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The document provides handling and soldering information for the TJA1145 high-speed CAN transceiver, emphasizing the importance of ESD protection and proper soldering techniques. It discusses wave and reflow soldering methods, their suitability for different types of components, and key characteristics affecting the soldering process. Additionally, it references application notes for more detailed guidance on soldering techniques and temperature profiles.

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5 views3 pages

PHGLS29788 1 Pages

The document provides handling and soldering information for the TJA1145 high-speed CAN transceiver, emphasizing the importance of ESD protection and proper soldering techniques. It discusses wave and reflow soldering methods, their suitability for different types of components, and key characteristics affecting the soldering process. Additionally, it references application notes for more detailed guidance on soldering techniques and temperature profiles.

Uploaded by

Marcos D'Avila
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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NXP Semiconductors TJA1145

High-speed CAN transceiver for partial networking

14. Handling information


All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.

15. Soldering of SMD packages


This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.

15.1 Introduction to soldering


Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.

15.2 Wave and reflow soldering


Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering

15.3 Wave soldering


Key characteristics in wave soldering are:
TJA1145 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.

Product data sheet Rev. 1 — 27 September 2013 42 of 48


NXP Semiconductors TJA1145
High-speed CAN transceiver for partial networking

• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities

15.4 Reflow soldering


Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 19) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 41 and 42

Table 41. SnPb eutectic process (from J-STD-020D)


Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350  350
< 2.5 235 220
 2.5 220 220

Table 42. Lead-free process (from J-STD-020D)


Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all


times.

Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 19.

TJA1145 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.

Product data sheet Rev. 1 — 27 September 2013 43 of 48


NXP Semiconductors TJA1145
High-speed CAN transceiver for partial networking

maximum peak temperature


temperature = MSL limit, damage level

minimum peak temperature


= minimum soldering temperature

peak
temperature

time
001aac844

MSL: Moisture Sensitivity Level


Fig 19. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365


“Surface mount reflow soldering description”.

16. Soldering of HVSON packages


Section 15 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:

• AN10365 ‘Surface mount reflow soldering description”


• AN10366 “HVQFN application information”

TJA1145 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.

Product data sheet Rev. 1 — 27 September 2013 44 of 48

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