CMOS, ±5 V/+5 V,

4 Ω, Single SPDT Switches

ADG619/ADG620
FEATURES FUNCTIONAL BLOCK DIAGRAM
6.5 Ω (maximum) on resistance
ADG619/ADG620
0.8 Ω (maximum) on-resistance flatness
S2
2.7 V to 5.5 V single supply
D
±2.7 V to ±5.5 V dual supply S1

Rail-to-rail operation
8-lead SOT-23, 8-lead MSOP IN

Typical power consumption (<0.1 μW)

TTL-/CMOS-compatible inputs

02617-001
NOTES
1. SWITCHES SHOWN FOR
APPLICATIONS A LOGIC 1 INPUT.

Figure 1.
Automatic test equipment
Power routing
Communication systems
Data acquisition systems
Sample-and-hold systems
Avionics
Relay replacement
Battery-powered systems

GENERAL DESCRIPTION PRODUCT HIGHLIGHTS

The ADG619/ADG620 are monolithic, CMOS single-pole 1. Low on resistance (RON): 4 Ω typical.
double-throw (SPDT) switches. Each switch conducts equally 2. Dual ±2.7 V to ±5.5 V or single 2.7 V to 5.5 V supplies.
well in both directions when the device is on. 3. Low power dissipation.
4. Fast tON/tOFF.
The ADG619/ADG620 offer a low on resistance of 4 Ω, which 5. Tiny, 8-lead SOT-23 and 8-lead MSOP.
is matched to within 0.7 Ω between channels. These switches
also provide low power dissipation, yet result in high switching
Table 1. Truth Table for the ADG619/ADG620
speeds. The ADG619 exhibits break-before-make switching
action, thus preventing momentary shorting when switching IN Switch S1 Switch S2
channels. The ADG620 exhibits make-before-break action. 0 On Off
1 Off On
The ADG619/ADG620 are available in an 8-lead SOT-23 and
an 8-lead MSOP.

Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Tel: 781.329.4700 www.analog.com
Trademarks and registered trademarks are the property of their respective owners. Fax: 781.461.3113 ©2001–2007 Analog Devices, Inc. All rights reserved.
ADG619/ADG620

TABLE OF CONTENTS
Features .............................................................................................. 1 Absolute Maximum Ratings ............................................................6

Applications....................................................................................... 1 ESD Caution...................................................................................6

Functional Block Diagram .............................................................. 1 Pin Configurations and Function Descriptions ............................7

General Description ......................................................................... 1 Typical Performance Characteristics ..............................................8

Product Highlights ........................................................................... 1 Terminology .................................................................................... 10

Revision History ............................................................................... 2 Test Circuits..................................................................................... 11

Specifications..................................................................................... 3 Outline Dimensions ....................................................................... 13

Dual Supply ................................................................................... 3 Ordering Guide............................................................................... 14

Single Supply ................................................................................. 5

REVISION HISTORY
3/07—Rev. B to Rev. C
Changes to Specifications ................................................................ 3

1/06—Rev. A to Rev. B
Changes to RON Values in Table 2 ................................................... 2
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 13

6/03—Rev. 0 to Rev. A.
Edits to Specifications ...................................................................... 2
Changes to Ordering Guide ............................................................ 4
Updated Outline Dimensions ......................................................... 8

Rev. C | Page 2 of 16
 ADG619/ADG620

SPECIFICATIONS
DUAL SUPPLY
VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.

Table 2.
B Version 1
Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VSS to VDD V VDD = +4.5 V, VSS = −4.5 V
On Resistance (RON) 4 Ω typ VS = ±4.5 V, IDS = −10 mA; see Figure 15
6.5 8.5 Ω max
RON Match Between Channels (ΔRON) 0.7 Ω typ VS = ±4.5 V, IDS = −10 mA
1.1 1.35 Ω max
On-Resistance Flatness (RFLAT (ON)) 0.7 0.8 Ω typ VS = ±3.3 V, IDS = −10 mA
1.35 1.4 Ω max
LEAKAGE CURRENTS VDD = +5.5 V, VSS = −5.5 V
Source Off Leakage, IS (Off ) ±0.01 nA typ VS = ±4.5 V, VD = ∓ 4.5 V; see Figure 16
±0.25 ±1 nA max
Channel On Leakage, ID, IS (On) ±0.01 nA typ VS = VD = ±4.5 V; see Figure 17
±0.25 ±1 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.4 V min
Input Low Voltage, VINL 0.8 V max
Input Current, IINL or IINH 0.005 μA typ VIN = VINL or VINH
±0.1 μA max
Digital Input Capacitance, CIN 2 pF typ
DYNAMIC CHARACTERISTICS 2
ADG619
tON 80 ns typ RL = 300 Ω, CL = 35 pF
120 155 ns max VS = 3.3 V; see Figure 18
tOFF 45 ns typ RL = 300 Ω, CL = 35 pF
75 90 ns max VS = 3.3 V; see Figure 18
Break-Before-Make Time Delay, tBBM 40 ns typ RL = 300 Ω, CL = 35 pF
10 ns min VS1 = VS2 = 3.3 V; see Figure 19
ADG620
tON 40 ns typ RL = 300 Ω, CL = 35 pF
65 85 ns max VS = 3.3 V; see Figure 18
tOFF 200 ns typ RL = 300 Ω, CL = 35 pF
330 400 ns max VS = 3.3 V; see Figure 18
Make-Before-Break Time Delay, tMBB 160 ns typ RL = 300 Ω, CL = 35 pF
10 ns min VS = 0 V; see Figure 20
Charge Injection 110 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 21
Off Isolation −67 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 22
Channel-to-Channel Crosstalk −67 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 23
Bandwidth −3 dB 190 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 24
CS (Off ) 25 pF typ f = 1 MHz
CD, CS (On) 95 pF typ f = 1 MHz

Rev. C | Page 3 of 16
ADG619/ADG620
B Version 1
Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
POWER REQUIREMENTS VDD = +5.5 V, VSS = −5.5 V
IDD 0.001 μA typ Digital inputs = 0 V or 5.5 V
1.0 μA max
ISS 0.001 μA typ Digital inputs = 0 V or 5.5 V
1.0 μA max
1
Temperature range for B version is −40°C to +85°C.
2
Guaranteed by design, not subject to production test.

Rev. C | Page 4 of 16
 ADG619/ADG620
SINGLE SUPPLY
VDD = 5 V ± 10%, VSS = 0 V, GND = 0 V. All specifications −40°C to +85°C, unless otherwise noted.

Table 3.
B Version 1
Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to VDD V VDD = 4.5 V, VSS = 0 V
On Resistance (RON) 7 Ω typ VS = 0 V to 4.5 V, IDS = −10 mA; see Figure 15
10 12.5 Ω max
RON Match Between Channels (ΔRON) 0.8 Ω typ VS = 0 V to 4.5 V, IDS = −10mA
1.1 1.3 Ω max
On-Resistance Flatness (RFLAT (ON)) 0.5 0.5 Ω typ VS = 1.5 V to 3.3 V, IDS = −10 mA
1.2 Ω max
LEAKAGE CURRENTS VDD = 5.5 V
Source Off Leakage, IS (Off ) ±0.01 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 16
±0.25 ±1 nA max
Channel On Leakage, ID, IS (On) ±0.01 nA typ VS = VD = 1 V/4.5 V; see Figure 17
±0.25 ±1 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.4 V min
Input Low Voltage, VINL 0.8 V max
Input Current, IINL or IINH 0.005 μA typ VIN = VINL or VINH
±0.1 μA max
Digital Input Capacitance, CIN 2 pF typ
DYNAMIC CHARACTERISTICS 2
ADG619
tON 120 ns typ RL = 300 Ω, CL = 35 pF
220 280 ns max VS = 3.3 V; see Figure 18
tOFF 50 ns typ RL = 300 Ω, CL = 35 pF
75 110 ns max VS = 3.3 V; see Figure 18
Break-Before-Make Time Delay, tBBM 70 ns typ RL = 300 Ω, CL = 35 pF
10 ns min VS1 = VS2 = 3.3 V; see Figure 19
ADG620
tON 50 ns typ RL = 300 Ω, CL = 35 pF
85 110 ns max VS = 3.3 V; see Figure 18
tOFF 210 ns typ RL = 300 Ω, CL = 35 pF
340 420 ns max VS = 3.3 V; see Figure 18
Make-Before-Break Time Delay, tMBB 170 ns typ RL = 300 Ω, CL = 35 pF
10 ns min VS = 3.3 V; see Figure 20
Charge Injection 6 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 21
Off Isolation −67 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure
22
Channel-to-Channel Crosstalk −67 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure
23
Bandwidth −3 dB 190 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 24
CS (OFF) 25 pF typ f = 1 MHz
CD, CS (ON) 95 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 5.5 V
IDD 0.001 μA typ Digital inputs = 0 V or 5.5 V
1.0 μA max
1
Temperature range for B version is −40°C to +85°C.
2
Guaranteed by design, not subject to production test.

Rev. C | Page 5 of 16
ADG619/ADG620

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 4.
Parameter Rating Stresses above those listed under Absolute Maximum Ratings
VDD to VSS 13 V may cause permanent damage to the device. This is a stress
VDD to GND −0.3 V to +6.5 V rating only; functional operation of the device at these or any
VSS to GND +0.3 V to −6.5 V other conditions above those indicated in the operational
Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V section of this specification is not implied. Exposure to absolute
Digital Inputs1 −0.3 V to VDD + 0.3 V or 30 mA maximum rating conditions for extended periods may affect
(whichever occurs first) device reliability.
Peak Current, S or D 100 mA (pulsed at 1 ms,
10% duty cycle maximum) Only one absolute maximum rating may be applied at a time.

ESD CAUTION
Continuous Current, S or D 50 mA
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
MSOP
θJA Thermal Impedance 206°C/W
θJC Thermal Impedance 44°C/W
SOT-23
θJA Thermal Impedance 229.6°C/W
θJC Thermal Impedance 91.99°C/W
Lead Temperature, Soldering 300°C
(10 sec)
IR Reflow, Peak Temperature 220°C
1
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.

Rev. C | Page 6 of 16
 ADG619/ADG620

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

D 1 8 S2
ADG619/ D 1 8 S2
S1 2 7 VSS
ADG620 ADG619/
S1 2 7 VSS
GND 3 TOP VIEW 6 IN ADG620
(Not to Scale) GND 3 TOP VIEW 6 IN
VDD 4 5 NC (Not to Scale)

02617-003
VDD 4 5 NC

02617-002
NC = NO CONNECT NC = NO CONNECT

Figure 2. 8-Lead SOT-23 Figure 3. 8-Lead MSOP

(RJ-8) (RM-8)

Table 5. Pin Function Descriptions

Pin No. Mnemonic Description
1 D Drain Terminal. Can be an input or output.
2 S1 Source Terminal. Can be an input or output.
3 GND Ground (0 V) Reference.
4 VDD Most Positive Power Supply.
5 NC No Connect. Not internally connected.
6 IN Logic Control Input.
7 VSS Most Negative Power Supply. This pin is only used in dual-supply applications and should be tied to
ground in single-supply applications.
8 S2 Source Terminal. Can be an input or output.

Rev. C | Page 7 of 16
ADG619/ADG620

TYPICAL PERFORMANCE CHARACTERISTICS

8 10
VDD, VSS = ±2.5V
9
7
8
6 VDD, VSS = ±3V TA = +85°C
7

ON RESISTANCE (Ω)
5
ON RESISTANCE (Ω)

6
TA = +25°C
VDD, VSS = ±3.3V
4 5
TA = –40°C
VDD, VSS = ±4.5V 4
3 VDD, VSS = ±5V
3
2
2
1
02617-004

02617-007
1 VDD = 5V
TA = 25°C VSS = 0V
0 0
–5 –4 –3 –2 –1 0 1 2 3 4 5 0 1 2 3 4 5
VD, VS (V) VD, VS (V)

Figure 4. On Resistance vs. VD, VS (Dual Supply) Figure 7. On Resistance vs. VD, VS for Different Temperatures (Single Supply)

18 0.5
TA = 25°C VDD = +5V
VDD = 2.7V VSS = –5V
VSS = 0V 0.4 VD = ±4.5V
16
VS = 4.5V
±
0.3
14 VDD = 3V
LEAKAGE CURRENTS (nA)

0.2
12 IS (OFF)
ON RESISTANCE (Ω)

0.1
10 VDD = 3.3V
0
ID, IS (ON)
8 VDD = 4.5V
–0.1
6 –0.2
VDD = 5V

4 –0.3

02617-008
2 –0.4
02617-005

0 –0.5
0 1 2 3 4 5 0 10 20 30 40 50 60 70 80
VD, VS (V) TEMPERATURE (°C)

Figure 5. On Resistance vs. VD, VS (Single Supply) Figure 8. Leakage Currents vs. Temperature (Dual Supply)

6 0.5
VDD = 5V
VSS = 0V
0.4 VD = 4.5V/1V
5 VS = 1V/4.5V
0.3
LEAKAGE CURRENTS (nA)

TA = +85°C 0.2
ON RESISTANCE (Ω)

4
0.1 ID, IS (ON)
TA = +25°C
3 0
IS (OFF)
TA = –40°C –0.1
2
–0.2

–0.3
1
02617-006

02617-009

VDD = +5V –0.4

VSS = –5V
0 –0.5
–5 –4 –3 –2 –1 0 1 2 3 4 5 0 10 20 30 40 50 60 70 80
VD, VS (V) TEMPERATURE (°C)

Figure 6. On Resistance vs. VD, VS for Different Temperatures (Dual Supply) Figure 9. Leakage Currents vs. Temperature (Single Supply)

Rev. C | Page 8 of 16
 ADG619/ADG620
250
TA = 25°C –10

200 –20
CHARGE INJECTION (pC)

VDD = +5V
VSS = –5V –30

ATTENUATION (dB)
150
–40

100
–50

VDD = +5V
VSS = 0V –60
50

02617-010
–70 VDD = +5V

02617-013
VSS = –5V
0 TA = 25°C
–5 –4 –3 –2 –1 0 1 2 3 4 5 –80
VS (V) 0.2 1 10 100
FREQUENCY (MHz)
Figure 10. Charge Injection vs. Source Voltage Figure 13. Crosstalk vs. Frequency

180
0
160

VDD = +5V –2
140 VSS = 0V

120 VDD = +5V –4

VSS = –5V
ATTENUATION (dB)
tON
100
–6
TIME (ns)

80
–8
60 tOFF
–10
40
VDD = +5V VDD = +5V
VSS = 0V
02617-011

20 VSS = –5V –12 VDD = +5V

02617-014
VSS = –5V
0 TA = 25°C
–40 –20 0 20 40 60 80 –14
0.2 1 10 100 1000
TEMPERATURE (°C) FREQUENCY (MHz)
Figure 11. tON/tOFF Times vs. Temperatures Figure 14. On Response vs. Frequency

–10

–20

–30
ATTENUATION (dB)

–40

–50

–60

–70

–80
VDD = +5V
–90
02617-012

VSS = –5V
TA = 25°C
–100
0.03 1 10 100
FREQUENCY (MHz)

Figure 12. Off Isolation vs. Frequency

Rev. C | Page 9 of 16
ADG619/ADG620

TERMINOLOGY
IDD CD, CS (On)
Positive supply current. On switch capacitance.

ISS tON
Negative supply current. Delay between applying the digital control input and the output
switching on.
RON
Ohmic resistance between D and S terminals. tOFF
Delay between applying the digital control input and the output
ΔRON switching off.
On resistance match between any two channels.
tMBB
RFLAT (ON) On time is measured between the 80% points of both switches,
Flatness is defined as the difference between the maximum and when switching from one address state to another.
minimum value of on resistance as measured over the specified
analog signal range. tBBM
Off time or on time is measured between the 90% points of
IS (Off) both switches, when switching from one address state
Source leakage current with the switch off. to another.
ID, IS (On) Charge Injection
Channel leakage current with the switch on. A measure of the glitch impulse transferred from the digital
VD, VS input to the analog output during switching.
Analog voltage on Terminal D and Terminal S. Crosstalk
VINL A measure of unwanted signal coupled through from one
Maximum input voltage for Logic 0. channel to another as a result of parasitic capacitance.

VINH Off Isolation

Minimum input voltage for Logic 1. A measure of unwanted signal coupling through an off switch.

IINL, IINH Bandwidth

Input current of the digital input. The frequency response of the on switch.

CS (Off) Insertion Loss

Off switch source capacitance. The loss due to the on resistance of the switch.

Rev. C | Page 10 of 16
 ADG619/ADG620

TEST CIRCUITS
IDS

V1
IS (OFF) ID (OFF) ID (ON)
S D S D S D

02617-015
A A NC A

02617-017
02617-016
VS VS VD VD
RON = V1/IDS

Figure 15. On Resistance Figure 16. Off Leakage Figure 17. On Leakage

VDD VSS
0.1µF 0.1µF

50% 50%
VDD VSS VIN
S D 90%
VOUT 90%
VS IN RL CL
VOUT

02617-018
300Ω 35pF
GND
tON tOFF

Figure 18. Switching Times

VDD VSS
0.1µF 0.1µF

VDD VSS VIN 50% 50%

S1 0V
VS1
D D2
VOUT 90% 90%
S2 CL2 VOUT
VS2 RL2
IN 35pF 0V
300Ω

02617-019
VIN GND
tBBM tBBM

Figure 19. Break-Before-Make Time Delay, tBBM (ADG619 Only)

VDD VSS
0.1µF 0.1µF

VDD VSS
VS1
VD VIN 50% 50%
0V
VS1 RL1 CL1
IN
RL2 CL2 300Ω 35pF VS1 80%V D
VIN GND 300Ω 35pF
80%V D
VS2 02617-020

tMBB
Figure 20. Make-Before-Break Time Delay, tMBB (ADG620 Only)
VDD VSS

VDD VSS VIN

RS D S
VOUT S2
CL ΔVOUT
VS
IN 1nF VOUT

ΔVOUT
02617-021

GND
S1
QINJ = CL × ΔVOUT

Figure 21. Charge Injection

Rev. C | Page 11 of 16
ADG619/ADG620
VDD VSS
0.1µF 0.1µF

NETWORK
VDD VSS ANALYZER

S 50Ω
IN 50Ω
VS
D
VIN VOUT
RL
50Ω
GND

02617-022
VOUT
OFF ISOLATION = 20 log
VS

Figure 22. Off Isolation

VDD VSS
0.1µF 0.1µF

NETWORK
ANALYZER VDD VSS
VOUT
S1
R
50Ω
S2 D R
50Ω
50Ω
IN
VS
GND

02617-023
VOUT
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
VS

Figure 23. Channel-to-Channel Crosstalk

VDD VSS
0.1µF 0.1µF

NETWORK
VDD VSS ANALYZER

S 50Ω
IN
VS

D
VIN VOUT
RL
50Ω
GND
02617-024

VOUT WITH SWITCH

INSERTION LOSS = 20 log
VS WITHOUT SWITCH

Figure 24. Bandwidth

Rev. C | Page 12 of 16
 ADG619/ADG620

OUTLINE DIMENSIONS
3.20
3.00
2.80

8 5 5.15
3.20
4.90
3.00
4.65
2.80 1
4

PIN 1
0.65 BSC
0.95
0.85 1.10 MAX
0.75
0.80
0.15 0.38 8° 0.60
0.23
0.00 0.22 0° 0.40
0.08
COPLANARITY SEATING
0.10 PLANE

COMPLIANT TO JEDEC STANDARDS MO-187-AA

Figure 25. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)
Dimensions shown in millimeters

2.90 BSC

8 7 6 5

1.60 BSC 2.80 BSC

1 2 3 4

PIN 1
INDICATOR
0.65 BSC
1.95
1.30 BSC
1.15
0.90

1.45 MAX 0.22

0.08
0.60
0.38 8° 0.45
0.15 MAX 4°
0.22 SEATING 0.30
PLANE 0°

COMPLIANT TO JEDEC STANDARDS MO-178-BA

Figure 26. 8-Lead Small Outline Transistor Package [SOT-23]

(RJ-8)
Dimensions shown in millimeters

Rev. C | Page 13 of 16
ADG619/ADG620
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding 1
ADG619BRM −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SVB
ADG619BRM-REEL −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SVB
ADG619BRM-REEL7 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SVB
ADG619BRMZ 2 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SCC
ADG619BRMZ-REEL2 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SCC
ADG619BRMZ-REEL72 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SCC
ADG619BRT-REEL −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SVB
ADG619BRT-REEL7 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SVB
ADG619BRT-500RL7 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SVB
ADG619BRTZ-REEL2 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SCC
ADG619BRTZ-REEL72 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SCC
ADG619BRTZ-500RL72 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SCC
ADG620BRM −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SWB
ADG620BRM-REEL −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SWB
ADG620BRM-REEL7 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 SWB
ADG620BRMZ2 −40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 S21
ADG620BRT-REEL −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SWB
ADG620BRT-REEL7 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 SWB
ADG620BRTZ-REEL72 −40°C to +85°C 8-Lead Small Outline Transistor Package (SOT-23) RJ-8 S21
1
Branding on SOT-23 and MSOP is limited to three characters due to space constraints.
2
Z = RoHS Compliant Part.

Rev. C | Page 14 of 16
 ADG619/ADG620

NOTES

Rev. C | Page 15 of 16
ADG619/ADG620

NOTES

©2001–2007 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.
C02617-0-3/07(C)

Rev. C | Page 16 of 16