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19 views7 pages

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Uploaded by

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D

r d
"Thin Film Technology"
"Physics of Thin Films"
Contents:

Preface

1. Introduction

1.1. General
1.2. History
1.3. Definition of Terms
1.4. Applications of Thin Film Technology
1.5. Deposition Methods - Overview
1.6. Coating Thickness and Deposition Rates

2. Deposition Methods

2.1. PVD (Physical Vapor Deposition)


2.1.1. Evaporation
2.1.1.1. Introduction
2.1.1.2. Fundamentals of Evaporation
2.1.1.3. Evaporation Sources
2.1.1.4. Evaporation Materials
2.1.1.5. Special Evaporation Methods
2.1.2. Sputtering
2.1.2.1. Introduction
2.1.2.2. Fundamentals of Sputtering
2.1.2.3. Practical Aspects of Sputtering
2.1.3. Ion Plating
2.1.3.1. Introduction
2.1.3.2. Influence of Particle Bombardement on Interface - and
Film Properties
2.1.3.3. Practical Aspects of Ion Plating

2.2. CVD (Chemical Vapour Deposition)


2.2.1. PACVD (Plasma Assisted Chemical Vapour Deposition)
2.2.1.1. Introduction
2.2.1.2. Practical Aspects of PACVD

"Thin Film Technology/Physics of Thin Films" I


2.3. Other Coating Methods
2.3.1. Plasma Polymerization
2.3.2. Electrochemical and Chemical Deposition
2.3.2.1. Introduction
2.3.2.2. Fundamentals of Galvanics
2.3.2.3. Practical Aspects
2.3.2.4. Applications
2.3.2.5. Fundamentals of Anodization
2.3.2.6. Fundamentals of Chemical-Reductive Deposition
2.3.3. Thermal Spraying
2.3.3.1. Introduction
2.3.3.2. Practical Aspects of Thermal Spraying
2.3.3.3. Applications
2.3.4. Build up Welding and Plating
2.3.4.1. Introduction
2.3.4.2. Practical Aspects
2.3.5. Melt Dipping
2.3.6. Emulsions and Pastes

3. Condensation and Thin Film Growth

3.1. Introduction
3.2. Theory
3.2.1. Elementary Processes at Surfaces
3.2.2. Condensation Regimes
3.2.2.1. Complete Condensation
3.2.2.2. Incomplete Condensation
3.2.3. Nucleation
3.2.3.1. General Considerations
3.2.3.2. Droplet Model
3.2.3.3. Particle Model
3.2.4. Film Growth
3.2.4.1. Growth Modes

3.3. Advanced Concepts of Thin Film Formation


3.3.1. Rate Equations
3.3.2. Kinetic Monte-Carlo-Simulations: Local Effects and Surface Defects
3.3.3. Concluding Remarks

" Thin Film Technology/Physics of Thin Films " II


4. Properties and Characterization of Thin Films

4.1. Film Thickness


4.1.1. Introduction
4.1.2. Gravimetric Methods
4.1.2.1. General
4.1.2.2. Weighing
4.1.2.3. Quartz Oscillator Method
4.1.2.4. Microbalance
4.1.2.5. Dosed Mass Supply
4.1.3. Optical Methods
4.1.3.1. General
4.1.3.2. Photometer Method
4.1.3.3. Tolansky Interferometer
4.1.3.4. FECO Method
4.1.3.5. Other Optical Methods
4.1.4. Direct Methods
4.1.4.1. General
4.1.4.2. Stylus Method
4.1.4.3. Optical and Electron Microscopy for Thickness Measurement
4.1.5. Film Thickness Measurement by Electrical or Magnetic Quantities
4.1.5.1. Resistance Method
4.1.5.2. Capacitance Method
4.1.5.3. Eddy Current Method
4.1.5.4. Magnetic Method
4.1.6. Thickness Measurement by Interaction with Particles
4.1.6.1. Evaporation Rate Monitor
4.1.6.2. Other Methods

4.2. Roughness
4.2.1. Introduction
4.2.2. Types of Roughness
4.2.2.1. Stochastic Roughness
4.2.2.2. Self Affine Surfaces
4.2.2.3. Pore Formation and non "Solid-on-Solid"-Surfaces
4.2.2.4. Waviness and defined Structures
4.2.3. Roughness Measurement
4.2.3.1. Stylus or Probe Methods
4.2.3.2. Optical Methods und Scattering
4.2.4. Roughness Quantification
4.2.4.1. Global Quantities
4.2.4.2. Correlation Functions
4.2.4.3. Methods Based on Fourier Analysis

" Thin Film Technology/Physics of Thin Films " III


4.3. Mechanical Properties
4.3.1. Introduction
4.3.2. Structure Zone Models
4.3.2.1. General
4.3.2.2. Model of Movchan und Demchishin
4.3.2.3. Thornton-Model
4.3.3. Incorporation of Foreign Atoms
4.3.4. Stresses
4.3.4.1. General
4.3.4.2. Stress Measurement
4.3.5. Adhesion
4.3.5.1. General
4.3.5.2. Interface between Substrate and Coating
4.3.5.3. Substrate Pre Treatment
4.3.5.4. Adhesion Measurement
4.3.6. Friction and Wear
4.3.7. Ductility
4.3.8. Hardness
4.3.8.1. General
4.3.8.2. Micro Hardness Measurement

4.4. Electrical Properties


4.4.1. Introduction
4.4.2. Definition and Measurement
4.4.3. Theoretical Fundamentals
4.4.3.1. Conductivity of Continous Thin Films
4.4.3.2. Conductivity of Discontinuous Thin Films
4.4.4. Practical Aspects
4.4.4.1. General
4.4.4.2. NiCr-Thin Film Resistors
4.4.4.3. Cermet Thin Film Resistors
4.4.4.4. Semiconductor Films
4.4.4.5. Magnetic Thin Films

" Thin Film Technology/Physics of Thin Films " IV


4.5. Optical Properties
4.5.1. Introduction
4.5.2. Theory
4.5.2.1. Fresnel's Equations
4.5.3. Anti Reflection Coatings
4.5.3.1. Single Layer
4.5.3.2. Double Layer
4.5.3.3. Multilayer Coatings
4.5.4. Reflection Enhancement
4.5.4.1. Metal Mirrors
4.5.4.2. Dielectric Mirrors - Multilayer Systems
4.5.5. Filters
4.5.5.1. Fabry-Perot-Filter
4.5.5.2. Edge Filter
4.5.6. Characterization of Optical Coatings
4.5.6.1. General
4.5.6.2. Characterization Methods

4.6. Chemical Composition


4.6.1. Introduction
4.6.2. Electron Probe Microanalysis (EPM)
4.6.3. Auger Electron Spectroscopy (AES)
4.6.4. Photo Electron Spectroscopy (UPS, XPS)
4.6.5. Secondary Ion Mass Spectroscopy (SIMS)
4.6.6. Secondary Neutral Mass Spectroscopy (SNMS)
4.6.7. Ion Scattering Spectroscopy (ISS)
4.6.8. Rutherford Backscatter Spectroscopy (RBS)

" Thin Film Technology/Physics of Thin Films " V


Preface:

The present Volume of Lecture notes is based on the Lecture "Physics and
Technology of Thin Films". The basic version was authored by Dr. Anton Bergauer in 1993.
Starting 2000 Lhe lecture notes were regularily updated by Dr. Christoph
Eisenmenger-Sittner. In 2006 the four hour lecture "Physics and Technology of Thin Films"
was devided into two two hour lectures, "Thin Film Technology", LVA 138 030 and "Physics
of Thin Films", LVA 130 032. Together, both lectures comprise the topics of the present
script. Within the script the contents of the two lectures are cab be distibguished by different
fonts.

Contents which concern LVA 138 030, " Thin Film Technology " are written in "Areal"
font. The lecture deals with the most important technologies of thin film deposition from the
vapor and the liquid phase as well as the most common methods of thin film characterization
in respect to e. g. thickness, mechanical, electrical and optical properties. Also the most
important applications of thin films are discussed. The lecture specifically aims at bachelor
students and does not comprise a deeper analysis of the methods discussed.

Contents which concern LVA 138 032, "Physics of Thin Films" betreffen, are written in
"Areal italic" font. The topics of this lecture are the basic physical principles of thin film
deposition and thin film formation. The physical principles of vacuum technology, the
emission of atoms from the solid phase by thermal or mechanical processes and the
elementary steps of film condensation from the vapor phase are discussed. Additionally, the
reasons why the mechanical, electronical and optical properties of thin films differ from the
theree dimensional bulk are elucidated. The lecture aims at master students and therefore
requires knowledge about certain advanced mathematical and physical methods and
concepts as e. g. distribution functions, transport theory and thermodynamics.

Contents which are treated in both lectures (of course this part was reduced to the
maximum, but could not completely be avoided) finally are written in the "Times New
Roman" font.

The lecture notes were refined in 2017. References from basic Thin Film textbooks
were included to provide the reader easy access to information for further studies. The
number of secondary literature was kept to a minimum. Therefore, for original quotes, the
references in within the textbooks provided, should be used.

Vienna, August 2017


C. Eisenmenger-Sittner

" Thin Film Technology/Physics of Thin Films " VI

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