Scribd
Upload
71 views1 page

Solder Reflow

Uploaded by

hanipe2979
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
71 views1 page

Solder Reflow

Uploaded by

hanipe2979
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 1

SOLDER REFLOW

PULSE RECOMMENDED SOLDER REFLOW PROFILE


IR/CONVENCTION REFLOW PROFILE (IPC/JEDEC J-STD-020E

tp=30sec
(see note 2)
TP=per table

MAX RAMP UP RATE = 3°C/S


MAX RAMP DOWN RATE = 6°C/S

TL=217C

TSMAX=200C t=60-150sec
PREHEAT AREA

TSMIN=150C
TEMPERATURE

ts=60-120sec

25
TIME 25° C TO PEAK<= 8 MINUTES
TIME

Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 > 2000
<1.6 mm 260°C 260°C 260°C
1.6 mm - 2.5mm 260°C 250°C 245°C
> 2.5mm 250°C 245°C 245°C

Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If parts are reflowed in other
than the normal live bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2 °C of the live bug Tp and still meet the Tc requirements, otherwise, the profile shall be adjusted
to achieve the latter. To accurately measure actual peak package body temperatures, refer to JEP140 for recommended thermocouple use.

Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly profiles should be developed
based on specific process needs and board designs and should not exceed the parameters in this table. For example, if Tc is 260 °C and time Tp is 30 seconds, this means the following for
the supplier and the user:
For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds.
For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.

Note 3: Package ‘‘volume’’ excludes external terminals (e.g., balls, bumps, lands, leads) and/or non-integral heat sinks. Package volume includes the external dimensions of the package
body, regardless if it has a cavity or is a passive package style.

Note 4: At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the values specified in table 4-1 or
4-2. The use of a higher Tp does not change the classification temperature (Tc).

Note 5: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduces the thermal gradients
between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.

www.PulseElectronics.com 09/01/23

You might also like

pFad - Phonifier reborn

Pfad - The Proxy pFad of © 2024 Garber Painting. All rights reserved.

Note: This service is not intended for secure transactions such as banking, social media, email, or purchasing. Use at your own risk. We assume no liability whatsoever for broken pages.


Alternative Proxies:

Alternative Proxy

pFad Proxy

pFad v3 Proxy

pFad v4 Proxy