Product Sample & Technical Tools & Support &

Folder Buy Documents Software Community

bq27542-G1
SLUSC33 – APRIL 2015

bq27542-G1 Single Cell Li-Ion Battery Fuel Gauge for Battery Pack Integration
1 Features 2 Applications
1• Battery Fuel Gauge for 1-Series (1sXp) Li-Ion • Smartphones
Applications up to 14,500-mAh Capacity • Tablets
• Microcontroller Peripheral Provides: • Digital Still and Video Cameras
– Accurate Battery Fuel Gauging Supports up to • Handheld Terminals
14,500 mAh • MP3 or Multimedia Players
– Internal or External Temperature Sensor for
Battery Temperature Reporting 3 Description
– SHA-1/HMAC Authentication The Texas Instruments bq27542-G1 Li-Ion battery
– Lifetime Data Logging fuel gauge is a microcontroller peripheral that
provides fuel gauging for single-cell Li-Ion battery
– 64 Bytes of Non-Volatile Scratch Pad FLASH packs. The device requires little system
• Battery Fuel Gauging Based on Patented microcontroller firmware development for accurate
Impedance Track™ Technology battery fuel gauging. The fuel gauge resides within
– Models Battery Discharge Curve for Accurate the battery pack or on the main board of the system
Time-To-Empty Predictions with an embedded battery (non-removable).
– Automatically Adjusts for Battery Aging, The fuel gauge uses the patented Impedance
Battery Self-Discharge, and Temperature/Rate Track™ algorithm for fuel gauging, and provides
Inefficiencies information such as remaining battery capacity
(mAh), state-of-charge (%), run-time to empty
– Low-Value Sense Resistor (5 mΩ to 20 mΩ) (minimum), battery voltage (mV), and temperature
• Advanced Fuel Gauging Features (°C). It also provides detections for internal short or
– Internal Short Detection tab disconnection events.
– Tab Disconnection Detection The fuel gauge also features integrated support for
• HDQ and I2C Interface Formats for secure battery pack authentication, using theSHA-
Communication with Host System 1/HMAC authentication algorithm.
• Small 12-pin 2.50 mm × 4.00 mm SON Package Device Information (1)
• Complies with Battery Trip Point (BTP) PART NUMBER PACKAGE BODY SIZE (NOM)
Requirements bq27542-G1 SON (12) 2.50 mm x 4.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

4 Simplified Schematic
Battery Pack
PACK+

VCC

REGIN LDO REG25

BAT
SE SE

HDQ HDQ
TS

SDA SDA

SCL SCL
SRP

PROTECTION SRN
IC VSS

PACK–

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

Table of Contents
1 Features .................................................................. 1 9 Detailed Description ............................................ 10
2 Applications ........................................................... 1 9.1 Overview ................................................................. 10
3 Description ............................................................. 1 9.2 Functional Block Diagram ....................................... 11
4 Simplified Schematic............................................. 1 9.3 Feature Description................................................. 12
9.4 Device Functional Modes........................................ 14
5 Revision History..................................................... 2
9.5 Programming........................................................... 16
6 Device Comparison Table..................................... 3
9.6 Power Control ......................................................... 17
7 Pin Configurations and Functions ....................... 3
9.7 Autocalibration ........................................................ 18
8 Specifications......................................................... 4 9.8 Communications ..................................................... 18
8.1 Absolute Maximum Ratings ...................................... 4
10 Application and Implementation........................ 22
8.2 ESD Ratings ............................................................ 4
10.1 Application Information.......................................... 22
8.3 Recommended Operating Conditions....................... 4
10.2 Typical Application ................................................ 22
8.4 Thermal Information .................................................. 5
10.3 Application Curves ............................................... 27
8.5 Electrical Characteristics: Power-On Reset .............. 5
11 Power Supply Recommendations ..................... 28
8.6 2.5-V LDO Regulator ............................................... 5
8.7 Internal Temperature Sensor Characteristics ........... 5 12 Layout................................................................... 28
12.1 Layout Guidelines ................................................ 28
8.8 Internal Clock Oscillators .......................................... 5
12.2 Layout Example .................................................... 29
8.9 Integrating ADC (Coulomb Counter) Characteristics 6
8.10 ADC (Temperature and Cell Voltage) 13 Device and Documentation Support ................. 30
Characteristics ........................................................... 6 13.1 Documentation Support ........................................ 30
8.11 Data Flash Memory Characteristics........................ 6 13.2 Community Resources.......................................... 30
8.12 Timing Requirements .............................................. 6 13.3 Trademarks ........................................................... 30
8.13 Timing Requirements: HDQ Communication ......... 7 13.4 Electrostatic Discharge Caution ............................ 30
8.14 Timing Requirements: I2C-Compatible Interface .... 8 13.5 Glossary ................................................................ 30
8.15 Typical Characteristics ............................................ 9 14 Mechanical, Packaging, and Orderable
Information ........................................................... 30

5 Revision History
DATE REVISION NOTES
April 2015 * Initial Release

2 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

6 Device Comparison Table

PRODUCTION COMMUNICATION TAPE AND REEL
PACKAGE TA
PART NO. (1) FORMAT QUANTITY
bq27542DRZR-G1 3000
SON-12 –40°C to 85°C I2C, HDQ (1)
bq27542DRZT-G1 250
2
(1) The bq27542-G1 device is shipped in I C mode.

7 Pin Configurations and Functions

(Top View)

SE 1 12 HDQ

REG25 2 11 SCL

REGIN 3 10 SDA

BAT 4 9 TS

VCC 5 8 SRN

VSS 6 7 SRP

Pin Functions
PIN
TYPE (1) DESCRIPTION
NAME NUMBER
BAT 4 I Cell-voltage measurement input. ADC input. Decouple with 0.1-μF capacitor.
HDQ serial communications line (Slave). Open-drain. Use with 10-kΩ pullup resistor (typical) or leave
HDQ 12 I/O
floating when it is not used.
REG25 2 P 2.5-V output voltage of the internal integrated LDO. Connect a minimum 0.47-μF ceramic capacitor.
REGIN 3 P The input voltage for the internal integrated LDO. Connect a 0.1-μF ceramic capacitor.
Slave I2C serial communications clock input line for communication with the system (slave). Open-drain
SCL 11 I
I/O. Use with a 10-kΩ pullup resistor (typical).
Slave I2C serial communications data line for communication with the system (slave). Open-drain I/O.
SDA 10 I/O
Use with a 10-kΩ pullup resistor (typical).
SE 1 O Shutdown Enable output. Push-pull output. Leave floating when it is not used.
Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRN is
SRN 8 IA
nearest the PACK– connection. Connect to 5-mΩ to 20-mΩ sense resistor.
Analog input pin connected to the internal coulomb counter with a Kelvin connection where SRP is
SRP 7 IA
nearest the CELL– connection. Connect to 5-mΩ to 20-mΩ sense resistor.
TS 9 IA Pack thermistor voltage sense (use 103AT-type thermistor). ADC input
VCC 5 P Processor power input. The minimum 0.47-μF capacitor connected to REG25 should be close to VCC.
VSS 6 P Device ground

(1) I/O = Digital input/output, IA = Analog input, P = Power connection

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

8 Specifications
8.1 Absolute Maximum Ratings
Over-operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VI Regulator input, REGIN –0.3 24 V
VCC Supply voltage range –0.3 2.75 V
VIOD Open-drain I/O pins (SDA, SCL, HDQ) –0.3 6 V
VBAT BAT input (pin 4) –0.3 6 V
VI Input voltage range to all others (pins 1, 7, 8, 9) –0.3 VCC + 0.3 V
TF Functional temperature range –40 100 °C
Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE UNIT
Human-body model (HBM), per All pins except 4 (BAT) ±2000
ANSI/ESDA/JEDEC JS-001 (1)
Pin 4 (BAT) ±1500
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC All pins
±250
specification JESD22-C101 (2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

TA = -40°C to 85°C; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V (unless otherwise noted)
MIN NOM MAX UNIT
No operating restrictions 2.7 5.5
VI Supply voltage, REGIN V
No FLASH writes 2.45 2.7
Fuel gauge in NORMAL mode
ICC Normal operating mode current (1) 131 μA
ILOAD > Sleep Current
Fuel gauge in SLEEP mode
I(SLP) Low-power operating mode current (1) 60 μA
ILOAD < Sleep Current
Fuel gauge in FULLSLEEP mode
I(FULLSLP) Low-power operating mode current (1) 21 μA
ILOAD < Sleep Current
Fuel gauge in HIBERNATE mode
I(HIB) Hibernate operating mode current (1) Available in I2C mode only. 6 μA
ILOAD < Hibernate Current
VOL Output voltage low (HDQ, SDA, SCL, SE) IOL = 3 mA 0.4 V
VOH(PP) Output high voltage (SE) IOH = –1 mA VCC – 0.5 V
External pullup resistor connected to
VOH(OD) Output high voltage (HDQ, SDA, SCL) VCC – 0.5 V
VCC
VIL Input voltage low (HDQ, SDA, SCL) –0.3 0.6 V
VIH Input voltage high (HDQ, SDA, SCL) 1.2 6 V
V(A1) Input voltage range (TS) VSS – 0.125 2 V
V(A2) Input voltage range (BAT) VSS – 0.125 5 V
V(A3) Input voltage range (SRP, SRN) VSS – 0.125 0.125 V
Ilkg Input leakage current (I/O pins) 0.3 μA
tPUCD Power-up communication delay 250 ms

(1) Specified by design. Not tested in production.

4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

8.4 Thermal Information

Over-operating free-air temperature range (unless otherwise noted)
bq27542-G1
(1)
THERMAL METRIC DRZ UNIT
(12 PINS)
RθJA Junction-to-ambient thermal resistance 64.1
RθJC(top) Junction-to-case (top) thermal resistance 59.8
RθJB Junction-to-board thermal resistance 52.7
°C/W
ψJT Junction-to-top characterization parameter 0.3
ψJB Junction-to-board characterization parameter 28.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.4

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.

8.5 Electrical Characteristics: Power-On Reset

TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIT+ Positive-going battery voltage input at VCC 2.05 2.20 2.31 V
VHYS Power-on reset hysteresis 115 mV

8.6 2.5-V LDO Regulator (1)

TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
2.7 V ≤ V(REGIN) ≤ 5.5 V,
2.4 2.5 2.6 V
Regulator output voltage, IOUT ≤ 16 mA TA = –40°C to
VO
REG25 2.45 V ≤ V(REGIN) < 2.7 V (low 85°C
2.4 V
battery), IOUT ≤ 3 mA
TA = –40°C to
IOS (2) Short circuit current limit V(REG25) = 0 V 250 mA
85°C

(1) LDO output current, IOUT, is the total load current. LDO regulator should be used to power internal fuel gauge only.
(2) Specified by design. Not production tested.

8.7 Internal Temperature Sensor Characteristics

TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
G(TEMP) Temperature sensor voltage gain –2.0 mV/°C

8.8 Internal Clock Oscillators

TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < (V(REGIN) = VBAT) < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6
V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f(OSC) Operating frequency 8.389 MHz
f(LOSC) Operating frequency 32.768 kHz

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

8.9 Integrating ADC (Coulomb Counter) Characteristics

TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN(SR) Input voltage range, V(SRN) and V(SRP) VSR = V(SRN) – V(SRP) –0.125 0.125 V
tCONV(SR) Conversion time Single conversion 1 s
Resolution 14 15 bits
VOS(SR) Input offset 10 μV
INL Integral nonlinearity error ±0.007 ±0.034 FSR
ZIN(SR) Effective input resistance (1) 2.5 MΩ
Ilkg(SR) Input leakage current (1) 0.3 μA

(1) Specified by design. Not production tested.

8.10 ADC (Temperature and Cell Voltage) Characteristics

TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN(ADC) Input voltage range –0.2 1 V
tCONV(ADC) Conversion time 125 ms
Resolution 14 15 bits
VOS(ADC) Input offset 1 mV
Z(ADC1) Effective input resistance (TS) (1) 5 kΩ
bq27542-G1 not measuring cell 8
MΩ
Z(ADC2) Effective input resistance (BAT) (1) voltage
bq27542-G1 measuring cell voltage 100 kΩ
Ilkg(ADC) Input leakage current (1) 0.3 μA

(1) Specified by design. Not production tested.

8.11 Data Flash Memory Characteristics

TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tDR Data retention (1) 10 Years
Flash programming write-cycles (1) 20,000 Cycles
(1)
tWORDPROG Word programming time 2 ms
ICCPROG Flash-write supply current (1) 5 10 mA

(1) Specified by design. Not production tested.

8.12 Timing Requirements

TA = –40°C to 85°C, CREG = 0.47 μF, 2.45 V < VREGIN = VBAT < 5.5 V; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
tr SCL/SDA rise time 300 ns
tf SCL/SDA fall time 300 ns
tw(H) SCL pulse width (high) 600 ns
tw(L) SCL pulse width (low) 1.3 μs
tsu(STA) Setup for repeated start 600 ns
td(STA) Start to first falling edge of SCL 600 ns
tsu(DAT) Data setup time 1000 ns
th(DAT) Data hold time 0 ns

6 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

Timing Requirements (continued)

TA = –40°C to 85°C, CREG = 0.47 μF, 2.45 V < VREGIN = VBAT < 5.5 V; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
tsu(STOP) Setup time for stop 600 ns
tBUF Bus free time between stop and start 66 μs
fSCL Clock frequency 400 kHz

8.13 Timing Requirements: HDQ Communication

TA = –40°C to 85°C, CREG = 0.47 μF, 2.45 V < VREGIN = VBAT < 5.5 V; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
t(CYCH) Cycle time, host to bq27542-G1 190 μs
t(CYCD) Cycle time, bq27542-G1 to host 190 205 250 μs
t(HW1) Host sends 1 to bq27542-G1 0.5 50 μs
t(DW1) bq27542-G1 sends 1 to host 32 50 μs
t(HW0) Host sends 0 to bq27542-G1 86 145 μs
t(DW0) bq27542-G1 sends 0 to host 80 145 μs
t(RSPS) Response time, bq27542-G1 to host 190 950 μs
t(B) Break time 190 μs
t(BR) Break recovery time 40 μs
t(RISE) HDQ line rising time to logic 1 (1.2 V) 950 ns
Turnaround time (time from the falling edge of the last
t(TRND) transmitted bit of 8-bit data and the falling edge of the 210 μs
next Break signal)

1.2V
t(B) t(BR) t(RISE)

(a) Break and Break Recovery (b) HDQ line rise time

t(HW1) t(DW1)
t(HW0) t(DW0)
t(CYCH) t(CYCD)

(c) Host Transmitted Bit (d) Gauge Transmitted Bit

1-bit
Break 7-bit address 8-bit data
R/W

t(RSPS)
(e) Gauge to Host Response

Figure 1. Timing Diagram, HDQ

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

8.14 Timing Requirements: I2C-Compatible Interface

TA = –40°C to 85°C, CREG = 0.47μF, 2.45 V < VREGIN = VBAT < 5.5 V; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
tr SCL/SDA rise time 300 ns
tf SCL/SDA fall time 300 ns
tw(H) SCL pulse width (high) 600 ns
tw(L) SCL pulse width (low) 1.3 μs
tsu(STA) Setup for repeated start 600 ns
td(STA) Start to first falling edge of SCL 600 ns
tsu(DAT) Data setup time 1000 ns
th(DAT) Data hold time 0 ns
tsu(STOP) Setup time for stop 600 ns
tBUF Bus free time between stop and start 66 μs
fSCL Clock frequency 400 kHz

tSU(STA) tw(H) tw(L) tf tr t(BUF)

SCL

SDA

td(STA) tf tsu(STOP)
tr
th(DAT) tsu(DAT)

REPEATED STOP START

START

Figure 2. I2C-Compatible Interface Timing Diagrams

8 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

8.15 Typical Characteristics

2.58 32.8

2.56 32.75

2.54 32.7
R E G 2 5 O u tp u t (V )

L F O (kH Z )
2.52 32.65

2.5 32.6

2.48 32.55

2.46 32.5
I OUT = 16 mA, REGIN = 5 V
I OUT = 3 mA, REGIN = 2.7 V
2.44 32.45
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (qC) Temperature (qC)
D001 D002

Figure 3. REG25 vs. Temperature Figure 4. Low Frequency Oscillator vs. Temperature
8.4

8.395

8.39
H F O (M H Z )

8.385

8.38

8.375

8.37

8.365
-40 -20 0 20 40 60 80 100
Temperature (qC)
D003

Figure 5. High Frequency Oscillator vs. Temperature

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

9 Detailed Description

9.1 Overview
The bq27542-G1 fuel gauge accurately predicts the battery capacity and other operational characteristics of a
single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such
as state-of-charge (SOC), time-to-empty (TTE), and time-to-full (TTF).
To minimize power consumption, the fuel gauge has different power modes: NORMAL, SLEEP, FULLSLEEP,
and HIBERNATE. The fuel gauge passes automatically between these modes, depending upon the occurrence
of specific events, though a system processor can initiate some of these modes directly. More details can be
found in Device Functional Modes.

NOTE

The following formatting conventions are used in this document:

Commands: italics with parentheses() and no breaking spaces, for example: RemainingCapacity()
Data Flash: italics, bold, and breaking spaces, for example: Design Capacity
Register Bits and Flags: italics with brackets[ ], for example: [TDA]
Data Flash Bits: italics, bold, and brackets[ ], for example: [LED1]
Modes and States: All capitals, for example: UNSEALED mode

10 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

9.2 Functional Block Diagram

REGIN LDO

POR
REG25

VCC

HFO

BAT SRN
CC
HFO LFO

HFO/128
4R

HFO/128
SRP
MUX
ADC
R
Wake
Comparator

TS
Internal
VCC Temp
Sensor
5k

HFO/4
SE SDA

22
Instruction I2C Slave
ROM Engine
22
CPU

VSS SCL

I/O Instruction
Controller FLASH

HDQ Slave
Engine HDQ

8 8

Wake
GP Timer
and Data Data
and
Watchdog SRAM FLASH
PWM
Timer

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

9.3 Feature Description

9.3.1 Fuel Gauging
The fuel gauge measures the cell voltage, temperature, and current to determine battery SOC based on the
Impedance Track algorithm. (Refer to the Theory and Implementation of Impedance Track Battery Fuel-Gauging
Algorithm Application Report [SLUA450] for more information.) The fuel gauge monitors charge and discharge
activity by sensing the voltage across a small-value resistor (5-mΩ to 20-mΩ, typical) between the SRP and SRN
pins and in series with the cell. By integrating the charge passing through the battery, the battery SOC is
adjusted during battery charge or discharge.
The total battery capacity is found by comparing states of charge before and after applying the load with the
amount of charge passed. When an application load is applied, the impedance of the cell is measured by
comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load.
Measurements of OCV and charge integration determine chemical state of charge and chemical capacity
(Qmax). The initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of
parallel cells. It is also used for the value in Design Capacity. The fuel gauge acquires and updates the battery-
impedance profile during normal battery usage. It uses this profile, along with SOC and the Qmax value, to
determine FullChargeCapacity() and StateOfCharge(), specifically for the present load and temperature.
FullChargeCapacity() is reported as capacity available from a fully charged battery under the present load and
temperature until Voltage() reaches the Terminate Voltage. NominalAvailableCapacity() and
FullAvailableCapacity() are the uncompensated (no or light load) versions of RemainingCapacity() and
FullChargeCapacity(), respectively.

9.3.2 Impedance Track Variables

The fuel gauge has several data flash variables that permit the user to customize the Impedance Track algorithm
for optimized performance. These variables depend on the power characteristics of the application, as well as the
cell itself.

9.3.3 System Control Function

The fuel gauge provides system control functions that allow the fuel gauge to enter SHUTDOWN mode to power-
off with the assistance of an external circuit or provide interrupt function to the system. Table 1 shows the
configurations for SE and HDQ pins.

Table 1. SE and HDQ Pin Functions

COMMUNICATION
[INTSEL] SE PIN FUNCTION HDQ PIN FUNCTION
MODE
I2C (1)
Not Used
0 (default) Interrupt Mode
HDQ HDQ Mode (2)
I2C Interrupt Mode
1 Shutdown Mode
HDQ HDQ Mode (2)

(1) [SE_EN] bit in Pack Configuration can be enabled to use [SE] and [SHUTDWN] bits in
CONTROL_STATUS() function. The SE pin shutdown function is disabled.
(2) HDQ pin is used for communication and HDQ Host Interrupt Feature is available.
9.3.3.1 SHUTDOWN Mode
In SHUTDOWN mode, the SE pin is used to signal external circuit to power-off the fuel gauge. This feature is
useful to shut down the fuel gauge in a deeply discharged battery to protect the battery. By default, SHUTDOWN
mode is in NORMAL state. By sending the SET_SHUTDOWN subcommand or setting the [SE_EN] bit in the
Pack Configuration register, the [SHUTDWN] bit is set and enables the shutdown feature. When this feature is
enabled and [INTSEL] is set, the SE pin can be in NORMAL state or SHUTDOWN state. The SHUTDOWN state
can be entered in HIBERNATE mode (only if HIBERNATE mode is enabled due to low cell voltage). All other
power modes will default the SE pin to NORMAL state. Table 2 shows the SE pin state in NORMAL or
SHUTDOWN mode. The CLEAR_SHUTDOWN subcommand or clearing [SE_EN] bit in the Pack Configuration
register can be used to disable SHUTDOWN mode.
The SE pin will be high impedance at power-on reset (POR); the [SE_POL] does not affect the state of SE pin at
POR. Also, [SE_PU] configuration changes will only take effect after POR. In addition, the [INTSEL] only controls
the behavior of the SE pin; it does not affect the function of [SE] and [SHUTDWN] bits.
12 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

Table 2. SE Pin State

SHUTDOWN Mode
[INTSEL] = 1 and
([SE_EN] or [SHUTDOWN] = 1)
[SE_PU] [SE_POL] NORMAL State SHUTDOWN State
0 0 High Impedance 0
0 1 0 High Impedance
1 0 1 0
1 1 0 1

9.3.3.2 INTERRUPT Mode

By using the INTERRUPT mode, the system can be interrupted based on detected fault conditions, as specified
in Table 5. The SE or HDQ pin can be selected as the interrupt pin by configuring the [INTSEL] bit based on SE
and HDQ pin functions. In addition, the pin polarity and pullup (SE pin only) can be configured according to the
system's needs, as described in Table 3 or Table 4.

Table 3. SE Pin in Interrupt Mode ([INTSEL] = 0)

[SE_PU] [INTPOL] INTERRUPT CLEAR INTERRUPT SET
0 0 High Impedance 0
0 1 0 High Impedance
1 0 1 0
1 1 0 1

Table 4. HDQ Pin in Interrupt Mode ([INTSEL] = 1)

[INTPOL] INTERRUPT CLEAR INTERRUPT SET
0 High Impedance 0
1 0 High Impedance

Table 5. Interrupt Mode Fault Conditions

INTERRUPT CONDITION Flags() STATUS BIT ENABLE CONDITION COMMENT
This interrupt is raised when the [SOC1]
SOC1 Set [SOC1] Always
flag is set.
This interrupt is raised when the [BATHI]
Battery High [BATHI] Always
flag is set.
This interrupt is raised when the
Battery Low [BATLOW] Always
[BATLOW] flag is set.
This interrupt is raised when the [OTC]
Over-Temperature Charge [OTC] OT Chg Time ≠ 0
flag is set.
Over-Temperature This interrupt is raised when the [OTD]
[OTD] OT Dsg Time ≠ 0
Discharge flag is set.
This interrupt is raised when the [ISD]
Internal Short Detection [ISD] [SE_ISD] = 1 in Pack Configuration B
flag is set.
This interrupt is raised when the [TDD]
Tab Disconnect Detection [TDD] [SE_TDD] = 1 in Pack Configuration B
flag is set.
This interrupt is raised when the [IMAX]
Imax [IMAX] [IMAXEN] = 1 in Pack Configuration D
flag is set.
This interrupt is raised when
RemainingCapacity() ≤ BTPSOC1Set() or
[BTP_EN] = 1 in Pack Configuration C . RemainingCapacity() ≥ BTPSOC1Clear()
The BTP interrupt supersedes all other during battery discharge or charge,
Battery Trip Point (BTP) [SOC1]
interrupt sources, which are unavailable respectively. The interrupt remains
when BTP is active. asserted until new values are written to
the BTPSOC1Set() and BTPSOC1Clear()
registers.

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 13

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

9.4 Device Functional Modes

The fuel gauge has three power modes: NORMAL, SLEEP, and HIBERNATE.
• In NORMAL mode the fuel gauge is fully powered and can execute any allowable task.
• In SLEEP mode the fuel gauge exists in a reduced-power state, periodically taking measurements and
performing calculations.
• In HIBERNATE mode, the fuel gauge is in a very low power state, but can be awoken by communication or
certain I/O activity.
The relationship between these modes is shown in Figure 6. Details are described in the sections that follow.

POR

Exit From HIBERNATE

VCELL < POR threshold
Exit From HIBERNATE
Communication Activity
NORMAL

OR Fuel gauging and data Exit From SLEEP

bq27541 clears Control Status updated every 1s Pack Configuration [SLEEP] = 0
[HIBERNATE] = 0 OR
Recommend Host also set Control | AverageCurrent( ) | > Sleep Current
Status [HIBERNATE] = 0 OR
Current is Detected above IWAKE

Entry to SLEEP
Pack Configuration [SLEEP] = 1
AND SLEEP
| AverageCurrent( ) |≤ Sleep Current
Fuel gauging and data
HIBERNATE
Wakeup From HIBERNATE updated every 20 seconds
Communication Activity
AND
Disable all bq27541 Comm address is NOT for bq27541
subcircuits except GPIO. Entry to WAITFULLSLEEP
Entry to FULLSLEEP If Full Sleep Wait Time > 0, Exit From WAITFULLSLEEP
Guage ignores Control Status Any Communication Cmd
If Full Sleep Wait Time = 0, [FULLSLEEP]
Host must set Control Status
[FULLSLEEP]=1
Exit From WAIT_HIBERNATE
Cell not relaxed
WAITFULLSLEEP
OR
| AverageCurrent() | =>Hibernate Current
FULLSLEEP Count Down

Exit From FULLSLEEP

Entry to FULLSLEEP Any Communication Cmd
Exit From WAIT_HIBERNATE Count <1 Note: Control Status [FULLSLEEP]
VCELL < Hibernate Voltage is cleared if Full Sleep Wait Time
(Supports SE pin shutdown function) WAIT_HIBERNATE <= 0

OR FULLSLEEP
Exit From SLEEP
Host has set Control Status
Cell relaxed
[HIBERNATE] = 1
Fuel gauging and data AND In low power state of SLEEP
| AverageCurrent() | < Hibernate Current
updated every 20 seconds mode. Gas gauging and data
updated every 20 seconds

System Shutdown System Sleep

Figure 6. Power Mode Diagram

9.4.1 NORMAL Mode

The fuel gauge is in NORMAL Mode when not in any other power mode. During this mode, AverageCurrent(),
Voltage(), and Temperature() measurements are taken, and the interface data set is updated. Decisions to
change states are also made. This mode is exited by activating a different power mode.
Because the gauge consumes the most power in NORMAL mode, the Impedance Track algorithm minimizes the
time the fuel gauge remains in this mode.

14 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

Device Functional Modes (continued)

9.4.2 SLEEP Mode
SLEEP mode is entered automatically if the feature is enabled (Pack Configuration [SLEEP] = 1) and
AverageCurrent() is below the programmable level Sleep Current. Once entry into SLEEP mode has been
qualified, but prior to entering it, the fuel gauge performs an ADC autocalibration to minimize offset.
While in SLEEP mode, the fuel gauge can suspend serial communications as much as 4 ms by holding the
comm line(s) low. This delay is necessary to correctly process host communication, since the fuel gauge
processor is mostly halted in SLEEP mode.
During the SLEEP mode, the fuel gauge periodically takes data measurements and updates its data set.
However, a majority of its time is spent in an idle condition.
The fuel gauge exits SLEEP if any entry condition is broken, specifically when: (1) AverageCurrent() rises above
Sleep Current, or (2) a current in excess of IWAKE through RSENSE is detected when the IWAKE comparator is
enabled.

9.4.3 FULLSLEEP Mode

FULLSLEEP mode is entered automatically when the bq27542-G1 is in SLEEP mode and the timer counts down
to 0 (Full Sleep Wait Time > 0). FULLSLEEP mode is entered immediately after entry to SLEEP if Full Sleep
Wait Time is set to 0 and the host sets the [FULLSLEEP] bit in the CONTROL_STATUS register using the
SET_FULLSLEEP subcommand.
During FULLSLEEP mode, the fuel gauge periodically takes data measurements and updates its data set.
However, a majority of its time is spent in an idle condition.
The gauge exits the FULLSLEEP mode when there is any communication activity. The [FULLSLEEP] bit can
remain set (Full Sleep Wait Time > 0) or be cleared (Full Sleep Wait Time ≤ 0) after exit of FULLSLEEP mode.
Therefore, EVSW communication activity might cause the gauge to exit FULLSLEEP MODE and display the
[FULLSLEEP] bit as clear. The execution of SET_FULLSLEEP to set [FULLSLEEP] bit is required when Full
Sleep Wait Time ≤ 0 in order to re-enter FULLSLEEP mode.
While in FULLSLEEP mode, the fuel gauge can suspend serial communications as much as 4 ms by holding the
comm line(s) low. This delay is necessary to correctly process host communication, since the fuel gauge
processor is mostly halted in SLEEP mode.
The fuel gauge exits FULLSLEEP if any entry condition is broken, specifically when: (1) AverageCurrent() rises
above Sleep Current, or (2) a current in excess of IWAKE through RSENSE is detected when the IWAKE comparator
is enabled.

9.4.4 HIBERNATE Mode

HIBERNATE mode should be used for long-term pack storage or when the host system needs to enter a low-
power state, and minimal gauge power consumption is required. This mode is ideal when the host is set to its
own HIBERNATE, SHUTDOWN, or OFF modes. The gauge waits to enter HIBERNATE mode until it has taken a
valid OCV measurement (cell relaxed) and the value of the average cell current has fallen below Hibernate
Current. When the conditions are met, the fuel gauge can enter HIBERNATE due to either low cell voltage or by
having the [HIBERNATE] bit of the CONTROL_STATUS register set. The gauge will remain in HIBERNATE
mode until any communication activity appears on the communication lines and the address is for bq27541. In
addition, the SE pin shutdown mode function is supported only when the fuel gauge enters HIBERNATE due to
low cell voltage.
When the gauge wakes up from HIBERNATE mode, the [HIBERNATE] bit of the CONTROL_STATUS register is
cleared. The host is required to set the bit to allow the gauge to re-enter HIBERNATE mode if desired.

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 15

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

Device Functional Modes (continued)

Because the fuel gauge is dormant in HIBERNATE mode, the battery should not be charged or discharged in this
mode, because any changes in battery charge status will not be measured. If necessary, the host equipment can
draw a small current (generally infrequent and less than 1 mA, for purposes of low-level monitoring and
updating); however, the corresponding charge drawn from the battery will not be logged by the gauge. Once the
gauge exits to NORMAL mode, the IT algorithm will take about 3 seconds to re-establish the correct battery
capacity and measurements, regardless of the total charge drawn in HIBERNATE mode. During this period of re-
establishment, the gauge reports values previously calculated prior to entering HIBERNATE mode. The host can
identify exit from HIBERNATE mode by checking if Voltage() < Hibernate Voltage or [HIBERNATE] bit is cleared
by the gauge.
If a charger is attached, the host should immediately take the fuel gauge out of HIBERNATE mode before
beginning to charge the battery. Charging the battery in HIBERNATE mode will result in a notable gauging error
that will take several hours to correct. It is also recommended to minimize discharge current during exit from
HIBERNATE.

9.5 Programming
9.5.1 Standard Data Commands
The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 6. Each
protocol has specific means to access the data at each Command Code. DataRAM is updated and read by the
gauge only once per second. Standard commands are accessible in NORMAL operation mode.

Table 6. Standard Commands

COMMAND NAME COMMAND CODE UNIT SEALED ACCESS
Control() 0x00 and 0x01 — RW
AtRate() 0x02 and 0x03 mA RW
UnfilteredSOC() 0x04 and 0x05 % R
Temperature() 0x06 and 0x07 0.1°K R
Voltage() 0x08 and 0x09 mV R
Flags() 0x0A and 0x0B — R
NomAvailableCapacity() 0x0C and 0x0D mAh R
FullAvailableCapacity() 0x0E and 0x0F mAh R
RemainingCapacity() 0x10 and 0x11 mAh R
FullChargeCapacity() 0x12 and 0x13 mAh R
AverageCurrent() 0x14 and 0x15 mA R
TimeToEmpty() 0x16 and 0x17 min R
FullChargeCapacityFiltered() 0x18 and 0x19 mAh R
SafetyStatus() 0x1A and 0x1B — R
FullChargeCapacityUnfiltered() 0x1C and 0x1D mAh R
Imax() 0x1E and 0x1F mA R
RemainingCapacityUnfiltered() 0x20 and 0x21 mAh R
RemainingCapacityFiltered() 0x22 and 0x23 mAh R
BTPSOC1Set() 0x24 and 0x25 mAh RW
BTPSOC1Clear() 0x26 and 0x27 mAh RW
InternalTemperature() 0x28 and 0x29 0.1°K R
CycleCount() 0x2A and 0x2B Counts R
StateofCharge() 0x2C and 0x2D % R
StateofHealth() 0x2E and 0x2F % / num R
ChargingVoltage() 0x30 and 0x31 mV R
ChargingCurrent) 0x32 and 0x33 mA R

16 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

Programming (continued)
Table 6. Standard Commands (continued)
COMMAND NAME COMMAND CODE UNIT SEALED ACCESS
PassedCharge() 0x34 and 0x35 mAh R
DOD0() 0x36 and 0x37 hex R
SelfDischargeCurrent() 0x34 and 0x35 mA R

9.5.1.1 Control(): 0x00 and 0x01

Issuing a Control() command requires a subsequent 2-byte subcommand. These additional bytes specify the
particular control function desired. The Control() command allows the system to control specific features of the
fuel gauge during normal operation and additional features when the fuel gauge is in different access modes, as
described in Table 7.

Table 7. Control() Subcommands

SUBCOMMAND SEALED
SUBCOMMAND NAME DESCRIPTION
CODE ACCESS
CONTROL_STATUS 0x0000 Yes Reports the status of DF Checksum, Impedance Track, and so on
DEVICE_TYPE 0x0001 Yes Reports the device type of 0x0541 (indicating bq27542-G1)
FW_VERSION 0x0002 Yes Reports the firmware version on the device type
HW_VERSION 0x0003 Yes Reports the hardware version on the device type
RESET_DATA 0x0005 Yes Returns reset data
PREV_MACWRITE 0x0007 Yes Returns previous Control() subcommand code
CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance Track configuration
BOARD_OFFSET 0x0009 No Forces the device to measure and store the board offset
CC_OFFSET 0x000A No Forces the device to measure the CC offset
DF_VERSION 0x000C Yes Reports the data flash version of the device
SET_FULLSLEEP 0x0010 Yes Sets the CONTROL_STATUS[FULLSLEEP] bit to 1
SET_SHUTDOWN 0x0013 Yes Sets the CONTROL_STATUS[SHUTDWN] bit to 1
CLEAR_SHUTDOWN 0x0014 Yes Clears the CONTROL_STATUS[SHUTDWN] bit to 1
SET_HDQINTEN 0x0015 Yes Forces CONTROL_STATUS [HDQHOSTIN] to 1
CLEAR_HDQINTEN 0x0016 Yes Forces CONTROL_STATUS [HDQHOSTIN] to 0
STATIC_CHEM_CHKSUM 0x0017 Yes Calculates chemistry checksum
ALL_DF_CHKSUM 0x0018 Yes Reports checksum for all data flash excluding device specific variables
STATIC_DF_CHKSUM 0x0019 Yes Reports checksum for static data flash excluding device specific variables
SYNC_SMOOTH 0x001E Yes Synchronizes RemCapSmooth() and FCCSmooth() with RemCapTrue()
and FCCTrue()
SEALED 0x0020 No Places the fuel gauge in SEALED access mode
IT_ENABLE 0x0021 No Enables the Impedance Track algorithm
IMAX_INT_CLEAR 0x0023 Yes Clears an Imax interrupt that is currently asserted on the RC2 pin
CAL_ENABLE 0x002D No Toggle CALIBRATION mode
RESET 0x0041 No Forces a full reset of the fuel gauge
EXIT_CAL 0x0080 No Exit CALIBRATION mode
ENTER_CAL 0x0081 No Enter CALIBRATION mode
OFFSET_CAL 0x0082 No Reports internal CC offset in CALIBRATION mode

9.6 Power Control

9.6.1 Reset Functions
When the fuel gauge detects a software reset by sending [RESET] Control() subcommand, it determines the type
of reset and increments the corresponding counter. This information is accessible by issuing the command
Control() function with the RESET_DATA subcommand.
Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

Power Control (continued)

9.6.2 Wake-Up Comparator
The wake up comparator is used to indicate a change in cell current while the fuel gauge is in SLEEP modes.
Pack Configuration uses bits [RSNS1, RSNS0] to set the sense resistor selection. Pack Configuration also
uses the [IWAKE] bit to select one of two possible voltage threshold ranges for the given sense resistor
selection. An internal interrupt is generated when the threshold is breached in either charge or discharge
directions. Setting [RSNS1] and [RSNS0] to 0 disables this feature.

Table 8. IWAKE Threshold Settings (1)

IWAKE RSNS1 RSNS0 Vth(SRP-SRN)
0 0 0 Disabled
1 0 0 Disabled
0 0 1 1.0 mV or –1.0 mV
1 0 1 2.2 mV or –2.2 mV
0 1 0 2.2 mV or –2.2 mV
1 1 0 4.6 mV or –4.6 mV
0 1 1 4.6 mV or –4.6 mV
1 1 1 9.8 mV or –9.8 mV

(1) The actual resistance value vs. the setting of the sense resistor is not important just the actual voltage
threshold when calculating the configuration. The voltage thresholds are typical values under room
temperature.

9.6.3 Flash Updates

Data Flash can only be updated if Voltage() ≥ Flash Update OK Voltage. Flash programming current can cause
an increase in LDO dropout. The value of Flash Update OK Voltage should be selected such that the VCC
voltage does not fall below its minimum of 2.4 V during Flash write operations.

9.7 Autocalibration
The fuel gauge provides an autocalibration feature that will measure the voltage offset error across SRP and
SRN from time-to-time as operating conditions change. It subtracts the resulting offset error from normal sense
resistor voltage, VSR, for maximum measurement accuracy.
Autocalibration of the ADC begins on entry to SLEEP mode, except if Temperature() is ≤ 5°C or Temperature() ≥
45°C.
The fuel gauge also performs a single offset calibration when: (1) the condition of AverageCurrent() ≤ 100 mA
and (2) {voltage change since last offset calibration ≥ 256 mV} or {temperature change since last offset
calibration is greater than 8°C for ≥ 60 seconds}.
Capacity and current measurements will continue at the last measured rate during the offset calibration when
these measurements cannot be performed. If the battery voltage drops more than 32 mV during the offset
calibration, the load current has likely increased considerably; hence, the offset calibration will be aborted.

9.8 Communications
9.8.1 HDQ Single-Pin Serial Interface
The HDQ interface is an asynchronous return-to-one protocol where a processor sends the command code to
the fuel gauge. With HDQ, the least significant bit (LSB) of a data byte (command) or word (data) is transmitted
first. Note that the DATA signal on pin 12 is open-drain and requires an external pullup resistor. The 8-bit
command code consists of two fields: the 7-bit HDQ command code (bits 0:6) and the 1-bit RW field (MSB bit 7).
The RW field directs the fuel gauge either to:
• Store the next 8 or 16 bits of data to a specified register, or
• Output 8 bits of data from the specified register
The HDQ peripheral can transmit and receive data as either an HDQ master or slave.

18 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

Communications (continued)
HDQ serial communication is normally initiated by the host processor sending a break command to the fuel
gauge. A break is detected when the DATA pin is driven to a logic-low state for a time t(B) or greater. The DATA
pin should then be returned to its normal ready high logic state for a time t(BR). The fuel gauge is now ready to
receive information from the host processor.
The fuel gauge is shipped in the I2C mode. TI provides tools to enable the HDQ peripheral. The SLUA408
application report provides details of HDQ communication basics.

9.8.2 HDQ Host Interruption Feature

The default fuel gauge behaves as an HDQ slave only device when HDQ mode is enabled. If the HDQ interrupt
function is enabled, the fuel gauge is capable of mastering and also communicating to a HDQ device. There is
no mechanism for negotiating who is to function as the HDQ master and care must be taken to avoid message
collisions. The interrupt is signaled to the host processor with the fuel gauge mastering an HDQ message. This
message is a fixed message that will be used to signal the interrupt condition. The message itself is 0x80 (slave
write to register 0x00) with no data byte being sent as the command is not intended to convey any status of the
interrupt condition. The HDQ interrupt function is disabled by default and needs to be enabled by command.
When the SET_HDQINTEN subcommand is received, the fuel gauge will detect any of the interrupt conditions
and assert the interrupt at 1-second intervals until the CLEAR_HDQINTEN command is received or the count of
HDQHostIntrTries has lapsed.
The number of tries for interrupting the host is determined by the data flash parameter named
HDQHostIntrTries.

9.8.2.1 Low Battery Capacity

This feature will work identically to SOC1. It will use the same data flash entries as SOC1 and will trigger
interrupts as long as SOC1 = 1 and HDQIntEN = 1.

9.8.2.2 Temperature
This feature will trigger an interrupt based on the OTC (Over-Temperature in Charge) or OTD (Over-Temperature
in Discharge) condition being met. It uses the same data flash entries as OTC or OTD and will trigger interrupts
as long as either the OTD or OTC condition is met and HDQIntEN = 1.

9.8.3 I2C Interface

The fuel gauge supports the standard I2C read, incremental read, one-byte write quick read, and functions. The
7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The 8-bit
device address is therefore 0xAA or 0xAB for write or read, respectively.

Host Generated Fuel Gauge Generated

S ADDR[6:0] 0 A CMD[7:0] A DATA[7:0] A P S ADDR[6:0] 1 A DATA[7:0] N P

(a) (b)

S ADDR[6:0] 0 A CMD[7:0] A Sr ADDR[6:0] 1 A DATA[7:0] N P

(c)

S ADDR[6:0] 0 A CMD[7:0] A Sr ADDR[6:0] 1 A DATA[7:0] A ... DATA[7:0] N P

(d)

Figure 7. Supported I2C Formats

(a) 1-byte write
(b) Quick read
(c) 1 byte-read
(d) Incremental read (S = Start, Sr = Repeated Start, A = Acknowledge, N = No Acknowledge, and P = Stop)

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 19

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

Communications (continued)
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the
I2C master. The quick writes function in the same manner and are a convenient means of sending multiple bytes
to consecutive command locations (such as two-byte commands that require two bytes of data).
Attempt to write a read-only address (NACK after data sent by master):

S ADDR[6:0] 0 A CMD[7:0] A DATA[7:0] A P

Attempt to read an address above 0x7F (NACK command):

S ADDR[6:0] 0 A CMD[7:0] N P

Attempt at incremental writes (NACK all extra data bytes sent):

S ADDR[6:0] 0 A CMD[7:0] A DATA[7:0] A DATA[7:0] N ... N P

Incremental read at the maximum allowed read address:

S ADDR[6:0] 0 A CMD[7:0] A Sr ADDR[6:0] 1 A DATA[7:0] A ... DATA[7:0] N P

Address Data From Data From

0x7F addr 0x7F addr 0x00

The I2C engine releases both SDA and SCL if the I2C bus is held low for t(BUSERR). If the fuel gauge was holding
the lines, releasing them frees the master to drive the lines. If an external condition is holding either of the lines
low, the I2C engine enters the low-power sleep mode.

9.8.3.1 I2C Time Out

The I2C engine will release both SDA and SCL if the I2C bus is held low for about 2 seconds. If the fuel gauge
was holding the lines, releasing them will free for the master to drive the lines.

9.8.3.2 I2C Command Waiting Time

To make sure the correct results of a command with the 400-kHz I2C operation, a proper waiting time should be
added between issuing command and reading results. For subcommands, the following diagram shows the
waiting time required between issuing the control command the reading the status with the exception of the
checksum command. A 100-ms waiting time is required between the checksum command and reading result. For
read-write standard commands, a minimum of 2 seconds is required to get the result updated. For read-only
standard commands, there is no waiting time required, but the host should not issue all standard commands
more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the
watchdog timer.

S ADDR[6:0] 0 A CMD[7:0] A DATA [7:0] A DATA [7:0] A P 66ms

S ADDR[6:0] 0 A CMD[7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms

Waiting time between control subcommand and reading results

S ADDR[6:0] 0 A CMD[7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A DATA [7:0] A

DATA [7:0] A DATA [7:0] N P 66ms

Waiting time between continuous reading results

20 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

Communications (continued)
9.8.3.3 I2C Clock Stretching
I2C clock stretches can occur during all modes of fuel gauge operation. In the SLEEP and HIBERNATE modes, a
short clock stretch will occur on all I2C traffic as the device must wake-up to process the packet. In NORMAL and
SLEEP+ modes, clock stretching will only occur for packets addressed for the fuel gauge. The timing of stretches
will vary as interactions between the communicating host and the gauge are asynchronous. The I2C clock
stretches may occur after start bits, the ACK/NAK bit and first data bit transmit on a host read cycle. The majority
of clock stretch periods are small (≤ 4 ms) as the I2C interface peripheral and CPU firmware perform normal data
flow control. However, less frequent but more significant clock stretch periods may occur when data flash (DF) is
being written by the CPU to update the resistance (Ra) tables and other DF parameters such as Qmax. Due to
the organization of DF, updates need to be written in data blocks consisting of multiple data bytes.
An Ra table update requires erasing a single page of DF, programming the updated Ra table and a flag. The
potential I2C clock stretching time is 24 ms maximum. This includes 20-ms page erase and 2-ms row
programming time (×2 rows). The Ra table updates occur during the discharge cycle and at up to 15 resistance
grid points that occur during the discharge cycle.
A DF block write typically requires a maximum of 72 ms. This includes copying data to a temporary buffer and
updating DF. This temporary buffer mechanism is used to protect from power failure during a DF update. The
first part of the update requires 20 ms to erase the copy buffer page, 6 ms to write the data into the copy buffer
and the program progress indicator (2 ms for each individual write). The second part of the update is writing to
the DF and requires 44 ms for DF block update. This includes a 20-ms each page erase for two pages and 2-ms
each row write for two rows.
In the event that a previous DF write was interrupted by a power failure or reset during the DF write, an
additional 44-ms maximum DF restore time is required to recover the data from a previously interrupted DF write.
In this power failure recovery case, the total I2C clock stretching is 116 ms maximum.
Another case where I2C clock stretches is at the end of discharge. The update to the last discharge data will go
through the DF block update twice because two pages are used for the data storage. The clock stretching in this
case is 144 ms maximum. This occurs if there has been a Ra table update during the discharge.

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 21

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

10 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

10.1 Application Information

The bq27542-G1 fuel gauge is a microcontroller peripheral that provides fuel gauging for single-cell Li-Ion battery
packs. The integrated delta-sigma converters provide accurate, high precision measurements for voltage,
current, and temperature in order to accomplish effective battery gauging. To allow for optimal performance in
the end application, special considerations must be taken to ensure minimization of measurement error through
proper printed circuit board (PCB) board layout and correct configuration of battery characteristics in the fuel
gauge data flash.

10.2 Typical Application

J10

R20
4.7k

MM3511
3 6
5 2
4 1

R7, R8, and R9 are optional pulldown resistors if pullup resistors are applied.

Figure 8. Typical Application

22 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

Typical Application (continued)

10.2.1 Design Requirements
Several key parameters must be updated to align with a given application's battery characteristics. For highest
accuracy gauging, it is important to follow-up this initial configuration with a learning cycle to optimize resistance
and maximum chemical capacity (Qmax) values prior to sealing and shipping packs to the field. Successful and
accurate configuration of the fuel gauge for a target application can be used as the basis for creating a "golden"
file that can be written to all production packs, assuming identical pack design and Li-Ion cell origin (chemistry,
lot, and so forth). Calibration data can be included as part of this golden file to cut down on battery pack
production time. If going this route, it is recommended to average the calibration data from a large sample size
and use these in the golden file. Ideally, it is recommended to calibrate all packs individually as this will lead to
the highest performance and lowest measurement error in the end application on a per-pack basis. In addition,
the integrated protection functionality should be correctly configured to ensure activation based on the fault
protection needs of the target pack design, or else accidental trip could be possible if using defaults. Table 9,
Key Data Flash Parameters for Configuration, shows the items that should be configured to achieve reliable
protection and accurate gauging with minimal initial configuration.

Table 9. Key Data Flash Parameters for Configuration

NAME DEFAULT UNIT RECOMMENDED SETTING
Set based on the nominal pack capacity as interpreted from cell manufacturer's
Design Capacity 1000 mAh
datasheet. If multiple parallel cells are used, should be set to N × Cell Capacity.
Set based on the nominal pack energy (nominal cell voltage × nominal cell
Design Energy 3800 mWh capacity) as interpreted from the cell manufacturer's datasheet. If multiple parallel
cells are used, should be set to N × Cell Energy.
Set to 10 to convert all power values to cWh or to 1 for mWh. Design Energy is
Design Energy Scale 1 —
divided by this value.
Set to desired runtime remaining (in seconds / 3600) × typical applied load
Reserve Capacity 0 mAh
between reporting 0% SOC and reaching Terminate Voltage, if needed.
Design Voltage 3800 mV Set to nominal cell voltage per manufacturer datasheet.
Cycle Count Threshold 900 mAh Set to 90% of configured Design Capacity
Should be configured using TI-supplied Battery Management Studio software.
Default open-circuit voltage and resistance tables are also updated in conjunction
Device Chemistry 0354 hex with this step. Do not attempt to manually update reported Device Chemistry as
this does not change all chemistry information! Always update chemistry using
the appropriate software tool (that is, BMS).
Load Mode 1 — Set to applicable load model, 0 for constant current or 1 for constant power.
Load Select 1 — Set to load profile which most closely matches typical system load.
Set to initial configured value for Design Capacity. The gauge will update this
Qmax Cell 0 1000 mAh parameter automatically after the optimization cycle and for every regular Qmax
update thereafter.
Set to nominal cell voltage for a fully charged cell. The gauge will update this
V at Chg Term 4350 mV
parameter automatically each time full charge termination is detected.
Set to empty point reference of battery based on system needs. Typical is
Terminate Voltage 3000 mV
between 3000 and 3200 mV.
Ra Max Delta 43 mΩ Set to 15% of Cell0 R_a 4 resistance after an optimization cycle is completed.
Set based on nominal charge voltage for the battery in normal conditions (25°C,
Charging Voltage 4350 mV and so on). Used as the reference point for offsetting by Taper Voltage for full
charge termination detection.
Set to the nominal taper current of the charger + taper current tolerance to ensure
Taper Current 100 mA
that the gauge will reliably detect charge termination.
Sets the voltage window for qualifying full charge termination. Can be set tighter
Taper Voltage 100 mV to avoid or wider to ensure possibility of reporting 100% SOC in outer JEITA
temperature ranges that use derated charging voltage.
Sets threshold for gauge detecting battery discharge. Should be set lower than
Dsg Current Threshold 60 mA
minimal system load expected in the application and higher than Quit Current.
Sets the threshold for detecting battery charge. Can be set higher or lower
Chg Current Threshold 75 mA depending on typical trickle charge current used. Also should be set higher than
Quit Current.

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 23

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

Typical Application (continued)

Table 9. Key Data Flash Parameters for Configuration (continued)
NAME DEFAULT UNIT RECOMMENDED SETTING
Sets threshold for gauge detecting battery relaxation. Can be set higher or lower
Quit Current 40 mA
depending on typical standby current and exhibited in the end system.
Current profile used in capacity simulations at onset of discharge or at all times if
Avg I Last Run –299 mA Load Select = 0. Should be set to nominal system load. Is automatically updated
by the gauge every cycle.
Power profile used in capacity simulations at onset of discharge or at all times if
Avg P Last Run –1131 mW Load Select = 0. Should be set to nominal system power. Is automatically
updated by the gauge every cycle.
Sets the threshold at which the fuel gauge enters SLEEP Mode. Take care in
Sleep Current 15 mA setting above typical standby currents else entry to SLEEP may be
unintentionally blocked.
Sets the boundary between charging inhibit / suspend and charging with T1-T2
T1 Temp 0 °C
parameters. Defaults set based on recommended values from JEITA standard.
Sets the boundary between charging with T1-T2 or T2-T3 parameters. Defaults
T2 Temp 10 °C
set based on recommended values from JEITA standard.
Sets the boundary between charging with T2-T3 or T3-T4 parameters. Defaults
T3 Temp 45 °C
set based on recommended values from JEITA standard.
Sets the boundary between charging with T4-T5 or T4-T5 parameters. Also
T4 Temp 50 °C serves as charge inhibit boundary if initiating new charging event. Defaults set
based on recommended values from JEITA standard.
Sets the boundary between charging suspend and charging with T4-T5
T5 Temp 60 °C
parameters. Refer to JEITA standard for compliance.
Adds temperature hysteresis for boundary crossings to avoid oscillation if
Temp Hys 1 °C
temperature is changing by a degree, approximately, on a given boundary.
Sets reported charge voltage when inside of T1 Temp and T2 Temp range.
T1-T2 Chg Voltage 4350 mV
Defaults set based on recommended values from JEITA standard.
Sets reported charge voltage when inside of T2 Temp and T3 Temp range.
T2-T3 Chg Voltage 4350 mV
Defaults set based on recommended values from JEITA standard.
Sets reported charge voltage when inside of T3 Temp and T4 Temp range.
T3-T4 Chg Voltage 4300 mV
Defaults set based on recommended values from JEITA standard.
Sets reported charge voltage when inside of T4 Temp and T5 Temp range.
T4-T5 Chg Voltage 4250 mV
Defaults set based on recommended values from JEITA standard.
Sets reported charge current when inside of T1 Temp and T2 Temp range.
T1-T2 Chg Current 50 %
Defaults set based on recommended values from JEITA standard.
Sets reported charge current when inside of T2 Temp and T3 Temp range.
T2-T3 Chg Current 80 %
Defaults set based on recommended values from JEITA standard.
Sets reported charge current when inside of T3 Temp and T4 Temp range.
T3-T4 Chg Current 80 %
Defaults set based on recommended values from JEITA standard.
Sets reported charge current when inside of T4 Temp and T5 Temp range.
T4-T5 Chg Current 80 %
Defaults set based on recommended values from JEITA standard.
Set to desired temperature at which charging is prohibited to prevent cell damage
OT Chg 55.0 °C
due to excessive ambient temperature.
Set to desired time before CHG FET is disabled based on overtemperature.
OT Chg Time 5 s Because temperature changes much more slowly than other fault conditions, the
default setting is sufficient for most application.
OT Chg Recovery 50.0 °C Set to the temperature threshold at which charging is no longer prohibited.
Set to desired temperature at which discharging is prohibited to prevent cell
OT Dsg 60.0 °C
damage due to excessive ambient temperature.
Set to desired time before DSG FET is disabled based on overtemperature.
OT Dsg Time 5 s Because temperature changes much more slowly than other fault conditions, the
default setting is sufficient for most application.
OT Dsg Recovery 55.0 °C Set to the temperature threshold at which cell discharging is no longer prohibited.
Calibrate this parameter using TI-supplied BMS software and calibration
CC Gain 5 mΩ procedure in the TRM. Determines conversion of coulomb counter measured
sense resistor voltage to current.

24 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

Typical Application (continued)

Table 9. Key Data Flash Parameters for Configuration (continued)
NAME DEFAULT UNIT RECOMMENDED SETTING
Calibrate this parameter using TI-supplied BMS software and calibration
CC Delta 5.074 mΩ procedure in the TRM. Determines conversion of coulomb counter measured
sense resistor voltage to passed charge.
Calibrate this parameter using TI-supplied BMS software and calibration
CC Offset 6.874 mA procedure in the TRM. Determines native offset of coulomb counter hardware
that should be removed from conversions.
Calibrate this parameter using TI-supplied BMS software and calibration
Board Offset 0.66 µA procedure in the TRM. Determines native offset of the printed circuit board
parasitics that should be removed from conversions.
Calibrate this parameter using TI-supplied BMS software and calibration
procedure in the TRM. Determines voltage offset between cell tab and ADC input
Pack V Offset 0 mV
node to incorporate back into or remove from measurement, depending on
polarity.

10.2.2 Detailed Design Procedure

10.2.2.1 BAT Voltage Sense Input

A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing
its influence on battery voltage measurements. It proves most effective in applications with load profiles that
exhibit high frequency current pulses (that is, cell phones) but is recommended for use in all applications to
reduce noise on this sensitive high impedance measurement node.
The series resistor between the battery and the BAT input is used to limit current that could be conducted
through the chip-scale package's solder bumps in the event of an accidental short during the board assembly
process. The resistor is not likely to survive a sustained short condition (depends on power rating); however, it
sacrifices the much cheaper resistor component over suffering damage to the fuel gauge die itself.

10.2.2.2 SRP and SRN Current Sense Inputs

The filter network at the input to the coulomb counter is intended to improve differential mode rejection of voltage
measured across the sense resistor. These components should be placed as close as possible to the coulomb
counter inputs and the routing of the differential traces length-matched in order to best minimize impedance
mismatch-induced measurement errors. The single-ended ceramic capacitors should be tied to the battery
voltage node (preferably to a large copper pour connected to the SRN side of the sense resistor) in order to
further improve common-mode noise rejection. The series resistors between the CC inputs and the sense
resistor should be at least 200 Ω in order to mitigate SCR-induced latch-up due to possible ESD events.

10.2.2.3 Sense Resistor Selection

Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect
the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense
resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard
recommendation based on best compromise between performance and price is a 1% tolerance, 50 ppm drift
sense resistor with a 1-W power rating.

10.2.2.4 TS Temperature Sense Input

Similar to the BAT pin, a ceramic decoupling capacitor for the TS pin is used to bypass AC voltage ripple away
from the high-impedance ADC input, minimizing measurement error. Another helpful advantage is that the
capacitor provides additional ESD protection since most thermistors are handled and manually soldered to the
PCB as a separate step in the factory production flow. As before, it should be placed as close as possible to the
respective input pin for optimal filtering performance.

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 25

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

10.2.2.5 Thermistor Selection

The fuel gauge temperature sensing circuitry is designed to work with a negative temperature coefficient-type
(NTC) thermistor with a characteristic 10-kΩ resistance at room temperature (25°C). The default curve-fitting
coefficients configured in the fuel gauge specifically assume a 103AT-2 type thermistor profile and so that is the
default recommendation for thermistor selection purposes. Moving to a separate thermistor resistance profile (for
example, JT-2 or others) requires an update to the default thermistor coefficients in data flash to ensure highest
accuracy temperature measurement performance.

10.2.2.6 REGIN Power Supply Input Filtering

A ceramic capacitor is placed at the input to the fuel gauge's internal LDO in order to increase power supply
rejection (PSR) and improve effective line regulation. It ensures that voltage ripple is rejected to ground instead
of coupling into the device's internal supply rails.

10.2.2.7 REG25 LDO Output Filtering

A ceramic capacitor is also needed at the output of the internal LDO in order to provide a current reservoir for
fuel gauge load peaks during high peripheral utilization. It acts to stabilize the regulator output and reduce core
voltage ripple inside of the device.

10.2.2.8 Communication Interface Lines

A protection network composed of resistors and zener diodes is recommended on each of the serial
communication inputs to protect the fuel gauge from dangerous ESD transients. The Zener should be selected to
break down at a voltage larger than the typical pullup voltage for these lines but less than the internal diode
clamp breakdown voltage of the device inputs (~6 V). A zener voltage of 5.6 V is typically recommended. The
series resistors are used to limit the current into the Zener diode and prevent component destruction due to
thermal strain once it goes into breakdown. 100 Ω is typically recommended for these resistance values.

10.2.2.9 PACKP Voltage Sense Input

Inclusion of a 2-kΩ series resistor on the PACKP input allows it to tolerate a charger overvoltage event up to
28 V without device damage. The resistor also protects the device in the event of a reverse polarity charger
input, since the substrate diode will be forward biased and attempt to conduct charger current through the fuel
gauge (as well as the high FETs). An external reverse charger input FET clamp can be added to short the DSG
FET gate to its source terminal, forcing the conduction channel off when negative voltage is present at PACK+
input to the battery pack and preventing large battery discharge currents. A ceramic capacitor connected at the
PACKP pin helps to filter voltage into the comparator sense lines used for checking charger and load presence.
In addition, in the Low Voltage Charging State, the minimal circuit elements that are operational are powered
from this input pin and require a stable supply.

26 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

10.3 Application Curves

2.58 32.8

2.56 32.75

2.54 32.7
R E G 2 5 O u tp u t (V )

L F O (kH Z )
2.52 32.65

2.5 32.6

2.48 32.55

2.46 32.5
I OUT = 16 mA, REGIN = 5 V
I OUT = 3 mA, REGIN = 2.7 V
2.44 32.45
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (qC) Temperature (qC)
D001 D002

Figure 9. REG25 vs. Temperature Figure 10. Low Frequency Oscillator vs. Temperature
8.4

8.395

8.39
H F O (M H Z )

8.385

8.38

8.375

8.37

8.365
-40 -20 0 20 40 60 80 100
Temperature (qC)
D003

Figure 11. High Frequency Oscillator vs. Temperature

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 27

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

11 Power Supply Recommendations

The REGIN input pin and the REG25 output pin require low equivalent series resistance (ESR) ceramic
capacitors placed as closely as possible to the respective pins to optimize ripple rejection and provide a stable
and dependable power rail that is resilient to line transients. A 0.1-µF capacitor at the REGIN and a 0.47-µF
capacitor at REG25 will suffice for satisfactory device performance.

12 Layout

12.1 Layout Guidelines

12.1.1 Lithium-Ion Cell Connections
For highest voltage measurement accuracy, it is critical to connect the BAT pin directly to the battery terminal
PCB pad. This avoids measurement errors caused by IR drops when high charge or discharge currents are
flowing. Connecting right at the positive battery terminal with a Kelvin connection ensures the elimination of
parasitic resistance between the point of measurement and the actual battery terminal. Likewise the low current
ground return for the fuel gauge and all related passive components should be star-connected right at the
negative battery terminal. This technique minimizes measurement error due to current-induced ground offsets
and also improves noise performance through prevention of ground bounce that could occur with high current
and low current returns intersecting ahead of the battery ground. The bypass capacitor for this sense line needs
to be placed as close as possible to the BAT input pin.

12.1.2 Sense Resistor Connections

Kelvin connections at the sense resistor are just as critical as those for the battery terminals themselves. The
differential traces should be connected at the inside of the sense resistor pads and not anywhere along the high
current trace path in order to prevent false increases to measured current that could result when measuring
between the sum of the sense resistor and trace resistance between the tap points. In addition, the routing of
these leads from the sense resistor to the input filter network and finally into the SRP and SRN pins needs to be
as closely matched in length as possible else additional measurement offset could occur. It is further
recommended to add copper trace or pour-based "guard rings" around the perimeter of the filter network and
coulomb counter inputs to shield these sensitive pins from radiated EMI into the sense nodes. This prevents
differential voltage shifts that could be interpreted as real current change to the fuel gauge. All of the filter
components need to be placed as close as possible to the coulomb counter input pins.

12.1.3 Thermistor Connections

The thermistor sense input should include a ceramic bypass capacitor placed as close to the TS input pin as
possible. The capacitor helps to filter measurements of any stray transients as the voltage bias circuit pulses
periodically during temperature sensing windows.

12.1.4 High Current and Low Current Path Separation

For best possible noise performance, it is extremely important to separate the low current and high current loops
to different areas of the board layout. The fuel gauge and all support components should be situated on one side
of the boards and tap off of the high current loop (for measurement purposes) at the sense resistor. Routing the
low current ground around instead of under high current traces will further help to improve noise rejection.

28 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 bq27542-G1
www.ti.com SLUSC33 – APRIL 2015

12.2 Layout Example

Battery Pack
PACKP
Use copper
pours for battery
power path to
minimize IR

RTHERM
losses

RESD1 RESD2
Place capacitors SE HDQ HDQ
close to gauge
IC. Trace to pin
Kelvin connect and VSS should RESD3 RESD4
BAT sense line be short REG25 SCL SCL
right at positive
battery terminal RESD5 RESD4
REGIN SDA SDA

PACKN
BAT TS
CREGIN
CBAT
Li-Ion CVCC
VCC SRN Use short and wide
Cell traces to minimize
inductance
VSS SRP

Protection
Star ground right at PACK-
IC
for ESD return path

10mŸ1%
NFET NFET

Kelvin connect SRP

Via connects to Power Ground
and SRN
connections right at
Rsense terminals

Figure 12. Layout Example

Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 29

Product Folder Links: bq27542-G1
bq27542-G1
SLUSC33 – APRIL 2015 www.ti.com

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation
For related documentation, see the following:
• bq27542-G1 Technical Reference Manual (SLUUB65)
• IC Package Thermal Metrics (SPRA953)
• Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm Application Report
(SLUA450)

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

13.3 Trademarks
Impedance Track, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

30 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: bq27542-G1

 PACKAGE OPTION ADDENDUM

www.ti.com 12-May-2015

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

BQ27542DRZR-G1 ACTIVE SON DRZ 12 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ
& no Sb/Br) 7542
BQ27542DRZT-G1 ACTIVE SON DRZ 12 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ
& no Sb/Br) 7542

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 12-May-2015

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-May-2015

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ27542DRZR-G1 SON DRZ 12 3000 330.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2
BQ27542DRZT-G1 SON DRZ 12 250 180.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 1-May-2015

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ27542DRZR-G1 SON DRZ 12 3000 552.0 367.0 36.0
BQ27542DRZT-G1 SON DRZ 12 250 552.0 185.0 36.0

Pack Materials-Page 2
 IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated