The Principles of Adhesion
The Principles of Adhesion
of bodies in contact or the attraction be in Sodium atom Chlorine Sodium Chloride
ide One electron atom ion ton
tween molecules at an interface. This
force is called adhesion when unlike m in t electrons
in outer tirhit
molecules arc attracted and cohesion
when molecules of the same kind are The force of attraction is given by:
attracted. The material added to pro 9+ • 9-
duce the adhesion is known as the ad I-- = ----------------------
The shared pairs of electrons. -X, are ( I) Van tier Waal's forces.
displaced towards the more electro-nega According to Elcy (1961), these forces
tive chlorine atoms which thus are given of molecular attraction are due to three
a negative charge and the carbon atom main factors: the Keesom, Debye and
a positive charge. London forces.
The ionic character of polar covalent
bonds varies as it is dependent on the (a) The Keesom forces—orientation
electro-negativity of the atoms between effect.
which the bonds are formed. The esti
mated ionic character of some single These result from the interaction of
bonds is ; permanent dipoles in neighbouring mole
Bond Approximate ionic cules of polar compounds. If in a bimolc-
character cular reaction the two dipoles arc free to
C-C 0 rotate they will take up a hcad-to-tail or
C- H 4 lowest energy configuration as here
C -C I 10 shown ;
C-F 44
Covalent bonds are commonly found in
organic compounds.
A dipole results whenever a covalent A typical molecule in a liquid will have
10 - 12 molecules in its immediate vicinity,
bond is formed by the unequal sharing all interacting with one another. Except
of the electron pairs that go to make up for molecules of very low polarity, the
the bonds. The shared electron pair is rotation of the dipoles will certainly not
displaced towards the most electro-nega be free and the problem of the relative
tive atom and the degree of electron dis orientation of dipoles in a liquid is a very
placement is reflected by the dipole mo difficult one (Good 1967).
ment.
The electric dipole moment (b) Debye forces— induction effect.
a = q/
where q = the magnitude of the charges These arise from the induction ched
separated. that hikes into account the influence of
/ = the distance separating the the dipole moment in a molecule which
charges. induces tin additional dipole moment in a
neighbouring molecule; that is to say.
Permanent dipoles are found in polar they result from the interaction of a per
organic compounds and are of consider manent dipole with a bond system capable
able importance in adhesion. of being polarized. A dipole in a mole
(3) Metallic Bond. cule may provide the electrical field to
The free valence electrons of metals polarize a neighbouring symmetrical
can move about the metal space lattice molecule. Once a dipole moment has been
to form an electron cloud. The movement induced, the two molecules attract each
of these electrons is responsible for some other.
of the properties of metals such as the
conduction of electricity; and the move
ment of the free valence electrons leads to
a regular array of positive ion cores being
found in the crystal. The electron clouds
and the positive ion cores provide the
forces of attraction which bond the metal
atoms together. The surface of metals
will have some free electron deficient
sites available for bonding.
The Physical Forces. The Keesom and Debye forces both
These tire intermolecular attractive depend on the existence of permanent
forces. dipole moments in molecules and there-
Srm:M:iiit 1470 287
Tim Journal o r Tin; D.A.S.A.
garded as the seal of a special force which )’st. F v ' /'sv' •• • • (I)
acts perpendicular to the surface; and if .v
the section of the surface involved is 1.0 Cos 0 ----- where 0 — con-
cm long it is called the surface tension v° tact angle
and is expressed in dynes/cm. .’. .V }’i v" COS 0
Substitute .v in (1)
)’sl r 5’i.v cos 0 - )’sv'
(5) Thermodynamic Considerations. or ysv" - ysu >'i.v° cos 0 .. (2)
In 1805 Thomas Young enunciated that /s v ° - )'sl
the three surface tensions, ysv', )’sl mid and cos 0 ------------ .. (3)
o
yi,v° existing at the phase boundaries of a }'l. v
drop of liquid at rest on a solid surface The cosine of the contact angle formed
must form a system in static equilibrium between a liquid drop and the plane sur
Fig. 9 (a). face of a solid on which the drop is rest
ing has, at equilibrium, a definite rela
tionship to the surface tensions of the
T lv ' liquid and the solid in contact with the
saturated vapour.
\ The free surface energy expressed in
vapour
ergs/cm2 is dimensionally the same as
"lTouicT the surface tension expressed in dynes/
T sl r"sv° cm. Sumner (1937), using a thermodyna
,~t __ -*rr mic approach, substituted the specific
free energies in the system for the surface
SOLID tensions and showed that the Young
A equation (2) could be written;
)’sv° - '/si. =- )’i.v° cos 0 .. (4)
Where ySv" r= the free surface energy of
the solid in equilibrium
with the vapour.
)’SL — the free surface energy at
the solid/liquid interface,
/i.v" the free surface energy of
the liquid in equilibrium
with the vapour.
Dupre (1869) showed that WA, the re
Fici. 9: (a) The surface tensions at the versible work of adhesion per unit area
phase boundaries of a liquid of a liquid with a solid (or another liquid),
at rest on a solid surface. is related to the decrease in free energy
(b) Resolution of forces at the when the two surfaces come together to
point where the phases meet. form an interface.
Wa ys" •! /i.v" -■ /si.. . (5)
Where ysv° - the surface tension of the Where ys" the free surface energy of
solid in equilibrium with the solid in a vacuum.
the vapour. It was realized, however, that the solid
yLV“ - the surface tension of the surface will be covered by adsorbed vapour
liquid in equilibrium with of the liquid and consequently a new
the vapour. quantity W a * was defined (Zisman, 1963).
W a * is the reversible work of adhesion to
ySL the surface tension at the
interlace between the pull the liquid oil' the surface leaving the
solid anc! the liquid. eq ui1ibr ium-a bsorbed ftIm.
Wa* ysv" : yi.v" ysi. (6)
If we resolve the forces acting along the Where ysv" the free surface energy of
line of the solid to liquid interface (Fig. the solid in equilibrium
9b) we obtain the following expression : with the vapour.
By eliminating y sL from equations (4) (6) The Critical Surface Tension of Wetting
and (6) -y e .
Wa * = )-l v ° (1 -f cos 0) . . (7) Zisman and his co-workers (Glantz
and 0 can readily be determined
yLV ° 1969), in their studies of the contact angles
experimentally and Wa* calculated. between various liquids and different solid
The specific reversible work of cohesion surfaces, revealed a rectilinear relationship
(We) of the liquid is calculated by applying between the cosine of the contact angle and
equation (7) to a liquid—liquid interface the surface tension, yL V °, for each homolo
made up of two layers of the same liquid. gous series of organic liquids. The inter
We = 2yLV° (0 = 0"; cos 0 = 1) .. (8) cept of the extrapolated straight line plot
In equations (5) and (6) ys° and ysv° of cos 0 vs. yLV” with the horizontal line
refer respectively to the free surface energy cos 0 = 1 occurs at ye (Fig. 10). ye is
of the solid in a vacuum and the free sur
face energy of the solid immersed in the
saturated vapour of the liquid. Thus
ys° — ysv° is the decrease in the surface
energy of the solid obtained on immersing
it in the saturated vapour of the liquid. The
free energy change is presented by /sv° and
/sv° = ys" — ysv°.. .. (9)
/sv° is referred to as the equilibrium
spreading coefficient.
From equations (5) and (6) it can be
calculated that: F ig .10: The critical surface tension of
W a - Wa * = ys° - ysv ° wetting.
= J sv°........................ (10) called the critical surface tension of wetting
It has been shown (Zisman 1963) that of a solid surface for each homologous
/sv° will always have a positive value and series of organic liquids. For a liquid to
hence W a > Wa*. wet a surface completely, the surface ten
Cooper and Nuttal (1915) laid down the sion of the liquid must be lower than ye,
conditions for the spreading of a liquid the critical surface tension of wetting of the
substance on a solid surface. adherend.
For spreading to occur S > 0 Even when cos 0 is plotted against the
For non-sprcadinc S< 0 surface tension for noil-homologous
Where S = ys° - (y L V ° + y sL ) ..(11) liquids, the points on the graph lie close to
For an organic liquid spreading on an a straight line or form a narrow rectilinear
organic solid surface it can be assumed that band; and although the intercept is less
y sL is negligibly small in comparison with precisely defined than is the ease with a
yL V °, therefore: homologous series of liquids, it is an even
For spreading to occur ys° > yLV° (12) more useful parameter because it is
Thus in systems where the specific sur characteristic of the solid only, y e has been
face free energy of the liquid is less than used to study the wettability of a variety of
that of the solid, spreading should occur. low-energy surfaces.
From equation (7) it is clear that for any The surface constitution of solids affects
system having 0 — 0°, i.c. cos 0 = 1 , the value of y e . Zisman (1961) has ob
WA*^2yLV° .........................(13) served a parallel and regular increase in y e
This value is much greater than the ten with progressive replacement of fluorine by
sile strength of common adhesives. When hydrogen atoms in the surfaces of bulk
the adhesive wets the adherend surface polymers.
properly (0 — 0°) the tensile strength of
the adhesive joint will be considerably O ther F actors A ffecting Bond
more than that of the adhesive. Therefore Strength
if the joint fails it will break within the bulk The manner in which some of the physi
of the adhesive rather than at the adhesive/ cal and chemical properties of the adhe
adherent interface. sive and the adherend affect the bond
strength has been described. In addition and counteract the molecular forces
the external influencing factors have to be of attraction between the adherend
considered. These are prevalent when the and adhesive at the interface.
bond is processed and subsequently when The effect of the thickness of the ad
it is subjected to use. hesive on the bond strength is presented
During processing of the bond the way graphically in Fig. 11. Up to an optimum
the adhesive is applied is important. It point, .v, the thinner the adhesive layer
should be at a temperature at which its the stronger is the joint strength. Beyond
viscosity provides for adequate spreading this, insufficient material is available to
on the adherend surface. The setting con cover the whole joint and the bond will
ditions, pressure and temperature, must fail as a result of joint starvation.
be correct for the selected material. In Several factors will affect the bond
the setting or curing of the adhesive there strength during use: the type of stress
is shrinkage, which causes residual strain to which the joint is exposed; the rate and
in the bond. speed at which the stresses are applied;
Another significant factor affecting the the temperature changes to which the
bond strength is the nature of the adhesive joint is exposed; and the chemical stresses
layer: thick ones give weaker joints than to which the bond may be subjected
thin ones. A number of reasons have been (Patrick. 1961).
postulated for this observation. The effect of certain of these factors
1. In a thin layer there is less chance can be lessened by the addition of fillers.
of flaws occurring which may cause These are inert inorganic particles which
stress concentrations when the joint are added to the adhesive to improve
is subjected to a load (Buonocorc, some of its physical properties. The im
1963). provement in adhesive performance may
2. A thick layer is more likely to be be obtained by reducing the shrinkage
come deformed and thus will frac during cure, approximating the coefficient
ture sooner. of thermal expansion of the adhesive to
3. There is less shrinkage in a thin that of the adherend. and improving the
layer during polymerization. Fur bulk strength of the adhesive.
ther, the swelling of the adhesive A biiesives
due to the absorption of fluid Abhesives are coatings applied to a
during use, or the effect of a signi solid to greatly decrease or prevent the
ficant difference in the thermal ex adhesion to another solid in intimate con
pansion of the adhesive and the tact with it. They are commonly employed
adherend are reduced. De Bruync in moulding or coating operations. Mate
and Houwink (1951) suggest that rials employed for this purpose include
these factors produce tangential vec high molecular weight fatty acids, poly-
tors of force which are proportional dimcthylsiloxanc and Teflon. A mono
to the thickness of the adhesive layer layer of the abhesive agent suffices to
cause the optimum parting effect. The
abhesive coating converts the high-energy
solid surface to a low-energy one. This
results in the critical surface tension of
wetting, )’C. being markedly reduced.
The equilibrium contact angle of any
liquid in contact with an abhesive coating
will be large; and the greater the differ
ence between the surface tension of the
liquid and the critical surface tension of
wetting of the abhesive coating the larger
it will be. When it becomes large enough
the resultant adhesion is so poor that a
F ig. 11 : The effect of adhesive thickness modest external stress suffices for effec
on the joint strength. tive mould release.
P eterson, E. A., P hillips , R. W. and S wartz, Owen Litho Service, Indiana, pp. 164-
M. L. 1966. A comparison of the physi 170.
cal properties of four restorative resins. R oydiiouse, R. H. 1968. Prevention of occlusal
J.A.D.A., 73:1324-1336. fissure caries by use of a sealant. A pilot
P hillips , R. W. 1961. In: Workshop proceed study. J. dent. Cliil., XXXV: 253-262.
ings, adhesive restorative dental mate S kinner, E. W. and P hillips , R. W. 1967. The
rials. Owen Litho Service, Indiana, p. Science of Dental Materials. W. 13.
170. Saunders Co., Philadelphia and London.
P hillips , R. W. 1967. Advances in adhesive S umner, C. G. 1937. Symposium on Deter
restorative dental materials. J. dent. Res., gency. Chem. Publ. Co., New York. p.
47:1662-1667. 15. Cited by Zisman, 1961, 1963.
Y oung, T. 1805. Phil. Trans. Roy. Soc. (Lon
R etief , D. H. and D rp.yer, C. J. 1967. Epoxy don) 95:65. Cited by Zisman, 1963.
resins for bonding orthodontic atta c h Z isman, W. A. 1961. Constitutional effects on
ments to teeth. J. dent. Ass. S. Afr., 22: adhesion and abhesion. In: Workshop
338-346. proceedings, adhesive restorative dental
R ose, E. E., Lal, J., W illiams, N. B. and materials. Owen Litho Service, Indiana,
F alcetti, J. P. 1961. The screening of pp. 106-136.
materials for adhesion to human tooth Z isman, W. A. 1963. Influence of constitution
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