2.one Dimensional Conduction
2.one Dimensional Conduction
conduction
analysis
To determine the temperature field, T(x,y,z,t), in a body
(i.e. how temperature varies with position within the body)
T(x,y,z,t) depends on:
- boundary conditions T(x,y,z)
- initial condition
- material properties (k, cp, …)
- geometry of the body (shape, size)
Why we need T(x,y,z,t) ?
- to compute heat flux at any location (using Fourier’s eqn.)
- compute thermal stresses, expansion, deflection due to temp. etc.
- design insulation thickness
- chip temperature calculation
- heat treatment of metals
Unidirectional
heat conduction
(1D)
Area = x
0 x+x
A x
Solid bar, insulated on all
long sides (1D heat
conduction) qx A
qx+x
kA T
E ( q x
T x
A
x)u
E
Ax u Axc q q q x
t t t
x x
x
x
x
Unidirectional heat
conduction (1D)(contd…)
kA T kA T A k T x Ax q
x x x x t
T
Ac xT
T
q c
k
x x t
Internal heat Thermal inertia
Longitudinal
conduction generation
If k is a constant 2T q c T 1 T
x 2 k k t t
Unidirectional heat
conduction (1D)
(contd…)
ForT to rise, LHS must be positive (heat input
is positive)
For a fixed heat input, T rises faster for higher
In this special case, heat flow is 1D. If sides were not
insulated, heat flow could be 2D, 3D.
Boundary and Initial
conditions:
The objective of deriving the heat diffusion equation is to
determine the temperature distribution within the conducting
body.
Const. K; solution
is: dT kA T
q x kA T s ,1 T s , 2 T s ,1
s,2
Thermal resistance
(electrical analogy)
OHM’s LAW :Flow of Electricity
V=IR elect
T qR therm
T∞,1 …. Cold
... ... . .. ... …
... .. k ..
Ts,1 . . . . .. . .. .
.. . . . ..
Ts,2 fluid
. . . .. . . . . . . T∞,2
Hot . . . ... . .
.
x=0 x=L
fluid Ts,1 Ts,2 T∞,2
qx T∞,
L 1
1
1
k A h2 A
h1 A
1 L 1
Rt
h1 A
kA
h2 A
(Thermal Resistance )
Resistance
expressions
THERMAL RESISTANCES
Conduction
Rcond = x/kA
Convection
T∞,1 A B C
h1
KA KB KC h2
T∞,2
T∞,1 LA LB LC T∞,2
qx 1 L LB LC 1
kA A A kBA k CA
h1A h2A
1 1
U
R total A 1 L 1
h 1 k h 2
Contact Resistance :
TA
TB
T
A B
T
R t , c
q
x
1
U
1 L LB LC 1
A
h1 k A k B kC h2
SeriesParallel :
B AB+AC=AA=AD
A D
KB
T1 T2 LB=L C
KA KD
C
Kc
SeriesParallel
(contd…)
LB
LA k BA LD
k AA k DA
T1 LC
T2
kC A
Assumptions :
kI = 20 W/mk
qx AI = 1 m2, L = 1m
T1 = 0°C Tf = 100°C
kII = 10 W/mk
h = 1000 W/ m2 k
AII = 1 m2, L = 1m
h1
r1
T∞,1 r2
h2
k1
T∞,2 r3 k2
q r T , 2 T ,1
R
t
T∞,1 T∞,2
1 1
( h 1 )( 2 r1 L ) ( h 2 )( 2 r2
ln r1 L)
r2
r
ln
2 2
1
Lk 2 r3
2
Critical Insulation Thickness :
Set dR tot
dr 0 0
1 1
2
2 kr0 L 2 0
0
hLr
k
r0
h d 2R k
at r0
Max or Min. ? Take : 2 tot
dr 0 0
h
d 2R 1 1
tot
k
dr 2 0 2 kr 2 0 L r 20 r0
h
hL
h2 0
2 3
Lk
Critical Insulation
Thickness (contd…)
Minimum q at r0 =(k/h)=r cr
(critical radius)
r0
1D Conduction in Sphere
r2
r1
k
T∞,2 Inside Solid:
Ts,2 T 1 d 2 dT
s,1
r 2 dr kr dr 0
T∞,1 T s ,1 T s , 2 11rr / /rr
s ,1
1
T (r) 1 2
T dT 4 k T s ,1 T s , 2
dr 1 / r 1 / r
1 2
q r kA
R t , cond 1 / r1 1 / r2
4 k
Conduction with Thermal
Energy Generation
E
q V = Energy generation per unit
volume
Applications: * current carrying conductors
* chemically reacting systems
* nuclear reactors
Conduction with
Thermal Energy
Generation
The Plane Wall :
k
Ts,1
q Ts,2
Assumptions:
T∞,1 T∞,2 1D, steady state,
Hot constant k,
Cold
fluid
uniform q
x= L x=0 x=+L fluid
Conduction With Thermal
Energy Generation (contd…)
d2T q
0
dx 2 k
Boundary cond
x L, s ,1
.:
T T
s,2
q x 2 L , T
T
Solution : x C x
1 2
T 2 C
k
Conduction with
Thermal Energy
Generation (cont..)
Use boundary conditions tofind C1and C2
Hence thermal resistance concept is not correct to use when there is internal
heat generation