Optical Gyroscope
Optical Gyroscope
Presentation on
OPTICAL GYROSCOPE(MEMS)
By:-
Chinmayee Nayak
Mechanical 4th yr , 7th semester
Regd no:-2101109401
Micro-opto- electro-mechanical system (MOEMS)
OPTICAL GYROSCOPE
Introduction
A fibre-optic gyroscope (FOG) senses changes in orientation using the Sagnac effect, thus performing the function of a mechanical gyroscope.
However its principle of operation is instead based on the interference of light which has passed through a coil of optical fibre, which can be as
long as 5 kilometres.
Parts of an optical gyroscope:-
1.Light source: Often a laser that emits a beam of light.
2.Beam splitter: Divides the light into two beams that travel in opposite directions.
3.Optical fibers or waveguides: Pathways for the light beams to travel through.
4.Detector: Measures the phase shift between the two beams of light.
5.Electronics: Convert the detector's signals into readable data. Fig.1. Optical gyroscope
• The amount of displacement is proportional to the angular velocity of the rotating platform.
• The phase shift of the interference fringes is proportional to the platform's angular frequency ω
and is given by the formula originally derived by Sagnac:-
where ,
“A” is the oriented area of the loop
Fig. 3. A guided wave Sagnac interferometer, or fibre optic
“λ” the wavelength of light gyroscope, can be realized using an optical fiber in a single or
multiple loops.
WORKING PROCESS OF THE OPTICAL GYROSCOPE
• Two beams from a laser are injected into the same fibre but in opposite directions. Due to the Sagnac effect, the beam travelling against the
rotation experiences a slightly shorter path delay than the other beam. The resulting differential phase shift is measured through interferometry,
thus translating one component of the angular velocity into a shift of the interference pattern which is measured photometrically.
• Beam splitting optics split light from a laser diode (or other laser light source) into two waves propagating in both clockwise and anticlockwise
directions through a coil consisting of many turns of optical fibre. The strength of the Sagnac effect is dependent on the effective area of the
closed optical path: this is not simply the geometric area of the loop but is also increased by the number of turns in the coil.
2.Material Selection: Silicon is often the material of choice because of its excellent mechanical properties, such as strength and flexibility, which
are crucial for the tiny moving parts in a MEMS device. Depending on the specific requirements, other materials like silicon dioxide, silicon
nitride, or metals may also be used.
3.Wafer Preparation: The silicon wafer is cleaned using a series of chemical baths to remove any contaminants. This is essential to ensure that
subsequent processes like photolithography and etching are not hindered by impurities.
Integrated optics chip: This is the core component of the system, where the optical signal is processed.
SLD: This stands for Superluminescent Diode, which is a type of light source that emits a broad spectrum of light.
Collimator: This component converts the diverging light beam from the SLD into a parallel beam.
Detector: This device converts the optical signal into an electrical signal.
Optical sensitivity part: This is the part of the system that is sensitive to light. It is likely the detector or a component connected to it.
4. Photolithography: The wafer is coated with a thin layer of photoresist, a light-sensitive material. A mask with the desired pattern is placed over
the wafer, and the assembly is exposed to ultraviolet light. The light causes the exposed areas of the photoresist to undergo a chemical change,
allowing those areas to be developed away, leaving behind a precise pattern on the wafer.
5. Etching: The patterned wafer is etched using either wet chemical etching or dry plasma etching. Wet etching involves immersing the wafer in a
chemical solution that removes the exposed silicon, while dry etching uses a plasma of reactive gases to achieve the same effect. This process
creates the intricate 3D structures required for the MEMS device.
6. Deposition: Various thin films of materials are deposited onto the wafer to create the necessary layers for the device. Techniques like chemical
vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD) are used to build up the layers with high precision.
7. Dicing: The wafer is cut into individual dies using a precision dicing saw. Each die contains one MEMS gyroscope. The dicing process must be
done with extreme care to avoid damaging the delicate structures.
8. Packaging: The individual dies are placed into protective packages that provide electrical connections and, in some cases, optical components.
Packaging ensures the gyroscopes are protected from environmental factors like dust, moisture, and mechanical stress.
10. Integration: The calibrated gyroscopes are integrated into final products, such as smartphones, drones, or navigation systems. This integration
involves connecting the gyroscopes to the electronic systems that will use their data for various applications.
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