3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

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UGRD-ECE6342-2123T /
Week 7 and 8 /
Midterm Quiz 1

Started on Thursday, 10 March 2022, 7:02 PM

State Finished
Completed on Thursday, 10 March 2022, 7:08 PM
Time taken 6 mins 7 secs
Marks 18.00/20.00
Grade 90.00 out of 100.00

Question 1
Correct

Mark 1.00 out of 1.00

What is the best choice of IC package used for experimental purpose?

Select one:
a. Metal can package

b. Transistor pack

c. DIP package


d. Flat pack

Your answer is correct.

Question 2
Correct

Mark 1.00 out of 1.00

What is the general information specified in ordering an IC?

Select one:
a. Package type

b. Device type

c. Temperature range

d.  Temperature, Device and Package Type



Your answer is correct.

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3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

Question 3

Correct

Mark 1.00 out of 1.00

Dual-In-Line pack is considered to be suitable for mounting because......

Select one:
a. Fits mounting hardware

b. Lightweight

c. Inexpensive


d. Easy to handle

Your answer is correct.

Question 4
Correct

Mark 1.00 out of 1.00

What is the use of notch and dot in DIP ICs?

Select one:
a. Determine the pin configuration

b. Represent property of IC

c. Designed to represent device type

d. Find the pin number



Your answer is correct.

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3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

Question 5

Correct

Mark 1.00 out of 1.00

Which package type is chosen for military purposes?

Select one:
a. Plastic DIP

b. Plat pack

c. Ceramic DIP


d. Metal can pack

Your answer is correct.

Question 6
Correct

Mark 1.00 out of 1.00

How a choice is made, if all three package types are available?

Select one:
a. Based on cost, fabrication and experimentation usage


b. Based on fabrication

c. Based on Experimentation usage

d. Based on cost

Your answer is correct.

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3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

Question 7

Correct

Mark 1.00 out of 1.00

In ordering an IC, the device type is represented as......

Select one:
a. Numbers

b. Alphanumeric characters 

c. Alphabets

d. Symbols

Your answer is correct.

Question 8
Correct

Mark 1.00 out of 1.00

Why Integrated Circuits are considered to be economical?

Select one:
a. Easy to use and reuse

b. Due to batch production



c. Simple manufacturing process

d. Provide trouble free service

Your answer is correct.

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3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

Question 9

Correct

Mark 1.00 out of 1.00

Which of the following circuit is not made of digital ICs?

Select one:
a.  Demultiplexers

b. Counters

c. Multipliers


d. Shift registers

Your answer is correct.

Question 10
Correct

Mark 1.00 out of 1.00

Controlling the characteristics of operating region is not taken care in digital ICs because_____.

Select one:
a. Digital IC requires only power supply, input and output

b. It is lightweight

c. It involves only two voltages



d. It is used to form transistor logic

Your answer is correct.

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3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

Question 11

Correct

Mark 1.00 out of 1.00

How are components array available in IC form?

Select one:
a. Array of silicon wafer

b. Group of gates logic circuits arranged in array format

c. Group of isolated transistor, diodes and resistor



d. Array of individual stages of differential and cascade amplifier

Your answer is correct.

Question 12
Correct

Mark 1.00 out of 1.00

Which type of integrated circuit is suitable for small quantity custom circuits?

Select one:
a. Monolithic IC

b. Linear IC

c. Hybrid IC


d. Digital IC

Your answer is correct.

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3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

Question 13

Correct

Mark 1.00 out of 1.00

Monolithic Integrated Circuits exhibits __________

Select one:
a. Thermal stability


b. POwer Consumption, non-matched devices, thermal stability

c. Non-matched devices

d. Increase in power consumption

Your answer is correct.

Question 14
Correct

Mark 1.00 out of 1.00

How are thin film hybrid ICs obtained?

Select one:
a. Silk screening method

b. Adiabatic cooling method

c. Spraying method

d. Evaporation method


Your answer is correct.

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3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

Question 15

Correct

Mark 1.00 out of 1.00

DIP simple means

Select one:
a. dual inline package


b. dielectric inline package

c. double inline process

d. double inline package

Your answer is correct.

Question 16
Incorrect

Mark 0.00 out of 1.00

There are Three common types of packages, TO Package, DIP and ______.

Select one:
a. Surface Pack

b. Film Pack

c. Flat Pack

d. Hybrid Pack


Your answer is incorrect.

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3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

Question 17

Incorrect

Mark 0.00 out of 1.00

The modified TO-5 package can be either plugged into or embedded in a ______ .

Select one:
a. package


b. board

c. flat

d. surface

Your answer is incorrect.

Question 18
Correct

Mark 1.00 out of 1.00

Whether the package is plugged in or ________, the interconnection area of the package leads must have sufficient clearance on both sides of
the board.

Select one:
a. embedded


b. board

c. flat

d. surface

Your answer is correct.

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3/18/22, 10:30 PM Midterm Quiz 1: Attempt review

Question 19

Correct

Mark 1.00 out of 1.00

Many types of IC flat packs are being produced in various sizes and materials. These packages are available in ________, rectangular, oval, and
circular. 

Select one:
a. Square


b. Round

c. Octagon

d. Triangular

Your answer is correct.

Question 20
Correct

Mark 1.00 out of 1.00

The die-bonding step is followed by bonding gold or _______ wires between the bonding islands on the IC die and on the inner portions of
the package leads. 

Select one:
a. diamond

b. nickel

c. aluminum


d. steel

Your answer is correct.

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