168 HR CU NIPDAU Level-3-260C-168 HR

(1)

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jun-2011

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SOP DUB 8

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 24.4 10.9

B0 (mm) 10.01

K0 (mm) 5.85

P1 (mm) 16.0

W Pin1 (mm) Quadrant 24.0 Q1

AMC1200SDUBR

350

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jun-2011

*All dimensions are nominal

Device AMC1200SDUBR

Package Type SOP

Package Drawing DUB

Pins 8

SPQ 350

Length (mm) 358.0

Width (mm) 335.0

Height (mm) 35.0

Pack Materials-Page 2

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