LPG Gas Leakage Detection

System Using Atmega328

1
 Abstract:

The Gas leakage is one of the big problems with industrial sector, residential milieu and gas

functioning vehicles like CNG (Compressed Natural Gas) buses, cars etc. One of the

contraceptive methods to stop accidents associated with the gas leakage is to install a gas leakage

detection device at vulnerable places. The system detects the leakage of the LPG using a gas

sensor and uses the buzzer to alert the person about the gas leakage . When the concentration of

LPG in air exceeds a certain level, the sensor senses the gas leakage and the output of the sensor

goes LOW. The detection is done by the gas sensor, through the microcontroller the LED and

buzzer are turned ON simultaneously.

2
 I. INTRODUCTION

There are numerous answers for fireplace accidents that agencies continually endorse. Smoke

detectors, hearth alarms, hearth extinguishers and sprinklers are examples of those gadgets. On

reflection, those devices can also alert or prevent the unfold of fire but they do not save you

hearth injuries, and that alone is a main downside already. This have a look at makes a speciality

of the LPG fuel and the way to save you it from causing greater injuries. There's a want to build

a system that aids people's negligence of their surroundings even as stopping the begin of

conflagration. The device also implements a shut-off mechanism which acts as the first line of

defence inside the prevention of the coincidence ought to there be an absence of individual inside

the residence. Liquefied Petroleum fuel is constituent of Butane and Propane gases, which can be

distinctly inflammable in nature. The LPG is an odorless gasoline and hence the addition of

Ethanethiol allows it to show case a smell throughout its leakage. An ideal gasoline sensor may

be used to feel the leakage of an LPG from cars, industries, homes and different residential

regions. If there is a leakage of LPG, we will effortlessly perceive by using its concentration

through the gasoline sensor and by using upward push in temperature. The LPG is broadly used

for home functions such as boiling, heating and cooking. some human beings can also have a low

sense of scent and in such instances they'll now not be able to respond for the gasoline

concentration present. Consequently, a protection primarily based LPG detection system is

crucial to provide alertness, protection and protection from any harmful fuel leakage injuries.

The incidents which include Kumbakonam and Bhopal fuel tragedy were the examples of the

arena’s worst fuel leakage injuries. This leakage detection gadget detects the fuel leakage and

additionally stops the gasoline deliver together with an alarm. The fuel sensor we used right here

identifies the toxic gases other than LPG and its voltage goes LOW when there's a leakage of any

3
toxic fuel. LOW signal is despatched to a microcontroller which in flip sends those alerts to the

buzzer hence, rising an alarm.

4
 2. PROPOSED METHOD

We purpose a system to come across LPG fuel leakage situations and offer a security alert to

supposed customers. We right here endorse to build the gadget the use of a MQ5 gas detection

sensor. If the LPG sensor senses any gas leakage from storage, gas sensor is going stumble on it

this sign is monitored by using the microcontroller and it'll perceive the gasoline leakage. Now

the microcontroller is turn on LED and buzzer. After few milliseconds put off, microcontroller

instructions driving force circuitry for exhaust fan to turn the fan on to release the gasoline

outdoor from the room and concurrently microcontroller commands every other circuitry a relay

circuitry to shut the fuel knob. In our proposed machine we designed two motive force circuitry

one to power motor to close knob. And any other is relay circuitry in which relay is used to

switched on and rancid for exhaust fan. Microcontroller is programmed by using embedded c

language. It's far the complete control of the task. It controls the Exhaust fan, LED, Buzzer and

when LPG leak takes place. The enter/ output ports of the microcontroller is used for this.

5
2.1 BLOCK DIAGRAM

POWER SUPPLY

MQ-5 GAS BUZZER

ATMEGA328
MICRO
CONTROLLER LCD 16X2

6
 3.CIRCUIT DIAGRAM

LCD1
LM016L
GSM SIM800L
RXD

TXD

RTS

VDD
VSS

VEE

RW
RS

D0
D1
D2
D3
D4
D5
D6
D7
CTS

E
1
2
3

4
5
6

7
8
9
10
11
12
13
14
U2
7805

1 3
VI VO
GND
2

RV1

U1 BUZ1
2 14
PD0/RXD/PCINT16 PB0/ICP1/CLKO/PCINT0
3 15
PD1/TXD/PCINT17 PB1/OC1A/PCINT1
4 16
PD2/INT0/PCINT18 PB2/SS/OC1B/PCINT2 BUZZER
R1 10k 5 17
PD3/INT1/OC2B/PCINT19 PB3/MOSI/OC2A/PCINT3
BAT1 6
PD4/T0/XCK/PCINT20 PB4/MISO/PCINT4
18
12V 1k 11 19
PD5/T1/OC0B/PCINT21 PB5/SCK/PCINT5
12 9
PD6/AIN0/OC0A/PCINT22 PB6/TOSC1/XTAL1/PCINT6
13
PD7/AIN1/PCINT23 PB7/TOSC2/XTAL2/PCINT7
10 U3
21 23 MQ 2 GAS SENSOR1
AREF PC0/ADC0/PCINT8
20 24
AVCC PC1/ADC1/PCINT9
25
PC2/ADC2/PCINT10
26
PC3/ADC3/PCINT11 29.0
27
PC4/ADC4/SDA/PCINT12
28
PC5/ADC5/SCL/PCINT13
1 2
PC6/RESET/PCINT14 VOUT
ATMEGA328P

3
R2
10k

The sensing material in TGS gas sensors is metal oxide, most typically SnO2. When a metal

oxide crystal such as SnO2 is heated at a certain high temperature in air, oxygen is adsorbed on

the crystal surface with a negative charge. Then donor electrons in the crystal surface are

transferred to the adsorbed oxygen, resulting in leaving positive charges in a space charge layer.

Thus, surface potential is formed to serve as a potential barrier against electron flow. Inside the

sensor, electric current flows through the conjunction parts (grain boundary) of SnO2 micro

crystals. At grain boundaries, adsorbed oxygen forms a potential barrier which prevents carriers

from moving freely. The electrical resistance of the sensor is attributed to this potential barrier.

7
In the presence of a deoxidizing gas, the surface density of the negatively charged oxygen

decreases, so the barrier height in the grain boundary is reduced. The reduced barrier height

decreases sensor resistance. Working Model Working Regulated power supply is fed to MCLR

Pin of PIC16F877 Microcontroller which is also supplied with crystal oscillator frequency (i.e.)

from OSC 1 and OSC 2 for the working of the microcontroller. With the help of step down

transformer of 230V AC primary to 0-12V, 500mA secondary power supply is taken from main

supply. Full-wave rectifier and a capacitor filter provide the output voltage and then fed to 5-volt

regulator (LM7805) whose output is used as power supply for IC’s and microcontroller.

Furthermore, temperature sensor and gas sensor is connected to the microcontroller. The

Complete Connection Diagram consists of the Microcontroller Circuit, Power Supply, GAS

Sensor Module and Exhaust Fan. The output of the sensor goes low as soon as the MQ-5 Gas

Sensor senses any gas leakage from the storage. This is detected by the microcontroller and the

LED & buzzer are turned ON.

8
4.PCB LAYOUT

9
 5.PROGRAM CODE
#include<LiquidCrystal.h>

LiquidCrystal lcd(2,3,4,5,6,7);

int BUZZ= 8;

int temp=0,i;

void setup()

lcd.begin(16,2);

Serial.begin(9600);

pinMode(BUZZ, OUTPUT);

lcd.clear();

lcd.print("WELCOME TO OIST ");

lcd.setCursor(0,1);

lcd.print(" BHOPAL");

delay(2000);

lcd.clear();

lcd.print("LPG GAS LEAKAGE");

lcd.setCursor(0,1);

lcd.print("DETECTION SYSTM");

delay(2000);

10
digitalWrite(BUZZ, LOW);

digitalWrite(BUZZ, HIGH);

delay(1000);

digitalWrite(BUZZ, LOW);

delay(1000);

digitalWrite(BUZZ, HIGH);

delay(1000);

digitalWrite(BUZZ, LOW);

delay(1000);

digitalWrite(BUZZ, HIGH);

delay(1000);

digitalWrite(BUZZ, LOW);

delay(1000);

digitalWrite(BUZZ, HIGH);

delay(1000);

digitalWrite(BUZZ, LOW);

//delay(1000);

void loop()

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int analogSensor = analogRead(A0);

analogSensor = analogSensor*0.570;

if (analogSensor>=501)

digitalWrite(BUZZ, 1);

lcd.clear();

lcd.setCursor(0,0);

lcd.print("LPG LEAK AT ");

lcd.setCursor(0,1);

lcd.print("DANGER LEVEL");

delay(2000);

digitalWrite(BUZZ, 0);

lcd.clear();

lcd.setCursor(0,0);

lcd.print("LPG:");

lcd.print(analogSensor);

lcd.print("PPM");

delay(2000);

12
else if (analogSensor<=500 && analogSensor>=0)

digitalWrite(BUZZ, 0);

lcd.clear();

lcd.setCursor(0,0);

lcd.print("NORMAL LEVEL");

lcd.setCursor(0,1);

lcd.print("LPG:");

lcd.print(analogSensor);

lcd.print("PPM");

delay(1000);

13
 6-SOFTWARE USE FOR CIRCUIT DESIGN
1:-PROTEUS

14
 6.1 SOFTWARE USE FOR PCB LAYOUT DESIGN

1:-CIRCUIT WIZARD

15
 6.3 SOFTWARE USE FOR PROGRAMING
1:-ARDUINO ID

16
 7:-PRINTED CIRCUIT BOARD DESIGN

A printed circuit board, or PCB, is used to mechanically support and electrically connect

electronic components using conductive pathways, tracks or signal traces etched from copper

sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring

board (PWB) or etched wiring board. A PCB populated with electronic components is a printed

circuit assembly (PCA), also known as a printed circuit board assembly (PCBA). Printed circuit

boards are used in virtually all but the simplest commercially-produced electronic devices.

PCBs are inexpensive, and can be highly reliable. They require much more layout effort and

higher initial cost than either wire wrap or point-to-point construction, but are much cheaper and

faster for high-volume production; the production and soldering of PCBs can be done by totally

automated equipment. Much of the electronics industry's PCB design, assembly, and quality

control needs are set by standards that are published by the IPC organization.

 Chemical etching

Chemical etching is done with ferric chloride, ammonium per sulfate, or sometimes hydrochloric

acid. For PTH (plated-through holes), additional steps of electro less deposition are done after

the holes are drilled, then copper is electroplated to build up the thickness, the boards are

screened, and plated with tin/lead. The tin/lead becomes the resist leaving the bare copper to be

etched away.

The simplest method, used for small scale production and often by hobbyists, is immersion

etching, in which the board is submerged in etching solution such as ferric chloride. Compared

with methods used for mass production, the etching time is long. Heat and agitation can be

17
applied to the bath to speed the etching rate. In bubble etching, air is passed through the etchant

bath to agitate the solution and speed up etching. Splash etching uses a motor-driven paddle to

splash boards with etchant; the process has become commercially obsolete since it is not as fast

as spray etching. In spray etching, the etchant solution is distributed over the boards by nozzles,

and recirculated by pumps. Adjustment of the nozzle pattern, flow rate, temperature, and etchant

composition gives predictable control of etching rates and high production rates.

As more copper is consumed from the boards, the etchant becomes saturated and less effective;

different etchants have different capacities for copper, with some as high as 150 grams of copper

per litre of solution. In commercial use, etchants can be regenrated to restore their activity, and

the dissolved copper recovered and sold. Small-scale etching requires attention to disposal of

used etchant, which is corrosive and toxic due to its metal content.

The etchant removes copper on all surfaces exposed by the resist. "Undercut" occurs when

etchant attacks the thin edge of copper under the resist; this can reduce conductor widths and

cause open-circuits. Careful control of etch time is required to prevent undercut. Where metallic

plating is used as a resist, it can "overhang" which can cause short-circuits between adjacent

traces when closely spaced. Overhang can be removed by wire-brushing the board after etching.

 Lamination

Some PCBs have trace layers inside the PCB and are called multi-layer PCBs. These are formed

by bonding together separately etched thin boards.

18
  Drilling

Holes through a PCB are typically drilled with small-diameter drill bits made of solid

coated tungsten carbide. Coated tungsten carbide is recommended since many board materials

are very abrasive and drilling must be high RPM and high feed to be cost effective. Drill bits

must also remain sharp to not mar or tear the traces. Drilling with high-speed-steel is simply not

feasible since the drill bits will dull quickly and thus tear the copper and ruin the boards. The

drilling is performed by automated drilling machines with placement controlled by a drill tape or

drill file. These computer-generated files are also called numerically controlled drill (NCD) files

or "Excellon files". The drill file describes the location and size of each drilled hole. These holes

are often filled with annular rings (hollow rivets) to create vias. Vias allow the electrical and

thermal connection of conductors on opposite sides of the PCB.

When very small vias are required, drilling with mechanical bits is costly because of high rates

of wear and breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias

typically have an inferior surface finish inside the hole. These holes are called micro vias.

It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual

sheets of the PCB before lamination, to produce holes that connect only some of the copper

layers, rather than passing through the entire board. These holes are called blind vias when they

connect an internal copper layer to an outer layer, or buried vias when they connect two or more

internal copper layers and no outer layers.

The walls of the holes, for boards with 2 or more layers, are made conductive then plated with

copper to form plated-through holes that electrically connect the conducting layers of the PCB.

For multilayer boards, those with 4 layers or more, drilling typically produces a smearof the high

19
temperature decomposition products of bonding agent in the laminate system. Before the holes

can be plated through, this smear must be removed by a chemical de-smear process, or

by plasma-etch. Removing (etching back) the smear also reveals the interior conductors as well.

20
 8-PARTS USE IN PROJECT

 Microcontroller Atmega328

21
 ATMEGA 328

22
 Electrical resistance

The electrical resistance of an electrical conductor is the opposition to the passage of an electric

current through that conductor. The inverse quantity is electrical conductance, the ease with

which an electric current passes. Electrical resistance shares some conceptual parallels with the

mechanical notion of friction. The SI unit of electrical resistance is the ohm (Ω), while electrical

conductance is measured in Siemens (S).

An object of uniform cross section has a resistance proportional to its resistivity and length and

inversely proportional to its cross-sectional area. All materials show some resistance, except

for superconductors, which have a resistance of zero.

The resistance (R) of an object is defined as the ratio of voltage across it (V) to current through it

(I), while the conductance (G) is the inverse:

For a wide variety of materials and conditions, V and I are directly proportional to each other,

and therefore R and G are constant (although they can depend on other factors like temperature

or strain). This proportionality is called Ohm's law, and materials that satisfy it are called

"Ohmic" materials.

In other cases, such as a diode or battery, V and I are not directly proportional, or in other words

the I–V curve is not a straight line through the origin, and Ohm's law does not hold. In this case,

resistance and conductance are less useful concepts, and more difficult to define. The ratio V/I is

23
sometimes still useful, and is referred to as a "chordal resistance" or "static resistance",[1][2] as it

corresponds to the inverse slope of a chord between the origin and an I–V curve. In other

situations, the derivative may be most useful; this is called the "differential resistance

 Capacitor

A capacitor (originally known as a condenser) is a passive two-terminal electrical

component used to store energy electrostatically in an electric field. The forms of practical

capacitors vary widely, but all contain at least two electrical conductors (plates) separated by a

dielectric (i.e., insulator). The conductors can be thin films of metal, aluminum foil or disks, etc.

The 'non conducting' dielectric acts to increase the capacitor's charge capacity. A dielectric can

be glass, ceramic, plastic film, air, paper, mica, etc. Capacitors are widely used as parts

of electrical circuits in many common electrical devices. Unlike a resistor, a capacitor does not

24
dissipate energy. Instead, a capacitor stores energy in the form of an electrostatic field between

its plates.

When there is a potential difference across the conductors (e.g., when a capacitor is attached

across a battery), an electric field develops across the dielectric, causing positive charge (+Q) to

collect on one plate and negative charge (-Q) to collect on the other plate. If a battery has been

attached to a capacitor for a sufficient amount of time, no current can flow through the capacitor.

However, if an accelerating or alternating voltage is applied across the leads of the capacitor,

a displacement current can flow.

An ideal capacitor is characterized by a single constant value for its capacitance. Capacitance is

expressed as the ratio of the electric charge (Q) on each conductor to the potential difference (V)

between them. The SI unit of capacitance is the farad (F), which is equal to

one coulomb per volt (1 C/V). Typical capacitance values range from about 1 pF (10−12 F) to

about 1 mF (10−3 F).

The capacitance is greater when there is a narrower separation between conductors and when the

conductors have a larger surface area. In practice, the dielectric between the plates passes a small

amount of leakage current and also has an electric field strength limit, known as the breakdown

voltage. The conductors a ndleads introduce an undesired inductance and resistance.

Capacitors are widely used in electronic circuits for blocking direct current while

allowing alternating current to pass. In analog filter networks, they smooth the output of power

supplies. In resonant circuits they tune radios to particular frequencies. In electric power

transmission systems they stabilize voltage and power flow.

25
 P–n junction diode
A p–n junction is a boundary or interface between two types of semiconductor material, p-

type and n-type, inside a single crystal of semiconductor. It is created by doping, for example

by ion implantation, diffusion of dopants, or by epitaxy (growing a layer of crystal doped

with one type of dopant on top of a layer of crystal doped with another type of dopant). If

two separate pieces of material were used, this would introduce a grain boundary between the

semiconductors that severely inhibits its utility by scattering the electrons and holes.

p–n junctions are elementary "building blocks" of most semiconductor electronic

devices such as diodes, transistors, solar cells, LEDs, and integrated circuits; they are the

active sites where the electronic action of the device takes place. For example, a common

type of transistor, the bipolar junction transistor, consists of two p–n junctions in series, in

the form n–p–n or p–n–p.

Properties of a p–n junction]

The p–n junction possesses some interesting properties that have useful applications in

modern electronics. A p-doped semiconductor is relatively conductive. The same is true of an

n-doped semiconductor, but the junction between them can become depleted of charge

carriers, and hence non-conductive, depending on the relative voltages of the two

semiconductor regions. By manipulating this non-conductive layer, p–n junctions are

commonly used as diodes: circuit elements that allow a flow of electricity in one direction

but not in the other (opposite) direction. This property is explained in terms of forward

26
 bias and reverse bias, where the term bias refers to an application of electric voltage to the p–

n junction.

PN junction operation in forward-bias mode, showing reducing depletion width. Both p and n

junctions are doped at a 1e15/cm3 doping level, leading to built-in potential of ~0.59 V.

Reducing depletion width can be inferred from the shrinking charge profile, as fewer dopants

are exposed with increasing forward bias.

With a battery connected this way, the holes in the P-type region and the electrons in the N-

type region are pushed toward the junction. This reduces the width of the depletion zone. The

positive potential applied to the P-type material repels the holes, while the negative potential

applied to the N-type material repels the electrons. As electrons and holes are pushed toward

the junction, the distance between them decreases. This lowers the barrier in potential. With

increasing forward-bias voltage, the depletion zone eventually becomes thin enough that the

zone's electric field cannot counteract charge carrier motion across the p–n junction, as a

consequence reducing electrical resistance. The electrons that cross the p–n junction into the

P-type material (or holes that cross into the N-type material) will diffuse in the near-neutral

region. Therefore, the amount of minority diffusion in the near-neutral zones determines the

amount of current that may flow through the diode.

Only majority carriers (electrons in N-type material or holes in P-type) can flow through a

semiconductor for a macroscopic length. With this in mind, consider the flow of electrons

across the junction. The forward bias causes a force on the electrons pushing them from the N

side toward the P side. With forward bias, the depletion region is narrow enough that electrons

can cross the junction and inject into the P-type material. However, they do not continue to

flow through the P-type material indefinitely, because it is energetically favorable for them to
27
 recombine with holes. The average length an electron travels through the P-type material

before recombining is called the diffusion length, and it is typically on the order

ofmicrometers.[2]

Although the electrons penetrate only a short distance into the P-type material, the electric

current continues uninterrupted, because holes (the majority carriers) begin to flow in the

opposite direction. The total current (the sum of the electron and hole currents) is constant in

space, because any variation would cause charge buildup over time (this is Kirchhoff's current

law). The flow of holes from the P-type region into the N-type region is exactly analogous to

the flow of electrons from N to P (electrons and holes swap roles and the signs of all currents

and voltages are reversed).

Therefore, the macroscopic picture of the current flow through the diode involves electrons

flowing through the N-type region toward the junction, holes flowing through the P-type

region in the opposite direction toward the junction, and the two species of carriers constantly

recombining in the vicinity of the junction. The electrons and holes travel in opposite

directions, but they also have opposite charges, so the overall current is in the same direction

on both sides of the diode, as required.

The Shockley diode equation models the forward-bias operational characteristics of a p–n

junction outside the avalanche (reverse-biased conducting) region

Reverse bias mode

28
A silicon p–n junction in reverse bias.

Connecting the P-type region to the negative terminal of the battery and theN-type region to

the positive terminal corresponds to reverse bias. If a

diode is reverse-biased, the voltage at the cathode is higher than that at the anode. Therefore, no

current will flow until the diode breaks down. Reverse-bias usually refers to how a diode is used

in a circuit. The connections are illustrated in the diagram to the right.

Because the p-type material is now connected to the negative terminal of the power supply, the

'holes' in the P-type material are pulled away from the junction, causing the width of the

depletion zone to increase. Likewise, because the N-type region is connected to the positive

terminal, the electrons will also be pulled away from the junction. Therefore, the depletion

region widens, and does so increasingly with increasing reverse-bias voltage. This increases the

voltage barrier causing a high resistance to the flow of charge carriers, thus allowing minimal

electric current to cross the p–n junction. The increase in resistance of the p–n junction results in

the junction behaving as an insulator.

The strength of the depletion zone electric field increases as the reverse-bias voltage increases.

Once the electric field intensity increases beyond a critical level, the p–n junction depletion zone

breaks down and current begins to flow, usually by either the Zener or the avalanche

breakdown processes. Both of these breakdown processes are non-destructive and are reversible,

as long as the amount of current flowing does not reach levels that cause the semiconductor

material to overheat and cause thermal damage.

This effect is used to one's advantage in Zener diode regulator circuits. Zener diodes have a

certain – low – breakdown voltage. A standard value for breakdown voltage is for instance

29
5.6 V. This means that the voltage at the cathode can never be more than 5.6 V higher than the

voltage at the anode, because the diode will break down – and therefore conduct – if the voltage

gets any higher. This in effect regulates the voltage over the diode.

Another application of reverse biasing is Varicap diodes, where the width of the depletion

zone (controlled with the reverse bias voltage) changes the capacitance of the diode.

 potentiometer
A potentiometer informally a pot, is a three-terminal resistor with a sliding contact that forms an

adjustable voltage divider. If only two terminals are used, one end and the wiper, it acts as

a variable resistor or rheostat.

A potentiometer measuring instrument is essentially a voltage divider used for measuring electric

potential (voltage); the component is an implementation of the same principle, hence its name.

Potentiometers are commonly used to control electrical devices such as volume controls on audio

equipment. Potentiometers operated by a mechanism can be used as position transducers, for

example, in a joystick. Potentiometers are rarely used to directly control significant power (more

than a watt), since the power dissipated in the potentiometer would be comparable to the power

in the controlled load.

30
Potentiometer construction

Potentiometers comprise a resistive element, a sliding contact (wiper) that moves along the

element, making good electrical contact with one part of it, electrical terminals at each end of the

element, a mechanism that moves the wiper from one end to the other, and a housing containing

the element and wiper.

Many inexpensive potentiometers are constructed with a resistive element formed into an arc of a

circle usually a little less than a full turn and a wiper sliding on this element when rotated,

making electrical contact. The resistive element, with a terminal at each end, is flat or angled.

The wiper is connected to a third terminal, usually between the other two. On panel

potentiometers, the wiper is usually the center terminal of three. For single-turn potentiometers,

this wiper typically travels just under one revolution around the contact. The only point of

ingress for contamination is the narrow space between the shaft and the housing it rotates in.

Another type is the linear slider potentiometer, which has a wiper which slides along a linear

element instead of rotating. Contamination can potentially enter anywhere along the slot the

slider moves in, making effective sealing more difficult and compromising long-term reliability.

An advantage of the slider potentiometer is that the slider position gives a visual indication of its

setting. While the setting of a rotary potentiometer can be seen by the position of a marking on

the knob, an array of sliders can give a visual impression of, for example, the effect of a multi-

band equaliser.

The resistive element of inexpensive potentiometers is often made of graphite. Other materials

used include resistance wire, carbon particles in plastic, and a ceramic/metal mixture called

cermet. Conductive track potentiometers use conductive polymer resistor pastes that contain

31
hard-wearing resins and polymers, solvents, and lubricant, in addition to the carbon that provides

the conductive properties. Others are enclosed within the equipment and are intended to be

adjusted to calibrate equipment during manufacture or repair, and not otherwise touched. They

are usually physically much smaller than user-accessible potentiometers, and may need to be

operated by a screwdriver rather than having a knob. They are usually called "preset

potentiometers" or "trim[ming] pots". Some presets are accessible by a small screwdriver poked

through a hole in the case to allow servicing without dismantling.

Multi turn potentiometers are also operated by rotating a shaft, but by several turns rather than

less than a full turn. Some multi turn potentiometers have a linear resistive element with a sliding

contact moved by a lead screw; others have a helical resistive element and a wiper that turns

through 10, 20, or more complete revolutions, moving along the helix as it rotates. Multi turn

potentiometers, both user-accessible and preset, allow finer adjustments; rotation through the

same angle changes the setting by typically a tenth as much as for a simple rotary potentiometer.

A string potentiometer is a multi-turn potentiometer operated by an attached reel of wire turning

against a spring, enabling it to convert linear position to a variable resistance.

User-accessible rotary potentiometers can be fitted with a switch which operates usually at the

anti-clockwise extreme of rotation. Before digital electronics became the norm such a component

was used to allow radio and television receivers and other equipment to be switched on at

minimum volume with an audible click, then the volume increased, by turning a knob. Multiple

resistance elements can be ganged together with their sliding contacts on the same shaft, for

example, in stereo audio amplifiers for volume control.

32
 VOLTAGE REGULATOR IC

A voltage regulator is designed to automatically maintain a constant voltage level. A voltage

regulator may be a simple "feed-forward" design or may include negative feedback control

loops. It may use an electromechanical mechanism, or electronic components. Depending on the

design, it may be used to regulate one or more AC or DC voltages.

Electronic voltage regulators are found in devices such as computer power supplies where they

stabilize the DC voltages used by the processor and other elements. In automobile alternators and

central power station generator plants, voltage regulators control the output of the plant. In

an electric power distribution system, voltage regulators may be installed at a substation or along

distribution lines so that all customers receive steady voltage independent of how much power is

drawn from the line.

The 78xx (sometimes L78xx, LM78xx, MC78xx...) is a family of self-contained fixed linear

voltage regulator integrated circuits. The 78xx family is commonly used in electronic circuits

requiring a regulated power supply due to their ease-of-use and low cost. For ICs within the

family, the xx is replaced with two digits, indicating the output voltage (for example, the 7805

has a 5 volt output, while the 7812 produces 12 volts). The 78xx line are positive voltage

33
regulators: they produce a voltage that is positive relative to a common ground. There is a related

line of 79xx devices which are complementary negative voltage regulators. 78xx and 79xx ICs

can be used in combination to provide positive and negative supply voltages in the same circuit.

78xx ICs have three terminals and are commonly found in the TO220 form factor, although

smaller surface-mount and larger TO3 packages are available. These devices support an input

voltage anywhere from a couple of volts over the intended output voltage, up to a maximum of

35 to 40 volts depending on the make, and typically provide 1 or 1.5 amperes of current (though

smaller or larger packages may have a lower or higher current rating).

Part Number Output Voltage (V) Minimum Input Voltage (V)

7805 +5 7.3

7806 +6 8.3

7808 +8 10.5

7810 +10 12.5

7812 +12 14.6

7815 +15 17.7

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 7818 +18 21.0

7824 +24 27.1

 Light-emitting diode

A light-emitting diode (LED) is a two-lead semiconductor light source that resembles a basic pn-

junction diode, except that an LED also emits light. When an LED's anode lead has a voltage that

is more positive than its cathode lead by at least the LED's forward voltage drop, current

flows. Electrons are able to recombine with holes within the device, releasing energy in the form

of photons. This effect is called electroluminescence, and the color of the light (corresponding to

the energy of the photon) is determined by the energy band gap of the semiconductor.

An LED is often small in area (less than 1 mm2), and integrated optical components may be used

to shape its radiation pattern.

Appearing as practical electronic components in 1962, the earliest LEDs emitted low-intensity

infrared light. Infrared LEDs are still frequently used as transmitting elements in remote-control

circuits, such as those in remote controls for a wide variety of consumer electronics. The first

visible-light LEDs were also of low intensity, and limited to red. Modern LEDs are available

across the visible, ultraviolet, and infrared wavelengths, with very high brightness.

35
Early LEDs were often used as indicator lamps for electronic devices, replacing small

incandescent bulbs. They were soon packaged into numeric readouts in the form of seven-

segment displays, and were commonly seen in digital clocks.

Recent developments in LEDs permit them to be used in environmental and task lighting. LEDs

have many advantages over incandescent light sources including lower energy consumption,

longer lifetime, improved physical robustness, smaller size, and faster switching. Light-emitting

diodes are now used in applications as diverse as aviation lighting, automotive headlamps,

advertising, general lighting,traffic signals, and camera flashes. However, LEDs powerful

enough for room lighting are still relatively expensive, and require more precise current and heat

management than compact fluorescent lamp sources of comparable output.

LEDs have allowed new text, video displays, and sensors to be developed, while their high

switching rates are also useful in advanced communications technology.

Technology

The inner workings of an LED, showing circuit (top) and band diagram (bottom)

36
 9:-APPLICATION
1. Industrial automation
2. Home automation

10:-ADVANTAGES
1. Human comfortable
2. Lower cost of circuit
3. Prevent from fire hazard.
4. Indication given by buzzer

11:-CONCLUSION
For the first stage project presentation the required research work has been completed and the

validation of project has been proved. Hence it can be said that the aim of the project “LPG Gas

Detection System Using microcontroller ” can be achieved successfully. The further designing

and fabrication of the working model will be completed by NOV 2021. After which the different

experiments will be conducted for efficiency improvement.

37
 REFERENCES

[1] T. Murugan, A. Periasamy and S. Muruganand, “Embedded Based Industrial temperature

monitoring system using GSM”, International Journal of computer applications.

[2] V. Ramya and B. Palaniappan, “Embedded system for Hazardous gas detection and

Alerting,” in Proc. of International Journal of Distributed and parallel system (IJDPS), vol. 3, no.

3, May 2012.

[3] L. Solis, Y. Li and L. B. Kishs, “Fluctuation-Enhanced Multiple-gas sensing by Commercial

Taguchi Sensor,”IEEE Sensor Journal, vol. 5, no. 6, Dec 2005.

[4] H. G. Rodney Tan, C. H. Lee and V. H. Mok, “Automatic Power Meter Reading System

Meter Reading Using GSM Network,” in Proc. of the 8 Th International Conference.

[5] H. Huang, H. Bainand S. Zhu, “A Greenhouse Remote Monitoring System Based on GSM,”

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[6] A Jain, D. Kumar and J. Kedia, “Design and development of GSM based energy Meter,

“International Journal of Computer Application, vol. 47, no. 12, June 2012.

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[8] Geronimo, "Gas leak, not bomb, caused Two Seren blast," GMA Network, 7 June 2013.

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serendra-blast-mar-roxas.

[9] NSO, “Philippines in Figures; 2014”

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%20Annual%20Report_Region%20I_final.pdf.

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[10] DOH, “Leading causes of mortality "; 16 April 2013.

http://www.doh.gov.ph/node/198.html.

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