BC95 Hardware Design

NB-IoT Module Series

Rev. BC95_Hardware_Design_V1.1

Date: 2017-01-24

www.quectel.com
 NB-IoT Module Series
BC95 Hardware Design

Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:

Quectel Wireless Solutions Co., Ltd.

Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233
Tel: +86 21 5108 6236
Email: info@quectel.com

Or our local office. For more information, please visit:

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http://www.quectel.com/support/salesupport.aspx

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For technical support, or to report documentation errors, please visit:

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http://www.quectel.com/support/techsupport.aspx

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Or email to: Support@quectel.com

GENERAL NOTES

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QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION

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PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT

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ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO

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CHANGE WITHOUT PRIOR NOTICE.

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COPYRIGHT

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THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL
CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT
AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION.
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IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN.

Copyright © Quectel Wireless Solutions Co., Ltd. 2017. All rights reserved.

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About the Document

History

Revision Date

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Author Description

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Bryant CHEN/
1.0 2016-11-30 Initial
Mark ZHANG

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1. Modified module’s current consumption in PSM.

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2. Changed the name of BC95 variants from BC95

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Bryant CHEN/ -CM/BC95-SL/BC95-VF to BC95-B8/BC95-B5/B

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1.1 2017-01-24
Mark ZHANG C95-B20.

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3. Enabled main port to upgrade firmware.
4. Updated current consumption in Table 23.

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Contents

About the Document ................................................................................................................................... 2

Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 5
Figure Index ................................................................................................................................................. 6

1 Introduction .......................................................................................................................................... 7
1.1. Safety Information ................................................................................................................... 8

2 Product Concept .................................................................................................................................. 9

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2.1. General Description ................................................................................................................. 9
2.2. Key Features ......................................................................................................................... 10

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2.3. Functional Diagram ............................................................................................................... 11

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2.4. Evaluation Board ................................................................................................................... 11

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3 Application Functions ....................................................................................................................... 12

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3.1. General Description ............................................................................................................... 12

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3.2. Pin Assignment ...................................................................................................................... 13

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3.3. Pin Description ...................................................................................................................... 14

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3.4. Operating Modes ................................................................................................................... 17

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3.5. Power Supply ........................................................................................................................ 17
3.5.1. Power Supply Pins ......................................................................................................... 17
3.5.2. Reference Design for Power Supply .............................................................................. 18

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3.6. Power on and down Scenarios ............................................................................................. 19
3.6.1. Power on ........................................................................................................................ 19

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3.6.2. Power down.................................................................................................................... 19
3.6.3. Reset the Module ........................................................................................................... 19

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3.7. SWD Interface ....................................................................................................................... 20
3.8. UART Interfaces .................................................................................................................... 21

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3.8.1. Main Port ........................................................................................................................ 22
3.8.2. Debug Port ..................................................................................................................... 23
3.8.3. The UART Application .................................................................................................... 23
3.9. ADC Interface*....................................................................................................................... 25
3.10. USIM Card Interface .............................................................................................................. 25
3.10.1. USIM Card Application ................................................................................................... 25
3.11. Behaviors of the RI* .............................................................................................................. 27
3.12. Network Status Indication* .................................................................................................... 27

4 Antenna Interface ............................................................................................................................... 29

4.1. RF Reference Design ............................................................................................................ 29
4.2. Reference Design of RF Layout ............................................................................................ 30
4.3. RF Output Power ................................................................................................................... 32
4.4. RF Receiving Sensitivity........................................................................................................ 32
4.5. Operating Frequencies .......................................................................................................... 32

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4.6. Antenna Requirement ........................................................................................................... 33

4.7. RF Cable Welding ................................................................................................................. 33

5 Electrical, Reliability and Radio Characteristics ............................................................................ 35

5.1. Absolute Maximum Ratings................................................................................................... 35
5.2. Operating Temperature ......................................................................................................... 35
5.3. Current Consumption ............................................................................................................ 36

6 Mechanical Dimensions .................................................................................................................... 37

6.1. Mechanical Dimensions of the Module ................................................................................. 37
6.2. Recommended Footprint ....................................................................................................... 39
6.3. Design Effect Drawings of the Module .................................................................................. 40

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7 Storage, Manufacturing and Packaging .......................................................................................... 41

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7.1. Storage .................................................................................................................................. 41

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7.2. Manufacturing and Soldering ................................................................................................ 42

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7.3. Packaging .............................................................................................................................. 42

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7.3.1. Tape and Reel Packaging .............................................................................................. 43

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8 Appendix A References..................................................................................................................... 45

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Table Index

TABLE 1: FREQUENCY BANDS OF BC95 SERIES MODULE .......................................................................... 9

TABLE 2: BC95 KEY FEATURES ..................................................................................................................... 10
TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 14
TABLE 4: PIN DESCRIPTION ........................................................................................................................... 14
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................. 17
TABLE 6: VBAT AND GND PINS....................................................................................................................... 18
TABLE 7: RESET CHARACTERISTICS ........................................................................................................... 20
TABLE 8: PIN DEFINITION OF SWD INTERFACES ........................................................................................ 21

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TABLE 9: PIN DEFINITION OF THE UART INTERFACES .............................................................................. 22
TABLE 10: LOGIC LEVELS OF THE UART INTERFACES .............................................................................. 22

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TABLE 11: PIN DEFINITION OF THE ADC ....................................................................................................... 25

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TABLE 12: PIN DEFINITION OF THE USIM CARD INTERFACE .................................................................... 25

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TABLE 13: BEHAVIORS OF THE RI ................................................................................................................. 27

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TABLE 14: WORKING STATE OF THE NETLIGHT .......................................................................................... 28

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TABLE 15: PIN DEFINITION OF THE RF_ANT ................................................................................................ 29

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TABLE 16: RF OUTPUT POWER (UPLINK GMSK AND BPSK MODULATION) ............................................. 32

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TABLE 17: RF RECEIVING SENSITIVITY (MCS-1, BLER <10%) ................................................................... 32
TABLE 18: OPERATING FREQUENCIES ........................................................................................................ 32

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TABLE 19: ANTENNA CABLE REQUIREMENT ............................................................................................... 33
TABLE 20: ANTENNA REQUIREMENTS.......................................................................................................... 33
TABLE 21: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 35

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TABLE 22: OPERATING TEMPERATURE........................................................................................................ 36
TABLE 23: CURRENT CONSUMPTION ........................................................................................................... 36

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TABLE 24: RELATED DOCUMENTS ................................................................................................................ 45

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TABLE 25: TERMS AND ABBREVIATIONS ...................................................................................................... 45

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Figure Index

FIGURE 1: FUNCTIONAL DIAGRAM ................................................................................................................ 11

FIGURE 2: PIN ASSIGNMENT ......................................................................................................................... 13
FIGURE 3: REFERENCE CIRCUIT FOR THE VBAT INPUT ........................................................................... 18
FIGURE 4: TURN-ON TIMING .......................................................................................................................... 19
FIGURE 5: TURN-OFF TIMING ........................................................................................................................ 19
FIGURE 6: REFERENCE CIRCUIT OF RESET BY USING DRIVING CIRCUIT ............................................. 20
FIGURE 7: REFERENCE CIRCUIT OF RESET BY USING BUTTON ............................................................. 20
FIGURE 8: REFERENCE DESIGN FOR SWD INTERFACE............................................................................ 21

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FIGURE 9: REFERENCE DESIGN FOR MAIN PORT ..................................................................................... 23
FIGURE 10: REFERENCE DESIGN FOR DEBUG PORT ............................................................................... 23

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FIGURE 11: LEVEL MATCH DESIGN FOR 3.3V SYSTEM .............................................................................. 24

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FIGURE 12: SKETCH MAP FOR RS-232 INTERFACE MATCH ...................................................................... 24

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FIGURE 13: REFERENCE CIRCUIT FOR USIM INTERFACE WITH 6-PIN USIM CARD CONNECTOR ...... 26

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FIGURE 14: BEHAVIORS OF RI WHEN THE URC OR SMS IS RECEIVED .................................................. 27

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FIGURE 15: REFERENCE DESIGN FOR NETLIGHT ..................................................................................... 28

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FIGURE 16: REFERENCE DESIGN FOR RF .................................................................................................. 29

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FIGURE 17: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB ...................................................................... 30
FIGURE 18: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB .................................................. 30

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FIGURE 19: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND) .......................................................................................................................................................... 31
FIGURE 20: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE

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GROUND) .......................................................................................................................................................... 31
FIGURE 21: RECOMMENDED RF CABLE WELDING .................................................................................... 34

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FIGURE 22: TOP AND SIDE DIMENSIONS OF BC95 MODULE (UNIT: MM) ................................................. 37

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FIGURE 23: BOTTOM DIMENSIONS OF BC95 MODULE (UNIT: MM) ........................................................... 38
FIGURE 24: RECOMMENDED FOOTPRINT (UNIT: MM) ................................................................................ 39

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FIGURE 25: TOP VIEW OF THE MODULE ...................................................................................................... 40
FIGURE 26: BOTTOM VIEW OF THE MODULE .............................................................................................. 40
FIGURE 27: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 42
FIGURE 28: TAPE DIMENSIONS ..................................................................................................................... 43
FIGURE 29: REEL DIMENSIONS ..................................................................................................................... 44

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1 Introduction
This document defines the BC95 module and describes its hardware interface which are connected with
your application and the air interface.

This document can help you quickly understand module interface specifications, electrical and

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mechanical details. Associated with application note and user guide, you can use BC95 module to design
and set up mobile applications easily.

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1.1. Safety Information

The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating BC95 module. Manufacturers of the
cellular terminal should send the following safety information to users and operating personnel, and
incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for the customer’s failure to comply with these precautions.

Full attention must be given to driving at all times in order to reduce the risk of an

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accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. You must comply with laws and regulations

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restricting the use of wireless devices while driving.

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Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is

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switched off. The operation of wireless appliances in an aircraft is forbidden, so as

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to prevent interference with communication systems. Consult the airline staff about

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the use of wireless devices on boarding the aircraft, if your device offers an

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Airplane Mode which must be enabled prior to boarding an aircraft.

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Switch off your wireless device when in hospitals, clinics or other health care
facilities. These requests are desinged to prevent possible interference with
sensitive medical equipment.

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Cellular terminals or mobiles operating over radio frequency signal and cellular

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network cannot be guaranteed to connect in all conditions, for example no mobile
fee or with an invalid USIM/SIM card. While you are in this condition and need

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emergent help, please remember using emergency call. In order to make or
receive a call, the cellular terminal or mobile must be switched on and in a service

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area with adequate cellular signal strength.

Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,
it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.

In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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2 Product Concept

2.1. General Description

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BC95 is a series of NB-IoT module which contains three variants: BC95-B5, BC95-B8 and BC95-B20. It is

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designed to communicate with Mobile Network Operator infrastructure equipment using the NB-IoT radio

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protocol (3GPP Rel-13). The following table shows the frequency bands of BC95 series module.

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Table 1: Frequency Bands of BC95 Series Module

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Mode BC95-B5 BC95-B8 BC95-B20

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H-FDD 850MHz 900MHz 800MHz

The BC95 is designed to support a very large number of connected terminal devices (up to 100000 per
cell), and it supports adaptive modulation coding and spreading schemes to enable a trade-off between

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coverage and bit rate.

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With an ultra-compact profile of 19.9mm × 23.6mm × 2.2mm, the module can meet almost all the

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requirements for IoT applications, such as smart metering, smart city, security and asset tracking, white
goods, agricultural and environmental monitoring, etc.

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BC95 is an SMD type module with LCC package, which can be easily embedded into applications. It
provides abundant hardware interfaces such as ADC and UART interfaces.

Designed with power saving technique, the BC95 consumes an ultra-low current in SLEEP mode.

The module fully complies with the RoHS directive of the European Union.

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2.2. Key Features

The following table describes the detailed features of BC95 module.

Table 2: BC95 Key Features

Feature Implementation
Supply voltage: 3.1V ~ 4.2V
Power Supply
Typical supply voltage: 3.8V

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Power Saving Mode Maximum power consumption in deep sleep mode: 5uA

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Transmitting Power 23dBm±2dB

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 Operation temperature range: -30°C ~ +75°C1)

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Temperature Range
 Extended temperature range: -40°C ~ +85°C2)

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USIM Interface Support USIM/SIM card: 3.0V

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SWD port:

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 Two lines on SWD port interface: SWD_CLK and SWD_DATA
SWD Interface
 SWD port can be used for firmware upgrading, this function may not

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be supported in the future
Main port:
 Three lines on main port interface

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 Used for AT command communication and data transmission
 Main port can be used for firmware upgrading

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UART Interfaces  Only support 9600bps baud rate

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Debug port:
 Two lines on debug port interface: DBG_TXD and DBG_RXD
 Debug port is used for debugging

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 Only support 921600bps baud rate
Size: (19.9±0.15) × (23.6±0.15) × (2.2±0.2mm)
Physical Characteristics
Weight: Approx 1.6g
Firmware Upgrade Firmware upgrade via SWD port or main port

Antenna Interface Connected to antenna pad with 50 Ohm impedance control

NOTES
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1. 1) Within operation temperature range, the module is 3GPP compliant.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain SMS,
data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio
spectrum and no harm to radio network. Only one or more parameters like P out might reduce in their

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value and exceed the specified tolerances. When the temperature returns to the normal operating
temperature levels, the module will meet 3GPP compliant again.

2.3. Functional Diagram

The following figure shows a block diagram of BC95 and illustrates the major functional parts.

 Radio frequency

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 Power management
 Peripheral interfaces

VBAT

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Load

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Switch

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APT DCDC TX Switch RF_ANT

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Filter

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RF_PA

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RX_SAW

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RF Transceiver
ADC
and Analogue

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RESET
PMU Baseband Main UART

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VDD_EXT Debug UART

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Flash USIM
SRAM
SWD
DCDC

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XTAL
Driver
SPI NETLIGHT
TCXO
38.4M
32K
SPI Flash
LDO (Optional)

Figure 1: Functional Diagram

2.4. Evaluation Board

In order to help you to develop applications with BC95, Quectel supplies the evaluation board (EVB),
RS-232 to USB cable, power adapter, antenna and other peripherals to control or test the module.

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3 Application Functions

3.1. General Description

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BC95 is equipped with 54-pin 1.1mm pitch SMT pads plus 40-pin ground pads and reserved pads. The

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following chapters provide detailed descriptions of these pins:

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 Power supply

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 SWD interface

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 UART interfaces

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 USIM interface

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 ADC interface

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 RF interface

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 NETLIGHT

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3.2. Pin Assignment

RESERVED
RESERVED
RESERVED
RF_ANT

VBAT

VBAT
GND

GND
GND

GND

GND
48
54
53
52
51

47
46
45
44
49
50
RESERVED 1 43 GND
74 73 72 71
GND 2 42 USIM_GND

SWD_DATA 3 92
41 USIM_CLK
94 93 91

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SWD_CLK 4 40 USIM_DATA

RESERVED 5 55 75 90 70 39 USIM_RST

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RESERVED 6 38 USIM_VDD

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56 76 89 69
RESERVED 7 37 RESERVED

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RESERVED 8 57 77 88 68 36 RESERVED

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RESERVED 9 35 RESERVED

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58 78 87 67

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RESERVED 10 34 RI
59 79 86 66

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RESERVED 11 33 RESERVED

RESERVED 12 60 80 85 65 32 RESERVED

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RESERVED 13 31 RESERVED
81 82 83 84
RESERVED 14 30 TXD

RESET 15 61 62 63 64 29 RXD

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RESERVED 16 28 RESERVED

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17
18
19
20
21

22
23
24
25
26
27

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RESERVED
DBG_TXD

RESERVED

RESERVED
DBG_RXD

RESERVED

RESERVED
NETLIGHT

VDD_EXT
RESERVED

ADC

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POWER ADC UART USIM SWD ANT GND RESERVED OTHERS

Figure 2: Pin Assignment

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3.3. Pin Description

The following tables show the pin definition and description of BC95.

Table 3: I/O Parameters Definition

Type Description

IO Bidirectional

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DI Digital input

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DO Digital output

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PI Power input

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PO Power output

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AI Analog input

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AO Analog output

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OD Open drain

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Table 4: Pin Description

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Power Supply

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Pin Name Pin No. I/O Description DC Characteristics Comment

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Main power supply of Vmax=4.2V
VBAT 45, 46 PI the module: Vmin=3.1V
VBAT=3.1V~4.2V Vnorm=3.8V
If unused, keep this
pin open.
Recommend to add a
VDD_ Supply 3.0V voltage for Vnorm=3.0V
26 PO 2.2~4.7uF bypass
EXT external circuit IOmax=20mA
capacitor when using
this pin for power
supply.
2, 43,
47, 48,
GND Ground
51, 52,
54,

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59~66,
71~74,
81~83,
92~94

SWD Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

VOLmax=0.4V
VOHmin=2.4V
SWD_ VILmin=-0.3V
3 IO Serial wire data signal
DATA VILmax=0.6V

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Used for firmware
VIHmin=2.1V upgrading.

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VIHmax=3.3V

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SWD_ VOLmax=0.4V

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4 DI Serial wire clock signal

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CLK VOHmin=2.4V

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Reset Interface

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Pin Name Pin No. I/O Description DC Characteristics Comment

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RPU≈78kΩ

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VIHmax=3.3V Pull up internally.
RESET 15 DI Reset the module
VIHmin=2.1V Active low.
VILmax=0.6V

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Network Status Indicator

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Pin Name Pin No. I/O Description DC Characteristics Comment

Network status VOLmax=0.4V If unused, keep this

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NETLIGHT 18 DO
indication VOHmin=2.4V pin open.

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ADC interface

Pin Name Pin No. I/O Description DC Characteristics Comment

General purpose analog Input voltage range: If unused, keep this

ADC 21 AI
to digital converter -0.3V to 4.2V pin open.

UART Port

Pin Name Pin No. I/O Description DC Characteristics Comment

VILmax=0.6V 3.0V power domain.

RXD 29 DI Receive data VIHmin=2.1V If unused, keep this
VIHmax=3.3V pin open.
3.0V power domain.
VOLmax=0.4V
TXD 30 DO Transmit data If unused, keep this
VOHmin=2.4V
pin open.

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3.0V power domain.

VOLmax=0.4V
RI 34 DO Ring indicator If unused, keep this
VOHmin=2.4V
pin open.

Debug Port

Pin Name Pin No. I/O Description DC Characteristics Comment

VILmax=0.6V
DBG_ If unused, keep these
19 DI Receive data VIHmin=2.1V
RXD pins open.
VIHmax=3.3V
DBG_ VOLmax=0.4V If unused, keep these
20 DO Transmit data

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TXD VOHmin=2.4V pins open.

USIM Interfaces

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Pin Name Pin No. I/O Description DC Characteristics Comment

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USIM_ Power supply for USIM

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38 DO Vnorm=3.0V

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VDD card

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USIM_ VOLmax=0.4V

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39 DO USIM reset All signals of USIM
RST VOHmin=2.4V

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interfaces should be
VOLmax=0.4V
protected against ESD

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VOHmin=2.4V
with a TVS diode
USIM_ VILmin=-0.3V
40 IO USIM data array.
DATA VILmax=0.6V
Maximum trace length
VIHmin=2.1V

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from the module pad
VIHmax=3.3V
to USIM card

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USIM_ VOLmax=0.4V
41 DO USIM clock connector is 200mm.
CLK VOHmin=2.4V

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USIM_
42 USIM ground
GND

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RF Interface

Pin Name Pin No. I/O Description DC Characteristics Comment

RF_ANT 53 IO RF antenna pad Impedance of 50Ω

RESERVED Pins

Pin Name Pin No. I/O Description DC Characteristics Comment

1, 5~14,
16, 17,
22, 23, Keep these pins
RESERVED Reserved
24, 25, unconnected.
27, 28,
31~33,

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35~37,
44, 49,
50,
55~58,
67~70,
75~80,
84~91

3.4. Operating Modes

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BC95 module has three operating modes, which can determine availability of functions for different levels

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of power-saving.

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Table 5: Overview of Operating Modes

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Mode Function

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In Active mode, all functions of the module are available and all

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processors are active. Radio transmission and reception can be
Active
performed. Transitions to Standby mode and Deep-sleep mode can
only be initiated in Active mode.

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In Standby mode, all processors are inactive, but all peripherals can
be active. The system clock is active and power consumption is

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Standby reduced via clock gating and power gating. Standby mode is
Normal Operation
entered when all processors are executing a wait-for-interrupt

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(WFI) instruction.
In Deep-sleep, only the 32kHz RTC is working, which means the

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module can be moved to active state by an RTC interrupt or by an
Deep-sleep external event through the peripherals that are using the RTC. This
mode is entered by all processors setting the “sleep-deep” bit and
then executing a WFI instruction.

3.5. Power Supply

3.5.1. Power Supply Pins

BC95 provides two VBAT pins for connection with an external power supply.

The following table shows the VBAT pins and ground pins.

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Table 6: VBAT and GND Pins

Pin Name Pin No. Description Min. Typ. Max. Unit

VBAT 45, 46 Power supply for the module 3.1 3.8 4.2 V

2, 43, 47, 48, 51, 52,

GND 54, 59~66, 71~74, Ground - 0 - V
81~83, 92~94

3.5.2. Reference Design for Power Supply

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The power design for the module is very important, as the performance of the module largely depends on

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the power source. The power supply is capable of providing the sufficient current up to 0.5A at least. The

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power supply range of the module is from 3.1V to 4.2V. Please make sure that the input voltage will never

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drop below 3.1V even in burst transmission. If the power voltage drops below 3.1V, the module will be

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abnormal.

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For better power performance, it is recommended to place a 100uF tantalum capacitor with low ESR

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(ESR=0.7Ω) and three ceramic capacitors with 100nF, 100pF and 22pF near the VBAT pin. A reference

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circuit is illustrated in the following figure. In principle, the longer the VBAT trace is, the wider it will be.

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VBAT

n f + C1 C2 C3 C4

o
100uF 100nF 100pF 22pF

C
0402 0402

GND

Figure 3: Reference Circuit for the VBAT Input

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3.6. Power on and down Scenarios

3.6.1. Power on

The module can be automatically turned on by supplying power source to VBAT pins.

Delay>535us

VBAT

el
RESET

c t a l
e t i
Figure 4: Turn-on Timing

3.6.2. Power down

u
Q ide n
The module can be turned off by shutting down the VBAT power supply.

n f
Delay>5ms
VBAT

Co RESET

Figure 5: Turn-off Timing

3.6.3. Reset the Module

The module can be reset by driving the reset pin to a low level voltage for a certain time. The reset timing
is illustrated as the following table.

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Table 7: Reset Characteristics

Pin Name Pin No. Description Reset Time

RESET 15 Reset the module, active low >100ms

The recommended circuit is shown as below. An open drain/collector driver or button can be used to
control the RESET pin.

RESET

el
4.7K

t
Reset pulse

e c a l
47K

u n t i
Figure 6: Reference Circuit of RESET by Using Driving Circuit

Q ide
S1
RESET

n f TVS

Co Close to S1

Figure 7: Reference Circuit of RESET by Using Button

3.7. SWD Interface

The module provides one Serial Wire Debug (SWD) interface for firmware upgrading. It is recommended
to reserve SWD interface in order to upgrade firmware. Please note that upgrading via SWD interface
may not be supported in the future.

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Table 8: Pin Definition of SWD Interfaces

Interfaces Name Pin No. Description

SWD SWD_DATA 3 Serial wire data signal

SWD SWD_CLK 4 Serial wire clock signal

The following figure is a reference design for SWD interface.

Module 20-pin JTAG

(DCE)

l
VDD_EXT VCC NC

e
TRST GND

t
TDI GND
SWD_DATA TMS GND

c l
SWD_CLK TCK GND
RTCK GND

e ia
TDO GND

t
RESET RESET GND

u
NC GND
GND

n
NC GND

Q ide
Figure 8: Reference Design for SWD Interface

n f
3.8. UART Interfaces

o
The module provides two UART ports: main port and debug port. The module is designed as a DCE (Data

C
Communication Equipment), following the traditional DCE-DTE (Data Terminal Equipment) connection.

The main port:

 TXD: Send data to RXD of DTE.

 RXD: Receive data from TXD of DTE.
 RI: Ring indicator (when SMS or data is coming, the module will output signal to inform DTE).

The debug port:

 DBG_TXD: Send data to the COM port of computer.

 DBG_RXD: Receive data from the COM port of computer.

The logic levels are described in the following table.

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Table 9: Pin Definition of the UART Interfaces

Interfaces Pin No. Pin Name Description Comment

19 DBG_RXD Receive data 3.0V power domain

Debug Port
20 DBG_TXD Transmit data 3.0V power domain

29 RXD Receive data 3.0V power domain

Main Port 30 TXD Transmit data 3.0V power domain

l
34 RI Ring indicator 3.0V power domain

t e
Table 10: Logic Levels of the UART Interfaces

c a l
Parameter Min. Max. Unit

e t i
VIL -0.1 × VDD_EXT 0.2 × VDD_EXT V

u n
VIH 0.7 × VDD_EXT 1.1 × VDD_EXT V

Q ide
VOL 0.4 V

VOH 2.4 VDD_EXT V

3.8.1. Main Port

n f
o
Main port can be used for AT command communication and data transmission. The baud rate is 9600bps.
Main port can also be used for firmware upgrading through Universal Code Loader tool. For details,

C
please refer to document [2].

When main port is applied in modulation-demodulation process, a reference design for main port
connection is shown as below.

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Module (DCE) PC (DTE)

Main port Serial port

TXD TXD

RXD RXD

RI RING

GND GND

el
Figure 9: Reference Design for Main Port

3.8.2. Debug Port

c t a l
e t i
Debug port can only be used to capture the system’s log with UE Log View tool and output the log. The

u n
baud rate is 921600bps.

Q ide
A reference design for debug port is shown as below.

Module (DCE) PC (DTE)

f
Debug port Serial port

n
DBG_TXD DBG_TXD

Co
DBG_RXD DBG_RXD

GND GND

Figure 10: Reference Design for Debug Port

3.8.3. The UART Application

A reference design of 3.3V level match is shown as below.

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Peripheral Module
1K
TXD RXD

1K
RXD TXD

1K
EINT RI

GND GND

10K

l
Voltage level: 3.3V

t e
Figure 11: Level Match Design for 3.3V System

e c ia l
t
NOTE

u
It is highly recommended to add a resistor divider circuit on the UART port signal lines when the host’s

n
voltage level is 3.3V. For systems with a higher voltage level, a level shifter IC could be used between the

Q ide
host and the module.

The following circuit shows a reference design for the communication between module and PC. As the

f
electrical level of module is 3.0V, a RS-232 level shifter must be used. Please make sure the I/O voltage
of level shifter which connects to module is 3.0V.

o n
C1+ V+ GND

C1- GND GND

C
C2+ VCC 3.3V
Module
C2- V- GND

T1IN T2OUT
1K
TXD T2IN T1OUT

T3IN T5OUT
1K
To PC Main Serial Port
RI T4IN T3OUT

T5IN T4OUT
1
/R1OUT
6
1K 2
RXD R1OUT R1IN 7
3
R2OUT R2IN
10K 8
4
R3OUT R3IN
9
5
GND

RS-232 Level Shifter GND

Figure 12: Sketch Map for RS-232 Interface Match

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Please visit vendor web site to select the suitable RS-232 level shifter IC, such as: http://www.exar.com
and http://www.maximintegrated.com.

3.9. ADC Interface*

The module provides a 10-bit ADC input channel to measure the value of voltage. This ADC is available
in Active mode and Standby mode.

l
Table 11: Pin Definition of the ADC

t e
Name Pin No. Description

c l
ADC 21 Analog to digital converter

u e t ia
NOTE

n
“*” means under development.

Q ide
f
3.10. USIM Card Interface

n
The module contains one USIM interface to allow the module to access to the USIM cards.

Co
3.10.1. USIM Card Application

The USIM interface supports the functionality of the 3GPP specification, which is intended for use with a
USIM application tool-kit.

The USIM interface is powered by an internal regulator in the module. Only 3.0V USIM cards are
supported.

Table 12: Pin Definition of the USIM Card Interface

Pin No. Name Description Comment

Supply power for USIM card. Automatic detection of

38 USIM_VDD
USIM card voltage is 3.0V±5%.

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41 USIM_CLK USIM card clock

40 USIM_DATA USIM card data I/O

39 USIM_RST USIM card reset

42 USIM_GND USIM card ground

A reference circuit for 6-pin USIM card connector is illustrated as the following figure.

USIM_GND 100nF

l
USIM Card Connector
USIM_VDD
VCC GND

e
USIM_RST 22R
RST VPP
Module

t
USIM_CLK 22R
CLK IO

c l
USIM_DATA 22R

e ia
33pF33pF 33pF

u t
TVS

Q ide n
GND GND

Figure 13: Reference Circuit for USIM Interface with 6-pin USIM Card Connector

f
For more information of USIM card connector, please visit http://www.amphenol.com and

n
http://www.molex.com.

o
In order to enhance the reliability and availability of the USIM card in application, please follow the below

C
criteria in USIM circuit design:

 Keep layout of USIM card to the module as close as possible. Keep the trace length as less than
200mm as possible.
 Keep USIM card signals away from RF and VBAT traces.
 Assure the ground between module and USIM card connector short and wide. Keep the trace width
of ground no less than 0.5mm to maintain the same electric potential. The decouple capacitor of
USIM_VDD is less than 1uF and must be near to USIM card connector.
 To avoid cross talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
 In order to offer good ESD protection, it is recommended to add a TVS diode array. For more
information of TVS diode, please visit http://www.onsemi.com. The most important rule is to place the
ESD protection device close to the USIM card connector and make sure the USIM card interface
signal lines being protected will go through the ESD protection device first and then lead to the
module. The 22Ω resistors should be connected in series between the module and the USIM card so

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as to suppress EMI spurious transmission and enhance ESD protection. Please note that the USIM
peripheral circuit should be close to the USIM card connector.
 Place the RF bypass capacitors (33pF) close to the USIM card on all signals lines to improve EMI
suppression.

3.11. Behaviors of the RI*

Table 13: Behaviors of the RI

l
State RI Response

t e
Standby HIGH

c l
When a new SMS comes, the RI changes to LOW and holds low level for about

a
SMS

e i
120ms, then changes to HIGH.

t
URC Certain URCs can trigger 120ms low level on RI.

u
Q ide
HIGH

n
RI 120ms

n f
LOW
URC or
Idle

o
SMS is received

C
Figure 14: Behaviors of RI When the URC or SMS is Received

NOTE

“*” means under development.

3.12. Network Status Indication*

The NETLIGHT signal can be used to drive a network status indication LED. The working state of this pin
is listed in the following table.

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Table 14: Working State of the NETLIGHT

State Module Function

Low The module is not working or not synchronized with network.

High The module is synchronized with network.

A reference circuit is shown as below.

VBAT

l
Module

c t e l
300R

e ia
4.7K

t
NETLIGHT

u
47K

Q ide nFigure 15: Reference Design for NETLIGHT

f
NOTE

n
“*” means under development.

Co

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4 Antenna Interface
The pin 53 is the RF antenna pad. The RF interface has an impedance of 50Ω.

Table 15: Pin Definition of the RF_ANT

l
Name Pin Description

t e
GND 51 Ground

c l
GND 52 Ground

e t ia
RF_ANT 53 RF antenna pad

u n
GND 54 Ground

Q ide
4.1. RF Reference Design

n f
A reference design for RF is shown as below.

o
0R

C
RF_ANT

Module NM NM

Figure 16: Reference Design for RF

BC95 provides an RF antenna pad for antenna connection. There is one grounding pad on both sides of
the antenna pad in order to give a better grounding. Besides, a π-type match circuit is suggested to be
used to adjust the RF performance, and place the π-type matching components as close to the antenna
as possible.

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4.2. Reference Design of RF Layout

For user’s PCB, the characteristic impedance of all RF traces should be controlled as 50 ohm. The
impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant,
the distance between signal layer and reference ground (H), and the clearance between RF trace and
ground (S). Microstrip line or coplanar waveguide line is typically used in RF layout for characteristic
impedance control. The following are reference designs of microstrip line or coplanar waveguide line with
different PCB structures.

t el
e c ia l
u n t
Figure 17: Microstrip Line Design on a 2-layer PCB

Q ide
n f
Co Figure 18: Coplanar Waveguide Line Design on a 2-layer PCB

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el
Figure 19: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)

c t a l
u e n t i
Q ide
n f
Figure 20: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground)

Co
In order to ensure RF performance and reliability, the following principles should be complied with in RF
layout design:

 Use impedance simulation tool to control the characteristic impedance of RF traces as 50 ohm.
 The GND pins adjacent to RF pins should not be hot welded, and should be fully connected to
ground.
 The distance between the RF pins and the RF connector should be as short as possible, and all the
right angle traces should be changed to curved ones.
 There should be clearance area under the signal pin of the antenna connector or solder joint.
 The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground could help to improve RF performance. The distance between
the ground vias and RF traces should be no less than two times the width of RF signal traces (2*W).

For more details about RF layout, please refer to document [3].

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4.3. RF Output Power

Table 16: RF Output Power (Uplink GMSK and BPSK Modulation)

Frequency Max. Min.

900MHz 23dBm±2dB <-40dBm

850MHz 23dBm±2dB <-40dBm

l
800MHz 23dBm±2dB <-40dBm

t e l
NOTE

c a
This design is compliant with the NB-IoT radio protocol 3GPP Rel-13.

u e n t i
Q ide
4.4. RF Receiving Sensitivity

f
Table 17: RF Receiving Sensitivity (MCS-1, BLER <10%)

n
Frequency Receive Sensitivity

o
900MHz -129dBm

C
850MHz -129dBm

800MHz -129dBm

4.5. Operating Frequencies

Table 18: Operating Frequencies

Frequency Receive Transmit

900MHz 925~960MHz 880~915MHz

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850MHz 869~894MHz 824~849MHz

800MHz 791~821MHz 832~862MHz

4.6. Antenna Requirement

The following table shows the requirement on NB-IoT antenna.

l
Table 19: Antenna Cable Requirement

t e
Frequency Range Requirement

c l
791-960MHz Insertion Loss: <1dB

u e
Table 20: Antenna Requirements

t ia
Q ide n
Type Requirements

Frequency Range 791-960MHz

f
VSWR ≤2

n
Gain (dBi) ≥1

o
Max Input Power (W) 5

Input Impedance (Ω)

C
50

Polarization Type Linear

4.7. RF Cable Welding

Welding the RF cable to RF pad of module correctly will reduce the loss on the path of RF, please refer to
the following example of RF cable welding.

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l
Figure 21: Recommended RF Cable Welding

c t e l
u e t ia
Q ide n
n f
Co

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5 Electrical, Reliability and Radio

Characteristics

l
5.1. Absolute Maximum Ratings

t e
Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are

c l
listed in the following table.

e t ia
Table 21: Absolute Maximum Ratings

u n
Parameter Min. Max. Unit

Q ide
VBAT -0.3 +4.2 V

Peak Current of Power Supply 0 0.3 A

f
RMS Current of Power Supply 0 0.25 A

n
Voltage at Digital Pins -0.3 +3.0 V

o
Voltage at Analog Pins -0.3 +4.2 V

C
Voltage at Digital/Analog Pins in Power Down Mode -0.25 +0.25 V

5.2. Operating Temperature

The operating temperature is listed in the following table.

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Table 22: Operating Temperature

Parameter Min. Typ. Max. Unit

Operation Temperature Range1) -30 +25 +75 ºC

Extended Operation Range2) -40 +85 ºC

NOTES
1)
1. Within operation temperature range, the module is 3GPP compliant.
2)

l
2. Within extended temperature range, the module remains the ability to establish and maintain SMS,
data transmission, etc. There is no unrecoverable malfunction; there are also no effects on radio

e
spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their

t
value and exceed the specified tolerances. When the temperature returns to the normal operating

c l
temperature levels, the module will meet 3GPP compliant again.

u e
5.3. Current Consumption

t ia
Q ide n
The values of current consumption are shown below.

f
Table 23: Current Consumption

n
Parameter Description Conditions Min. Typ. Max. Unit

o
Deep sleep state Power saving mode 5 uA

C
Standby state Idle mode 6 mA
IVBAT
3GPP data transfer (23dBm) 250 mA
Active state
3GPP data receiving 61 mA

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6 Mechanical Dimensions
This chapter describes the mechanical dimensions of the module.

l
6.1. Mechanical Dimensions of the Module

c t e l
u e t ia
Q ide n
n f
Co
Figure 22: Top and Side Dimensions of BC95 Module (Unit: mm)

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t el
e c ia l
u n t
Q ide
n f
o
Figure 23: Bottom Dimensions of BC95 Module (Unit: mm)

C
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6.2. Recommended Footprint

t el
e c ia l
u n t
Q ide
n f
Co Figure 24: Recommended Footprint (Unit: mm)

NOTES

1. For easy maintenance of the module, please keep about 3mm between the module and other
components in the host PCB.
2. All RESERVED pins must not be connected to GND.
3. All dimensions are in millimeters.

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6.3. Design Effect Drawings of the Module

t el
e c ia l
t
Figure 25: Top View of the Module

u
Q ide n
n f
Co
Figure 26: Bottom View of the Module

NOTE

These are design effect drawings of BC95 module. For more accurate pictures, please refer to the
module that you get from Quectel.

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7 Storage, Manufacturing and

Packaging

l
7.1. Storage

t e
BC95 module is stored in a vacuum-sealed bag. The storage restrictions are shown as below.

c a l
1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH.

u e t i
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other

n
high temperature processes must be:

Q ide
 Mounted within 72 hours at the factory environment of ≤30ºC/60% RH.
 Stored at <10% RH.

f
3. Devices require baking before mounting, if any circumstance below occurs:

n
 When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity
is >10% before opening the vacuum-sealed bag.

o
 Device mounting cannot be finished within 72 hours at factory conditions of ≤30ºC/60%

C
4. If baking is required, devices may be baked for 48 hours at 125ºC±5ºC.

NOTE

As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (125ºC) baking. If shorter baking time is desired, please refer to the
IPC/JEDECJ-STD-033 for baking procedure.

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7.2. Manufacturing and Soldering

Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil for the module is recommended to be 0.15mm. For more details, please refer to
document [1].

It is suggested that the peak reflow temperature is 235 ~ 245ºC (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 260ºC. To avoid damage to the module caused by repeatedly heating, it is

l
suggested that the module should be mounted after reflow soldering for the other side of PCB has been
completed. Recommended reflow soldering thermal profile is shown below.

t e l
ºC

c
Preheat Heating Cooling
250

e ia
Liquids Temperature

t
217

u
200
200ºC

n
40s~60s

Q ide
160ºC
Temperature

150
70s~120s

f
100

n
Between 1~3ºC/s

o
50

C
0 50 100 150 200 250 300 s

Time

Figure 27: Reflow Soldering Thermal Profile

7.3. Packaging

The modules are stored inside a vacuum-sealed bag which is ESD protected. It should not be opened
until the devices are ready to be soldered onto the application.

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7.3.1. Tape and Reel Packaging

The reel is 330mm in diameter and each reel contains 250 modules.

t el
e c ia l
u n t
Q ide
n f
o
Figure 28: Tape Dimensions

C
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DETAIL:A

t el6
PS

e c ia l
u n t
Q ide
n f
Co DETAIL:A

Figure 29: Reel Dimensions

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8 Appendix A References

Table 24: Related Documents

SN Document Name Remark

l
[1] Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide

t e
[2] Quectel_BC95_Firmware_Upgrade_User_Guide BC95 Firmware Upgrade User Guide

c l
[3] Quectel_RF_Layout_Application_Note RF Layout Application Note

u e t i
Table 25: Terms and Abbreviations

a
Q ide n
Abbreviation Description

ADC Analog-to-Digital Converter

f
DCE Data Communications Equipment (typically module)

n
DTE Data Terminal Equipment (typically computer, external controller)

o
I/O Input/Output

C
IC Integrated Circuit

Imax Maximum Load Current

Inorm Normal Current

kbps Kilo Bits Per Second

LED Light Emitting Diode

PCB Printed Circuit Board

RF Radio Frequency

RMS Root Mean Square (value)

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RTC Real Time Clock

RX Receive Direction

USIM Universal Subscriber Identification Module

SMS Short Message Service

TE Terminal Equipment

TX Transmitting Direction

l
UART Universal Asynchronous Receiver & Transmitter

e
URC Unsolicited Result Code

t l
VSWR Voltage Standing Wave Ratio

c a
Vmax Maximum Voltage Value

e t i
Vnorm Normal Voltage Value

u n
Vmin Minimum Voltage Value

Q ide
VIHmax Maximum Input High Level Voltage Value

VIHmin Minimum Input High Level Voltage Value

f
VILmax Maximum Input Low Level Voltage Value

n
VILmin Minimum Input Low Level Voltage Value

o
VImax Absolute Maximum Input Voltage Value

C
VImin Absolute Minimum Input Voltage Value

VOHmax Maximum Output High Level Voltage Value

VOHmin Minimum Output High Level Voltage Value

VOLmax Maximum Output Low Level Voltage Value

VOLmin Minimum Output Low Level Voltage Value

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