LLC Current-Resonant Off-Line Switching Control IC

SSC9522S Data Sheet

Description Package
The SSC9522S is a controller IC (SMZ* method) for SOP18
half-bridge resonant type power supply, incorporating a
floating drive circuit for the high-side power MOSFET
drive.
The product achieves high efficiency, low noise and
high cost-performance power supply systems with few
external components.
*SMZ; Soft-switched Multi-resonant Zero Current
Not to Scale
switch (All switching periods work with soft switching

ns
operation.)
Electrical Characteristics

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Features ● Absolute maximum rating of VCC pin is 35 V
● Minimum oscillation frequency is 28.3 kHz (typ.)

es
● Built-in floating drive circuit for high-side power
● Maximum oscillation frequency is 300 kHz (typ.)
MOSFET

D
● Soft Start Function
● Capacitive Mode Operation Detection Function

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(Pulse-by-pulse)
● Automatic Dead Time Adjustment Function
● Brown-in and Brown-out Function
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● Protections Applications
High-side Driver UVLO Protection
External Latched Shutdown Function ● Digital appliance
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Overcurrent Protection (OCP): Three steps protection ● Office automation equipment

corresponding to overcurrent levels ● Industrial equipment
●
d

Overload Protection (OLP): Latched shutdown Communication equipment, etc

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Overvoltage Protection (OVP): Latched shutdown

Thermal Shutdown (TSD): Latched shutdown
en

Typical Application
m
m

R1
BR1
o

VAC
C1 R2
ec

R3
R

D1 R8

RB(H) DS(H)
ot

14 Q(H)
16
C10 D2
VB T1
VGH
RA(H)
N

REG RGS(H)
8 D51
15
VS
SSC9522S PC1
VSEN RB(L) DS(L)
1 Q(L)
U1 11
C51
VCC VGL Cv
2 RA(L)
C9 GND
RGS(L)
4 D52
9
RV
R4 C2
Ci
10 CRV
FB CSS OC RC
RC COM

3 5 6 7
External C11
power supply
R5 R6
R7
ROCP
C3
C4 PC1 C5 C6 C7 C8 C12

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SSC9522S

Contents
Description ------------------------------------------------------------------------------------------------------ 1
Contents --------------------------------------------------------------------------------------------------------- 2
1. Absolute Maximum Ratings----------------------------------------------------------------------------- 3
2. Electrical Characteristics -------------------------------------------------------------------------------- 4
3. Block Diagram --------------------------------------------------------------------------------------------- 6
4. Pin Configuration Definitions--------------------------------------------------------------------------- 6
5. Typical Application --------------------------------------------------------------------------------------- 7

ns
6. Physical Dimensions -------------------------------------------------------------------------------------- 8

ig
7. Marking Diagram ----------------------------------------------------------------------------------------- 8
8. Operational Description --------------------------------------------------------------------------------- 9

es
8.1 Resonant Circuit Operation ----------------------------------------------------------------------- 9
8.2 Startup Operation --------------------------------------------------------------------------------- 12

D
8.3 Soft Start Function -------------------------------------------------------------------------------- 13
8.4 High-side Driver ----------------------------------------------------------------------------------- 13

ew
8.5 Constant Output Voltage Control-------------------------------------------------------------- 13
8.6 Automatic Dead Time Adjustment Function ------------------------------------------------ 14
rN
8.7 Capacitive Mode Operation Detection Function -------------------------------------------- 15
8.8 Brown-in and Brown-out Function ------------------------------------------------------------ 16
8.9 External Latched Shutdown Function -------------------------------------------------------- 17
fo

8.10 Overcurrent Protection (OCP) ----------------------------------------------------------------- 17

8.11 Overload Protection (OLP)---------------------------------------------------------------------- 18
8.12 Overvoltage Protection (OVP) ------------------------------------------------------------------ 19
d

8.13 Thermal Shutdown (TSD) ----------------------------------------------------------------------- 19

de

9. Design Notes ---------------------------------------------------------------------------------------------- 19

9.1 External Components ---------------------------------------------------------------------------- 19
en

9.2 PCB Trace Layout and Component Placement --------------------------------------------- 20

m

Important Notes ---------------------------------------------------------------------------------------------- 21

o m
ec
R
ot
N

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SSC9522S

1. Absolute Maximum Ratings

Current polarities are defined as follows: current going into the IC (sinking) is positive current (+); and current
coming out of the IC (sourcing) is negative current (−).
Unless otherwise specified, TA = 25 °C.
Characteristic Symbol Conditions Pin Rating Units
VSEN Pin Voltage VSEN 1−4 − 0.3 to VREG V
VCC Pin Voltage VCC 2−4 − 0.3 to 35 V
FB Pin Voltage VFB 3−4 − 0.3 to 10 V
CSS Pin Voltage VCSS 5−4 − 0.3 to 12 V
OC Pin Voltage VOC 6−4 − 6 to 6 V

ns
RC Pin Voltage VRC 7−4 − 6 to 6 V

ig
REG Pin Source Current IREG 8−4 − 20.0 mA

es
DC 9−4 − 2 to 2 mA
RV Pin Current IRV
9−4 − 100 to 100

D
Pulse 40 ns mA
VGL Pin Voltage VGL 11 − 4 − 0.3 to VREG + 0.3 V

ew
Voltage between VB Pin and VS
VB−VS 14 − 15 − 0.3 to 15.0 V
Pin
rN
VS Pin Voltage VS 15 − 4 − 1 to 600 V
VGH Pin Voltage VGH 16 − 4 VS − 0.3 to VB + 0.3 V
fo

Operating Ambient Temperature TOP — − 20 to 85 °C

Storage Temperature Tstg — − 40 to 125 °C
d

Junction Temperature Tj — 150 °C

de

*The pin 14, pin 15 and pin 16, are guaranteed 1000 V of ESD withstand voltage (Human body model).
Other pins are guaranteed 2000V of ESD withstand voltage.
en
m
o m
ec
R
ot
N

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SSC9522S

2. Electrical Characteristics
Current polarities are defined as follows: current going into the IC (sinking) is positive current (+); and current
coming out of the IC (sourcing) is negative current (−).
Unless otherwise specified, TA = 25 °C, VCC = 15 V.
Characteristic Symbol Conditions Pin Min. Typ. Max. Unit
Startup Circuit and Circuit Current
Operation Start Voltage VCC(ON) 2−4 10.2 11.8 13.0 V
Operation Stop Voltage (1)
VCC(OFF) 2−4 8.8 9.8 10.9 V
Circuit Current in Operation ICC(ON) 2−4 — — 20.0 mA
Circuit Current in Non-operation ICC(OFF) VCC = 9 V 2−4 — — 1.2 mA

ns
Circuit Current in Latched
ICC(L) VCC = 11 V 2−4 — — 1.2 mA
Shutdown Operation

ig
Soft Start
5−4 −0.21 −0.18 −0.15

es
CSS Pin Charge Current ICSS(C) mA
CSS Pin Reset Current ICSS(R) VCC = 9 V 5−4 1.0 1.8 2.4 mA

D
ON / OFF

ew
VSEN = 3 V
CSS Pin Threshold Voltage (2) VCSS(2) VOC = 0 V
5−4 0.50 0.59 0.68 V
Oscillator
rN
11 − 10
Minimum Oscillation Frequency f(MIN) VCC = 9 V 26.2 28.3 31.2 kHz
16 − 15
11 − 10
fo

Maximum Oscillation Frequency f(MAX) IFB = − 2 mA 265 300 335 kHz

16 − 15
11 − 10
Maximum Dead Time td(MAX) VSEN = 3 V 1.90 2.45 3.00 μs
d

16 − 15
11 − 10
de

Minimum Dead Time td(MIN) IFB = − 2 mA 0.25 0.50 0.75 μs

16 − 15
en

Standby Operation
Burst Oscillation frequency fCSS IFB = – 3.5 mA 5−4 70 105 130 Hz
m

Feedback control
m

FB Pin Source Current at Burst

ICONT(1) 3−4 −2.9 −2.5 −2.1 mA
Mode Start
o

FB Pin Source Current at

ICONT(2) 3−4 −3.7 −3.1 −2.5 mA
ec

Oscillation stop
Supply of Driver Circuit
R

REF Pin Output Voltage VREG IFB = – 2 mA 8−4 9.9 10.5 11.1 V
ot

High-side Drive Circuit

High-side Driver Operation Start
14 − 15
N

VBUV(ON) 6.3 7.3 8.3 V

Voltage
High-side Driver Operation Stop
VBUV(OFF) 14 − 15 5.5 6.4 7.2 V
Voltage
Drive Circuit
VREG = 10.5V
Source Current 1 of VGL Pin and IGLSOURCE1 VB = 10.5 V 11 − 10
— –515 — mA
VGH Pin IGHSOURCE1 VGL = 0 V 16 − 15
VGH = 0 V

(1)
VCC(OFF) < VCC(ON)

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SSC9522S

Characteristic Symbol Conditions Pin Min. Typ. Max. Unit

VREG = 10.5V
Sink Current 1 of VGL Pin and IGLSINK1 VB = 10.5 V 11 − 10
— 685 — mA
VGH Pin IGHSINK1 VGL = 10.5 V 16 − 15
VGH = 10.5 V
VREG = 12 V
Source Current 2 of VGL Pin and IGLSOURCE2 VB = 12 V 11 − 10
–120 –85 –50 mA
VGH Pin IGHSOURCE2 VGL = 10.5 V 16 − 15
VGH = 10.5 V
VREG = 12 V
Sink Current 2 of VGL Pin and IGLSINK2 VB = 12 V 11 − 10
70 113 160 mA
VGH Pin IGHSINK2 VGL = 1.5 V 16 − 15
VGH = 1.5 V
Brown-in / Brown-out Function

ns
VSEN Pin Threshold Voltage (ON) VSEN(ON) 1−4 1.32 1.42 1.52 V

ig
VSEN Pin Threshold Voltage
VSEN(OFF) 1−4 1.08 1.16 1.24 V
(OFF)

es
Detection of Voltage Resonant

D
Voltage Resonant Detection
VRV(1) 9−4 3.8 4.9 5.4 V
Voltage (1)

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Voltage Resonant Detection
VRV(2) 9−4 1.20 1.77 2.30 V
Voltage (2)
Detection of Current Resonant and OCP
rN
Capacitive Mode Operation 0.055 0.155 0.255 V
VRC 7−4
Detection Voltage –0.255 –0.155 –0.055 V
fo

RC Pin Threshold Voltage 2.15 2.35 2.55 V

VRC(S) 7−4
(High Speed) –2.55 –2.35 –2.15 V
d

OC Pin Threshold Voltage (Low) VOC(L) VCSS = 3 V 6−4 1.42 1.52 1.62 V
de

OC Pin Threshold Voltage (High) VOC(H) VCSS = 3 V 6−4 1.69 1.83 1.97 V
en

OC Pin Threshold Voltage VOC(S) VCSS = 5 V 6−4 2.15 2.35 2.55 V

(High Speed)
m

VCSS = 3 V
CSS Pin Sink Current (Low) ICSS(L)
VOC = 1.65 V
5−4 1.0 1.8 2.4 mA
m

VCSS = 3 V
CSS Pin Sink Current (High) ICSS(H)
VOC = 2 V
5−4 12.0 20.0 28.0 mA
o

CSS Pin Sink Current (High Speed) ICSS(S) VRC = 2.8 V 5−4 11.0 18.3 25.0 mA
ec

OLP Latch and External Latch

3−4 −30.5 −25.5 −20.5 μA
R

FB Pin Source Current IFB VFB = 5 V

FB Pin Threshold Voltage VFB 3−4 6.55 7.05 7.55 V
ot

CSS Pin Threshold Voltage (1) VCSS(1) 5−4 7.0 7.8 8.6 V
N

Latched Circuit Release VCC VCC(LA_OFF) 2−4 6.7 8.2 9.5 V

Voltage (2)
OVP and TSD
VCC Pin OVP Threshold Voltage VCC(OVP) VSEN = 3 V 2−4 28.0 31.0 34.0 V
Thermal Shutdown Temperature Tj (TSD) — 150 — — °C
Thermal Resistance
Thermal Resistance Junction to θj−A — — — 95 °C/W
Ambient

(2)
VCC(LA_OFF) < VCC(OFF)

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SSC9522S

3. Block Diagram

14 VB
VCC 2
UVLO

Start/Stop
Level 16 VGH
Reg/Bias
shift
OVP/TSD/Latch
15 VS
GND 4 High-side driver
VCC

ns
Input
VSEN 1

ig
sense 8 REG
Main logic

es
11 VGL
OLP

D
10 COM

ew
Frequency
FB 3 FB control Dead time
control rN RC detector 7 RC

Freq.
RV detector 9 RV
Max.
Soft-start/OC
fo

CSS 5
Standby control OC detector 6 OC
d
de
en

4. Pin Configuration Definitions

m

Number Name Function

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1 VSEN (NC) 18 1 VSEN AC input voltage detection signal input

Power supply voltage input for the IC, and Overvoltage
o

2 VCC (NC) 17 2 VCC

Protection (OVP) signal input
ec

3 FB VGH 16 Feedback signal input for constant voltage control

3 FB
signal, and Overload Protection (OLP) signal input
R

4 GND VS 15 4 GND Ground for control part

5 CSS Soft start capacitor connection
ot

5 CSS VB 14
6 OC Overcurrent Protection (OCP) signal input
6 OC (NC) 13
N

7 RC Resonant current detection signal input

7 RC (NC) 12 8 REG Power supply output for high-side gate drive
8 REG VGL 11 9 RV Resonant voltage detection signal input
10 COM Ground for power part
9 RV COM 10
11 VGL Low-side gate drive output
12, 13 (NC) −
14 VB Power supply input for high-side gate drive
15 VS Floating ground for high-side driver
16 VGH High-side gate drive output
17, 18 (NC) −

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 5.
R1 D1
SSC9522S

BR1 R8

Jan. 17, 2017

VAC
C1
N
RB(H) DS(H)
14 Q(H)
C10 D2
R2 VB 16
VGH T1
ot
8 RA(H)
REG RGS(H) D51
R

SSC9522S - DSE Rev.1.4

R3
15
VS
Typical Application

SSC9522S PC1
1 RB(L) DS(L)
VSEN
Q(L)
ec
U1 C51
2 11
VCC
o VGL Cv
RA(L)
C9 4
m RGS(L)

© SANKEN ELECTRIC CO.,LTD. 2010

GND
D52
9
m RV
Ci
10 CRV
FB CSS OC RC COM

R4 C2 3 5 6 7
en
C11

R5 R6
de
R7
ROCP
C3
C4 C6 C7 C8
d
PC1 C5 fo C12

External power supply

http://www.sanken-ele.co.jp/en
SANKEN ELECTRIC CO.,LTD.
rN
ew
D
es
ig
ns

7
SSC9522S

6. Physical Dimensions
● SOP18

ns
ig
es
D
ew
rN
fo
d
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NOTES:
● Dimension is in millimeters
en

● Pb-free (RoHS compliant)

m
m

7. Marking Diagram
o
ec

18
SSC9522S
R

Part Number
SKYMD
ot

Lot Number
XXXX
N

Y is the last digit of the year (0 to 9)

1 M is the month (1 to 9,O,N or D)
D is a period of days
1 : 1st to 10th
2 : 11th to 20th
3 : 21st to 31st
Sanken Control Number

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SSC9522S

8. Operational Description The frequency in which Ż becomes minimum value is

the resonant frequency, f0. The higher frequency area
All of the parameter values used in these descriptions than f0 is the inductance area, and the lower frequency
are typical values, unless they are specified as minimum area than f0 is the capacitance area.
or maximum. Current polarities are defined as follows: From Equation (3), f0 is as follows;
current going into the IC (sinking) is positive current
(+); and current coming out of the IC (sourcing) is 1
negative current (−). Q(H) and Q(L) indicate a high-side f0 = (4)
power MOSFET and a low-side power MOSFET 2π√LC
respectively. Ci, and CV indicate a current resonant
Figure 8-3 shows the circuit of a current resonant
capacitor and a voltage resonant capacitor respectively.
power supply. The basic configuration of the current
resonant power supply is a half-bridge converter. The
switching device Q(H) and Q(L) are connected in series

ns
8.1 Resonant Circuit Operation with VIN. The series resonant circuit and the voltage
Figure 8-1 shows a basic RLC series resonant circuit. resonant capacitor CV are connected in parallel with Q(L).

ig
The series resonant circuit is comprised of a resonant
inductor LR, a primary winding P of a transformer T1

es
and a current resonant capacitor Ci.
R L C In the resonant transformer T1, the coupling between

D
primary winding and secondary winding is designed to
be poor so that the leakage inductance increases. By

ew
using it as LR, the series resonant circuit can be down
sized. The dotted mark in T1 shows the winding polarity,
Figure 8-1. RLC Series Resonant Circuit
rN
the secondary windings S1 and S2 are connected so that
the polarities are set to the same position shown in
Figure 8-3, and the winding numbers of each other are
The impedance of the circuit, Ż, is as the following
equal.
fo

Equation.

1 From Equation (1), the impedance of current resonant

d

Ż = R + j �ωL − � (1) power supply is calculated by Equation (5). From

ωC
de

Equation (4), the resonant frequency, f0, is calculated by

Equation (6).
where, ω is angular frequency and ω = 2πf.
en

1
1 Ż = R + j �ω(LR + LP ) − � (5)
Ż = R + j �2πfL − � (2) ωCi
m

2πfC
1
m

When the frequency, f, changes, the impedance of f0 = (6)

resonant circuit will change as shown in Figure 8-2 2π�(LR + LP ) × Ci
o
ec

Capacitance area Inductance area where,

R: the equivalent resistance of load
R

LR: the inductance of the resonant inductor

Impedance

LP: the inductance of the primary winding P

ot

Ci: the capacitance of current resonant capacitor

N

ID(H)
R
Q(H) Series resonant circuit
f0 Frequency VDS(H)
VGH LR IS1
T1 VOUT
VIN (+)
Figure 8-2. Impedance of Resonant Circuit ID(L)
Q(L) Cv P S1
LP
In Equation (2), Ż becomes minimum value (= R) at VDS(L)
2πfL = 1/2πfC, and then ω is calculated by Equation VGL VCi S2
(3) . (−)
Ci
ICi IS2
1
ω = 2πf = (3) Figure 8-3. Current Resonant Power Supply Circuit
√LC

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SSC9522S

In the current resonant power supply, Q(H) and Q(L) are VGH
alternatively turned on and off. The on time and off time
of them are equal. There is a dead time between Q(H) on VGL
period and Q(L) on period. During the dead time, both
Q(H) and Q(L) are in off status.
VDS(H) VIN+VF(H)
The current resonant power supply is controlled by
the frequency control. When the output voltage
decreases, the IC makes the switching frequency low so ID(H)
that the output power is increased and the output voltage
is kept constant. This control must operate in the
inductance area (fSW > f0). Since the winding current is VDS(L)
delayed from the winding voltage in the inductance area,
the turn-on operation is ZCS (Zero Current Switching)
ID(L)

ns
and the turn-off operation is ZVS (Zero Voltage
Switching). Thus, the switching loss of Q(H) and Q(L) is

ig
nearly zero, ICi
In the capacitance area (fSW < f0), the current resonant

es
power supply operates as follows. When the output
voltage decreases, the switching frequency is decreased,

D
and then the output power is more decreased. Thus, the VCi
VIN
output voltage cannot be kept constant. Since the

ew
winding current goes ahead of the winding voltage in the
capacitance area, the operation with hard switching IS1
occurs in Q(H) and Q(L). Thus, the power loss increases.
rN
This operation in the capacitance area is called the
IS2
capacitive mode operation. The current resonant power
supply must be operated without the capacitive mode
fo

A B D E
operation (refer to Section 8.7 about details of it). C F
d

Figure 8-4 shows the basic operation waveform of Figure 8-4. The Basic Operation Waveforms of
de

current resonant power supply (see Figure 8-3 about the Current Resonant Power Supply
symbol in Figure 8-4). The current resonant waveforms
in normal operation are divided a period A to a period F.
en

The current resonant power supply operates in the each

Q(H)
period as follows.
m

ID(H)
In following description, ON LR
LP
ID(H) is the current of Q(H), VIN
m

ID(L) is the current of Q(L), S1 IS1

VF(H) is the forwerd voltage of Q(H),
o

Q(L) Cv
VF(L) is the forwerd voltage of Q(L), VCV
ec

IL is the current of LR, OFF

S2
VIN is an input voltage,
R

Ci
VCi is Ci voltage, and VCi
VCV is CV voltage.
ot

Figure 8-5. Operation in Period A

1) Period A
N

When Q(H) is ON, energy is stored into the series

resonant circuit by ID(H) flowing through the resonant
Q(H)
circuit and the transformer as shown in Figure 8-5. At ID(H)
the same time, the energy is transferred to the ON LR
LP
secondary circuit. When the primary winding voltage VIN

can not keep the secondary rectifier ON, the energy to S1

the secondary circuit is stopped. Q(L) Cv

2) Period B OFF
S2
After the secondary side current becomes zero, the
resonant current flows to the primary side only as Ci
shown in Figure 8-6 and Ci is charged by it.
Figure 8-6. Operation in Period B

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SSC9522S

3) Period C
Q(H)
Pireod C is the dead-time. Both Q(H) and Q(L) are in
off-state. OFF LR
LP
When Q(H) turns off, IL is flowed by the energy stored VIN
in the series resonant circuit as shown in Figure 8-7, IL
and CV is discharged. When VCV decreases to VF(L), Q(L) Cv
−ID(L) flows through the body diode of Q(L) and VCV is VCV
clamped to VF(L). OFF
-ID(L)
After that, Q(L) turns on. Since VDS(L) is nearly zero at
the point, Q(L) operates in ZVS and ZCS. Thus, Ci
switching loss is nearly zero.
Figure 8-7. Operation in Period C
4) Period D

ns
When Q(L) turns on, ID(L) flows as shown in Figure 8-8
and the primary winding voltage of the transformer Q(H)

ig
adds VCi. At the same time, energy is transferred to LR
OFF
the secondary circuit. When the primary winding

es
LP
VIN
voltage can not keep the secondary rectifier ON, the
ID(L)

D
energy to the secondary circuit is stopped. S1
Q(L) Cv

ew
5) Period E ON
S2 IS2
After the secondary side current becomes zero, the Ci
resonant current flows to the primary side only as
rN VCi
shown in Figure 8-9 and Ci is charged by it.
Figure 8-8. Operation in Period D
fo

6) Period F
This pireod is the dead-time. Both Q(H) and Q(L) are in
off-state. Q(H)
d

When Q(L) turns off, − IL is flowed by the energy

de

OFF LR
stored in the series resonant circuit as shown in Figure LP
VIN
8-10. CV is discharged. When VCV decreases to VIN +
en

ID(L)
VF(H), − ID(H) flows through body diode of Q(H) and
S1
Q(L) Cv
VCV is clamped to VIN + VF(H).
m

After that, Q(H) turns on. Since VDS(H) is nearly zero at ON

S2
the point, Q(H) operates in ZVS and ZCS. Thus, the
m

switching loss is nearly zero. Ci

o

Figure 8-9. Operation in Period E

ec

7) After the Period F

Then, ID(H) flows and the operation returns to the
R

period A.
Q(H)
The above operation is repeated, the energy is
ot

-ID(H)
OFF LR
transferred to the secondary side from the resonant VIN
LP
N

circuit.
-IL
Q(L)
VCV
Cv
OFF

Ci

Figure 8-10. Operation in Period F

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8.2 Startup Operation In startup operation, the IC starts a switching

operation when the IC satisfies all conditions below as
Figure 8-11 shows the VCC pin peripheral circuit shown in Figure 8-14.
with Brown-in and Brown-out Function, Figure 8-12 VCC pin voltage ≥ VCC(ON) = 11.8 V
shows the VCC pin peripheral circuit without Brown-in VSEN pin voltage ≥ VSEN(ON) = 1.42 V
and Brown-out Function (see Section 8.8 about CSS pin voltage ≥ VCSS(2) = 0.59 V
Brown-in and Brown-out Function).
The VCC pin is a power supply input pin for a control VCC pin
circuit and is supplied from an external power supply. In voltage VCC(ON)
Figure 8-13, when the VCC pin increases to the
Operation Start Voltage, VCC(ON) = 11.8 V, the control VSEN pin
circuit starts operation. When the VCC pin decreases to voltage VSEN(ON)
the Operation Stop Voltage, VCC(OFF) = 9.8 V, the control
circuit is stopped by Undervoltage Lockout (UVLO) CSS pin

ns
voltage
circuit, and returns to the state before startup. VCSS(2)

ig
VGL pin
voltage

es
R1 External power supply
time

D
R2
C1 U1 Figure 8-14. Startup Waveforms
R3
VCC 2

ew
1
VSEN
CSS GND rN When the IC is supplied by the external power supply,
R4 5 4 tST is calculated by Equation (7).
C2 C3 tST is the total startup time until the IC starts a
C6
switching operation after VCC pin voltage reaches
VCC(ON).
fo

Figure 8-11. VCC Pin Peripheral Circuit with

● With Brown-in and Brown-out Function
d

Brown-in and Brown-out Function

de

C6 × VCSS( 2 )
t ST = t ST1 = (7)
External power supply | I CSS( C ) |
en

C1 U1 where, VCSS(2) is 0.59 V and ICSS(C) is − 0.18 mA.

m

1 VCC 2 If C6 is 1 μF, tST becomes about 3.3 ms.

VSEN
m

CSS GND
● Without Brown-in and Brown-out Function
5 4
o

In this case, tST is a value of adding tST1 calculated by

C2 C3
Equation (7) to tST2 calculated by Equation (8). The
ec

C6
period that until the VSEN pin voltage reaches to
R

VSEN(ON) = 1.42 V after the VCC pin voltage reaches

Figure 8-12. VCC Pin Peripheral Circuit without VCC(ON) is defined as tST2.
Brown-in and Brown-out Function
ot

t ST 2 = C2 × 380k (8)
N

Circuit current, ICC

If C6 is 1 μF and C2 is 0.01 μF, tST1 becomes 3.3ms
and tST2 becomes about 3.8 ms.
Thus, tST is tST1 + tST2 = 7.1 ms.
Stop Start

VCC（OFF） VCC（ON） VCC pin

voltage

Figure 8-13. Relationship between

VCC Pin Voltage and ICC

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8.3 Soft Start Function When the voltage of between the VB pin and the VS
pin, VB-S, increases to VBUV(ON) = 7.3 V or more, an
Figure 8-15 shows the waveform of the CSS pin in the internal high-side drive circuit starts operation. When
startup operation. VB-S decreases to VBUV(OFF) = 6.4 V or less, its drive
The IC has Soft Start Function to reduce stress of circuit stops operation.
peripheral component and prevent the capacitive mode In case the both ends of C10 are short, the IC is
operation. During the soft start operation, C6 connected protected by VBUV(OFF).
to the CSS pin is charged by the CSS Pin Charge D1 should use a fast recovery diode that is short
Current, ICSS(C) = − 0.18 mA. The oscillation frequency is recovery time and low leakage current. AG01A
varied by the CSS pin voltage. The oscillation frequency (Vrm = 600 V, Sanken product) is recommended when
becomes gradually low with the increasing CSS pin the maximum input voltage is 265V AC.
voltage. At same time, output power increases. When C10 should use film or ceramic capacitor that is the
the output voltage increases, the IC is operated with an low ESR and the low leakage current.
oscillation frequency controlled by feedback.

ns
If the overcurrent protection activates as soon as the D1 R8 Bootstrap circuit
IC starts and the CSS pin voltage is under the CSS Pin

ig
Threshold Voltage (2), VCSS(2) = 0.59 V, the IC stops 14
C10
VB VGH 16

es
switching operation. Since the period of the high peak D2
High- side
current of primary windings becomes short, the stress of Driver Q(H) T1

D
15
peripheral components is reduced. REG VS
8
When the IC becomes any of the following conditions, VGL
11
C9 Cv

ew
C6 is discharged by the CSS Pin Reset Current,
GND Q(L)
ICSS(R) = 1.8 mA. 4 Ci
U1 COM 10

● VCC pin voltage ≤ VCC(OFF)= 9.8 V

rN
● VSEN pin voltage ≤ VSEN(OFF)= 1.16 V
● When the latched shutdown is operated by External Figure 8-16. Bootstrap Circuit
Latched Shutdown Function or some protection (OVP,
fo

OLP and TSD)

8.5 Constant Output Voltage Control
d

OCP
CSS pin Figure 8-17 shows the FB pin peripheral circuit. The
de

voltage operation Oscillation frequency is

period controlled by feedback current FB pin is sunk the feedback current by the photo-coupler,
About 5.5V PC1, connected to FB pin. As a result, since the
en

Soft start
peropd oscillation frequency is controlled by the FB pin, the
output voltage is controlled to constant voltage (in
m

inductance area).
C6 is charged by -0.18mA When the FB pin current decreases to the FB Pin
m

VCSS(2)=0.59V
Source current at Burst Mode Start, ICONT(1) = − 2.5 mA
time or less at light load, the IC stops switching operation.
o

Primary
winding This operation reduces switching loss, and prevents the
ec

current increasing of the secondary output voltage. The

Limited by photo-coupler of the secondary side should be
R

OCP
considered about the secular change of CTR and its
0A current ability for control should be set ICONT(2) = − 3.7
ot

time
mA (min.) or less. The recommend value of R6 is
560 Ω.
N

Figure 8-15. Soft Start Operation Waveforms U1

FB GND
3 4
8.4 High-side Driver
Figure 8-16 shows a bootstrap circuit. The bootstrap C5 R5 R6
circuit is for driving to Q(H) and is made by D1, R8 and
C10 between the REG pin and the VS pin.
When Q(H) is OFF state and Q(L) is ON state, the VS C4 PC1
pin voltage becomes about ground level and C10 is
charged from the REG pin. Figure 8-17. FB Pin Peripheral Circuit

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8.6 Automatic Dead Time Adjustment VIN

Dead time detection Q(H)
Function Reg VGH
16

SW2
As shown in Figure 8-18, if the dead time is shorter 15 T1
VS
than the voltage resonant period, the power MOSFET is
turned on and off during the voltage resonant operation. Logic Q(L)
Cv
In this case, the power MOSFET turned on and off in VGL 11 VCV
hard switching operation, and the switching loss
increases. The Automatic Dead Time Adjustment SW1 Ci
10
COM
Function is the function that the ZVS (Zero Voltage
RC
Switching) operation of Q(H) and Q(L) is controlled RV CRV
9
automatically by the voltage resonant period detection of U1
IC. The voltage resonant period is varied by the power

ns
supply specifications (input voltage and output power, Figure 8-19. RV Pin Peripheral Circuit and Dead Time
etc.). However, the power supply with this function is Detection Circuit

ig
unnecessary to adjust the dead time for each power
supply specification.

es
Q(L) drain to dt dt
VGL source voltage,

D
VDS(L)
dv
time

ew
VGH Dead time

Differential
Q(H) D-S voltage, current,Δi
Loss increase by hard
rN
switching operation
VDS(H) time
fo

Voltage resonant period Figure 8-20. Differential Current Waveforms

d
de

Figure 8-18. ZVS Failure Operation Waveform

Figure 8-21 shows the operating waveform of the
Automatic Dead Time Adjustment Function. When Q(L)
en

Figure 8-19 shows the RV pin peripheral circuit and and Q(H) turn off, this function operates as follows:
the internal dead time detection circuit. The external
m

components for this function is only high-voltage ● Q(L) Turns Off

ceramic capacitor, CRV, connected between the VS pin After Q(L) turns off, SW2 is turned on while SW1 is
m

and the RV pin. The value of CRV is about 5 pF. kept on state. The resonant current flows through CV,
The RV pin voltage is the divided voltage by resistors Ci and T1 (refer to Figure 8-19) and the CV voltage,
o

between the internal reference voltage, Reg, and the VCV, increases from 0 V. When VCV becomes
ec

GND pin. When the drain to source voltage of Q(L), Equation (11), the resonant current flows through the
VDS(L), increases, the differential current, Δi, flows body diode of Q(H) and VCV is clamped VIN + VF(H).
R

through CRV (refer to Figure 8-20). The dv/dt when The period that until VCV is clamped after VCV starts
VDS(L) increases is detected by Δi input to the RV pin. to increase is defined as the voltage resonant period.
ot

Since SW1 and SW2 turn on necessary period, the IC

circuit current reduction and the differential circuit VCV ≥ VIN + VF( H )
N

(11)
response improvement are achieved.
Δi is calculated by Equation (9). The CRV should be
Where, VIN is input voltage and VF(H) is the forward
adjusted in all condition including transient state so that
voltage of the body diode of Q(H)
Δi satisfies Equation (10).
If Δi is large, the capacitance of CRV is adjusted small.
In this time, the differential current, Δi, flows through
When dt is under 40 ns, Δi is ± 100 mA.
CRV. The RV pin voltage increases from the voltage
divided by internal resistors and becomes internal
 dv  clamped voltage. When the voltage resonant period
Δi＝C RV ×   (9)
 dt  finishes and flowing Δi finishes, the RV pin voltage
starts to decrease. When the RV pin voltage becomes
100 (mA) × 40 (ns) the Voltage Resonant Detection Voltage (1),
Δi ≤ (10)
VRV(1) = 4.9 V, Q(H) is turned on and SW1 is turned off.
dt

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The period that until SW1 is turned off after SW2 is When the RV pin is inputted the signal of VRV(1) and
turned on is defined as the automatically adjusted VRV(2), the IC is controlled ZVS (Zero Voltage
dead time. Switching) always by the Automatic Dead Time
Adjustment Function.
● Q(H) Turns Off In minimum output power at maximum input voltage
After Q(H) turns off, SW1 is turned on while SW2 is and maximum output power at minimum input voltage,
kept on state. The resonant current flows through CV, the ZCS (Zero Current Switching) operation of IC (the
Ci and T1 (refer to Figure 8-19) and the CV voltage, drain current flows through the body diode is about 1 μs
VCV, decrease from the input voltage, VIN. as shown in Figure 8-21), should be checked based on
When VCV becomes Equation (12), the resonant actual operation in the application.
current flows through the body diode of Q(L) and VCV
is clamped − VF(L). The period that until VCV is
clamped after VCV starts to decrease is defined as the 8.7 Capacitive Mode Operation Detection

ns
voltage resonant period. Function
VCV ≤ −VF( L )

ig
(12) The resonant power supply is operated in the
inductance area shown in Figure 8-22. In the capacitance

es
area, the power supply becomes the capacitive mode
Where, VF(L) is the forward voltage of the body diode
operation (refer to Section 8.1). In order to prevent the

D
of Q(L).
operation, the minimum oscillation frequency is needed
to be set higher than f0 on each power supply
In this time, the differential current, Δi, flows through

ew
specification.
CRV. The RV pin voltage decreases from the voltage
However, the IC has the capacitive mode operation
divided by internal resistors and becomes about the
Detection Function kept the frequency higher than f0.
rN
ground voltage. When the voltage resonant period
Thus, the minimum oscillation frequency setting is
finishes and flowing Δi finishes, the RV pin voltage
unnecessary and the power supply design is easier. In
starts to increase. When the RV pin voltage becomes
addition, the ability of transformer is improved because
fo

the Voltage Resonant Detection Voltage (2),

the operating frequency can operate close to the resonant
VRV(2) = 1.77 V, Q(L) is turned on and SW2 is turned
frequency, f0.
off. The period until SW2 is turned off after SW1 is
d

The RC pin detects the resonant current, and the

turned on is defined as the automatically adjusted
de

capacitive mode operation is prevented. The Capacitive

dead time.
Mode Operation Detection Function operations as
follows:
en

Automatically adjusted dead time

SW1 ON ON
m

OFF
Capacitance area Inductance area
m

ON
SW2
Impedance

OFF OFF
o

Voltage Operating area

Q(H) drain to source resonant
ec

voltage, VDS(H) period

R

f0
Voltage Resonant fresuency
resonant
Q(L) drain to source
ot

period
voltage, VDS(L)=VCV Hard switching Sift switching
N

RV pin voltage
VRV(1)
VRV(2)
Uncontrollable operation

Q(H) drain current,

ID(H) Figure 8-22. Operating Area of Resonant Power
Flows through body diode
Supply
about 1μs

Figure 8-21. Automatic Dead Time Adjustment

Function Operating Waveforms

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● Period in which the Q(H) is ON off, output short and dynamically output power
Figure 8-23 shows the RC pin waveform in the changing). In addition, the RC pin voltage should be
inductance area, and Figure 8-24 shows the RC pin within the absolute maximum voltage ± 6 V.
waveform in the capacitance area. Since ROCP and C11 are used by Overcurrent
In the inductance area, the RC pin voltage doesn’t Protection (OCP), these values should take account of
cross VRC = + 0.155 V in the downward direction OCP. If the RC pin voltage becomes more than the RC
during the on period of Q(H) as shown in Figure 8-23. pin threshold voltage (High speed), VRC(S) = 2.35 V, or
On the contrary, in the capacitance area, the RC pin less than VRC(S) = – 2.35 V, OCP becomes active (refer
voltage crosses VRC = + 0.155 V in the downward to Section 8.9).
direction. At this point, the capacitive mode operation
is detected. Thus, Q(H) is turned off, and Q(L) is turned 16
on, as shown in Figure 8-24. VGH
U1
15 T1
VS
● Period in which the Q(L) is On

ns
ID(H)
Contrary to the above of Q(H), in the capacitance area, VGL
11
Cv ID(L)

ig
the RC pin voltage crosses VRC = – 0.155 V in the
upward directiont during the on period of Q(L). At Ci

es
10
this point, the capacitive mode operation is detected. RC COM
GND CSS OC RC
Thus, Q(L) is turned off and Q(H) is turned on. 4 5 6 7 C12

D
As above, since the capacitive mode operation is R11
C14

ew
ROCP
detected by pulse-by-pulse and the operating C13
C8
frequency is synchronized with the frequency of the
capacitive mode operation, and the capacitive mode
rN
operation is prevented. Figure 8-25. RC pin peripheral circuit

VDS(H) OFF
fo

8.8 Brown-in and Brown-out Function

ON
When the input voltage decreases, the switching
d

RC pin
operation of the IC is stopped by Brown-in and
de

voltage
VRC+ Brown-out Function. This function prevents excessive
0 input current and overheats.
en

The detection voltage of Brown-in and Brown-out

Function is set by R1 to R4 shown in Figure 8-26. When
m

the VCC pin voltage is higher than VCC(ON), this function

Figure 8-23. RC Pin Voltage in Inductance Area operates depending on the VSEN pin voltage as follows:
m

VDS(H) OFF
● When the VSEN pin voltage is more than VSEN
o

(ON) = 1.42 V, the IC starts.

● When the VSEN pin voltage is less than VSEN
ec

0 ON
(OFF) = 1.16 V, the IC stops switching operation.
Capacitive mode
R

RC pin
VRC+ operation detection
voltage Given, the DC input voltage when the IC starts as
0 VIN(ON), the DC input voltage when the switching
ot

operation of the IC stops as VIN(OFF). VIN(ON) is calculated

by Equation (13). VIN(OFF) is calculated by Equation (14).
N

Thus, the relationship between VIN(ON) and VIN(OFF) is

Figure 8-24. RC Pin Voltage in Capacitance Area Equation (15).

In order to quicken detection speed of the capacitive

VIN(ON) ≒ VSEN ( ON ) ×
(R1 + R 2 + R 3 + R 4) (13)
mode operation, the RC pin is connected before the filter R4
circuit of the OC pin as shown in Figure 8-25. C8 is for
preventing malfunction caused by noise. The value of
VIN(OFF) ≒ VSEN ( OFF) ×
(R1 + R 2 + R 3 + R 4) (14)
C8 is about 100 pF.
R4
The value of ROCP and C11 should be adjusted so that
the RC pin voltage reaches to VRC = ± 0.155 V in the
condition that the IC operation becomes the capacitive V SEN ( OFF)
VIN(OFF) ≒ × VIN(ON) (15)
mode operation easily (startup operation, input voltage VSEN ( ON )

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SSC9522S

The detection resistance is calculated from Equation U1

(13) as follows:
GND CSS
4 5 External
VIN(ON) − VSEN ( ON )
R1 + R 2 + R 3 ≒ × R4 (16) circuit
VSEN ( ON )
C6 VCSS(1) ≤ VCSS <12V
Because R1, R2, and R3 are applied high DC voltage
and are high resistance, the following should be
considered: Figure 8-27. CSS pin peripheral circuit example
● Select a resistor designed against electromigration
according to the requirement of the application, or
● Use a combination of resistors in series for that to 8.10 Overcurrent Protection (OCP)

ns
reduce each applied voltage When Overcurrent Protection (OCP) is activated, the
C2 shown in Figure 8-26 is for reducing ripple output power is limited by detecting the drain current of

ig
voltage of detection voltage and making delay time. The the power MOSFET at pulse-by-pulse.
value of C2 is about 0.1 μF. The overcurrent is detected by the OC pin or the RC

es
The value of R1 to R4 and C2 should be selected pin. Figure 8-28 shows the peripheral circuit of the OC

D
based on actual operation in the application. pin and the RC pin.
When the Brown-in and Brown-out Function does not C11 is the bypass capacitor. Since C11 is smaller than
Ci, the detection current of ROCP becomes low. Thus, the

ew
be used, the detection resistance (R1, R2, R3, and R4) is
removed. C2 is for preventing malfunction caused by ROCP can reduce loss and be small resistor.
noise. The value of C2 is about 0.01 μF.
rN
Q(H)
16
VGH

R1 15 T1
fo
VAC U1 VS

R2 U1 Q(L) ID(H)
C1
d

11
VGL Cv
R3
1
de

VSEN Ci
10
R4 GND CSS OC RCRC COM
C2
en

4 GND 4 5 6 7 C11
m

R7
Figure 8-26. VSEN Pin Peripheral Circuit C8 ROCP
m

C7
C6
o

8.9 External Latched Shutdown Function

ec

Figure 8-28. The Peripheral Circuit of OC Pin and RC

Figure 8-27 shows the CSS pin peripheral circuit Pin
example. When the voltage is inputted to the CSS pin
R

from an external power supply, External Latched

Shutdown Function is activated, the IC stops switching Since the accurate value of the resonant current
ot

operation in the latch mode. When the VCC pin voltage cannot be calculated easy from the condition of the
is decreased to VCC(LA_OFF) = 8.2 V or less, the latch resonant power supply including input voltage and
N

mode is released. output voltage, the value of ROCP, C11, R7 and C7

This function can be used as the protection of should be adjusted based on actual operation in the
abnormal operations. application. R7 and C7 are the filter of the OC pin.
The CSS pin input voltage should be set The value of ROCP, C11, R7 and C7 are set as follows:
VCSS(1) = 8.6 V (max.) or more and less than the absolute
maximum ratings 12 V. ● C11 and ROCP
Since the sink current flows from the CSS pin in the C11 is 100pF to 330pF (around 1 % of Ci value).
overcurrent operation (refer to Section 8.10), the current ROCP is around 100 Ω.
supply ability of the external circuit should be set more Given the current of the high side power MOSFET at
than the CSS pin sink current (about 100 mA). ON state as ID(H). ROCP is calculated Equation (17).
The detection voltage of ROCP is used the detection of
the capacitive mode operation (refer to Section 8.7).
Therefore, setting of ROCP and C11 should be taken

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SSC9522S

account of both OCP and the capacitive mode 8.11 Overload Protection (OLP)
operation.
Figure 8-29 shows the FB pin peripheral circuit,
V OC ( L ) Figure 8-30 shows the FB pin waveform at Overload
R OCP ≒ Protection (OLP) operation.
 C11  (17)
I D(H) ×   When the output power becomes overload state that
 C11 + Ci  the drain current is limited by Overcurrent Protection
(OCP) operation, the oscillation frequency increases.
● R7 and C7 are for high frequency noise reduction. When the oscillation frequency increases, the output
R7 is 100 Ω to 470 Ω. C7 is 100 pF to 1000 pF. voltage decreases and the current of the secondary
photo-coupler becomes zero. Thus, the feedback current
Table 8-1 shows the overcurrent detection voltage of flowing through the photo-coupler connected the FB pin
the OC pin and the RC pin, and the sink current of CSS becomes zero. As a result, C4 is charged by the FB Pin
Source Current IFB = − 25.5 μA, and the FB pin voltage

ns
pin. There are three OCP operations as follows:
increases. If the FB pin voltage increases to the FB Pin
Threshold Voltage VFB = 7.05 V, the IC stops switching

ig
1) Low Level OCP Detection
When the OC pin voltage becomes VOC(L) or more, C6 operation in the latch mode. When the VCC pin voltage

es
connected to the CSS pin is discharged by the sink is decreased to VCC(LA_OFF) = 8.2 V or less or the VSEN
current ICSS(L). As a result, the oscillation frequency pin voltage is decreased to VSEN(OFF) = 1.16 V or less,

D
increases, the output power is limited. the latch mode is released.
If the OC pin voltage decreases less than VOC(L) The stresses of the power MOSFET and the secondary

ew
during discharge of C6, the IC stops discharge of C6. side rectifier diode are reduced by OLP.
Given the time that until the FB pin voltage reaches to
2) High Level OCP Detection VFB as the OLP delay time, tDLY (refer to Figure 8-30).
rN
When the OC pin voltage becomes VOC(H) or more, C6 tDLY is calculated Equation (18).
is discharged by the sink current ICSS(H). Since ICSS(H) If R5 is 47 kΩ and C4 is 4.7 μF, tDLY becomes about
is eleven times of ICSS(L), the oscillation frequency 0.5 s.
fo

increases at high speed, the output power is limited

quickly. If the OC pin voltage decreases less than
t DLY ≒
(4.05V − R5 × I )× C4 FB
d

VOC(H) during discharge of C6, the IC becomes the (18)

I FB
de

Low Level OCP Detection.

3) High Speed OCP Detection Where, IFB is the FB Pin Source Current − 25.5 μA.
en

In case the large current flows as output is shorted,

this protection is activated. When the OC pin voltage U1
m

or the RC pin voltage becomes as follows, the FB GND

switching states of the power MOSFET is inverted. 3 4
m

OC pin voltage is more than VOC(S) or IFB

o

RC pin voltage is more than |VRC(S)|.

At same time, C6 is discharged by the sink current R5 R6
ec

C5
ICSS(S). As a result, the oscillation frequency increases
at high speed, the output power is limited quickly. If
R

the OC pin voltage decreases less than VOC(S) or the C4 PC1

RC pin voltage becomes within |VRC(S)| due to
ot

reducing the output power, the IC becomes the High Figure 8-29. FB Pin Peripheral Circuit
Speed OCP Detection and the Low Level OCP
N

Detection. FB pin voltage

VFB=7.05V
Table 8-1. Overcurrent Detection Voltage and Sink
C7 is charged by -25.5µA
Current of CSS Pin
Detection CSS Pin
OCP Pins
Voltage Sink Current About 3V
The voltage of both end of
Low OC VOC(L) = 1.52 V ICSS(L) = 1.8 mA R1due to flowing -25.5µA
time
High OC VOC(H) = 1.83 V ICSS(H) = 20.0 mA Normal operation OLP opetation Latched shutdown

OC VOC(S) = 2.35 V
High OLP delay time, tDLY
VRC(S) = 2.35 V, ICSS(S) = 18.3 mA
Speed RC
– 2.35 V Figure 8-30. OLP Operation

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8.12 Overvoltage Protection (OVP) ● Gate Pin Peripheral Circuit

The VGH pin and the VGL pin are for the gate dive of
When the VCC pin voltage increases to the VCC Pin an external power MOSFET. The source peak current
OVP Threshold Voltage VCC(OVP) = 31.0 V, Overvoltage of the VGH pin and the VGL pin are – 515 mA, the
Protection (OVP) is activated and the IC stops switching sink peak current of these pins are 685 mA.
operation in the latch mode. When the VCC pin voltage In Figure 9-1, RA, RB and DS should be adjusted by
is decreased to VCC(LA_OFF) = 8.2 V or less or the VSEN the loss of the power MOSFET and the gate
pin voltage is decreased to VSEN(OFF) = 1.16 V or less, the waveform (reduction of ringing caused by pattern
latch mode is released. layout, and others) and EMI noise.
The VCC pin input voltage should be set absolute RGS is for preventing malfunction caused by
maximum ratings 35 V or less. precipitous dv/dt when the power MOSFET turns off.
The value of RGS is about 10 kΩ to 100 kΩ. RGS is
connected to near the Gate pin and the Source pin.

ns
8.13 Thermal Shutdown (TSD) When the gate resistances are adjusted, the gate
waveforms should be checked that the dead time is
When the junction temperature of the IC reach to the

ig
ensured as shown in Figure 9-2.
Thermal Shutdown Temperature Tj(TSD) = 150 °C (min.),
Thermal Shutdown (TSD) is activated and the IC stops

es
RB DS
switching operation in the latch mode. When the VCC Drain

D
pin voltage is decreased to VCC(LA_OFF) = 8.2 V or less or Gate
the VSEN pin voltage is decreased to VSEN(OFF) = 1.16 V
or less, the latch mode is released. RA

ew
rN RGS Source

9. Design Notes Figure 9-1. Peripheral Circuit of Power MOSFET Gate

fo

High-side
d

9.1 External Components Gate

de

Take care to use properly rated, including derating as

Vth(min.)
necessary and proper type of components.
en

● Input and Output Electrolytic Capacitor Low-side Dead time Dead time
m

Apply proper derating to ripple current, voltage, and Gate

temperature rise. The electrolytic capacitor of high
m

ripple current and low impedance types, designed for Vth(min.)

switch mode power supplies, is recommended to use.
o
ec

● Resonant Transformer Figure 9-2. Dead Time Confirmation

The resonant power supply uses the leakage
R

inductance of transformer. Therefore, in order to

reduce the effect of the eddy current and the skin
ot

effect, the wire of transformer should be used a

bundle of fine litz wires.
N

● Current Detection Resistor, ROCP

Choose a type of low internal inductance because a
high frequency switching current flows to ROCP, and
of properly allowable dissipation.

● Current Resonant Capacitor, Ci

Large resonant current flows through Ci. Ci should
use the polypropylene film capacitor with low loss
and high current capability. In addition, Ci must be
considered its frequency characteristic since high
frequency current flows.

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SSC9522S

9.2 PCB Trace Layout and Component

Placement 2) Control Ground Trace Layout
When large current flows into the control ground trace,
Since the PCB circuit design and the component the operation of IC might be affected by it. The
layout significantly affect the power supply operation, control ground trace should be separate from the main
EMI noise, and power dissipation, the high frequency circuit trace, and should be connected at a single point
trace of PCB shown in Figure 9-3 should be designed grounding as close to the GND pin as possible.
low impedance by small loop and wide trace.
3) VCC Trace Layout
This is the trace for supplying power to the IC, and
thus it should be as small loop as possible. If C3 and
the IC are distant from each other, placing a film
capacitor Cf (about 0.1 μF to 1.0 μF) close to the VCC

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pin and the GND pin is recommended.

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4) Peripheral Components for the IC Control
These components should be placed close to the IC,

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Ci
and be connected to the IC pin as short as possible.

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Figure 9-3. High Frequency Current Loops (hatched 5) Bootstrap Circuit Components
areas) These components should be connected to the IC pin

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as short as possible, and the loop for these should be
In addition, the PCB circuit design should be taken
rN as small as possible.
account as follows:
Figure 9-4 shows the circuit design example. 6) Secondary side Rectifier Smoothing Circuit Trace
Layout
This is the trace of the rectifier smoothing loop,
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1) Main Circuit Trace Layout

This is the main trace containing switching currents, carrying the switching current, and thus it should be as
and thus it should be as wide trace and small loop as wide trace and small loop as possible.
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possible.
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(1) Main trace should be wide (3) Loop of the power

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BR1 trace and small loop supply should be small

VAC
R1
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R2 C3 外部電源 (5)Boot strap circuit trace

C1 should be small loop
R4 (6) Main trace of secondary
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side should be wide trace

C2 R3 VSEN NC and small loop
1 18
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D1 T1 D51
VCC NC
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2 17 Q(H)
C5 R8
Cf
C4 R5 FB VGH C51
3 16
R

SSC9522S

R6
(2)GND trace for IC PC1 GND VS
4 15
should be separate
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from main trace and D2

should be connected C6 CSS VB
5 14
at a single point CV
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C10
C7 OC NC
6 13
D52
R7
U1

C8 RC NC
7 12
Q(L)
C9 REG VGL
8 11 Ci
C11
(4)Peripheral RV COM
components for IC ROCP 9 10
control should be
placed close to the IC

CRV

C12

Figure 9-4. Peripheral Circuit Example Around the IC

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SSC9522S

Important Notes
● All data, illustrations, graphs, tables and any other information included in this document as to Sanken’s products listed herein (the
“Sanken Products”) are current as of the date this document is issued. All contents in this document are subject to any change
without notice due to improvement of the Sanken Products, etc. Please make sure to confirm with a Sanken sales representative
that the contents set forth in this document reflect the latest revisions before use.
● The Sanken Products are intended for use as components of general purpose electronic equipment or apparatus (such as home
appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products,
please put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to
Sanken. When considering use of the Sanken Products for any applications that require higher reliability (such as transportation
equipment and its control systems, traffic signal control systems or equipment, disaster/crime alarm systems, various safety
devices, etc.), you must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix
your name and seal, on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the
Sanken Products. The Sanken Products are not intended for use in any applications that require extremely high reliability such as:
aerospace equipment; nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result

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in death or serious injury to people, i.e., medical devices in Class III or a higher class as defined by relevant laws of Japan
(collectively, the “Specific Applications”). Sanken assumes no liability or responsibility whatsoever for any and all damages and

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losses that may be suffered by you, users or any third party, resulting from the use of the Sanken Products in the Specific
Applications or in manner not in compliance with the instructions set forth herein.

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● In the event of using the Sanken Products by either (i) combining other products or materials therewith or (ii) physically,
chemically or otherwise processing or treating the same, you must duly consider all possible risks that may result from all such

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uses in advance and proceed therewith at your own responsibility.
● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the

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occurrence of any failure or defect in semiconductor products at a certain rate. You must take, at your own responsibility,
preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which
the Sanken Products are used, upon due consideration of a failure occurrence rate or derating, etc., in order not to cause any human
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injury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products. Please refer
to the relevant specification documents and Sanken’s official website in relation to derating.
● No anti-radioactive ray design has been adopted for the Sanken Products.
● No contents in this document can be transcribed or copied without Sanken’s prior written consent.
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● The circuit constant, operation examples, circuit examples, pattern layout examples, design examples, recommended examples, all
information and evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of
use of the Sanken Products and Sanken assumes no responsibility whatsoever for any and all damages and losses that may be
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suffered by you, users or any third party, or any possible infringement of any and all property rights including intellectual property
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rights and any other rights of you, users or any third party, resulting from the foregoing.
● All technical information described in this document (the “Technical Information”) is presented for the sole purpose of reference
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of use of the Sanken Products and no license, express, implied or otherwise, is granted hereby under any intellectual property
rights or any other rights of Sanken.
● Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied,
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including, without limitation, any warranty (i) as to the quality or performance of the Sanken Products (such as implied warranty
of merchantability, or implied warranty of fitness for a particular purpose or special environment), (ii) that any Sanken Product is
m

delivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance, course
of dealing or usage of trade, and (iv) as to any information contained in this document (including its accuracy, usefulness, or
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reliability).
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● In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws and
regulations that regulate the inclusion or use of any particular controlled substances, including, but not limited to, the EU RoHS
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Directive, so as to be in strict compliance with such applicable laws and regulations.

● You must not use the Sanken Products or the Technical Information for the purpose of any military applications or use, including
but not limited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Technical
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Information, or providing them for non-residents, you must comply with all applicable export control laws and regulations in each
country including the U.S. Export Administration Regulations (EAR) and the Foreign Exchange and Foreign Trade Act of Japan,
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and follow the procedures required by such applicable laws and regulations.
● Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including
the falling thereof, out of Sanken’s distribution network.
● Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it is
error free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting
from any possible errors or omissions in connection with the contents included herein.
● Please refer to the relevant specification documents in relation to particular precautions when using the Sanken Products, and refer
to our official website in relation to general instructions and directions for using the Sanken Products.
● All rights and title in and to any specific trademark or tradename belong to Sanken or such original right holder(s).

DSGN-CEZ-16002

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