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An 40004

This document discusses reflow soldering of lead-less LTCC (Low Temperature Co-fired Ceramic) products. It recommends using tin-lead eutectic or silver-bearing solders with lead-less LTCC. Kester 57-3201-4813 (Sn/Pb) and EFD 6-SN62-575 (Sn/Pb/Ag) solder pastes are identified as suitable options. The importance of following the recommended temperature profile for the specific solder paste is emphasized to ensure proper wetting and reliable connections. Temperature profiles for the two example solder pastes are illustrated.

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31 views4 pages

An 40004

This document discusses reflow soldering of lead-less LTCC (Low Temperature Co-fired Ceramic) products. It recommends using tin-lead eutectic or silver-bearing solders with lead-less LTCC. Kester 57-3201-4813 (Sn/Pb) and EFD 6-SN62-575 (Sn/Pb/Ag) solder pastes are identified as suitable options. The importance of following the recommended temperature profile for the specific solder paste is emphasized to ensure proper wetting and reliable connections. Temperature profiles for the two example solder pastes are illustrated.

Uploaded by

Clena
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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You are on page 1/ 4

Reflow Soldering of Lead-less LTCC Products

AN-40-004

AN-40-004 Rev.: OR M87588 (06/30/03) File: AN40004.doc Page 1 of 4


This document and its contents are the property of Mini-Circuits.
Table of Contents

1.0 Introduction 3
2.0 Solders suitable for lead-less LTCC 3
3.0 Reflow ovens and temperature profiles 3
Fig. 1 Reflow used for Kester 57-3201-4813 Sn/Pb solder paste 4
Fig. 2 Reflow used for EFD 6-SN62-575 Sn/Pb/Ag solder paste 4

AN-40-004 Rev.: OR M87588 (06/30/03) File: AN40004.doc Page 2 of 4


This document and its contents are the property of Mini-Circuits.
1.0 Introduction
Mini-Circuits has developed products having a lead-less LTCC (Low Temperature Co-fired
Ceramic) substrate that serves as the base of the unit. Examples of such products are the
SBTC series of power splitters and the DBTC series of directional couplers.

Metallized pads on the bottom surface, typically deposited with palladium-silver, form the
electrical connections and mechanical mounting points. The absence of leads makes possible
the ultimate in packing density for a given component size. As with other kinds of surface
mount components, lead-less LTCC is mounted on a user’s motherboard via stencil printing
of solder paste followed by reflow. An optimum choice of solder formulation and a well-
controlled reflow process are required to ensure proper wetting of both the LTCC component
pads and the motherboard metallization. Adequate wetting is essential for reliable
connections.

2.0 Solders suitable for lead-less LTCC


Both tin-lead eutectic (Sn/Pb 63/37%) and silver-bearing solder (Sn/Pb/Ag 62/36/2%) have
been used successfully with lead-less LTCC. The solder paste must be formulated especially
for stencil printing. A well chosen solder paste will not require raising the peak temperature,
relative to what is needed for other kinds of components, in order to obtain good wetting.

Examples of solder pastes that have been used successfully without providing an inert
atmosphere in the conveyor oven are Kester Part No. 57-3201-4813 (Easy Profile 256, Sn/Pb)
and EFD Inc. type 6-SN62-575 (Sn/Pb/Ag). These materials contain “no-clean” flux. Solder
pastes containing water-soluble flux are generally more active in removing oxidation from
surfaces to be soldered.

3.0 Reflow ovens and temperature profiles


The importance of control of the temperature profile in the reflow process must be
emphasized. The optimum profile depends upon the type of solder paste to be used to mount
the lead-less LTTC component to the motherboard. The temperature profile recommended by
the solder manufacturer for the particular solder paste should be followed as closely as
possible.

Figure 1 illustrates the profile used with Kester 57-3201-4813 (Sn/Pb), and Figure 2 the
profile used with EFD 6-SN62-575 (Sn/Pb/Ag). In each case the conveyor oven is a Sikama
unit having 6 zones (4 heating zones in the middle, and 2 cooling zones at input and output).
The pre-heat time above 150°C, up to when solder-melt temperature is reached, is critical for
proper activation of the flux contained in the solder paste.

AN-40-004 Rev.: OR M87588 (06/30/03) File: AN40004.doc Page 3 of 4


This document and its contents are the property of Mini-Circuits.
(Slope Degrees/Second)

Peak Min Max Total Total Total


Degrees C Rising Time Time Time
Slope Above Above Above
150 183 220
1 226.1 26.4 7.64 109.14 31.90 14.26

Fig. 1 – Reflow Profile used for Kester 57-3201-4813 Sn/Pb solder paste

(Slope Degrees/Second)

Peak Min Max Max Total Total Total


Degrees C Rising Falling Time Time Time
Slope Slope Above Above Above
150 179 216
1 Built In TC 223.6 27.8 2.55 -2.77 64.90 46.98 18.67

Fig. 2 – Reflow Profile used for EFD 6-SN62-575 Sn/Pb/Ag solder paste

AN-40-004 Rev.: OR M87588 (06/30/03) File: AN40004.doc Page 4 of 4


This document and its contents are the property of Mini-Circuits.

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