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Temperature Profile Curves

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Alejandro Nuñez Velasquez
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22 views3 pages

Profile Curves

Temperature Profile Curves

Uploaded by

Alejandro Nuñez Velasquez
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as TXT, PDF, TXT or read online on Scribd
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When soldering **SMD (Surface-Mount Device)** components using a **hot plate** (or

a heated surface), the **temperature profile** is an important factor in ensuring


that the soldering process is effective, efficient, and safe for both the
components and the PCB. A proper **temperature profile** ensures that the solder
paste melts evenly and the solder joints form correctly, while also preventing
damage to sensitive components.

### What Is a Temperature Profile?

A **temperature profile** refers to the specific **temperature vs. time curve**


that describes how the temperature of the PCB and solder paste changes during the
reflow soldering process. The profile is divided into different **phases** that
help to:
1. **Prevent thermal shock** to the components.
2. Ensure **uniform soldering** without under- or overheating any area of the
board.
3. Allow the **solder paste** to melt and flow correctly to form good solder
joints.

In reflow soldering, the temperature profile typically consists of three main


phases:
- **Preheat (or Ramp-Up) Phase**
- **Soak (or Pre-Soak) Phase**
- **Reflow (or Peak) Phase**
- **Cool-down Phase**

### Typical Temperature Profile for Hot Plate Soldering

While **hot plate soldering** is more basic than using a **reflow oven**, the same
general temperature profile principles apply. The hot plate typically heats the
bottom of the PCB, so it’s important to **manage the heating time and temperature**
carefully to avoid overheating sensitive components.

#### 1. **Preheat (Ramp-Up) Phase**


- **Objective**: Gradually raise the temperature of the PCB and the solder paste
to avoid thermal shock and ensure even heating of the components.
- **Temperature Range**: **100°C to 150°C (212°F to 302°F)**
- **Time**: Typically **2-3 minutes**
- **What Happens**:
- The **PCB and solder paste** begin to warm up slowly.
- The **flux** in the solder paste starts to activate, cleaning the surfaces
of the PCB pads and component leads.
- This phase is important to avoid rapid temperature changes that could damage
the components or cause thermal stresses.

#### 2. **Soak (Pre-Soak) Phase**


- **Objective**: This phase allows the PCB to stabilize at a higher temperature,
ensuring that both the **PCB and components** heat evenly before reaching the
reflow stage.
- **Temperature Range**: **150°C to 180°C (302°F to 356°F)**
- **Time**: Typically **1–2 minutes**
- **What Happens**:
- The **solder paste** is further activated, and the flux starts to vaporize,
which helps the paste adhere to the PCB pads.
- The temperature is kept steady to allow even distribution of heat across the
entire PCB.
- If you heat too quickly, the paste may not spread evenly, leading to weak or
unreliable joints.
#### 3. **Reflow (Peak) Phase**
- **Objective**: This is the critical phase where the **solder paste melts** and
forms the actual solder joints between the component leads and the PCB pads.
- **Temperature Range**: **220°C to 250°C (428°F to 482°F)**
- **Time**: Typically **30-90 seconds**
- **What Happens**:
- The **solder paste melts** and flows, creating reliable solder joints.
- The temperature should be high enough to reflow the paste but not too high
to avoid overheating or damaging the components.
- At this point, the solder paste becomes **shiny** and **smooth** when
melted, indicating that the reflow is complete.
- The exact **peak temperature** depends on the type of **solder paste** used
(e.g., lead-free or leaded). Lead-free pastes often require a higher peak
temperature (around 240°C to 250°C), while leaded pastes can reflow at slightly
lower temperatures (around 220°C).

#### 4. **Cool-down Phase**


- **Objective**: To allow the solder joints to solidify and cool down without
distortion.
- **Temperature Range**: From **reflow temperature** down to room temperature
(around 20°C or 68°F)
- **Time**: Typically **1-2 minutes** (cooling naturally)
- **What Happens**:
- The PCB is removed from the hot plate and allowed to cool down naturally.
- The solder solidifies, forming **solid solder joints**. If cooled too
quickly, the solder joints can become brittle.
- Cooling too slowly can lead to **cold joints** or weak solder connections,
so proper cooling is important.

---

### Example of a Typical Temperature Profile for Hot Plate Soldering:

Here’s a simplified version of what the temperature vs. time curve might look like
during hot plate reflow soldering:

| Phase | Time | Temperature Range |


|----------------------|------------------|--------------------------|
| **Preheat** | 2–3 minutes | 100°C to 150°C (212°F to 302°F) |
| **Soak** | 1–2 minutes | 150°C to 180°C (302°F to 356°F) |
| **Reflow** | 30–90 seconds | 220°C to 250°C (428°F to 482°F) |
| **Cool-down** | 1–2 minutes | Room temperature (~20°C / 68°F) |

---

### Important Considerations for Hot Plate Soldering:

- **Uniform Heating**: Since a hot plate typically heats from the **bottom** of the
PCB, it’s essential to ensure that heat is distributed evenly. This is especially
important for components with different thermal mass, such as larger components
compared to smaller ones.
- **Monitoring Temperature**: Ideally, a **thermocouple** or **infrared
thermometer** should be used to monitor the temperature at key locations on the
PCB, especially if your hot plate doesn’t have built-in temperature feedback.
- **Avoid Overheating**: Excessive temperature or prolonged exposure to high
temperatures can damage components, cause **delamination** of the PCB, or **degrade
solder joints**.
- **Type of Solder Paste**: The reflow temperature depends on the type of solder
paste you're using. **Lead-free solder paste** requires a higher peak temperature
(around 240–250°C), while **leaded solder paste** can reflow at a lower temperature
(around 220°C).
- **Component Sensitivity**: Some components, like **BGAs** (Ball Grid Arrays),
have specific reflow profiles due to their **thermal mass** and **heat
sensitivity**. Be sure to check the component datasheets for any special
requirements regarding reflow.

### Final Thoughts:

When soldering with a hot plate, following a proper **temperature profile** is key
to achieving high-quality, reliable solder joints. Each phase in the profile —
**preheat**, **soak**, **reflow**, and **cool-down** — is essential for ensuring
that the solder paste melts properly and that the components are not damaged by
thermal stress. If you're using a hot plate for **prototyping**, make sure you
understand the **characteristics of the solder paste** and **monitor the
temperature carefully** to achieve the best results.

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