C0G (NP0) Dielectric

General Specifications
C0G (NP0) is the most popular formulation of the “tempera-
ture-compensating,” EIA Class I ceramic materials. Modern
C0G (NP0) formulations contain neodymium, samarium and
other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitor
dielectrics available. Capacitance change with temperature
is 0 ±30ppm/°C which is less than ±0.3% ∆ C from -55°C
to +125°C. Capacitance drift or hysteresis for C0G (NP0)
ceramics is negligible at less than ±0.05% versus up to
±2% for films. Typical capacitance change with life is less
than ±0.1% for C0G (NP0), one-fifth that shown by most
other dielectrics. C0G (NP0) formulations show no aging
characteristics.
The C0G (NP0) formulation usually has a “Q” in excess
of 1000 and shows little capacitance or “Q” changes with
frequency. Their dielectric absorption is typically less than
0.6% which is similar to mica and most films.

PART NUMBER (see page 3 for complete part number explanation)

0805 5 A 101 J A T 2 A

Size Voltage Dielectric Capacitance Capacitance Failure Terminations Packaging Special

(L" x W") 25V = 3 C0G (NP0) = A Code Tolerance Rate T = Plated Ni 2 = 7" Reel Code
50V = 5 Preferred A = Not and Solder 4 = 13" Reel A = Std.
100V = 1 K = ±10% Applicable Product
200V = 2 J = ± 5%

PERFORMANCE CHARACTERISTICS

Capacitance Range 0.5 pF to .1 µF (1.0 ±0.2 Vrms, 1kHz, for ≤100 pF use 1 MHz)
Capacitance Tolerances Preferred ±5%, ±10%
others available: ±.25 pF, ±.5 pF, ±1% (≥25pF), ±2%(≥13pF), ±20%
For values ≤ 10 pF preferred tolerance is ±.5 pF, also available ±.25 pF.
Operating Temperature Range -55°C to +125°C
Temperature Characteristic 0 ± 30 ppm/°C (EIA C0G)
Voltage Ratings 25, 50, 100 & 200 VDC (+125°C)
Dissipation Factor and “Q” For values >30 pF: 0.1% max. (+25°C and +125°C)
For values ≤30 pF: “Q” = 400 + 20 x C (C in pF)
Insulation Resistance (+25°C, RVDC) 100,000 megohms min. or 1000 MΩ - µF min., whichever is less
Insulation Resistance (+125°C, RVDC) 10,000 megohms min. or 100 MΩ - µF min., whichever is less
Dielectric Strength 250% of rated voltage for 5 seconds at 50 mamp max. current
Test Voltage 1 ± 0.2 Vrms
Test Frequency For values ≤100 pF: 1 MHz
For values >100 pF: 1 KHz

4
C0G (NP0) Dielectric
Typical Characteristic Curves**
Temperature Coefficient Variation of Impedance with Cap Value
Impedance vs. Frequency
0805 - C0G (NP0)
10 pF vs. 100 pF vs. 1000 pF
Typical Capacitance Change 100,000
Envelope: 0 ± 30 ppm/°C
% ⌬ Capacitance

10,000
+0.5

Impedance, ⍀
1,000
0

-0.5 100

10 pF
10.0

-55 -35 -15 +5 +25 +45 +65 +85 +105 +125 1.0
Temperature °C 100 pF
1000 pF
0.1
1 10 100 1000
⌬ Capacitance vs. Frequency Frequency, MHz

+2 Variation of Impedance with Chip Size

Impedance vs. Frequency
% ⌬ Capacitance

+1 1000 pF - C0G (NP0)

0 10
1206
-1 0805

Impedance, ⍀
1812
-2 1210
1.0

1KHz 10 KHz 100 KHz 1 MHz 10 MHz

Frequency
0.1
10 100 1000

Insulation Resistance vs Temperature Frequency, MHz

Insulation Resistance (Ohm-Farads)

10,000
Variation of Impedance with Ceramic Formulation
Impedance vs. Frequency
1000 pF - C0G (NP0) vs X7R
0805
1,000
10.00
X7R
NPO
Impedance, ⍀

100 1.00

0.10
0
+20 +25 +40 +60 +80 +100
Temperature °C 0.01
10 100 1000
Frequency, MHz

SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE

Style 25V 50V 100V 200V
0402* 0.5pF - 220pF 0.5pF - 120pF — —
0504 0.5pF - 330pF 0.5pF - 150pF 0.5pF - 68pF —
0603* 0.5pF - 1nF 0.5pF - 1nF 0.5pF - 330pF —
0805* 0.5pF - 4.7nF 0.5pF - 2.2nF 0.5pF - 1nF 0.5pF - 470pF
1206* 0.5pF - 10nF 0.5pF - 4.7nF 0.5pF - 2.2nF 0.5pF - 1nF
1210* 560pF - 10nF 560pF - 10nF 560pF - 3.9nF 560pF - 1.5nF
1505 — 10pF - 1.5nF 10pF - 820pF 10pF - 560pF
1808 → 1nF - 4.7nF 1nF - 3.9nF 1nF - 2.2nF
1812* 1nF - 15nF 1nF - 10nF 1nF - 4.7nF 1nF - 3.3nF
1825* → 1nF - 22nF 1nF - 12nF 1nF - 6.8nF
2220 → 4.7nF - 47nF 4.7nF - 39nF 3.3nF - 27nF
2225 → 1nF - 100nF 1nF - 39nF 1nF - 39nF
* Standard Sizes
** For additional information on performance changes with operating conditions consult AVX’s software SpiCap.

5
C0G (NP0) Dielectric
Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE 0402* 0504* 0603* 0805 1206 1505

Standard Reel
Packaging All Paper All Embossed All Paper Paper/Embossed Paper/Embossed All Embossed
MM 1.00 ± .10 1.27 ± .25 1.60 ± .15 2.01 ± .20 3.20 ± .20 3.81 ± .25
(L) Length
(in.) (.040 ± .004) (.050 ± .010) (.063 ± .006) (.079 ± .008) (.126 ± .008) (.150 ± .010)
MM .50 ± .10 1.02 ± .25 .81 ± .15 1.25 ± .20 1.60 ± .20 1.27 ± .25
(W) Width
(in.) (.020 ± .004) (.040 ± .010) (.032 ± .006) (.049 ± .008) (.063 ± .008) (.050 ± .010)
(T) Max. Thickness MM .60 1.02 .90 1.30 1.50 1.27
(in.) (.024) (.040) (.035) (.051) (.059) (.050)
MM .25 ± .15 .38 ± .13 .35 ± .15 .50 ± .25 .50 ± .25 .50 ± .25
(t) Terminal
(in.) (.010 ± .006) (.015 ± .005) (.014 ± .006) (.020 ± .010) (.020 ± .010) (.020 ± .010)
WVDC 25 50 25 50 100 25 50 100 25 50 100 200 25 50 100 200 50 100 200

Cap 0.5

䉲
䉲
(pF) 1.0 W
L

䉲
1.2 䉲

䉲
1.5
䉲
T
1.8
2.2
2.7

䉲
䉲
3.3 t
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
10000

*Reflow soldering only. = Paper Tape

= Embossed Tape
NOTES: For higher voltage chips, see pages 20 and 21.

6
C0G (NP0) Dielectric
Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE 1210 1808* 1812* 1825* 2220* 2225*

Standard Reel Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed All Embossed
MM 3.20 ± .20 4.57 ± .25 4.50 ± .30 4.50 ± .30 5.7 ± .40 5.72 ± .25
(L) Length
(in.) (.126 ± .008) (.180 ± .010) (.177 ± .012) (.177 ± .012) (.225 ± .016) (.225 ± .010)
MM 2.50 ± .20 2.03 ± .25 3.20 ± .20 6.40 ± .40 5.0 ± .40 6.35 ± .25
(W) Width
(in.) (.098 ± .008) (.080 ± .010) (.126 ± .008) (.252 ± .016) (.197 ± .016) (.250 ± .010)
MM 1.70 1.52 1.70 1.70 2.30 1.70
(T) Max. Thickness
(in.) (.067) (.060) (.067) (.067) (.090) (.067)
MM .50 ± .25 .64 ± .39 .61 ± .36 .61 ± .36 .64 ± .39 .64 ± .39
(t) Terminal
(in.) (.020 ± .010) (.025 ± .015) (.024 ± .014) (.024 ± .014) (.025 ± .015) (.025 ± .015)
WVDC 25 50 100 200 50 100 200 25 50 100 200 50 100 200 50 100 200 50 100 200

Cap 560

䉲
䉲
(pF) 680 W
L

䉲
820 䉲

䉲
1000
䉲
T
1200
1500
1800

䉲
䉲
2200 t
2700
3300
3900
4700
5600
6800
8200
Cap. .010
(µF) .012
.015
.018
.022
.027
.033
.039
.047
.068
.082
.1

*Reflow soldering only. = Paper Tape

= Embossed Tape
NOTES: For higher voltage chips, see pages 20 and 21.

7
How to Order
Part Number Explanation
EXAMPLE: 08055A101JAT2A

0805 5 A 101 J A T 2 A

Size Dielectric Capacitance Terminations Special**

(L" x W") C0G (NP0) = A Tolerance Code
0402 X7R = C C = ±.25 pF* Standard: A = Standard
0504 X5R = D D = ±.50 pF* T = Ni and Tin Product
0603 Z5U = E F = ±1% (≥ 25 pF) Plated Non-Standard
0805 Y5V = G G = ±2% (≥ 13 pF) P = Embossed
1005 J = ±5% Others: unmarked
0907 K = ±10% 7 = Plated Ni M = Embossed
1206 M = ±20% Gold Plated marked
1210 Z = +80%, -20% 1 = Pd/Ag E = Standard
1505 P = +100%, -0% packaging
1805 marked
1808 Low Profile
1812 Chips Only
1825 Max. Thickness
2225 Voltage Capacitance Failure T = .66mm (.026")
3640 10V = Z Code Rate S = .56mm (.022")
16V = Y (2 significant A = Not R = .46mm (.018")
25V = 3 digits + no. of Applicable
50V = 5 zeros)
100V = 1 Examples:
Packaging**
200V = 2 10 pF = 100
250V = V 100 pF = 101 Recommended:
500V = 7 1,000 pF = 102 2 =7" Reel
600V = C 22,000 pF = 223 4 =13" Reel
1000V = A 220,000 pF = 224
1500V = S 1 µF = 105
2000V = G Others:
For values below 10 pF, 7 = Bulk Cassette
2500V = W use “R” in place of
3000V = H 9 = Bulk
decimal point, e.g., 9.1
4000V = J pfd = 9R1.
5000V = K

* C&D tolerances for ⱕ10 pF values.

** Standard Tape and Reel material depends upon chip size and thickness.
See individual part tables for tape material type for each capacitance value.
Note: Unmarked product is standard. Marked product is available on special request, please contact AVX.
Standard packaging is shown in the individual tables.
Non-standard packaging is available on special request, please contact AVX.

3
Surface Mounting Guide
MLC Chip Capacitors

Component Pad Design

Component pads should be designed to achieve good sol-
der filets and minimize component movement during reflow
soldering. Pad designs are given below for the most com-
mon sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
• Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
• Pad overlap 0.5mm beneath component.
• Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.

REFLOW SOLDERING

Case Size D1 D2 D3 D4 D5
D2 0402 1.70 (0.07) 0.60 (0.02) 0.50 (0.02) 0.60 (0.02) 0.50 (0.02)
0603 2.30 (0.09) 0.80 (0.03) 0.70 (0.03) 0.80 (0.03) 0.75 (0.03)
D1 D3 0805 3.00 (0.12) 1.00 (0.04) 1.00 (0.04) 1.00 (0.04) 1.25 (0.05)
1206 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 1.60 (0.06)
1210 4.00 (0.16) 1.00 (0.04) 2.00 (0.09) 1.00 (0.04) 2.50 (0.10)
D4
1808 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 2.00 (0.08)
1812 5.60 (0.22) 1.00 (0.04)) 3.60 (0.14) 1.00 (0.04) 3.00 (0.12)
D5 1825 5.60 (0.22) 1.00 (0.04) 3.60 (0.14) 1.00 (0.04) 6.35 (0.25)
2220 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 5.00 (0.20)
Dimensions in millimeters (inches) 2225 6.60 (0.26) 1.00 (0.04) 4.60 (0.18) 1.00 (0.04) 6.35 (0.25)

41
Surface Mounting Guide
MLC Chip Capacitors

WAVE SOLDERING

D2 Case Size D1 D2 D3 D4 D5
0603 3.10 (0.12) 1.20 (0.05) 0.70 (0.03) 1.20 (0.05) 0.75 (0.03)
D1 D3 0805 4.00 (0.15) 1.50 (0.06) 1.00 (0.04) 1.50 (0.06) 1.25 (0.05)
1206 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 1.60 (0.06)
D4 1210 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 2.50 (0.10)

D5

Dimensions in millimeters (inches)

Component Spacing Preheat & Soldering

For wave soldering components, must be spaced sufficiently The rate of preheat should not exceed 4°C/second to
far apart to avoid bridging or shadowing (inability of solder prevent thermal shock. A better maximum figure is about
to penetrate properly into small spaces). This is less impor- 2°C/second.
tant for reflow soldering but sufficient space must be
For capacitors size 1206 and below, with a maximum
allowed to enable rework should it be required.
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
≥1.5mm (0.06)
consult AVX.
Cleaning
≥1mm (0.04) Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
≥1mm (0.04) become conductive and effectively offer a low resistance
bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.

42
Surface Mounting Guide
MLC Chip Capacitors
APPLICATION NOTES General
Surface mounting chip multilayer ceramic capacitors
Storage are designed for soldering to printed circuit boards or other
Good solderability is maintained for at least twelve months, substrates. The construction of the components is such that
provided the components are stored in their “as received” they will withstand the time/temperature profiles used in both
packaging at less than 40°C and 70% RH. wave and reflow soldering methods.
Solderability Handling
Terminations to be well soldered after immersion in a 60/40 Chip multilayer ceramic capacitors should be handled with
tin/lead solder bath at 235 ±5°C for 2±1 seconds. care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
Leaching is strongly recommended for individual components. Bulk
Terminations will resist leaching for at least the immersion handling should ensure that abrasion and mechanical shock
times and conditions shown below. are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
Termination Type Solder Solder Immersion Time
Tin/Lead/Silver Temp. °C Seconds machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
Nickel Barrier 60/40/0 260±5 30±1
Preheat
Recommended Soldering Profiles It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
Reflow
and a target figure 2°C/second is recommended. Although
300 an 80°C to 120°C temperature differential is preferred,
Preheat Natural
Cooling recent developments allow a temperature differential
250 between the component surface and the soldering temper-
ature of 150°C (Maximum) for capacitors of 1210 size and
200 below with a maximum thickness of 1.25mm. The user is
Solder Temp.

cautioned that the risk of thermal shock increases as chip

150
220°C
to
size or temperature differential increases.
250°C
Soldering
100
Mildly activated rosin fluxes are preferred. The minimum
amount of solder to give a good joint should be used.
50 Excessive solder can lead to damage from the stresses
caused by the difference in coefficients of expansion
0 between solder, chip and substrate. AVX terminations are
1min 1min 10 sec. max suitable for all wave and reflow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the
(Minimize soldering time)
utilization of hot air soldering tools.
Wave Cooling
Natural cooling in air is preferred, as this minimizes stresses
300
Preheat within the soldered joint. When forced air cooling is used,
Natural cooling rate should not exceed 4°C/second. Quenching
250 Cooling
is not recommended but if used, maximum temperature
differentials should be observed according to the preheat
200 T
Solder Temp.

conditions above.
150 230°C Cleaning
to
250°C Flux residues may be hygroscopic or acidic and must be
100 removed. AVX MLC capacitors are acceptable for use with
all of the solvents described in the specifications MIL-STD-
50 202 and EIA-RS-198. Alcohol based solvents are acceptable
and properly controlled water cleaning systems are also
acceptable. Many other solvents have been proven successful,
0
and most solvents that are acceptable to other components
1 to 2 min 3 sec. max on circuit assemblies are equally acceptable for use with
(Preheat chips before soldering) ceramic capacitors.
T/maximum 150°C

43
Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.

8mm 12mm
Paper or Embossed Carrier 0805, 1005, 1206,
1210
Embossed Only 0504, 0907 1505, 1805, 1812, 1825
1808 2220, 2225
Paper Only 0402, 0603
Qty. per Reel/7" Reel 2,000 or 4,000 (1) 3,000 1,000
Qty. per Reel/13" Reel 10,000 10,000 4,000
(1)
Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are
not available on 13" reels. For 3640 size chip contact factory for quantity per reel.

REEL DIMENSIONS

Tape A B* C D* N W1 W2 W3
Size(1) Max. Min. Min. Min. Max.
7.9 Min.
8mm 8.4 +1.0
–0.0 14.4 (.311)
(.331 +.060
–0.0 ) (.567) 10.9 Max.
330 1.5 13.0±0.20 20.2 50 (.429)
(12.992) (.059) (.512±.008) (.795) (1.969)
11.9 Min.
12mm 12.4 +2.0
–0.0 18.4 (.469)
+.076
(.488 –0.0 ) (.724) 15.4 Max.
(.607)
Metric dimensions will govern.
English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.

32
Embossed Carrier Configuration
8 & 12mm Tape Only

8 & 12mm Embossed Tape

Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size D0 E P0 P2 T Max. T1 G1 G2
+0.10
8mm 8.4 -0.0 1.75 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 0.600 0.10 0.75 0.75
+.004
and (.059 -0.0 ) (.069 ± .004) (.157 ± .004) (.079 ± .002) (.024) (.004) (.030) (.030)
12mm Max. Min. Min.
See Note 3 See Note 4

VARIABLE DIMENSIONS
Tape Size B1 D1 F P1 R T2 W A0 B0 K0
Max. Min. Min.
See Note 6 See Note 5 See Note 2

4.55 1.0 3.5 ± 0.05 4.0 ± 0.10 25 2.5 Max 8.0 +0.3
-0.1
8mm (.179) (.039) (.138 ± .002) (.157 ± .004) (.984) (.098) (.315 +.012
-.004 )
See Note 1

8.2 1.5 5.5 ± 0.05 4.0 ± 0.10 30 6.5 Max. 12.0 ± .30
12mm (.323) (.059) (.217 ± .002) (.157 ± .004) (1.181) (.256) (.472 ± .012) See Note 1

8mm 4.55 1.0 3.5 ± 0.05 2.0 ± 0.10 25 2.5 Max. 8.0 +0.3
-0.1
1/2 Pitch (.179) (.039) (.138 ± .002) 0.79 ± .004 (.984) (.098) (.315 +.012
-.004 )
See Note 1

12mm
8.2 1.5 5.5 ± 0.05 8.0 ± 0.10 30 6.5 Max. 12.0 ± .30 See Note 1
Double
(.323) (.059) (.217 ± .002) (.315 ± .004) (1.181) (.256) (.472 ± .012)
Pitch
NOTES:
1. A0, B0, and K0 are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The
clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and K0) must be within 0.05 mm (.002) min. and 0.50 mm
(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D).
2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm
embossed tape for reels with hub diameters approaching N min. (Table 4).
3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the
cavity whichever is less.
4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity
or to the edge of the cavity whichever is less.
5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.
Dimensions of embossment location and hole location shall be applied independent of each other.
6. B1 dimension is a reference dimension for tape feeder clearance only.

33
Paper Carrier Configuration
8 & 12mm Tape Only

8 & 12mm Paper Tape

Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size D0 E P0 P2 T1 G1 G2 R MIN.
+0.1
8mm 1.5 -0.0 1.75 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 0.10 0.75 0.75 25 (.984)
+.004
and (.059 -.000 ) (.069 ± .004) (.157 ± .004) (.079 ± .002) (.004) (.030) (.030) See Note 2
12mm Max. Min. Min.

VARIABLE DIMENSIONS
Tape Size P1 F W A0 B0 T

8mm 4.0 ± 0.10 3.5 ± 0.05 8.0 +0.3

-0.1 See Note 1 See Note 3
(.157 ± .004) (.138 ± .002) (.315 +.012
-.004 )

4.0 ± .010 5.5 ± 0.05 12.0 ± 0.3

12mm (.157 ± .004) (.217 ± .002) (.472 ± .012)

8mm 2.0 ± 0.10 3.5 ± 0.05 8.0 +0.3

-0.1
1/2 Pitch (.079 ± .004) (.138 ± .002) (.315 +.012
-.004 )

12mm
8.0 ± 0.10 5.5 ± 0.05 12.0 ± 0.3
Double
(.315 ± .004) (.217 ± .002) (.472 ± .012)
Pitch
NOTES:
1. A0, B0, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The
clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and T) must be within 0.05 mm (.002) min. and 0.50 mm
(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A & B).
2. Tape with components shall pass around radius “R” without damage.
3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.

Bar Code Labeling Standard

AVX bar code labeling is available and follows latest version of EIA-556-A.

34
Bulk Case Packaging

BENEFITS BULK FEEDER

• Easier handling
• Smaller packaging volume
(1/20 of T/R packaging)
• Easier inventory control Case
• Flexibility
• Recyclable Cassette

Gate

Shooter
CASE DIMENSIONS

Shutter
Slider
12mm

36mm
Mounter
Expanded Drawing Head

110mm Chips
Attachment Base

CASE QUANTITIES
Part Size 0402 0603 0805
Qty. 10,000 (T=0.6mm)
80,000 15,000
(pcs / cassette) 5,000 (T¯≥0.6mm)

35