Data Sheet
Data Sheet
D SUFFIX
VCC CASE 751 1
A = Assembly Location
Gate WL, L = Wafer Lot
CTRL Control OUT
Driver YY, Y = Year
Logic
WW, W = Work Week
5.0 V
VT
PIN CONNECTIONS
FLAG SENSE+ 1
FLAG VCC
Latch
SENSE+ CTRL
SENSE– CLI
VREF
VT GND OUT
Lead Temperature Soldering Wave Solder (through hole styles only) Note 1. 260 peak °C
Reflow (SMD styles only) Note 2. 230 peak °C
1. 10 seconds max.
2. 60 seconds max above 183°C
*The maximum package power dissipation must be observed.
General
Power Supply Including Ripple Voltage – 7.0 – 10 V
Quiescent Current, IQ
Turn On VCTRL = 5.5 V – – 15 mA
Turn Off VCTRL = –0.3 V – – 5.0 mA
Control Function
Input Voltage Range ICTRL = 2.0 mA –0.3 – 5.5 V
Input Threshold
Turn On CTRL Increasing – – 3.5 V
Turn Off CTRL Decreasing 1.5 – – V
Hysteresis 0.4 – 2.0 V
Input Capacitance – – – 50 pF
Input Threshold
Turn On CLI Increasing – – 3.5 V
Turn Off CLI Decreasing 1.5 – – V
Hysteresis 0.4 – 2.0 V
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CS8312
Output Stage
IOUT – – – 5.0 mA
Flag Function
Output Low VCTRL = 5.5 V, IFLAG = 1.5 mA – – 0.9 V
Output Capacitance – – – 50 pF
Turn On (VSENSE+ – VSENSE–) VCTRL = 5.5 V, VCLI = –0.3 V 210 225 240 mV
VCTRL = 5.5 V, VCLI = 5.5 V 300 – 350 mV
Turn On Delay – – – 10 µs
Sense Function
Input Voltage Range – –0.3 – 2.5 V
Sense Regulation Voltage VCTRL = 5.5 V, VCLI = –0.3 V 270 295 320 mV
VCTRL = 5.5 V, VCLI = 5.5 V 380 410 440 mV
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CIRCUIT DESCRIPTION
VCC VBAT
LOAD
0.1 µF
VCC
VCC
OUT
R CS8312
FLAG
Microprocessor CTRL
SENSE+
CLI
RSENSE
SENSE–
GND
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CS8312
PACKAGE DIMENSIONS
DIP–8
N SUFFIX
CASE 626–05
ISSUE L
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
8 5 2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
–B– Y14.5M, 1982.
1 4 MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
F C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
NOTE 2 –A– F 1.02 1.78 0.040 0.070
L G 2.54 BSC 0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
C L 7.62 BSC 0.300 BSC
M --- 10 --- 10
J N 0.76 1.01 0.030 0.040
–T–
SEATING N
PLANE
M
D K
H G
0.13 (0.005) M T A M B M
SO–8
D SUFFIX
CASE 751–07
ISSUE W
–X–
NOTES:
A 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
8 5 3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
B S 0.25 (0.010) M Y M SIDE.
1 5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
4
K PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
–Y– EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
G MILLIMETERS INCHES
DIM MIN MAX MIN MAX
C N X 45 A 4.80 5.00 0.189 0.197
B 3.80 4.00 0.150 0.157
SEATING
PLANE C 1.35 1.75 0.053 0.069
–Z– D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
0.10 (0.004) H 0.10 0.25 0.004 0.010
H M J J 0.19 0.25 0.007 0.010
D K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
0.25 (0.010) M Z Y S X S
S 5.80 6.20 0.228 0.244
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Notes
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Notes
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CS8312
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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