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"Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip ..."

Takuya Wadatsumi et al. (2023)

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DOI: 10.1587/TRANSELE.2022CTP0004

access: closed

type: Journal Article

metadata version: 2024-02-05

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  - journals/ieicetc/WadatsumiKHMHSFKMN23
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  persistent URL:
  - https://dblp.org/rec/journals/ieicetc/WadatsumiKHMHSFKMN23
Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa, Kikuo Muramatsu, Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo, Takuji Miki, Makoto Nagata:
Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging. IEICE Trans. Electron. 106(10): 556-564 (2023)

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