IPC J-STD-001FS

Space Applications
Electronic Hardware
Addendum to
IPC J-STD-001F
Requirements for
Soldered Electrical and
Electronic Assemblies

Developed by the Space Electronic Assemblies J-STD-001 Addendum

Task Group (5-22as) of the Assembly & Joining Processes Committee
(5-20) of IPC

Users of this publication are encouraged to participate in the

development of future revisions.

Contact:

IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
January 2015 IPC J-STD-001FS

Space Applications Electronic Hardware Addendum to

IPC J-STD-001F Requirements for Soldered
Electrical and Electronic Assemblies

Table of Contents 5.1.2 Strand Damage

The following topics are addressed in this Addendum. 5.3.6 Terminal Mounting - Soldering
0.1 Scope 5.5 Soldering to Terminals
0.1.1 Purpose 5.6.3 Wire Staking
0.1.2 Precedence 6.1.1 Lead Forming
0.1.3 Existing or Previously Approved Designs
6.1.2 Termination Requirements
0.1.4 Use
Through-Hole Component Lead
0.1.5 Lead-Free Tin 6.2.2
Soldering
0.1.6 Use of Lead-Free Tin
Lead Termination Requirements for
0.1.6.1 Lead Free Control Plan 6.3.1
Unsupported Holes
0.1.6.2 Mitigation
7 SURFACE MOUNTING OF COMPONENTS
0.1.7 Red Plague (Cuprous Oxide Corrosion)
0.1.7.1 Red Plague Control Plan - Minimum Require- 7.1.2 Surface Mount Device Lead Forming
ments 7.1.3 Unintentional Bending
0.1.7.1.1 Shipping and Storage 7.2 Leaded Component Body Clearance
0.1.7.1.2 Assembly 7.5.6 Castellated Terminations
0.1.7.1.3 Limited Life Article Round or Flattened (Coined) Gull Wing
7.5.8
The following reference numbers are to J-STD-001E Leads
Clauses that are modified or added in this Addendum. 7.5.14 Surface Mount Area Array Packages

1.1 Scope 7.5.15 Bottom Termination Components (BTC)

1.2 Purpose Components with Bottom Thermal Plane

7.5.16
Terminations (D-Pak)
1.5.1 Hardware Defects
7.5.17 Flattened Post Connections
1.7 Order of Precedence
8.3 Post Solder Cleanliness
1.7.1 Conflict
8.3.1 Foreign Object Debris (FOD)
1.10 Personnel Proficiency
Flux Residues and Other Ionic or Organic
1.10.1 Vision Requirements 8.3.2
Contaminants
1.11 Acceptance Requirements 9.1.1 Blistering/Delamination
1.13.2.2 High Frequency Applications 9.1.2 Weave Exposure/Cut Fibers
1.13.2.3 High Voltage Applications 9.1.5 Land/Conductor Separation
3.1 Materials 9.1.9 Burns
3.2 Solder 9.1.11 Measles
3.3 Flux Coating, Encapsulation, Staking and
10
3.9 Tools and Equipment Bonding
4.2.3 Lighting Rework or Touchup of Conformal
10.3.10
Coating
4.5.1 Gold Removal
10.5.1 Staking - Application
4.6 Thermal Protection
10.6 Bonding (Adhesive)
4.9.a
10.6.a
4.9.2 Lead Deformation Limits
10.6.b
4.15.3 Drying/Degassing
10.6.c
4.17 Reflow Soldering
11 Witness (Torque/Anti-Tampering) Stripe
4.18.1 Exposed Surfaces
12.2.2 Visual Inspection
4.18.2 Solder Connection Defects
12.2.3 Sampling Inspection
Partially Visible or Hidden Solder
4.18.3 13.2 Repair
Connections

1
IPC J-STD-001FS January 2015

0.1 Scope This Addendum provides requirements to be and materials meeting any of the following conditions shall
used in addition to, and in some cases, in place of, those be prohibited unless documented and controlled through a
published in IPC J-STD-001F to ensure the reliability of User approved Lead Free Control Plan (LFCP) incorporat-
soldered electrical and electronic assemblies that must sur- ing either a replating or hot solder dip (HSD) process that
vive the vibration and thermal cyclic environments getting completely replaces the lead-free tin finish, or a minimum
to and operating in space. of two mitigation measures.
• Lead-free tin plating, metallization, etc., on external sur-
0.1.1 Purpose When required by procurement faces of parts, mechanical parts, etc., or in internal cavity
documentation/drawings, this Addendum supplements or surfaces, i.e.: hybrid, relay crystal cans, MEMS, etc.
replaces specifically identified requirements of IPC J-STD-
• Any components, printed circuit assemblies (PCAs), etc.,
001, Revision F of July 2014.
assembled with lead-free tin solder alloys except
0.1.2 Precedence The contract takes precedence over SnAg3.7, see paragraph 3.2.
this Addendum, referenced standards and User-approved
drawings. In the event of a conflict between this Addendum 0.1.6.1 Lead Free Control Plan The Lead Free Control
and the applicable documents cited herein, this Addendum Plan (LFCP) shall document controls and processes that
takes precedence. Where referenced criteria of this Adden- assures that assemblies containing lead-free tin solder
dum differ from the published IPC J-STD-001F, this alloys and/or component finishes will perform as intended
Addendum takes precedence. In the event of conflict within the expected parameters of the mission, e.g., envi-
between the requirements of this Addendum and the appli- ronment, duration, etc. At a minimum, the LFCP shall:
cable assembly drawing(s)/documentation, the applicable a. Document the use of lead-free tin technology and pre-
User approved assembly drawing(s)/documentation take vent its use without review and approval by the User
precedence. See Table 1 of this Addendum, clauses 1.7 prior to implementation.
Order of Precedence and 1.7.1 Conflict. b. Incorporate a minimum of two mitigation measures
when the lead-free tin finish is not completely replaced
0.1.3 Existing or Previously Approved Designs This through a replating or HSD process.
Addendum shall not constitute the sole cause for the rede-
c. Include any special design requirements, mitigation
sign of previously approved designs. When drawings for
measures, test and qualification requirements, quality
existing or previously approved designs undergo revision,
inspection and screening, marking and identification,
they should be reviewed and changes made that allow for
maintenance, and repair processes.
compliance with the requirements of this Addendum.
d. Require review and approval by the User prior to
0.1.4 Use This Addendum is not to be used as a stand- implementation.
alone document.
The following documents may be helpful when develop-
Where criteria are not supplemented, the Class 3 require- ing the LFCP:
ments of IPC J-STD-001F shall apply. Where IPC J-STD- • GEIA-STD-0005-1, Performance Standard for Aerospace
001F criteria are supplemented or new criteria are added by and High Performance Electronic Systems Containing
this Addendum, the clause is listed in J-STD-001FS, Table Lead-free Solder
1, Space Applications Requirements, and the entire IPC
• GEIA-STD-0005-2, Standard for Mitigating the Effects of
J-STD-001F clause is replaced by this Addendum except as
Tin Whiskers in Aerospace and High Performance Elec-
specifically noted.
tronic Systems
The clauses modified by this Addendum do not include • GEIA-HB-0005-1, Program Management / Systems Engi-
subordinate clauses unless specifically stated, e.g., 1.4 does neering Guidelines For Managing The Transition To
not include 1.4.1. Clauses, Tables, Figures, etc., in IPC Lead-Free Electronics
J-STD-001F that are not listed in this Addendum are to be
• GEIA-HB-0005-2, Technical Guidelines for Aerospace
used as-published.
and High Performance Electronic Systems Containing
0.1.5 Lead-Free Tin For the purpose of this document, Lead-free Solder and Finishes
lead-free tin is defined as tin containing less than 3 percent • GEIA-STD-0006, Requirements for Using Solder Dip to
lead by weight as an alloying constituent. Solder alloy Replace the Finish on Electronic Piece Parts
SnAg3.7 is exempt from this requirement. See Table 1 of
this Addendum, clause 3.2. 0.1.6.2 Mitigation Components, sub-assemblies, assem-
blies, and mechanical hardware identified as having lead-
0.1.6 Use of Lead-Free Tin The use of components, free tin surfaces, plating, metallization, etc., but which by
assemblies, packaging technology, mechanical hardware, package design or engineering decision are not protected