Product ID Document Name

J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies 

IPC-HDBK- Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies 
001
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 
J-STD-003 Solderability Tests for Printed Boards 
SMEMA 3.1 Fiducial Mark Standard 
J-STD-004 Requirements for Soldering Fluxes 
SMEMA 4 Reflow Terms and Definitions 
J-STD-005 Requirements for Soldering Pastes 
SMC-WP-005 PWB Surface Finishes 
IPC-HDBK- Guide to Solder Paste Assessment
005 5
SMEMA Screen Printing Terms and Definitions 
J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices 
J-STD-033 Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices 
IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits 
IPC-DRM-53 Introduction to Electronics Assembly 
IPC-CH-65 Guidelines for Cleaning of Printed Boards and Assemblies 
J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes
IPC-PC-90 General Requirements for Implementation of Statistical Process Control 
IPC-QS-95 General Requirements for Implementation of ISO 9000 Quality Systems 
IPC-D-300 Printed Board Dimensions and Tolerances 
IPC-PD-335 Electronic Packaging Handbook 
IPC-A-610 Acceptability of Electronic Assemblies 
IPC-D-620 Design and Critical Process Requirements for Cable and Wiring Harnesses
IPC/WHMA-A- Acceptability of Electronic Wire Harnesses and Cables
620
IPC-A-630 Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures
IPC-AI-641 User’s Guidelines for Automated Solder Joint Inspection 
IPC-OI-645 Standard for Visual Optical Inspection Aids 
IPC-TM-650 Test Methods Manual 
IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 
IPC-QL-653 Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material 
IPC-MI-660 Incoming Inspection of Raw Materials Manual 
IPC-R-700 Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies 
IPC-S-804 Solderability Test Methods for Printed Wiring Boards 
IPC-S-805 Solderability Tests for Component Leads and Terminations 
IPC-S-815 General Requirements for Soldering Electronic Interconnections 
IPC-S-816 SMT Process Guideline and Checklist 
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives
IPC-SF-818 General Requirement for Electronic Soldering Fluxes 
IPC-SP-819 General Requirements and Test Methods for Electronic Grade Solder Paste 
IPC-AJ-820 Assembly and Joining Handbook
IPC-HDBK- Guidelines for Design, Selection and Application of Conformal Coatings
830
IPC-SM-839 Pre and Post Solder Mask Application Cleaning Guidelines 
IPC-HDBK- Solder Mask Handbook
840
IPC-1066 Labeling of PCBs and Assemblies
 IPC-1601 Printed Board Handling and Storage Guidelines
IPC-1710 OEM Standard for Printed Board Manufacturers’ Qualification Profile (MQP) 
IPC-1720 Assembly Qualification Profile (AQP) 
IPC-1730 Laminator Qualification Profile (LQP) 
IPC-1731 Strategic Raw Materials Supplier Qualification Profile 
IPC-1751 Generic Requirements for Declaration Process Management
IPC-1752 Materials Declaration Management
IPC-1756 Manufacturing Process Data Management
IPC-1758 Declaration Requirements for Shipping, Pack and Packing Materials
IPC-1782 Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-1791 Trusted Electronic Designer, Manufacturer, and Assembler Requirements
IPC-2141 Controlled Impedance Circuit Boards and High Speed Logic Design 
IPC-2224 Sectional Standard for Design of PWBs for PC Cards 
IPC-2541 Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication 
IPC-2546 Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication 
IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment
IPC-2611 Communication 
Generic Requirements for Electronic Product Documentation
IPC-2615 Printed Board Dimensions and Tolerances 
IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards 
IPC-4921 Requirements for Printed Electronics Base Materials
IPC/JPCA- Application Categories for Printed Electronics
6901
IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC-7525 Guidelines for Stencil Design 
IPC-7526 Stencil and Misprinted Board Cleaning Handbook
IPC-7527 Requirements for Solder Paste Printing
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Wave and Reflow)
IPC-7535 Solder Dross Reduction in Wave Soldering Process
IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies
IPC-7801 Reflow Oven Process Control Standard
IPC-7912 Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies 
IPC-9111 Troubleshooting for Printed Board Assembly Processes
IPC-9121 Troubleshooting for Printed Board Fabrication Processes
IPC-9151 Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard
and Database
IPC-9191 General Guideline for implementation of Statistical Process Control (SPC) 
IPC-9194 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly
IPC-9199 Manufacture Guideline
SPC Quality Rating 
IPC-9201 Surface Insulation Resistance Handbook 
IPC-9261 In-Process DPMO and Estimated Yield for PWAs 
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 
IPC-9502 PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components 
IPC-9503 Moisture Sensitivity Classification for Non-IC Components 
IPC-DRM-PTH Through-Hole Solder Joint Evaluation Desk Reference Manual 
IPC-DRM-SMT Surface Mount Solder Joint Evaluation Desk Reference Manual 
IPC-DRM- Wire Preparation & Crimping
WHA