INSTITUTEOFAERONAUTICALENGINEERING

(Autonomous)
Dundigal, Hyderabad-500043

MECHANICAL ENGINEERING

TUTORIAL QUESTION BANK

Course Title PRECISION ENGINEERING

Course Code AME512

Programme B.Tech

Semester V ME

Course Type Elective

Regulation IARE - R16

Theory Practical

Course Structure Lectures Tutorials Credits Laboratory Credits

3 1 3 - -

Chief Coordinator Mr. G Sarat Raju, Assistant Professor

Course Faculty Mr. G Sarat Raju, Assistant Professor

COURSE OBJECTIVES:

The course should enable the students to:

I Understand the BIS code fits and tolerances for geometrical dimensioning and tolerance (GD &T).
II Understand the principal application of different measuring instruments.
III Summarize the application of latest manufacturing techniques (nano).

COURSE OUTCOMES (COs):

CO 1 Describes the General concept of accuracy, dimensional wear of cutting tools, clamping errors &
setting errors, location of rectangular prism &cylinder, basic type of tests, measuring instruments
used for testing machine tools, alignment tests, straightness, flatness, parallelism, squareness,
Circularity, cylindricity.
CO 2 Describes the Influence of static stiffness, thermal effects, compliance of work piece, Influence of
vibration on accuracy.
CO 3 Describes Top down and bottom up approach, development of Nanotechnology, precision and
micro-machining, Stereo microlithography.
CO 4 Describes Nano Measuring Systems such as mechanical measuring systems, optical measuring
systems, electron beam measuring systems, pattern recognition and inspection systems.
CO 5 Describes various types of Lithography such as Photolithography, nano lithography, electron beam
lithography, ion Beam lithography, optical lithography, LIGA process, dip pen lithography, deep
UV.
COURSE LEARNING OUTCOMES (CLOs):
AME512.01 Describes the General concept of accuracy,
AME512.02 Describe dimensional wear of cutting tools, clamping errors & setting errors
AME512.03 Describes how to location of rectangular prism &cylinder.
AME512.04 Describes basic type of tests and measuring instruments used for testing machine tools.
AME512.05 Describes the Influence of static stiffness.
AME512.06 Describes thermal effects and methods of decreasing thermal effects,
AME512.07 Describes the compliance of work piece
AME512.08 Describes the Influence of vibration on accuracy.
AME512.09 Describes the importance of Top down and bottom up approach,
AME512.10 Explains the development of Nanotechnology, precision and micro-machining, Stereo
microlithography.
AME512.11 Explains the development of precision and micro-machining.
AME512.12 Explains the development Stereo microlithography.
AME512.13 Classify the various Nano Measuring systems.
AME512.14 Discuss the various Mechanical measuring systems
AME512.15 Discuss the optical measuring systems, electron beam measuring system.
AME512.16 Discuss the pattern recognition and inspection systems.
AME512.17 Classify the various Lithography’s.
AME512.18 Describe the importance of Nano lithography & electron beam lithography
AME512.19 Describe the importance of ion Beam lithography & optical lithography
AME512.20 Explain LIGA Process, Dip Pen Lithography & deep UV
 TUTORIAL QUESTION BANK

MODULE- I
ACCURACY AND ALIGNMNET TEST
Part - A (Short Answer Questions)
S QUESTIONS Blooms Course Course
No Taxonomy Outcomes Learning
Level Outcomes
(CLOs)
1 What is the term precision? Remember CO 1 AME512.01
2 Write briefly the dimensional wear of cutting tools. Understand CO 1 AME512.01
3 What is the use of NC systems? Understand CO 1 AME512.01
4 Differentiate between accuracy and precision. Remember CO 1 AME512.01
5 What is the spindle rotation error? Understand CO 1 AME512.01
6 Write the term alignment tests? Remember CO 1 AME512.01
7 What is the use of measuring instruments? Understand CO 1 AME512.02
8 Name the errors of cylindrical form. Remember CO 1 AME512.02
9 What is the use of test methods? Remember CO 1 AME512.02
10 How do measure the displacement accuracy? Understand CO 1 AME512.02
11 What is the ring gauge center method? Remember CO 1 AME512.02
12 What is the plug gauge center method? Understand CO 1 AME512.03
13 Define the term straightness. Remember CO 1 AME512.03
14 Define the term parallelism. Remember CO 1 AME512.03
15 Define the term squareness. Understand CO 1 AME512.03
16 Define the term circularity. Remember CO 1 AME512.03
17 Why is alignment necessary for machine tools?. Understand CO 1 AME512.04
18 What is the cumulative error? Remember CO 1 AME512.04
19 Define the term wear of cutting tools. Remember CO 1 AME512.04
20 Differentiate between the clamping errors and setting errors. Understand CO 1 AME512.04
Part - B (Long Answer Questions)
1 Explain spindle rotation accuracy. Remember CO 1 AME512.01
2 What are the test methods for radial spindle rotation error? Remember CO 1 AME512.01
3 Explain various types of errors that are occur with spindle rotation with sketches. Understand CO 1 AME512.01
4 How spindle rotation error is important for machine tools? Understand CO 1 AME512.02
5 What is the influence of displacement accuracy on machined work pieces in Remember CO 1 AME512.02
machine tools.
6 Explain spindle rotation error. Understand CO 1 AME512.03
7 What are the basic components of displacement error? Remember CO 1 AME512.03
8 Write about clamping errors. Remember CO 1 AME512.03
9 Explain setting errors with neat sketches. Understand CO 1 AME512.03
10 How can you measure straightness? Remember CO 1 AME512.03
11 What are the different methods to check flatness? Understand CO 1 AME512.03
12 Write about different alignment test. Remember CO 1 AME512.03
13 What are the two major specifications for evaluating positioning accuracy of NC Remember CO 1 AME512.03
machine tools?
14 Write briefly different parallelism checking methods. Understand CO 1 AME512.03
15 Explain the NMTBA specification in NC system. Remember CO 1 AME512.03
16 Explain the VDI specification in NC system Understand CO 1 AME512.03
17 What is the importance of periodic errors in NC system? Remember CO 1 AME512.04
18 Explain the errors occurred in NC systems due to velocity lags. Understand CO 1 AME512.04
19 Explain the measuring instruments used in testing machine tools and their Remember CO 1 AME512.04
applications.
20 What is the influence of spindle rotation error in the boring operation? Remember CO 1 AME512.04
Part - C (Problem Solving and Critical Thinking Questions)
1 How alignment tests are performed and write important parameters to conduct Understand CO 1 AME512.01
alignment tests?
2 Explain the NMTBA specification in NC system. Remember CO 1 AME512.01
3 Explain the VDI specification in NC system Remember CO 1 AME512.02
4 What is the importance of periodic errors in NC system? Remember CO 1 AME512.02
 5 Explain the errors occurred in NC systems due to velocity lags. Remember CO 1 AME512.02
6 How can measure the spindle rotation errors Understand CO 1 AME512.03
7 What is the influence of spindle rotation on accuracy? Remember CO 1 AME512.03
8 What is the importance of alignment tests? Understand CO 1 AME512.03
9 What are the different errors that occur in NC machine tool system? Remember CO 1 AME512.04
10 What are the effects on dimensions due to wear of cutting tools? Remember CO 1 AME512.04
MODULE-II
INFLUENCE OF STATIC STIFFNESS,THERMAL EFFECTS
Part – A (Short Answer Questions)
1 What is static stiffness? Remember CO 2 AME512.05
2 Write the formula overall stiffness of lathe. Understand CO 2 AME512.05
3 Name the errors occurred due to variation of cutting force. Remember CO 2 AME512.05
4 Write the formula compliance of work piece. Understand CO 2 AME512.05
5 Draw the schematic diagram of work piece before clamping and after clamping. Remember CO 2 AME512.05
6 How do measure setting errors of work piece held in vice. Understand CO 2 AME512.05
7 Discuss the inaccuracies caused due to thermal effects. Remember CO 2 AME512.06
8 Draw the graph between dimensional wear and length of tool travel. Remember CO 2 AME512.06
9 Discuss briefly distribution of axial setting error of work piece held in collets. Understand CO 2 AME512.06
10 Write the formula for tool growth Understand CO 2 AME512.06
11 What is nominal differential expansion? Remember CO 2 AME512.07
12 How can you calculate thermal bending in case of single-slided clamping? Understand CO 2 AME512.07
13 What is MWTF system? Remember CO 2 AME512.05
14 Write an empirical expression for force normal to machined surface. Remember CO 2 AME512.07
15 What are sources the of forced vibrations in machine tools? Understand CO 2 AME512.07
16 Write the formula to find contact deformation. Remember CO 2 AME512.08
17 Draw the deflection curve along the length of work piece turned between centers. Understand CO 2 AME512.08
18 What is temperature variation error? Remember CO 2 AME512.08
19 How can calculate thermal error index? Understand CO 2 AME512.08
20 Draw the deflection curve caused by changing depth of cut. Remember CO 2 AME512.08
Part - B (Long Answer Questions)
1 Explain nature of deformation in a machine tool. Understand CO 2 AME512.05
2 Derive an expression for overall stiffness of a lathe. Understand CO 2 AME512.05
3 What are the errors occurred due to variation of cutting force? Remember CO 2 AME512.05
4 Explain briefly different methods to decrease thermal effects. Understand CO 2 AME512.05
5 How vibrations effect the waviness? Understand CO 2 AME512.05
6 What are the different methods of decreasing thermal effects? Remember CO 1 AME512.06
7 Write about compliance of work piece. Understand CO 2 AME512.06
8 What is the significance of forced vibration in various machine tools? Remember CO 2 AME512.06
9 How dimensional wear of cutting tools effects the accuracy? Understand CO 2 AME512.06
10 What are the errors occurred due to variation of total compliance? Remember CO 2 AME512.07
11 Explain deformation of slender members between two rigid members Understand CO 2 AME512.07
12 What are the errors due to compliance while machining on milling machines? Remember CO 2 AME512.07
13 Explain force deformation directions while machining various operations. Understand CO 2 AME512.07
14 What are thermal deformations in machine tools? Remember CO 2 AME512.07
15 How stabilization of temperature taking place in machine tools? Remember CO 2 AME512.08
16 How deflection calculations being done in multi tool machining? Understand CO 2 AME512.08
17 How do you distinguish horizontal and vertical vibrations in micromachining? Understand CO 2 AME512.08
18 Classify thermal effects in micromachining. Remember CO 2 AME512.08
19 What is thermal rigidity? How does it effects thermal inaccuracies? Remember CO 2 AME512.08
20 Write indirect assessment methods for thermal effects. Understand CO 2 AME512.08
Part - C (Problem Solving and Critical Thinking Questions)
1 Possibility of interfacing drastically reduces the thermal effects Explain with an Remember CO 2 AME512.05
example
2 Illustrate horizontal and vertical vibrations occurring in micromachining. Remember CO 2 AME512.05
3 Find deformation of slender members between two rigid members. Understand CO 2 AME512.05
4 How over all stiffness effects the accuracy in a lathe machine? Remember CO 2 AME512.06
5 What is the impact of vibrations on the waviness? Understand CO 2 AME512.06
6 What are different deformations contributing to compliance in a machine tool? Remember CO 2 AME512.06
 7 How surface finish is effected by forced vibrations by a single point cutting tool? Understand CO 2 AME512.07
8 What is the method to stabilize the temperature? Remember CO 2 AME512.07
9 How thermal rigidity effects the thermal inaccuracies in the machining process? Understand CO 2 AME512.08
10 How heat is carried away with in a machine? Remember CO 2 AME512.08
MODULE –III
PRECISION MACHINING
Part - A (Short Answer Questions)
1 Differentiate top down and bottom up approach. Remember CO 3 AME512.09
2 List different micro-machining methods. Understand CO 3 AME512.09
3 What is stereo lithography? Remember CO 3 AME512.09
4 What is meant by top down approach? Understand CO 3 AME512.09
5 What is meant by bottom up approach? Remember CO 3 AME512.09
6 What is micromachining process? Remember CO 3 AME512.10
7 Define micro cracking. Understand CO 3 AME512.10
8 What is micro fracturing? Remember CO 3 AME512.10
9 Why diamond turning is necessary? Understand CO 3 AME512.10
10 Where precision machining is used? Remember CO 3 AME512.10

11 Write most significant advantage of mirror grinding in ceramics Remember CO 3 AME512.10

12 What does infiltration mean in grinding ceramics? Understand CO 3 AME512.10
13 What is the built mass in mirrors? Remember CO 3 AME512.11
14 What is stereo lithography? Understand CO 3 AME512.11
15 What is meant by top down approach? Remember CO 3 AME512.11
16 Define micro cracking. Remember CO 3 AME512.12
17 What is micro fracturing? Understand CO 3 AME512.12
18 Differentiate top down and bottom up approach. Remember CO 3 AME512.12
19 List different micro-machining methods. Understand CO 3 AME512.12
20 Where precision machining is used? Remember CO 3 AME512.12
Part – B (Long Answer Questions)
1 How Nano materials are synthesized? Remember CO 3 AME512.09
2 Write different micro-machining methods with sketches? Understand CO 3 AME512.09
3 Explain top down approach in manufacturing of nano materials. Remember CO 3 AME512.09
4 Explain bottom up approach in manufacturing of nano materials. Understand CO 3 AME512.09
5 Explain constrained surface technique in micro-stereo lithography. Remember CO 3 AME512.09
6 Write about free surface technique in micro-stereo lithography. Remember CO 3 AME512.09
7 Explain the processing of grinding wheel conditioning in diamond micro Understand CO 3 AME512.10
machining
8 ‘Feed rate per revolution is directly proportional to tool nose radius’. How this Remember CO 3 AME512.10
parameter effects the surface roughness in diamond turning?
9 What are the challenges in diamond machining of brittle materials? Understand CO 3 AME512.10
10 How brittle to ductile transition taking place in diamond machining? Remember CO 3 AME512.10

11 Explain micro fracturing. Remember CO 3 AME512.10

12 Why micro sized block gauges are used in multiple combinations? Understand CO 3 AME512.11
13 How the block gauge step size is chosen in micro sized block gauges? Remember CO 3 AME512.11
14 How to calibrate the coefficient of thermal expansion in micro sized gauges? Understand CO 3 AME512.11
15 What is gauge interferometer in micro sized components? Remember CO 3 AME512.11
16 How to measure and remove burrs from a micro sized components? Remember CO 3 AME512.12
17 Write about double phased interferometer. Understand CO 3 AME512.12
18 What is thermal stabilization time of micro sized components? Remember CO 3 AME512.12
19 Explain plasma etching in mirror grinding process. Understand CO 3 AME512.12
20 How to measure damage penetration limit? Remember CO 3 AME512.12
Part – C (Problem Solving and Critical Thinking)
1 ‘The micro chambers and channels used in inkjet printers are produced by one of Understand CO 3 AME512.09
the micro machining processes’ discuss briefly.
2 Explain why bulk micro machining is widely used to make micro sized Remember CO 3 AME512.09
components
3 What is the deposition processes used in surface micro machining process? Remember CO 3 AME512.09
4 What is gauge interferometer in micro sized components? Understand CO 3 AME512.10
5 Explain plasma etching in mirror grinding process. Remember CO 3 AME512.10

6 Differentiate between the top down and bottom up approach. Understand CO 3 AME512.10
7 How do estimate thermal stabilization time of micro sized components? Remember CO 3 AME512.11
8 What is the method for calibration of the coefficient of thermal expansion in Remember CO 3 AME512.11
micro sized gauges?
9 What is the importance of plasma etching in the process of mirror grinding? Understand CO 3 AME512.12
10 How material is transformed from brittle to ductile in the diamond machining ? Remember CO 3 AME512.12
MODULE –IV
NANO MEASURING SYSTEMS
Part – A (Short Answer Questions)
1 What is the basic concept of pattern recognition system? Remember CO 4 AME512.13
2 Write the basic principle of electron beam lithography. Understand CO 4 AME512.13
3 What are mechanical measuring systems? Remember CO 4 AME512.13
4 Write the basic principle of laser interferometer Understand CO 4 AME512.13
5 Name different measurement methods in production process. Remember CO 4 AME512.14
6 What is purpose of scanning electron micro scope? Remember CO 4 AME512.14
7 What is purpose of transmission electron micro scope? Understand CO 4 AME512.14
8 Where Nano positioning and Nano measuring Machine is used? Remember CO 4 AME512.14
9 Write the applications of Nano positioning and Nano measuring Machine . Understand CO 4 AME512.14
10 What is the measuring range and resolution of Nano measuring Machine? Remember CO 4 AME512.15
11 Sketch the Laser interferometer for figure measurement. Remember CO 4 AME512.15
12 What is image processing? Understand CO 4 AME512.15
13 What do you mean by Touch Probe? Remember CO 4 AME512.15
14 Define nano tweezers. Understand CO 4 AME512.16
15 Define emitance. Remember CO 4 AME512.16
16 What is energy spread? Understand CO 4 AME512.16
17 What is the basic concept of pattern recognition system? Remember CO 4 AME512.16
18 Write the basic principle of electron beam lithography. Understand CO 4 AME512.16
19 What are mechanical measuring systems? Remember CO 4 AME512.16
20 Write the basic principle of laser interferometer Remember CO 4 AME512.16
Part – B (Long Answer Questions)
1 Explain different measurement methods in production processes. Remember CO 4 AME512.13
2 What are the features of mechanical measuring systems? Understand CO 4 AME512.13
3 Explain vertical resolution of profile instrument. Remember CO 4 AME512.13
4 Explain horizontal resolution of profile instrument. Understand CO 4 AME512.13
5 Write about post process and on machine measurement of dimensional features. Remember CO 4 AME512.13
6 How laser interferometer works? Remember CO 4 AME512.14
7 Explain optical figure measuring instruments. Understand CO 4 AME512.14
8 How can measure surface roughness by optical measuring instruments? Remember CO 4 AME512.14
9 Write about scanning electron microscopy. Understand CO 4 AME512.14
10 Explain transmission electron microscope. Remember CO 4 AME512.14
11 Drawn and explain block diagram of image processing unit. Remember CO 4 AME512.14
12 Write different industrial applications of pattern recognition. Understand CO 4 AME512.14
13 Explain wafer inspection systems. Remember CO 4 AME512.15
14 Describe pattern distortion and overlay Understand CO 4 AME512.15
15 Is atom holography necessary for nano instrumentation Explain. Remember CO 4 AME512.15
16 What are the susceptibility parameters of nano instrumentation? Understand CO 4 AME512.15
17 Explain different measurement methods in production processes. Remember CO 4 AME512.16
18 What are the features of mechanical measuring systems? Remember CO 4 AME512.16
19 Explain vertical resolution of profile instrument. Understand CO 4 AME512.16
20 Explain horizontal resolution of profile instrument. Remember CO 4 AME512.16
Part – C (Problem Solving and Critical Thinking)
1 The linear collider is used to measure beam size in electron beam measuring Remember CO 4 AME512.13
systems. What will be the minimum number of locations that it should be used?
2 What are the features of mechanical measuring systems? Understand CO 4 AME512.14
3 Explain vertical resolution of profile instrument. Remember CO 4 AME512.14
 4 Is atom holography necessary for nano instrumentation Explain. Understand CO 4 AME512.15
5 Explain horizontal resolution of profile instrument. Remember CO 4 AME512.16
6 What is the working principle of transition electron microscope? Remember CO 4
7 What is the working principle of scanning electron microscopy? Understand CO 4
8 Compare the SEM and TEM. Remember CO 4
9 In nano instrumentation how susceptibility parameters are varying? Understand CO 4
10 Discuss the horizontal resolution and vertical resolution in profile Remember CO 4
instrument.
MODULE -V
LITHOGRAPHY
Part - A (Short Answer Questions)
1 Define electron beam lithography. Understand CO 5 AME512.17
2 Write the concept of dip pen lithography. Remember CO 5 AME512.17
3 Draw the schematic diagram of photo lithographic process. Understand CO 5 AME512.17
4 Draw schematic diagram of ion beam lithography. Understand CO 5 AME512.17
5 What is the meaning of LIGA? Understand CO 5 AME512.17
6 What is the importance X-ray lithography? Remember CO 5 AME512.18
7 Write advantages of X-ray lithography? Understand CO 5 AME512.18
8 Write disadvantages of X-ray lithography? Remember CO 5 AME512.18
9 Write shortly on nano lithography. Understand CO 5 AME512.18
10 What are advantages of LIGA? Remember CO 5 AME512.18
11 Write applications of LIGA. Understand CO 5 AME512.19
12 What is deep UV? Understand CO 5 AME512.19
13 Write the applications of photo lithography. Remember CO 5 AME512.19
14 What is depth of focus? Understand CO 5 AME512.19
15 Define alignment marks. Remember CO 5 AME512.19
16 Explain with examples schematics. Understand CO 5 AME512.20
17 Write the disadvantages of EUV lithography. Understand CO 5 AME512.20
18 What are the disadvantages of X-ray lithography? Remember CO 5 AME512.20
19 Explain the problems with partial field chips. Understand CO 5 AME512.20
20 What is focus exposure matrix? Remember CO 5 AME512.20
Part - B (Long Answer Questions)
1 What are the parameters that influence the resolution of DPN? Understand CO 5 AME512.17
2 What are the steps to be followed in photo lithography? Remember CO 5 AME512.17
3 Explain ion beam lithography with neat sketch. Remember CO 5 AME512.17
4 What are the applications of DPN? Understand CO 5 AME512.17
5 Explain optical lithography with neat sketch. Remember CO 5 AME512.18
6 How ion beam lithography is different from the other lithography? Understand CO 5 AME512.18
7 What is the basic principle of optical lithography? Explain with sketch. Understand CO 5 AME512.18
8 Write about deep ultra violet lithography. Remember CO 5 AME512.18
9 What is the procedure for LIGA process? Remember CO 5 AME512.18
10 Mass separator is a setup that allows only required amount of ions with affixed Understand CO 5 AME512.18
mass charge .Explain.
11 Mention few methods to reduce the spot size of the beam in ion beam system. Understand CO 5 AME512.19
12 Describe briefly the basic lithography process Remember CO 5 AME512.19
13 Differentiate light field and dark field in the lithography? Remember CO 5 AME512.19
14 What is numerical aperture in lithographic modeling? Understand CO 5 AME512.19
15 What is resolution enhancement technique in lithography? Remember CO 5 AME512.19
16 What are uses of anti-reflective coating in lithography? Understand CO 5 AME512.20
17 What are partial fields and full fields? Understand CO 5 AME512.20
18 Explain the problem with partial field chips. Remember CO 5 AME512.20
19 Describe EUV and X- ray lithography. Remember CO 5 AME512.20
20 Describe the optical proximity correction in optical lithography. Understand CO 5 AME512.20
Part – C (Problem Solving and Critical Thinking)
1 Why optical lithography is so important in the field of lithography Understand CO 5 AME512.17
2 Mention few methods to reduce the spot size of the beam in ion beam system. Remember CO 5 AME512.17
3 Mass separator is a setup that allows only required amount of ions with affixed Remember CO 5 AME512.17
 mass charge .Explain.
4 Describe briefly the basic lithography process. Understand CO 5 AME512.18
5 Differentiate light field and dark field in the lithography. Remember CO 5 AME512.18
6 Differentiate between the partial fields and full fields. Understand CO 5 AME512.18
7 What is the importance of optical proximity correction in optical lithography. Remember CO 5 AME512.19
8 How do resolution enhancement techniques in lithography? Remember CO 5 AME512.19
9 What is the importance of optical lithography? Understand CO 5 AME512.20
10 What are the advantages and disadvantages of optical lithography? Remember CO 5 AME512.20

Prepared by:
Mr. G Sarat Raju , Assistant Professor

HOD, ME