INTEGRATED CIRCUITS

DATA SHEET

TDA8444; TDA8444T;
TDA8444AT
Octuple 6-bit DACs with I2C-bus
Product specification 1999 Apr 29
Supersedes data of March 1991
File under Integrated Circuits, IC01
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

FEATURES
• Eight DACs with 6-bit resolution
• Adjustable common output swing
• Push-pull outputs
• Outputs short-circuit protected
• Three programmable slave address bits The TDA8444 contains eight programmable 6-bit DAC
outputs, an I2C-bus slave receiver with three (two for
• Large supply voltage range
SO16) programmable address bits and one input (VMAX) to
• Low temperature coefficient. set the maximum output voltage. Each DAC can be
programmed separately by a 6-bit word to 64 values, but
GENERAL DESCRIPTION VMAX determines the maximum output voltage for all
DACs. The resolution will be approximately 1⁄64VMAX.
The interface circuit is a bipolar IC in a DIP16, SO16, or
SO20 package made in an I2L-compatible 18 V process. At power-on all DACs are set to their lowest value.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VCC supply voltage 4.5 12 13.2 V
ICC supply current VCC = 12 V − 14 − mA
P power dissipation − 170 − mW
VVMAX input effective voltage 1 − VCC − 2.0 V
Vo(DACn) DAC output voltage VMAX = VCC 0.1 − VCC − 0.5 V
Vo(DACn)(max) maximum DAC output voltage 1 < VMAX < VCC − 2.0 − VMAX + 0.3 − V
Isource(min) minimum DAC source current data = 1FH 2 − − mA
Isink(min) minimum DAC sink current data = 1FH 2 − − mA

ORDERING INFORMATION

TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA8444 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
TDA8444T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
TDA8444AT SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

1999 Apr 29 2
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

BLOCK DIAGRAM

handbook, full pagewidth A0 A1 A2 VCC VEE

5 6 7 1 8
3
SDA
4 I2C BUS
SCL
SLAVE RECEIVER
TDA8444
REFERENCE
2
VMAX VOLTAGE
GENERATOR

DAC0 DAC1 DAC2 DAC3 DAC4 DAC5 DAC6 DAC7

9 10 11 12 13 14 15 16

DAC0 DAC1 DAC2 DAC3 DAC4 DAC5 DAC6 DAC7

MGH513

Fig.1 Block diagram.

1999 Apr 29 3
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

PINNING

PIN
SYMBOL TDA8444 TDA8444T TDA8444AT DESCRIPTION
(DIP16) (SO16) (SO20)
VCC 1 1 1 supply voltage
VMAX 2 2 2 control input for DAC maximum output voltage
SDA 3 3 3 I2C-bus serial data input/output
SCL 4 4 4 I2C-bus serial clock
A0 5 6 7 programmable address bit 0 for I2C-bus slave receiver
A1 6 7 8 programmable address bit 1 for I2C-bus slave receiver
A2 7 − 9 programmable address bit 2 for I2C-bus slave receiver
VEE 8 8 10 ground
DAC0 9 9 11 analog voltage output 0
DAC1 10 10 13 analog voltage output 1
DAC2 11 11 14 analog voltage output 2
DAC3 12 12 15 analog voltage output 3
DAC4 13 13 16 analog voltage output 4
DAC5 14 14 17 analog voltage output 5
DAC6 15 15 18 analog voltage output 6
DAC7 16 16 20 analog voltage output 7
n.c. − 5 5, 6, 12, 19 not connected

handbook, halfpage handbook, halfpage

VCC 1 16 DAC7 VCC 1 16 DAC7

VMAX 2 15 DAC6 VMAX 2 15 DAC6

SDA 3 14 DAC5 SDA 3 14 DAC5

SCL 4 13 DAC4 SCL 4 13 DAC4

TDA8444 TDA8444T
A0 5 12 DAC3 n.c. 5 12 DAC3

A1 6 11 DAC2 A0 6 11 DAC2

A2 7 10 DAC1 A1 7 10 DAC1

VEE 8 9 DAC0 VEE 8 9 DAC0

MGH512 MGL531

Fig.2 Pin configuration (TDA8444; DIP16). Fig.3 Pin configuration (TDA8444T; SO16).

1999 Apr 29 4
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

handbook, halfpage
VCC 1 20 DAC7

VMAX 2 19 n.c.

SDA 3 18 DAC6

SCL 4 17 DAC5

n.c. 5 16 DAC4
TDA8444AT
n.c. 6 15 DAC3

A0 7 14 DAC2

A1 8 13 DAC1

A2 9 12 n.c.

VEE 10 11 DAC0

MGL532

Fig.4 Pin configuration (TDA8444AT; SO20).

FUNCTIONAL DESCRIPTION

I2C-bus interface
The I2C-bus interface is a receive-only slave, which accepts data according the format shown in Table 1.

Table 1 I2C-bus format (see note 1)

S 0 1 0 0 A2 A1 A0 0 A I3 I2 I1 I0 SD SC SB SA A X X D5 D4 D3 D2 D1 D0 A P

Note
1. S = START condition; A2 to A0 = programmable address bits; A = Acknowledge; I3 to I0 = Instruction bits;
SD to SA = subaddress bits; X = don’t care; D5 to D0 = data bits; P = STOP condition.

Valid addresses are:

TDA8444 and TDA8444AT: 40H, 42H, 44H, 46H, 48H, 4AH, 4CH and 4EH
TDA8444T: 48H, 4AH, 4CH and 4EH (A2 is always logic 1).
All other addresses cannot be acknowledged by the circuit. The actual slave address depends on the programmable
address bits A2, A1 and A0. This way up to eight circuits can be used on one I2C-bus.
Valid instructions are: 00H to 0FH; F0H to FFH.

1999 Apr 29 5
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

The circuit will not react to other combinations of the connected between these pins and VEE. This means that
4 instruction bits I3 to I0 than 0 or F, but will still generate normal bus line voltage should not exceed 5.5 V.
an acknowledge. The difference between
The address inputs A0, A1 and A2 can be easily
instruction 0 and F is only important when more than one
programmed by either a connection to VEE (An = 0) or VCC
data byte is sent within one transmission. Instruction 0
(An = 1). If the inputs are left floating the result will be
causes the data bytes to be written into the DAC-latches
An = 1.
with consecutive subaddresses starting with the
subaddress given in the instruction byte (auto-increment of
VMAX
subaddress), while instruction F will cause a consecutive
writing of the data bytes into the same DAC-latch whose The VMAX input gives a means of compressing the DAC
subaddress was given in the instruction byte. In case of output voltage swing. The maximum DAC output voltage
only one data byte the DAC-latch with the subaddress will be equal to VMAX + VDAC(min), while the 6-bit resolution
equal to the subaddress in the instruction byte will receive is maintained. This enables a higher voltage resolution for
the data. smaller output swings.
Valid subaddresses are: 0H to 7H.
DACs
The subaddresses correspond to DAC0 to DAC7.
The Auto-Increment (AI) function of instruction 0, The DACs consist of a 6-bit data-latch, current switches
however, works on all possible subaddresses 0 to F in and an opamp. The current sources connected to the
such a way that next to subaddress F, subaddress 0 will switches have values with weights 20 to 25. The sum of the
follow, and so on. switched on currents is converted by the opamp into a
voltage between approximately 0.5 and 10.5 V if
The data will be latched into the DAC-latch on the VMAX = VCC = 12 V. The DAC outputs are short-circuit
positive-going edge of the acknowledge related clock protected against VCC and VEE. Capacitive load on the
pulse. DAC outputs should not exceed 2 nF in order to prevent
The specification of the SCL and SDA I/O meets the possible oscillations at certain levels. The temperature
I2C-bus specification. For protection against positive coefficient for each of the outputs remains in all possible
voltage pulses on pins 3 and 4, zener diodes are conditions well below 0.1 LSB per Kelvin.

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER MIN. MAX. UNIT
VCC supply voltage −0.5 +18 V
ICC supply current −10 +40 mA
P(max) maximum power dissipation − 500 mW
Vi(n) input voltage −0.5 +5.9 V
pins SDA and SCL −0.5 +5.9 V
pins VMAX, A0 to A2 and DAC0 to DAC7 −0.5 VCC + 0.5 V
In current in all pins except VCC and VEE − ±10 mA
Tstg storage temperature −65 +150 °C
Tamb operating ambient temperature −20 +70 °C

QUALITY SPECIFICATION
In accordance with “SNW-FQ-611-E”.

1999 Apr 29 6
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air
TDA8444 75 K/W
TDA8444T note 1 100 K/W
TDA8444AT note 1 85 K/W

Note
1. When mounted on a Printed-Circuit Board (PCB).

CHARACTERISTICS
VCC = 12 V; Tamb = 25 °C; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply
VCC supply voltage 4.5 12 13.2 V
ICC supply current VMAX = VCC = 12 V; 12 14 19 mA
data = 00H
P power dissipation − 170 250 mW
Vrst power reset voltage 1 − 4 V
Pin VMAX
Vi(VMAX) input effective voltage 1 − VCC − 2.0 V
Ii input current VMAX = VCC − − 10 µA
VMAX = 1 V − − 10 µA
Pins SDA and SCL
VI input voltage 0 − 5.5 V
VIL LOW-level input voltage − − 1.0 V
VIH HIGH-level input voltage 3.0 − − V
IIL LOW-level input current VSDA = VSCL = −0.3 V − − −10 µA
IIH HIGH-level input current VSDA = VSCL = 6 V − − ±10 µA
PIN SDA
VOL LOW-level output voltage IL = 3 mA − − 0.4 V
Io(sink) output sink current 3 8 − mA
Address bits (A0 to A2)
VI input voltage 0 − VCC V
VIL LOW-level input voltage − − 1.0 V
VIH HIGH-level input voltage 2.2 − − V
IIL LOW-level input current VAn = VEE −10 −15 − µA
IIH HIGH-level input current VAn = VCC − − 1 µA

1999 Apr 29 7
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

DACs (DAC0 to DAC7)
Vo DAC output voltage VMAX = VCC 0.1 − VCC − 0.5 V
Vo(min) minimum output voltage data = 00H; 0.1 0.28 0.5 V
IL = −2 mA
Vo(max) maximum output voltage data = 3FH;
IL = −2 mA
VMAX = VCC 10.0 10.5 11.5 V
1 < VMAX < 10 V − note 1 − V
Io(sink) output sink current VDAC = VCC; 2 8 15 mA
data = 1FH
Io(source) output source current VDAC = VEE; −2 − −6 mA
data = 1FH
Zo output impedance −2 ≤ IL ≤ +2 mA; − 4 50 Ω
data = 1FH
DNL differential non-linearity VMAX = VCC; − − ±0.5 LSB
IL = −2 mA
INL integral non-linearity VMAX = VCC; − − ±0.5 LSB
IL = −2 mA
∆GFS DC gain match at full-scale data = 3FH; − − 5 %
IL = −2 mA
∆G/∆data DC gain versus other DAC data = 3FH; − <±0.5 − LSB
data change IL = −2 mA
TC temperature coefficient data = 3FH; − <±0.1 − LSB/K
IL = −2 mA
Note
V swing
1. The output voltage is typically: -------------------------------- × V MAX + V o ( 00H ) with Vswing = Vo(3FH) − Vo(00H) for VMAX = VCC.
( V CC – 2.0 )

1999 Apr 29 8
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

TEST AND APPLICATION INFORMATION

MGH514 MGL533
12 12
handbook, halfpage handbook, halfpage
VO(DAC) VMAX = 12 V VO(DAC)
VCC = 12 V
(V) (V)

8 VMAX = 10 V 8

VCC = 8 V

VMAX = 6 V

4 4
VCC = 5 V

VMAX = 1 V

0 0
00 05 0A 0F 14 19 1E 23 28 2D 32 37 3C 3F 00 05 0A 0F 14 19 1E 23 28 2D 32 37 3C 3F
data (hex) data (hex)

VCC = 12 V. VMAX = VCC.

Fig.5 DAC output voltage as a function of Fig.6 DAC output voltage as a function of
programmed value. programmed value.

1999 Apr 29 9
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

D ME
seating plane

A2 A

A1
L

c
Z e w M
b1
(e 1)
b
16 9 MH

pin 1 index
E

1 8

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT
A A1 A2
b b1 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.40 0.53 0.32 21.8 6.48 3.9 8.25 9.5
mm 4.7 0.51 3.7 2.54 7.62 0.254 2.2
1.14 0.38 0.23 21.4 6.20 3.4 7.80 8.3
0.055 0.021 0.013 0.86 0.26 0.15 0.32 0.37
inches 0.19 0.020 0.15 0.10 0.30 0.01 0.087
0.045 0.015 0.009 0.84 0.24 0.13 0.31 0.33

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

92-10-02
SOT38-1 050G09 MO-001AE
95-01-19

1999 Apr 29 10
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

D E A
X

y HE v M A

16 9

Q
A2 A
A1 (A 3)

pin 1 index
θ
Lp
L

1 8 detail X
e w M
bp

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z
(1)
θ

0.30 2.45 0.49 0.32 10.5 7.6 10.65 1.1 1.1 0.9
mm 2.65 0.25 1.27 1.4 0.25 0.25 0.1
0.10 2.25 0.36 0.23 10.1 7.4 10.00 0.4 1.0 0.4 8o
0.012 0.096 0.019 0.013 0.41 0.30 0.419 0.043 0.043 0.035 0o
inches 0.10 0.01 0.050 0.055 0.01 0.01 0.004
0.004 0.089 0.014 0.009 0.40 0.29 0.394 0.016 0.039 0.016

Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

95-01-24
SOT162-1 075E03 MS-013AA
97-05-22

1999 Apr 29 11
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

D E A
X

c
y HE v M A

20 11

Q
A2 A
A1 (A 3)

pin 1 index
θ
Lp
L

1 10 detail X
e w M
bp

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z
(1)
θ

0.30 2.45 0.49 0.32 13.0 7.6 10.65 1.1 1.1 0.9
mm 2.65 0.25 1.27 1.4 0.25 0.25 0.1
0.10 2.25 0.36 0.23 12.6 7.4 10.00 0.4 1.0 0.4 8o
0.012 0.096 0.019 0.013 0.51 0.30 0.419 0.043 0.043 0.035 0o
inches 0.10 0.01 0.050 0.055 0.01 0.01 0.004
0.004 0.089 0.014 0.009 0.49 0.29 0.394 0.016 0.039 0.016

Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

95-01-24
SOT163-1 075E04 MS-013AC
97-05-22

1999 Apr 29 12
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

SOLDERING Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary
Introduction between 50 and 300 seconds depending on heating
There is no soldering method that is ideal for all IC method. Typical reflow temperatures range from
packages. Wave soldering is often preferred when 215 to 250 °C.
through-hole and surface mounted components are mixed Preheating is necessary to dry the paste and evaporate
on one printed-circuit board. However, wave soldering is the binding agent. Preheating duration: 45 minutes at
not always suitable for surface mounted ICs, or for 45 °C.
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
Wave soldering techniques can be used for all SO
A more in-depth account of soldering ICs can be found in
packages if the following conditions are observed:
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011). • A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
DIP technique should be used.
• The longitudinal axis of the package footprint must be
SOLDERING BY DIPPING OR BY WAVE
parallel to the solder flow.
The maximum permissible temperature of the solder is • The package footprint must incorporate solder thieves at
260 °C; solder at this temperature must not be in contact the downstream end.
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed During placement and before soldering, the package must
5 seconds. be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
The device may be mounted up to the seating plane, but dispensing. The package can be soldered after the
the temperature of the plastic body must not exceed the adhesive is cured.
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling Maximum permissible solder temperature is 260 °C, and
may be necessary immediately after soldering to keep the maximum duration of package immersion in solder is
temperature within the permissible limit. 10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal
Apply a low voltage soldering iron (less than 24 V) to the of corrosive residues in most applications.
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the REPAIRING SOLDERED JOINTS
soldering iron bit is less than 300 °C it may remain in Fix the component by first soldering two diagonally-
contact for up to 10 seconds. If the bit temperature is opposite end leads. Use only a low voltage soldering iron
between 300 and 400 °C, contact may be up to 5 seconds. (less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
SO using a dedicated tool, all other leads can be soldered in
REFLOW SOLDERING one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1999 Apr 29 13
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1999 Apr 29 14
Philips Semiconductors Product specification

TDA8444; TDA8444T;
Octuple 6-bit DACs with I2C-bus
TDA8444AT

NOTES

1999 Apr 29 15
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Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, Tel. +90 212 279 2770, Fax. +90 212 282 6707
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Tel. +82 2 709 1412, Fax. +82 2 709 1415 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +1 800 234 7381, Fax. +1 800 943 0087
Tel. +60 3 750 5214, Fax. +60 3 757 4880 Uruguay: see South America
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Vietnam: see Singapore
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy Tel. +381 11 62 5344, Fax.+381 11 63 5777

For all other countries apply to: Philips Semiconductors, Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

© Philips Electronics N.V. 1999 SCA63

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Printed in The Netherlands 545002/750/03/pp16 Date of release: 1999 Apr 29 Document order number: 9397 750 04699