CD54HC243, CD74HC243,

Data sheet acquired from Harris Semiconductor

CD54HCT243, CD74HCT243
SCHS168D High-Speed CMOS Logic
November 1997 - Revised October 2003 Quad-Bus Transceiver with Three-State Outputs

Features Description
• Typical Propagation Delay (A to B, B to A) of 7ns at The ’HC243 and ’HCT243 silicon-gate CMOS three-state
VCC = 5V, CL = 15pF, TA = 25oC bidirectional noninverting buffers are intended for two-way
[ /Title • Three-State Outputs asynchronous communication between data buses. They
have high-drive-current outputs that enable high-speed oper-
(CD74 • Buffered Inputs
ation when driving large bus capacitances. These circuits
HCT24 • Fanout (Over Temperature Range) possess the low power dissipation of CMOS circuits and
2, - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads have speeds comparable to low-power Schottky TTL circuits.
CD74 - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads They can drive 15 LSTTL loads.
HC243 • Wide Operating Temperature Range . . . -55oC to 125oC The states of the output-enable (OEB, OEA) inputs
, • Balanced Propagation Delay and Transition Times determine both the direction of flow (A to B, B to A), and the
• Significant Power Reduction Compared to LSTTL three-state mode.
CD74
Logic ICs
HCT24 Ordering Information
• HC Types
3) - 2V to 6V Operation
/Sub- TEMP. RANGE
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC PART NUMBER (oC) PACKAGE
ject at VCC = 5V
(High • HCT Types CD54HC243F3A -55 to 125 14 Ld CERDIP

Speed - 4.5V to 5.5V Operation CD54HCT243F3A -55 to 125 14 Ld CERDIP

- Direct LSTTL Input Logic Compatibility,
CMOS VIL= 0.8V (Max), VIH = 2V (Min) CD74HC243E -55 to 125 14 Ld PDIP
Logic - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
CD74HC243M -55 to 125 14 Ld SOIC
Quad-
CD74HC243MT -55 to 125 14 Ld SOIC
Pinout CD74HC243M96 -55 to 125 14 Ld SOIC
CD54HC243, CD54HCT243
CD74HCT243E -55 to 125 14 Ld PDIP
(CERDIP)
CD74HC243, CD74HCT243 CD74HCT243M -55 to 125 14 Ld SOIC
(PDIP, SOIC)
TOP VIEW NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel of
OEB 1 14 VCC 250.
NC 2 13 OEA

A0 3 12 NC

A1 4 11 B0

A2 5 10 B1

A3 6 9 B2

GND 7 8 B3

CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
1
 CD54HC243, CD74HC243, CD54HCT243, CD74HCT243

Functional Diagram

‘HC243, ‘HCT243

3 11
A0 B0

4 10
A1 B1

5 9
A2 B2

6 8
A3 B3

1
OEB DIRECTION
13 SELECT LOGIC
OEA

TRUTH TABLE

HC, HCT243 SERIES

CONTROL INPUTS DATA PORT STATUS

OEB OEA An Bn

H H O I

L H Z Z

H L Z Z

L L I O

H= High Voltage Level

L= Low Voltage Level
I= Input
O= Output (Same Level as Input)
Z= High Impedance
To prevent excess currents in the High Z modes all I/O terminals should be terminated with 10kΩ
to 1MΩ resistors.

2
 CD54HC243, CD74HC243, CD54HCT243, CD74HCT243

Absolute Maximum Ratings Thermal Information

DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Thermal Resistance (Typical, Note 1) θJA (oC/W)
DC Input Diode Current, IIK E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
DC Output Diode Current, IOK Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
DC Drain Current, per Output, IO Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA (SOIC - Lead Tips Only)
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±70mA

Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.

DC Electrical Specifications
TEST
CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC

PARAMETER SYMBOL VI (V) IO (mA) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS

HC TYPES

High Level Input VIH - - 2 1.5 - - 1.5 - 1.5 - V

Voltage
4.5 3.15 - - 3.15 - 3.15 - V

6 4.2 - - 4.2 - 4.2 - V

Low Level Input VIL - - 2 - - 0.5 - 0.5 - 0.5 V

Voltage
4.5 - - 1.35 - 1.35 - 1.35 V

6 - - 1.8 - 1.8 - 1.8 V

High Level Output VOH VIH or -0.02 2 1.9 - - 1.9 - 1.9 - V

Voltage VIL
CMOS Loads -0.02 4.5 4.4 - - 4.4 - 4.4 - V

-0.02 6 5.9 - - 5.9 - 5.9 - V

High Level Output -6 4.5 3.98 - - 3.84 - 3.7 - V

Voltage
TTL Loads -7.8 6 5.48 - - 5.34 - 5.2 - V

Low Level Output VOL VIH or 0.02 2 - - 0.1 - 0.1 - 0.1 V

Voltage VIL
CMOS Loads 0.02 4.5 - - 0.1 - 0.1 - 0.1 V

0.02 6 - - 0.1 - 0.1 - 0.1 V

Low Level Output 6 4.5 - - 0.26 - 0.33 - 0.4 V

Voltage
TTL Loads 7.8 6 - - 0.26 - 0.33 - 0.4 V

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 CD54HC243, CD74HC243, CD54HCT243, CD74HCT243

DC Electrical Specifications (Continued)

TEST
CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC

PARAMETER SYMBOL VI (V) IO (mA) VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS

Input Leakage II VCC or - 6 - - ±0.1 - ±1 - ±1 µA

Current GND

Quiescent Device ICC VCC or 0 6 - - 8 - 80 - 160 µA

Current GND

Three-State Leakage IOZ VIL or - 6 - - ±0.5 - ±0.5 - ±10 µA

Current VIH

HCT TYPES

High Level Input VIH - - 4.5 to 2 - - 2 - 2 - V

Voltage 5.5

Low Level Input VIL - - 4.5 to - - 0.8 - 0.8 - 0.8 V

Voltage 5.5

High Level Output VOH VIH or -0.02 4.5 4.4 - - 4.4 - 4.4 - V
Voltage VIL
CMOS Loads

High Level Output -6 4.5 3.98 - - 3.84 - 3.7 - V

Voltage
TTL Loads

Low Level Output VOL VIH or 0.02 4.5 - - 0.1 - 0.1 - 0.1 V
Voltage VIL
CMOS Loads

Low Level Output 6 4.5 - - 0.26 - 0.33 - 0.4 V

Voltage
TTL Loads

Input Leakage II VCC to - 5.5 - - ±0.1 - ±1 - ±1 µA

Current GND

Quiescent Device ICC VCC or 0 5.5 - - 8 - 80 - 160 µA

Current GND

Additional Quiescent ∆ICC VCC - 4.5 to - 100 360 - 450 - 490 µA

Device Current Per (Note 2) -2.1 5.5
Input Pin: 1 Unit Load

Three-State Leakage IOZ VIL or - 5.5 - - ±0.5 - ±5.0 - ±10 µA

Current VIH

NOTE:
2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.

HCT Input Loading Table

INPUT UNIT LOADS

An, Bn 1.1

OEA, OEB 0.6

NOTE: Unit Load is ∆ICC limit specified in DC Electrical

Specifications table, e.g., 360µA max at 25oC.

4
 CD54HC243, CD74HC243, CD54HCT243, CD74HCT243

Switching Specifications Input tr, tf = 6ns

TEST 25oC -40oC TO 85oC -55oC TO 125oC

PARAMETER SYMBOL CONDITIONS VCC (V) TYP MAX MAX MAX UNITS
HC TYPES
Propagation Delay Data tPLH, tPHL CL = 50pF 2 - 90 115 135 ns
to Outputs 4.5 - 18 23 27 ns
CL = 15pF 5 7 - - - ns
CL = 50pF 6 - 15 20 23 ns
Output High-Z, to High Level tPZL, tPZH CL = 50pF 2 - 150 190 225 ns
to Low Level CL = 50pF 4.5 - 30 38 45 ns
CL = 15pF 5 12 - - - ns
CL = 50pF 6 - 26 33 38 ns
Output High Level, tPHZ, tPLZ CL = 50pF 2 - 150 190 225 ns
Output Low Level to High-Z CL = 50pF 4.5 - 30 38 45 ns
CL = 15pF 5 12 - - - ns
CL = 50pF 6 - 26 33 38 ns
Output Transition Times tTLH, tTHL CL = 50pF 2 - 60 75 90 ns
4.5 - 12 15 18 ns
6 - 10 13 15 ns
Input Capacitance CI - - - 10 10 10 pF
Three-State Output CO - - - 20 20 20 pF
Capacitance
Power Dissipation CPD - 5 80 - - - pF
Capacitance
(Notes 3, 4)
HCT TYPES
Propagation Delay Data to tPLH, tPHL CL = 50pF 4.5 - 22 28 33 ns
Outputs CL = 15pF 5 9 - - - ns
Output High-Z to High Level tPZH, tPZL CL = 50pF 4.5 - 34 43 51 ns
to Low Level CL = 15pF 5 14 - - - ns
Output High Level, tPHZ, tPLZ CL = 50pF 4.5 - 35 44 53 ns
Output Low Level to High-Z CL = 15pF 5 14 - - - ns
Output Transition Times tTLH, tTHL CL = 50pF 4.5 - 12 15 18 ns
Input Capacitance CI - - - 10 10 10 pF
Three-State Output CO - - - 20 20 20 pF
Capacitance
Power Dissipation CPD - 5 91 - - - pF
Capacitance
(Notes 3, 4)
NOTES:
3. CPD is used to determine the dynamic power consumption, per channel.
4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.

5
 CD54HC243, CD74HC243, CD54HCT243, CD74HCT243

Test Circuits and Waveforms

tr = 6ns tf = 6ns tr = 6ns tf = 6ns

VCC 3V
90% 2.7V
INPUT 50% INPUT 1.3V
10% GND 0.3V GND

tTHL tTLH tTHL tTLH

90% 90%
50% 1.3V
INVERTING 10% INVERTING
10%
OUTPUT OUTPUT
tPHL tPLH tPHL tPLH

FIGURE 1. HC AND HCT TRANSITION TIMES AND PROPAGA- FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
TION DELAY TIMES, COMBINATION LOGIC DELAY TIMES, COMBINATION LOGIC

6ns 6ns tr 6ns tf 6ns

OUTPUT VCC OUTPUT 3V
90% 2.7
DISABLE 50% DISABLE 1.3
10% 0.3
GND GND
tPLZ tPZL tPLZ tPZL

OUTPUT LOW OUTPUT LOW

TO OFF 50% TO OFF
10% 10% 1.3V

tPHZ tPZH tPHZ

tPZH
90% 90%
OUTPUT HIGH 50% OUTPUT HIGH
TO OFF TO OFF 1.3V

OUTPUTS OUTPUTS OUTPUTS OUTPUTS OUTPUTS OUTPUTS

ENABLED DISABLED ENABLED ENABLED DISABLED ENABLED

FIGURE 3. HC THREE-STATE PROPAGATION DELAY FIGURE 4. HCT THREE-STATE PROPAGATION DELAY

WAVEFORM WAVEFORM

OTHER OUTPUT
INPUTS IC WITH RL = 1kΩ
TIED HIGH THREE- VCC FOR tPLZ AND tPZL
OR LOW STATE CL GND FOR tPHZ AND tPZH
OUTPUT 50pF
OUTPUT
DISABLE

NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL = 1kΩ to
VCC, CL = 50pF.
FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT

6
 PACKAGE OPTION ADDENDUM

www.ti.com 17-Dec-2015

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

8409001CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409001CA
CD54HC243F3A
CD54HC243F ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD54HC243F

CD54HC243F3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409001CA
CD54HC243F3A
CD74HC243E ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC243E
(RoHS)
CD74HC243EE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -55 to 125 CD74HC243E
(RoHS)
CD74HC243M ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC243M
& no Sb/Br)
CD74HC243M96 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC243M
& no Sb/Br)
CD74HC243M96G4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC243M
& no Sb/Br)
CD74HC243MG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC243M
& no Sb/Br)
CD74HC243MT ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HC243M
& no Sb/Br)
CD74HCT243E ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT243E
(RoHS)
CD74HCT243EE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -55 to 125 CD74HCT243E
(RoHS)
CD74HCT243M ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT243M
& no Sb/Br)
CD74HCT243MG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125 HCT243M
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 17-Dec-2015

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD54HC243, CD54HCT243, CD74HC243, CD74HCT243 :

• Catalog: CD74HC243, CD74HCT243

• Military: CD54HC243, CD54HCT243

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

www.ti.com 17-Dec-2015

• Military - QML certified for Military and Defense Applications

Addendum-Page 3
 PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD74HC243M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD74HC243MT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD74HC243M96 SOIC D 14 2500 367.0 367.0 38.0
CD74HC243MT SOIC D 14 250 367.0 367.0 38.0

Pack Materials-Page 2
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