PART CODE: SOT232N70S702K

SPECIFICATION SHEET

SPECIFICATION SHEET NO. P0908- SOT232N70S702K

DATE Sept. 08, 2022

REVISION A2

DESCRIPITION SMD Plastic-Encapsulate MOSFETS, SOT-23 series, 3 pads

2N7002K Type, 60V N-Channel Enhancement Mode MOSFET
Reverse Working Voltage : 12V, Peak Pulse Power per (8/20μs): 350 Watts
Operating Temp. Range -55°C ~+150°C,
Package in Tape/Reel, 3000pcs/Reel
RoHS/RoHS III compliant

CUSTOMER

CUSTOMER PART NUMBER

CROSS REF. PART NUMBER

ORIGINAL PART NUMBER MDD 2N7002K

PART CODE SOT232N70S702K

VENDOR APPROVE
Issued/Checked/Approved

DATE: Sept. 08, 2022

CUSTOMER APPROVE

DATE:

9/8/2022 1
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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES
MAIN FEATURE
• High density cell design for low RDS(ON)
• Voltage controlled small signal switch
• Rugged and reliable
• High saturation current capability
• HMB ESD protected (2000V)

APPLICATION
• Load Switch for Portable Devices
• DC/DC Converter

RFQ
Request For Quotation
PART CODE GUIDE

SOT23 2N70 S 702K

1 2 3 4

1) SOT23: SMD Plastic-Encapsulate MOSFETS, SOT-23 series, 3 pads

2) 2N70: Type code for Original part number 2N7002K

3) S: Package code, Package in Tape/Reel, 3000pcs/Reel

4) 702K: Marking code for “702K” on the case surface, Different Marking for different specification.

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES
DIMENSION (Unit: Inch/mm)

Image for reference Marking: 702K

Symbol Value ( mm)

Min. Typ. Max.

A 1.0 1.4

A1 0.10

b 0.35 0.50
SOT-23
c 0.10 0.20

D 2.70 2.90 3.10

E 1.40 1.60

E1 2.40 2.80

e 1.9

L 0.10 0.30

L1 0.40
Ɵ 0° 10°

Recommend Pad Layout Equivalent Circuit Diagram

(Tol.: +/-0.05mm)

1. Gate
2. Source
3. Drain
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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES

60V N-CHANNEL ENHANCEMENT MODE MOSFET

V (BR)DSS R DS(on) Typical I D MAX

0.9Ω@10V 500mA
60V
1.1Ω@4.5V 500mA

MECHANICAL DATA
V(BR)DSS Terminals Polarity Mounting Weight
Position per piece

JEDEC SOT-23 molded Matte tin plated Polarity symbol Any 0.00019 Ounce,
plastic body marking on case 0.00591 grams

MAX. RATINGS AT Ta=25 °C (unless otherwise specified)

Parameter SYMBOL VALUE UNITS

S
LIMIT

Drain-Source Voltage V DS 60 V

Gate-Source Voltage V GS +/-20 V

Continuous Drain Current ID 0.5 A

Power Dissipation P D 0.3 W

Thermal Resistance from Junction to Ambient R QJA 400 °C/W

Junction Temperature TJ + 150 °C

Storage Temperature Range T STG -50 ~ +150 °C

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES

MOSFET ELECTRICAL CHARACTERISTICS AT Ta=25 °C (unless otherwise specified)

Parameter SYMBOLS VALUE UNIT Condition

Min. Typ. Max.

Drain-Source Breakdown Voltage V (BR) DSS 60 V V GS=0V I D=250μA

Zero Gate Voltage Drain I DSS 1 µA VDS=60V, VGS=0V

Current(TA=25℃)

Zero Gate Voltage Drain I DSS 100 µA VDS=50V, VGS=0V

Current(TA=125℃)

Gate-Body Leakage Current I GSS +/-10 µA VGS=±20V, VDS=0V

Gate Threshold Voltage V GS(TH) 1.0 1.6 2.5 V VDS=VGS, ID=250μA

Drain-Source On-State R DS(ON) 0.9 2 Ω VGS=10V, ID=0.5A

Resistance②
1.4 3 Ω VGS=4.5V, ID=0.3A

DYNAMIC ELECTRICAL CHARACTERISTICS

Parameter SYMBOLS VALUE UNIT Condition

Min. Typ. Max.

Input Capacitance C iss 23.8 pF V DS=30V

V GS=0V
f =1MHz
Output Capacitance C oss 3.9

Reverse Transfer Capacitance C rss 1.5

Total Gate Charge Qg 0.93 nC VDS=30V

ID=0.5A
V DS =10V
Gate Source Charge Q gs 0.18

Gate Drain Charge Q gd 0.31

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES

SWITCHING CHARACTERISTIS
Parameter SYMBOLS VALUE UNIT Condition

Min. Typ. Max.

Turn on Delay Time t d(on) 6 ns V DD=30V

I D=0.3A
R G = 3.3Ω
Turn on Rise Time tr 3.5 V GS = 10 V

Turn Off Delay Time t d (off) 20

Turn Off Fall Time tf 5.9

SOURCE DRAIN DIODE CHERACTERISTIC

Parameter SYMBOLS VALUE UNIT Condition

Min. Typ. Max.

Source drain current(Body Diode） I SD 0.2 A V GS=0V I D=250μA

Forward on voltage② V SD 0.78 1.2 V VDS=60V, VGS=0V

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES
RELIABILITY

Number Experiment Items Experiment Method And Conditions Reference

Documents

1 Solder Resistance Test Test 260°C± 5°C for 10 ± 2 sec. MIL-STD-750D

Immerse body into solder 1/16” ± 1/32" METHOD-2031.2

2 Solderability Test 230°C ±5°C for 5 sec. MIL-STD-750D

METHOD-2026.1 0

3 Pull Test 1 kg in axial lead direction for 10 sec. MIL-STD-750D

METHOD-2036.4

4 Bend Test 0.5Kg Weight Applied To Each Lead, MIL-STD-750D

Bending Arcs 90 °C ± 5 °C For 3 Times METHOD-2036.4

5 High Temperature Reverse TA=100°C for 1000 Hours at VR=80% MIL-STD-750D

Bias Test Rated VR METHOD-1038.4

6 Forward Operation Life Test TA=25°C Rated Average Rectified MIL-STD-750D

Current METHOD-1027.3

7 Intermittent Operation Life On state: 5 min with rated IRMS Power MIL-STD-750D
Test Off state: 5 min with Cool Forced Air. METHOD-1036.3
On and off for 1000 cycles.

8 Pressure Cooker Test 15 PSIG, TA=121°C, 4 hours MIL-S-19500

APPENOIXC

9 Temperature Cycling Test -55°C~+125°C; 30 Minutes For Dwelled MIL-STD-750D

Time 5 minutes for transferred time. METHOD-1051.7
Total: 10 cycles.

10 Thermal Shock Test 0°C for 5 minutes., 100°C for 5minutes, MIL-STD-750D
Total: 10 cycles METHOD-1056.7

11 Forward Surge Test 8.3ms Single Sale Sine-wave One Surge. MIL-STD-750D
METHOD-4066.4

12 Humidity Test TA=65°C, RH=98% for 1000 hours. MIL-STD-750D

METHOD-1021.3

13 High Temperature Storage 150°C for 1000 Hours MIL-STD-750D

life Test METHOD-1031.5

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES
SUGGESTED REFLOW PROFILE (For Reference Only)

• Recommended peak temperature is over 245℃, If peak temperature is below 245 ℃, you may adjust the

following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of

solder paste (thicker)

• Welding shall not exceed 2 times

• Remark: lead free solder paste (96.5 sn/3.0 Ag/0.5Cu)

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES
RATINGS AND CHARACTERISTIC CURVES (For Reference Only)

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES
RATINGS AND CHARACTERISTIC CURVES (For Reference Only)

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES
RATINGS AND CHARACTERISTIC CURVES (For Reference Only)

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES
TAPE/REEL (Unit: mm)
All Devices are packed in accordance with EIA standard RS-481-A and specifications.

Item Symbol Tolerance SOT-23

Carrier width A 0.1 3.15

Carrier Length B 0.1 2.77

Carrier Depth C 0.1 1.22

Sprocket hole d 0.05 1.55

7”Reel outside diameter D 2.0 178.00

7”Reel inner diameter D1 Min. 54.4

Feed hole diameter D2 0.5 13.00

Sprocket hole position E 0.1 1.75

Punch hole position F 0.1 3.50

Punch hole pitch P 0.1 4.00

Sprocket hole pitch P0 0.1 4.00

Embossment center P1 0.1 2.00

Overall tape thickness T 0.1 0.25

Tape width W 0.3 8.00

Reel width W1 1.0 19.50

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 PART CODE: SOT232N70S702K
SMD PLASTIC-ENCAPSULATE MOSFETS SOT-23 SERIES
PACKAGE
Case Reel MPQ Component Qty. Inner Box Reel Carton size Qty. G. W
Code Size Spacing Per Box L*W*H Size L*W*H Per
(pcs) (mm) (pcs) (mm) (mm) (mm) Carton (kg)
(pcs)

SOT-23 7” 3,000 45,000 212*207*207 178 430*430*230 180,000 6.5

DISCLAIMER
NextGen Component, Inc. reserves the right to make changes to the product(s) and or information contained herein
without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany
the sale of any such product(s) or information 13
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