Solve it with the problem solvers.

Reliability and Flexibility to Handle Tomorrow’s Challenges

Omron’s new VT-WIN II offers advances in solder inspection, component fault detection and process speed
that give you a competitive edge in productivity, waste reduction and quality control. First introduced in 1996,
the original VT-WIN revolutionized in-line PCB inspection with a patented Color Highlight System and color
image processing that positioned Omron as an industry leader in this category of quality improvement tools.

Advances Evolved for Maximizing All Of Where VT-WIN II

Changing Needs Your Resources Contributes Most
The VT-WIN II delivers these Join the hundreds of foreign By integrating VT-WIN II into
major improvements: and domestic VT-System users your process, you will improve
and discover how our combination of production and inspection quality, verify
Angled-view inspection to detect lifted
leads on gullwing devices and heel fillets powerful, easy-to-use software, unique process engineering and allow for a
on SOJ and PLCC devices inspection algorithms and the ability to more efficient distribution of resources.
perform 100% detailed inspections at The VT-WIN II inspection system offers
Industry-leading algorithms to accurately production speeds can help your bottom line. benefits that will positively impact multiple
inspect lead-free solder We increase the speed of rework and repair areas in your process, including:
Four times the inspection area and twice by using fault images combined with the PCB
the speed map location for fault verification. The full Post Wave Solder

Automatic color extraction tool and other color images captured during setup or Post Reflow
teaching aid functions dramatically operation can be further used for training and
reduce setup time to improve the performance of your assembly
operation. Both uses help maximize your
Omron’s commitment to continuous
production up-time and eliminate waste.
improvement and innovation through R&D
investment assures a steady stream of
advancements to further automate and
simplify the inspection process.

The VT-WIN II combines

innovative technologies,
unrivaled speed, easy-to-use
functionality, and national and
international support to deliver
maximum benefits for your
inspection operations.
Partial Client List
Solectron
Celestica
Flextronics
Kyocera
Siemens
Ford/Visteon
Benchmark Electronics
Sony
Hitachi
Data Acquisition and Interpretation Red
Omron’s patented Color Highlight System provides unparalleled inspection Green
quality for both conventional solder joints and lead-free solder joints. Blue
Our system uses a multi-color LED light source to project red, green and
blue light onto the PCB at different angles. The camera captures these colors
as they reflect off the board’s surface, producing a two-dimensional image
that conveys three-dimensional information. This image allows the VT-WIN II
to detect minute flaws that would ordinarily be missed. For an extensive list
of faults detected, see the next page.
Camera image

Color Extraction Process

The exclusive Color Extraction Process greatly simplifies system setup and
customization of Omron’s patented Color Highlight System for conventional
or lead-free solder. The graphical user interface (GUI) Omron developed
allows an operator to define color values by pointing to a desired object and
assigning it a color with click of a mouse. Proven algorithms allow detection
of a wide range of surface and reflective conditions, especially important with
lead-free solder. Compared to gray-scale inspection methods, where solder
fillet image settings are defined with numerical values for brightness and
contrast, Omron’s Color Extraction Process is significantly easier, reduces
errors due to misinterpretation of data or colors, and ultimately reduces
start-up time.

Angled View Inspection

Gullwing lead pitches are getting smaller,
and many PCB designs are using SOJ Angled view inspection
and PLCC devices to maximize board real
estate through increased density. These
instances present a particular challenge
to accurate automatic detection of solder
fillets and lead lifting. Omron’s exclusive
angled-view inspection lets you look
around at a 20-degree angle. Improved
inspection algorithms, including user-
customized ones, ensure reliable results
from the most challenging board layouts.
Compare the image detail from conven-
tional orthogonal inspection to the
extensive detail of Omron’s angled view.
Orthogonal view
PCB Magnification and Inspection Speed
Eight Magnification Levels Match Component Size
For maximum speed and efficiency in inspecting PCBs with varying
component densities, the VT-WIN II has eight different magnification
levels: 10, 13, 15, 20, 25, 30, 35 and 50 µm resolutions. The standard
power zoom lens allows the operator to customize the inspection
depending on the individual component size. At 10 µm resolution, it is
possible to perform 0.3 mm pitch QFP (quad flat pack) and 0603 mm
(0201 inch) chip component inspections accurately. The zoom lens
allows any three different magnifications to be used when inspecting
PCBs. The VT-WIN II automatically changes magnifications among
programmed selections to maximize inspection speed.
Eight magnification levels
Larger Image Area for Faster Inspections between 10 and 50 µm resolution
To keep in step with tomorrow’s high-speed processing Omron’s
VT-WIN II uses a high resolution, triple element CCD camera with four
times the image area of previous models. Inspection speed is
effectively doubled, too. This reduces the number of views per board to Advanced Fault Detection
program, further speeding both in-line and off-line processes. The VT-WIN II can inspect solder and
component defects on virtually all
types of wave and reflow components,
including J-lead devices and rotated
components with options.
Defects the VT-WIN II can detect
include:
Solder defects:
Bridging
VT-WIN II:
Four times the image area Wettability
Presence/absence
Excessive Solder
Insufficient Solder
Blow Holes
Solder Balls
Lead Free Solder

Component defects
Presence/absence
Shift/skew
Lifting
Un-inserted
Upside-down/backward
Polarity marking
Pin one marking
Component marking
Bent leads
Tombstone
Simple Setup
Operators can quickly set up and teach the VT-WIN II new inspection
programs using Omron’s library-based programming methods. For each type
of component used (transistors, QFPs chip components, etc.), the VT-WIN II
provides a generic inspection model with graphic elements that allow easy
re-shaping to match the exact part. Use the generic model to create specific
component variations in use on the PCB; then name and store it in the library.

Determining Component Placement

At the next stage each component variation gets placed where it appears on a
board. This can be done manually, but Omron automates this labor-intensive
step by merging your CAD or Gerber data with the component library using
our Teaching Interface Software. This automatically creates the inspection
program by assigning the right part variations to their locations. Omron drivers
are available from common CAD management software packages such as
AEGIS CircuitCAM and Tecnomatix. The information used from the component
placement data includes:
Component Library
Component type
Component reference designator
X-Y centroid
Theta rotation
Programs can be created offline to maximize up-time and performance.

Setting Inspection Parameters

The user can adjust the sizes of inspection windows and color variations
of each inspection item (solder joint, component body color, placement
markings, etc.) from a camera image of the component displayed on the
monitor. The last step requires the operator to tune the acceptability criteria
using additional production boards.

PCB Graphic

Automatic Window Position Adjustment

The VT-WIN II can automatically adjust for small changes in
component location and position compared to inspection window
location. If the inspection model is not where it should be, the
system automatically locates the component lands, and repositions
the inspection model. This feature, exclusive to the VT-WIN II,
increases accuracy while decreasing teaching time.
Networking and Data Usage
The VT-Systems family encompasses all the products necessary to maintain an efficient PCB inspection process. They
communicate via Ethernet, RS-232C and SMEMA to exchange important production data from one end of the process to the other.

ORION Repair Station Software

Use this optional software to take the
guesswork out of making delicate repairs
on densely populated PCBs. It automatically
prepares a list of parts, locations and types
of faults on a PCB and shows them on a VT-WIN VT-RBT VT-WIN II
map. VT-WIN II makes fault identification
easier by storing a high-resolution color
image of the defective location, so finding ETHERNET
the part for repair is faster and more
accurate. Data about the repair, the
technicians involved, and more can be
stored to a database for future analysis and
quality control needs.

Remote Teaching System Orion Repair Station Orion Software Suite Windows Server Database

ORION—The Complete
Software Suite
Omron offers three modules to optimize
usage of data gathered from PCB and
solder inspection. They are Data Monitor,
Data Analysis and Data Manager. Used
together these software modules obtain
various types of manufacturing information
in real time. The software can monitor the
operating status of multiple VT-Systems
simultaneously. It can also track the
amount and type of defects, using stored
inspection results to identify manufacturing
trends. The information obtained can be
displayed to reflect the entire production
process or tailored to show the
performance of individual VT-Systems.

Remote Teaching Software

Improve machine up-time by programming VT-WIN II offline using
Omron’s Remote Teaching Software (RTS). It can acquire images from the
VT-WIN II via an Ethernet connection or magnetic optical disk and
process and interpret the images using the Teaching Interface Software.
Use the images for remote programming and off-site training.
 Omron supports VT-System products with a
dedicated national and international staff of
engineers. On-line service and support activities
can be provided via telephone modem. Spare
parts are stocked globally and a 24-hour dispatch
hotline service provides next-flight out support.

HARDWARE SPECIFICATIONS
Image Signal Input Unit Video Camera Triple Element CCD Camera
Light Source 3 Ring-Shaped LED arrays with automatic brightness control
Image Resolution 10, 13, 15, 20, 25, 30, 35, 50 µm
Main Unit PCB Handling Edge Belt Conveyor
Rail Conveyor Width Adjustment Automatic
PCB Fixturing Method Outer Frame
PCB Support To avoid the effect of bending PCB, support pins can be attached.
Power Supply 208 VAC ±10%, 5.5 KVA, 5 minute UPS
Air 0.4 to 0.6 MPa (60 to 90 PSI)
Room Temperature 10° to 35°C (50° to 95°F)
Room Humidity 30 to 80% RH
Weight Medium Under 1350 kg (2970 lbs) Large Under 1700 kg (3740 lbs)
Dimensions Medium 1253 W x 1203 D x 1910 H mm (49.33 W x 47.36 D x 75.20 H in)
Large 1503 W x 1507 D x 1910 H mm (59.17 W x 59.33 D x 75.20 H in)

OPTIONS
J/Angle View Inspection for J-lead components such as PLCC, SOJ, etc.
OCV/OCR Inspect components by checking characters on the component.

FUNCTION SPECIFICATIONS
Inspectable PCBs Solder Process Wave and reflow; lead or lead-free solder
Board Sizes Medium frame: 50 x 80 mm (1.96 x 3.14 in) up to 255 x 333 mm (10.02 x 13.08 in)
Large frame: 50 x 80 mm (1.96 x 3.14 in) up to 460 x 510 mm (18.11 x 20.08 in)
PCB Thickness 0.3 to 4.0 mm (0.01 to 0.16 in)
Camera Clearance 50 mm (1.97 in) both above and below the PCB
Inspectable Components Square Chips 0603 mm (0201 in) packages and up
LSI 0.3 mm (0.01 in) pitch and up
Others Special-shaped components, through-hole components
Inspection Categories Solder Defects Presence/absence of solder, excessive solder, insufficient solder,
blow holes, wettability, bridges, solder balls
Component Defects Presence/absence, shift/skew, lifting, wrong component,
un-inserted, upside-down/backward, polarity marking,
pin one marking, lead bent
Number of Inspection Points Up to 10,000 components/PCB
Data Storage 40 GB hard disk, 13 GB magneto-optical
Component Data Library Up to 999 variation/component types
Inspection Results Output Faulty component name, faulty pin number, type of fault, PCB graphic (printer, monitor)
Standard Inspection Speed 400 msec/screen
Communications Ethernet, RS-232C, SMEMA
Process Change Automatic rail width adjustment
Process Flow Direction Through or Turn Back
Position Standard Left or Right, Front or Back; selectable before shipping.
 Unit: mm (inch)

1,890 1,780
(74.41) (70.08)
1,910
(75.20)
1,465
(57.68)
900
1,290 (35.43)
(50.79)
780
(30.71)

M: 1,253 (49.33) M: 1,203 (47.36)

L: 1,503 (59.17) L: 1,507 (59.33)

PATENT Information
OMRON has many patents for PCB solder inspection systems.
Approved: 40 Pending: 200

UNITED STATES REGIONAL SALES OFFICE AUTHORIZED DISTRIBUTOR:

800.55.OMRON or 847-843-7900
CANADA REGIONAL SALES OFFICE
www.omron.com/oei
416.286.6465
OMRON ELECTRONICS LLC MEXICO SALES OFFICES
Technical Automation Solutions Division Florida 954.227.2121 Ciudad Juarez 656.623.7083
Schaumburg, IL
Mexico, D.F. 555.534.1195 Monterrey, N.L. 818.377.4281
BRAZIL SALES OFFICE
OMRON CANADA, INC. 55.11.5564.6488
Toronto, Ontario
ARGENTINA SALES OFFICE - CONO SUR
SB VTWIN2-1 10/02/5M 114.590.2408
© 2002 OMRON ELECTRONICS LLC
Printed in the U.S.A.