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Disassembly Monito 20106122290

This document provides instructions for disassembling an HP ZR30w 30-inch LCD monitor to remove components for selective treatment as required by the WEEE directive. It lists printed circuit boards, batteries, mercury-containing components, LCDs over 100 sq cm, and electrical cables as requiring selective treatment. The disassembly process involves 25 steps to remove covers, boards, stands, cables and other parts to access these components. Diagrams illustrate some steps like removing the quick release base, electrolytic capacitor extraction, and cable separation.

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Andy Wilson
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372 views33 pages

Disassembly Monito 20106122290

This document provides instructions for disassembling an HP ZR30w 30-inch LCD monitor to remove components for selective treatment as required by the WEEE directive. It lists printed circuit boards, batteries, mercury-containing components, LCDs over 100 sq cm, and electrical cables as requiring selective treatment. The disassembly process involves 25 steps to remove covers, boards, stands, cables and other parts to access these components. Diagrams illustrate some steps like removing the quick release base, electrolytic capacitor extraction, and cable separation.

Uploaded by

Andy Wilson
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model


[List multiple models if applicable.]
HP ZR30w 30-inch S-IPS LCD Monitor
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 2
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin 0
or button style batteries
Mercury-containing components For example, mercury in lamps, display backlights, 18
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas 1
than 100 sq cm discharge lamps
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring 1
greater than 2.5 cm in diameter or height
External electrical cables and cords 8
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 0
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos 0
Components, parts and materials containing 0
refractory ceramic fibers
EL-MF877-00 Page 1
Template Revision A
Components, parts and materials containing 0
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD) #2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove Stand Base From Display Head


2. Remove Rear Cover From Display Head
3. Remove Front Cover From Display Head
4. Remove Key Board Off From Front Cover
5. Remove Trim Cover From Rear Cover
6. Remove LOGO Part From Rear Cover
7. Take Screw(*4) Off From Chassis Cover & Remove Panel
8. Take Screw(x3) Off From P.C.B
9. Take Screw(x13) Off From P.C.B
10. Take Screw(x8) Off From P.C.B & Remove BKT
11. Remove Mylar From Chassis Cover
12. LCD PANEL EXPLODE
13. Take Screw(*4)Off From Quick Release
14. Remove Quick Release off Stand Base
15. Remove Cable Cover Off Stand Base
16. Remove Stand Front Cover Off Stand Base
17. Remove Stand Rear Cover Off Stand Base
18. Remove Stand Columnb Rear off Stand Base
19. Remove Stand Columnb Front Off Stand BKT
20. Remove Vesa Cover Assy Off Stand BKT
21. Remove Vesa Cover Off VESA BKT
22. Remove Tilt Cover and Stand Columnb Top Off Stand BKT
23. Remove Rubber Off Base BKT
24. Remove Base Off Base BKT
25. Remove Release Button Off Stand Rear Cover

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2
Template Revision A
HP ZR30w Disassembly Process

December-10-2009
External Electric Cables Dissecting Process

USB Cable Power Cord

DVI Cable DP Cable

1.Remove Cable From Display Head. 2.Dissecting To Complete.

2
Remove Stand Base From Display Head

1. Rotate the Quick release button

2. Remove Stand Base From Display Head.

3
Remove Stand Base From Display Head

1 2
4 3

3. Take screw(x4) off from Quick Release Metal.

4. Remove Quick Release Metal.

4
Remove Rear Cover From Display Head

5
Remove Front Cover From Display Head

1. Remove Connector

2. Remove Front Cover.

6
Remove Key Board Off From Front Cover

1. Take Screw(x3) Off From Front Cover

2. Remove key board from FC

7
Remove Trim Cover From Rear Cover

1. Remove Trim Cover From Rear Cover.

2. Dissecting To Complete.

8
Remove LOGO Part From Rear Cover

Remove LOGO part From Rear Cover.

9
Take Screw(*4) Off From Chassis Cover & Remove Panel

1. Remove connector from 2 take screw(x4)off from chassis cover 3.Take USB cover Off from Chassis
LEFT Chassis cover. cover & Remove USB cover ASSY
From Chassis Cover.

4.Remove connector off from Panel 5. Take screw(x2)off from panel; 6. Dissecting To Complete.
, remove chassis ASSY from panel Remove Shield cover off from Panel
10
Take Screw(x3) Off From P.C.B

Take Screw(x3) Off From P.C.B

11
Take Screw(x13) Off From P.C.B

12
Take Screw(x8) Off From P.C.B & Remove BKT (Printed Circuit Assemblies>10cm**2)

Switch

Chassis Cover
Dissecting to complete 13
Remove Mylar From Chassis Cover

14
LCD PANEL EXPLODE

15
Electrolytic Capacitors Over 25mm High& Diameter Dissecting Process

3.Dissecting To Complete.
1.Heats Up, Dissolved Tin Lead. 2.Takes Down The Capacitor.
(Next Page Have Description)

16
Electrolytic Capacitors Process Drawing

C805

17
Take Screw(*4)Off From Quick Release

1 2

3 4

18
Remove Quick Release off Stand Base

19
Explode Quick Release

20
Remove Cable Cover Off Stand Base

21
Remove Stand Front Cover Off Stand Base

22
Remove Stand Rear Cover Off Stand Base

Take 2 screws off

23
Remove Stand Columnb Rear off Stand Base

24
Remove Stand Columnb Front Off Stand BKT

Take 3 screws off

25
Remove Vesa Cover Assy Off Stand BKT

Take 4 screws off

26
Remove Vesa Cover Off VESA BKT

Use to tool, Let the rubber melt, And Remove VESA Cover.

27
Remove Tilt Cover and Stand Columnb Top Off Stand BKT

Take 2 screws off

28
Remove Rubber Off Base BKT

Take screws(x9) off

29
Remove Base Off Base BKT

30
Remove Release Button Off Stand Rear Cover

31

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