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Glue Stencil Design R. 00 (Presentation)

The document discusses the process of designing stencil apertures for surface mount technology (SMT) assembly. It describes reviewing component sizes and placements, submitting gerber files to suppliers, checking checkplots for accuracy, designing apertures 110% the size of components' pads, confirming checkplots match the intended design, and inspecting finished stencils. The goal is to prevent defects by ensuring the correct amount of adhesive is deposited during assembly.

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edwin
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214 views13 pages

Glue Stencil Design R. 00 (Presentation)

The document discusses the process of designing stencil apertures for surface mount technology (SMT) assembly. It describes reviewing component sizes and placements, submitting gerber files to suppliers, checking checkplots for accuracy, designing apertures 110% the size of components' pads, confirming checkplots match the intended design, and inspecting finished stencils. The goal is to prevent defects by ensuring the correct amount of adhesive is deposited during assembly.

Uploaded by

edwin
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd
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GLUE STENCIL DESIGN

OBJECTIVE

To learn and understand the basics of stencil design, with the


consideration of SMT adhesive (glue or bonding paste),
according to the required aperture size and shape for a
particular component.
OBJECTIVE
Why design?
To prevent insufficient and excessive amount of printed
adhesive that may cause some defects during SMT process
and wave soldering.
OBJECTIVE
Why design?
To prevent insufficient and excessive amount of printed
adhesive that may cause some defects during SMT process
and wave soldering.

COMMON DEFECTS

Missing component No solder Insufficient solder


(Insufficient) (Excess) (Excess)
PROCESS FLOW

STENCIL GERBER FILE


CHECKPLOT
START DIMENSION REVIEW &
REVIEW
IDENTIFICATION SUBMISSION

STENCIL CHECKPLOT
END DESIGN PROPER
INSPECTION CONFIRMATION
PROCESS FLOW
I. Stencil Dimension Identification
Identify the following:
1. Frame size (29” x 29”) 29 in.
FRAME
2. Foil thickness (8 mils)
FOIL
3. Fiducial markings (PCB side)
4. Image orientation

29 in.
20 in.
IMAGE

23 in.
MESH

STENCIL

STENCIL GERBER FILE


CHECKPLOT DESIGN CHECKPLOT STENCIL
START DIMENSION REVIEW & END
REVIEW PROPER CONFIRMATION INSPECTION
IDENTIFICATION SUBMISSION
PROCESS FLOW
II. Gerber File Review & Submission
Review of Gerber File
This is to determine the accuracy of the file prior to sending
to stencil supplier.
Check:
1. Size of PCB – should be compatible with the available printer and
squeegee.
2. Existence of fiducial markings – at least 2 are required.
3. PCB layout requirement – singulated or panelized/in array

Submission of Gerber File


The Gerber file is forwarded to the supplier, for them to
send a checkplot to the customer.
STENCIL GERBER FILE
CHECKPLOT DESIGN CHECKPLOT STENCIL
START DIMENSION REVIEW & END
REVIEW PROPER CONFIRMATION INSPECTION
IDENTIFICATION SUBMISSION
PROCESS FLOW
III. Checkplot Review
Checkplot provided by the stencil supplier will be reviewed
to determine if the position, quantity and size of the
aperture are correct with respect to the component.

STENCIL GERBER FILE


CHECKPLOT DESIGN CHECKPLOT STENCIL
START DIMENSION REVIEW & END
REVIEW PROPER CONFIRMATION INSPECTION
IDENTIFICATION SUBMISSION
PROCESS FLOW
III. Checkplot Review
Checkplot example:

STENCIL GERBER FILE


CHECKPLOT DESIGN CHECKPLOT STENCIL
START DIMENSION REVIEW & END
REVIEW PROPER CONFIRMATION INSPECTION
IDENTIFICATION SUBMISSION
PROCESS FLOW
IV. Design Proper
General rule for passive components and
small diodes (e.g., SOD-323):

PAD

110% of W
G G/3

APERTURE

STENCIL GERBER FILE


CHECKPLOT DESIGN CHECKPLOT STENCIL
START DIMENSION REVIEW & END
REVIEW PROPER CONFIRMATION INSPECTION
IDENTIFICATION SUBMISSION
PROCESS FLOW
V. Checkplot Confirmation
A. Checkplot is verified if it is according to the intended
design.
B. Confirmation is sent to the supplier, to proceed with the
fabrication of the stencil. No confirmation, no stencil.

Stencil details:
1. Model Name
2. Frame Size
Note:
3. Foil Thickness
The stencil details (1 to 4) must be
4. Fiducial
inscribed on the stencil.
5. Image Orientation

STENCIL GERBER FILE


CHECKPLOT DESIGN CHECKPLOT STENCIL
START DIMENSION REVIEW & END
REVIEW PROPER CONFIRMATION INSPECTION
IDENTIFICATION SUBMISSION
PROCESS FLOW
VI. Stencil Inspection
The inspection includes:
1. Correct identification info 2. Damages due to handling
a. Model Name and rev. 3. Presence of fiducials
b. Frame Size 4. Correct shape & qty of
c. Foil Thickness aperture as per design
d. Date of Fabrication 5. Others, refer Stencil Buy-off
e. Supplier’s Ref. No.
Form
f. Supplier’s Name

STENCIL GERBER FILE


CHECKPLOT DESIGN CHECKPLOT STENCIL
START DIMENSION REVIEW & END
REVIEW PROPER CONFIRMATION INSPECTION
IDENTIFICATION SUBMISSION
THANK YU !

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