Numerical Modeling of The Electrostatic Field in Metal-Insulator-Metal Structures
Numerical Modeling of The Electrostatic Field in Metal-Insulator-Metal Structures
Metal-Insulator-Metal Structures
Emilia-Simona Malureanu and Daniel Ioan
Mihail-Iulian Andrei
AbstractThe accurate data about electric field on the metalinsulator interface is essential for a series of phenomena, such as
electric breakdown, corona discharges, or electron emission. As
the size of the structures used in electronics industry goes towards
nanaoscopic scale, the sharp edge electrostatic effect in these
structures becomes more predominant and a correct estimation of
the electric field intensity value implies using combined numerical
and analytical methods.
I.
I NTRODUCTION
The accurate data about electric field on the metalinsulator interface is essential for a series of phenomena,
such as electric breakdown, corona discharges, or quantum
tunneling [1], [2].
This paper proposes to analyse the electric field intensity in structures with nanoscopic dimensions, considering an
Al SiO2 Al test structure, specially designed and realised
by silicon planar technology, for experimental study of field
electron emission.
By modeling the test structure, the electrostatic field was
computed with the finite element method, using Comsol program . In the paper is presented the detailed geometrical model,
as well as the solved equations and their boundary conditions.
The influence of exact shape and surface smoothness are
analysed, considering the sharp corner effect in estimating the
value of the electric field in Al SiO2 Al test structures
and the results are validated, by comparison with those analytically obtained. The electrostatic sharp corner effect imply the
appearance of high intensity electric fields in the vecinity of
charged electrodes with sharp corners and edges. The electric
fiels intensity in the appex of the emiting electrode is in inverse
ratio to its bending radius. Modeling this effect is necessary
in studying the Corona phenomenon, in integrated circuits, as
determining the precision of the electrostatic forces in MEMS
devices [3] or studying the electro-migration in integrated
circuits [4].
The precise modeling of this effect with the finite element
method implies using an extremely fine mesh around the edges
and corners with considerable consumption of computational
resources as memory and time. As the bending radius decreases, the necessary of computational resources increases.
If a geometrical model with sharp edges is adopted, with
a zero bending radius, then a coarse mesh can be used in
C ONCEPTUAL MODEL
Parameter
Electrode length
Electrode width
Thickness (gAl )
Electrodes appex
SiO2 layer thickness (gSiO2 )
SiO2 layer width
Electrodes voltage
Test structure
4.5m
3m
0.4m
r = 1.5m
1.5m
93.7nm
20V
1) Modelling hypotheses:
Since the magnetic field distribution does not influence the conduction phenomenon in MIM structures, and considering the constant applied voltage, Maxwells equations are defined considering the
electro-quasistatic (EQS) regime.
Gauss law
= qD ,
divD = .
rotE = 0,
E = gradV.
(2)
D(E) relationship
D = E.
(1)
(3)
(4)
A NALYTIC APPROACH
M ATHEMATICAL MODEL
lim (v (r , ) S(r , )) = 0,
(6)
1
2
3
4
5
6
Parameter
d
b
c
r
a
V0
Value
47 nm
4.5m
1.5m
1.5m
3m
10V
(7)
where Emax is the maximum value of the electric field intensity in the considered test structure, E0 = U/d is the electric
field, considered as an uniform one, d is the distance between
electrodes, rrac is the bending radius of the electrodes edge
(transition radius) according to Fig. 6.
V.
N UMERIC APPROACH
A. 2D top view
The geometry of electrodes depicted in Fig. 3 and 4 is
considered. The approximate Al electrode is eliminated form
the computational domain since inside this the electrostatic
field is zero. Fig. 3 indicates the computational domain, its
shape and its dimensions, with values according to Tabel II,
and the boundary conditions.
with red: V = 0;
in rest: dV /dn = 0.
E [V /m](analytic)
1.5971 109
7.986 108
5.22 108
4.356 108
3.877 108
3.55 108
3.322 108
3.139 108
2.99 108
2.866 108
2.76 108
2.66 108
2.588 108
2.517 108
2.452 108
2.394 108
2.341 108
2.2929 108
2.2481 108
2.206 108
2.167 108
E [V /m](numeric)
1.03461 109
8.593 108
5.305 108
4.467 108
4.009 108
3.716 108
3.505 108
3.345 108
3.220 108
3.118 108
3.034 108
2.963 108
2.903 108
2.851 108
2.805 108
2.765 108
2.729 108
2.698 108
2.669 108
2.643 108
2.620 108
(8)
gAl
gSiO2
r
d
rf
0.4m
1.5m
1.5m
93nm
0.63m
C. 3D model
Considering the geometry from Fig. 9 and 10, the dimensions of the computational domain are according to Table IV.
Fig. 10 describes the emission electrode geometry for two
different values of the transition radius (rrac ).
VI.
C ONCLUSION
The authors would like to thank National Institute for Research and Development in Microtechnologies -IMT Bucharest
for the helpful collaboration about this work. Also, this work
has been supported by Advanced Tools and Methodologies
for the Multiphysics Modelling and Simulation of RF MEMS
Switches, TOMEMs (PN-II-PT-PCCA-2011-3) and High Performance Computing Knowledge for nano-Electronic Design
Automation FP6/ToK4nEDA European Project.
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