Programmable Logic Control

XGR CPU Module

XGT Series

CPU XGR-CPUH/F
XGR-CPUH/T
XGR-CPUH/S
Expansion drive XGR-DBST
XGR-DBSF(S)
XGR-DBSH(S)
XGR-DBDT
XGR-DBDF(S)
XGR-DBDH(S)
 Safety Instruction

Before using the product …

For your safety and effective operation, please read the safety instructions
thoroughly before using the product.

► Safety Instructions should always be observed in order to prevent accident

or risk with the safe and proper use the product.

► Instructions are separated into “Warning” and “Caution”, and the meaning of
the terms is as follows;

This symbol indicates the possibility of serious injury

Warning or death if some applicable instruction is violated

This symbol indicates the possibility of slight injury

Caution or damage to products if some applicable instruction
is violated

► The marks displayed on the product and in the user’s manual have the
following meanings.

Be careful! Danger may be expected.

Be careful! Electric shock may occur.

► The user’s manual even after read shall be kept available and accessible to
any user of the product.

1
 Safety Instruction

Safety Instructions when designing

Warning

 Please, install protection circuit on the exterior of PLC to protect

the whole control system from any error in external power or PLC
module. Any abnormal output or operation may cause serious problem
in safety of the whole system.
- Install applicable protection unit on the exterior of PLC to protect
the system from physical damage such as emergent stop switch,
protection circuit, the upper/lowest limit switch, forward/reverse
operation interlock circuit, etc.
- If any system error (watch-dog timer error, module installation error,
etc.) is detected during CPU operation in PLC, the whole output is
designed to be turned off and stopped for system safety. However,
in case CPU error if caused on output device itself such as relay or
TR can not be detected, the output may be kept on, which may
cause serious problems. Thus, you are recommended to install an
addition circuit to monitor the output status.

 Never connect the overload than rated to the output module nor
allow the output circuit to have a short circuit, which may cause a
fire.

 Never let the external power of the output circuit be designed to

be On earlier than PLC power, which may cause abnormal output or
operation.

 In case of data exchange between computer or other external

equipment and PLC through communication or any operation of
PLC (e.g. operation mode change), please install interlock in the
sequence program to protect the system from any error. If not, it
may cause abnormal output or operation.

2
 Safety Instruction

Safety Instructions when designing

Caution
 I/O signal or communication line shall be wired at least 100mm
away from a high-voltage cable or power line. If not, it may cause
abnormal output or operation.

Safety Instructions when designing

Caution
 Use PLC only in the environment specified in PLC manual or
general standard of data sheet. If not, electric shock, fire, abnormal
operation of the product or flames may be caused.

 Before installing the module, be sure PLC power is off. If not,

electric shock or damage on the product may be caused.

 Be sure that each module of PLC is correctly secured. If the

product is installed loosely or incorrectly, abnormal operation, error or
dropping may be caused.

 Be sure that I/O or extension connecter is correctly secured. If

not, electric shock, fire or abnormal operation may be caused.

 If lots of vibration is expected in the installation environment,

don’t let PLC directly vibrated. Electric shock, fire or abnormal
operation may be caused.

 Don’t let any metallic foreign materials inside the product, which
may cause electric shock, fire or abnormal operation.

3
 Safety Instruction

Safety Instructions when wiring

Warning
 Prior to wiring, be sure that power of PLC and external power is
turned off. If not, electric shock or damage on the product may be
caused.

 Before PLC system is powered on, be sure that all the covers of
the terminal are securely closed. If not, electric shock may be caused

Caution
 Let the wiring installed correctly after checking the voltage rated
of each product and the arrangement of terminals. If not, fire,
electric shock or abnormal operation may be caused.

 Secure the screws of terminals tightly with specified torque when

wiring. If the screws of terminals get loose, short circuit, fire or abnormal
operation may be caused.

 Surely use the ground wire of Class 3 for FG terminals, which is

exclusively used for PLC. If the terminals not grounded correctly,
abnormal operation may be caused.

 Don’t let any foreign materials such as wiring waste inside the
module while wiring, which may cause fire, damage on the product
or abnormal operation.

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 Safety Instruction

Safety Instructions for test-operation or repair

Warning
 Don’t touch the terminal when powered. Electric shock or abnormal
operation may occur.

 Prior to cleaning or tightening the terminal screws, let all the

external power off including PLC power. If not, electric shock or
abnormal operation may occur.

 Don’t let the battery recharged, disassembled, heated, short or

soldered. Heat, explosion or ignition may cause injuries or fire.

Caution
 Don’t remove PCB from the module case nor remodel the module.
Fire, electric shock or abnormal operation may occur.

 Prior to installing or disassembling the module, let all the

external power off including PLC power. If not, electric shock or
abnormal operation may occur.

 Keep any wireless installations or cell phone at least 30cm away

from PLC. If not, abnormal operation may be caused.

Safety Instructions for waste disposal

Caution
 Product or battery waste shall be processed as industrial waste.
The waste may discharge toxic materials or explode itself.

5
Safety Instruction

6
 Revision History

Revision History
Version Data Main contents Revised location

V 1.0 ’08. 6 First Edition -

V 1.1 ’08.7 1. Modifying contents -

(2) How to configure redundancy system 2-5
(3) Performance specification 4-1,4-2
(4) Scan Time 5-6,5-8
(5) Program memory 5-28
(6) I/O module skip function 6-19,6-20
(7) Module changing wizard during RUN 6-21
(8) Performance specification 7-1,7-3
(9) Example of calculating consumption 8-5
current/power 11-5
(10) Caution in handling 11-13
(11) Grounding -
2. Adding contents 1-3
(1) XGR redundancy system configuration 2-13
(2) Remote I/O system 5-8
(3) Scan Time 6-20
(4) I/O module skip -
3. Deleting contents 7-1
(1) Max install-able module number in specification

V 1.2 ’09.9 1. Modifying contents -

(1) Performance specification 4-2
(2) redundancy parameter setting window 5-2, CH6
(3) Flag A-6, A-11

V 1.3 ’09.9 1. Adding contents

(1) Contents on redundancy system communication 6-18~20
operation setting (ONE IP Solution)
2. modifying contents
(1) Product list (add new products)
- XGR-DC32, XGR-DMMA 2-1
- XGF-SOEA 2-3
- XGL-EIPT 2-4

1
 Revision History

Version Data Main contents Revised location

V 1.4 ’09.12 1. Adding contents Ch8.1, Ch8.2, Ch8.3

(1) adding contents related to DC power

V 1.5 ’10.03 1. Adding contents

(1) Contents on reset/D.Clear 4-6
(2) Contents on Cnet/FEnet module equipment 2-7
(3) Contents on redundancy parameter 5-8~9
(4) Warning flag App-8
(5) Smart Link wiring diagram and Event input 9-24~25
module specifications
2. Modifying contents
(1) Contents on parameter setting window 5-4, 6-1, 6-14~15
(2) Contents on Fault mask setting 6-20
(3) Module replacement 6-23~24

V 1.6 ’10.10 1. Modifying contents

(1) Modifying contents Ch3.1
(2) Adding contents Ch5.1.2
(3) Adding modules Ch5.1.4
(4) Modifying contents on redundancy parameter Ch5.1.4
(5) Modifying contents on basic parameter Ch6.7.1

V 1.7 ’10.10 1. Modifying contents

(1) Overview Ch1.1
(2) System configuration Ch2.1
(3) Power module Ch8.4.1
(4) Base and expansion cable Ch101.1

V 1.8 ’10.10 1. Adding contents

(1) Adding contents on redundancy parameter Ch5.1.4
(2) Adding contents on redundancy parameter Ch6.8.1
(3) Adding contents on redundancy parameter Ch6.9

2
 Revision History

Version Data Main contents Revised location

V 1.9 ’11.06 1. Adding contents

(1) Adding module on Extension redundancy 1-1, 2-1, 7-2
(2) Adding contents on Extension redundancy 1-3, 1-4, 2-8, 6-25,
8-3, 10-2, 14-28
(3) Adding contents on Flag App-3/7/11/13
(4) Adding optical single module 1-1, 2-1, 2-6, 4-1, 4-2, 7-1

V 2.0 ’13.01 1. Adding contents

(1) Adding Redundancy Expansion Base 2-1, 10-1
(2) Built-in PID Function Ch 14
2.Modifying contents
(1) Modifying EtherNet/IP 1-6, 2-7, 2-13
(2) Modifying U, K Device memory 4-1, 5-32
3. Removing contents
(1) Removing Appendix 1.11 App-21

V 2.1 ’14.06 1. Adding contents

(1) Adding _REFRESH_NG_BASE App-13

V 2.2 ’15.07 1.Modifying contents

(1) Vibration resistance Specifications 3-1
1.Modifying contents
(1) Rated input voltage modified 8-1
(2) Circuit configuration modified 9-2, 9-3, 9-4, 9-5
V 2.3 ‘15.09 (3) Smart Link Model name modified 9-6
(4) Terminology modified (FG  PE) 8-2, 10-1, 10-2, 11-2, 13-1
(5) CPU Processing Speed Unit changed (us  ns) 4.1
(6) List of Configuration Products updated 2.1

1.Modifying contents 9-6

V 2.4 ‘16.03
(1) Smart Link manual supplemented

1. Adding contents
V2.5 ’16.09 (1) Redundancy expansion driver(single mode) 1-1, 2-1, 7-7
updated

3
 Revision History

Version Data Main contents Revised location

V 2.6 ’20.05 LSIS to change its corporate name to LS ELECTRIC Entire

Domain modification
V2.7 ’23.06
(www.lselectric.co.kr -> www.ls-electric.com)

4
 About User's Manual

Thank you for purchasing PLC of LS ELECTRIC Co., Ltd.

Before use, make sure to carefully read and understand the User’s Manual about the functions, performances,
installation and programming of the product you purchased in order for correct use and importantly, let the end user and
maintenance administrator to be provided with the User’s Manual.

The User’s Manual describes the product. If necessary, you may refer to the following description and order accordingly.
In addition, you may connect our website (http://www.ls-electric.com/) and download the information as a PDF file.

Relevant User’s Manuals

Title Description

XG5000 User’s Manual XG5000 software user manual describing online function such as programming,
(for XGK, XGB) print, monitoring, debugging by using XGK, XGB CPU.
XG5000 User’s Manual XG5000 software user manual describing online function such as programming,
(for XGI, XGR) print, monitoring, debugging by using XGI, XGR CPU.
XGK/XGB Instructions & User’s manual for programming to explain how to use instructions that are used
Programming User’s Manual PLC system with XGK, XGB CPU.
XGI/XGR/XEC Instructions & User’s manual for programming to explain how to use instructions that are used
Programming User’s Manual PLC system with XGI, XGR, XEC CPU.
XGK-CPUA/CPUE/CPUH/CPUS/CPUU user manual describing about XGK
XGK CPU User’s Manual
CPU module, power module, base, IO module, specification of extension cable
(XGK-CPUA/E/H/S/U)
and system configuration, EMC standard.
XGI-CPUU/CPUH/CPUS user manual describing about XGI CPU module,
XGI CPU User’s Manual
power module, base, IO module, specification of extension cable and system
(XGI-CPUU/CPUH/CPUS)
configuration, EMC standard.
XGI-CPUZ3/ CPUZ5/ CPUZ7 user manual describing about XGI CPU module,
XGI CPUZ User’s Manual
power module, base, IO module, specification of extension cable and system
(XGI-CPUZ3/ CPUZ5/ CPUZ7)
configuration, EMC standard.
XGR- CPUH/F, CPUH/T user manual describing about XGR CPU module,
XGR Redundant Series
power module, extension drive, base, IO module, specification of extension cable
User’s Manual
and system configuration, EMC standard.
XG-PM software user manual describing online function such as motion
XG-PM User’s Manual
programing, monitoring, debugging by using Motion Control Module.

1
About User's Manual

2
 Table of Contents

◎ TABLE OF CONTENTS ◎

Chapter 1 Overview............................................................................................................................... 1-1~1-8

1.1 About this User Manual .........................................................................................................................1-1

1.2 Configuration of the XGR Redundant System ......................................................................................1-3
1.3 Features of the XGR Redundancy system............................................................................................1-4
1.4 Glossary .................................................................................................................................................1-6

Chapter 2 System Configuration ........................................................................................................ 2-1~2-17

2.1 Product List ..............................................................................................................................................2-1

2.2 Redundancy System .............................................................................................................................2-7
2.2.1 Redundant System Configuration .................................................................................................2-7
2.2.2 Redundancy of CPU system .......................................................................................................2-9
2.2.3 Power Module Redundancy ...................................................................................................... 2-11
2.2.4 Extension Drive Redundancy ....................................................................................................2-12
2.2.5 Extension Base Communication Path Redundancy ................................................................2-12
2.2.6 Example of Redundant System Configuration ........................................................................2-12
2.3 Network System ....................................................................................................................................2-17
2.3.1 Networking among Systems ......................................................................................................2-17
2.3.2 Remote I/O System ......................................................................................................................2-17

Chapter 3 General Specifications ................................................................................................................. 3-1

3.1 General Specifications.............................................................................................................................3-1

Chapter 4 CPU Module......................................................................................................................... 4-1~4-8

4.1 Performance Specifications ....................................................................................................................4-1

4.2 Names and Functions of Parts ...............................................................................................................4-3
4.3 Battery ......................................................................................................................................................4-7
4.3.1 Battery specifications ......................................................................................................................4-7
4.3.2 Cautions for usage..........................................................................................................................4-7
4.3.3 Battery life ........................................................................................................................................4-7
4.3.4 Replacement ...................................................................................................................................4-8

Chapter 5 Program Constitution and Operation Method .................................................................. 5-1~5-33

5.1 Program Basics ......................................................................................................................................5-1

5.1.1 Program Structure and Execution ................................................................................................5-1
5.1.2 Software Program Execution Methodology ................................................................................5-2
5.1.3 Operation of instantaneous interrupt .............................................................................................5-5

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 Table of Contents

5.1.4 Scan Time .......................................................................................................................................5-6

5.2 Program Execution .............................................................................................................................. 5-11
5.2.1 Program Type................................................................................................................................ 5-11
5.2.2 Program Execution ....................................................................................................................... 5-11
5.2.3 Restart Mode ...............................................................................................................................5-12
5.2.4 Task Program ..............................................................................................................................5-14
5.3 Operation Mode .....................................................................................................................................5-23
5.3.1 Operation Mode ..........................................................................................................................5-23
5.3.2 RUN mode ....................................................................................................................................5-23
5.3.3 Stop Mode .....................................................................................................................................5-24
5.3.4 Debug Mode .................................................................................................................................5-25
5.3.5 Switching Operation Mode .........................................................................................................5-25
5.4 Redundancy System Operation .........................................................................................................5-27
5.4.1 Redundancy System Operation ..................................................................................................5-27
5.4.2 Start-up of Redundant System.....................................................................................................5-29
5.5 Memory ..................................................................................................................................................5-31
5.5.1 Program memory..........................................................................................................................5-31
5.5.2 Data memory ................................................................................................................................5-32
5.5.3 Data retain area setting.................................................................................................................5-32

Chapter 6 CPU Module Functions ..................................................................................................... 6-1~6-24

6.1 Self-diagnosis Function ...........................................................................................................................6-1

6.1.1 Scan watchdog timer ......................................................................................................................6-1
6.1.2 I/O Module Check Function ...........................................................................................................6-3
6.1.3 Battery level check ..........................................................................................................................6-3
6.1.4 Saving error log ...............................................................................................................................6-3
6.1.5 Troubleshooting ..............................................................................................................................6-3
6.2 Clock Function .........................................................................................................................................6-4
6.3 Remote Functions ...................................................................................................................................6-7
6.4 Forced On/Off Function of I/O...............................................................................................................6-10
6.4.1 Force I/O Setting ...........................................................................................................................6-10
6.4.2 The point of time of method of forced On/Off process................................................................ 6-11
6.5 Operation history saving function .........................................................................................................6-12
6.5.1 Error history ...................................................................................................................................6-12
6.5.2 Mode change history ....................................................................................................................6-12
6.5.3 Shut down history .........................................................................................................................6-12
6.5.4 System history...............................................................................................................................6-12
6.6 External device failure diagnosis function ............................................................................................6-13
6.7 Redundancy system operation mode ..................................................................................................6-14
6.7.1 Operation mode setting ................................................................................................................6-14
6.7.2 Data synchronization area setting................................................................................................6-16
6.8 Setting operation of communication ...................................................................................................6-17
6.8.1 Automatic master conversion .....................................................................................................6-17
6.8.2 Global status variable ...................................................................................................................6-18
6.8.3 ONE IP Solution ............................................................................................................................6-18
6.9 Fault Mask Function ............................................................................................................................6-20
6.9.1 Applications and operations .........................................................................................................6-20
6.9.2 Fault mask setting .........................................................................................................................6-20
6.9.3 Releasing fault mask ....................................................................................................................6-20
6.10 I/O Module Skip Function....................................................................................................................6-21

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 Table of Contents

6.10.1 Applications and operations .......................................................................................................6-21

6.10.2 Setting and processing I/O data.................................................................................................6-21
6.10.3 Releasing skip function...............................................................................................................6-21
6.11 I/O Base Skip Function........................................................................................................................6-22
6.11.1 Purpose and outline of the operation .........................................................................................6-22
6.11.2 Setting method ............................................................................................................................6-22
6.11.3 Releasing skip function ...............................................................................................................6-22
6.12 Module Replacement Function during Operation .............................................................................6-23
6.12.1 Module replacement in redundant system................................................................................6-23
6.12.2 Replacing I/O module in redundant system..............................................................................6-23
6.12.3 Replacing base module in redundant system ..........................................................................6-24

Chapter 7 Extension Drive Module ...................................................................................................... 7-1~7-3

7.1 Performance specifications .....................................................................................................................7-1

7.2 Identification and Function ......................................................................................................................7-2

Chapter 8 Power Module ...................................................................................................................... 8-1~8-5

8.1 Type and Specification.............................................................................................................................8-1

8.2 Parts’ Names............................................................................................................................................8-2
8.3 Selection...................................................................................................................................................8-3
8.4 Examples of Current Consumption/Power Calculations.......................................................................8-4

Chapter 9 IO Module ........................................................................................................................... 9-1~9-40

9.1 Cautions for Selecting Modules ..............................................................................................................9-1

9.2 Digital Input Module Specifications .........................................................................................................9-3
9.2.1 8 point DC24V input module(source/sink type) ............................................................................9-3
9.2.2 16 point DC24V input module(source/sink type) ..........................................................................9-4
9.2.3 16 point DC24V input module(source type)..................................................................................9-5
9.2.4 32 point DC24V input module(source/sink type) ..........................................................................9-6
9.2.5 32 point DC24V input module(source type)..................................................................................9-7
9.2.6 64 point DC24V input module(source/sink type) ..........................................................................9-8
9.2.7 64 point DC24V input module(source type)..................................................................................9-9
9.2.8 16 point AC110V input module ....................................................................................................9-10
9.2.9 8 point AC220V input module ...................................................................................................... 9-11
9.2.10 8 point AC220V isolated input module ......................................................................................9-12
9.3 Digital Output Module Specifications ....................................................................................................9-13
9.3.1 8 point relay output module ..........................................................................................................9-13
9.3.2 16 point relay output module ........................................................................................................9-14
9.3.3 16 point relay output module(Surge Killer built-in type) ..............................................................9-15
9.3.4 16 point Triac output module ........................................................................................................9-16
9.3.5 16 point transistor output module(sink type) ...............................................................................9-17
9.3.6 32 point transistor output module(sink type) ...............................................................................9-18
9.3.7 64 point transistor output module(sink type) ...............................................................................9-19
9.3.8 16 point transistor output module(source type)...........................................................................9-20
9.3.9 32 point transistor output module(source type)...........................................................................9-21
9.3.10 64 point transistor output module(source type) ........................................................................9-22

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 Table of Contents

9.3.11 8 point transistor isolated output module(sink type)..................................................................9-23

9.4 Digital I/O Combined Module Specifications. .......................................................................................9-24
9.4.1 32 point(DC input transistor output) I/O combined module........................................................9-24
9.5 Event Input Module................................................................................................................................9-25
9.5.1 Event input module .......................................................................................................................9-25

9.6 Applications of Smart Link .....................................................................................................................9-26

9.6.1 Modules accessible to Smart Link ...............................................................................................9-26
9.6.2 Smart Link Components...............................................................................................................9-26
9.6.3 Smart Link Mapping Table............................................................................................................9-27
9.6.4 Smart Link Connection .................................................................................................................9-27
9.6.5 Smart Link Connection Diagram..................................................................................................9-28
9.6.6 Smart Link Specifications & Dimensions.....................................................................................9-38

Chapter 10 Base and Extension Cable ........................................................................................... 10-1~10-5

10.1 Specifications .......................................................................................................................................10-1

10.1.1 Basic base...................................................................................................................................10-1
10.1.2 Extension base ...........................................................................................................................10-1
10.1.3 Sync. Cable .................................................................................................................................10-2

10.1.4 Extension cable...........................................................................................................................10-2

10.1.5 Connector for extension cable (electrical) .................................................................................10-3
10.2 Parts and Names.................................................................................................................................10-4
10.2.1 Basic base...................................................................................................................................10-4
10.2.2 Extension base ...........................................................................................................................10-5

Chapter 11 Installation and Wiring...................................................................................................11-1~11-13

11.1 Installation............................................................................................................................................. 11-1

11.1.1 Installation environment .............................................................................................................. 11-1
11.1.2 Cautions for handling .................................................................................................................. 11-3
11.1.3 Attachment/Detachment of modules ......................................................................................... 11-8
11.2 Wiring..................................................................................................................................................11-10
11.2.1 Power wiring ..............................................................................................................................11-10
11.2.2 I/O Device wiring ....................................................................................................................... 11-11
11.2.3 Grounding wiring .......................................................................................................................11-12
11.2.4 Specifications of wiring cable....................................................................................................11-13

Chapter 12 Maintenance .................................................................................................................. 12-1~12-2

12.1 Repairs and Maintenance ...................................................................................................................12-1

12.2 Routine Inspection ...............................................................................................................................12-1
12.3 Periodic Inspection ..............................................................................................................................12-2

Chapter 13 EMC Compliance. ......................................................................................................... 13-1~13-4

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 Table of Contents

13.1 Requirements Complying with EMC Specifications ........................................................................13-1

13.1.1 EMC specifications .....................................................................................................................13-1
13.1.2 Panel............................................................................................................................................13-2
13.1.3 Cable ...........................................................................................................................................13-3
13.2 Requirements Complying with Low Voltage Direction ......................................................................13-4
13.2.1 Specifications applicable to XGT series ....................................................................................13-4
13.2.2 Selection of XGT series PLC .....................................................................................................13-4

Chapter 14 Built-in PID Function .................................................................................................... 14-1~14-37

14.1 Features ...............................................................................................................................................14-1

14.2 PID Control...........................................................................................................................................14-1
14.3 PID Control Operation .........................................................................................................................14-2
14.3.1 Terms used..................................................................................................................................14-2
14.3.2 PID equation ...............................................................................................................................14-2
14.3.3 P control.......................................................................................................................................14-3
14.3.4 PI control......................................................................................................................................14-4
14.3.5 PID control...................................................................................................................................14-5
14.4 PID Instruction......................................................................................................................................14-6
14.4.1 PID loop state..............................................................................................................................14-6
14.4.2 PID instruction group ..................................................................................................................14-7
14.5 PID Configuration ................................................................................................................................14-9
14.5.1 Common bit area ..................................................................................................................... 14-12
14.5.2 Individual data operation ......................................................................................................... 14-15
14.6 Convenient Functions of PID Instruction......................................................................................... 14-22
14.6.1 Various control method including PID .................................................................................... 14-22
14.6.2 Operation and function of Anti Wind-UP ................................................................................ 14-22
14.6.3 Operation and function of Auto-tuning .................................................................................... 14-22
14.6.4 Operation and function of cascade......................................................................................... 14-23
14.7 Directions of PID Instructions........................................................................................................... 14-24
14.7.1 Hardware configuration ........................................................................................................... 14-24
14.7.2 Program example 1 ................................................................................................................. 14-27
14.7.3 PID control................................................................................................................................ 14-28
14.7.4 AT(Auto-tuning) operation ....................................................................................................... 14-35
14.7.5 Program example 2 ................................................................................................................. 14-36
14.7.6 Cascade operation .................................................................................................................. 14-37

Chapter 15 Troubleshooting ........................................................................................................... 15-1~15-27

15.1 Basic Troubleshooting Procedure ......................................................................................................15-1

15.2 Troubleshooting ...................................................................................................................................15-2
15.2.1 Action when POWER LED is off................................................................................................15-3
15.2.2 Action when WAR. (Warning) LED is on ...................................................................................15-4
15.2.3 Action when ERR. LED is on. ....................................................................................................15-8
15.2.4 Action when RUN/STOP LED is off...........................................................................................15-9
15.2.5 Acton when I/O module does not work properly.................................................................... 15-10
15.2.6 Action when writing program is not possible .......................................................................... 15-12
15.2.7 Action when Sync. cable is not installed properly .................................................................. 15-13
15.2.8 When undesirable master switching occurs .......................................................................... 15-14
15.2.9 When newly added CPU does not join redundant operation ............................................... 15-15

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 Table of Contents

15.2.10 When failing to switch master ............................................................................................... 15-16

15.2.11 When extension cable is disconnected .............................................................................. 15-17
15.2.12 When extension driver gets error .................................................................................. 15-19
15.3 Troubleshooting Questionnaires...................................................................................................... 15-21
15.4 Cases ................................................................................................................................................ 15-22
15.4.1 Trouble types and measures of input circuit .......................................................................... 15-22
15.4.2 Trouble types and measures of output circuit ........................................................................ 15-23
15.5 Error Codes List ................................................................................................................................ 15-25
15.5.1 Error codes during CPU operation ......................................................................................... 15-25

Appendix 1 Flags List ................................................................................................................. App-1~App-18

Appendix 1.1 User Flag ............................................................................................................................ App-1

Appendix 1.2 System Error Representative Flag ................................................................................... App-2
Appendix 1.3 System Error Detail Flag ................................................................................................... App-6
Appendix 1.4 System Warning Representative Flag.............................................................................. App-8
Appendix 1.5 System Warning Detail Flag............................................................................................ App-10
Appendix 1.6 System Operation Status Information Flag .................................................................... App-11
Appendix 1.7 Redundant Operation Mode Information Flag ............................................................... App-16
Appendix 1.8 Operation Result Information Flag.................................................................................. App-17
Appendix 1.9 Operation mode Key Status Flag ................................................................................... App-18
Appendix 1.10 Link Flag (L) List............................................................................................................. App-19
Appendix 1.11 Reserved Word .............................................................................................................. App-21

6
 Chapter 1. Overview

Chapter 1. Overview

1.1 About this User Manual

This User Manual describes the performance specifications and operation procedures of the redundancy system including the XGR-
CPU, in addition to the configuration of communication system and the use of special module in relation to the redundancy system.

This User Manual provides the basic specifications of the CPU module, power module, I/O module, main/expansion base of
redundancy and expansion drive module, which are applied to the basic system of redundancy (XGR).

Classification Model Name

Redundancy CPU Module XGR−CPUH/F, XGR−CPUH/T, XGR-CPUH/S
Expansion Drive Module XGR−DBST, XGR−DBSF(S), XGR−DBSH(S)
Redundancy Power Module XGR−AC12, XGR-AC22, XGR-AC13, XGR-AC23, XGR-DC42
I/O Module XGI−□□□□, XGQ−□□□□
Redundancy Basic Base XGR-M02P, XGR-M06P
Redundancy Expansion Base XGR-E12P, XGR-E12H
Redundancy Expansion Drive Module XGR-DBDT, XGR-DBDF(S), XGR-DBDH(S)
For programming, see following manuals in addition to this User Manual;

 XG5000 User Manual (for XGI/XGR)

 XGI/XGR Instruction User Manual

For further information on the special and communication modules, see the manuals and technical data pertinent to each special
module and communication modules.

 User Manuals of the special modules

 User Manuals of the communication modules

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 Chapter 1. Overview

This User Manual contains following information.

Chapter Subject Description

Chap. 1 Overview Describes the configuration, product features, and glossaries.
Describes the product types and system configurations available for the XGR
Chap. 2 System Configuration
series.
Chap. 3 General Specifications Provides the common specifications of the modules used in the XGR series.
CPU Module
Chap. 4 Specifications
Configuration of program Describes the performance, specification, and operation of the XGR-CPUH.
Chap. 5 and operation method
Chap. 6 CPU Module Functions

Chap. 7 Expansion driver module

Chap.8 Power Module Describes the specifications and use of the I/O module and power module,
IO Module except the CPU module.
Chap. 9
Chap. 10 Base Expansion Cable

Chap. 11 Provides the guidelines for installation, wiring and precaution of the PLC system
Installation and Wiring
to secure system reliability.
Provides the items and methodology of maintenance for PLC system to
Chap. 12 Maintenance
prevent failure throughout the service life.
Provides the system construction and configuration in response to the EMC
Chap. 13 EMC Compliance
specification.
Describes various errors and faults which may occur in the system and
Chap. 14 Troubleshooting
countermeasures..
Append. 1 Flag List Describes the types and contents of various flags.
Append. 2 Dimensions Provides the external size of the CPU, I/O module and base.
Append. 3 GLOFA Compatibility
Append. 4 Warranty

Note
1) This User Manual does not describe the special and communication modules and programming.
Refer related manuals for the information.

2) XGR CPU is a kind of XGT PLC system whose CPU type can be classified as follows;
① XGK Series: the XGT PLC systems having the CPU using Master-K language(LS language)
② XGI Series: the XGT PLC systems having single CPU using IEC language
③ XGR Series: the XGT PLC systems having redundant CPUs using IEC language

1-2
 Chapter 1. Overview

1.2 Configuration of the XGR Redundant System

XGR Redundancy System provides reliable solution for various types of redundancy systems required in diversified applications. The
XGR Redundancy System is economical and user-convenient because the system makes use of the most resources of the XGI
system, added with the components for redundancy.

Redundancy

 CPU module redundancy

 Power module redundancy
 Ethernet communication module redundancy

Modules for redundancy

 2 redundant CPUs [optical, electrical]

 5 types of power module [standard, large output] – AC110V, AC220V, DC24V individual
 Redundant bases [2, 6 slots: 2, 6 communication modules can be installed]
 3 types of expansion drive modules [per media class: optical, electrical, mixed]
 Expansion base [12 slots: according to consumption current]
 3 types of redundancy expansion drive modules [per media: Optical, electrical, mixed]
 Redundancy expansion base [12 slots: according to consumption current]

CPU Module

 IEC 61131-3 language supported, ladder process rate of 42ns/command, 3MB (Approx. 128kstep) program capacity,
131,072 of I/O points
 1Gbps optical communication for CPU synchronization
 Built-in I/O communication master
 Provides 2 types of CPU module according to the I/O communication media [optical, electrical]

Redundant system Network

•
 Expansion drive module
 Topology: ring [bus type operation activated in case of one error]
 Provides optical, electrical, and combined media
 Applied with 100Mbps class industrial Ethernet technology
 Max. available I/O points: 23,808 (31 stations x 12 slots x 64 points)

Programming Tool
 Integrated control of all the all XGT types with XG5000 – XGK, XGI, XGB, XGR
 Convenient programming, various motoring function, diagnosis function, edit funtion
 Supports various IEC type languages: LD, ST, SFC, IL[Only view function]
 Supports communication parameter setting, frame monitoring function through XG-PD
 Supported with software packages per functionalities for motion, APM, temperature controller, etc.

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 Chapter 1. Overview

1.3 Features of the XGR Redundancy system

XGR Redundancy System provides optimized solutions in various applications with its superb performance and convenience features.

High performance

 CPU process rate: 42ns / command

 High speed backplane
 Large capacity control points: max. 131,072 points
 Sufficient program capacity (max. 128ksteps)
 Sufficient data memory: 25MB
 Long data type (64bit) and high speed real number operation (single, double) provided
 Switching operation with minimum delay : if the master CPU fails, operation is switched to the backup CPU within
50ms

Minimum size implemented

 Compact panel can be implemented with the minimum size among the class
 CPU module: Width(55 mm) * Height(98 mm) * Depth(90 mm)
 Power module
1) XGR-AC12/AC22: Width (55 mm) * Height (98 mm) * Depth (90 mm)
2) XGR-AC13/AC23: Width (55 mm) * Height (98 mm) * Depth (110 mm)

Easy expansion using network

 Easy installation of expansion bases using network cable
 Up to 31 remote bases can be added
 Software program can be uploaded/downloaded via online access from expansion base
 Communication master module on expansion base enables the installation of smart I/O at anywhere

Improved maintenance maintain ace by system history, network ring configuration, etc.

 Provides system analysis data including the operation, error, and system histories
 Network ring configuration enables normal system operation even when a network cable fails
 Provides network monitoring and protocol monitoring functions
 If communication fails (smart I/O, etc.), the failed channel can be monitored (by monitoring the flag via HMI).
 Graphic display of system configuration
 Module Changing Wizard enables safe replacement of module during operation
 Base Changing Wizard enables safe replacement of base during operation

IEC 61131-3 (standard language) specification compliance

 Provides IEC standard LD, ST, SFC, IL(only view function)

 Provides IEC standard program structure and data type

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 Chapter 1. Overview

Supports various communication functions

 Open network enables convenient interface with other products (Ethernet, Profibus, DeviceNet, RS-232C, RS-
422/485, etc.)
 Supports various protocols for improved convenience
 Up to 24 communication master modules (12 high speed links, 8 P2Ps) can be mounted on one redundant system.
 Simple and east network diagnosis using network and communication frame monitoring function
 RAPIEnet module can be inserted on basic base

Diverse I/O modules are provided for easy system configuration

 8, 16, 32, and 64 point modules are provided (8/16 point modules for relay output)
 Single input, single output, mixed I/O module provided

Extended applications with enhanced analog function

 Analog modules can be connected to the slots of all the expansion bases (max. 250 output modules, 139 input
modules)
 Supports various applications with insulated type analog and temperature module
 Convenient use by special parameter settings and flags
 Strengthened debugging function by monitoring flags and data and changing the setting value through special monitor
display window

Provides integrated programming & engineering environments

 Integrated control of all the all XGT types with XG5000 – XGK, XGI, XGB, XGR
 Convenient programming, various motoring function, diagnosis function, edit funtion
 Supports various IEC type languages: LD, ST, SFC, IL[Only view function]
 Supports communication parameter setting, frame monitoring function through XG-PD
 Supported with software packages per functionalities for motion, APM, temperature controller, etc.

Provides diversified additional function

 Battery backup and flash memory backup for software programs

 Various restart mode(warm, cold)
 Task program process
 Forced ON/OFF of I/O
 Clock
 Module changing wizard available during operation
 Fault mask function
 Module skip function
 Extensive operation history supported (system history)
 Detail error report supported (error history)
 LED indication of operation status
 Dot matrix indicator: display operation information and abnormal matters in texts.

PID Function
 Max. 256 loops supported
 Parameter setting using XG5000, convenient monitoring on loop status through Trend monitor
 Easy control parameter setting using improved auto-tuning function
 Provides various control modes including normal/reverse combination operation, 2 step SV PID control, cascade
control, etc.
 Safety secured by diversified alarm functions including PV MAX, PV change, etc.

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 Chapter 1. Overview

1.4 Glossary

This section provides the major terms and their definitions, used in this Manual.

Terms Definition Remark

CPU module,
A standardized component having a specific function to constitute a power module,
Module
system. E.g., I/O board designed to be inserted into base. I/O module,
etc.
The CPU module running the present software program. Automatically
Master CPU Module switched to backup CPU module when the operation is stopped and
transfers the control

The control function of the master CPU module is transferred to this

Standby CPU Module standby CPU module in case of failure, and this standby CPU module
becomes the master CPU module.
This base can accommodate the CPU module and Ethernet
communication module.
Redundant Basic ▪Master CPU system: the redundant basic system whose CPU module
Base is operating as the master.
▪Standby CPU system: the redundant basic base whose CPU module is
operating as backup mode.
Expansion base where power module, I/O module, and
Redundant Expansion special/communication module can be installed. (The communication
Base module can be any module except the EtherNet/IP , FEnet and 서식 있음: 글꼴: (영어) Arial, (한글) 굴림체, 축소: 0.2
RAPIEnet). pt
Expansion Drive The module for communication between bases. It also enables setting the
Module base numbers (1~31) with a rotary switch

1Gbps optical cable for connection between the CPU modules of a

Synchronous cable
redundant system

As a part of redundant system, the system is constructed to enable

CPU redundancy continuous operation when the master CPU module fails using a backup
CPU module

A system constructed with redundant power modules to enable continuous

Power redundancy
system operation when a module of the base fails

A module or a set of module which is the minimum unit of a PLC system Basic unit.
Unit
operation. A PLC system comprises units and/or sets of units Expansion unit

A system consists of PLC and peripheral devices and can be controlled

PLC System
with user software program

A programming tool for developing software program, editing and

XG5000
debugging
Replaceable
A software used for the replacement of CPU module during PLC special
Module Changing
operation. Power module, I/O module, some of the special modules, and modules:
Wizard
base module can be replaced with this software A/D,D/A,
HSC,RTD

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 Chapter 1. Overview

Terms Definition Remark

Starting a PLC system and user program after initializing all data (variables
Cold Restart and programs such as I/O image area, internal register, timer, counter, etc.)
automatically or manually

Along with the function that notifies user-program about power OFF
Warm Restart incidents, the user programs are restarted with holding previous data
according to setting, after a power OFF.

The internal memory area of the CPU module installed to maintain I/O
I/O Image Area
status

Cnet Computer Network

FEnet Fast Ethernet Network

Pnet Profibus-DP Network

Dnet DeviceNet Network

Rnet Remote Network

RTC Real Time Clock. The generic IC with a built-in clock function

The timer which monitors the preset running time of a user program, and
Watchdog Timer
triggers alarm if the process fails to be completed within preset time

The operation units which do not store the operation result in the
Function instructions, such as the 4 arithmetical and comparison operations, and
output the results of the inputs immediately

The operation units which store the operation results in the instruction, such
Function Block
as timer and counter, and use the results over multiple scans

%IX0.0.2
The variables used without declaring name and type. For example, I, Q, %QW1.2.1
Direct Variable
and M areas are direct variables. %MD1234,
etc.
The variables used with names and type declared by user.
Automatic Symbolic - if declared as‘INPUT_0’=%IX0.0.2, ‘RESULT’=%MD1234, ‘INPUT_0’
Variable and ‘RESULT’ names can be used in the program instead of %IX0.0.2
and %MD1234.

The condition for a program start-up, such as fixed cycle task, internal
Task
contact point task, and initialization task

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 Chapter 1. Overview

Terms Definition Remark

The method wherein the current enters PLC input terminal from switch when
the input signal is turned ON

PLC Z: input
Sink Input
+ S/W
I impedance
Z
− Common

The method wherein the current enters switch from PLC input terminal when
the input signal is turned ON
Common PLC

Source Input +
Current Z
−
S/W

Sink Output The method wherein the current enters output terminal from load when the
PLC output is ON

PLC
Load
Output +
Contact Current

−
Common

The method wherein the current enters from output terminal when the PLC
output is ON

PLC Common

Source Output +
Current

Load
−
Output
Contact

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 Chapter 2. System Configuration

Chapter 2. System Configuration

The XGR Series offer various products for basic systems, computer communication and network systems.
This Chapter describes the configuration method and features of each system.

2.1 Product List

The product line of the XGR Series is as follows.

(1) Products exclusive for redundancy

Product Model Description

• Max. I/O points: 23,808, program capacity: 3MByte (including UPLOAD)
XGR-CPUH/F
• For optical communication (multi mode, max. distance: 2km)
Redundancy CPU • Max. I/O points: 23,808, program capacity: 3MByte (including UPLOAD)
XGR-CPUH/S
Module • For optical communication (single mode, max. distance: 15km)
• Max. I/O points: 23,808, program capacity: 3MByte (including UPLOAD)
XGR-CPUH/T
• For electrical communication
• For mounting redundancy CPU module, power redundancy
XGR-M02P
Redundancy Basic • Available for 2 communication modules
Base • For mounting redundancy CPU module, power redundancy
XGR-M06P
• Available for 6 communication modules
• For mounting I/O module, power redundancy
XGR-E12P
Redundancy Expansion • Available for 12 I/O modules
Base • For mounting I/O module, power redundancy
XGR-E08P
• Available for 8 I/O modules
• For mounting I/O module, power redundancy
Redundancy Expansion
XGR-E12H • Extension drive module redundancy
Driver Base
• Available for 12 I/O modules
• Communication module for XGR expansion base operation.
XGR-DBST
Electrical media
• Communication module for XGR expansion base operation.
XGR-DBSF
Optical media (multi mode, max. distance: 2km)
Expansion Drive • Communication module for XGR expansion base operation.
XGR-DBSH
Module Electrical/optical media mixing (multi mode, max. distance: 2km)
• Communication module for XGR expansion base operation.
XGR-DBSFS
Optical media (single mode, max. distance: 15km)
• Communication module for XGR expansion base operation.
XGR-DBSHS
Electrical/optical media mixing (single mode, max. distance: 15km)
• Communication module for XGR expansion drive redundancy base
XGR-DBDT
operation. Electrical media
• Communication module for XGR expansion drive redundancy base
XGR-DBDF
operation. Optical media (multi mode, max. distance: 2km)
• Communication module for XGR expansion drive redundancy base
Expansion Drive XGR-DBDH operation. Electrical/optical media mixing
Redundancy Module (multi mode, max. distance: 2km)
• Communication module for XGR expansion drive redundancy base
XGR-DBDFS
operation. Optical media (single mode, max. distance: 15km)
• Communication module for XGR expansion drive redundancy base
XGR-DBDHS operation. Electrical/optical media mixing
(single mode, max. distance: 15km)

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 Chapter 2. System Configuration

Product Model Description

XGR-AC12 • DC5V: 5.5A, AC110V input

XGR-AC22 • DC5V: 5.5A, AC220V input

Power Module XGR-AC13 • DC5V: 8.5A, AC110V input

XGR-AC23 • DC5V: 8.5A, AC220V input

XGR-DC42 • DC5V: 7.5A, DC24V input

XGC-F201 • LC type optical cable (multi core), length: 2 m
Sync. Cable XGC-F301 • LC type optical cable (multi core), length: 3 m
XGC-F501 • LC type optical cable (multi core), length: 5 m
Dustproof module XGR-DMMA • dustproof module for not used power module slot

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 Chapter 2. System Configuration

(2) Common Products for XGT Series

(a) Digital I/O Module

Product Model Description
XGI-D21A • DC 24V input, 8 points (current source / sink input)
XGI-D21D • DC 24V Diagnostic Input, 8 point (Current sink input)
XGI-D22A • DC 24V input, 16 points (current source / sink input)
XGI-D24A • DC 24V input, 32 points (current source / sink input)
XGI-D28A • DC 24V input, 64 points (current source / sink input)
Digital Input Module XGI-D22B • DC 24V input, 16 points (current source input)
XGI-D24B • DC 24V input, 32 points (current source input)
XGI-D28B • DC 24V input, 64 points (current source input)
XGI-A12A • AC 110V input, 16 points
XGI-A21A • AC 220V input, 8 points
XGI-A21C • AC 220V isolated input, 8 points
XGQ-RY1A • Relay output, 8 points (2A, single COM.)
XGQ-RY1D • Diagnostic Relay output, 8 point (for 2A, single COM.)
XGQ-RY2A • Relay output, 16 points (2A)
XGQ-RY2B • Relay output, 16 points (2A), Varistor incorporated.
XGQ-TR2A • Transistor output, 16 points (0.5A, sink output)

XGQ-TR4A • Transistor output, 32 points (0.1A, sink output)

Digital Output Module
XGQ-TR8A • Transistor output, 64 points (0.1A, sink output)
XGQ-TR2B • Transistor output 16 points (0.5A, source output)
XGQ-TR4B • Transistor output 32 points (0.1A, source output)

XGQ-TR8B • Transistor output 64 points (0.1A, source output)

XGQ-SS2A • Triac output, 16 points (1A)

XGQ-TR1C • Transistor isolated output, 8 points (2A)

Digital I/O Mixed • DC 24V input, 16 points(current source / sink input)
XGH-DT4A
Module • Transistor output, 16 points (0.1A, sink output)

Anti-vibration Module XGT-DMMA • Anti-vibration module for unused slots

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 Chapter 2. System Configuration

(b) Process and Motion Control Modules

Product Model Description Remarks
• Voltage Input: 8 channel
XGF-AV8A -
• DC 1 ~ 5V / 0 ~ 5V / 0 ~ 10V / −10 ~ +10V
• Current Input: 8 channel
XGF-AC8A -
• DC 4 ~ 20mA / 0 ~ 20mA
XGF-AD08A • Voltage/Current Input: 8 channels -
Analog input
• Voltage/Current Input: 4 channels
Module XGF-AD4S -
• Insulation between channels
XGF-AD16A • Voltage/Current Input: 16 channels -
• 2-wire voltage/current input: 4 –channel, insulation
XGF-AW4S between channels -
• 2-wire transmitter driver power supported
• Voltage Output: 4 channels
XGF-DV4A -
• DC 1 ~ 5V / 0 ~ 5V / 0 ~ 10V / −10 ~ +10V
• Current Output:: 4 channels
XGF-DC4A -
• DC 4 ~ 20mA / 0 ~ 20mA
• Current Output:: 4 channels
XGF-DV4S -
Analog output • Insulation between channels
Module • Current Output:: 4 channels
XGF-DC4S -
• Insulation between channels
• Voltage Output: 8 channels
XGF-DV8A -
• DC 1 ~ 5V / 0 ~ 5V / 0 ~ 10V / −10 ~ +10V
• Current Output:: 8 channels
XGF-DC8A -
• DC 4 ~ 20mA / 0 ~ 20mA
Analog I/O • Voltage/Current input 4 channels
XGF-AH6A -
Module • Voltage/Current output 2 channels
HART I/F
• Current Input : 4 channel
Analog Input XGF-AC4H -
• HART I/F, DC 4 ~ 20mA
Module
HART I/F
• Current Output : 4 channel
Analog Output XGF-DC4H -
• HART I/F, DC 4 ~ 20mA
Module
Thermocouple • Temperature (T/C) Input, 4 channels,
XGF-TC4S -
Input Module • Insulation between channels
XGF-RD4A • Temperature (RTD) Input, 4 channels -
RTD Input • Temperature (RTD) Input, 4 channels
XGF-RD4S -
Module • Insulation between channels
XGF-RD8A • Temperature (RTD) Input, 8 channels -
• Control loop : 4 loops
XGF-TC4UD • Input(4 channels, TC/RTD/voltage/current), -
Temp. control
Output(8 channels, TR/current)
Module
• Control loop: 4 loops
XGF-TC4RT -
• input (4 channels, RTD), Output (8 channels, TR)
• Voltage Input type (Open Collector type)
XGF-HO2A -
• 200kHz, 2 channel
High speed
• Differential Input type (Line Driver type)
Counter XGF-HD2A -
Module • 500kHz, 2 channel
• Voltage Input type (Open Collector type)
XGF-HO8A -
• 200kHz, 8 channel

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 Chapter 2. System Configuration

Product Model Description Remarks

XGF-PO3A • Pulse output (Open Collector type), 3 axes -

XGF-PO2A • Pulse output (Open Collector type), 2 axes -

XGF-PO1A • Pulse output (Open Collector type), 1 axis -

XGF-PD3A • Pulse output (Line Drive type), 3 axes -

XGF-PD2A • Pulse output (Line Drive type), 2 axes -

XGF-PD1A • Pulse output (Line Drive type), 1 axis -

XGF-PO4H • Pulse output (Open Collector type), 4 axes -

Positioning
XGF-PO3H • Pulse output (Open Collector type), 3 axes -
Module XGF-PO2H • Pulse output (Open Collector type), 2 axes -

XGF-PO1H • Pulse output (Open Collector type), 1 axes -

XGF-PD4H • Pulse output (Line Drive type), 4 axes -

XGF-PD3H • Pulse output (Line Drive type), 3 axes -

XGF-PD2H • Pulse output (Line Drive type), 2 axes -

XGF-PD1H • Pulse output (Line Drive type), 1 axes -

XGF-PN8A • Network type(EtherCat), 8 axes, LS dedicated type -

XGF-PN8B • Network type(EtherCat), 8 axes, Standard type -

Motion Control XGF-M16M • Motion dedicated net (M-II) type, 16 axes -

Module XGF-M32E • Motion dedicated net (EtherCAT) type, 32 axes -
Event Input
XGF-SOEA • DC 24V input, 32 point, Sequence of Event module -
Module
Data Log • USB 2.0, CF2001, Max 16GB
XGF-DL16A -
Module • 32 points (Input: 22 points , Output : 10 points)

Note
Recommendations of selecting USB Cable (To avoid disconnection with XG5000)

1. Recommend that the company’s USB Cable(USB-301A) which is shielded and shorter than 3m.

2. Recommend using USB Hub when connecting up to the PC poor at Noise.

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 Chapter 2. System Configuration

(c) Communication Modules

Product Model Description Remarks
• Fast Ethernet(optical), Master
XGL-EFMF -
• 100/10 Mbps support
FEnet Module • Fast Ethernet(electrical), Master
XGL-EFMT -
(Optical/Elec.) • 100/10 Mbps support
XGL-ESHF • Fast Ethernet Switch module(optical) -
XGL-EH5T • Fast Ethernet Switch module(electrical) -
• Communication Module between PLCs (electrical)
XGL-EIMT -
• 100 Mbps Industrial Ethernet supported
• Communication Module between PLCs (optical)
XGL-EIMF -
• 100 Mbps Industrial Ethernet supported
RAPIEnet • Communication Module between PLCs (electrical / optical)
XGL-EIMH -
• 100 Mbps Industrial Ethernet supported
• Communication Module between PLCs (electrical)
XGL-ES4T • 100 Mbps Industrial Ethernet supported -
• RAPIEnet Switch
• Serial communication
XGL-C22A
• RS-232C, 2 channel
• Serial communication
Cnet Module XGL-C42A -
• RS-422(485), 2 channel
• Serial communication
XGL-CH2A
• RS-232C 1 channel / RS-422(485) 1 channel
• Dedicated Ethernet(optical), Master
XGL-EDMF • Deterministic communication support
FDEnet • 100/10 Mbps support
-
Module(Master) • Dedicated Ethernet(electrical), Master
XGL-EDMT • Deterministic communication support
• 100/10 Mbps support
• for Rnet Master I/F (Smart I/O communication available)
• Fast response speed support(against the existing Fnet
Rnet Module XGL-RMEA module) -
• 1 Mbps base band
• for twisted cable
Profibus-DP XGL-PMEA
• Profibus-DP Master module -
Module XGL-PMEC
Pnet Slave I/F
XGL-PSEA • Profibus-DP Slave module -
module
DeviceNet
XGL-DMEA • DeviceNet Master module -
Module
Ethernet/IP  EtherNet/IP(electric)
XGL-EIPT -
Module  100/10 Mbps support
BACnet/IP I/F  BACNet/IP(electric)
XGL-BIPT -
Module  100/10 Mbps support

Fnet I/F module XGL-FMEA  Field Bus master module -

Note

For the active coupler, optical converter, repeater and block type remote module, see the network related
technical documents.

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 Chapter 2. System Configuration

2.2 Redundancy System

2.2.1 Redundant System Configuration

The configuration of the basic system incorporating the redundant basic base and expansion bases connected with
cables are shown below.

Classification Description
Basic base
• Constructed with 2 basic bases of the same structure.
configuration
Extension base
• Constructed with 2 extension drive module of the same station number
configuration
Max. extendable
• Expansion bases can be installed up to 31 stacks.
stacks
Max. I/O modules • Up to 372 I/O modules can be installed in expansion bases.
• 16-point modules: 5,952 points
Max. I/O points • 32-point modules: 11,904 points
• 64-point modules: 23,808 points
• Between bases
- Optical multi mode: 2 km
- Optical single mode: 15km
Max. expansion - Electrical: 100 m
distance • Total max length
- Optical multi mode: 62km (when installing 31 expansion modules)
- Optical single mode: 465km (when installing 31 expansion modules)
- Electrical: 3.1km (when installing 31 expansion modules)

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 Chapter 2. System Configuration

Classification Description
• The beginning value of the I/O numbers of each base is determined by the base number setup
in the expansion drive module.
• In the base, the I/O numbers are allocated by 64 (fixed) points per slot.
Each slot is allocated with 64 points regardless of the installation and type of module.

• Different from the digital I/O modules, special modules do not use I/O number for control.
They use U device and exclusive function block.
• An exemplary allocation of I/O numbers of a 12 slot base is shown below.

I/O number
allocation for
expansion bases

• Since communication module only can be installed on the basic base, I/O numbering is
meaningless.
I/O number of basic • Though the basic base does not use the I/O number, the same numbers (768 points) as that
base of a 12 lot expansion base are allocated.
• The basic base has the base No. of “0” located at the first digit of the I/O No.

Note
(1)The redundant basic base has a fixed base No. of 0. Expansion bases are provided with switches for
setting up base No.
(2) The base modules installed with redundant CPU are available for the basic base only.
(3) The redundant CPU is a CPU module which occupies 2 slots.
(4) The type of module setup with I/O parameter must agree with that of the actual module to enable operation
to start.
(5) In the XGR system, the extension network cable (between main base and extension base, between
extension base and extension base) and the sync cable (optical) between the CPU modules must use a
single cable. If you use hubs, switches, opto-electric converters, etc. in the XGR system, the system may
malfunction.

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 Chapter 2. System Configuration

2.2.2 Module selection when configuring basic system

When configuring basic system, you must consider about size of each module’s Data Refresh area.
Data Refresh area is used for data transmission between CPU and modules in XGR CPU system. Data Refresh
area is allocated to CPU memory, irrespective of module’s operation. You must consider about maximum size of
Data
Refresh area. If it exceeds 5120 words(Input Data), 3072 words(Output Data), system doesn’t operate properly.

(1) Size of each module’s Data Refresh area

(Unit : WORD)
Refresh Refresh
Item Type Item Type
Size Size
XGI-A12A 1 XGQ-RY1A 1
XGI-A21A 1 XGQ-RY2A 1
XGI-A21C 1 XGQ-RY2B 1
Digital input module XGI-D21A 1 XGQ-SS2A 1
Digital output module
XGI-D22A/B 1 XGQ-TR1C 1
XGI-D24A/B 2 XGQ-TR2A/B 2
XGI-D28A/B 4 XGQ-TR4A/B 4
Digital I/O module XGH-DT4A 2 XGQ-TR8A/B 8
XGF-AC8A 22 XGF-RD4A 30
XGF-AV8A 22 Temperature detector XGF-RD4S 30
XGF-AD8A 22 input module XGF-TC4S 30
Analog input module XGF-AD16A 21 XGF-RD8A 23
XGF-AD4S 12 Temperature control XGF-TC4RT 31
XGF-AW4S 12 module XGF-TC4UD 31
XGF-AC4H 11 XGF-HO2A 25
High speed counter
XGF-DC8A 11 module XGF-HD2A 25
XGF-DV8A 11 XGF-HO8A 25
XGF-DC4A 11 SOE module XGF-SOEA 2
Analog output
module XGF-DV4A 11 Data log module XGF-DL16A 32
XGF-DC4S 11 XGL-EFMT 16
XGF-DV4S 11 XGL-EFMF 16
XGF-DC4H 7 XGL-ESHF 16
Analog I/O module XGF-AH6A 11 XGL-DMEA 16
XGF-PO1A 2 XGL-PSEA 16
XGF-PO2A 2 XGL-PMEA 16
XGF-PO3A 2 Communication module XGL-PMEC 16
APM module XGF-PD1A 2 XGL-EDMT 16
( Advanced Position
module ) XGF-PD2A 2 XGL-EDMF 16
XGF-PD3A 2 XGL-EDST 16
XGF-PO1H 2 XGL-EDSF 16
XGF-PO2H 2 XGL-RMEA 16

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 Chapter 2. System Configuration

Refresh Refresh
Item Type Item Type
Size Size
XGF-PO3H 2 XGL-FMEA 16
XGF-PO4H 2 XGL-C22A 16
XGF-PD1H 2 XGL-C42A 16
XGF-PD2H 2 XGL-CH2A 16
APM module XGF-PD3H XGL-EIMT
2 16
( Advanced Position Communication module
module ) XGF-PD4H 2 XGL-EIMH 16
XGF-PN8A 3 XGL-EIMF 16
XGF-PN8B 3 XGL-ES4T 16
XGF-M16M 1 XGL-BBM 16
XGF-M32E 4 XGL-EIPT 16

(2) Calculation of Data Refresh area’s size

1) Limit of Data Refresh area’s size

Sum of Data Refresh area’s size installed in system (Input module) ≤ 5,120 WORD
Sum of Data Refresh area’s size installed in system (Output module) ≤ 3,072 WORD

2) Example

In a system, below modules are installed. (Input module)

XGI-D28A(20 EA), XGF-DC8A(40EA), XGF-AC8A(20EA), XGF-RD4A(10EA)

→ Input module data refresh : (4 * 20) + (22 * 20) + (30 * 10) = 820 WORD ≤ 5,120 WORD
→ Output module data refresh : (11 * 40) = 440 WORD ≤ 3,072 WORD

Note
1) Sum of Input module Data Refresh area’s size must not exceed 5,120 WORD.
Sum of Output module Data Refresh area’s size must not exceed 3,072 WORD.

2) If size of Data Refresh area exceeds the range, XGK/I system doesn’t operate properly.

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 Chapter 2. System Configuration

2.2.3 Redundancy of CPU system

A redundant system has the redundancy of power supply modules, CPU modules, basic base modules, and
communication modules. On the basic base module of a redundant system, two identical power, CPU, and
communication modules are installed. The two CPU modules are connected with a sink cable.

One of the two CPU systems functions as the master which is in charge of the operation and the other is the
backup system which takes over the operation when the master system fails.

After correcting the failure, the previous master system can participate in the redundant operation as a backup
system. Master and backup systems can be selected using software tool and key switch during redundant
operation.

Use the switch on the CPU module to setup CPU-A and CPU-B. If the setting is duplicated with A or B, normal
redundant operation cannot be achieved.

Slot 0

Slot 1

Slot 2

Slot 3

Slot 4

Slot 5
Power Power CPU
CPU-A
Module Module Module
Slot 0

Slot 1

Slot 2

Slot 3

Slot 4

Slot 5

Power Power CPU

CPU-B
Module Module Module

[Fig. 2.3.2] Slot configuration of duplicated basic base

The modules which can be installed on the basic base are as follows.

Modules Type/Model
Main base CPU Module XGR-CPUH/T, XGR-CPUH/F
Power Module XGR-AC12, XGR-AC22, XGR-AC13, XGR-AC23
Communication EtherNet/IP I/F module, FEnet I/F module, RAPIEnet I/F module,
Module Cnet I/F module*1)
Base XGR-M02P*2), XGR-M06P
Expansion Digital I/O All types of digital I/O
base Analog I/O All types of analog I/O
Communication Pnet/Rnet/Dnet/Cnet I/F module
Module
*1) XGR CPU module V1.8 or above is needed.
*1) XGR-M02P base is supported at XG5000 V3.6 or above

Note
(1) Redundant CPU cannot be installed on an expansion base module.
(2) The O/S version of the two CPUs must be the same.
(3) As shown in [Fig. 2.3.2], the modules on CPU-A: 0, 1, 2, 3, 4, 5 slots and CPU-B: 0, 1, 2, 3, 4, 5
slots must be of the same product type. If the CPU-A: 0 slot is installed with an XGL-EFMF(FEnet)
module, the same module must be installed on the CPU-B: 0 slot.

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 Chapter 2. System Configuration

2.2.4 Power Module Redundancy

The power modules of the basic and expansion base systems can have a redundancy.
The redundant power module enables continuous system operation without interruption when one of the two
power modules fails to supply power.
Power system or power module failure can be repaired or the module can be replaced during operation without
interruption.

2.2.5 Extension Drive Redundancy

Extension redundancy system consists of power module, extension drive module, redundancy extension base,
redundancy cable. All modules except extension base modules are backed up by redundancy. One extension driver
operates as master system and another operation as standby which gets the right when error occurs at master
system. Master extension driver recovered from error gets stand-by and doesn’t participate in an operation. When
changing extension drive module during RUN mode, use “Base Skip”.
Extension redundancy drive modules in the same extension base should have same station number. Extension
redundancy drive module has to be mounted on the designated position of extension base
Master-standby status of extension driver is determined by operating status of CPU.

2.2.6 Expansion Base Communication Path Redundancy

Since the cable connection of the expansion bases are ring-structured, the system can be operated without
interruption even when a cable fails, by using the other cable.

In normal ring operation mode, operation is performed using the path which is nearer to the master. When a
cable fails, the system operation is maintained by line operation mode.
The failed cable can be replaced without interrupting the operation.

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 Chapter 2. System Configuration

(1) Ring Operation Mode

Dual ring method

Note
(1) Extension base system can be configured by dual ring method.
(2) Diverse configuration is available but there is some limit. Refer to application note.
(3) O/S version of both extension drivers should be same.
(4) Switching of extension driver is same as that of CPU.
(5) If there is error in extension base modules (digital/analog I/O, communication module in
extension base), those are not backed up by redundancy.
(6) You can use only one extension driver. But at this time, extension driver is not backed up by
redundancy.
(7) All extension drivers in the system need not be same.

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 Chapter 2. System Configuration

2.2.7 Example of Redundant System Configuration

(1) Example of using electrical modules

(a) CPU-A module, CPU-B module: XGR-CPUH/T

(b) Ext. drive modules of base 1,2,3: XGR-DBDT

(2) Example of using optical modules

(a) CPU-A module, CPU-B module: XGR-CPUH/F

(b) Ext. drive modules of base 1,2,3: XGR-DBDF

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 Chapter 2. System Configuration

(3) Example using mixed modules

In a system that electrical modules are already established where distance among the stations is too far or
electrical noise is severe, the section can be replaced with optical modules to build an optical/electrical
mixed module network without an additional converter.

(a) CPU-A module, CPU-B module: XGR-CPUH/T

(b) Ext. drive modules of base 1,2,3: XGR-DBDT
(c) Ext. drive modules of base 1,2,3: XGR-DBDH

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 Chapter 2. System Configuration

(4) Example of using dedicated Ethernet for upper level HMI connection and between PLCs (Single
ring)

The communication network between upper level systems, existing PLCs and the controllers from other
suppliers can be constructed using an Ethernet communication module (FEnet). With XGT PLCs, a high
speed and reliable system can be built using an industrial Ethernet module (RAPIEnet).

Software HMI
(Info-U)

Hub Hub
Ethernet

Master Backup

GM4C
GMR

RAPIEnet (Ring)

PC Card
/HMI
XGI XGK

Modbus

Rnet

Smart
Dnet
I/O
Pnet

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 Chapter 2. System Configuration

2.3 Network System

XGR Series support diversified network systems for flexible system configuration methodology.

For the communication between PLCs and upper level systems or between PLCs, Ethernet (EthNet/IP, FEnet,
RAPIEnet) and Cnet are provided. For lower control network system, Profibus-DP, DeviceNet, and Rnet are provided.

2.3.1 Networking among Systems

Only EthNet/IP , FEnet and RAPIEnet communication modules are available for the redundant basic base.
All communication modules except Ethernet communication module can be installed in the expansion base.
Maximum 24 communication modules can be installed in the redundant basic base and expansion bases.
Maximum number of modules limited by functionality are as follows;

Functionality Maximum No. of Modules

Max. No. of modules for high speed link configuration 12

Max. No. of P2P1) service modules 8

Max. No. of dedicated service (slave) modules 24

*Note1) : P2Pservice: 1 to 1 communication

2.3.2 Remote I/O System

For the control network systems of the I/O modules distributed across remote locations, Profibus-DP, DeviceNet,
Rnet, Cnet, etc., are provided.

(1) I/O System Application by Network Type

Remote I/O modules are classified into base board type and block type (Smart I/O, etc.). Base board type may
not be supported in certain network types.

Network Type Block-type Remote Ext.-type Remote

No.
(Master) I/O (Smart IO) I/O

1 Profibus-DP O O
2 DeviceNet O O
3 Rnet O O
4 Cnet(MODBUS) O -

* The above specifications can be changed for functional improvement. Please refer to the technical material
of the network system for detail information.

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 Chapter 2. System Configuration

(2) Block-type Remote I/O System

(a) System Configuration

Constructed with Profibus-DP, DeviceNet, Rnet and Cnet. Block-type remote I/O can be used regardless of
the PLC series in the system. Profibus-DP and DeviceNet are developed in compliance with the international
standard, therefore, they can be connected with other suppliers’ products as well as our own.
Pnet/Dnet/Rnet/Cnet
(Master Module)
Pwr/ Mod.

Pwr/ Mod.

XGL−****
Ext. Drive.

Smart-I/O Smart-I/O Smart-I/O

(b) I/O Allocation and I/O Numbering Scheme

1) available to allocate variable to remote IO by High Speed Link parameter
2) I, Q, M area of master can be designated as READ/WRITE area for the remote I/O area.
3) For smooth use of forced I/O setting function, it is recommended to use ‘I’ and ‘Q’ areas.
4) For the setting method of the high speed link parameters of module, see the technical documents of the
network system.

Note

(1) Remote station numbers and areas must be set-up without overlapping.
(2) Input and output services, such as forced On/Off, are provided only when the inputs
and outputs are allocated with I/O variables (%IW,%QW).
(3) For SMART IO connected to master module, in case you set Read area(Q) and Save
area(I) through XG-PD, forced I/O setting is available.

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 Chapter 3. General Specifications

Chapter 3 General Specifications

3.1 General Specifications
Table 3.1 shows the general specifications of XGT series.
[Table 3.1] General specifications
No. Items Specifications Related standards
Ambient
1 0 ~ 55 °C
temperature
Storage
2 −25 ~ +70 °C
temperature
Ambient
3 5 ~ 95%RH (Non-condensing)
humidity
4 Storage humidity 5 ~ 95%RH (Non-condensing)
Occasional vibration -
Frequency Acceleration Amplitude times
5 ≤ f < 8.4 Hz − 3.5mm
Vibration 8.4 ≤ f ≤ 150 Hz 9.8m/s2(1G) −
5 10 times each
resistance Continuous vibration IEC61131-2
directions
Frequency Acceleration Amplitude
(X, Y and Z)
5 ≤ f < 8.4 Hz − 1.75mm
8.4 ≤ f ≤ 150 Hz 4.9m/s2(0.5G) −
• Peak acceleration: 147 m/s 2(15G)
Shock
6 • Duration: 11ms IEC61131-2
resistance
• Half-sine, 3 times each direction per each axis
Square wave LS ELECTRIC
±1,500 V
Impulse noise standard
Electrostatic IEC61131-2
4kV
discharge IEC61000-1-2
Radiated
7 Noise resistance IEC61131-2,
electromagnetic 80 ~ 1,000 MHz, 10V/m
IEC61000-1-3
field noise
Segme Power supply Digital/analog input/output
Fast transient/bust IEC61131-2
nt module communication interface
noise IEC61000-1-4
Voltage 2kV 1kV
8 Environment Free from corrosive gasses and excessive dust
9 Altitude Up to 2,000 ms
Pollution
10 2 or less
degree
11 Cooling Air-cooling

Note
1) IEC (International Electrotechnical Commission):
An international nongovernmental organization which promotes internationally cooperated standardization in
electric/electronic field, publishes international standards and manages applicable estimation system related with.
2) Pollution degree:
An index indicating pollution degree of the operating environment which decides insulation performance of the devices. For instance, Pollution
degree 2 indicates the state generally that only non-conductive pollution occurs. However, this state contains temporary conduction due to dew
produced.

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Chapter 3. General Specifications

3-2
 Chapter 4. CPU Module

Chapter 4 CPU Module

4.1 Performance Specifications

The performance specifications of the redundant CPU module are as follows.

Specifications
Item Remarks
XGR-CPUH/F XGR-CPUH/S XGR-CPUH/T
Scan program: Reiterative operation, Fixed cycle scan
Program operation method
Task program: Initialization, Cycle, Internal device
Direct method by command is
I/O Control system Scan synchronous batch processing system (refresh system).
not supported.
LD (Ladder Diagram), ST (Structured Text)
Program language SFC (Sequential Function Chart)
IL (Instruction List, view function only)
Operator 18
Basic function 130 types ＋ real number operation function
No. of Basic function
Instructions 41
block
Dedicated
FB dedicated for special module, FB for process control
function block
Basic 42 ns / command
Operation
processing MOVE 112 ns / command
speed (basic ±: 602 ns(S), 1,078 ns(D)
Real number S: Single real number
instruction) x: 1,106 ns(S), 2,394 ns(D)
operation D: Double real number
÷ : 1,134 ns(S), 2,660 ns(D)
Program memory capacity 3MB Including upload program
I/O points(installable) 23,808 points (31bases * 12slots * 64points)
Max. I/O memory contact point I: 131,072, Q: 131,072
Input variable(I) 16KB %IW0.0.0 ~ %IW127.15.3
Output variable(Q) 16KB %QW0.0.0 ~ %QW127.15.3
Automatic variable
512KB (max. 256KB retain settable)
area(A)
M 256KB (max. 128KB retain settable)

Direct variable R 64KB * 2 blocks 64KB per block

Data W 128KB
memory Same area with R
F 4KB System flag
K 16KB (PID 256 loops) PID flag
Flag variable L 22KB High speed link flag
N 42KB P2P flag
U 32KB (31 base, 16 slot, 32channel) Analogue refresh flag

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 Chapter 4. CPU Module

Specifications
Item Remarks
XGR-CPUH/F XGR-CPUH/S XGR-CPUH/T
Occupying 20 bytes
Timer  No point limit of automatic variable area
 Time range: 0.001~ 4,294,967.295 second (1,193 hours) per point
Occupying 8 bytes
Counter  No point limit of automatic variable area
 Coefficient range : 64 bit expression range (-32,768 ~ +32,767) per point
Total no. of programs 256
Initialization task 1(_int)
Program structure Fixed cycle task 32 (range: 0~31)
Processed at scan
Internal device task 32 (range: 64~95)
END
Operation mode RUN, STOP, DEBUG
Restart mode Cold, Warm
Operation delay monitoring, memory fault, I/O fault, battery fault, power fault
Self diagnosis function
and etc
Data protection in case of Setting retain area in the Basic Parameter
power failure Retain setting of auto variable
Max. expansion base 31 stages One base per stage
Max. length between expansion base Optical (2km) Optical (15km) Electrical (100m)
Operation monitoring
Redundant monitoring by Sync. Line and ring type I/O network
between CPU
Data backup
1 G bps optical line, max. length 200 m (recommended)
between CPU
Data Sync. Method
Set in the Redundancy Parameter
between CPU
Proportional to data which master transmits to backup
Redundancy
Delay in case of - Max. 15ms
performance
redundancy - optimization available by user setting Refer to 5.1.4
operation Basic 15ms +
user designated amount (2kword) * 0.250ms/2kword
Master switching
22ms Refer to 5.1.4
time
Operation delay in
About 10% more than single operation scan time Refer to 5.1.4
case of standby start
Internal consumption current (mA) 1,310 ㎃ 980 ㎃
Weight (g) 276 g 257 g

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 Chapter 4. CPU Module

4.2 Names and Functions of Parts

No. Name Description

Sets the operation mode of CPU module via key switch.

 RUN mode: runs program
 STOP mode: stops program
Operation mode  REM mode: mode selectable by programming tool
① switch ▶ RUN -> REM, STOP -> REM: keeps previous mode.
RUN/REM/STOP ▶ RUN -> RUN, REM -> STOP: changes the mode to RUN, STOP
respectively
▶ In case operation mode is not REM, writing program and changing
operation mode are not available by programming tool. (Monitoring and
changing the data are available)

Shows the operation status of the CPU module.

 Green light: ‘RUN’ mode

▶ ‘RUN’ operation by mode switch (local run)
▶ ‘RUN’ operation by programming tool with mode switch set as ‘REM’
(Remote run)
②- a RUN/STOP LED
 Red light: ‘STOP’ mode
▶ ‘STOP’ operation by mode switch
▶ ‘STOP’ operation by programming tool with mode switch set as ‘REM’
(Remote stop)

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 Chapter 4. CPU Module

No. Name Description

 On(yellow): displaying an warning

▶ Force I/O setting
▶ Skip I/O/Fault mask setting
▶ Run when Fuse error
▶ Run when I/O module error
▶ Run when special module error
▶ Run when communication module error
▶ Warning abnormal RTC data
▶ Warning existence of base which doesn’t participate in the operation
▶ Abnormal operation stop warning
▶ Task collision warning
②- b WAR. LED
▶ Abnormal battery warning
▶ Warning detection of light error of external device
▶ High speed link setting warning
▶ P2P setting warning
▶ Fixed cycle error warning
▶ Abnormal base power module warning
▶ Abnormal base skip cancellation warning
▶ Abnormal base number setting warning
▶Warning redundant configuration
▶Warning OS version inconsistency
▶Warning Ring topology configuration
 Off: No warning

 On(red): displays error makes the operation unavailable

▶ CPU configuration error
▶ Module type mismatch error
▶ Module detached error
▶ Fuse disconnection error
▶ Detection of heavy trouble of external device
▶ Basic parameter error
▶ I/O parameter error
▶ Special module parameter error
▶ User program error
▶ Program code error
▶ CPU abnormal end or malfunction
②- c ERR. LED ▶ Base power error
▶ Scan watchdog error
▶ Base information error
▶ Standby CPU run error
▶ Expansion base detached error
▶ Redundant parameter error
▶ Module insertion location error
▶ Expansion base no. overlapped error
▶ Redundant Sync. Error
▶ A/B side overlapped setting error
▶Base abnormal configuration error
 Off:
▶ No error

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 Chapter 4. CPU Module

No. Name Description

 Displays operation status with 4 characters
Displaying operation ▶ Normal operation
②- d
status ▶ Warning
▶ Error (Refer to XGR error code)

 Displays operation/installation status of CPU system.

Displaying ▶ RED: On when redundant operation, Off when single operation

②- e ▶ MASTER: on; CPU operating as master, off; standby CPU
redundancy status
▶ CPU-A: on when CPU position designation switch (⑤-b) set as A
▶ CPU-B: on when CPU position designation switch (⑤-b) set as B

Displays communication status with expansion base

 ACT On (yellow): relevant channel is operating
 LINK On (Green): link of relevant channel is connected
Displaying expansion
②- f ▶ 1 indicates upper channel (④-a), 2 indicates lower channel (④-b).
network status
 RING On (Green): Expansion network is configured as Ring.
 Ring Off: Expansion network is not established or configured as Line because part
of Ring fails

③ Sync. connector Data sharing and monitoring between two CPUS.

Connector used for connecting with expansion base

④-a Connector for
 For easy Ring configuration, two connector supported
④-b expansion connector
 Two types, optical/optical, electrical/electrical
Used to download OS at first time
 BOOT/NORMAL (right side): used for normal operation
 BOOT/NORMAL (left side): used to download OS (OS download mode).

Caution
BOOT/NORMAL
⑤-a
switch
(1) BOOT/NORMAL switch always should be set to right side.
(2) In case of setting to left side, system doesn’t operate properly and
It is not allowed for the user to use
(3) BOOT/NORMAL switch is not allowed to set to left side
for OS downloading

Designates the logical position of CPU

 Left side means CPU position is set as A
A/B side switch
 Right side means CPU position is set as B
⑤-b (CPU position
 Two CPU should have a different position.
designation switch)
(available to check in the programming tool)
 In case two PLC are set as same position, the lately started one cause “E101” error

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 Chapter 4. CPU Module

No. Name Description

You can enable/disable Reset/D.Clear switch in “XG5000  Basic Parameter  Basic

Operation Setup”

1. When Reset switch is enabled

Operation Result
move to left  return to center Reset
move to left  keep 3 seconds or Overall reset
above  return to center

2. When D.Clear switch is enabled

Operation Result
⑤-c Reset/D. Clear switch move to right  return to center: General data area and retain area (M,
Automatic variable) will be cleared.
move to left  keep 3 seconds or General data area, retain area (M,
above  return to center: Automatic variable) and R area will be
cleared.

Caution
(1) Data clear function is only executed in stop mode.

⑥ USB connector Connector for connecting with peripheral (XG5000 etc.) (supports USB 1.1)

⑦ RS-232C connector Connector for connecting with peripheral (XG5000 etc.)

⑧ Backup battery cover Backup battery cover

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 Chapter 4. CPU Module

4.3 Battery

4.3.1 Battery specifications

Item Specifications
Nominal Voltage / Current DC 3.0 V / 1,800 mAh
Warranty period 5 years(at ambient temperature)
Applications Program/data backup, RTC operation in case of power failure
Type LiMnO2 Lithium Battery
Dimensions (mm) φ 17.0 X 33.5 mm

4.3.2 Cautions for usage

(1) Do not heat it up nor weld the electrode(it may reduce the life)
(2) Do not measure the voltage with a tester nor short-circuit it(it may cause a fire).
(3) Do not disassemble it without permission.

4.3.3 Battery life

The XGR-CPUH is designed to use it for 7 years and longer at any environment. However, the battery life varies depending on the
duration of power failure, operation temperature range and etc.
If the battery voltage level is low, the CPU module generates a warning of ‘Low Battery Level’. It can be checked by the LED of the
CPU module, flag and error message in XG5000.
If it is occurred to a low battery level warning, please shortly change the battery.

Caution
In general, it generates the warning after 7 years from the purchase, but if the current is excessively discharged due to
defective battery or leakage current, it may warn it earlier. If it warns shortly after replacing a battery, the CPU module may
need A/S service.

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 Chapter 4. CPU Module

4.3.4 Replacement
A battery used as a backup power for program and data in case of power failure needs replacing regularly. The program and data is
kept by the super capacity for about 30 minutes even after removing the battery, but it needs urgently replacing it as soon as
possible.

Replace a battery in accordance with the following steps.

Starting replacing a battery

Open the battery cover.

Pull out the current battery and remove the

connector.

Insert a new battery into the holder along the

right direction and connect to the connector

Check whether ‘E502’ indication of the CPU

module indicator disappear

Yes
‘BAT’ LED Off?

No
Defective battery End

4-8
 Chapter 5. Program Configuration and Operation Method

Chapter 5 Program Constitution and Operation Method

5.1 Program Basics

5.1.1 Program Structure and Execution

The program for the XGR PLC is made out with XG5000, compiled into an executable program, and transmitted to
PLC for execution.

(1) The programs can be classified into scan programs and task programs. The scan programs are executed at
every scanning, and the task programs are executed by a task.
- Scan program: the program executed every scan repeatedly
- Task program: the program executed by task

(2) A scan program runs from the first to the last step registered in the project in the registered order, and terminates
the scanning (END). The entire process is referred to as “1 scan.’

(3) This process methodology which runs a program from the beginning to the end and then runs the entire process
again, is called ‘cyclic operation method.’

(4) Before starting the operation of a scan program, the status of the input module is read and saved in the input
image area, and the status of the output image area is outputted to the output module when the operation of the scan
program is completed. This process is called ‘I/O Refresh.’

(5) XGR PLC series is based on the cyclic operation method. In the operation process, input or output status is not
entered directly, but the operation is executed by I/O refreshing by scan unit basis. To this end, the statuses of the
input and output contact points are stored in the memory area of the PLC. This area is called image area.

Begin Operation

Input image area refresh Input module contact point status

Begin scan program

. Execute task
. program
.
End of scan program

1 Scan

Output image area refresh Output module contact status

:System self diagnosis, comm. data

END
processing, operation mode changing, etc.

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5.1.2 Program Execution Methodology

(1) Cyclic Operation Method (Scan)

A program scan is an operation cycle of a program from the first step to the end step. In a cyclic operation, the
first step is restarted after the end step of the previous scan has been completed. The table below shows this
process by step.

Step Process Description

 With the program downloaded into the PLC, the instruction from the
Operation user is received.

 Step to start scan: it runs once as follows if it is turned on or if you reset

it.
I/O module reset  self-diagnostic execution
Initialization processing Data clear
 Address allocation and type registration of I/O module

 Before starting an operation of program, it reads the status of Input

Refresh input image area module and saves it to the input image area
 When ON time of input data is shorter than CPU scan time, it is not
reflected to ladder program

Program operation processing

 Execute operations from the first to the last step of a program.

Program starts

Program ends

 Once a program’s operation ends, it outputs the content saved in the

Refresh output image area output image area to the output module.

 As a step that the CPU module ends 1 scan process and returns to the
END first step, it processes the follows.

Updating the current values of Timer, Counter and others

Executing user event and data trace service
Execute self-diagnostic
Execute high speed link and P2P service
Check the status of mode setting key switch

Note

The synchronization between the data of the master CPU and standby CPU begins after the start-up of the
standby CPU. See 5.3 Operation Mode for the details of redundant operation.

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(2) Interrupt Operation Method (Fixed Cycle Task Program)

In the interrupt operation method, if it is required to execute a task program with priority during scan program
operation, the current scan program operation is interrupted and the task program is executed. When the task
program operation is completed, the system returns to the previous scan program operation.
An interrupt signal instructs the CPU to execute a task program with priority.
A typical interrupt operation is the fixed cycle interrupt operation. In this method, the interrupt signals are
generated at the times preset by the user to execute task programs. After the completion of a task program, the
system returns to the scan program.

Scan program

Interrupt 1
Interrupt 1 occurs
(Program 1)

Interrupt 2
Interrupt 2 occurs
(Program 2)

Interrupt 3

Interrupt 3 occurs (Program 3)

(프로그램
Interrupt 23)

Interrupt 2
(Program 2)

Interrupt 4 occurs Interrupt 4

(Program 4)

END

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 Chapter 5. Program Configuration and Operation Method

(3) Constant Scan

Constant scan is an operation method which repeats the execution of a basic scan program at fixed cycle time.
In case that the fixed cycle time is longer than the time required for executing the scan program, the system waits
for the remaining time, and restarts the scan program at the beginning of the next cycle time. Therefore, different
from the fixed cycle task program, the program can be executed matching the I/O refreshing and synchronization.
In such case, the scan time is indicated excluding the waiting time.
On the contrary, if the fixed cycle time is setup shorter than the time elapsed for the scan program execution, the
‘_CONSTANT_ER’ flag is turned ‘ON’ and the operation is executed with the time during which the operation can
be executed.

The constant scan can be setup with the basic parameters of the XG5000.

Note

When configured for a constant scan operation, the scan time is indicated as follows.
The maximum and current scan times are indicated with the scan times setup with the fixed cycle operation
parameters, and the minimum scan time indicates the actual time elapsed for the program execution deducted
with the waiting time.

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5.1.3 Operation of instantaneous interrupt

The CPU module detects instantaneous interruption when the voltage of input power supplied to the power module is
lower than the nominal value.
If the CPU module detects instantaneous interruption, it processes operation as follows.

(1) In case of instantaneous interruption within 20ms occurs

(a) It stops an operation with the output at the
moment of instantaneous interruption
maintained.
(b) It resumes the operation once the interruption is
Input power removed
(c) The output voltage of power module is
Instantaneous interruption within 20ms maintained within the specified value.
(d) Even though an operation stops due to
(2) In case of instantaneous interruption over 20ms occurs instantaneous power failure, timer
measurement and interrupt timer
measurements still work normally.

(a) It executes initialization process such as when it

is turned on
Input power
(b) In a redundant CPU operation, the system
Instantaneous interruption over 20ms triggers CPU switch-over.

(3) If the system has a redundant power, the operation will be one of followings;

(a) Instantaneous power interruption in one of two power modules which have been in operation;
- the other power module keeps operation, without interrupting PLC operation.
(b) Instantaneous power interruption in both power modules by shorter than 20ms;
- the modules operate as described in Clause 1) above.
(c) Instantaneous power interruption in both power modules by longer than 20ms;
- the modules operate as described in Clause 2) above.

Note

(1) What is instantaneous interruption?

It means the status that the power supply voltage specified in the PLC is out of the allowable variance
range and falls, and especially, a short term interruption(several ms ~ dozens of ms) is called
instantaneous interruption.
(2) CPU switching
In a redundant CPU operation, if a power interruption longer than 20ms occurs in all the power modules of
the master CPU, the operation is switched over to the standby CPU. For the details of redundant
operation, see 5.3 Operation Mode.

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5.1.4 Scan Time

The time required to complete all steps from the first step (0 step) to last step, that is, a time taken for one control
operation is called ‘scan time.’ It is directly related to the control performance of the system.

(1) Operation and performance of XGR

The major factors which influence scan time are program operation time, I/O data process time, communication
service time, and the data synchronization between the master and standby CPUs. By utilizing the hardware relay
method for the data exchange between expansion drive modules, the data communication performance of the
XGR is greatly improved. In addition, the scan time is greatly reduced by MPU’s ladder program execution and
the paralleled execution of the I/O data scanning by bus controller.

In a single CPU operation, the scan process times of CPU are as follows.
Item Content to be processed time
Process time of scan 42ns per 4 byte of execution
Scan program+ Task program
program program
Communication module: within
Module process
Process time of basic base 200 ㎲ per one
Communication service Within 500 ㎲ per one service

Every expansion base Within 300 ㎲ per one base

Digital I/O: within 10 ㎲ per one
Special module: within 30 ㎲
Module process
Communication module: within
150 ㎲
Process time of Expansion Communication service Within 1000 ㎲ per service
base
Different according to data
~ 0.5 kbyte : 800 ㎲ or less
PUT/GET instruction process
~ 1 kbyte : 2.5 ㎳ or less
~ 4 kbyte : 8 ㎳ or less
~ 8 kbyte : 15 ㎳ or less
Different according to setting
Basic O/S process routine, module error environment
Process time of system
check, Fault mask, I/O skip etc. In case of normal operation,
within 4ms

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 Chapter 5. Program Configuration and Operation Method

(2) Calculation of scan time (Single CPU operation)

The CPU module executes controls along the following steps. A user can estimate the control performance of a
system that the user is to structure from the following calculation.

System
process

① scan program ② ③ ④
CPU scan

② main base
process

Basic base
process
②-1 ②-2
③ extension base
process
Extension
base
process ③-1 ③-2
1 scan 1 scan

Scan time = ① scan program process ＋ ② basic base process＋ ③ expansion base process + ④ system
process

① Scan program process = program size/4 x 0.042 (usec)

(For correct scan time calculation, add the execution speed of the applied instructions.)
② Basic base process
②-1. module process: processes refresh data of module in basic base

- Commmunication module: 200 ㎲ or less per one

②-2. communication service process: executes HS, P2P service

- 500 ㎲ or less per one service

③ Expansion base process

③-1. module process: processes refresh data of module in basic base

- Process time per expansion base: 300 ㎲ or less per expansion base
- Digital I/O: 10 ㎲ or less per one
- Special module: 30 ㎲ per one
- Communication module: 150 ㎲ or less per one
③-2. Communication service process and PUT/GET instruction process: executes HS, P2P service and
PUT/GET instruction set by user
- Communication service process: 1000 ㎲ or less per service
- PUT/GET instruction process
~ 0.5 kbyte : 800 ㎲ or less
~ 1 kbyte : 2.5 ㎳ or less
~ 4 kbyte : 8 ㎳ or less
~ 8 kbyte : 15 ㎳ or less

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 Chapter 5. Program Configuration and Operation Method

④ System process: executes system internal process includig basic O/S process routin, battery check, module error

check, I/O skip, forced I/O, loader service etc.

- different according to the environment In case of normal 4ms or less

Example
CPU(program 32KB) + 6 32-point I/O modules + 6 analog modules (total PUT/GET size 1000byte) + 4 communication
modules (two in basic base, other two in expansion base, one communication service setting for each module)
What is the scan time of above system (the number of expansion base is 2)
Scan time(㎲) = ladder process time + basic base process time + expansion base process time + system process time
= (32768/4 x 0.042) + (200 x 2(two communication modules) + 500 x 2) + (300 x 2(expansion base) + (10 x 6)+(30 x 6)+(150
x 2) + 1000 x 2 + 2500(PUT/GET)) + (4000)
= 11384 ㎲
= 11.4 ㎳

(3) Scan time monitor

In an actual XGR CPU operation, the actual scan time can be obtained by monitoring following data.

(1) Scan time is saved into the following flag(F) areas.

_SCAN_MAX : max. value of scan time(unit of 0.1ms)

_SCAN_MIN : min. value of scan time(unit of 0.1ms)

_SCAN_CUR : current value of scan time (unit of 0.1ms)

_SCAN_MAX, _SCAN_MIN value can be initialized using _SCAN_WR flag.

If the _SCAN_MAX is larger than WDT (Watch Dog Timer) value, a system error occurs. The WDT time can be setup

with the basic parameters.

(4) Scan Time in Redundant Operation

In redundant operations, compared with single CPU operation, the scan time substantially increases due to the
system data sharing between the CPUs. The scan time also varies according to the data volume setup by the
user in the redundancy parameter setting area. The increase in the scan time by data volume is as follows.

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 Chapter 5. Program Configuration and Operation Method

Redundancy
Contents Operation
parameter
Though base error occurs in normal RUN mode,
Base system except that base operates. And if that base
Hot swapping is restored, it operates normally.
option Though module is disabled, module detachment
Module error doesn’t appear. If that module is enabled, it
operates normally.
When two power modules of expansion base are
Expansion base Restart and wait
off, system goes to WAIT mode (Ebxx)
power failure
When two power modules of expansion base
setup Base power failure error are off, CPU error appears
Disable warning for single power Disables warning message when one between two
operation power modules in expansion base is off
Disables warning message when becoming line
Disable warning for line Topology
topology
Warning option
Disables warning message when becoming Single
Disable warning for Single CPU Mode
CPU Mode
Disable warning message for fault Disables warning message when fault mask is
mask removal removed.
When the cable is disconnected, it is instantly
Disconnection of the cable
switched. (within 1s)
Master automatic switchover (redundancy
Communication
operation)
operation setting
Disconnection of the server connection  When Master/Standby is acting as FEnet
server, if the cable of the Master is disconnected,
Standby becomes Master.

(a) Redundant CPU system data: share basic data, e.g., system flag, communication flag, etc. (2.8ms)
(b) Redundancy parameter setting data: synchronization time in each area is as follows;
I/Q base: 1ms/32 bases
M area: approx. 250 ㎲ per 2 kwords. Approx. 16 ms for synchronizing 128kword
R area: approx. 1.5ms per 2 kword. Approx. 12ms for max. 16 kword synchronization. (When 2 kword in R area is
transmitted, 2 kword in W area are also transmitted; total 4 kword are transmitted)
PID Area: 016.7 ㎲ required for each PID setting one loop. When max. 8 blocks are synchronized, approx. 4ms is
required.
Automatic variable area: 32KB  2.5ms required

Example
CPU(program 32KB) + 6 32-point I/O modules + 6 analog modules (total PUT/GET size 1000byte)
+ 4 communication modules(two in basic base, other two in expansion base, one communication service for
each one module) what is the scan time of above system? (Two expansion bases, synchronizes M area 2kword
and PID 2 blocks)
Redundancy Run scan time = single Run scan time + time for synchronizing redundancy data
= Single Run scan time + redundancy system data+ I/O base + synchronizing M area and PID area
= 11.4ms + 2.8ms + 1ms + 0.25ms + 0.5 x 2
= 16.45

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(5) Delay Time at Entering Redundancy Operation

When a redundant CPU is added to single CPU operation, the scan time of the current scan cycle is increased
temporarily, for the standby CPU to be initiated to enter redundancy operation mode. Since the data
synchronization is carried out by 10% equivalent to the scan time of single operation, the scan time during the
data synchronization increases by about 10% compared with single operation.

Caution
(1) When the standby CPU is activated to change the system from single operation to redundant operation,
the scan time increases for a short time to synchronize the program and data from the master CPU to the
standby CPU.
(2) It should be noted that, during single mode operation, including when the standby CPU is not in operation,
data is not synchronized between the master CPU and standby CPU. Therefore, the data may differ from
each other CPU.

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5.2 Program Execution

5.2.1 Program Type

The programs for the XGR PLC can be classified as presented in the chart below, according to their conditions of
execution. Total 256 programs can be used.

Total 256 PLC Task Program Initialization Task Program (0 ~ 1)

programs

Fixed Cycle Task Program (0 ~ 32)

Internal contact point Task Program (0 ~ 32)

Scan Program (256 deducted with the No. of task programs)

5.2.2 Program Execution

(1) Task Program

(a) Initialization Task Program

The initialization task programs are used for system initialization when starting PLC operation in cold or warm
restart mode.
During the execution of an initialization task program, the system operation status information flag _INIT_RUN is
turned to ON.
The initialization task program executes cycle operation including I/O refresh until the _INIT_DONE flag is ON.

(b) Fixed Cycle Task Program

Fixed cycle task programs are executed in repetition at the cycle setup in the task.

(c) Internal Contact Point Task Program

The internal contact point task programs are executed when such events as rise, fall, transition, on, or off of the
internal contact points occur.
The point of time of execution is determined by the condition of event occurrence after the completion of scan
program.

(2) Scan Program

In order to process the signals which are repeated regularly in each scan, the operation is executed from the first
(0) step to the last step in the sequential order.
In case that a condition of interrupt execution is met by the fixed cycle task or interrupt module during the
execution of scan program, the current program is suspended, and the respective task (interrupt) program is
executed. The occurrence of an event of internal contact point program is checked when the scan program has
been completed.

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Caution
• Of the initialization tasks, the first scan On/Off is executed for the first scan only, and not executed from the
next scan until the completion of _INIT_DONE.
• The above mode applies when the master CPU is started from stop state. Since the standby operates
according to the status of the master, restart mode does not apply.
• For manual reset switch activation in redundant operation, please take care of followings;
Activating the reset switch of the master CPU will restart the entire system, but activating the reset switch of
the standby CPU will restart the standby CPU only.
• When activating the Run/Stop switch during redundant operation, please take care of following;
If you activate Stop switch of CPU operating as master, CPU operating as master will become Stop mode
and standby CPU will operates as master

5.2.3 Restart Mode

The restart mode sets up the method of initializing variables and the system at the start-up of PLC operation.
Restart mode has two types; cold and warm restart, which can be set up in the basic parameters of the
XG5000.

When the standby CPU starts up, it executes the initialization according to the restart mode and receives the
program and data backup from the master. When set up in flash operation mode, it receives the flash data
backup from the master too.

When the standby CPU is switched to master CPU during operation, it is not a restart, therefore, no further action
is taken.

The conditions of the execution of the restart modes are as follows.

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(1) Cold restart

(a) All data is reset (deleted) to “0.” Here, the ‘all data’ means the M area, R area, and automaton
variables. The flag area, such as PID, which does not belong to this category is not deleted.
(b) Only the variables whose initial values are set up are reset to the initial values.
(c) Even though the parameter is set up to warm restart mode, at the first running after changing the
program to be executed, the following program will be executed with cold restart mode.
(d) Pressing the manual rest switch for 3 seconds (same as the overall reset of the XG5000), the system
will start in cold restart mode regardless of the set up restart mode.
(2) Warm restart
(a) The data which was set up to maintain previous value will maintain the previous value. The data which
has user defined initial value will be reset to the initial value. Other data will be deleted to “0.”
(b) When set up in warm restart mode, too, the first run, after an interruption by program download or
error, will be started in cold restart mode.
(c) When set up in warm restart mode, if the data is abnormal (data was not maintained during a power
failure), the system will be started in cold restart mode.
(d) Pressing the manual reset switch for less than 5 seconds during power-on, same as the reset
instruction in the XG5000, if the setting is warm restart mode, the operation will begin in warm restart
mode.

Data initialization according to the restart modes are as follows.

The variables related with restart mode are default, retain, and initialization variables. The method of initializing
the variables in the execution of restart mode is as follows.

Mode Cold Warm

Variable
Default Initialize to ‘0’ Initialize to ‘0’

Retain Initialize to ‘0’ Maintain the previous value

Initialization Initialize to user defined value Initialize to user defined value

Retain &
Initialize to user defined value Maintain the previous value
Initialization

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5.2.4 Task Program

This section describes the programming and configuration of the task programs with XG5000 which is the
programming software of the XGR.

(1) Programming Task Programs

(a) In the project window of the XG5000, select the PLC to which the task is added. Click the right button of
mouse, and select [Add Item]-[Task].

(b) In the Task dialog box, set up the task to be added, and click Confirm button.

Note

External contact point task is not supported in the XGR PLC Series, and will be developed in the near future.

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(c) The configured task will be displayed as shown in the window below. For detail configuration, see the User
Manual of the XG5000.

(2) Task Types

The below table summarizes the types and functions of tasks.

Type
Initialization Cycle time Internal address
Spec.
Number 1 32 32
When entering RUN Cycle time (settable up to
Start-up mode, prior to starting Conditions of internal device
4,294,967.295 seconds at the
condition scan program designation
unit of 1ms)

Detection/exec Execute until the flag Cyclically execute at the pre- Checks and Executes after
ution _INIT_DONE is ON defined interval. completing scan program
-
Detection delay Delayed as long as 0.2ms to the Delayed as long as the max.
time max. scan time.
--
Execution Setting 2 ~ 7 levels Setting 2 ~ 7 levels
priority (level 2 is the highest priority) (level 2 is the highest priority)
-
Assigning it between 0~31 so that Assigning it between 64~95 so
Task number
it is not duplicate that it is not duplicated

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(3) Processing method of task program

It describes the common processing method and cautions of task program

(a) Features of task program

 Task program does not reiteratively be processed like a scan program and instead, it is executed only when the

execution conditions occur. Make sure to remember this when creating a task program.

 For instance, if a task program with 10 seconds of fixed cycle is used with a timer and counter, the timer may have an

error of 10 seconds maximum while the counter checks every 10 seconds, any counter input changed within 10 seconds

is not counted.

(b) Execution priority

 If several tasks to execute are waiting, it processes from the highest priority task program. If there are several tasks of

same priority, they are processed by the order which is occurred.

 The task priority is applied to only each task.

 Please set the priority of task program considering program features, importance level and urgency demanding

execution.

(c) Process delay time

The delay of task program processing occurs due to the following factors. Make sure to consider them when setting a

task or creating a program.

 Task detection delay(please refer to the details of each task)

 Program execution delay due to the execution of preceding task program

(d) Correlation between scan program and task program in the initialization

Fixed Cycle task and internal contact point task does not operate while initialization task program is working.

Since scan program has a low priority, if a task occurs, it stops a scan program and executes a task program. Therefore,

if tasks frequently occur during one scan, a scan time may increase unreasonably. A special attention should be paid

when setting the conditions of task.

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(e) Protection from task program of a currently running program

 If program execution continuity is lost by executing a higher priority program, you can partially protect the task program

from being executed, for a problematic part. At the moment, a program can be protected by application function
commands of ‘DI (task program operation disabled)’ or ‘EI(task program operation enabled)’

 Insert the application function command, ‘DI’ into the beginning position of a section to be protected and the

application function command, ‘EI’ to the position to cancel it. Initialization task is not affected by the application

function commands of ‘DI’ and ‘EI’.

Note
(1) If task program priority is duplicate set, a program works according to the creation order.

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(4) Cycle Time Task Program

(a) Setting up cycle task

The window below shows the setting up of a fixed cycle task. In order to set up a fixed cycle task, enter task name, priority,

and task number for task control, and select Fixed Cycle radio button in the Condition of Execution, and enter the cycle

time of execution.

(b) Fixed cycle task processing

 Execute a fixed cycle task program at a pre-defined interval.

(c) Cautions for using a fixed cycle task program

If a same task program is to be executed when a fixed cycle task program is in operation or waiting for execution, a new

task is ignored.

 Only for a moment when the operation mode is RUN, a timer requiring executing a fixed cycle program is counted. Any

interruption time is ignored.

 Remember that several fixed cycle task programs are to be executed simultaneously when setting the execution cycle

of a fixed cycle task program.

If using 4 fixed cycle task programs of which cycle is 2, 4, 10 and 20 seconds respectively, it may have simultaneous

execution of 4 programs every 20 seconds, probably causing a longer scan time.

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Caution
(1) Note that if the total time length during which cycle time task are executed simultaneously is longer than the
specified time length when several cycle time tasks occur simultaneously, a short cycle time task may not be
successfully executed.
(2) The only cycle time task of which cycle is longer than scan cycle can be guaranteed for the fixed cycle.

(5) Internal device task

Bit and Word device can be set as execution condition for task.

(a) Task setting

In order to set up an internal device task, set task name, priority, and task number, Internal Device, the type of device and

the condition of start up (Rising, falling, transition, on and off)

(b) Internal Device Task Handling

After the completion of scan program by CPU module, the internal device task program will be executed if starting

condition is met according to the priority.

Caution
Internal address task program is executed at the moment when a scan program is completely executed.
Therefore, although a scan program or task program generates the execution conditions of internal address task
program, it is not immediately executed and instead, it is executed at the moment when a scan program is
executed completely. Therefore, if the execution conditions of internal address task occur and disappear within a
scan program, a task is not executed because it is not detected at the moment when the execution conditions
are surveyed.

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(6) Task processing in instantaneous interruption

When resuming operation due to a long instantaneous interruption, ignore any waiting task and tasks that occur
during the interruption and process the only tasks from the moment of starting operation. If an interruption is
within 20ms, a task that was waiting is executed once the interruption is removed. Any fixed cycle interrupt task
that is duplicated during the interruption is ignored.

(7) Verification of task program

After creating a task program, verify it in accordance with the followings.

(a) Is the task set properly?

If a task occurs excessively or several tasks occur simultaneously in a scan, it may cause longer scan time or irregularity

If a task setting can not be changed, check the max. scan time.

(b) Is the task priority well arranged?

A low priority task program may not be processed in a specified time due to a delay from a higher priority task program.

The case may be, since the next task occurs with a preceding task delayed, it may cause task collision. The priority

should be set in consideration of urgency of task, execution time and etc.

(c) Is the task program created as short as possible?

A longer execution time of task program may cause a longer scan time or irregularity. In addition, it may cause task

program collision. Make sure to set the execution time as short as possible(especially, create a fixed cycle task program

so that it could be executed within 10% of the shortest task cycle among several tasks. )

(d) Doesn’t the program need to be protected against the highest priority task during the execution of program?

If a different task breaks into a task program execution, it completes a current task and then, operates from a task with the

highest priority among waiting tasks. In case it is prohibited that a different task breaks into a scan program, it can be
protected by using ‘DI’/’EI’ application functional commands. It may cause a trouble while processing a global

parameter process commonly used with other program or a special or communication module.

(8) Program configuration and example of processing

First of all, register task and program as follows.

• Registering a task :

T_SLOW (fixed cycle : = 10ms, Priority := 3 )

PROC_1 (internal contact : = M0, Priority := 5 )

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• Registering a program :

Program --> P0 (scan program)

Program --> P1 (operating by task T_SLOW)

Program --> P2 (operating by task PROC_1)

Then, if the program execution time and the occurrence time of external interrupt signal are same,

• Execution time of each program: P0 = 21ms, P1 = 2ms and P2 = 7ms, respectively

• PROC_1 occurrence: During a scan program, the program is executed as follows.

Scan start 1’st Scan 1’st scan end

(1’st operation start) program end (2’nd scan start)

P0 Execution

P1 Execution

T_SLOW Detection

P2 Execution

PROC_1 Detection

Time : 0 6 78 10 12 17 20 22 24 25 30 32 34 (ms)

: Execution without program interruption : Instant stopping during program execution

: Delay of program execution

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 Processing by time period

Time(ms) Processing
0 Scan starts and the scan program P0 starts operation
0~10 Program P0 is executed
10~12 P0 stops due to the execution request for P1 and P1 is executed
17 Execution request for P2
12~20 P1 execution is complete and the suspended P0 resumes
20~24 P0 stops due to the execution request for P1 and P1 is executed
24~25 As P1 execution is complete, the suspended P0 is completely executed.
Check the execution request for P2 at the moment when scan program(P0) is
25
complete and execute P2.
25~30 Execute program P2
30~32 P2 stops due to the execution request for P1 and P1 is executed
32~34 As P1 execution is complete, the suspended P2 is completely executed.
34 Start a new scan(P2 execution starts)

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5.3 Operation Mode

5.3.1 Operation Mode

(1) Program Execution Mode
Program execution mode is the status of program execution by the CPU module. There are three modes; Run,
Stop, and Debug. The operational status of each mode may vary by the status of the redundant operation.

It describes the operation process at each operation mode.

5.3.2 RUN mode

It executes a program operation normally.

Start the first scan at RUN

mode

Initialize data area

Determine whether to process by

verifying the effectiveness of
program

Execute input refresh

Execute scanprogram and interrupt

program

Inspect the operation and

detachment of modules installed

Execute output refresh

Process communication service and

others
Maintaining RUN mode

Change Operation Mode

Changing to other mode

Operate at the changed
operation mode

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(1) Process of switching to Run mode

(a) When the PLC module is switched to the Run mode, the data area is initialized.
 According to the set up restart mode (cold, warm)
(b) Check the program validity to judge the possibility of execution.

(2) Operation process

Execute I/O refresh and program operation.
(a) Execute the interrupt program by detecting the operation conditions of interrupt program.
(b) Inspect the operation and detachment of modules installed.
(c) Process communication service and other internal operations.
(d) Synchronize the data between the master and standby CPUs.

5.3.3 Stop Mode

It stops with no program operation. Program can be transmitted through XG5000 only at remote STOP mode.

(1) Process in mode switching

When switched to the Stop mode, the output images are processed in two ways according to the basic parameter
setting, as shown below.

(a) When set up to maintain output in Run  Stop switching

When the mode is switched from Run to Stop operation, the output image area maintains the results of the
last operation, and carries out output refreshing.
(b) When the output is released from maintenance at switching from Run to Stop
When the mode is switched from Run to Stop operation, the output image area is deleted and output
refreshing is carried out.

(2) Operation process

(a) Execute I/O refresh.

(b) Inspect the operation and detachment of modules installed.
(c) Process communication service and other internal operations.

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5.3.4 Debug Mode

As a mode to find any error from a program or trace an operation procedure, the mode can be changed only from
STOP mode. In the mode, a user can verify a program while checking the program execution and data.

(1) Processing when a mode is changed

(a) At the beginning when the mode is changed, initialize the data area.
(b) Clear the output image area and execute input refresh.

(2) Operation process

(a) Execute I/O refresh.
(b) Debugging operation depending on the settings.
(c) After completing debugging operation to the end of the program, it executes output refresh.
(d) Inspect the operation and detachment of modules installed.
(e) Process communication service and other internal operations.

(3) Conditions of debug operation

There are four types of debug operation conditions and if reaching the break point, it is possible to set a different
type of break point.

Operation condition Description

Stepwise execution of
Upon an operation command, it executes a unit of operation and stops
operation(step over)
Execution according to the Once a break point is designated in a program, it stops at the designated
designation of break point point
If designating the contact area to monitor and the status(read, write,
Execution according to the
value), it stops when the designated operation occurs at the pre-defined
status of contact
contact.
Execution according to the Once designating the scan frequency to operation, it stops after operating
designated scan frequency as many as the scan frequency designated.

Caution
1. Debug mode is only available in single system.
(1) To use debug mode, turn off the power of standby CPU and so that the system runs in single.
(2) Convert to remote stop mode by mode key switch.
2. During debug mode, the user can’t change mode by mode switch.

(4) Operation method

(a) Set the debug operation conditions at XG5000 and execute the operation.
(b) The interrupt program can be set by enabled/disabled at the unit of each interrupt.
(For the details of operation, please refer to Chapter 12 Debugging in the user’s manual of XG5000)

5.3.5 Switching Operation Mode

(1) How to change an operation mode

An operation mode can be changed as follows.

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(a) Mode change by the mode key of the CPU module

(b) Change by accessing the programming tool(XG5000) to a communication port of CPU
(c) Change of a different CPU module networked by XG5000 accessed to a communication port of CPU
(d) Change by using XG5000, HMI and computer link module, which are networked.
(e) Change by ‘STOP’ command while a program is operating.

(2) Type of Operation Mode

(a) Changing program execution mode with mode key

the method of changing operation mode using mode key is as follows.

Mode Key Position Operation Mode

RUN Local RUN
STOP Local STOP
STOP → REM Remote STOP
REM → RUN Local RUN
RUN → REM Remote RUN
REM → STOP Local STOP

(b) Changing remote operation mode

Changing remote modes can be done with the operation mode switch at ‘Remote Allowed: REM.’

Mode Key Change by computer

Mode change Mode change by XG5000
Position communication, etc.
Remote STOP → Remote RUN Ｏ Ｏ(review)
Remote STOP → DEBUG Ｏ Ｘ
Remote RUN → Remote STOP Ｏ Ｏ
REM
Remote RUN → DEBUG Ｘ Ｘ
DEBUG → Remote STOP Ｏ Ｏ
DEBUG → Remote RUN Ｘ Ｘ

Caution
If changing the remote ‘RUN’ mode to ‘RUN’ mode by switch, the PLC is continuously operating without
suspension.
Editing during RUN is possible in the ‘RUN’ mode by switch, but the mode change by XG5000 is restricted.
Make sure to change it only when the mode change is not remotely allowed.

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5.4 Redundancy System Operation

5.4.1 Redundancy System Operation

(1) Redundant operation mode

A redundant system has data synchronization (SYNC) cable between CPUs. Each CPU module has a key
switch for operation mode setting. The key switches look as shown below;

The operation statues of redundancy system can be classified as flows according to the installation, power
supply, whether dada communication cable is connected between the CPUs, and the operation mode of
each CPU.

Data sync. Current Operation Operation

Cable between operation mode of mode of Description
CPUs status CPU-A(B) CPU-B(A)
Single Only CPU-A or CPU-B is operating in redundant
RUN STOP
operation operation mode. Same single CPU operation.
In redundant operation mode, CPU-A and CPU-B are
Redundant
Connected RUN RUN set up as master and standby to perform redundant
operation
operation.
CPU-A and CPU-B are set up as master and standby
Operation
STOP STOP to perform redundant operation, but the operation is
stopped
stopped.
Single The operation is same as a single CPU operation.
Not connected RUN/STOP -
operation

Caution
When a standby CPU is added to a system operating with a single CPU (master) for redundant operation, the
additional (standby) CPU must be installed in accordance with following procedures for uninterrupted operation of
the PLC.

(1) With the power of the standby-side base OFF, construct a same module as the master-side base.
(2) Install the standby CPU in the CPU mounting slot. And set the A/B side switch in Standby CPU differently
from Master CPU.
(3) Connect the CPUs with the data synchronization cable (Sync cable) and expansion cable.
(4) Confirm that the cables are correctly connected, turn the power of the standby base ON.
(5) Turn the operation mode switch to Local Run mode, so that the standby CPU is incorporated
in the redundant operation.
(6) The standby CPU must be incorporated in the redundancy system operation to be able to run
the same programs as those of the master CPU.
(Take care that, if the standby CPU has not been participating in the redundant operation,
its program may differ from that of the master CPU.)

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(2) Changing redundant operation mode

(a) According to the change of the CPU operation mode with mode key or by XG5000, the operation mode of the
redundant system is changed as follows.
Mode Change Description
Current Status Master Operation Standby Operation
STOP status is When the master is changed to STOP
RUN → STOP
maintained state, the operation is stopped
Single Operation
(RUN/STOP) Changing the standby to Run mode, the
(No change: RUN) → RUN operation is changed to redundant
operation.
If the master is changed to STOP, the
→ STOP (No change: RUN) standby becomes master in single
Redundant
operation status.
Operation
If the standby is changed to STOP, the
(RUN/RUN)
(No change: RUN) → STOP master operates in single operation
mode.
The one, A or B, that enters RUN mode
Operation Stop first gets the operation control and
→ RUN (No change: RUN)
(STOP/STOP) becomes the master in single operation
status.

(3) Changing master in redundant operation

(a) Conditions for automatic master switching

1) Master CPU power supply failure
2) Master CPU stopped due to failure in program execution
3) Module removal/replacement error in the master CPU‘s basic base
4) Master CPU failure (CPU excluded)
5) Module on an expansion base is removed (isolated)
6) A system error in the master CPU (abnormal termination of CPU, scan watchdog error)

(a) Conditions for manual master switching

1) Master CPU’s mode key switch is set to Stop
2) Switched to Stop mode by the XG5000 connected with the master CPU
3) Execution of master switching instruction via XG5000 online access
4) Master/standby switching instruction (MST_CHG) is executed
5) Master/standby switching flag (_MASTER_CHG) is executed.
(c) Conditions that do not switch master

1) One of two power supply fails

2) Master fails when the standby has been failed
a) If the same failure is identified, the operation is stopped.
b) When en error is detected in the module in which error mask has been set up, the master is not
switched.
3) When the standby CPU is not in Run operation state

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5.4.2 Start-up of Redundant System

(1) Programming
(a) Conduct programming with XG5000.
(For details, see ‘XG5000 User Manual’.)
(b) Transmit the program
Transmit the program with XG5000.

(2) Starting methods

Following methods are available for starting-up PLC;
(a) Starting with local key:
Download the program in remote mode (REM), set the front key to ‘RUN’

(b) Starting with XG5000:

Set the front key on the CPU module to ‘REM,’ select RUN on the XG5000’s online menu.

(c) Starting by power ON:

When the power is turned ON with the front key set to RUN or if the system was in Remote RUN mode
before power OFF, the system can be started by power ON.

(d) Restarting with reset key:

Restarting with reset key has two methods; Reset and Overall Reset
1) Reset: activated by pressing the reset button on the front of the CPU module less than 3 seconds.
‘RST’ will appear on the indicator panel of the CPU. This is the same as power ON/OFF.
2) Overall Reset: activated by pressing the reset button on the CPU module for more than 3 seconds.
‘RSTC’ will appear on the indicator panel of the CPU. When the button is released, the system will be
restarted in cold restart.

(3) Beginning the first operation

The procedures of system setting-up and starting-up for the first time operation of a redundant system are as
follows.
(a) Prepare the program bocks suitable for the purpose, in as independent forms as possible
(b) In the redundancy parameters, set up the data synchronization area.
(c) When the programming is completed, compile it and carry out debugging.
(d) Using the XG5000 program tool, access CPU communication port and download the program
(e) Switch CPU-A or B to RUN mode using the mode switch key or XG5000.
(f) Switch the CPU which is not the master to RUN mode to set it to the standby CPU
(g) Stop the CPU-A to check normal operation of the standby CPU-B.

(4) Participating in operation

When the standby CPU participates in the operation while the master CPU is in operation, the standby CPU
is synchronized with the master CPU in following procedures.
(a) CPU initialization
(b) Checking the redundant components
(c) Transfer non-variable data to the master
(d) Transfer variable data from the master
(e) Check synchronization with the master CPU
(f) Participate in the operation at the same time as the master CPU

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Note

(1) For the redundant operation mode setting and parameter setting, see ‘6.7 Redundant System Operation Mode’
(2) (a), (b), and (c) are processed separately with delay time less than approximately 50ms at every scan of the master.
(3) (d), (e), and (f) must be processed within one scan of the master, with the delay time not exceeding 50ms.
(If the volume of the variables used exceeds the standard variable value, the delay time may exceed 50ms. For further
information, see ‘5.1.4 Scan Time’)

(5) Procedures of participating in standby operation

Detail procedures of participating in standby operation are as follows.
(a) Power ON
1) Check that the master is in operation
2) Standby entering mode
3) CPU self diagnosis
4) Transfer program from the master (store in RAM and memory module)

(b) Checking redundant system components

1) Check switching I/O access
2) Receive and check switching I/O module information from the master
3) Scan the redundant I/O module information installed in the standby-side
4) Compare with the I/O parameters

(c)Transfer non-variable data from the master

1) Receive the flag from the master (executed by being divided into multiple scans as necessary)
2) After confirming that the flag status has not been changed, proceed to (4)

(d) Receive the variable data from the maser

1) User data area and a part of system buffer

(e) Check synchronicity with the master

1) All the operation data in the CPU is synchronized

(f) Participate in the operation at the same time as the master

1) Conduct redundant operation from the input refreshing

(6) Operation according to starting status

(a) Normal start-up
The master CPU module checks system configuration at power ON. In case of late power on of the
expansion base, the base being check appears on the front indicator panel and wait for power on.
In ‘STOP’ mode, wait for 10 seconds and switched to Stop mode.
1) The first operation after program modification begins in cold restart.
2) When the system had been shut-down normally, the restarting will be performed according to the set-up
parameters, including mode key, XG5000, power OFF and reset.
3) To cold-restart a system set up in warm restart mode, use reset key or the Overall Reset function of the
XG5000.
4) If the system was stopped due to an error in operation, the restarting method will be determined by the
type and release method of the error (see ‘Chapter 13. Program Troubleshooting’).

(b) When I/O skip has been set up

1) Since the I/O module set up with skip is excluded from the operation in the restarting, failure check, etc.,
are not conducted, and included in the operation normally when the skip is released during operation.
For detail information, see ‘9.2 I/O Skip’ and ‘9.3 Module Replacement during Operation.’

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(c) When failure mask has been set up

1) Since the modules set up with failure mask are included in the operation in the restarting, failure check,
etc., are conducted. However, even if module type disagreement error occurs in the initial phase of the
restart, the operation is continued. For further information, see ‘9.1 Failure Mask.’
2) When the entire bases are set up with mask, if the power of the respective base is off, the CPU waits
for power on in waiting mode.

5.5 Memory

The CPU module contains two types of memory that can be used by a user. One is the program memory to save a
user program created to construct a system and the other one is the data memory to provide a device area to save the
data during operation.

5.5.1 Program memory

The storage capacity and data area type of the program memory are as follows.

Item(area) Capacity Remark

Whole memory area 25MB Whole memory capacity

Program Memory 3MB Include Upload

System data and parameter

System Memory 4MB
area
Device memory, Flag, System
Data Memory 2MB
area

Flash Memory 16MB For flash operation mode

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5.5.2 Data memory

The storage capacity and data area type of the data memory are as follows.

Item(area) Capacity
Whole data memory area 2MB
System area :
 I/O data table
770KB
 Forcible I/O table
 Reserved area
System flag 4KB
Analogue image flag 32KB
Flag area PID flag 16KB
High speed link flag 22KB
P2P flag 42KB
Input image area(%I) 16KB
Output image area(%Q) 16KB
R area(%R) 128KB
Direct parameter area(%M) 256KB
Symbolic parameter area(max.) 512KB
Stack area 256KB

5.5.3 Data retain area setting

If the data necessary for operation or the data that occur during operation are to be kept for use even when the
PLC stops and resumes operation, the default(auto.) parameter retain is to be used. Alternatively, a part of the
M area device may be used as the retain area by parameter setting.

The following table summarizes the features of retain settable device.

Device Retain setting Feature

Auto variable User-defined Retain settable if adding a parameter to the auto parameter area
M User-defined Retain settable into internal contact area by parameter
K(PID) X Contact that is kept as contact status in case of interrupt
F X System flag area
U Not retained Analogue data register (retain not settable)
Not retained High speed link/P2P service status contact of communication
L
(V1.1 or above) module(retained)
N X P2P service address area of communication module(retained)
R X Exclusive flash memory area(retained)
W X Exclusive flash memory area(retained)

Note
(1) K, L, N and R devices are basically retained.
(2) K, L and N devices can be deleted in the memory deletion window of PLC deletion, an online menu of
XG5000.
(3) For details of directions, please refer to the ‘Online’ in the user’s manual of XG5000.

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(1) Data initialization by restart mode

There are 3 restart mode related parameters; default, initialization and retain parameter and the initialization
methods of each parameter are as follows in the restart mode.

Mode
Cold Warm
Parameter
Default Initializing as ‘0’ Initializing as ‘0’
Retain Initializing as ‘0’ Maintaining the previous value
Initializing as a user-defined
Initialization Initializing as a user-defined value
value
Initializing as a user-defined
Retain & initialization Maintaining the previous value
value

(2) Operation in the data retain area

Retain data can be deleted as follows.

- D.CLR switch of the CPU module

- RESET switch of the CPU module (3 seconds and longer: Overall Reset)
- RESET by XG5000 (Overall Reset)
- Deleting memory at STOP mode by XG5000
- Writing by a program (recommending the initialization program)
- Writing ‘0’ FILL and etc at XG5000 monitor mode

D.CLR clear does not work at RUN mode. To do it, after make sure to change to STOP mode. In addition, the
default area can be also initialized when clearing by D.CLR switch.
When instantaneously operating D.CLR, the only retain area is deleted. If maintaining D.CLR for 3 seconds, 6
LEDs blink and at the moment, if the switch returns, even R area data are also deleted.

For the maintenance or reset(clear) of the retain area data according to the PLC operation, refer to the following
table.

Item Retain M area retain R area

Maintaining the previous Maintaining the previous Maintaining the previous
Reset value value value
Maintaining the previous
Over all reset Initializing as ‘0’ Initializing as ‘0’
value
Maintaining the previous
DCLR Initializing as ‘0’ Initializing as ‘0’
value
DCLR (3sec) Initializing as ‘0’ Initializing as ‘0’ Initializing as ‘0’
Maintaining the previous Maintaining the previous Maintaining the previous
STOP→RUN value value value
When STOP->RUN, in case it is set as Cold Restart, Retain Auto variable is initialized
In case it is set as Warm Restart, Retain Auto variable is maintained.
Note
The terms and definitions for 3 types of variables are as follows.
(1) Default variable: a variable not set to maintain the initial/previous value
(2) Initialization(INIT) variable: a variable set to maintain the initial value
(3) Retain variable: a variable set to maintain the previous value

(3) Data initialization

Every device memory is cleared up as ‘0’ at the status of memory deletion. The data value may be assigned initially
depending on a system and at the moment, the initialization task should be used.

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 Chapter 6. CPU Module Functions

Chapter 6 CPU Module Functions

6.1 Self-diagnosis Function

(1) The self-diagnostic is the function that the CPU module diagnoses any trouble of the PLC system.
(2) It detects any trouble when turning on the PLC system or any trouble is found during the operation, avoid the
system from malfunctioning and taking preventive measures.

6.1.1 Scan watchdog timer

WDT(Watchdog Timer) is the function to detect any program runaway resulting from abnormal hardware/software
of PLC CPU module.

(1) WDT is a timer used to detect an operation delay from abnormal user program. It can be set in the basic
parameter of XG5000.

(2) WDT monitors any scan overtime during operation and if it detects any overtime delay, it immediately
suspends the PLC operation and turns off every output.

(3) If it is expected that programming a specific part(using FOR ~ NEXT command, CALL command and etc)
may have an overtime delay of scan watchdog timer while executing a user program, you can clear the
timer by using ‘WDT’ command. The ‘WDT’ command restarts from 0 by initializing the overtime delay of
scan watchdog time(for the details of WDT command, please refer to the chapter about commands in the
manual).

(4) To release a watchdog error, turn it on again, operate manual reset switch or change the mode to STOP
mode.

WDT
0 1 2 3 ….. …8 9 0 1 2 … 0 1 2 … …6 7 0 1 2 …
Count (ms)

WDT Reset Scan END Executing WDT Scan END

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Caution
(1) The setting range of the watchdog timer is 1 ~ 999ms(1ms step), and the initial value is 200ms.
(2) If the cycle is set too short, scan watchdog time error may occur if the scan time is elongated by
communication traffic overload, etc. It is recommended to set the cycle sufficiently longer that
_SCAN_MAX

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6.1.2 I/O Module Check Function

This function checks the I/O module when entering Run mode or during PLC operation

(1) When entering Run mode, check if a module disagrees with the parameter setting or in failure (E030)
(2) Check if the I/O module is isolated or failed during operation (E031)

If an abnormality is detected, the error indicator lamp (ERR LED) turns on, error number is indicated on the status
indicator, and the CPU stops operation.

6.1.3 Battery level check

The function monitors battery level and detects, if any, low battery level, warning a user of it. At the moment, the
warning lamp (BAT) on the front of the CPU module is On. For the details of measures, please refer to “4.3.3
Battery Life”.

6.1.4 Saving error log

The CPU module logs, if any, errors so that a user can easily analyze the error and take corrective measures.

It saves each error code to the flag area.

Note
The results of self-diagnostic check are logged in the flag area.
For the details of self-diagnostic and troubleshooting against errors, please refer to 14.5 Error Codes List
during CPU Operation of Chapter 13. Troubleshooting.

6.1.5 Troubleshooting

(1) Types of trouble

A trouble occurs mainly by the breakage of PLC, system configuration error and abnormal operation results.
‘Trouble’ can be categorized by ‘heavy fault mode’ at which the system stops for the purpose of the system safety
and ‘light fault mode’ at which the system warns a user of a trouble and resumes operation.

The PLC system may have a trouble by the following causes.

 Trouble in the PLC hardware

 System configuration error
 Operation error while a user program is operating
 Error detection resulting from a fault external device

(2) Operation mode when a trouble is found

If a trouble is detected, the PLC system logs the trouble message and stops or resumes operation depending on
a trouble mode.

(a) Trouble in the PLC hardware

If heavy fault that the PLC may not properly work, such as CPU module, power module and others occurs,
the system stops. However, the system resumes operation in case of light fault such as abnormal battery.

(b) System configuration error

It occurs when the hardware structure of PLC is not same as defined in the software. At the moment, the
system stops. This occurs at module type disagreement error, module isolated error, or when the I/O
mounted on the PLC differs from the I/O set up in the XG5000.

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(c) Operation error while a user program is operating

In case of numerical operation error as a trouble occurring while a user program is operating, error
flag(_ERR) and error latch flag(_LER) are displayed and the system resumes operation. If an operation time
exceeds the overtime delay limit or the built-in I/O module is not controlled, the system stops.

Note
Error latch flag is maintained as long during a scan program if an error occurs in scan program.
Every time a command is executed, error flag is cleared and set just after a command generating an
error is executed.

(d) Error detection resulting from a fault external device

It detects a fault of external device; in case of heavy fault, the system stops while it just displays a fault of the
device and keeps operating in case of light fault.

Note
(1) If a fault occurs, the fault number is saved into the flag(_ANNUM_ER).
(2) If light fault is detected, the fault number is saved into the flag(_ANNUM_WAR).
(3) For further information about the flags, please refer to Appendix 1. Flags List.

(5) Error detection in redundant operation

Nonconformity of redundancy parameter is detected by the redundancy parameter error flag
(_DUPL_PRM_ER), and data communication error during redundant operation is detected by the
redundancy synchronization error flag (_DUPL_SYNC_ERR). If an error occurs, the system stops. In
addition, the status information on the current redundancy system configuration is provided with the
redundancy Configuration warning error flag (_REDUN_WAR). If this error is detected, the system displays
the status but continues operation.

6.2 Clock Function

The CPU module contains a clock element (RTC), which operates by the backup battery even in case of power-off or
instantaneous interruption.
By using the clock data of RTC, the time control for the operation or trouble logs of the system is available. The
present time of RTC is updated to the clock-related F device per scan.

(1) Read from XG5000/Setting

Click ‘PLC RTC’ in the online mode, ‘PLC Information.’

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It displays the time from the PLC RTC. If it displays the present time incorrectly, a user can fix it up by
transferring the right time after manually setting the time or performing “Synchronize PLC with PC clock”
method to transmit the time of PC clock connected to the PLC.

(2) Clock reading by Flag

It can be monitored by flags as follows.

Flags Examples Size F area Description
_RTC_TIME[0] 16#08 BYTE %FB12 Current time [year, last two digits]
_RTC_TIME[1] 16#02 BYTE %FB13 Current time [Month]
_RTC_TIME[2] 16#23 BYTE %FB14 Current time [Date]
_RTC_TIME[3] 16#14 BYTE %FB15 Current time [Hour]
_RTC_TIME[4] 16#16 BYTE %FB16 Current time [Minute]
_RTC_TIME[5] 16#17 BYTE %FB17 Current time [Second]
_RTC_TIME[6] 16#06 BYTE %FB18 Current time[day]
_RTC_TIME[7] 16#20 BYTE %FB19 Current time [hundred year]

(3) Clock data modified by program

A user also can set the value of clock by using a program.

It is used when setting the time manually by external digital switches or creating a system to calibrate a clock
periodically on network.

Input a value into the below flag area and use the ‘_RTC_TIME_USER’ function block. The time data is
updated in scan END.
Flags Examples Size F area Description
_RTC_TIME_USER[0] 16#08 BYTE %FB3860 Current time [year, last two digits]
_RTC_TIME_USER [1] 16#02 BYTE %FB3861 Current time [Month]
_RTC_TIME_USER [2] 16#23 BYTE %FB3862 Current time [Date]
_RTC_TIME_USER [3] 16#14 BYTE %FB3863 Current time [Hour]
_RTC_TIME_USER [4] 16#16 BYTE %FB3864 Current time [Minute]
_RTC_TIME_USER [5] 16#17 BYTE %FB3865 Current time [Second]
_RTC_TIME_USER [6] 16#06 BYTE %FB3866 Current time[day]
_RTC_TIME_USER [7] 16#20 BYTE %FB3867 Current time [hundred year]

Alternatively, instead of using function blocks, it is also possible to enter clock data into the above area and turn
on ‘_RTC_WR’ in order to input the time.

(a) No input is allowed unless time data is entered in a right format

(However, even if the day of the week data is not correct, it is set without error detected)

(b) After writing the clock data, check whether it is rightly set by monitoring Reading Clock device.

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(4) How to express the day of the week

Number 0 1 2 3 4 5 6
Day Sunday Monday Tuesday Wednesday Thursday Friday Saturday

(5) Time error

The error of RTC varies depending on the operating temperature. The following table shows the time error for a
day.

Operating temp. Max. error (sec/date) Ordinary (sec/date)

0 °C - 4.67 ~ 1.38 -1.46
25 °C - 1.64 ~ 2.42 0.43
55 °C - 5.79 ~ 0.78 -2.29

Caution
(1) Initially, RTC may not have any clock data.
(2) When using the CPU module, first make sure to set the accurate clock data.
(3) If any data out of the clock data range is written into RTC, it does not work properly.
i.e.) 14M 32D 25H
(4) RTC may stop or have an error due to abnormal battery and other causes. The error is released if a new
clock data is written.
(5) For further information of how to modify the clock data, please refer to the description of XGI commands
(6) In the sybchronization of the master and backu CPUs, time difference may occur between the master and
backup.

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6.3 Remote Function

The operation mode of the CPU can be changed by communication, in addition to the key switch on the module.
For remote operation, set the key switch of the CPU module to REM (remote) position>

(1) Types of remote operation

(a) Operation by connecting to XG5000 via USB or RS-232C port installed on the CPU module
(b) Operate by connecting XG5000 via the USB port on the expansion drive module
(c) Other PLC networked on the PLC can be controlled with the CPU module connected to XG5000.
(d) The PLC operation is controlled by HMI software and other applications through the dedicated
communication.
(2) Remote RUN/STOP

(a) Remote RUN/STOP is the function to execute RUN/STOP remotely with the dip switch of the CPU module
set to REMOTE and the RUN/STOP switch set to STOP.
(b) It is a very convenient function when the CPU module is located in a place hard to control or in case the
CPU module is to run/stop from the outside.

(3) DEBUG

(a) DEBUG is the function to control DEBUG with the dip switch of the CPU module set to REMOTE and
RUN/STOP switch set to STOP.
(b) It is a very convenient function when checking program execution status or data in the debugging operation
of the system.

(4) Remote Reset

(a) Remote reset is the function to reset the CPU module remotely in case an error occurs in a place not to
directly control the CPU module.
(b) Like the switch control, it supports ‘Reset’ and ‘Overall Reset.’

Note
For the further information about remote functions, please refer to the ‘Online’ part in the user’s manual of
XG5000.

(5) Flash memory operation mode

(a) What is the flash operation mode? It means that the system operates by the backup program in flash in
case the program in ram is damaged. If selecting “Flash Memory Operation Mode”, it starts operation after
program in flash moves to the program memory of the CPU module when the operation mode is changed
from other mode to RUN mode or when restarting.

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(b) Flash Memory Operation Mode Setting

Check the operation mode setting by using ‘Online  Set Flash Memory …  ‘Enable flash memory run
mode’ and click ‘OK. ’
Once pressing it, it shows a dialogue box stating “Saving flash memory program …” and copies the
program from user program area to flash.

Caution
(1) The default is ‘Flash Memory Operation Mode deselected’.

(2) Flash memory operation mode is maintained as ‘On’ as long as it is not ‘Off’ by XG5000.

(3) Flash memory operation mode can be changed, irrespective of RUN/STOP mode.

(4) Flash memory operation mode can be set by the online menu of XG5000 when executing flash ‘operation
mode setting’ after program debugging is complete with the flash memory operation mode off.

(5) If modifying during RUN with ‘flash memory operation mode’ set, the changed program may be applied only
when it restarts as long as the program is successfully written in flash memory. Note that if the PLC restarts
before a program is saved into flash memory, a program that is saved in advance, instead of the changed
program, works.

(6) If flash memory operation mode is changed from ‘disabled’ to ‘enable’, flash memory operation mode is
applied as long as the flash memory writing is complete. In case the PLC restarts before completing program
writing, “Flash memory operation mode” is released.

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(c) Flash memory operation method

If restarting the PLC system or changing its operation mode to RUN, it works as follows depending on the
flash operation mode setting.

Flash memory operation mode

Description
setting

If program memory data are damaged because flash memory

and program memory are different or battery voltage is low, it
On
downloads the program saved in flash memory to program
memory.

CPU understands that flash memory does not have any

Off
program and operates by the program saved in RAM.

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6.4 Forced On/Off Function of I/O

The forcible I/O function is used to forcibly turn on or off I/O area, irrespective of program execution results.

6.4.1 Force I/O Setting

(1) Click [Online]-[Force I/O] on XG5000.

(a) To set forcible I/O, select the flag of a contact to set and the data checkbox
(b) To set “1”, select the flag and data of a bit and then, select a flag.
(c) To set “0”, select a flag only, not the data corresponding to the bit.
(d) If selecting ‘forcible input or output enabled’, the setting is applied and it works accordingly.

For further directions, please refer to the user’s manual of XG5000.

Caution
(1) Forcible I/O setting is available only in local I/O module.
(2) It can not be set in remote I/O module(smart I/O module).
(3) If forcible I/O is set, “CHK LED” is On.
(4) The forcible I/O set by a user is maintained even though a new program is downloaded.

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6.4.2 The point of time of method of forced On/Off process

(1) Forcible input

‘Input’ replaces the data of a contact set by Forcible On/Off from the data read from input module at the time of
input refresh with the forcibly set data and updates input image area. Therefore, a user program can execute
operation with actual input data and forcibly set data.

(2) Forcible output

‘Output’ replaces the data of a contact set by Forcible On/Off from the output image area data containing
operation result at the time of output refresh with the forcibly set data and outputs to an output module after
completing user program operation. Unlike input, the data in output image area is not changed by forcible
On/Off setting.

Caution
Cautions for using forcible I/O

(1) It works from the time when input/output are set to ‘enable/disable’ respectively after setting forcible data.

(2) Forcible input can be set even though actual I/O module is not installed.

(3) The previously set On/Off setting data are kept in the CPU module, despite of power off  on, operation
mode change, program download or manipulation by reset key. However, it is deleted if overall reset is
executed.

(4) Forcible I/O data are not deleted even in STOP mode.

(5) To set new data from the first, release every setting of I/O by using ‘overall reset’.

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6.5 Operation history saving function

There are four types of operation logs; Error log, Mode change log, shut down log and System log.
It saves the time, frequency and operation of each event into memory and a user can conveniently monitor them
through XG5000. Operation log is saved within the PLC unless it is deleted by XG5000.
6.5.1 Error history
It saves error log that occurs during operation.
(1) Saving error code, date, time and error details.
(2) Saving logs up to 2,048
(3) Automatically released if memory backup is failed due to low battery level and etc
6.5.2 Mode change history
It saves the change mode information and time if an operation mode is changed.
(1) Saving the date, time and mode change information.
(2) Saving up to 1,024.

6.5.3 Shut down history

Saving power On/Off data with it’s time data.
(1) Saving On/Off data, date and time.
(2) Saving up to 1,024.
(3) History of master and standby power is indicated respectively.

6.5.4 System history

It saves the operation log of system that occurs during operation.
(1) Saving the date, time and operation changes
(2) XG5000 operation data, key switch change information
(3) Instantaneous interruption data and network operation
(4) Saving up to 2,048

Note
(1) The saved data are not deleted before it is deleted by selecting a menu in XG5000.
(2) If executing Read All in case logs are more than 100, the previous logs are displayed.

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6.6 External device failure diagnosis function

It is the flag that a user detects a fault of external device so that the suspension/warning of a system could be easily
realized. If using the flag, it can display a fault of external device, instead of creating a complex program and monitor
a fault position without XG5000 and source program.

(1) Detection/classification of external device fault

(a) The fault of external device is detected by a user program and it can be divided into heavy fault(error) that
requires stopping the PLC operation and light fault(warning) that only displays fault status while it keeps
operating.
(b) Heavy fault uses ‘_ANC_ERR' flag and light fault uses ‘_ANC_WB' flag.

(2) If a heavy fault of external device is detected

(a) If a heavy fault of external device is detected in a user program, it writes the value according to error type
defined in a system flag, ‘_ANC_ERR’ by a user. Then, with _CHK_ANC_ERR flag On, it checks at the
completion of a scan program. At the moment, if a fault is displayed, it is displayed in ‘_ANNUN_ER’ of
‘_CNF_ER’, which is the representative error flag. Then, the PLC turns off every output module(depending on
the output control setting of basic parameter) and it has the same error status with PLC fault detection. At the
moment, P.S LED and CHK LED are On, besides ERR LED.
(b) In case of a fault, a user can check the cause by using XG5000 and alternatively, check it by monitoring
‘_ANC_ERR’ flag.
(c) To turn off ERR LED, P.S LED and CHK LED, which are On by heavy fault error flag of external device, it is
necessary to reset the PLC or turn it off and on again.

 Example

(3) If a light fault of external device is detected

(a) If a light fault of external device is detected in a user program, it writes the value according to warning type
defined in ‘_ANC_WAR’ by a user. Then, with _CHK_ANC_WAR On, it checks at the completion of a scan
program. At the moment, if a warning is displayed, ‘_ANNUN_WAR’ of ‘_CNF_WAR’, which is the
representative error flag of system is On. At the moment, P.S LED and CHK LED are On.
(b) If a warning occurs, a user can check the causes by using XG5000. Alternatively, a user can check the
causes by directly monitoring ‘_ANC_WAR’ flag.
(c) With _CHK_ANC_WAR OFF, P.S LED and CHK LED are off and the display, ‘_ANNUN_WAR’ of
‘_CNF_WAR’ is reset.

 Example

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6.7 Redundancy system operation setting

For redundant system operation, redundancy parameters have to be set up.

Redundanct parameter configurationis classified into the operation mode setting and data synchronization area
setting.
The default setting has no data synchronization area. Be careful that, if the data synchronization area is not set up,
the data of the master CPU is not synchronized to the standby CPU.

Different from other parameters, the dredundancy parameters can be written during running.

However, the redundancy parameters cannot be automatically dpwnloaded during running writing.
From the XG5000 online writing, select the redundancy parameters only and download them.

6.7.1 Operation mode setting

(1) Single CPU operation mode

If the system is operation with master CPU only, without standby, redundancy system configuration warning occurs.
To configure XGR system with a single CPU, select the ‘Disable the warning message for Single CPU Mode’
check box to prevent the warning display.

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Caution
It is recommended to configure the XGR system in redundant CPU system. If the redundant system is configured
with single CPU, the system stops if the CPU module fails. To prevent system interruption, set up the system in
redundant CPU configuration

(2) Error handling in power cut-off of expansion base

In a redundant XGR system configured wuth multiple extensin bases for enhanced system reliability and diversity,
in case of detach (powr off) of expansion base(s), the user can select whether to consider it as error or CPU
restarts the system and watis until exension base in problem paricipate in operation again.

a) If the check box “Restart and wait” is selected;

As the default setting, in case of a problem in an expansion base, the system is restarted and the CPU module
waits until the base in failure is normalized. The base in failure is indicated with “Ebxx” in the CPU indicator panel.

When the failed base is restarted normally and returns to the system, the CPU module restarts in the same
manner as the initial start-up and carry out normal operation.

b) If the check box “Extended Base Detach Error ” is selected;

In case of failure of an expansion base, other modules operate in accordance with the error process setting in the
basic parameter settings.
If the basic parameter was set to maintain output under error occurrence, other modules maintain the last output.

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6.7.2 Data synchronization area setting

(1) M area setting

Setting can be made by 1 kbyte step within 1 ~ 256 kByte range.
Initial value: %MW0~%MW2000
Change in Start End method
(2) I/Q : setting by base unit
Setting can be made in base unit.
Initial value is 31 bases (error message if the setting value is less than the number of installed bases)
(3) PID : setting by block (max. 8 blocks)
For the synchronization area of the PID area, 32 PID areas are allocated for each block
- Initial value: 0 block
(4) R(W) : set R only, and automatic setting for W
Synchronization area for R(W) area
- Initial value: %RW0~%RW2000(%WW0~%WW2000, %WW32768~%WW34768)

Caution
(1) The M area retain can be set up in the “Basic Parameter Setting.” For details, see “5.5.3 Data Retain Area
Setting.”
(2) When the master/standby CPUs are performing redundant operation, followings are automatically
synchronized.
(a) L (high speed link flag), N(P2P parameter setting) device area
(b) F (system flag area) device area (however, individual flag areas are not synchronized).
(c) U (special module refresh area) device area (however, only installed modules are synchronized).
(3) If a variable value has been changed during monitoring by XG5000, it applies to the respective areas of the
master and standby CPUs, regardless of the data synchronization area setting.

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6.8 Setting operation of communication

Here you can set operation when FEnet module’s cable is disconnected. According to setting, master CPU and
Standby CPU are switchted automatically when FEnet module is disconnected.

6.8.1 Automatic master switchover

(1) Automatic master switchover setting

When the cable of FEnet set as server or server connection is disconnected, you have to check the
Automatic switchover for automatic master switchover. This setting is applied in case of redundancy
operation

(2) Detail option

Here sets the condition for automatic master switchover through detail option. This means setting the group
for each FEnet module installed at main base. Each module can be set as same group or not. When
automatic master switchove setting and detail option setting is done, if the following two conditions are met,
master switchove occurs.
(a) All master base FEnet module belonging to one group are disconnected and
(b) At least one standby base FEnet module belonging to the above group is under normal connection
status

For example, In case you set slot 1 and slot 2 as group 1, slot 3 and slo4 as group 2 and slot 5 as group3,
master switchover occurs under the following three conditions. (We assumes that FEnet modules on standby
base are normal connection status)
(a) Slot 1 and slot 2 are disconnected or
(b) Slot3 and slot4 are disconnected or
(c) Slot 5 is disconnected

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(3) Adding switchover condition items

-Cable disconnection: When the cable (media) is disconnected at the FEnet module, switchover is done
within 1s by updating the flag instantly.
- Server disconnection: through the cable (media) is disconnected at the FEnet module, switchover is not
done during connection wait time.
(But, when connection wait time is set as more than 5s, switchover is done within max. 6s)

6.8.2 Global status variable

After installing FEnet module, you can check the server connection status of FEnet module and physical
cable connection status through Global variable at XG5000. In order to monitor global variable, register
relevant variable at Variable Monitoring Window after executing [Edit]-[Register Special/Communication
Module Variable] in XG5000. And these variables can be used at user program

(1) Sever connection status variable

Sever connection status variable indicates connection status of each client connected to server. Each bit
indicates each client status in order of connection to server and if bit is on, it is normal connection status.
Each bit indicates status of each client in the order as connected and if it's ON, its normal connection.

(2) Link up/down information variable

Link up/down information variable indicates physical cable connection status of relevant FEnet module. If
variable is on, it means normal connection and if variable is off, it means disconnection or detachment

6.8.3 ONE IP Solution

You can connect to the master base FEnet module of XGR redundancy system with one IP regardless of
master switchover through One IP Solution. For this, in case of master switchover, master base FEnet module
and standby FEnet module change each other’s IP address

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(1) IP setting
You set IP of FEnet module at standard setting window after registering FEnet module at XG-PD. If you check
ONE IP Solution of standard setting window, ONE IP Solution function will be activated. Unlike when ONE IP
Solution is not used, you can set only one IP address (For how to set IP address when ONE IP Solution is not
activated, refer to FEnet user manual). When using ONE IP Solution, IP address should be even number.
That IP address becomes IP address of master base FEnet module and master base FEnet module’s IP
address + 1 becomes IP address of standby base FEnet module

(2) IP change
If you use ONE IP Solution, in case of master switchover caused by error, communication disconnection,
master base and standby FEnet modules change each other’s IP address. For this, after master switchover,
individual module reset is conducted.

Caution
(1) Individual module reset should be complete after master switchover so let no master switchover occurs again
within 3 second (time for completing individual module reset) after master switchover.

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6.9 Fault Mask Function

6.9.1 Applications and operations

(1) Fault mask helps a program keep operating even though a module is in trouble during operation. A module
designated as fault mask normally works until a fault occurs.

(2) If an error occurs on a module on which fault mask is set, the module stops working but the entire system
keeps working.

(3) If a fault occurs in a module during operation, the CPU module sets the error flag and “PS LED” on the front is
“On.” The error is displayed when accessing to XG5000.

6.9.2 Fault mask setting

(1) Fault mask can be set by the online menu of XG5000. For the details, please refer to the user’s manual of
XG5000.

(2) Fault mask setting by a program is not available. You can monitor the fault mask flag with program.
(Refer to appendix1. flag list)

6.9.3 Releasing fault mask

Fault mask is released only by the following methods.
(1) Releasing the setting in the online menu of XG5000
(2) Releasing by overall reset
(3) Automatically releasing in case memory backup is failed due to low battery level and other causes

Note that the fault mask is not released even in the following cases.
(1) Power Off→On
(2) Operation mode change
(3) Program download
(4) Reset key(released only when it is pressed for 3 seconds and longer)
(5) Data clear

Caution
(1) If releasing fault mask with error flag in the CPU module not cleared although the causes of an error are
eliminated, the system stops. Please check the state of error flag before releasing fault mask flag.
(2) To remove an error flag, release it after setting I/O skip in the respective module. For details, see
[XG5000 online help desk >>I/O Skip.
(3) In case of XGR-CPU V1.8 or above, if you don’t set fault mask, warning message appears when
connecting CPU via XG5000. In case of XGR-CPU V1.8 or above, “Warning for fault mask removal”
option is added at Redundancy parameter.

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6.10 I/O Module Skip Function

6.10.1 Applications and operations

During operation, the I/O module skip function excludes a designated module from the operation. For the
designated module, the data update and fault diagnostics of I/O data stops as soon as being designated. It is
available when temporarily operating it with the fault excluded.

6.10.2 Setting and processing I/O data

(1) It can be set at the unit of I/O module.
(For further information about setting, please refer to the user’s manual of XG5000)

(2) Input(I) image area suspends input refresh, so it maintains the value set before skip setting. However, even in
the case, the image manipulation by forcible On/Off is still effective.

(3) The actual output of output module is Off when setting the skip function but it changes depending on a user
program’s operation, irrespective of skip setting. After the skip setting, the output value of output module can not
be controlled by forcible On/Off.

(4) The skip function is identically executed even when using I/O function.

6.10.3 Releasing skip function

The I/O module skip function is released only by the method of setting.
(1) Releasing by the online menu of XG5000
(2) Releasing by overall reset
(3) Automatically releasing in case memory backup is failed due to low battery level and other causes

Note that the fault mask is not released even in the following cases.
(1) Power Off→On
(2) Operation mode change
(3) Program download
(4) Reset key(released only when it is pressed for 3 seconds and longer)
(5) Data clear

Caution
If any fault is found in a module when releasing the skip function, the system may stop. Before releasing the skip
function, make sure to release the skip with fault mask set and check the operation of a module.

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6.11 Base Skip Function

6.11.1 Purpose and outline of the operation

Base skip is the function to exclude the designated base from operation during an operation. The excluded base
stops all functions from the skip. This function is useful to continue operation by excluding a failed base or replace
the base.

6.11.2 Setting method

• This setting can be done for each base.

6.11.3 Releasing skip function

Base skip can be released by following methods only.
• Selecting XG5000’s [Online >> I/O Skip Setting] menu
• Release by Overall Reset
• Automatic release at backup memory lost by battery voltage drop, etc.

Note that followings do not release the failure mask;

• power Off → On,
• operation mode change,
• program download,
• reset key operation (however, released if pressed for 3 seconds or longer), and
• data clear

Caution
(1) When expansion driver is detached, all modules in base are automatically initialized.
(2) When expansion driver is detached, digital output module operates as set in Output control settings of Basic
parameter.
(3) When expansion driver is detached, analog output module operates as set in Output type setting
(4) For more detail, refer to each module’s user manual.

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6.12 Module Replacement Function during Operation

A module can be replaced during operation in the redundant system. There are two methods. First, use “Hot
swapping option” function of [table 5.1.4] redundancy parameter described in Chapter 5. Check the “How swapping
option” and download only “Redundancy parameter” to PLC during RUN mode. Then replace base and module.
Second, use “OnlineModule changing wizard or Base changing wizard”

Warning
The special modules which can be normally replaced are A/D, D/A, TC, and RTD. HSC and APM
modules can be replaced but the previous data cannot be maintained.
Some communication modules (XGL-PMEA, XGL-DMEA) can be connected as long as network is
set(using Sycon software).
(1) When replacing a module, align the bottom of the base and the holding part of a module before inserting it.
A wrong insertion may cause ‘system down.’

6.12.1 Module replacement in redundant system

CPU module, power module, I/O module, a certain special modules, and the base module can be replaced during
redundant operation. For safety purpose, this Manual provides the methods using the Module Replacement Wizard,
Base Replacement Wizard. And “Hot swapping option” in redundancy parameter is also available to replace the
module.

6.12.2 Replacing I/O module in redundant system

To replace a module in the base in redundant operation, change the main base to backup operation status and cut-
off the power. If the Module Replacement Wizard is used, the I/O and internal data of the module is lost.
(If you use “Hot swapping option”, you can change in RUN mode)

To replace a module, users can use XG5000’s [Online >> Module Replacement Wizard] function.
For details, see XG5000 User Manual [Online >> Module Replacement Wizard].

Caution
Replacement of the main base (base 0) using the XG5000’s [Online >> Module Replacement Wizard]
function is available only during single CPU operation.

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6.12.3 Replacing base module in redundant system

Bases can be replaced in redundant operation. For a line-configured system, the last base only can be replaced.
For a ring-configured system, all the bases of the 1-31 bases which are participating in the operation can be
replaced.

For safety purpose, this Manual provides XG5000’s [Online >> Base Replacement Wizard] function. For further
details, see XG5000 User Manual [Online >> Base Module Replacement Wizard].
(If you use “Hot swapping option”, you can change in RUN mode)

Caution
In this process, only one base can be replaced at a time for safety reason.
The main base cannot be replaced during operation.
Ring configuration: available to change all extension bases
Line configuration: available to change last extension base because of line configuration

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Chapter 7 Expansion Drive Module

7.1 Performance specifications

Specification
Items
100BASE-FX (multi) 100BASE-FX (single) 100BASE-TX

Transmission Method Base band

Max. Expansion distance
2km 15km 100m
between nodes
Transmission
Specification

Max. Number of nodes 31

Max. Protocol size 1,516 byte

Communication access
CSMA/CD
method
Frame error check
CRC 32 = X32 + X26 + X23+ ,,,,, + X2 + X + 1
method

Cable Multi Mode Fiber Single Mode Fiber FTP / STP / SFTP

Transmission speed 100Mbps

Communication
Media

Flow control Full Duplex

Communication port 2 port

Cross / Direct Cable is supported

Auto Crossover
(Recommend : Cross cable)

Network Topology Ring, Line

Conversion

Ring  Line(Bus) 10ms

Time

Line(Bus)  Ring 500ms

Dimensions(mm) 98(H) X 27(W) X 90(D)

Specification
Basic

DBSF(S): 850 mA / DBSH(S): 660 mA / DBST: 490 mA

Current consumption (mA) DBDF(S): 770 mA / DBDH(S): 674 mA / DBDT: 359 mA
DBSF(S): 102 g / DBSH(S): 101 g / DBST: 99 g
Weight (g) DBDF(S): 100 g / DBDH(S): 98 g / DBDT: 98 g

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7.2 Identification and Function

XGR-DBSH(S)/DBDH(S) XGR-DBST/DBDT XGR-DBSF(S)/DBDF(S)

No. Name Description and Functions

Status indicator LED of expansion drive module

(1) TX/RX (yellow): when there is communication data to the channel
(2) LINK (green): indicates the link connection of the channel
(a) 1 indicates the upper channel (④ - a) status,
Module Status and 2 indicates the lower channel (④ - b) status
① Indicator
(3) RING (green)
(a) On: the expansion network is ring configuration
(b) Blink: the expansion network is switched from ring to bus
(c) Off: the expansion network connection is off,
or in bus configuration from the first

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(4) RELAY (green)

(a) On: the module neighboring the two channels are connected and conducts
as a data relay
(b) Off: the module neighboring the two channels are connected and does not
conduct as a data relay
(5) CHK (green)
(a) On: indicates CPU’s WAR LED
(b) Blink: station No. in the expansion network conflict (other station numbers)
(6) FAULT (red)
(a) On: network station No. conflict (self station No.)
(b) Blink: frame error occurred
(7) RUN (green)
(a) On: CPU operation mode is RUN
(b) Blink: expansion drive is in wait state for CPU recognition
(c) Off: CPU operation mode is STOP
(8) I/F (green)
(a) Blink: in normal I/F with expansion manager
(b) Off: I/F with expansion manager unavailable
(9) PADT On (green): on in PADT connection
(10) ERR On (red): CPU operation mode is ERR
Switch for setting expansion base No.
(1) x10 for 10 digit setting, x1 for 1 digit setting
② Base Setting Switch
(2) Max. 31 bases can be set up
(3) Error LED on at station No. conflict or setting more than 31 station numbers
③ USB Connector Connector for peripheral devices (XG5000 etc.) (USB 1.1 supported)
Connector for expansion base connection.
(1) 2 connectors are provided for ring connection without additional switching
Expansion Network
④ device
Connector
(2) Optical-optical, electrical-electrical, and optical-electrical models are provided
to enable network construction using mixed electrical/optical
Pressing this switch will trigger module reset operation.
(1) Used to reset module only.
Expansion Drive
⑤ (2) Make sure to skip the module before conducting module reset
Module Reset Switch
(3) Take care that resetting without skip setting of the respective base will cause
module isolation error.

7-3
Chapter 7. Expansion Drive Module

7-4
 Chapter 8. Power Module

Chapter 8 Power Module

This chapter describes the selection, type and specifications of power module.

8.1 Type and Specification

We provide diverse types according to input voltage and output capacity. Select right module according to environment and system.
[Table 8.1.1] Power module specification
Item XGR-AC12 XGR-AC22 XGR-AC13 XGR- AC23 XGR-DC42

Rated input voltage 110 VAC 220 VAC 110 VAC 220 VAC 24 VDC

Input voltage range 85V~132VAC 176V~264VAC 85V~132VAC 176V~264VAC 19.2 ~ 28.8 VDC

Input frequency 50 / 60 Hz (47 ~ 63 Hz) -

Max. input power 110 VA / 42 W 176 VA / 72 W -

Input Inrush current 20A peak and lower (within8 ㎳ ) 80A peak and lower

Efficiency 65% or higher

Built in(not replaceable by a user) - AC power: 250V / 3.15A ( Time-lag Type ) UL approved
Input fuse
- DC power: 125V/10A (Time-lag type) UL approved
Allowed
instantaneous Within 20 ㎳
interruption
Output voltage 5VDC (±2%)
Output current 5.5A 8.5A 7.5A
Output
Output power 27.5W @ 55℃ 46.75W @ 55℃ 37.5W @ 55℃
Over current
6.0 A ~ 13.0 A 9.3 A ~ 17.0 A 9.0 A~17.0 A
protection
Purpose RUN contact (refer to 8.2)
Rated switching
24VDC, 0.5A
voltage/current
Relay
Output Min. switching load 5VDC, 1 ㎃
Response time Off→On/ On→Off: 10 ㎳ and lower/12 ㎳ and lower
Life Mechanical life: 20 million and more times, electrical life: rated switching current: 100 thousand and more times
Voltage status display LED On when output voltage is normal

Specification of cable 0.75 ~ 2 mm2

Available clamped terminal RAV1.25-3.5, RAV2-3.5

Dimension (W x H x D mm) 55 x 95 x 90 55 x 95 x 110
Weight 326g 382g 334g 384g 417g
Power part of
Applied base and install position Power part of basic/expansion base Power part of expansion base
basic/expansion base

Note
(1) Allowable instantaneous interruption time
(a) The time that the normal output voltage is maintained(normal operation) when AC110/220V/DC24V input voltage is
less
than rating value (AC 85/176V/DC 19.2V)
(2) Over current protection
(a) If a current over the rated level is allowed on 5VDC circuit, an over current protective system cuts off the circuit, suspending
the system.
(b) If there is any overcurrent, the system should be restarted after eliminating the causes such as low current capacity, short-
circuit and etc.

8-1
 Chapter 8. Power Module

8.2 Parts’ Names

It describes the names and applications of parts of the power module.

[Table 8.2.1] Parts’ names and purpose

No. Name Purpose

1 Power LED 5VDC Power display LED

2 NC Not used

3 RUN Terminal Displaying RUN state of a system

(1) On when CPU is normal RUN mode.
(2) Off when the stop error of CPU occurs.
(3) It is Off when the mode of CPU turns to STOP.
4 PE Terminal Functional Grounding terminal for reliability of system operation.
5 LG Terminal Grounding terminal of power filter
Power input terminal
(1) XGR-AC12, XGP-AC13: 110VAC connection
6 Power input Terminal
(2) XGR-AC22, XGP-AC23: 220VAC connection
(3) XGR-DC42 : DC 24V connection
7 Terminal cover Terminal unit protection cover

8-2
 Chapter 8. Power Module

8.3 Selection
The selection of power module is determined by the current that input power voltage and power module should supply to the system,
that is, the sum of current consumption of digital I/O module, special module and communication module that are installed on a same
base with the power module.
If it exceeds the rated output capacity of power module, the system does not properly work.
Select a power module by considering the power current of each module when structuring a system.
[Table 8.3.1] Current consumption by modules
Consumption Consumption
Item Name current Item Name current
(Unit: mA) (Unit: mA)
XGF-AV8A 420
XGR-CPUH/T 980
CPU module XGF-AC8A 420
XGR-CPUH/F 1,310 Analog input module XGF-AD4S 610
XGR-DBST 550 XGF-AD8A 420
Expansion drive
XGR-DBSF 550 XGF-AD16A 330
module
XGR-DBSH 550 XGF-DV4A 190 (250)
XGI-D21A 20 XGF-DC4A 190 (400)
XGI-D22A 30 Analog output XGF-DC4S 200 (220)
XGI-D22B 30 module XGF-DV8A 147 (180)
DC24V input module XGI-D24A 50 XGF-DC8A 243 (300)
XGI-D24B 50 XGF-DV4S 200 (150)
XGI-D28A 60 High speed counter XGF-HO2A 270
XGI-D28B 60 module XGF-HD2A 330
AC110V input module XGI-A12A 30 XGF-PO3A 400
AC220V input module XGI-A21A 20 XGF-PO2A 360
XGQ-RY1A 250 XGF-PO1A 340
Relay output module XGQ-RY2A 500 XGF-PD3A 860
XGQ-RY2B 500 XGF-PD2A 790
XGQ-TR2A 70 XGF-PD1A 510
XGQ-TR2B 70 XGF-PO4H 430
Positioning module
Transistor output XGQ-TR4A 130 XGF-PO3H 420
module XGQ-TR4B 130 XGF-PO2H 410
XGQ-TR8A 230 XGF-PO1H 400
XGQ-TR8B 230 XGF-PD4H 890
XGF-PD3H 850
Triac output module XGQ-SS2A 300
XGF-PD2H 600
XGF-PD1H 520
I/O module XGH-DT4A 110
XGF-RD4A 450
RTD input module
XGL-EFMF 640 XGF-RD4S 783
FEnet I/F module Thermocouple input
XGL-EFMT 410 XGF-TC4S 610
(Optical/Electricity) module
XGL-ESHF 1,200 Event input module XGF-SOEA 700
Motion control
XGL-EIMF 490 XGF-M16M 640
module
PAPIEnet I/F Module
XGL-EIMT 335
Analog I/O module XGF-AH6A 770
XGL-EIMH 400

8-3
 Chapter 8. Power Module

Consumption Consumption
Item Name current Item Name current
(Unit: mA) (Unit: mA)
Ethernet/IP I/F
XGL-EIPT 400 Dnet I/F module XGL-DMEA 440
module
XGL-C22A 330 XGL-EDMF 410
FDEnet I/F module
Cnet I/F module XGL-C42A 300 XGL-EDMT 410
XGL-CH2A 340 Pnet I/F module XGL-PMEA 560
Rnet I/F module XGL-RMEA 410 - - -

( ) means the current consumption for external DC24V.

8.4 Example of Current Consumption/Power Calculations

It describes which power module should be used for the XGR system with the following module.

AC Power
100V~240V
Power CPU
I5V
Comm.Comm.Output Input Special
Constant
voltage DC5V
transformer Iin
Iout

Load
DC Power AC Power
24V 100V~240V

[Figure 8.4.1] Example of use of power module

8.4.1 In case of basic base
Though you equip all modules that consume maximum current, it is not higher than 5.5A. So consider input voltage and select
XGR-AC12 or XGT-AC22
[Table 8.4.1] Consumption current/power calculation of basic base
No. of
Type Name Consumption current (5V)
equipment
CPU module XGR-CPUH/F 1 1.31A
Basic base XGR-M02P 1 0.2A
XGR-M06P 1 0.2A
FEnet module XGL-EFMF 6 0.61A
Consumption current (Total) / Power (Total) 1.31A + 0.61A*6 = 4.97A / 4.97×5V = 24.85W

8-4
 Chapter 8. Power Module

8.4.2 In case of expansion base

Calculate the consumption current of module equipped at expansion base and select 5.5A or 8.5A
[Table 8.4.2] Consumption current/power calculation of basic base
No. of
Type Name Consumption current (5V)
equipment
Expansion drive XGR-DBSF 1 0.65A
module
Expansion base XGB-E12RP 1 0.21A
Input module XGI-D24A 2 0.05A
Output module XGQ-RY2A 6 0.5A
A/D conversion XGF-AD4S 2 0.61A
module
Profibus-DP XGL-PMEA 2 0.56A
0.65A + 0.21A+0.05A*2 + 0.5A*6 + 0.61A*2 + 0.56A*2 = 6.30A
Consumption current (Total) / Power (Total)
/ 6.30A × 5V = 31.50 W

Since total of consumption current (5V) is 6.17A, use one among XGR-AC13, XGP-AC23 according to input voltage.
If power module is less than a necessary capacity, reliability of system is not guaranteed.

Note
If efficiency of power module is applied to power (5V), the user can estimates the maximum input power of PLC system.
Ex) Total of consumption power (5V) / Power module efficiency (Min.) = 100 W / 0.65 % = 154 W

8-5
Chapter 8. Power Module

8-6
 Chapter 9. I/O Module

Chapter 9. I/O Module

9.1 Cautions for Selecting Module

It describes the cautions when selecting digital I/O modules used for the XGI series.

1) There are two digital input types; current sink input and current source input
Since the wiring method of external input power varies in a DC input module, it should be selected considering the
specifications of input connectors.

2) The max. simultaneous input point varies depending on a module type. That is, it may be different, depending on
input voltage and ambient temperature. Please review the specifications of input module to apply before use.

3) In case of an application for highly frequent switching or inductive load switching, the relay output module may have
a shorter life, so it needs a transistor module or triac output module, instead of it.

4) If an output module operates an inductive load(L), the max. On/Off frequency should be limited to On per 1 second
and Off per 1 second, each.

5) In case a counter timer using DC/DC converter is used as a load in an output module, setting the average current
may cause a trouble because it may have inrush current in case of On or a certain cycle during operation. Therefore,
if using the foresaid load, it is necessary to connect resistance or inductor parallel to load or alternatively use a
module of which max. load current is large.

R Load Inductor Load

Output Output
module module

6) A fuse in an output module can not be replaced. That’s why it is intended to prevent external wiring from being
damaged when the output of a module is short-circuited. Therefore, the output module may not be protected. If an
output module is destructed in any other fault mode save for short-circuit, a fuse may not work.

9-1
 Chapter 9. I/O Module

7) The following figure shows the relay life of relay output module.
It also shows the max. life of relay used for relay output.
No. of switching(×10 thousands)

100

50

30
20

10
AC 125V resistance load

DC 30V resistance load

AC 250V resistance load

0.5 1 2 3 5 10 100
Current(A)

8) A clamped terminal with sleeve can not be used for the XGI terminal strip. The clamped terminals suitable for terminal strip
are as follows(JOR 1.25-3:Daedong Electricity).

6.0mm less than 6.0mm less than

9) The cable size connected to a terminal strip should be 0.3~0.75 ㎟ stranded cable and 2.8 ㎜ thick. The cable
may have different current allowance depending on the insulation thickness.

10) The coupling torque available for fixation screw and terminal strip screw should follow the table below.

Coupling position Coupling torque range

IO module terminal strip screw(M3 screw) 42 ~ 58 N·㎝
IO module terminal strip fixation screw(M3 screw) 66 ~ 89 N·㎝

11) Transistor output module(XGQ-TR4A, XGQ-TR8A) supports terminal protector function.

Thermal Protector is the function to prevent overload and overheat.

9-2
 Chapter 9. I/O Module

9.2 Digital Input Module Specifications

9.2.1 8 point DC24V input module (source/sink type)

Module type DC Input module
Spec. XGI-D21A
Input point 8 points
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current Approx. 4 ㎃
Voltage range DC20.4~28.8V (5% and lower ripple rate )
Input derating None
On voltage / On current DC19V and higher / 3 mA and higher
Off voltage / Off current DC11V and lower / 1.7 mA and lower
Input resistance Approx. 5.6 kΩ
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
Off → On
Initial value:3ms
Response time
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
On → Off
Initial value:3ms
Withstand voltage AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 16 point/ COM
Suitable cable size Stranded cable between 0.3~0.75 ㎟ (2.8mm and smaller outer dia.)
Suitable clamped terminal R1.25-3 (Sleeve built-in clamped terminal is not available)
Current consumption(㎃) 20mA
Operation display LED On with Input On
External connection method 9 point Terminal strip connector (M3 X 6 screws)
Weight 0.1 kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 1
TB3 2
TB4 3 00
DC5V TB5 4
0 Photocoupler 01
TB1
R
TB6 5
LED TB7 6 02
R TB8 7 03
7
TB8 Internal TB9 COM
04
COM circuit
05

DC24V 06

07
* COM : TB9
COM

9-3
 Chapter 9. I/O Module

9.2.2 16 point DC24V input module (source/sink type)

Module type DC Input module
Spec. XGI-D22A
Input point 16 points
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current Approx. 4 ㎃
Voltage range DC20.4~28.8V (5% and lower ripple rate )
Input derating None
On voltage / On current DC 15V and higher / 3mA and higher
Off voltage / Off current DC 12V and lower / 1.7mA and lower
Input resistance Approx. 5.6 kΩ
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
Off → On
Initial value:3ms
Response time
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
On → Off
Initial value:3ms
Insulation withstand voltage AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 16 point/ COM
Suitable cable size Stranded cable between 0.3~0.75 ㎟ (2.8mm and smaller outer dia.)
Suitable clamped terminal R1.25-3 (Sleeve built-in clamped terminal is not available)
Current consumption(㎃) 30mA
Operation display LED On with Input On
External connection method 18 point Terminal strip connector (M3 X 6 screws)
Weight 0.12 kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 1
TB3 2
TB4 3 00
DC5V TB5 4 01
Photocoupler 02
0
TB1
TB6 5 03
R LED TB7 6 04
05
R TB8 7 06
15 TB9 8 07
TB16 Internal 08
TB10 9 09
COM
circuit TB11 10 10
TB12 11 11
12
DC24V TB13 12 13
TB14 13 14
15
* COM : TB17 TB15 14 COM
TB16 15
TB17 COM
TB18 NC

9-4
 Chapter 9. I/O Module

9.2.3 16 point DC24V input module (source type)

Module type DC Input module
Spec. XGI-D22B
Input point 16 points
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current Approx. 4 ㎃
Voltage range DC20.4~28.8V (5% and lower ripple rate )
Input derating None
On voltage / On current DC 19V and higher / 3mA and higher
Off voltage / Off current DC 11V and lower / 1.7mA and lower
Input resistance Approx. 5.6 kΩ
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
Off → On
Initial value:3ms
Response time
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
On → Off
Initial value:3ms
Insulation withstand voltage AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 16 point/ COM
Suitable cable size Stranded cable between 0.3~0.75 ㎟ (2.8mm and smaller outer dia.)
Suitable clamped terminal R1.25-3 (Sleeve built-in clamped terminal is not available)
Current consumption(㎃) 30mA
Operation display LED On with Input On
External connection method 18point Terminal strip connector (M3 X 6 screws)
Weight 0.12 kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 1
TB3 2 00
TB4 3 01
02
DC5V TB5 4
Photocoupler 03
0
TB1
TB6 5 04
R 05
LED TB7 6 06
R TB8 7 07
08
15 Internal TB9 8 09
TB16
TB10 9 0A
COM circuit
TB11 10 0B
0C
DC24V TB12 11 0D
TB13 12 0E
0F
* COM : TB17
TB14 13 COM
TB15 14
TB16 15
TB17 COM
TB18 NC

9-5
 Chapter 9. I/O Module

9.2.4 32 point DC24V input module (source/sink type)

Module type DC Input module
Spec. XGI-D24A
Input point 32 points
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current Approx. 4 ㎃
Voltage range DC20.4~28.8V (5% and lower ripple rate )
Input derating Refer to the below derating level
On voltage / On current DC 19V and higher / 3mA and higher
Off voltage / Off current DC 11V and lower / 1.7mA and lower
Input resistance Approx. 5.6 kΩ
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
Off → On
Initial value:3ms
Response time
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
On → Off
Initial value:3ms
Insulation withstand voltage AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 32points / COM
Suitable cable size 0.3 ㎟
Current consumption(㎃) 50mA
Operation display LED On with Input On
External connection method 40point connector
Weight 0.1 kg
Circuit diagram No Contact No Contact
B20 0 A20 16
DC5V 1
Photocoupler B19 A19 17
0 B20
B18 2 A18 18
R LED B20 A20
B17 3 A17 19 B19 A19
R

31 B16 4 A16 20 B18 A18

A05 Internal B17 A17
B15 5 A15 21 B16 A16
COM Circuit
B14 6 A14 22 B15 A15
B14 A14
DC24V B13 7 A13 23 B13 A13
8 B12 A12
* COM : B02, B01, A02, A01 B12 A12 24
B11 A11
B11 9 A11 25 B10 A10
B09 A09
90 B10 10 A10 26 B08 A08
80 B09 11 A09 27 B07 A07
B06 A06
70 DC28.8V B08 12 A08 28 B05 A05
On rate
60 B07 13 A07 29 B04 A04
(%) B03 A03
50 B06 14 A06 30 B02 A02
40 B05 15 A05 31 B01 A01

0 10 20 30 40 50 55 B04 NC A04 NC
Ambient temp(℃) B03 NC A03 NC
Derating level B02 COM A02 COM
B01 COM A01 COM

9-6
 Chapter 9. I/O Module

9.2.5 32 point DC24V input module (source type)

Module type DC Input module
Spec. XGI-D24B
Input point 32 points
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current Approx. 4 ㎃
Voltage range DC20.4~28.8V (5% and lower ripple rate )
Input derating Refer to the below derating level
On voltage / On current DC19V and higher / 3 mA and higher
Off voltage / Off current DC 11V and lower / 1.7mA and lower
Input resistance Approx. 5.6 kΩ
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
Off → On
Initial value:3ms
Response time
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
On → Off
Initial value:3ms
Insulation withstand voltage AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 32 points / COM
Suitable cable size 0.3 ㎟
Current consumption(㎃) 50mA
Operation display LED On with Input On
External connection method 40point connector
Weight 0.1 kg
Circuit diagram No Contact No Contact
B20 0 A20 16
DC5V
B19 1 A19 17
0 B20
Photocoupler
R LED B18 2 A18 18
B20 A20
R B17 3 A17 19 B19 A19
31 B16 4 A16 20 B18 A18
A05 Internal B17 A17
COM Circuit B15 5 A15 21 B16 A16

DC24V B14 6 A14 22 B15 A15

B14 A14
B13 7 A13 23 B13 A13
* COM : B02, B01, A02, A01
B12 8 A12 24 B12 A12
B11 A11
B11 9 A11 25 B10 A10
B09 A09
B10 10 A10 26
90 B08 A08
B09 11 A09 27 B07 A07
80 B06 A06
B08 12 A08 28
70 DC28.8V B05 A05
On rate B07 13 A07 29 B04 A04
60 B03
(%) 14
A03
50 B06 A06 30 B02 A02
15 B01 A01
40 B05 A05 31
B04 NC A04 NC
0 10 20 30 40 50 55
Ambient temp(℃) B03 NC A03 NC

Derating level B02 COM A02 COM

B01 COM A01 COM

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 Chapter 9. I/O Module

9.2.6 64 point DC24V input module (source/sink type)

Module type DC Input module
Spec. XGI-D28A
Input point 64 points
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current Approx. 4 ㎃
Voltage range DC20.4~28.8V (5% and lower ripple rate )
Input derating Refer to the below derating level
On voltage / On current DC 19V and higher / 3mA and higher
Off voltage / Off current DC 11V and lower / 1.7mA and lower
Input resistance Approx. 5.6 kΩ
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
Off → On
Initial value:3ms
Response time
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
On → Off
Initial value:3ms
Insulation withstand voltage AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 32point / COM
Suitable cable size 0.3 ㎟
Current consumption(㎃) 60mA
Operation display LED On with Input On (32point LED on by switching)
External connection method 40point connector × 2
Weight 0.15 kg
Circuit diagram No Contact No Contact No Contact No Contact
1B20 0 1A20 16 2B20 32 2A20 48
DC5V 1B19 1 1A19 17 2B19 33 2A19 49
0 Photocoupler
1B20 1B18 2 1A18 18 2B18 34 2A18 50 B20 A20
R LED B19 A19
1B17 3 1A17 19 2B17 35 2A17 51
R B18 A18
63 1B16 4 1A16 20 2B16 36 2A16 52 B17 A17
2A05 Internal
B16 A16
COM 1B15 5 1A15 21 2B15 37 2A15 53
Circuit B15 A15
1B14 6 1A14 22 2B14 38 2A14 54 B14 A14
B13 A13
DC24V 1B13 7 1A13 23 2B13 39 2A13 55 B12 A12
A Switching 8 B11 A11
1B12 1A12 24 2B12 40 2A12 56
B10 A10
B Circuit
1B11 9 1A11 25 2B11 41 2A11 57 B09 A09
B08 A08
1B10 10 1A10 26 2B10 42 2A10 58 B07 A07
* COM : 1B02, 1B01 A: Displaying 0~31
B06 A06
2B02, 2B01 1B09 11 1A09 27 2B09 43 2A09 59
B: Displaying 32~63 B05 A05
1B08 12 1A08 28 2B08 44 2A08 60 B04 A04
90 B03 A03
80 1B07 13 1A07 29 2B07 45 2A07 61 B02 A02
70 B01 A01
1B06 14 1A06 30 2B06 46 2A06 62
On rate 60
(%) 50 1B05 15 1A05 31 2B05 47 2A05 63
40 DC28.8V
30 1B04 NC 1A04 NC 2B04 NC 2A04 NC
20
1B03 NC 1A03 NC 2B03 NC 2A03 NC
0 10 20 30 40 50 55
Ambient temp(℃) 1B02 COM 1A02 NC 2B02 COM 2A02 NC
Derating level 1B01 COM 1A01 NC 2B01 COM 2A01 NC

9-8
 Chapter 9. I/O Module

9.2.7 64 point DC24V input module (source type)

Module type DC Input module
Spec. XGI-D28B
Input point 64 points
Insulation method Photo coupler insulation
Rated input voltage DC24V
Rated input current Approx. 4 ㎃
Voltage range DC20.4~28.8V (5% and lower ripple rate )
Input derating Refer to the below derating level
On voltage / On current DC 19V and higher / 3mA and higher
Off voltage / Off current DC 11V and lower / 1.7mA and lower
Input resistance Approx. 5.6 kΩ
1ms/3ms/5ms/10ms/20ms/70ms/100ms(Set by CPU Parameter)
Off → On
Initial value:3ms
Response time
1ms/3ms/5ms/10ms/20ms/70ms/100ms (Set by CPU Parameter)
On → Off
Initial value:3ms
Insulation withstand voltage AC560V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 32 points / COM
Suitable cable size 0.3 ㎟
Current consumption(㎃) 60mA
Operation display LED On with Input On (32point LED on by switching)
External connection method 40point connector × 2
Weight 0.15 kg
Circuit diagram No Contact No Contact No Contact No Contact
1B20 0 1A20 16 2B20 32 2A20 48
DC5V 1 49
1B19 1A19 17 2B19 33 2A19
0 Photocoupler
1B20
R
LED 1B18 2 1A18 18 2B18 34 2A18 50 B20 A20
R 1B17 3 1A17 19 2B17 35 2A17 51 B19 A19
B18 A18
63
2A05 Internal 1B16 4 1A16 20 2B16 36 2A16 52 B17 A17
COM Circuit 1B15 5 1A15 21 2B15 37 2A15 53 B16 A16
B15 A15
DC24V 1B14 6 1A14 22 2B14 38 2A14 54 B14 A14
B13 A13
A Switching 1B13 7 1A13 23 2B13 39 2A13 55 B12 A12
B Circuit 1B12 8 1A12 24 2B12 40 2A12 56 B11 A11
B10 A10
A: Displaying 0~31 1B11 9 1A11 25 2B11 41 2A11 57 B09 A09
* COM : 1B02, 1B01
/2B02, 2B01 B: Displaying 32~63 1B10 10 1A10 26 2B10 42 2A10 58 B08 A08
B07 A07
1B09 11 1A09 27 2B09 43 2A09 59 B06 A06
B05 A05
1B08 12 1A08 28 2B08 44 2A08 60
90 B04 A04
80 1B07 13 1A07 29 2B07 45 2A07 61 B03 A03
70 B02 A02
60 1B06 14 1A06 30 2B06 46 2A06 62 B01 A01
On rate 50
(%) 40 DC28.8V 1B05 15 1A05 31 2B05 47 2A05 63
30
20 1B04 NC 1A04 NC 2B04 NC 2A04 NC
0 10 20 30 40 50 55 1B03 NC 1A03 NC 2B03 NC 2A03 NC

Ambient temp(℃) 1B02 COM 1A02 NC 2B02 COM 2A02 NC

Derating level 1B01 COM 1A01 NC 2B01 COM 2A01 NC

9-9
 Chapter 9. I/O Module

9.2.8 16 point AC110V input module

Module type AC Input module
Spec. XGI-A12A
Input point 16 points
Insulation method Photo coupler insulation
Rated input voltage AC100-120V(+10/-15%) 50/60 ㎐(±3 ㎐) (5% and lower distortion)
Rated input current Approx. 8 ㎃ (AC100,60 ㎐) , approx. 7 ㎃ (AC100,50 ㎐)
Inrush current Max. 200 ㎃ 1 ㎳ and lower(AC132V )
Input derating Refer to the below derating level
On voltage / On current AC80V and higher / 5 mA and higher(50 ㎐,60 ㎐)
Off voltage / Off current AC30V and lower / 1 mA and lower (50 ㎐,60 ㎐)
Input resistance Approx. 12 kΩ(60 ㎐), approx. 15 kΩ(50 ㎐)
Off → On 15 ms and lower(AC100V 50 ㎐,60 ㎐)
Response time
On → Off 25 ms and lower(AC100V 50 ㎐,60 ㎐)
Insulation withstand voltage AC1780V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 16 point/ COM
Suitable cable size Stranded cable between 0.3~0.75 ㎟ (2.8mm and smaller outer dia.)
Suitable clamped terminal R1.25-3 (Sleeve built-in clamped terminal is not available)
Current consumption(㎃) 30mA
Operation display LED On with Input On
External connection method 18point Terminal strip connector (M3 X 6 screws)
Weight 0.13 kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 1
0 TB1
Photocoupler DC5V
R TB3 2
LED
R 3
R TB4
15 TB5 4 00
TB16 Internal 01
TB6 5 02
COM Circuit 03
TB7 6 04
05
AC110V
TB8 7 06
07
* COM : TB17 TB9 8 08
09
TB10 9
90 0A

TB11 10 0B
80 0C
0D
AC120V TB12 11
70 0E
On rate 12 0F
TB13
(%) 60 COM

50 AC132V TB14 13
40 TB15 14
TB16 15
0 10 20 30 40 50 55
TB17 COM
Ambient temp(℃)
Derating level TB18 NC

9-10
 Chapter 9. I/O Module

9.2.9 8 point AC220V input module

Module type AC input module
Spec. XGI-A21A
Input point 8 points
Insulation method Photo coupler insulation
Rated input voltage AC100-240V(+10/-15%) 50/60 ㎐(±3 ㎐) (5% and lower distortion)
Rated input current Approx. 17 ㎃ (AC200,60 ㎐) , approx. 14 ㎃ (AC200,50 ㎐)
Inrush current Max. 500 ㎃ 1 ㎳ and lower(AC264V)
Input derating Refer to the below derating level
On voltage / On current AC80V and higher / 5 mA and higher(50 ㎐,60 ㎐)
Off voltage / Off current AC30V and lower / 1 mA and lower (50 ㎐,60 ㎐)
Input resistance Approx. 12 kΩ(60 ㎐), approx. 15 kΩ(50 ㎐)
Off → On 15 ms and lower(AC200V 50 ㎐,60 ㎐)
Response time
On → Off 25 ms and lower(AC200V 50 ㎐,60 ㎐)
Insulation withstand voltage AC2830V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 8 points / COM
Suitable cable size Stranded cable between 0.3~0.75 ㎟ (2.8mm and smaller outer dia.)
Suitable clamped terminal R1.25-3 (Sleeve built-in clamped terminal is not available)
Current consumption(㎃) 20mA
Operation display LED On with Input On
External connection method 9point Terminal strip connector (M3 X 6 screws)
Weight 0.13 kg
Terminal
Circuit diagram Contact
block
TB1 0
0 Photocoupler DC5V
TB1
R TB2 1
LED
R
R TB3 2
7 TB8 Internal TB4 3
00
COM Circuit TB5 4
01
AC110/220V TB6 5
02
* COM : TB9 TB7 6
03

TB8 7 04
37℃ 49℃
90 TB9 COM 05
AC240V
80 06

70 07

On rate
60 COM
(%)
50 AC264V
40

0 10 20 30 40 50 55
Ambient temp(℃)
Derating level

9-11
 Chapter 9. I/O Module

9.2.10 8 point AC220V isolated input module

Module type AC input module
Spec. XGI-A21C
Input point 8 points
Insulation method Photo coupler insulation
Rated input voltage AC100-240V(+10/-15%) 50/60 ㎐(±3 ㎐) (5% and lower distortion)
Rated input current Approx. 17 ㎃ (AC200,60 ㎐) , approx. 14 ㎃ (AC200,50 ㎐)
Inrush current Max. 500 ㎃ 1 ㎳ and lower(AC264V)
Input derating Refer to the below derating level
On voltage / On current AC80V and higher / 5 mA and higher (50 ㎐,60 ㎐)
Off voltage / Off current AC30V and lower / 1 mA and lower (50 ㎐,60 ㎐)
Input resistance Approx. 12 kΩ(60 ㎐), approx. 15 kΩ(50 ㎐)
Off → On 15 ms and lower(AC200V 50 ㎐, 60 ㎐)
Response time
On → Off 25 ms and lower(AC200V 50 ㎐, 60 ㎐)
Insulation withstand voltage AC2830V rms/3 Cycle (altitude 2000m)
Insulation resistance 10 ㏁ and higher by Insulation ohmmeter
Common method 1 point / COM
Suitable cable size Stranded cable between 0.3~0.75 ㎟ (2.8mm and smaller outer dia.)
Suitable clamped terminal R1.25-3 (Sleeve built-in clamped terminal is not available)
Current consumption(㎃) 20mA
Operation display LED On with Input On
External connection method 18 point Terminal strip connector (M3 X 6 screws)
Weight 0.13 kg
Terminal
Circuit diagram Contact
block
TB1 0
0
TB1
Photocoupler DC5V TB2 COM0
R
0 LED TB3 1
R
R TB4 COM1
TB2 Internal
COM0 TB5 2
circuit
AC110/220V TB6 COM2
TB7 3
TB8 COM3
90 37℃ 49℃
TB9 4
80 AC240V
TB10 COM4
70 5
On rate TB11
60 TB12 COM5
(%) AC264V
50 TB13 6
40 TB14 COM6
TB15 7
0 10 20 30 40 50 55
TB16 COM7
Ambient temp(℃) NC
TB17
Derating level TB18 NC

9-12
 Chapter 9. I/O Module

9.3 Digital Output Module Spec.

9.3.1 8 point relay output module

Module type Relay output module
Spec. XGQ-RY1A
Output point 8 points
Insulation method Relay insulation
Rated load voltage/current DC24V 2A(resistance load) / AC220V 2A(COSΨ = 1)
Min. load voltage / current DC5V / 1mA
Max. load voltage / current AC250V, DC125V
Leakage current at Off 0.1mA (AC220V, 60Hz)
Max. switching frequency 3,600 times/hr
Surge killer None
Mechanical 20 million and more times
Rated load voltage/current 100 thousand and more times
Life AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100 thousand and more times
Electrical
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100 thousand and more times
DC24V / 1A, DC100V / 0.1A (L / R = 7ms) 100 thousand and more times

Response Off → On 10 ms and lower

time On → Off 12 ms and lower
Common method 1 point/ 1COM (Independent contact)
Current consumption 260mA (when every point is On)
Operation display LED On with output On
External connection method 18 point Terminal strip connector (M3 X 6 screws)
Weight 0.13kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 COM
TB3 1
DC5V
TB4 COM
L 00
TB5 2
LED 01
TB6 COM L
TB1 TB7 3
L L
02

Internal 0 TB8 COM 03

RY L
circuit TB9 4
TB2
TB10 COM L
04
COM0
AC 220V TB11 5 05
L
TB12 COM
06
TB13 6 L

TB14 COM L 07

TB15 7
TB16 COM
TB17 NC
TB18 NC

9-13
 Chapter 9. I/O Module

9.3.2 16 point relay output module

Module type Relay output module
Spec. XGQ-RY2A
Output point 16 points
Insulation method Relay insulation
Rated load voltage/current DC24V 2A(resistance load) / AC220V 2A(COSΨ = 1)
Min. load voltage / current DC5V / 1mA
Max. load voltage / current AC250V, DC125V
Leakage current at Off 0.1mA (AC220V, 60Hz)
Max. switching frequency 3,600 times/hr
Surge killer None
Mechanical 20 million and more times
Rated load voltage/current 100 thousand and more times
Life AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100 thousand and more times
Electrical
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100 thousand and more times
DC24V / 1A, DC100V / 0.1A (L / R = 7ms) 100 thousand and more times

Response Off → On 10 ms and lower

time On → Off 12 ms and lower
Common method 16 point/ 1COM
Current consumption 500mA (when every point is On)
Operation display LED On with output On
External connection method 18point Terminal strip connector (M3 X 6 screws)
Weight 0.17kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 1
DC5V TB3 2
TB4 3 L 00
01.
LED TB5 4 L
L 02.
TB6 5 L 03.
TB1
L TB7 6 L
04
Internal L 05
RY
TB8 7 06
L
circuit TB9 8 L
07
08

TB16
TB10 9 L
09
L
L TB11 10 10
L
11
COM
TB12 11 L
12
L
TB13 12 L
13
14
AC 220V TB14 13 L
15
L
TB15 14 COM

* COM : TB17 TB16 15

TB17 COM
TB18 NC

9-14
 Chapter 9. I/O Module

9.3.3 16 point relay output module (Surge Killer built-in type)

Module Relay output module
type
Spec. XGQ-RY2B
Output point 16 points
Insulation method Relay insulation
Rated load voltage/current DC24V 2A(resistance load) / AC220V 2A(COSΨ = 1)
Min. load voltage / current DC5V / 1mA
Max. load voltage / current AC250V, DC125V
Leakage current at Off 0.1mA (AC220V, 60Hz)
Max. switching frequency 3,600 times/hr
Surge killer Varistor (387 ~ 473V), C.R absorber
Mechanical 20 million and more times
Rated load voltage/current 100 thousand and more times
Life AC200V / 1.5A, AC240V / 1A (COSΨ = 0.7) 100 thousand and more times
Electrical
AC200V / 1A, AC240V / 0.5A (COSΨ = 0.35) 100 thousand and more times
DC24V / 1A, DC100V / 0.1A (L / R = 7ms) 100 thousand and more times

Response Off → On 10 ms and lower

time On → Off 12 ms and lower
Common method 16 point/ 1COM
Current consumption 500mA (when every point is On)
Operation display LED On with output On
External connection method 18 point Terminal strip connector (M3 X 6 screws)
Weight 0.19kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 1
DC5V TB3 2
TB4 3 L 00
LED 01
TB5 4 L
L 02.
TB6 5 L 03.
TB1
L TB7 6 L
04
Internal L 05
RY
TB8 7 06
L
circuit TB9 8 L
07
08
TB10 9 L
09
TB16 L
L TB11 10 10
L
11
TB12 11 L
12
COM L
TB13 12 L
13
14
TB14 13 L
15
L
TB15 14 COM

* COM : TB17 TB16 15

TB17 COM
TB18 NC

9-15
 Chapter 9. I/O Module

9.3.4 16 point Triac output module

Module type Triac output module
Spec. XGQ-SS2A
Output point 16 points
Insulation method Photo coupler insulation
Rated load voltage AC 100-240V (50 / 60 Hz)
Max. load voltage AC 264V
Max. load current 0.6A / 1 point, 4A / 1COM
Min. load current 20 mA
Leakage current at Off 2.5 mA (AC 220V 60 Hz)
Max. inrush current 20A / Cycle and lower
Max. voltage drop at On AC 1.5V and lower (2A)
Surge killer Varistor (387 ~ 473V), C.R absorber

Response Off → On 1 ms and shorter

time On → Off 0.5 Cycle + 1 ms and shorter
Common method 16 point/ 1 COM
Current consumption 300 mA (when every point is On)
Operation display LED On with output On
External connection method 18point Terminal strip connector (M3 X 6 screw)
Weight 0.2 kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 1
DC5V TB3 2
TB4 3 L 00
LED TB5 4 L
01.

L 02.
TB1 TB6 5 03.
L L
TB7 6 L
04
Internal L 05
TB8 7 06
L
circuit ZC R TB9 8 07
L
08
TB16
TB10 9 L
09
L
L TB11 10 10
Triac L
11
TB12 11 L
12
COM L
TB13 12 L
13
14
AC110/220V TB14 13 L
15
L
TB15 14 COM

TB16 15
*COM : TB17
TB17 COM
TB18 NC

9-16
 Chapter 9. I/O Module

9.3.5 16 point transistor output module (sink type)

Module type Transistor output module
Spec. XGQ-TR2A
Output point 16 points
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operating load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1point, 4A / 1COM
Leakage current at Off 0.1mA and lower
Max. inrush current 4A / 10 ms and lower
Max. voltage drop at On DC 0.3V AND LOWER
Surge killer Zener diode
Fuse 4A×2(not replaceable)(Fuse cap.:50A)
Yes(If a fuse is burnt out, it transfers a signal to CPU and LED is on)
Fuse disconnection display
If external power supply is off, fuse status is not detected.
Off → On 1 ms and shorter
Response time
On → Off 1 ms and shorter (Rated load, resistance load)
Common method 16 point/ 1COM
Current consumption 70mA (when every point is On)
External power Voltage DC12/24V ± 10% (4 Vp-p and lower ripple voltage)
supply Current 10mA and lower (if connected to DC24V)
Operation display LED On with output On
External connection method 18point Terminal strip connector
Weight 0.11kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 1
DC5V 2
TB3
TB1 TB4 3
LED L 00
TB5 4 L
01
L
02
R TB6 5 L
Internal 03
L
TB7 6 L
04
circuit L
05
TB8 7 L
06
TB16 07
L 8 L
TB9 L
08
09
TB10 9 L
10
TB17 L
11
TB11 10 L
R Fuse L
12
COM 11 13
TB12 L
14
L
DC12/24V TB13 12 L
15

TB14 13 COM
R *COM : TB18
TB15 14
TB16 15
TB17 DC24V
TB18 COM

9-17
 Chapter 9. I/O Module

9.3.6 32 point transistor output module(sink type)

Module type Transistor output module
Spec. XGQ-TR4A
Output point 32 point
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operating load voltage range DC 10.2 ~ 26.4V
Max. load current 0.1A / 1point, 2A / 1COM
Leakage current at Off 0.1mA and lower
Max. inrush current 0.7A / 10 ms and lower
Max. voltage drop at On DC 0.2V and lower
Surge killer Zener diode
Off → On 1 ms and shorter
Response time
On → Off 1 ms and shorter (Rated load, resistance load)
Common method 32 points / 1COM
Current consumption 130mA (when every point is On)

External power Voltage DC12/24V ± 10% (4 Vp-p and lower ripple voltage)
supply Current 10mA and lower (if connected to DC24V)
Operation display LED On with Input On
External connection method 40 Pin Connector
Suitable cable size 0.3 ㎟
Weight 0.1 kg
Circuit diagram No Contact No Contact
B20 0 A20 16
B19 1 A19 17
DC5V B20 A20
B18 2 A18 18 A19
B19
B17 3 A17 19 B18 A18
B20
LED L B16 4 A16 20 B17 A17
B15 5 A15 21 B16 A16
R B14 6 A14 22 B15 A15
Internal A14
B13 7 A13 23 B14
B13 A13
circuit B12 8 A12 24
B12 A12
A05 B11 9 A11 25 B11 A11
L
B10 10 A10 26 B10 A10
B09 11 A09 27 B09 A09
B01,B02 A08
B08 12 A08 28 B08
B07 A07
B07 13 A07 29 B06 A06
COM
B06 14 A06 30 B05 A05
DC12/24V B05 15 A05 31 B04 A04
B04 /NC A04 NC B03 A03
B02 A02
* COM : A02, A01 B03 NC A03 NC
B01 A01
B02 DC12/ A02 COM
B01 24V A01 COM

9-18
 Chapter 9. I/O Module

9.3.7 64 point transistor output module (sink type)

Module type Transistor output module
Spec. XGQ-TR8A
Output point 64 points
Insulation system Photo coupler insulation
Rated load voltage DC 12 / 24V
Operating load voltage range DC 10.2 ~ 26.4V
Max. load current 0.1A / 1point, 2A / 1COM
Leakage current at Off 0.1mA and lower
Max. inrush current 0.7A / 10 ms and lower
Max. voltage drop at On DC 0.2V and lower
Surge killer Zener diode
Off → On 1 ms and shorter
Response time
On → Off 1 ms and shorter (Rated load, resistance load)
Common method 16 point/ 1COM
Current consumption 230mA (when every point is On)
Common method 32 points / COM

External power Voltage DC12/24V ± 10% (4 Vp-p and lower ripple voltage)
supply Current 10mA and lower (if connected to DC24V)
Operation display LED On with Input On (32point LED on by switching)
External connection method 40 Pin Connector × 2
Suitable cable size 0.3 ㎟
Weight 0.15 kg
Circuit diagram No Contact No Contact No Contact No Contact
1B20 0 1A20 16 2B20 32 2A20 48
1B19 1 1A19 17 2B19 33 2A19 49
DC5V 1B18 2 1A18 18 2B18 34 2A18 50
1B20 B20 A20
LED L 1B17 3 1A17 19 2B17 35 2A17 51
B19 A19
1B16 4 1A16 20 2B16 36 2A16 52
B18 A18
R 1B15 5 1A15 21 2B15 37 2A15 53
Internal B17 A17
circuit 1B14 6 1A14 22 2B14 38 2A14 54 B16 A16
1B13 7 1A13 23 2B13 39 2A13 55 B15 A15
2A05 1B12 8 1A12 24 2B12 40 2A12 56
L B14 A14
R B13 A13
1B11 9 1A11 25 2B11 41 2A11 57
B12 A12
1B02,1B01 1B10 10 1A10 26 2B10 42 2A10 58
2B02, 2B01 B11 A11
1B09 11 1A09 27 2B09 43 2A09 59 B10 A10
A 1B08 12 1A08 28 2B08 44 2A08 60 B09 A09
Switching
1B07 13 1A07 29 2B07 45 2A07 61 B08 A08
circuit B COM B07 A07
1B06 14 1A06 30 2B06 46 2A06 62
B06 A06
DC12/24V 1B05 15 1A05 31 2B05 47 2A05 63
B05 A05
A: displaying 0~31 1B04 NC 1A04 NC 2B04 NC 2A04 NC B04 A04
B: displaying 32~63 1B03 NC 1A03 NC 2B03 NC 2A03 NC B03 A03
1B02 1A02 2B02 2A02 B02 A02
12/24 12/24 B01 A01
*COM : 1A02, 1A01 COM1 COM2
/ 2A02, 2A01 VDC VDC
*1B01 1A01 2B01 2A01

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 Chapter 9. I/O Module

9.3.8 16 point transistor output module (source type)

Module type Transistor output module
Spec. XGQ-TR2B
Output point 16 points
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operating load voltage range DC 10.2 ~ 26.4V
Max. load current 0.5A / 1point, 4A / 1COM
Leakage current at Off 0.1mA and lower
Max. inrush current 4A / 10 ms and lower
Max. voltage drop at On DC 0.3V AND LOWER
Surge killer Zener diode
Fuse 4A×2(not replaceable)(Fuse cap.:50A)
Fuse disconnection display Yes(If a fuse is burnt out, it transfers a signal to CPU and LED is on)
Off → On 1 ms and shorter
Response time
On → Off 1 ms and shorter (Rated load, resistance load)
Common method 16 point/ 1COM
Current consumption 70mA (when every point is On)
External power Voltage DC12/24V ± 10% (4 Vp-p and lower ripple voltage)
supply Current 10mA and lower (if connected to DC24V)
Operation display LED On with output On
External connection method 18point Terminal strip connector
Weight 0.12kg
Terminal
Circuit diagram Contact
block
TB1 0
TB2 1
TB3 2
DC5V
TB4 3
TB1
LED L 4
TB5 L 00
01
L
R TB6 5 L
02
03
Internal TB7 6 L
04
L
circuit 05
TB8 7 L
06
L
TB16 8 07
L TB9 L
08
L
TB10 9 L
09
10
COM L
TB11 10 L
11
DC12/24V 12
R Fuse TB12 11 L
13
L
TB18 14
TB13 12 L
15
L
TB14 13 COM

R *COM : TB17 TB15 14

TB16 15
TB17 COM
TB18 0V

9-20
 Chapter 9. I/O Module

9.3.9 32 point transistor output module (source type)

Module type Transistor output module
Spec. XGQ-TR4B
Output point 32 points
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operating load voltage range DC 10.2 ~ 26.4V
Max. load current 0.1A / 1point, 2A / 1COM
Leakage current at Off 0.1mA and lower
Max. inrush current 4A / 10 ms and lower
Max. voltage drop at On DC 0.3V AND LOWER
Surge killer Zener diode
Off → On 1 ms and shorter
Response time
On → Off 1 ms and shorter (Rated load, resistance load)
Common method 32points / 1COM
Current consumption 130mA (when every point is On)

External power Voltage DC12/24V ± 10% (4 Vp-p and lower ripple voltage)
supply Current 10mA and lower (if connected to DC24V)
Operation display LED On with Input On
External connection method 40 Pin Connector
Suitable cable size 0.3 ㎟
Weight 0.1 kg
Circuit diagram No Contact No Contact
B20 0 A20 16
B19 1 A19 17 B20 A20
B18 2 A18 18 B19 A19
DC5V B18 A18
B20
B17 3 A17 19
L B17 A17
LED B16 4 A16 20
B16 A16
B15 5 A15 21 B15 A15
R
Internal B14 6 A14 22 B14 A14
B13 7 A13 23 B13 A13
circuit A12
B12 8 A12 24 B12
B11 A11
B11 9 A11 25
B10 A10
A05 B10 10 A10 26 B09 A09
L
B09 11 A09 27 B08 A08
COM
B08 12 A08 28 B07 A07
DC12/24V B07 13 A07 29 B06 A06
B05 A05
A02, A01 B06 14 A06 30
B04 A04
B05 15 A05 31 B03 A03
B04 NC A04 NC B02 A02
* COM : B02, B01 B03 NC A03 NC B01 A01
B02 A02
COM 0V
B01 A01

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 Chapter 9. I/O Module

9.3.10 64 point transistor output module (source type)

Module type Transistor output module
Spec.
XGQ-TR8B
Output point 64 points
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operating load voltage range DC 10.2 ~ 26.4V
Max. load current 0.1A / 1point, 2A / 1COM
Leakage current at Off 0.1mA and lower
Max. inrush current 4A / 10 ms and lower
Max. voltage drop at On DC 0.3V and lower
Surge killer Zener diode
Off → On 1 ms and shorter
Response time
On → Off 1 ms and shorter (Rated load, resistance load)
Common method 32point / 1COM
Current consumption 230mA (when every point is On)
Common method 32point / COM

External power Voltage DC12/24V ± 10% (4 Vp-p and lower ripple voltage)
supply Current 10mA and lower (if connected to DC24V)
Operation display LED On with Input On (32 point LED ON by switching)
External connection method 40 Pin Connector × 2
Suitable cable size 0.3 ㎟
Weight 0.15 kg
Circuit diagram No Contact No Contact No Contact No Contact
1B20 0 1A20 16 2B20 32 2A20 48
DC5V 1B19 1 1A19 17 2B19 33 2A19 49
1B18 2 1A18 18 2B18 34 2A18 50 B20 A20
1B20 1B17 3 1A17 19 2B17 35 2A17 51
LED L B19 A19
1B16 4 1A16 20 2B16 36 2A16 52 B18 A18
R 1B15 5 1A15 21 2B15 37 2A15 53 B17 A17
Internal B16 A16
1B14 6 1A14 22 2B14 38 2A14 54
B15 A15
circuit 1B13 7 1A13 23 2B13 39 2A13 55
B14 A14
1B12 8 1A12 24 2B12 40 2A12 56
B13 A13
R
2A05 1B11 9 1A11 25 2B11 41 2A11 57 B12 A12
L
1B10 10 1A10 26 2B10 42 2A10 58 B11 A11
1B09 11 1A09 27 2B09 43 2A09 59 B10 A10
COM
B09 A09
1B08 12 1A08 28 2B08 44 2A08 60
DC12/24V B08 A08
1B07 13 1A07 29 2B07 45 2A07 61
B07 A07
1A02, 1A01
2A02, 2A01
1B06 14 1A06 30 2B06 46 2A06 62 B06 A06
1B05 15 1A05 31 2B05 47 2A05 63 B05 A05
Switching A B04 A04
1B04 NC 1A04 NC 2B04 NC 2A04 NC
B 1B03 NC 1A03 NC 2B03 NC 2A03 NC B03 A03
circui *COM : 1B02, 1B01 B02 A02
/ 2B02, 2B01 1B02 1A02 2B02 2A02 B01 A01
A: displaying 0~31 COM 0V COM 0V
B: displaying 32~63 1B01 1A01 2B01 2A01

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 Chapter 9. I/O Module

9.3.11 8 point transistor isolated output module

Module type Transistor output module
Spec. XGQ-TR1C
Output point 8 points
Insulation method Photo coupler insulation
Rated load voltage DC 12 / 24V
Operating load voltage range DC 10.2 ~ 26.4V
Max. load current 2A / 1 point
Leakage current at Off 0.1mA and lower
Max. inrush current 4A / 10 ms and lower
Max. voltage drop at On DC 0.3V and lower
Surge killer Zener diode
Off → On 3 ms and shorter
Response time
On → Off 10 ms and shorter (Rated load, resistance load)
Common method 1 point/ 1COM
Current consumption 100mA (when every points On)
External power Voltage DC12/24V ± 10% (4 Vp-p and lower ripple voltage)
supply Current 10mA and lower (if connected to DC24V)
Operation display LED On with output On
External connection method 18point Terminal strip connector
Weight 0.11kg
Terminal
Circuit diagram Contact
block
TB1 P0
TB2 COM0
TB3 P1
DC5V
TB4 COM1
TB5 P2
TB6 COM2
TB7 P3
R
TB8 COM3
Internal
TB9 P4
TB10 COM4
circuit
TB11 P5
TB12 COM5
R TB13 P6
TB14 COM6
TB15 P7
TB16 COM7
TB17 NC
TB18 NC

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 Chapter 9. I/O Module

9.4 Digital I/O Module Specifications

9.4.1 32 point (DC input · transistor output) I/O combined module

XGH-DT4A
Input Output
Input point 16 points Output point 16 points
Insulation method Photo coupler insulation Insulation method Photo coupler insulation
Rated input voltage DC 24V Rated load voltage DC 12 / 24V
Rated input current Approx. 4 ㎃ Operating load voltage range DC 10.2 ~ 26.4V
DC20.4~28.8V
Operating voltage range Max. load current 0.1A / 1point, 1.6A / 1COM
(5% and lower ripple rate )
Withstand voltage AC560Vrms/3Cycle(altitude2000m) Leakage current at Off 0.1mA and lower
On voltage/On current DC 19V and higher / 3mA and higher Max. inrush current 0.7A / 10 ms and lower
Off voltage/Off current DC 11V and lower / 1.7mA and lower Surge killer Zener diode
Input resistance Approx. 5.6 kΩ Max. voltage drop at On DC 0.2V and lower
1ms/3ms/5ms/10ms/20ms/70ms/
Off→ On 100ms(set by CPU parameter) Off→ On 1 ms and shorter
Response Initial value:3ms Response
time 1ms/3ms/5ms/10ms/20ms/70ms/ time
1 ms and shorter
On → Off 100ms(set by CPU parameter) On → Off
(Rated load, resistance load)
Initial value:3ms
Common method 16 point/ COM Common method 16 point/ 1COM
Operation display LED On with input On Operation display LED On with output On
Current consumption(㎃) 110mA (when ever point is on)
External connection
40 Pin Connector × 1
method
Weight 0.1 kg
External connection
Input
DC5V
0 Photocoupler
B20
R No Contact No Contact
LED
R
B20 0 A20 16
15 B19 1 A19 17
B05
Internal B18 2 A18 18 B20 A20
circuit B17 3 A17 19 B19 A19
COM
B18 A18
B16 4 A16 20
B17 A17
B15 5 A15 21 B16 A16
DC24V
B14 6 A14 22 B15 A15
* COM : B02, B01 B13 7 A13 23 B14 A14
B13 A13
B12 8 A12 24
B12 A12
Output B11 9 A11 25 B11 A11
B10 10 A10 26 B10 A10
B09 11 A09 27 B09 A09
DC5V B08 A08
B08 12 A08 28
A20 B07 A07
LED L B07 13 A07 29 B06 A06
Photocouple B06 14 A06 30 B05 A05
r R
B05 15 A05 31 B04 A04
Internal
B03 A03
circuit
B04 NC A04 DC12 A02
B02
A05 L B03 NC A03 /24V B01 A01
B02 A02
COM 0V
A04, A03 B01 A01
A02,A01

DC12/24V

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 Chapter 9. I/O Module

9.5 Event Input Module

9.5.1 Event Input Module (Source/Sink type)

Specification XGF-SOEA

Input point 32 point

Insulation method Photo coupler insulation
Memory size Records 1Mbit event information (300 event information per XGF-SOEA module)
Precision 1 ms (±2ms : error between modules)
Rated input voltage DC24V
Rated input current About 4mA
Used voltage range DC20.4 ~ 28.8V (within ripple rate 5%)
On voltage/On current DC19V or above / 3 mA or above
Off voltage/ Off current DC11V or less / 1.7 mA or less
Input resistance About 5.6 kΩ

Response Off → On H/W delay (10㎲: Normal) + input filter time (user setting: 0~100ms) + CPU scan time delay (50㎲)
time On → Off H/W delay (84㎲: Normal) + input filter time (user setting: 0~100ms) + CPU scan time delay (50㎲)
Working voltage AC560V rms/3 Cycle (Altitude 2000m)
Insulation resistance Insulation resistance 10 ㏁ or above (DC500V)
COMM method 32 point / COM
Current consumption (A) 0.7(MAX)
Operation indicator LED is on when input is on
External connection
40 pin connector
method
Size 27x98x90
Weight 0.2 kg
Circuit configuration No Contact No Contact
B20 0 A20 16
DC5V
0 Photo coupler B19 1 A19 17 B20 A20
B20
R LED B18 2 A18 18 B19 A19

R B17 3 A17 19 B18 A18

B17 A17
31
A05 Internal B16 4 A16 20
B16 A16
COM B15 5 A15 21 B15 A15
circuit
B14 6 A14 22 B14 A14
B13 A13
DC24V B13 7 A13 23
B12 A12
* COM : B02, B01 B12 8 A12 24 B11 A11
90 B11 9 A11 25 B10 A10
B10 10 A10 26 B09 A09
80 B08 A08
B09 11 A09 27
70 DC28.8V B07 A07
On rate B08 12 A08 28 B06 A06
60
(%) B07 13 A07 29 B05 A05
50 B04 A04
B06 14 A06 30 B03 A03
40 B05 15 A05 31 B02 A02
B04 RX+ A04 SG B01 A01
0 10 20 30 40 50 55 B03 RX- A03 SG
Ambient temp (℃)
B02 COM A02 COM
Derating diagram
B01 COM A01 COM

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 Chapter 9. I/O Module

9.6 Smart Link

9.6.1 Modules accessible to Smart Link

From digital I/O modules used for XGT Series, the modules accessible to Smart Link are as follows.
32 point modules need a Connector(40 Pin x 1), 64 point modules need 2 connectors(40 Pin x 2)
Model Specification No. of Pins
XGI-D24A/B DC input 32 point module 40 Pin Connector × 1
XGI-D28A/B DC input 64 point module 40 Pin Connector × 2
XGQ-TR4A TR output 32 point module(sink type) 40 Pin Connector × 1
XGQ-TR8A TR output 64 point module(sink type) 40 Pin Connector × 2
XGQ-TR4B TR output 32 point module(source type) 40 Pin Connector × 1
XGQ-TR8B TR output 64 point module(source type) 40 Pin Connector × 2
XGF-SOEA Event input module 40 Pin Connector × 1

9.6.2 Smart Link Components

The company prepares smart link products for the convenience of using our Connector type I/O modules.
For further information, please refer to the data sheet contained in a smart link product.
(Refer to 7.6.6 1to confirm the differences between TG7-1H40CA 1and 1TG7-1H40S)
Model Cable Length of Cable
C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40S C40HF-15PB-1B 1.5m
C40HF-20PB-1B 2m
Terminal C40HF-30PB-1B 3m
board C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40CA
C40HF-15PB-1B 1.5m
(Common120Pin1Added )
C40HF-20PB-1B 2m
C40HF-30PB-1B 3m
C40HF-05PB-1 0.5m
C40HF-10PB-1 1m
R32C-NS5A-40P
C40HF-15PB-1 1.5m
(Sink type)
Relay C40HF-20PB-1 2m
board C40HF-30PB-1 3m
C40HF-05PB-XGP1 0.5m
R32C-PS5A-40P
C40HF-10PB-XGP1 1m
(Source type)
C40HF-20PB-XGP1 2m

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 Chapter 9. I/O Module

9.6.3 Smart Link Mapping Table

❶ : Module using 1ea Cable ❷ : Module using 2ea Cable

9.6.4 Smart Link Connection

Cable

Smart Link

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 Chapter 9. I/O Module

9.6.5 Smart Link Connection Diagram

(1) XGI-D24A/B

1) Applicable Smart Link

Model Cable Length of Cable

C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40S C40HF-15PB-1B 1.5m
C40HF-20PB-1B 2m
Terminal C40HF-30PB-1B 3m
board C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40CA
C40HF-15PB-1B 1.5m
(Common120Pin1Added)
C40HF-20PB-1B 2m
C40HF-30PB-1B 3m

2) Connection Diagram (XGI-D24A/B)

(a) TG7-1H40S

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(b) TG7-1H40CA

Common Contacts set1 Common Contacts set2

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 Chapter 9. I/O Module

(2) XGI-D28A/B

1) Applicable Smart Link

Model Cable Length of Cable

C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40S C40HF-15PB-1B 1.5m
C40HF-20PB-1B 2m
Terminal C40HF-30PB-1B 3m
board C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40CA
C40HF-15PB-1B 1.5m
(Common120Pin1Added)
C40HF-20PB-1B 2m
C40HF-30PB-1B 3m

2) Connection Diagram (XGI-D28A/B)

(a) TG7-1H40S

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(b) TG7-1H40CA

Common Contacts set1 Common Contacts set2

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 Chapter 9. I/O Module

(3) XGQ-TR4A/8A

1) Applicable Smart Link

Model Cable Length of Cable

C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40S C40HF-15PB-1B 1.5m
C40HF-20PB-1B 2m
Terminal C40HF-30PB-1B 3m
board C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40CA
C40HF-15PB-1B 1.5m
(Common120Pin1Added )
C40HF-20PB-1B 2m
C40HF-30PB-1B 3m
C40HF-05PB-1 0.5m
C40HF-10PB-1 1m
Relay R32C-NS5A-40P
C40HF-15PB-1 1.5m
board (Sink type)
C40HF-20PB-1 2m
C40HF-30PB-1 3m

2) Connection Diagram (XGQ-TR4A/8A)

(a) TG7-1H40S

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 Chapter 9. I/O Module

(b) TG7-1H40CA

Common Contacts set1 Common Contacts set2

(c) R32C-NS5A-40P

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 Chapter 9. I/O Module

(4) XGQ-TR4B/8B

1) Applicable Smart Link

Model Cable Length of Cable

C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40S C40HF-15PB-1B 1.5m
C40HF-20PB-1B 2m
Terminal C40HF-30PB-1B 3m
board C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40CA
C40HF-15PB-1B 1.5m
(Common120Pin1Added )
C40HF-20PB-1B 2m
C40HF-30PB-1B 3m
C40HF-05PB-XGP1 0.5m
C40HF-10PB-XGP1 1m
Relay R32C-PS5A-40P
C40HF-20PB-XGP1 2m
board (Source type)
- -
- -

2) Connection Diagram (XGQ-TR4B/8B)

(a) TG7-1H40S

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 Chapter 9. I/O Module

(b) TG7-1H40CA

Common Contacts set1 Common Contacts set2

(c) R32C-PS5A-40P

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 Chapter 9. I/O Module

(5) XGF-SOEA

1) Applicable Smart Link

Model Cable Length of Cable

C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40S C40HF-15PB-1B 1.5m
C40HF-20PB-1B 2m
Terminal C40HF-30PB-1B 3m
board C40HF-05PB-1B 0.5m
C40HF-10PB-1B 1m
TG7-1H40CA
C40HF-15PB-1B 1.5m
(Common120Pin1Added )
C40HF-20PB-1B 2m
C40HF-30PB-1B 3m

2) Connection Diagram (XGF-SOEA)

(a) TG7-1H40S

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(b) TG7-1H40CA

Common Contacts set1 Common Contacts set2

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 Chapter 9. I/O Module

9.6.6 Smart Link Specifications & Dimensions

(1) TG7-1H40S

1) Specifications

Rated Voltage AC, DC 125V

Rated Current 1A
Withstanding Voltage 600V 1min
Insulation resistance 100MΩ (DC 500V)
Applicable Wire 1.25 ㎟ /MAX
T/B Screw M3 X 10L
Screw Torque 1.2N • m(12Kgf • cm)
Case Modified PPO(Noryl)(UL 94V-0)

2) Dimensions(mm)

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 Chapter 9. I/O Module

(2) TG7-1H40CA

1) Specifications

Rated Voltage 125V AC / 24V DC

Rated IO 1A
Current Common 10A (Total)
Insulation resistance 100MΩ (DC 500V)
Withstanding Voltage AC500V 1min
Applicable Wire AWG22-16 (MAX / 1.5 ㎟)
Contact Screw M3 X 10L
Screw Torque 1.2N • m(12Kgf • cm)
Ambient Temperature -10℃ ~ +50℃ (Non-condensing)
Terminal Block & Cover Modified PPO
Protective Cover Polycarbonate
PCB Epoxy 1.6t

2) Dimensions(mm)

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 Chapter 9. I/O Module

(3) R32C-N(P)S5A-40P

1) Specifications
(a) Relay Board
Case Modified PPO
Protective Cover Polycarbonate
PCB Epoxy 1.6t / 2oz
Applicable Wire AWG22-16 (MAX / 1.5 ㎟)
T/B Screw M3 X 8L
Screw Torque 1.2N • m(12Kgf • cm)
Ambient Temperature -10℃ ~ +50℃ (Non-condensing)

(b) Relay
Specification PA1a-24V
Arrangement 1a
Nominal switching capacity 5A 250V AC / 5A 30V DC
Contact
Max. switching current 5A
Max. switching voltage 250V AC / 110V DC
Rated Voltage 24V DC
Pick-up voltage 16.8V
Coil Drop-out voltage 1.2V DC
Coil resistance 3,200Ω
Rated operation power 180mW
Surge voltage between contact and coil 4,000V
Initial breakdown voltage
Between contact and coil 2,000V rms

2) Dimensions(mm)

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 Chapter 10. Base and Expansion Cable

Chapter 10 Base and Expansion Cable

10.1 Specification

10.1.1 Basic base

Power module, CPU module, Ethernet communication module can be inserted into basic base.
XGR-M02P/XGR-M06P uses 5.5A output power module.

Table 1 Specification of basic base

Name
XGR-M02P XGR-M06P
Item
The no. of IO module 2 modules 6 modules
Dimension (mm) 238 X 98 X 19 346 X 98 X 19
Distance of hole for panel attachment 218 X 75 326 X 75
Specification of hole for panel attachment φ 4.5 (M4 screw used)
Specification of screw for PE connection (+)PHM 3 X 6 washer(φ 5)
Weight (kg) 0.33 0.5

10.1.2 Expansion Base

Power module, expansion driver module, IO module, special module, communication module can be inserted into expansion
base.
Table 2 Specification of expansion base
Name
XGR-E12P XGR-E08P XGR-E12H
Item
The no. of IO module 12 modules 8 modules 12 modules
Dimension (mm) 481 X 98 X 19 373 X 98 X 19 508 X 98 X 19
Distance of hole for
461 X 75 353 X 75 488 X 75
panel attachment
Specification of hole
φ 4.5 (M4 screw used)
for panel attachment
Specification of screw
(+)PHM 3 X 6 washer (φ 5)
for PE connection
Weight (kg) (kg) 0.7 0.51 0.71

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 Chapter 10. Base and Expansion Cable

10.1.3 Sync. Cable

This cable is used for the data synchronization between CPU modules.

Table 3 Specification of Sync. cable

Name
XGC-F201 XGC-F501
Item
Length (m) 2.0 5.0
Weight (g) 21g 47g
Connector LC type
Optical fiber
62.5/125um(62.5um fiber optic core and 125um outer cladding)
diameter
Wave length 1300nm
Attenuation 1.3Db/1000m or less
The quality of the
Multi Mode Fiber (max. 2 Km) – separate order for other specifications
material

10.1.4 Expansion Cable

This is the cable for connecting the basic and expansion bases. These are Ethernet cables. Electrical and optical cables are
provided for use in accordance with the network type.
Especially, since the electrical cables transmit control data by tens of micro, external noise may affect system performance
and control seriously.
Therefore, when using electrical cables in the XGR system, the FTP cable is the standard. If the system is subject to serious
noise environment, use shielded twisted pair cable, such as STP/FSTP.

Caution
1) The length of the optical cables should not exceed 2Km.
2) The length of the electrical cables should not exceed 100m.

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 Chapter 10. Base and Expansion Cable

10.1.5 Connector for expansion cable (electrical)

The electrical expansion cables should be shielded twisted pair cables, such as FTP, STP, and SFTP, in order to meet the EMC
specification and reduce external noise. To use such shield cables, the plugs and fix housing should be as follows.

(1) Connector Plug

Type: RJ45 PLUG /INDUSTRIAL CAT6(44915-0021)

(2) Plug Housing

Type (for FTP): RJ45 PLUG protection cover (WRJ45-0702)

Type (for STP/SFTP): RJ45 PLUG protection cover (WRJ45-0701)

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 Chapter 10. Base and Expansion Cable

10.2 Parts and Names

10.2.1 Basic Base

Table 4. Identification and Function of the Basic Base

No. Name Function

① Guide hole for base mounting Hole for the installation of this base on the panel in the control cabinet
② Power module connector The connector for mounting power module
③ CPU module connector The connector for mounting CPU module
 Module mounting connector The connector for mounting I/O module
 PE terminal Functional ground terminal

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 Chapter 10. Base and Expansion Cable

10.2.2 Expansion Base

Table 5. Identification and Function of the Expansion Base

No. Name Function

① Guide hole for base mounting Hole for the installation of this base on the panel in the control cabinet
② Power module connector The connector for mounting power module
/③ Expansion module connector The connector for mounting expansion module
 Module mounting connector The connector for mounting I/O module
 PE terminal Functional ground terminal

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Chapter 10. Base and Expansion Cable

10-6
 Chapter 11. Installation and Wiring

Chapter 11. Installation and Wiring

11.1 Installation

11.1.1 Installation environment

The system keeps a high reliability, irrespective of the installation environment. However, to guarantee the reliability
and stability, make sure to keep the following cautions.

(1) Environmental conditions

(a) Install in a control panel resisting to moisture and vibration.

(b) Free of any continuous impact or vibration.
(c) Not exposed to direct sunrays.
(d) No condensation from sudden temperature fluctuation.
(e) Ambient temperature range between 0 ~ 55°C.
(f) Relative humidity between 5 ~ 95%.
(g) Free of any corrosive gas or flammable gas.
(h) The falling of a thunderbolt and high voltage should not flow in

(2) Installation construction

(a) When boring a screw hole or executing wiring construction, any wiring impurities should not be inserted to the
PLC.
(b) The system should be installed in a place easily accessible.
(c) Do not install the system on a same panel of a high voltage device.
(d) It should be 50mm and more away from wiring duct or proximate modules.
(e) Grounding on a position where noise is lower than the specified level.

(3) Heat protective design of control panel

(a) If installing the PLC in an air-tight control panel, it needs heat-protective(control) design considering the heat
from the PLC as well as other devices. If ventilating by vent or fan, inflow of dust or gas may affect the
performance of the PLC system.
(b) Install a filter or use a closed heat exchanger.

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 Chapter 11. Installation and Wiring

The following shows the calculation of PLC system’s power consumption requiring heat protective design.

(4) Power Consumption block diagram of the PLC system

AC Power Power CPU Commu-Commu-Output Input Special

100V~240 I5V nicationnication
V DC5V
Constant
Voltage
Transformer DC24 Iout Iin
I24V
Load
AC Power
DC 100V~240
Power V
24V

(5) Power consumption of each part

(a) Power consumption of power module

The power conversion efficiency of power module is about 70% and the other 30% is gone with heat; 3/7 of
the output power is the pure power consumption. Therefore, the calculation is as follows.
• Wpw = 3/7 {(I5V X 5) + (I24V X 24)} (W)
I5V : power consumption of each module DC5V circuit(internal current consumption)
I24V: the average current consumption of DC24V used for output module
(current consumption of simultaneous On point)
If DC24V is externally supplied or a power module without DC24V is used, it is not applicable.

(b) Sum of DC5V circuit current consumption

The DC5V output circuit power of the power module is the sum of power consumption used by each
module.
• W5V = I5V X 5 (W)

(c) DC24V average power consumption(power consumption of simultaneous On point)

The DC24V output circuit’s average power of the power module is the sum of power consumption used by
each module.
• W24V = I24V X 24 (W)

(d) Average power consumption by output voltage drop of the output module (power consumption of
simultaneous On point)
• Wout = Iout X Vdrop X output point X simultaneous On rate (W)
Iout : output current(actually used current) (A)
Vdrop : voltage drop of each output module (V)

(e) Input average power consumption of input module(power consumption of simultaneous On point)
• Win = lin X E X input point X simultaneous On rate (W)
Iin: input current (root mean square value in case of AC) (A)
E : input voltage (actually used voltage) (V)

(f) Power consumption of special module power assembly

• WS = I5V X 5 + I24V X 24 + I100V X 100 (W)

The sum of power consumption calculated by each block is the power consumption of the entire PLC

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 Chapter 11. Installation and Wiring

system.

• W = WPW + W5V + W24V + Wout + Win + Ws (W)

Calculate the heats according to the entire power consumption(W) and review the temperature increase
within the control panel.

The calculation of temperature rise within the control panel is displayed as follows.

T = W / UA [°C]
W : power consumption of the entire PLC system (the above calculated value)
A : surface area of control panel [m2]
U : if equalizing the temperature of the control panel by using a fan and others - - - 6
If the air inside the panel is not ventilated - - - - - - - - - - 4

Note
(1) If the control cabinet is not well ventilated, temperature gradient in the cabinet may be
large. Care must be taken that the parts right above heat generating devices may become
very hot.
(2) Coefficient U, which can be different according to quantity of material, is general example

Calculation example)
Redundant basic base: 4 communication modules equipped
Expansion base 1: optical expansion drive, 6 Input modules, 6 output modules
Expansion base 2:optical expansion drive, 6 analog input modules, 6 analog output modules.

Structure figure, calculation according to above steps

11.1.2 Cautions for handling

It describes the cautions for handling from unpacking to installation.
• Please do not drop it or apply excessive force on it.
• Please do not separate PCB from the case. It may cause a trouble.
• During wiring, a special attention should be paid so that impurities such as wiring remainder should not be
inserted into the top of a module. If impurities are found, immediately remove them.

(1) Cautions for handling I/O module

It describes the cautions for installing or handling I/O module.

(a) Recheck the I/O module specifications.

The input module may be affected by input voltage while the output module may be subject to breakage,
destruction or a fire if the voltage over the max. switching capacity is allowed.

(b) Available cable type

Cable should be selected in consideration of ambient temperature and allowable current; the min. size of
cable should be AWG22(0.3mm2) and higher.

(c) Environment
If I/O module wiring is close to heating sources or materials or the wiring is directly contacted with oils for a
long time during wiring, it may cause short-circuit, destruction or malfunction.

(d) Polarities
Please make sure to check the polarities of modules of which terminal block is polarized before allowing the
power.

(e) Wiring

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 Chapter 11. Installation and Wiring

• When I/O wiring is executed with high voltage or power cable, it may cause inductive fault, probably leading
to malfunction or trouble.
• No cable should not be arranged front of I/O operation display(LED)
(I/O display may be hidden, hindering the interpretation)
• If an output module is connected to inductive load, please make sure to connect a surge killer or diode to
load in parallel. Please connect the cathode side of a diode to (+) o f the power.

OUT Inductive load

Output module
Surge killer
COM

OUT Inductive load

+
Output module
-
Diode
COM

(f) Terminal strip

Please check the tightness of terminal strip and prevent any wiring impurities(remainder) from being inserted
into the PLC when processing terminal strip wiring or screw hole making. It may cause malfunction or trouble.

(g) Besides the above, it is prohibited to apply excessive impact on I/O module or separating PCB board from the
case.

(2) Cautions for installing the base

It describes the cautions when installing the PLC on the control panel and others.

(a) A proper distance between the top of a module and structure/parts should be secured to facilitate ventilation
and module replacement.

C
A B E

A, B : more than 5 cm

C, D : more than 5 cm for easy attachment/detachment

(more than 3cm with wiring duct. In case of duct height is more than 5cm, keep the distance more than 5cm.)
In case using optical communication or maximum load of power module, keep the distance more than 15cm for
ventilation.

E: more than 10 cm
- In case of using optical cable, IO module of connector type, more than 8 cm distance necessary
- In case of Ethernet FTP cable, more than 10cm distance necessary

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 Chapter 11. Installation and Wiring

(b) Please do not install it vertically or horizontally for the ventilation purpose.

(c) Please use a different panel or secure a proper distance if there is vibration source from a large electronic
contact or
no-fuse breaker

(d) If necessary, please install a wiring duct. However, please keep the following cautions.

• If installing on the top of PLC, maintain the height of a wiring duct 50mm more than for better ventilation. In
addition, maintain the distance from the top of PLC so that the hook on the top of the base can be pressed.
• If installing on the bottom of it, let optical or coaxial cable be connected and consider the minimum radius of
the cable.

(e) Please install the PLC along the well-ventilated direction as presented below for the heat prevention purpose.

(f) Please do not install it to the direction as presented below.

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 Chapter 11. Installation and Wiring

(g) To avoid any influence of radiating noise or heat, please install the PLC and other devices(relay, electronic
contact) with a spacing secured as presented below.

100mm more than

100mm more than

50mm more than

50mm more than

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 Chapter 11. Installation and Wiring

(h) In a layered-installation of PLCs, the temperature of the base at the top may become very high due to the heat
transferred from the lower layers. If the temperature in the control cabinet is high, install a ventilating fan, or
provide sufficient distances between the bases.

Tb +2Tr

Tb +Tr

Tb

[Closed installation] [Installation with distance] [Ventilating fan]

Caution
(1) In case of closed installation, the temperature(Tb +Tr) around the modules right above the optical
communication module and power module which generate large heat may be higher than that at other
positions by 15℃.
(The temperature of the air near the modules should not exceed 55℃.)
- Optical communication module: XGR-CPU(optical) module, expansion drive (optical) module, inter-PLC
communication (optical) module
(2) In order to dissipate the heat radiated from PLCs, heat conductivity between the enclosure wall and bases
or base chassis should be considered in the design and installation.

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 Chapter 11. Installation and Wiring

11.1.3 Attachment/Detachment of modules

It describes how to attach or detach a module on the base.

(1) Attachment

• Please insert the fixation projection on the bottom of a module to the hole of module installation of the base.
• Please fix it on the base by pushing the top of a module and tight it by using the module fixation screw.
• Please try to pull the top of a module to check whether it is tightly fixed on it.

Projection for module installation

Hole for module

Caution
(1) A module should be installed by inserting the projection for module installation to the hole for module
installation. If applying an excessive force, a module may be broken.

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 Chapter 11. Installation and Wiring

(2) Detachment

• Please unscrew the fixation screw on the top of a module.

• Please press the hook for module installation with a module held by both hands.
• Please pull the bottom of a module toward the top while pressing the hook.
• Lifting up the module, please detach the projection for module installation from the hole for module
installation.

Hook for module installation

Caution
(1) When detaching a module, please press the hook to detach it from the base and then, isolate the projection
for module installation from the hole for module installation. At the moment, if trying to detach it forcibly, the
hook or projection may be damaged.

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 Chapter 11. Installation and Wiring

11.2 Wiring

It describes the important information about wiring when using the system.

11.2.1 Power wiring

(1) Connect a constant voltage transformer when the power variance is larger than the specified range.

Power CPU
AC power
100V~240
V AC
Constant
Voltage
Transformer

(2) Connect the power source of which inter-cable or cable-ground noise is small.
(If a large one is connected, make sure to connect to an insulation transformer)

(3) Isolate the PLC power, I/O devices and power devices as follows.

Power CPU
Main PLC
power power
Constant
AC220V Voltage
Transformer

I/O power

Main circuit device

(4) If using DC24V of the power module

 Do not connect DC24V of several power modules in parallel. It may cause the destruction of a module.
 If a power module can not meet the DC24V output capacity, supply DC24V externally as presented below.

Power Power
r I I
24V
24V
/ LG /
LG
PE
O PE
AC O
DC 24V
Power
I
24V
LG / Power
PE Supply
AC O

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 Chapter 11. Installation and Wiring

(5) AC110V/AC220V/DC24V cables should be compactly twisted and connected in the shortest distance.

(6) AC110V/AC220V cable should be as thick as possible(2mm2) to reduce voltage drop.

AC110V/ DC24V cables should not be installed close to main circuit cable(high voltage/high current) and I/O signal
cable. They should be 100mm away from such cables.

(7) To prevent surge from lightning, use the lightning surge absorber as presented below.

PLC
I/O device

E1 E2

Surge absorber to prevent lighting

Caution
(1) Isolate the grounding(E1) of lightning surge absorber from the grounding(E2) of the PLC.
(2) Select a lightning surge absorber type so that the max. voltage may not the specified allowable voltage
of the absorber.

(8) When noise may be intruded inside it, use an insulated shielding transformer or noise filter.

(9) Wiring of each input power should be twisted as short as possible and the wiring of shielding transformer or noise
filter should not be arranged via a duct.

11.2.2 I/O Device wiring

(1) The size of I/O device cable is limited to 0.3~2 mm2 but it is recommended to select a size(0.3 mm2) to use
conveniently.

(2) Please isolate input signal line from output signal line.

(3) I/O signal lines should be wired 100mm and more away from high voltage/high current main circuit cable.

(4) Batch shield cable should be used and the PLC side should be grounded unless the main circuit cable and power
cable can not be isolated.

PLC
Shield cable

Input
RA

DC
Output

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 Chapter 11. Installation and Wiring

(5) When applying pipe-wiring, make sure to firmly ground the piping.

(6) The output line of DC24V should be isolated from AC110V cable or AC220V cable.

(7) For a long distance wiring over 200m, please refer to 12.4 Cases in Chapter 12 because it is expected that
accident may occur due to leakage current due to inter-cable capacity.

11.2.3 Grounding wiring

(1) The PLC contains a proper noise measure, so it can be used without any separate grounding if there is a large
noise. However, if grounding is required, please refer to the followings.

(2) For grounding, please make sure to use the exclusive grounding.
For grounding construction, apply type 3 grounding(grounding resistance lower than 100 Ω)

(3) If the exclusive grounding is not possible, use the common grounding as presented in B) of the figure below.

PLC Other PLC Other PLC Other

Type 3 Grounding Type 3 Grounding

A) Exclusive grounding : best B) common grounding : good C) common grounding:

defective

(4) Use the grounding cable more than 2 mm2. To shorten the length of the grounding cable, place the grounding
point as close to the PLC as possible.

(5) Separately ground the LG of the power module and the FG of the base board.

Power Power Power

LG PE LG
PE LG PE

A) Exclusive grounding : best B) common grounding : good C) common grounding: defective

(6) If any malfunction from grounding is detected, separate the PE of the base from the grounding.

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 Chapter 11. Installation and Wiring

11.2.4 Specifications of wiring cable

The specifications of cable used for wiring are as follows.

Types of external Cable specification (mm2)

connection Lower limit Upper limit
Digital input 0.18 (AWG24) 1.5 (AWG16)
Digital output 0.18 (AWG24) 2.0 (AWG14)
Analogue I/O 0.18 (AWG24) 1.5 (AWG16)
Communication 0.18 (AWG24) 1.5 (AWG16)
Main power 1.5 (AWG16) 2.5 (AWG12)
Protective grounding 1.5 (AWG16) 2.5 (AWG12)

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Chapter 11. Installation and Wiring

11-14
 Chapter 12. Maintenance

Chapter 12 Maintenance
To maintain PLC in the best condition, please execute the following routine and periodic inspections.

12.1 Repairs and Maintenance

The I/O module mainly consists of semiconductor elements, so its life is almost semi permanent. However, such elements may be
affected by the environment, so they should be periodically inspected and maintained. Please refer to the following checklist for the
items to be checked once or twice every 6 months.

Checklist Judgment basis Actions

Within the power variance range
Power supply Adjust the power within the allowable voltage variance range.
(less than −15% / +10%)
I/O power I/O specifications of each module Adjust the power within the allowable voltage variance range.

Temperature 0 ~ + 55℃
Adjust the temperature and humidity conditions properly.
Environment Humidity 5 ~ 95%RH

Vibration None Use vibration-preventive rubber or other measures.

Shakes of modules Should not have shake Every module should be protected from shaking.

Loose terminal screw No looseness Tighten any loose screw.

Check whether the amount and
Spare parts conditions of spare parts are Replenish insufficient parts and improve the storage condition.
proper

12.2 Routine Inspection

The following items should be routinely inspected.

Checklist Check point Judgment basis Actions

Attachment of the base Check any loose screw Screws should be firmly tightened. Tightening
• Check the screws are firmly tightened
Attachment of I/O module Should be firmly tightened. Check screw
• Check any separation of module cover
Loosen screw No looseness Tightening
Attachment of terminal strip and
Proximity with clamped terminal Proper spacing Calibration
expansion cable
Connector of expansion cable Connector should be tightened Calibration

Power LED Check whether it is LED ON LED On (off is error)

RUN LED Check whether it is LED ON in RUN state LED On (off or blinking is error)

Display STOP LED Check whether it is LED Off in RUN state Blinking is error Please refer to
LED LED On with input ON and chapter 14.2
Input LED Check whether LED On or Off
LED Off with input off
LED On with output ON and
Output LED Check whether LED On or Off
LED Off with output off

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 Chapter 12. Maintenance

12.3 Periodic Inspection

Please take a measure by checking the following items once or twice every 6 months.

Checklist Check method Judgment basis Actions

Temperature 0 ~ 55 °C
Measure by Adjusting according to the
Environment Humidity thermometer/hygrometer 5 ~ 95%RH general spec.(the environment
Measure corrosive gas in panel)
Contamination level Free of corrosive gas

Looseness/shake Try to move each module Should be firmly attached Tightening

PLC status
Built-in dust/impurities Visual inspection No built-in dust/impurities -

Looseness Tightening with a screwdriver No loosened screws Tightening

Connection Proximate of clamped
Visual inspection Proper spacing Calibration
status terminal
Loosened connector Visual inspection No looseness Tightening connector screws

Check the voltage of input AC100~240V:AC85~ 264V

Check power voltage Change the power supplied
terminal by using a tester DC24V:DC19.2 ~ 28.8V
• Check the total interruption
Check the battery A battery should be replaced if
time and warranty period
Battery replacement timing and it passes the warranty period
• No battery voltage drop
voltage drop despite of no display
display

Regularly replace it because

Fuse Visual inspection • No fusing element may be deteriorated
by inrush current.

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 Chapter 13. EMC Compliance

Chapter. 13 EMC Compliance

13.1 Requirements Complying with EMC Specifications

EMC Directions describe “Do not emit strong electromagnetic wave to the outside: Emission” and “Do not have an
influence of electromagnetic wave from the outside: Immunity”, and the applicable products are requested to meet the
directions. The chapter summarizes how to structure a system using XGT PLC to comply with the EMC directions. The
description is the data summarized for the requirements and specifications of EMC regulation acquired by the company
but it does not mean that every system manufactured according to the description meets the following specifications.
The method and determination to comply with the EMC directions should be finally determined by the system
manufacturer self.

13.1.1 EMC specifications

The EMC specifications affecting the PLC are as follows.
Table 13-1
Specification Test items Test details Standard value
EN55011 Radiated Measure the wave emitted from a 30~230 ㎒ QP : 50 ㏈㎶/m ＊1
noise ＊2 product. 230~1000 ㎒ QP : 57 ㏈㎶/m
EN55011 conducted Measure the noise that a product emits to 150~500 ㎑ QP : 79 ㏈
EN50081-2 noise the power line. Mean : 66 ㏈
500~230 ㎒ QP : 73 ㏈
Mean : 60 ㏈
EN61000-4- 2 Immunity test allowing static electricity to 4 ㎸ Contact discharge
Electrostatic immunity the case of a device.
EN61000-4-4 Immunity test allowing a fast noise to Power line : 2 ㎸
Fast transient burst power cable and signal cable. Digital I/O : 1 ㎸
noise Analogue I/O, signal lines : 1 ㎸
EN61131-2 EN61000-4-3 Immunity test injecting electric field to a 10Vm, 26~1000 ㎒
Radiated field AM product. 80% AM modulation@ 1 ㎑
modulation
EN61000-4-12 Immunity test allowing attenuation Power line : 1 ㎸
Damped oscillatory vibration wave to power cable. Digital I/O(24V and higher) : 1 ㎸
wave immunity
＊1 : QP: Quasi Peak, Mean : average value
＊2 : PLC is a type of open device(installed on another device) and to be installed in a panel.
For any applicable tests, the system is tested with the system installed in a panel.

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 Chapter 13. EMC Compliance

13.1.2 Panel
The PLC is a kind of open device(installed on another device) and it should be installed in a panel. It is
because the installation may prevent a person from suffering from an accident due to electric shock as the
person contacts with the product(XGT PLC) and the panel can attenuates the noise generating from the PLC.
In case of XGT PLC, to restrict EMI emitted from a product, it should be installed in a metallic panel. The
specifications of the metallic panel are as follows.

(1) Panel

The panel for PLC should be installed and manufactured as follows.

(a) The panel should be made of SPCC(Cold Rolled Mild Steel)

(b) The plate should be 1.6mm and thicker
(c) The power supplied to the panel should be protected against surge by using insulated transformer.
(d) The panel should be structured so that electric wave is not leaked outside. For instance, make the door as a
box as presented below. The main frame should be also designed to be covered the door in order to
restrict any radiating noise generated from the PLC.
Body of Panel

Door

Visor

(e) The inside plate of panel should have proper conductivity with a wide surface as possible by eliminating
the plating of the bolt used to be mounted on the main frame in order to secure the electric contact with
the frame.

(2) Power cable and grounding cable

The grounding/power cable of PLC should be treated as follows.

(a) The panel should be grounded with a thick wire() to secure a lower impedance even in high frequency.
(b) LG(Line Ground) terminal and PE(Protective Earth) terminal functionally let the noise inside the PLC flow
into the ground, so a wire of which impedance is low should be used.
(c) Since the grounding cable itself may generate noise, thick and short wiring may prevent it serving as an
antenna.

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 Chapter 13. EMC Compliance

13.1.3 Cable
(1) Expansion cables can be classified into optical and electrical cables according to the connector type.
(a) For the optical cables, use MMF(Multi Mode Fiber) 50/65um LC Type Cable.
Use indoor type, outdoor type, or conduit type according to the installation site.

Fig. MMF(LC Type) cable

(b) For the electrical cables, communication can be done with 100Mbit Twisted Pair cables, however, since the
data transmission in expansion cables is in tens of micro unit, external noise may affect system performance
and control seriously.
Therefore, electrical cables used in XGR systems should, basically, be shielded twisted pair cables
such as FTP, STP, or FSTP.

Fig. FTP Cable

Fig. STP Cable

(2) Fixing a cable in the panel

If the expansion cable of XGT series is to be installed on the metallic panel, the cable should be 1cm and
more away from the panel, preventing the direct contact.
The metallic plate of panel may shield noise from electromagnetic wave while it a cable as a noise source is
close to the place, it can serve as an antenna. Every fast signal cable as well as the expansion cable needs
proper spacing from the panel

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 Chapter 13. EMC Compliance

13.2 Requirements Complying with Low Voltage Direction

The low voltage direction requires a device that operates with AC50~1000V, DC 75 ~ 1500V to have proper safety. The
followings summarize the cautions for installing and wiring PLC of the XGT series to comply with the low voltage
directions. The description is the data based on the applicable requirements and specifications as far as we know but it
does not mean that every system manufactured according to the description meets the following specifications. The
method and determination to comply with the EMC directions should be finally determined by the system manufacturer
self.

13.2.1 Specifications applicable to XGT series

XGT series follow the EN6100-1(safety of the device used in measurement/control lab).
XGT series is developed in accordance with the above specifications, even for a module operating at the rated
voltage higher than AC50V/DC75V.

13.2.2 Selection of XGT series PLC

(1) Power module
The power module of which rated input voltage is AC110/220V may have dangerous voltage(higher than 42.4V
peak) inside it, so any CE mark compliance product is insulated between the primary and the secondary.

(2) I/O module

The I/O module of which rated voltage is AC110/220V may have dangerous voltage(higher than 42.4V peak)
inside it, so any CE mark compliance product is insulated between the primary and the secondary. The I/O
module lower than DC24V is not applicable to the low voltage directions.

(3) CPU Module, Base unit

The modules use DC5V, 3.3V circuits, so they are not applicable to the low voltage directions.

(4) Special module, Communication module

The modules use the rated voltage less than DC 24V, so they are not applicable to the low voltage directions.

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 Chapter 14. Built-in PID Function

Chapter 14 Built-in PID Function

This chapter describes XGR Series CPU built-in PID function.

14.1 Features

The features of PID function built-in XGR-CPU are as follows.

(1) It can execute precise control operation.

(2) It has a fast operation cycle up to 0.6ms.
(3) XGR CPUH can operate totally 256 loops by using 32 loops in 8 blocks.
(4) Symbol variable function facilitates setting and monitoring.
(5) It supports forward/reverse operation process.
(6) Strong dual anti windup prevents effective over/under shoot.
(7) It may be operated by external device (HMI).
(8) It protects the system by restricting the max. variance of PV.
(9) It protects the drive by restricting the max. variance, max value and min value of MV.
(10) Auto-tuning function is used for PID control.
(11) Cascade PID control is available.

14.2 PID Control

PID Control compares the value measured at detection (process value) to the pre-determined value, adjusts outputs (control
signal) to eliminate, if any, an error between two values, making the current value to the target value, in order to maintain the
state of an object to control be a pre-determined value (target value).

MV_manual
User
CPU Manual
module
DA
SV MV Dri Object
User Conversion
MV ver control
PID operation module
PV Auto

AD
Conversion Sense
module

As presented in the above figure, PLC functions as a control in a whole control system while sensor and driver are used to
detect an object to control and drive the system, respectively.
When a sensor detects the current state of an object to control and delivers it to a control, PLC executes an operation of output
and delivers it to a driver. Meanwhile, a driver drives the object according to the output. Finally, a sensor detects the changed
state and re-sends it to PLC, forming a closed loop.
A procedure circulating a control loop repeats at the unit of several seconds and hundreds of microseconds and the time is
called control cycle.

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 Chapter 14. Built-in PID Function

14.3 PID Control Operation

14.3.1 Terms used

It describes the terms necessary to explain PID control operation.

SV : Set value to which an object to control should reach

T_s(Ts) : Sampling time (control cycle)
K_p(Kp) : Proportional constant
T_i(Ti) : Integral time constant
T_d(Td) : Differential time constant
PV : Current state of an object to control, which is detected by a sensor
E : Error of an object to control, which is expressed in (SV – PV)
MV : Control input or control’s output
MV_p(MVp) : Proportional component of MV
MV_i(MVi) : Integral component of MV
MV_d(MVd) : Differential component of MV

14.3.2 PID equation

PID Equation may be expressed from equation (14.3.1) through equation (14.3.5).

E = SV − PV (14.3.1)

MV p = K p E (14.3.2)
Kp
MVi =
Ti ∫ E dt (14.3.3)

dE
MVd = K pTd (14.3.4)
dt

MV = MV p + MVi + MVd (14.3.5)

Error is a mathematical expression indicating how far the current system is out of a user’s desirable state.
For instance, assuming that a user wishes to maintain water in an electric kettle at 50℃ and the temperature of water is 35℃,
SV and PV are 50℃ and 35℃, respectively and error E is 15, the difference between SV and PV. The control executes
PID operation according to the error.
Note that MV totally consists of each component of P, I and D, that is, MV_p, MV_i and MV_d, as presented in figure (14.3.5).
namely, if subtracting D from PID control equation, it results in PI control; alike, if subtracting I and D, it results in P control.

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 Chapter 14. Built-in PID Function

14.3.3 P control
As seen in the equation (14.3.7), MV of P control consists of proportional operation, MV_p only. The term is applicable as a
type multiplying proportional coefficient by error. A user should adjust the coefficient according to the system and as larger it is
set, as more it is sensitive to error.

MV p = K p E (14.3.6)
MV = MV p (14.3.7)
When applying P control to a temporary virtual system, the control tendency features as below.
The following system is made to help you understand; it may be different with the actual temperature (control) system.

60.0

50.0

40.0
Temperature
온도

30.0

20.0

10.0

0.0
0 2 4 6 8 10 12 14 16
초
Second

In the above simulation, SV is 50.0 and the above tendency is gained by adjusting K_p value properly. The above system
shows a stable state in 4 seconds after being operated at 20℃ and it is maintained at 46.2℃, so the residual drift is
3.8℃(about 7.6%). As such, the reason why P control has a permanent residual drift is because as closer PV approaches to
SV, as smaller error (E) is, reducing MV, so it maintains state balance at equilibrium point (in the example, 46.2℃). PI control
is used to supplement the residual drift intrinsically existing in P control.

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 Chapter 14. Built-in PID Function

14.3.4 PI control
PI (proportional-integral) control is calculated by summing up proportional term and integral term as seen in the equation
(14.3.10). To reduce the residual drift, a disadvantage of proportional term, PI control uses integration of the error.

MV p = K p E (14.3.8)
Kp
MVi =
Ti ∫ E dt (14.3.9)

MV = MV p + MVi (14.3.10)
Even though error is uniform, the integral is accumulated as time goes on if applying integral calculus until the error is
eliminated. Therefore, PI control may be used to supplement the residual drift intrinsically existing in P control. Note that Ti,
the integral time constant is the denominator of integral term, so it represents that integral effect is larger as smaller the value
of Ti. The following graph shows the results of PI control to P control application system.
70.0

60.0

50.0
Temperature

40.0
온도

30.0

20.0

10.0

0.0
0 2 4 6 8 10 12 14 16
초
Second

As a result of adding integral effect, the residual drift disappears and the system is converged to 50℃ accurately. However,
the temperature temporarily increased more than a desirable temperature, for which it increased up to 61.2℃ and dropped,
deepening overshoot. Excessive overshoot may overburden the system or make it unstably, so it is necessary to relieve the
overshoot through proper coefficient tuning or improve it by means of PIC control applying differential effect.

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 Chapter 14. Built-in PID Function

14.3.5 PID control

PID control relieves the vibration of PI control by adding differential effect to PI control as expressed in equation (14.3.1)
through (14.3.5). The effect is working when the system’s state is changed after comparing to the previous state, irrespective
of the error of system. However, it is necessary to install a filter on the sensor’s input and set the differential coefficient small to
prevent differential effect from operating against a small change as much as a system noise. In case of an actual system, it is
common to use 0.001 ~ 0.1.

60.0

50.0

40.0
Temperature
온도

30.0

20.0

10.0

0.0
0 2 4 6 8 10 12 14 16
초
Second

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 Chapter 14. Built-in PID Function

14.4 PID Instruction

14.4.1 PID loop state

PID loop has 5 states; PIDSTOP, AUTOTUNE, PIDRUN, PIDCAS and PIDPAUSE.

(1) PIDSTOP is the state in which output (MV) is MV_min, its internal state is initialized and user setting is maintained. In
the state, it is not possible to access to PIDPAUSE state.

(2) AUTOTUNE is the state that is immediately executed when a user turns on _PID[B]_[L]AT_EN bit either PIDRUN or
PIDCAS. If among PIDSTOP, _PID[B]_[L]AT_EN is on, it goes into AUTOTUNE state when it goes toward PIDRUN and
PIDCAS. Once AUTOTUNE is complete, PIDRUN or PIDCAS state is restored. AUTOTUNE checks a system’s
response for a series of inputs and finds PID coefficient (K_p, T_i, T_d) and operation cycle (T_s). These values are
updated as soon as Auto-tuning ends, so it loses the previous coefficients.

(3) PIDRUN is the state in which PID loop normally executes control operation. MV is outputted by PID operation and it
executes every scan operation independently, so it applies every setting that is changed during the procedure. In case
“contact front of PIDRUN instruction is ON”, it enters PIDRUN state, or if there is PIDRUN instruction in ladder program
and PIDxx_REM_RUN is ON, it may enter PIDRUN state.

(4) PIDCAS is the state in which two loops form a master loop and a slave loop respectively, executing control operation.
It is possible to enter PIDCAS state by using PIDCAS instruction after setting these two loops in a way like PIDRUN, and
data are exchanged between loops as the internal connection necessary for two loops are automatically created. Loops
that operate by cascade are indicated in a state flag, PIDxx_STATE and in the state, remote operation
PIDxx_REM_RUM bit does not work.

(5) PIDPAUSE is the state in which output, internal state and user setting are maintained and the control operation stops.
To enter PIDPAUSE state, it is necessary to turn on PIDxx_PAUSE bit or use PIDPAUSE instruction. However, it is
possible to enter PIDPAUSE as long as the previous state is PIDRUN.

AUTOTUNE PIDRUN

PIDSTOP

PIDCAS PIDPAUSE

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 Chapter 14. Built-in PID Function

14.4.2 PID instruction group

PID instruction group includes four instructions; PIDRUN, PIDCAS, PIDINIT and PIDPRMT.
Actually, every operation of PID function is wholly taken by PIDRUN or PIDCAS instruction. PIDINIT and/or IDPPMT
instructions works as long as it exists on a ladder program with PIDRUN or PIDCAS instruction, and both exist for the use
convenience of PIDRUN or PIDCAS instruction.

(1) PIDRUN

PIDRUN, as a basic PID control instruction, is the instruction taking charge of single PID loop control.

PIDRUN

BOOL REQ DONE BOOL

UINT BLOCK PID_STAT UINT
UINT LOOP

If inputting block number (0 ~ 7) into BLOCK and loop number (0 ~ 31) into LOOP, a loop of the block is selected.
PID_STAT displays the operation information for a PID loop, _PID[B]_[L]STATE.

(2) PIDCAS

PIDCAS is the instruction to execute cascade control using two loops.

PIDCAS

BOOL REQ DONE BOOL

UINT BLOCK MST_STAT UINT
UINT LOOP_MST SLV_STAT UINT
UINT LOOP_SLV

If inputting block number (0 ~ 7) into BLOCK, master loop number (0 ~ 31) into LOOP_MST and slave loop number (0 ~
31) into LOOP_SLV, the master and slave of the block are selected. At the moment, the block number of both loops
should be same. MST_STAT/SLV_STAT shows the operation information on master/slave loops, _PID[B]_[L]STATE.

Notes

Cascade Operation

Basically, master loop inputs its MV to SV of slave loop during operation while slave loop executes its
operation by using SV receiving from master loop.
Besides, both loops always mutually observe part of operation information on each loop (i.e. conversion
from/to windup, manual mode and/or auto mode conversion).

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(3) PIDINIT

It initializes the setting and state of a PID loop. At the moment, the initialized area is the setting and state of the designated
block[B] and loop[L], and 0 is inputted to every setting of the loop(bit is off.

PIDINIT

BOOL REQ DONE BOOL

UINT BLOCK
UINT LOOP

If inputting block number (0 ~ 7) into BLOCK and loop number (0 ~ 31) into LOOP, a loop of the block is selected.

(4) PIDPRMT

PIDPRMT changes the major settings of PIDRUN including SV, T_s, K_p, T_i and T_d to user-defined values.

PIDPRMT
BOOL REQ DONE BOOL
UINT BLOCK
UINT LOOP
INT SV
UINT T_S
REAL K_p
REAL Ti
REAR T_d

If inputting block number (0 ~ 7) into BLOCK and loop number (0 ~ 31) into LOOP, a loop of the block is selected.

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 Chapter 14. Built-in PID Function

14.5 PID Flag Configuration

The table shows the flag configuration when using the built-in PID function for XGR.

Data
Symbol K device area Description
type
_PID[B]_[L]MAN %KX[0+1050B+L] BIT Select PID output (0: auto, 1: manual)
_PID[B]_[L]PAUSE %KX[32+1050B+L] BIT PID Pause (0: STOP/RUN 1:PAUSE)
_PID[B]_[L]REV %KX[64+1050B+L] BIT Select PID operation (0: forward, 1:reverse)
_PID[B]_[L]AW2D %KX[96+1050B+L] BIT Prohibit PID Anti Wind-up2 (0:allowed, 1:prohibited)
_PID[B]_[L]REM_RUN %KX[128+1050B+L] BIT PID remote (HMI) execution bit (0:STOP, 1:RUN)
_PID[B]_[L]P_on_PV %KX[160+1050B+L] BIT Select PID proportional calculation source (0:ERR, 1:PV)
_PID[B]_[L]D_on_ERR %KX[192+1050B+L] BIT Select PID differential calculation source (0:PV, 1:ERR)
_PID[B]_[L]AT_EN %KX[224+1050B+L] BIT Set PID auto-tuning (0:Disable, 1:Enable)
MV non-impact conversion when converting PID
_PID[B]_[L]MV_BMPL %KX[256+1050B+L] BIT
mode(A/M) (0:Disable, 1:Enable)
_PID[B]_[L]SV %KW[24+1050B+32L] INT PID target value (SV)
_PID[B]_[L]T_s %KW[25+1050B+32L] WORD PID operation cycle (T_s)[0.1ms]
_PID[B]_[L]K_p %KD[13+525B+16L] REAL PID P – constant (K_p)
_PID[B]_[L]T_i %KD[14+525B+16L] REAL PID I - constant (T_i)[sec]
_PID[B]_[L]T_d %KD[15+525B+16L] REAL PID D – constant (T_d)[sec]
_PID[B]_[L]d_PV_max %KW[32+1050B+32L] WORD PID PV variation limit
_PID[B]_[L]d_MV_max %KW[33+1050B+32L] WORD PID MV variation limit
_PID[B]_[L]MV_max %KW[34+1050B+32L] INT PID MV max. value limit
_PID[B]_[L]MV_min %KW[35+1050B+32L] INT PID MV min. value limit
_PID[B]_[L]MV_man %KW[36+1050B+32L] INT PID manual output (MV_man)
_PID[B]_[L]STATE %KW[37+1050B+32L] WORD PID State
_PID[B]_[L]ALARM0 %KX[592+16800B+512L] BIT PID Alarm 0 (1:T_s setting is small)
_PID[B]_[L]ALARM1 %KX[593+16800B+512L] BIT PID Alarm 1 (1:K_p is 0 )
_PID[B]_[L]ALARM2 %KX[594+16800B+512L] BIT PID Alarm 2 (1:PV variation limited)
_PID[B]_[L]ALARM3 %KX[595+16800B+512L] BIT PID Alarm 3 (1:MV variation limited)
_PID[B]_[L]ALARM4 %KX[596+16800B+512L] BIT PID Alarm 4 (1:MV max. value limited)
_PID[B]_[L]ALARM5 %KX[597+16800B+512L] BIT PID Alarm 5 (1:MV min. value limited)
_PID[B]_[L]ALARM6 %KX[598+16800B+512L] BIT PID Alarm 6 (1:AT abnormal cancellation state)
_PID[B]_[L]ALARM7 %KX[599+16800B+512L] BIT PID Alarm 7
_PID[B]_[L]STATE0 %KX[600+16800B+512L] BIT PID State 0 (0:PID_STOP, 1:PID_RUN)
_PID[B]_[L]STATE1 %KX[601+16800B+512L] BIT PID State 1 (0:AT_STOP, 1:AT_RUN)
_PID[B]_[L]STATE2 %KX[602+16800B+512L] BIT PID State 2 (0:AT_UNDONE, 1:DONE)
_PID[B]_[L]STATE3 %KX[603+16800B+512L] BIT PID State 3 (0:REM_STOP, 1:REM_RUN)
_PID[B]_[L]STATE4 %KX[604+16800B+512L] BIT PID State 4 (0:AUTO_OUT, 1:MAN_OUT)
_PID[B]_[L]STATE5 %KX[605+16800B+512L] BIT PID State 5 (0:CAS_STOP, CAS_RUN)
_PID[B]_[L]STATE6 %KX[606+16800B+512L] BIT PID State 6 (0:SLV/SINGLE, 1:CAS_MST)
_PID[B]_[L]STATE7 %KX[607+16800B+512L] BIT PID State 7 (0:AW_STOP, 1:AW_ACT)
_PID[B]_[L]PV %KW[38+1050B+32L] INT PID Present value (PV)
_PID[B]_[L]PV_old %KW[39+1050B+32L] INT PID previous present value (PV_old)
_PID[B]_[L]MV %KW[40+1050B+32L] INT PID Output value (MV)
_PID[B]_[L]MV_BMPL_val %KW[41+1050B+32L] WORD PID non-impact operating memory
_PID[B]_[L]ERR %KD[21+525B+16L] DINT PID control error
_PID[B]_[L]MV_p %KD[22+525B+16L] REAL PID output P component
_PID[B]_[L]MV_i %KD[23+525B+16L] REAL PID output I component
_PID[B]_[L]MV_d %KD[24+525B+16L] REAL PID output D component
_PID[B]_[L]DB_W %KW[50+1050B+32L] WORD PID deadband setting (operating after stabilizing)
_PID[B]_[L]Td_lag %KW[51+1050B+32L] WORD PID differential function Lag filter

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 Chapter 14. Built-in PID Function

Data
Symbol K device area Description
type
_PID[B]_[L]AT_HYS_val %KW[52+1050B+32L] WORD PID auto-tuning hysterisis setting
_PID[B]_[L]AT_SV %KW[53+1050B+32L] INT PID auto-tuning SV setting
_PID[B]_[L]AT_step %KW[54+1050B+32L] WORD PID auto-tuning state indication (setting by user prohibited)
_PID[B]_[L]INT_MEM %KW[55+1050B+32L] WORD PID internal memory (setting by user prohibited)
* : Area prohibited from user’s setting
* B : XGR CPUH PID block number [0~7]
* L : PID loop number [0~31]

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 Chapter 14. Built-in PID Function

%KX[0+1050B] ~ %KX[287+1050B] area is the common bit area of the block PID loop. The bit state and settings of each bit
are collected and arranged on the front of each PID block. Therefore, 32 bits, the max. no. of loops that PID function may use in
a block is collected, forming a double-word, and the state and setting of each bit are saved in good order of bits.

%KW0024 ~ %KW0055 area is the individual data area for PID block 0 and loop 0, where the setting and state of block 0 and
loop 0 are saved. The loop setting for the PID loop such as SV, dPV_max, MV_man, T_s, Kp, Ti, Td, MV_max, MV_min and
dMV_max are saved in the area, and during the execution of PID function, the state of PID loops such as PV, ETC, MV,
MV_rvs, ERR, MVp, MVi, MVd and PV are also saved. A user may change PID setting simply by writing data on the memory
and get the result reflected to the next cycle.

%KW0056 ~ %KW1047 area is the memory of loop 1 through 31 with the format of block 0 & loop 0. Each loop independently
works and may execute auxiliary operation like the application of cascade. Additionally, the K device memory configuration
mentioned in the end of user’s manual may help you understand the memory location of PID.

The location and order of the memory area as mentioned above may change without prior notice to improve the product
performance.

Notes
1) PID memory statement format
_PID[B]_[L]MAN B: block, L : loop
i.e.) _PID3_05MAN : means MAN bit of block 3 and loop 5.

2) Common bit area

i.e.) _PID3_25PAUSE : because of block 3 and loop 25, it represents the location of %KX[32+1050B+L]
= %KX3207.

3) Individual data area

i.e.) _PID5_30SV : because of block 5 and loop 30, it represents the location of %KW[24+1050B+32L]
= %KW6234.

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 Chapter 14. Built-in PID Function

14.5.1 Common bit area

Common bit area is the part that gathers every data consisting of bits for each of 32 loops. It has a double word format of 32
bits as the information on 32 loops for an item; n th bit means the information on the n th loop. m is the value that the loop
number, n is converted to a hexadecimal.

(1) _PID[B]_[L]MAN (PID Manual operation enable) - Setting area

K DEVICE AREA : %KX [0+1050B+L]

Data unit : BIT
It determines whether PID function of n th loop is operated manually or automatically(AUTO/MANUAL).
AUTO state outputs the results that PID operation is normally executed while MANUAL state does not execute PID
operation and instead, it outputs a use desirable temporary value. At the moment, the output is generated as
_PID[B]_[L]MV_man, which is the value a user wishes.
If a bit is off, it is set as [Default] AUTO.

(2) _PID[B]_[L]PAUSE (PID PAUSE mode) - Setting area

K DEVICE AREA : %KX [32+1050B+L]

Data unit : BIT
It makes n th PID loop in pause state.
If converting PAUSE to RUN state again, it continuously controls. Therefore, since control system may result in
unexpected results if the system state is changed in PAUSE, PAUSE function should be carefully used.
If the bit is off, [Default] PAUSE is cancelled.

(3) _PID[B]_[L]REV (PID REVerse operation) - Setting area

K DEVICE AREA : %KX64+1050B+L]

Data unit : BIT
It sets whether a control system is forward system or reverse system.
If system state ascends when system input rises, it is called forward system; if it descends when it increases, it is called
reverse system.
In case of boiler, the temperature rises as the system input increases, so it is a forward system. On the other hand, in
case of cooling system, the temperature drops as the system input rises, so it is a reverse system.
If the bit is off, it is set as [Default] Forward system.

Notes

_PID[B]_[L]PAUSE

If making PID loop in PAUSE state by using PID[B]_[L]PAUSE and PIDPAUSE instruction, every
operation stops and it outputs the last calculation before PAUSE state. In the case, if system state
is changed, the control system may show unexpected results due to improper control, so PAUSE
function should be carefully used.
In the first scan of PLC, since PIDRUN instruction executes initialization, in which PAUSE bit is off,
it escapes from PAUSE and turns STOP or RUN state if turning on PLC in PAUSE state.

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(4) _PID[B]_[L]AW2D (PID Anti Wind-up 2 Disable) - Setting area

K DEVICE AREA : %KX[96+1050B+L]

Data unit : BIT
If the bit is off when a user does not want it, Anti Wind-up2 function is deactivated.
The function of Anti wind-up is detailed in 14.6.
If the bit is off, [Default] Anti Wind-up2 function is enabled.

(5) _PID[B]_[L]REM_RUN (PID REMote RUN) - Setting area

K DEVICE AREA : %KX[128+1050B+L]

Data unit : BIT
It is the external operation instruction of PIDRUN.
Being used as an external operation instruction, it functions alike the effect that PIDRUN instruction contact is on/off.
Indeed, PIDRUN instruction executes OR operation of “PIDRUN instruction’s input condition” contact and the bit to
determine whether to execute the operation. If using the function, PIDRUN instruction’s operation contact may be
assigned to a fixed address, so a user may conveniently use external I/O devices such as HMI.
If the bit is off, [Default] (if contact is off), PIDRUN instruction stops.

(6) _PID[B]_[L]P_on_PV (PID P on PV) - Setting area

K DEVICE AREA: %KX[160+1050B+L]

Data unit : BIT
It sets the P operation source of PID loop as PV. P operation is operated with ERR or PV, and P operation using PV is
relatively slow moving to stable state, rather using ERR, in an unstable state of instantaneous control due to initial
response or disturbance. It means that output fluctuation is not steep and consequently, it does not overburden the driver.
However, since the range of internal operation value changes, Anti Wind-up function does not work.
If the bit is off, PID executes P operation with ERR in [Default] state and in case of on, it executes P operation with PV
value.

(7) _PID[B]_[L]D_on_ERR (PID D on ERRor) - Setting area

K DEVICE AREA : %KX[192+1050B+L]

Data unit : BIT
It sets the D operation source of PID loop as ERR. D operation is operated with ERR or PV, and D operation using ERR
may cause excessive input to a driver instantly because D response may have sudden change as SV is changed by a
user. To prevent it, D operation uses PV and the default is also set to be D operation using PV. If using ERR without the
algorithm, the bit should be on. If the bit is off, PID executes D operation with PV in [Default] state, and in ON state, it
executes D operation with ERR value.

Notes

_PID[B]_[L]REM_RUN

The bit is saved in K device even though PLC stops, so if PLC stops and operates with the bit ON
(i.e. power failure), the system is initialized from the first scan and then, PIDRUN instruction
operates.

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(8) _PID[B]_[L]AT_EN (PID AutoTuning ENable) - Setting area

K DEVICE AREA : %KX[224+1050B+L]

Data unit : BIT
It auto-tunes the PID loop. AT finds out T_s (operation cycle) and PID coefficients (K_p, T_i and T_d) approximately.
Before operating AT, it is necessary to set PID[B]_[L]HYS_val item and the functions of AT is detailed in 14.6.
If the bit is off, [Default] AT function is disabled and AT is executed at the ascending edge.

(9) _PID[B]_[L]MV_BMPL (PID MV BuMPLess changeover) - Setting area

K DEVICE AREA : %KX[256+1050B+L]

Data unit : BIT
It calculates MV through operation, reflects it into the internal state and stabilizes MV so that MV is to be smoothly
continued as soon as the PID loop is converted from manual output mode to auto output mode. The function is different in
algorithm for single operation and cascade operation but both operate with the bit.
If the bit is on (the bit of master loop in case of cascade), it executes Bumpless changeover. In case of off, [Default]
Bumpless changeover function is disabled.

Notes

_PID[B]_[L]AT_EN

The bit is initialized to off as soon as PLC is turned to RUN mode, so when PLC stops and
operates with the bit on(i.e. power failure), the system is initialized from the first scan and then, it
does not go to AT mode again. At the moment, PID setting does not have any change, so the
system operates with the state before PLC stops.

_PID[B]_[L]MV_BMPL

For instance, assuming that manual output value is 1000, it is turned to auto output and 2000
output is to be generated, a driver operates the system with 1000 and instantly receives 2000 at
the moment of mode conversion. Then, if the bit is ON, the PID loop outputs at the moment of
conversion, gradually increases and operates it so that 2000 is to be outputted.

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14.5.2 Individual data operation

The individual data area of block B and loop L is %KW[24+1050B+32L] ~ %KW[55+1050B+32L].

(1) _PID[B]_[L]SV (PID Set-point Value) - Setting area

K DEVICE AREA : %KW[24+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
It sets SV of a loop.
As described in the previous chapter, it is the system state that a user wishes. The state is indicated with numbers and it
should be converted, based on PV along the system’s gain and inputted accordingly.
For instance, if temperature is 50℃, SV should be set to 5000 when controlling the temperature at 50℃ in a system in
which PV is sensed for 5000.

(2) _PID[B]_[L]T_s (PID Sampling Time) - Setting area

K DEVICE AREA : %KW[25+1050B+32L]

Data unit : WORD [ 0 ~ 65535 ]
It sets the sampling time of a loop.
Sampling time is the cycle of control operation and represents the time cycle of control operation. The sampling time may
be set, at least, from 0.1ms up to 6553.5 ms in 0.1ms, and it is also set at the unit of 1 integer per 0.1ms. That is, if setting
the sampling time to 100ms, input 1000 to _PID[B]_[L]T_.
Especially, if a user sets the sampling time to 0, it is set in scan cycle control mode and control operation is executed
every scan, so the max. speed control operation is executed in the current environment.
If it exceeds the current scan speed due to two short sampling time, _PID[B]_[L]STATE alarm bit is displayed.

(3) _PID[B]_[L]K_p (PID Proportional Gain) - Setting area

K DEVICE AREA : %KD[13+525B+16L]

Data unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
It sets the proportional constant(K_p) of a loop. K_p is multiplied by P, I and D(Proportional, integral and differential)
among PID control effects, so if K_p is increasing, differential effect is also larger while integral effect is reduced.
Especially, if _PID[B]_[L]K_p setting is 0, it does not execute P control. For details, refer to 14.6.
K_p can be set within the range of real number(REAL).

Notes

_PID[B]_[L]SV

PID changes the output (MV) through several operations until SV=PV. Therefore, if SV is 0, PIDRUN
seems not to operate. For instance, if the current temperature is 20 degrees and the SV of simple
heater of which PV is 2000 (20 degrees) is set to 0, PID outputs 0 as its MV and will not output until
PV is cooled down to 0 (0 degrees).

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 Chapter 14. Built-in PID Function

(4) _PID[B]_[L]T_i (PID integral Time gain) - Setting area

K DEVICE AREA : %KD[14+525B+16L]

Data unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
It sets the integral time constant (T_i) of a loop. T_i divides I (integra) term out of PID control effects, so if T_i is increasing,
the integral effect is reduced.
Especially, if _PID[B]_[L]T_i setting is 0, it does not execute I control and for details, refer to 14.6.
T_i may be set to the range of real number (REAL).

(5) _PID[B]_[L]T_d (PID derivative Time gain) - Setting area

K DEVICE AREA : %KD[15+525B+16L]

Data unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
It sets the differential time constant(T_d). T_d is multiplied by D(differential) term out of PID control effects, so if T_d is
increasing, differential effect is increasing.
Especially, if _PID[B]_[L]T_d setting is 0, it does not execute D control and for details, refer to 14.6.
T_d may be set to the range of real number(REAL).

(6) _PID[B]_[L]dPV_max (PID delta PV MAXimum limit) - Setting area

K DEVICE AREA : %KW[32+1050B+32L]

Data unit : WORD [ 0 ~ 65535 ]
It sets the PV variation of a loop.
In an actual control, PV does not always reflect the accurate state of system. In detail, PV may be reflected with
undesirable signals such as sensor’s malfunction, noise and disturbance. To prevent it, if PV is changed over the value
set in _PID[B]_[L]dPV_max, it protect it primarily, avoiding any change exceeding the value. On the other hand, if
_PID[B]_[L]dPV_max is set to small, the convergence time may take longer because system’s change is reflected late,
make sure to set it suitable for the characteristics of a system.
Especially, if the value is set to 0, the function does not work.

(7) _PID[B]_[L]dMV_max (PID delta MV MAXimum limit) - Setting area

K DEVICE AREA : %KW[33+1050B+32L]

Data unit : WORD [ 0 ~ 65535 ]
It limits the MV variation of a loop.
If control system is rapidly changed, system may not be stabilized or be subject to trouble or unstable operation due to
overload on a driver. To prevent it, it limits the output variation of a control. Especially, if the value is set to 0, the function
does not operate.

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(8) _PID[B]_[L]MV_max (PID MV MAXimum limit) - Setting area

K DEVICE AREA : %KW[34+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
It limits the max value of MV of a loop.
It prevents overload by limiting the max. output of a control delivered to output device and cuts off any system error. In
addition, it prevents any overflow or other undesirable value from being delivered.

(9) _PID[B]_[L]MV_min (PID MV MINimum limit) - Setting area

K DEVICE AREA : %KW[35+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
It limits the min. value of MV of a loop.
It prevents overload by limiting the min. output of a control delivered to output device and cuts of any system error. In
addition, it prevents any overflow or other undesirable value from being delivered.

(10) _PID[B]_[L]MV_man (PID MANual MV variable) - Setting area

K DEVICE AREA : %KW[36+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
It designates MV if a loop is set as a manual operation. The value set here outputs the value of PID[B]_[L]MV_man as the
MV of a loop if _PID[B]_[L]MAN of common bit area is on.

(11) _PID[B]_[L]STATE (PID STATE) - Setting disabled

K DEVICE AREA : %KW[37+1050B+32L]

Data unit : WORD [ h00 ~ hff ] or BIT
It indicates the state of abnormal state of a loop.
It is located at the address of %KW[37+1050B+32L] while each bit(16) has 16 meanings respectively. At present, a part of
them are used, among 16 bits.
STATE is on only for a moment that the related operation occurs while the operation is cancelled, it returns to off.
The low 8 bits of STATE(_PID[B]_[L]ALARM 0 ~ _PID[B]_[L]ALARM 7) represent kinds of abnormal state of a loop while
the high 8 bits of STATE(_PID[B]_[L]STATE 0 ~ _PID[B]_[L]STATE 7) indicates the control state of a loop.
Assignment of each bit is as follows.
_PID[B]_[L]ALARM 0 : skipping an operation because T_s setting is too small.
_PID[B]_[L]ALARM 1 : K_p is 0.
_PID[B]_[L]ALARM 2 : PV variation is limited.
_PID[B]_[L]ALARM 3 : MV variation is limited.
_PID[B]_[L]ALARM 4 : MV max. value is limited.
_PID[B]_[L]ALARM 5 : MV min. value is limited.
_PID[B]_[L]ALARM 6 : abnormally canceled during AT.
_PID[B]_[L]STATE 0 : PID operation is in progress(effective in case of PLC run)
_PID[B]_[L]STATE 1 : PID AT is in progress.
_PID[B]_[L]STATE 2 : PID AT is complete.
_PID[B]_[L]STATE 3 : PID is operating remotely by _PID[B]_[L]REM_RUM bit.
_PID[B]_[L]STATE 4 : PID mode is manual output mode.
_PID[B]_[L]STATE 5 : PID loop belongs to cascade.
_PID[B]_[L]STATE 6 : PID loop is the cascade master loop.
_PID[B]_[L]STATE 7 : Anti Wind-up is operating during PID operation.

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 Chapter 14. Built-in PID Function

(12) _PID[B]_[L]PV (PID Process Variable) - I/O area

K DEVICE AREA : %KW[38+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
It represents the PV of a loop.
PV is the indicator showing the current state of the system and the input from sensor is saved into U device of CPU via
input devices such as Analog input module. The value should be moved to _PID[B]_[L]PV by using instructions such as
MOV every time it scans. Refer to the examples described in the end of the user’s manual.

(13) _PID[B]_[L]PV_old (PID previous PV) - Setting disabled

K DEVICE AREA : %KW[39+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
It is used for integral/differential operation to the previous PV state of a step of the related loop and it is recommended to
refer to it, if necessary. If inputting a temporary value, it may be subject to malfunction.

(14) _PID[B]_[L]MV (PID Manipulated output Variable) - I/O area

K DEVICE AREA : %KW[40+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
It represents MV of a loop.
MV is a signal source to drive a system and conversely as described in 12) _PID_PV, it is delivered to U device by using
instruction such as MOV every time it scans and it is used as the input of system drive via output devices such as Analog
output module. Also, refer to the examples of program.

(15) _PID[B]_[L]MV_BMPL_val (PID MV BuMPLess changeover VALue) - Setting disabled

K DEVICE AREA : %KW[41+1050B+32L]

Data unit : WORD [ 0 ~ 65535 ]
A loop saves the information necessary for operating Bumpless changeover. The memory is automatically set and
inputted by means of PID internal operation while it is prohibited for a user to set the value.

Notes

Bumpless Change Over

In case PID control returns to auto output mode after being converted to manual output mode, it
increases the output from 0 like a control system that is newly started, by which the system is
subject to mode conversion impact. That is, a certain output is allowed in manual mode and as
soon as it is converted to auto mode, the output rises from 0 again. To prevent the mode
conversion impact, it uses MV_BMPL function, which detects the last state of manual mode of the
current system during the mode conversion and induces it to continue the control output from the
part smoothly. By expanding it, master loop detects the slave loop state with master loop
MV_BMPL allowed and creates the control output to be smoothly continued.

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(16) _PID[B]_[L]ERR (PID ERRor value) - Setting disabled

K DEVICE AREA : %KD[21+525B+16L]

Data unit : DINT [ -2747483648 ~ 2747483647 ]
It represents the current error of a loop.
In PID, error is defined as SV – PV. It is used as an indication how far the current state is distance from the desirable state,
and if error is 0, it means that the control system state reaches the desirable state. Therefore, ideal control system can be
defined that if control starts, error is rapidly reduced from its excessive state and reaches to the normal state, the vibration
is minimized and the residual drift(stable state error) is maintained as 0.

(17) _PID[B]_[L]MV_p (PID MV Proportional component) - Setting disabled

K DEVICE AREA : %KD[22+525B+16L]

Data unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
It represents the proportional control value of a loop. If the current system error is known, proportional, integral and
differential control outputs can be independently calculated. By comparing three outputs, the operation state of control
system and PID control may be accurately comprehended while MV is calculated with the sum of MV_p, MV_i and MV_d.

(18) _PID[B]_[L]MV_i (PID MV Integral component) - Setting prohibited

K DEVICE AREA : %KD[23+525B+16L]

Data unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
It displays the integral control value of a loop.

(19) _PID[B]_[L]MV_d (PID MV Derivative component) - Setting prohibited

K DEVICE AREA : %KD[24+525B+16L]

Data unit : REAL [ -3.40282347e+38 ~ -1.17549435e-38 , 0 , 1.17549435e-38 ~ 3.40282347e+38 ]
It displays the differential control value of a loop.

(20) _PID[B]_[L]DB_W (PID DeadBand Width) - Setting area

K DEVICE AREA : %KW[50+1050B+32L]

Data unit : WORD, Range [ 0 ~ 5000 ]
It sets the deadband of a loop. The only positive value is available and it operates within the area set up and down the SV.
That is, if PV is within the section of [SV – DB_W] ~ [SV + DB_W], it is necessary to substitute SV for PV(can not checked
externally). If setting the value to 0, the function does not work.

Notes

Deadband
It is used to eliminate small output flunctuation resulting from small change of state as PV approaches
to SV. If inputting a value into DB_W during PID control, a deadband is formed as much as up/down of
SV. If PV follows SV and enters the inside of deadband during control, ERR is forcibly calculated as 0
and the change of MV stops as long as PV remains in the section. That is, it's like the pause to control
in a stable section and through it, a driver receives input uniformly while it operate stably and helps it not
to be overburdened. It is recommended to use it after the system is properly stablized in a section set
as deadband. The reason is because a control may suffer from temporary transient phenomena while
entering into the deadband.

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(20) _PID[B]_[L]Td_lag (PID Td lag filter) - Setting area

K DEVICE AREA : %KW[51+1050B+32L]

Data unit : WORD [ 0 ~ 65535 ]
It sets the primary delay filter, based on the differential calculation, of a loop and makes the differential effect reacting as
an instant impact more smooth and constantly. If setting it higher, it may result in more smooth differential output. If setting
it as 0, the function does not work. It is normally used to avoid excessive force on drivers as the system output slightly
vibrates by differential vibration.

(21) _PID[B]_[L]AT_HYS_val (PID Autotuning HYSteresis value) - Setting area

K DEVICE AREA : %KW[52+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
It sets a proper directional deadband during AT of a loop. _PID[B]_[L]AT_HYS_val value operates as a high deadband
when PV increases or as a low deadband when PV decreases. Successful AT results depend on setting it properly. How
to set _PID[B]_[L]AT_HYS_val is described in 14.7.4.

(22) _PID[B]_[L]AT_SV (PID Autotuning SV) - Setting area

K DEVICE AREA : %KW[53+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
During AT of a loop, AT_SV used for SV is separately set. AT vibrates 3 times up and down around AT_SV.

(23) _PID[B]_[L]AT_step (PID Auto-tuning step) - Setting prohibited

K DEVICE AREA : %KW[54+1050B+32L]

Data unit : INT [ -32768 ~ 32767 ]
It displays the AT operation state of the loop. _PID[B]_[L]AT_step may have a value between 0 ~ 7; 0 indicates AT
operation is not started while 7 indicates AT operation is complete. And, 1, 3 and 5 are PV increasing section and 2, 4 and
6 are the PV decreasing section.

Caution
1) Setting prohibited : It is prohibited to set any item with the indication of –Setting prohibited among the
items described in the above common bit area and individual loop area. The area not only displays operation
information to a user but also saves the information necessary for operation, so the control system may
malfunction if setting it temporarily.
2) I/O area : _PID[B]_[L]PV and _PID[B]_[L]MV are – I/O area respectively, so it is necessary to connect to
external devices(A/D, D/A and others).

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Notes

Transient state and normal state

1) Transient state : the state that a control system starts controlling and searching for a desirable control
state. It may have sudden output fluctuation, and as a step in which integral value is stabilized, it may
have vibration and overshoot.

2) Normal state : the state that a control system reaches a desirable state via transient state. Vibration is
completely eliminated but it may have residual drift and output has little change.

High / low deadband

If analog component of a sensor is converted to digital via AD device, almost signals may have even a
part of noise component. The PID control instruction executes auto-tuning by using the converted value,
during which it increases and decreases PV from SV 3 times. During the procedure, if noise is inputted at
a moment of SV=PV, there is high/low convergence once but it may recognize it as several conversions.
That is, it’s like a digital switch’s chattering. To overcome it, PID control uses unidirectional deadband
(hysteresis), with which the deadband value is applicable only for high section of SV when the system’s
PV increases toward SV, and vice versa.

Mode Mode
conversion conversion

High deadband High deadband

SV
Low deadband

PV
Time

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 Chapter 14. Built-in PID Function

14.6 Convenient Functions of PID Instruction

The chapter describes additional functions that may be conveniently used with PID instructions.

14.6.1 Various control methods including PID

The most commonly used PID controls are P control, PD control and PID control. Meanwhile, if expecting several
characteristics(mostly stabilization), ID control, I control and D control, which are slightly complicate than the above-listed
controls, are often used. To enable various controls, PIDRUN instructions support the function to allow or prohibit such
controls by P, I and D components.
For instance, in case of P control, it may be structured by setting _PID[B]_[L]Ti and _PID[B]_[L]Td as 0. If PI control is desired,
set _PID[B]_[L]Kp and _PID[B]_[L]Ti only and input 0 to _PID[B]_[L]Td. Then, if you wish to use ID control, set _PID[B]_[L]Kp
as 0 and set the remaining _PID[B]_[L]Ti and _PID[B]_[L]Td.
Likewise, ID control sets 0 to _PID[B]_[L]Kp and substitutes each ID control coefficient to _PID[B]_[L]Ti and _PID[B]_[L]Td.
However, interestingly, ID control has 0 output theoretically once setting 0 to _PID[B]_[L]Kp(refer to equation 14.3.2 through
14.3.5). In addition, actual PIDRUN instruction calculates MVp = 0 and K_p = 1 internally if inputting 0 to _PID[B]_[L]Kp,
enabling ID control, I control and D control.

14.6.2 Operation and function of Anti Wind – up

PIDRUN instruction supports two wind-up prevention functions; Anti Wind-up 1 and Anti Wind-up 2. The former one that is
basically supported may work for controls including I control, PI control, ID control and PID control and may not be cancelled.
The operation principle is to limit MVi(integral result) to _PID[B]_[L]MV_max and _PID[B]_[L]MV_min.
On the other hand, Anti Wind-up 2 is organically connected MVp(proportional term result). If only with MVp, MV may reach
土(_PID[B]_[L]MV_max) because of a large system error, MVi maintains the previous value without any calculation.
Therefore, if an error is large, it induces PV to move to SV only with MVp, not integral nor differential, resumes I control and
prevents MVi from being excessively accumulated. On the other hand, a user may cancel an operation if Anti Wind-up 2
makes _PID[B]_[L]AW2D bit on the common bit area ON. And, like PI control and PID control, it works for a control
accompanying with P control and I control.

14.6.3 Operation and function of Auto-tuning

PIDRUN instruction has the AT function that tests a system through several basic settings and calculates _PID[B]_[L]T_s,
_PID[B]_[L]K_p, _PID[B]_[L]T_i and _PID[B]_[L]T_d, suitable for the system. The values such as _PID[B]_[L]MV_min,
_PID[B]_[L]MV_max, _PID[B]_[L]AT_HYS_val and _PID[B]_[L]AT_SV should be set before AT while the AT function sets
MV three times in good order of _PID[B]_[L]MV_max and _PID[B]_[L]MV_min, operates it, checks the system’s state(PV)
response, measures the time and vibration degree to reach to the AT target value(AT_ST) and finally, calculates
_PID[B]_[L]T_s, _PID[B]_[L]K_p, _PID[B]_[L]T_i and _PID[B]_[L]T_d suitable for the measurements. To calculate the
accurate tuning value, refer to the AT setting described in 14.7.4 and induce the AT operation accordingly.

Notes

Auto-tuning

At the moment when a series of works end, AT may automatically substitutes _PID[B]_[L]T_s,
_PID[B]_[L]K_p, _PID[B]_[L]T_i and _PID[B]_[L]T_d, which are calculated, to the corresponding
positions, so a user must note that _PID[B]_[L]T_s, _PID[B]_[L]K_p, _PID[B]_[L]T_i and
_PID[B]_[L]T_d that are used before are to be eliminated.

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14.6.4 Operation and function of cascade

PIDCAS instruction executes CASCADE PID control by operating two PID loops. In general, CASCADE PID control is used
for chemical process or temperature control through fuel and at the moment, two loops used are called master and slave,
respectively. For instance, assuming temperature control through fuel’s flowrate, in case of single loop PID control, it opens
fuel valve and control fuel’s flow, with which it controls the temperature of heating furnace. Therefore, a single PID loop is a
system to indirectly control temperature. As such, the application of cascade PID requires installing fuel’s flowmeter on a
system, which is divided into flow control and temperature control. That is, slave loop controls a flow by using a valve while
master loop controls temperature by using the flow. In the case, master loop delivers a desirable flow to slave loop, which
monitors, in turn, the flowmeter so that fuel is supplied as much as flow needed by master loop and controls flow by using a
valve. Simply, slave loop operates only with the target flow received from master, irrespectively of temperature.
Now, looking into the cascade operation, master loop measures temperature(PV_mst) at relatively later cycle than slave loop,
calculates the flow value(MV_mst) calculated for a desirable temperature(SV_mst) and delivers it to slave loop.
Slave loop sets the flow value(MV_mst) received from master as its target(SV_slv), measures the fuel input at more
frequency than master loop and adjusts the valve open/close(MV_slv).
Therefore, cascade plays a role to deliver the MV(MV_mst) of master loop to SV of slave loop(SV_slv) with two loop
operated.
If slave loop is converted to manual output state, master output is not used, so master loop is also converted to manual
output mode.
At the moment, the manual mode _PID[B]_[L]MAN bit is not on in the master loop. At the moment when slave loop is
converted to auto output mode again, master loop is also converted to auto output mode, when if _PID[B]_[L]MV_BMPL is
on, it exchanges state data between two loops, smoothly executing the conversion.
If slave loop is caught in anti-windup, master loop operates in PIDPAUSE mode. As such, despite of anti-windup, if it
increases or decreases the target slave value(SV_mst), the second windup for the entire cascade loop is prevented. The
function operates in accordance with the conditions without setting and _PID[B]_[L]PAUSE bit is not on.

user
Cascade loop
SV_mst
SV_slv = MV_mst PV_mst
Master loop

MV_slv Slave PV_slv thermom

loop eter
heater

Heating
fuel valve flowmeter
furnace

Notes

Cascade system’s auto-tuning

Cascade system’s AT auto-tunes slave loop first and then, it does master loop. However, to auto-tune
slave loop, it is necessary to anticipate how much SV the slave lop receives from master loop, and if
setting the value as AT_SV, the slave loop operates as an independent loop. AT performance depends
on the anticipated value. Once it starts working properly after the AT of slave loop, it executes AT of
master loop.

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14.7 Directions of PID Instructions

The chapter describe the directions of PID instructions.

Please refer to the manual for the details on CPU, special module and XG5000 functions.

14.7.1 Hardware Configuration

The example system is structure as follows.

MV_manual
user
CPU manual
module Analog
SV MV output driv Object
user
MV module er control
PID operation
PV auto

Analog
input
sensor
module

(1) CPU (XGR-CPUH)

CPU is a PID control because PID operation is executed here. A control receives the data sensed by an input module,
calculates the output through operation and delivers it to an output module. At the moment, a user should connect I/O and
design(tune) the inside of PID control. In general, input and output use Analog input modules and Analog output modules,
respectively.

(2) Analog module and parameter registration

To use Analog module, it is necessary to register them to a project and set them properly. First of all, install analog
modules and use the I/O synchronization function of I/O information module to register them.

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Once a module is registered, it is necessary to register a parameter to use among the parameters assigned to the module,
as the global parameter.

(3) Analog input module (XGF-AV8A)

It functionally receives the state of an object to control from a sensor and delivers it to CPU. Analog input module channel
0 receives 0 ~ 5 V as its input and delivers the output, a digital value to PLC. Then, XGF-AV8A has 8 channels(CH0 ~
CH7). AGF-AV8A setting may be changed in the I/O parameter setting window, which appears when selecting I/O
parameter in ‘Parameter’ item of project window. Change CH 0 to ‘Operate’ and set the input range to 0 ~ 5V(set along a
sensor). Output data type is the PV of PID control, and the range of the value for PID control is to be set between 0 ~
1000.
Now, the 0 ~ 5 signal detected from a sensor during Analog input module operation is converted to a digital value
between 0 ~ 1000, which is x2000, and it is delivered to PLC.
The following figure shows the setting window of XGF-AV8A in XG5000.

(4) Analog output module (XGF-DV4A)

Analog output module functionally converts the control output digital value, which is created by PLC’s control operation, to
4mA ~ 20mA and delivers it to a drive of an object to control. XGF-DV4A model has totally 4 channels and like XGF-
AC8A, it may be changed in the I/O parameter setting window. It is necessary to change CH0 to ‘Operate’ and set the
output range to 0 ~ 5V (set along a driver). The MV digital output of 0 ~ 1000, which is created by PID control operation is
reduced as small as 1/2000 and it is delivered to the signal of the driver.
The figure shows the setting window of XGF-DV4A in XG5000.

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(5) Register parameter

To approach Analog input module and Analog output module, it is necessary to register the parameter of each module
prior to use. A parameter of every special module installed may be automatically registered through the auto registration
of special module parameter of Edit menu after opening Global Parameter in the project window.

Among them, select parameters necessary for executing the ladder program and register them as the local parameters.

(6) Sensor and driver

Besides Analog output module, sensor and driver are media to deliver a state to a control from an object to control and
deliver the output of a control to an object to control from a control. Therefore, the output created by a sensor should be
used as an input of Analog input module while the output created by Analog output module should be used as the input of
driver. For instance, if a sensor is current type of 4mA ~ 20mA, it should be Analog input module type of 4mA ~ 20mA. In

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 Chapter 14. Built-in PID Function

addition, if a driver is voltage type of 0V ~ 5V, Analog output module should be also voltage type of 0V ~ 5V.
The output of Analog output module is used as a drive signal of a driver. If it is used directly as the motive power of driver,
PLC may be subject to malfunction.

(7) Object to control

The system uses water level control system as its object to control. The water level system is designed to supply water to
a water tank of which bottom is slightly open and maintain a desirable water level. The water in a tank uniformly flows out
and the increase/decrease of water depends on the water inflow by means of a pump. The structure of the water control
system is as follows.

Water
level
sensor
driver

pump
inflow

Water
level
Water
tank

outflow

14.7.2 Program example 1

The figure shows a program example to execute PID control by using Analog input module and Analog output module.
(but, PID constant and SV value are set in the parameter monitor window in the program)

L1 : delivers Analog input data to PV of PIDRUN instruction by using constant On contact.

L5 : If %MX0 bit is on, it executes the control operation of PIDRUN block 0 and loop 0 and if it is complete, it activates
D/A output. If D/A output is deactivated, the module outputs the value set when it is registered.

L10 : Delivers MV output of PIDRUN instruction to Analog output data by using constant ON contact.

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 Chapter 14. Built-in PID Function

14.7.3 PID control

(1) Register parameter monitor

Register PID parameters in the parameter monitor window and execute control setting.
If clicking the right button of mouse in the parameter monitor window and selecting, “Register in Parameter/Comment”, it
is possible to view “Select Parameter/Device” window. If selecting PID in “List”, canceling “View All” and inputting 0 to
“Block No.” and “Parameter No.”, a user can see the parameter to save the setting and state of block 0 and loop 0. If
selecting all parameters and checking “OK”, it is possible to monitor parameters and change the values even during the
program RUN.

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(2) Getting SV

To set SV, it is necessary to know PV conversion value of a system that a user desires. Simply, if a user desires to
maintain the water level at 250mm, it searches for the PV value indicating 250mm. The value can be found by numerical
analysis but it is more accurate to check it by using the response of an object to control experimentally. In the system, it
was analyzed that PV outputs 8333 when the water level is 250mm, but as a result of operating it actually, the sensor
output value was 8250. The cause of the error must be attributable to inaccurate sensor, error of measurement reference
point and others. Therefore, 8250, the value actually measured should be used as the state value of water level 250mm.
The value is also used as SV when controlling 250mm.

(3) Control setting

Download the previously created program to PLC and start monitoring. Then, set the parameters registered to the
parameter monitor window. The following figure shows the view of example program’s parameter monitor window.

Settings include three; SV, K_p and MV_max.

SV is set to 8250, which is actually measured and Kp is given with 5 temporarily. MV_max is an item to limit the max.
value of MV and is set to 1000 in accordance with ADC / DAC module.

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(4) Control state observance using trend monitor

It activates trend monitor among the monitor functions of XG5000.

By allowing the docking of trend monitor, arrange it properly.

By means of trend setting, register the data to observe.

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Set the monitoring cycle as 200ms, select the trend graph tab on the bottom and register the parameters to monitor such
as SV and PV of block 0 and loop 0.

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(5) Program execution (here, an example is introduced to show how to find a parameter manually and for auto tuning,
refer to 14.7.4)

If contact (%MX0) is ON, the system starts operating.

Increase K_p to 100 and restart it.

It can be found that it uniformly and permanently vibrates due to too large K_p.

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Set ‘K_p = 20, T_i = 100’.

Due to too large T_i , the normal state residual drift lasts and there is a slight overshoot.

Set K_p = 10, T_i =1.

Due to too small T_i, PV is slowly fluctuating.

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Set K_p = 10, T_i = 5.

It shows the satisfactory results.

The current system is the system slow enough to control only with PI, so it executes PI control only.
Therefore, tuning results are K_p = 10, T_i = 5, T_d = 0.

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14.7.4 AT (Auto-tuning) operation

While using and operating the system described in the above 14.7.3, especially using AT function, check the setting of AT.
The basic AT function may operate with the system not operated, that is, when the system has a PV less than
_PID[B]_[L]AT_SV (smaller one in case of reverse operation). Basically, AT executes different operation by stages while
step increases form 0 to 7 and the step of the current loop can be checked by _PID[B]_[L]AT_step. In PIDSTOP state, AT
step is 0 but once AT starts, it increases (automatically) from 0 up to 7, at which AT stops. Therefore, it may be subject to
malfunction if a user manipulates the steps.
To avoid duplicate, apply the setting after trying to execute up to (4) of the above 14.7.3.
Now, set _PID[B]_[L]AT_SV. Although _PID[B]_[L]SV value was already set in the above, PV vibrates the system during
AT so to be over _PID[B]_[L]SV, so it is necessary to set a SV value suitable for the case harmful to the system into
_PID[B]_[L]AT_SV. In other cases, make sure to set _PID[B]_[L]AT_SV like _PID[B]_[L]SV. _PID[B]_[L]AT_SV value is
used only during AT and once AT is complete, it automatically operates the system, based on _PID[B]_[L]SV.
Next, set _PID[B]_[L]MV_min and _PID[B]_[L]MV_max. In AT, _PID[B]_[L]MV_min and _PID[B]_[L]MV_max are
respectively regarded as the min./max. outputs of the system. During AT, both values change in 3 cycles, depending on
the system speed(how fast PV approaches SV). For instance, in case of _PID[B]_[L]MV_min = 0, _PID[B]_[L]MV_max =
10000, the system operation signal(MV) that is delivered to motor or heater repeats the output, 0  10000  0 three
times. As such, in case there is any possibility that a sudden change overburden the system, it is necessary to set
_PID[B]_[L]dMV.
Then, set _PID[B]_[L]HYS_val, which is used only during AT. As a deadband that occurs when PV approaches SV, it
occurs higher than the reference during ascent while it does lower than the reference during descent. That is, if SV is
5000 and _PID[B]_[L]HYS_val is 100, AT increases PV by maintaining MV as _PID[B]_[L]MV_max up to 5100 ( SV +
_PID[B]_[L]HYS_val ) and then, it maintains MV as _PID[B]_[L]MV_min up to 4900 ( SV - _PID[B]_[L]HYS_val ),
executing tuning while reducing PV.

The above graph is the water level waveform gained by setting _PID[B]_[L]HYS_val value (50 in the example) properly
and MV should have 3 square waveforms as seen in the figure.

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In the above graph, _PID[B]_[L]HYS_val is set too small (10 in the figure), so if no.3 square wave form on MV, which is
gained from the water level waveform, is not clear, accurate AT operation may not be secured. In addition, too large
_PID[B]_[L]HYS_val is inputted, the system may slow down disadvantageously.

14.7.5 Program example 2

The figure shows the program that PID constant and SV setting are changed in the program. If PIDPRMT contact
(%MX01) is on, user defined values like U_SV, U_Ts, U_Kp, U_Ti and U_Td are inputted as PID parameters and it is
also allowed to use monitor window as presented in 14.7.3.

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14.7.6 Cascade operation

The above ladder program is the view of cascade configuration, based on the following block diagram.

user
Cascade loop
SV_mst
MV_mst Master PV_mst
loop(0)
SV_slv
AD_mst
MV_slv Slave PV_slv thermon
loop(1) eter

DA AD_slv
heater

Heating
fuel valve flowmeter
furnance

The above block diagram is the system to measure the temperature of heating furnace, supply fuel to the heater and
maintain a desirable temperature.
Also, to control the signal delivered to fuel valve more actively, if installing a flowmeter and structuring a slave loop, it
supplies a uniform fuel on the operation of slave loop when master loop instructs a temporary value of fuel.

14-37
Chapter 14. Built-in PID Function

14-38
 Chapter 15. Troubleshooting

Chapter 15 Troubleshooting
The chapter describes types of potential errors that occur while operating the system, causes of errors, how to detect them and
corrective measures.

15.1 Basic Troubleshooting Procedure

To improve the reliability of a system, it is important to take a corrective measure promptly if a trouble occurs as well as to use highly
reliable devices. To operate a system immediately, it is the most important to quickly detect potential causes of a trouble and take
corrective measures. To troubleshoot the system correctly, make sure to take the following cautions and procedures.

(1) Check by visual inspection

Please check the followings visually.
• Operation status(Stop, Run)
• Power On/Off status
• I/O device status
• Wiring status(I/O wiring, expansion and communication cable)
• Check the status of each display(POWER LED, RUN/STOP LED, I/O LED and etc), connect to peripherals and check the
operation condition and program

(2) Check any abnormality

Please observe how a fault changes by executing the followings.
• Move the key switch to STOP and turn it On/Off

(3) Restricting Range

Estimate by which factor a fault occurs by the following methods.
• Is it from the PLC or external factor?
• I/O module or others?
• PLC program?

15-1
 Chapter 15. Troubleshooting

15.2 Troubleshooting

The above stated detection methods, description for error codes and measures are explained by phenomenon.

Trouble

If Power LED is Off

Measures taken when Power LED is Off

If WAR. LED is On
Measures taken when WAR/ LED is On

If Err. LED is On
Measures taken when Error LED is On

If Run/Stop LED is Off

Measures taken when Run/Stop LED is Off

If I/O module does not work

properly Measures taken when I/O module does not work properly

If writing a program is not

possible Measures taken when writing program is not possible

If Sync. cable is not properly

Measures taken when Sync. cable is not properly installed
installed

If master switching occurs

Measures taken when master switching occurs

If redundant operation does

not work when adding CPU Measures taken when redundant operation does not work when
adding CPU

If master switching fails

Measures taken when master switching fails

15-2
 Chapter 15. Troubleshooting

15.2.1 Action when POWER LED is off

The paragraph describes the orders of taking a measure if POWER LED is Off when turning it on or during operation.

POWER LED is Off

No Supply the power

Is the power being supplied?

Yes No Yes
Is the POWER LED On?

No Adjust the supplying power within the

Is the power voltage within the
allowable voltage range? range.

Yes No Yes
Is the POWER LED On?

Yes
Has a fuse burnt out?
Replace a fuse with new one.

No
Yes
Is the POWER LED On?
No

No
Is the power module fixed? Fix the power module firmly.

Yes
No Yes
Is the POWER LED On?

Yes
Is the overcurrent protection 1) Check the current capacity and
working properly? reduce any overcurrent.
2) Turn off input power and turn it on
again.
No

No Yes
Is the POWER LED On?

Prepare a troubleshooting questionnaire

and contact the dealer. End

15-3
 Chapter 15. Troubleshooting

15.2.2 Action when WAR. (Warning) LED is on.

The paragraph describes the orders of taking a measure if WAR.. LED is On when turning it on, starting operation or operating.

WAR. LED flickers

Check the error code message by accessing

to XG5000

Yes
Is it a warning Please refer to the flags in Appendix 1
(_CNF_WAR)? and remove the causes

No

Yes
WAR. LED still blink?

No

Prepare a troubleshooting questionnaire

and contact the dealer.
End

Caution
If warning error occurs, the PLC system does not stop but it is necessary to check the error message and take a
corrective measure. Or it may cause an error.

15-4
 Chapter 15. Troubleshooting

It describes measure when WAR LED is on because redundant system runs in single or configured b Line mode.
Connecti XG5000 and execitue [Monitor]-[System Monitor] and select [PLC]-[System Configuration] to check.

[Figure 15.2.1] System configuration menu

Base: 0 (Master) Base: 0 (standby)

Base: 31

[Figure 15.2.2] system configuration (in case of Ring configuration)

Base: 0 (Master) Base: 0 (standby)

Base: 31

[Figure 15.2.3] System configuration (in case of line configuration)

In case system is configured as ring, basic base and expansion base is displayed by ring like [Figure 14.2.2].In case system
is configured as line, disconnection between bases is displayed like [Figure 14.2.3]. This can be checked by LED. In case
system starts with line topology, RING LED turns off. In case it starts with ring topology and it changes the topology to line,

15-5
 Chapter 15. Troubleshooting

RING LED flickers

15-6
 Chapter 15. Troubleshooting

[Figure 15.2.4] CPU module LED

[Figure 15.2.5] Expansion drive LED

Caution
Since optical cable consists of two couples unlike electrical cable, TX and RX can be changed in case of installation.
Make sure that direction of TX and RX does not change. (TX should be connected with RX, and RX with TX.)

15-7
 Chapter 15. Troubleshooting

The paragraph describes the orders of taking a measure if RING LED is off or flickers when turning it on, starting operation or operating.

RING LED is Off

No Connect all cables

Are all cables connected?

Yes No Yes
Does RING LED flickers?

Yes Set A/B side switch of CPU differently

Is Error code E102 or S102 displayed?
And reset/restart

No No Yes
Does RING LED flickers?

Find where line is disconnected

Is it connected by electrical Yes Wire properly or replace the cable into new
cable?
one

No Yes
No Is the POWER LED On?

Are TX and RX connected Connect TX/RX to be crossed each

No
crossly? other

No Yes
No Is the POWER LED On?

Wire properly or replace the cable into

new one

Yes
Does RING LED flicker?

no

Prepare a troubleshooting questionnaire End

and contact the dealer.

15-8
 Chapter 15. Troubleshooting

15.2.3 Action when ERR. LED is on

The paragraph describes the orders of taking a measure if ERR. LED flickers when turning PLC on or starting operation

ERR. LED flickers

Check the error code message by accessing

to XG5000

Yes
CPU System error? Please refer to the flags in Appendix 1
(_CNF_ER)
and remove the causes

No

Yes
ERR. LED still blink?

No

Prepare a troubleshooting questionnaire

and contact the dealer.
End

Caution
If warning error occurs, the PLC system does not stop but it is necessary to check the error message and take a
corrective measure. Or it may cause an error.

15-9
 Chapter 15. Troubleshooting

15.2.4 Action when RUN/STOP LED is off

The paragraph describes the orders of taking a measure if RUN/STOP LED is Off when turning it on, starting operation or operating.

RUN/STOP LED is off

Power module off → on

No
Is still RUN/STOP LED off?

Yes

Contact the .dealer End

15-10
 Chapter 15. Troubleshooting

15.2.5 Acton when I/O module does not work properly

For the orders of taking measures when I/O module does not properly work during operation, the paragraph explains it with the
following illustration.

If I/O module does not work properly

SOL1 Output LED is On? No

Yes

Measure the terminal voltage of Correct the wiring. Replace the terminal strip Monitor the status of SCL1 by
SOL1 by tester connector. XG5000.

No No

No No
Is the measurement normal? Is the output wiring correct? Is the contact of terminal strip connector Yes Is it normal?
fine?

Yes
Yes
Yes
Continued
Separate the external wiring
and check the electricity
connection of module output.

Yes
No
Is it normal?

Check the status of output

device(SOL1). Replace an output module.

Continued
15-11
 Chapter 15. Troubleshooting

Is the LED of SWITCH1, 2 on? No

Ye

Check the voltage of Switch 1, 2 Measure the terminal voltage of

by a tester Switch 1,2 by a tester

Is the measurement normal? Is the measurement normal? Yes Is the tightness of

a terminal good?

No No
Yes No Yes

Yes Is the contact of terminal strip Yes

Is the input wiring correct?
connector correct?

Separate the external wiring No No

and check the input status by
forcible input.

Is wiring correct? Tighten the terminal Replace the terminal

Is the measurement normal? screw. strip connector.

No
Yes

Replace the input Check the status of input Check it from the first step Replace the input
module. devices(switch 1,2). module.

15-12
 Chapter 15. Troubleshooting

15.2.6 Action when writing program is not possible

It describes the orders of taking a measure when writing a program into the CPU Module is not possible.

Can not write a program

No Turn the RUN/STOP switch to

Is the RUN/STOP switch set to STOP STOP and execute Writing
(Remote Stop)? Program.

Yes

Is the Remote DIP

Yes Turn on Remote DIP switch and
switch of the CPU
Module On? execute Writing Program.

No

Release the PLC connection off,

Does the Stop LED blink? Yes read the error code displayed
when it connects and modify it
according to the message.
No

End

15-13
 Chapter 15. Troubleshooting

15.2.7 Action when Sync. cable is not installed properly

If there is a problem in Sync. Cable, redundant operation is not possible. It describes action when Sync. Cable is not installed properly.

Single RUN status

No Connect sync. cable and start standby

Is sync. cable connected? CPU

Yes
No Yes
Does RED LED FLICKER?

No Connect sync. Cable crossly and run

Is sync. cable connected crossly? standby CPU

Yes
No Yes
Does RED LED FLICKER?

Prepare a troubleshooting questionnaire

and contact the dealer.
End

15-14
 Chapter 15. Troubleshooting

15.2.8 When undesirable master switching occurs

In case switching occurs, it is displayed by MASTER LED at front part. If the revelent is acting as master, MASTER LED is on and if it is
acting as standby CPU, MASTER LED off. It swtiching the user does not want occurs, see the following steps.

Undesirable switching occurs

Yes Normal switching by master CPU stop

Is standby CPU stop mode?

No

Is switching command executed?

Yes Normal switching by switching
command

No

Is power supplied to Yes Normal switching by power failure of

master base’s power? master

No

Is there error on master CPU? Yes

Yes Normal switching by error of master

No

Is there disconnection on master Yes Normal switching by disconnection on

CPU’s expansion cable? master CPU’s expansion cable

No

Yes
Is master CPU detached? Normal switching by CPU detached

No
End
Prepare a troubleshooting questionnaire
and contact the dealer.

15-15
 Chapter 15. Troubleshooting

15.2.9 When newly added CPU does not join redundant operation
In case of adding new CPU to the previous system, it should act as standby CPU if normal.Before starting, check the Sync. Cable and
expansion cable. To join reduntdunt operation, version of new CPU should be same with previous CPU. If not, error occurs because of
version. Contact near dealer and get update of new OS.
If you have a problem when adding new CPU, see the following steps.

Failure to join redundant operation

No
Is power supplied to added base? Supply power to added base and restart

Yes

No Connect Sync. cable properly and

Is sync. cable connected properly?
restart

Yes

Is expansion cable of No
added CPU connected? Connect expansion cable and restart

Yes

Is there error on added CPU?

No
Cancel the error of added CPU and
Yes
restart

No

Prepare a troubleshooting questionnaire

and contact the dealer.

End

15-16
 Chapter 15. Troubleshooting

15.2.10 When failing to switch master

If system is not redunduncy status, switching may fail. Before switching, check the redundant ring configuration, RUN status of
master/standby CPU, connection status of Sync. Cable.
In case you try to switch but fail, see the following steps.

Switching failure

No
Is power supplied to standby base? Supply power and restart

Yes

No Change status of standby CPU to RUN

Is standby CPU RUN status?
and restart

Yes

Is Sync. cable connected properly? No

Connect Sync. cable and restart

Yes

Is expansion cable of standby No

Yes properly?
CPU connected Connect expansion cable and restart

Yes

Prepare a troubleshooting questionnaire

and contact the dealer.

End

15-17
 Chapter 15. Troubleshooting

15.2.11 When expansion cable is disconnected

In case two expansion cables are disconnected, cable disconnection error occurs or system except disconnected
expansion base operates normally.
- Cable disconnection error(E036) : In case fault mask is not set→

Cable disconnection error (E036)

Check what expansion base get error

via XG5000

Connect expansion cable

Reset system

Is it normal? No
Check PLC status via XG5000 and take action

Yes

No No In case of cable disconnection,

In case of cable disconnection, Will you make the system except
PLC goes to error mode? disconnected expansion base operate PLC goes to error mode
normally?
Yes Yes

XG5000→Online Fault→mask, set the relevant

base’s fault mask

End

15-18
 Chapter 15. Troubleshooting

(2) system except disconnected expansion base operates normally: in case fault mask is set

Extension cables are disconnected

(Ring topology configuration warning)

How to check
Check what extension base gets error 1. Through XG5000→ Monitor→System Monitor →
via XG5000 PLC→System Configuration
2. Through system flag“_BASE_DEER”

Connect extension cable

Connect XG5000

Online → Setting I/O skip

Enable “Base I/O Skip”

Disable “Base I/O Skip”

No Check the status via XG5000 and take

Normal? action

Yes

End

15-19
 Chapter 15. Troubleshooting

15.2.12 When expansion driver gets error

In case expansion driver is detached (or get error), cable disconnection error occurs or system except disconnected
expansion base operates normally.

(1) Expansion base detach error (E036) : In case fault mask is not set

Expansion base detach error

(Ring topology configuration warning)

How to check
Check what expansion base gets error 1. Through XG5000→Monitor→System monitoring→
via XG5000 PLC→System configuration
2. Through system flag _BASE_DEER

Connect expansion cable

Reset system

Is it normal? No
Check PLC status via XG5000 and take action

Yes

In case of expansion detach or No Will you make the system except No In case of cable disconnection,
error, PLC goes to error mode? disconnected expansion base operate PLC goes to error mode
normally?
Yes Yes

XG5000→ Online Fault→ mask, enable the

relevant base’s fault mask

End

15-20
 Chapter 15. Troubleshooting

(2) system except detached expansion base operates normally: in case of enabling fault mask

Extension base is detached or get error

(Ring topology configuration warning)

How to check
Check what extension base gets error 1. Through XG5000→ Monitor→System Monitor →
via XG5000 PLC→System Configuration
2. Through system flag“_BASE_DEER”

Attach or replace extension driver

module

Connect XG5000

Online → Setting I/O skip

Enable “Base I/O Skip”

Disable “Base I/O Skip”

No Check the status via XG5000 and take

Normal? action

Yes

End

15-21
 Chapter 15. Troubleshooting

15.3 Troubleshooting Questionnaires

If any trouble is found while using the XGI series, please fill out the form and call to fax it to us.
 For an error relating to special/communication modules, fill out the questionnaires attached in the user’s manual of the product.

1. Customer’s Contact Number: TEL)

FAX)
2. Model : ( )
3. Details of the Product
− Details of the CPU module : − OS version ( ), − Product’s serial number ( )
− XG5000 Version number used for program compiling : ( )
4. Brief description of a device and system :
5. Modules using the CPU module :
− Operation by key switch ( ), − Operation by XG5000 or Communication ( )
− Memory module operation ( )
6. STOP LED On of the CPU module? Yes( ), No( )
7. Error message generated from the XG5000 :
8. Measures taken against the error code in the above 7 :
9. Other troubleshooting measures against the error :
10. Features of the error
 Reiterative( ) : Periodic( ), Relating to a specific sequence level( )
Relating to the environment( )
 Intermittent( ) : Approx. interval of the error occurrence :
11. Detail description for the erroneous phenomena :
12. Configuration of the applied system :

15-22
 Chapter 15. Troubleshooting

15.4 Cases

It describes trouble types and measures for circuits.

15.4.1 Trouble types and measures of input circuit

The followings describe the examples and measures of troubles.

Phenomena Causes Measures

Leakage current of an external device  Connect a proper resistance or capacitor so that
Input signal can (if operating by proximate switch and others) the voltage between terminals of input module is
not be off below the return voltage.
AC input
C AC input
Leakage current
R
C
~ R
External device
~
Leakage current of an external device(operation by
Input signal can a limit switch with neon lamp)
 CR value is determined by the value of leakage
not be off(neon
AC input current.
lamp could be
C − Recommended value C : 0.1 ~ 0.47uF
still on) Leakage
R current R : 47 ~ 120 Ω (1/2W)
~ Or, separate a circuit completely and install another
External device
display circuit.
leakage current from the capacity between wires of  Install the power on an external device as
Input signal can wiring cable presented below.
not be off
AC Input
AC input
Leakage
current
~
~ External device
External device

Leakage current of an external device(operation by  Connect a proper resistance so that the voltage
Input signal can a switch with LED mark) between input module terminal and common
not be off terminal is higher than off voltage as presented
DC input below.
DC Input
Leakage
R current R
E1
External device

 Circulating current by using plural different power  Change plural to singular power
Input signal can sources  Connecting to a circulating current preventive
not be off DC Input diode(figure below)
DC Input
L
E E L
E
 If E1 > E2, it circulates.

15-23
 Chapter 15. Troubleshooting

15.4.2 Trouble types and measures of output circuit

The followings describe the examples and measures of troubles.

Phenomena Causes Measures

 If load contains half-wave rectification(solenoid valve  Connect a dozens ~ several hundreds kΩ resistor to a
Excessive may have it) load in parallel.
voltage is  If the polarity is ←, C is charged while the voltage +
allowed to power voltage charged to C is allowed to both ends of
load when diode(D). when the polarity is ↑. The max. voltage is
R
output approx. 2√2 .
contact is off D
←
C D C
~ ~
R load R Load
↑

Note) when using it as the above, the output element

does not have any problem but the performance of
diode(D) in load may be reduced, probably causing a
trouble.
 Leakage current from surge absorbing circuit  Connect a dozens of kΩ resistor or CR of which
Load can not connected to an output element in parallel impedance is equal to the resistance to load in parallel.
be off Output Note) If the length of wiring from output module to load is
Load long, it may have leakage current from capacity of
C
Leakage current ~ cables.
R C
R R

Load Load

 Leakage current from surge absorbing circuit  Operate the C-R type timer by mediating a relay.
Abnormal connected to an output element in parallel.  Use other one but a C−R type timer.
time when Note) A timer’s internal circuit may have half-wave
Output
load is a C-R Load
rectification T Timer
type timer C
~
R Leakage current Output X
~

15-24
 Chapter 15. Troubleshooting

 Circulating current resulting from two different power  Adjusting plural to singular power source.
Load can not source  Connecting to circulating current preventive diode(figure
be off(DC) Output below) Output

load
Load
E
E1 E
E2

Note) If load is relay and others, it needs connecting a

 It circulates if E1< E2. counter voltage absorbing diode as a dotted line in the
 It also circulates even when E1 is Off(E2 is On). figure.

Phenomena Causes Measures

Off response  Overcurrent at Off  Insert a magnetic connector and others of which time
from load takes If a large current load such as solenoid(time constant is small as presented in the figure and operate
a longer time. constant L/R is large) is directly operated by load by the contact
transistor output. Output
Output
Current at Off

Load
Load
E1

 Since current is allowed through diode when

transistor output is off, it may be delayed for 1
second and longer depending on load.
Output Inrush current of glow lamp  To restrict inrush current, it should allow dark current
transistor is that is 1/3 ~ 1/5 of the rated current of glow lamp.
destructed.
Output Output

E1 R E

Sink type transistor output

As soon as it lights up, it may have 10 times and Output

higher inrush current.
R

E
source type transistor output

15-25
 Chapter 15. Troubleshooting

15.5 Error Codes List

15.5.1 Error codes during CPU operation

Operation
Code Error causes Measures LED status Diagnostic timing
status
Turning it on
Abnormal base
13 Contact A/S service if it still exists after turning it on again STOP S013 Converting to RUN
information
mode
Operate after downloading program again (Cold)
If a program to execute is Replace a battery in case of abnormal battery (Cold) Converting to RUN
23 STOP E023
not normal After a program is reloaded, check the storage condition mode
and if any fault is found, replace the CPU module. (Cold)

Check I/O parameter and the installed module

Converting to RUN
24 Abnormal I/O parameter Set I/O parameter to be same with installed module and STOP E024
mode
download

Restart after basic parameter is reloaded

Abnormal basic Replace a battery in case of defective battery Converting to RUN
25 STOP E025
parameter After basic parameter is reloaded, check the storage mode
condition and if any fault is found, replace the CPU module.

Abnormal Redundancy Start after loading redundancy parameter again Turning it on,
28 STOP E028
parameter (Doesn’t check in case of downloading during Run) Loading program

Abnormal special Start after loading special parameter again Turning it on,
29 STOP E029
parameter (Doesn’t check in case of downloading during Run) Loading program

The module set in Check the wrong slot position by XG5000, modify a module Turning it on,
parameter and the or parameter and then, restart. STOP, Loading program
30 E030
actually installed module Reference flag: module type inconsistence error flag RUN Converting to RUN
do not coincide (_IO_TYER, _IO_TYER_N, _IO_TYERR[n]) mode
Check any detached/added slot position by XG5000,
Module detachment or
modify the installment and restart (according to parameter) STOP,
31 module addition during E031 scan ends
Reference flag: module detachment error flag RUN
operation
(_IO_DEER,_IO_DEER_N,_IO_DEERR[n])
Check the position of a slot of which fuse is burnt out by
Fuse of a module XG5000, replace a fuse and restart (according to
STOP,
32 holding a fuse is burnt parameter) E032 scan ends
RUN
out during operation Reference flag: fuse disconnection error flag
(_FUSE_ER,_FUSE_ER_N,_FUSE_ERR[n])

15-26
 Chapter 15. Troubleshooting

Operation
Code Error causes Measures(restart mode after the measure) LED status Diagnostic timing
status
turning it on,
Expansion base detach STOP,
36 Check the detachment of expansion base E036 Scan end,
error RUN Executing program

turning it on,
CPU abnormal end or
39 Contact A/S service if it still exists after turning it on again - E039 Scan end,
trouble
Executing program

The scan time of a

program exceeds the
scan delay watchdog Check the scan delay watchdog time designated by
40 STOP E040 Executing program
time designated by parameter, modify parameter or program and restart (cold)
parameter during
operation
Program execution
41 Download program again and restart STOP E041 turning it on,
code error
Duplicated base
43 Check the duplicated base number STOP E043 Executing program
number
Two power module are off STOP
45 Base power error E045 turning it on,
Check attachment of power module RUN
turning it on,
Module that can’t be installed has bee installed STOP Loading program
48 Module position error E048
For more detail, refer to error history RUN Switching to RUN
mode
Error of external device
Repair a fault device by referring to error detection flag of
is detected by a user STOP
50 external device and restart(according to parameter) E050 When scan ends
program during RUN
(_ANNUN_ER,_ANC_ERR[n])
operation

CPU is installed at wrong position

101 CPU position error STOP S101 turning it on,
Position CPU correctly

Duplicated CPU ID Set the A/B side switches of Master CPU and Standby
102 STOP S102 turning it on,
error CPU differently

Configure expansion cable as Ring Topology and

STOP,
103 Base abnormal error position detached base correctly. E103 Executing program
RUN
For information of detached base, refer to CPU error log

- Check redundancy configuration

System configuration  Check redundancy drive module station no. turning it on,
104 STOP E104
error  Check O/S version of extension drive module and Scan end

extension manager
Switching to
Redundancy system
During redundancy operating, synchronization error redundancy
300 synchronous operating STOP E300
occurs operation,
error
operating

15-27
 Chapter 15. Troubleshooting

Operation
Code Error causes Measures(restart mode after the measure) LED status Diagnostic timing
status

Restart as redundancy operation

 set operation mode of standby CPU as STOP

Standby CPU failed to  Cancel the error of master CPU and restart
operate as redundancy  Change standby CPU into RUN Starting standby
301 STOP E301
because of error of Restart standby CPU as single operation operation
Master CPU
 Disable master CPU (STOP mode or power cut)
 restart standby CPU through reset switch or
changing operation mode from STOP to RUN
RTC data error If there is no error in battery, reset RTC data via turning it on,
501 RUN E501
XG5000 scan end

turning it on,
502 Low battery voltage Replace battery while power in on RUN E502
scan end

Check the power of expansion base

bxx Expansion base error RUN Ebxx Operating
Check the expansion cable

Note

(1) Error No. 2 through 13 from “Error Codes during CPU Operation” can be checked in our A/S Service Center.
(2) The other errors of which number is 22 and lower can be checked by using the error log of XG5000.

15-28
 Appendix 1. Flag List

Appendix 1 Flag list

Appendix 1.1 User Flag

1. User flag
Address Flag name Type Writable Contents Description
Clock signal used in user program reverses On/Off per a half
%FX6144 _T20MS BOOL - 20ms cycle clock
cycle
Please use more enough long clock signal than
%FX6145 _T100MS BOOL - 100ms cycle clock
PLC scan time.
Clock signal starts from Off condition when initialization program
%FX6146 _T200MS BOOL - 200ms cycle clock starts or scan program starts.

%FX6147 _T1S BOOL - 1s cycle clock _T100ms clock example

50ms 50ms
%FX6148 _T2S BOOL - 2s cycle clock

%FX6149 _T10S BOOL - 10s cycle clock

%FX6150 _T20S BOOL - 20s cycle clock

%FX6151 _T60S BOOL - 60s cycle clock

%FX6153 _ON BOOL - Ordinary time On Always On state flag, used when writing user program.

%FX6154 _OFF BOOL - Ordinary time Off Always Off state flag, used when writing user program.

%FX6155 _1ON BOOL - 1’st scan On Only 1’st scan On after operation start

%FX6156 _1OFF BOOL - 1’st scan Off Only 1’st scan Off after operation start

Reversal every scan On/Off reversed flag per every scan when user program is
%FX6157 _STOG BOOL - (scan toggle) working. (On state for first scan)

%FX6163 _ALL_OFF BOOL - All output Off On in case all outputs are off

%FX30720 _RTC_WR BOOL Available Writing data to RTC Write data to RTC and Read

Initialize scan value

%FX30721 _SCAN_WR BOOL Available Initialize scan value

Request for detecting heavy

%FX30722 _CHK_ANC_ERR BOOL Available Flag that requests detecting heavy fault of external
fault of external device

Request for detecting light fault

%FX30723 _CHK_ANC_WAR BOOL Available Flag that requests detecting light fault (warning) of external
of external device

%FX30724 _MASTER_CHG BOOL Available Master/Standby switching Flag used when switching master/standby

ARRAY[0..7] Flag for user to set time

%FW3860 _RTC_TIME_USER Available Time to set (year, month, hour, minute, second, day, century available)
OF BYTE

A1-1
 Appendix 1. Flag List

Appendix 1.2 System Error Representative Flag

1. Master CPU system error representative flag

Address Flag name Type Bit position Contents Description
DWOR Represent System error (heavy
%FD65 _CNF_ER Handles error flags about non-operation fault error as below.
D ative flag fault error)
Representative flag displayed when I/O
configuration parameter for each slot is not matched with
Error when Module type
BOOL BIT 1 practical module configuration or a specific module is applied
%FX2081 _IO_TYER mismatched in the wrong location.
(Refer to “_IO_TYER_N, _IO_TYER[n]” )
Representative flag displayed when the module configuration
Module detachment
BOOL BIT 2 for each slot is changed while running.
%FX2082 _IO_DEER error (Refer to “_IO_DEER_N, _IO_DEER[n]” )
Representative flag displayed when the fuse of module is cut
BOOL BIT 3 Fuse cutoff error off.
%FX2083 _FUSE_ER
(Refer to “_FUSE_ER_N, _FUSE_ER[n]” )

Heavy fault detection Representative flag displayed when heavy fault error detected
%FX2086 _ANNUM_ER BOOL BIT 6
error in external device by user program is recorded in “_ANC_ERR[n]”.

%FX2088 _BPRM_ER BOOL BIT 8 Basic parameter error Basic parameter doesn’t match CPU type.

%FX2089 _IOPRM_ER BOOL BIT 9 I/O parameter error It is abnormal to the I/O configuration parameter.
Special module
BOOL BIT 10 It is abnormal to the special module parameter.
%FX2090 _SPPRM_ER parameter error
Communication module
%FX2091 _CPPRM_ER BOOL BIT 11 It is abnormal to the communication module parameter.
parameter error

%FX2092 _PGM_ER BOOL BIT 12 Program error Indicates that there is problem with user-made program.
Indicates that while user program is running, the program code
BOOL BIT 13 Program code error
%FX2093 _CODE_ER can’t be interpreted.
Displayed when the saved program gets damages by an
%FX2094 _SWDT_ER BOOL BIT 14 CPU abnormal ends.
abnormal end of CPU or program cannot work.

_BASE_POWE
%FX2095 BOOL BIT 15 Abnormal base power Base power off or power module error
R_ER
Indicates that the program scan time exceeds the scan
%FX2096 _WDT_ER BOOL BIT 16 Scan watchdog error
watchdog time specified by a parameter.

_BASE_INFO_E
%FX2097 BOOL BIT 17 Base information error Base information is abnormal
R
Extension base
%FX2102 _BASE_DEER BOOL BIT 22 Extension base is detatched
detachment error

_DUPL_PRM_E Redundant parameter

%FX2103 BOOL BIT 23 Abnormal Redundant parameter
error
R

Module attachment The module which can’t be inserted into main base is inserted

%FX2104 _INSTALL_ER BOOL BIT 24 position error in to main base or The module which can’t be inserted into

extension base is inserted in to extension base

A1-2
 Appendix 1. Flag List

Address Flag name Type Bit position Contents Description

Overlapped extension
%FX2105 _BASE_ID_ER BOOL BIT 25 extension base number is overlapped
base number

_DUPL_SYNC_ Redundant operation Synchronization between master and standby CPU is

%FX2106 BOOL BIT 26
Sync. error
ER abnormal

_AB_SIDEKEY_ A/B SIDE key overlap A,B side key of master, standby CPU are overlapped. They
%FX2107 BOOL BIT 27
error
ER should be different.

Configure extension cable as Ring Topology and position

Base abnormal
%FX2110 _BASE_AB_ER BOOL BIT 30 detached base correctly.
configuration
For information of detached base, refer to CPU error log

Abnormal system configuration

Ex)
System configuration - Master/Standby One ring or line configuration
%FX2111 _SYS_CON_ER BOOL BIT 31
error
- Duplicated station number of extension base or

Station number more than specification

- Different station number in same base

A1-3
 Appendix 1. Flag List

2. Standby CPU System error representative flag

Address Flag name Type Bit position Contents Description

DWOR Represent System error (heavy

%FD129 _SB_CNF_ER Handles error flags about non-operation fault error as below.
ative flag fault error)
D
Attached module is different with I/O parameter or some
Module type mismatch module which can’t be inserted into some slot is inserted some
%FX4129 _SB_IO_TYER BOOL BIT 1
error slot. Representative flag that detects them and displays
(refer to _SB_IO_TYER_N, _SB_IO_TYERR)
Representative flag displayed when the module configuration
Module detachment
BOOL BIT 2 for each slot is changed while running.
%FX4130 _SB_IO_DEER error (refer to _SB_IO_DEER_N,_SB_IO_DEERR]

Representative flag displayed when the fuse of module is cut

%FX4131 _SB_FUSE_ER BOOL BIT 3 Fuse cutoff error
off.

Heavy fault detection Representative flag displayed when heavy fault error detected
%FX4134 _SB_ANNUM_ER BOOL BIT 6
error in external device by user program is recorded in “_ANC_ERR[n]”.

%FX4136 _SB_BPRM_ER BOOL BIT 8 Basic parameter error Basic parameter doesn’t match CPU type.

%FX4137 _SB_IOPRM_ER BOOL BIT 9 I/O parameter error It is abnormal to the I/O configuration parameter
Special module
BOOL BIT 10 It is abnormal to the special module parameter.
%FX4138 _SB_SPPRM_ER parameter error
Communication
BOOL BIT 11 It is abnormal to the communication module parameter.
%FX4139 _SB_CPPRM_ER module parameter error
Indicates that while user program is running, the program code
BOOL BIT 13 Program code error
%FX4141 _SB_CODE_ER can’t be interpreted.
Displayed when the saved program gets damages by an
%FX4142 _SB_SWDT_ER BOOL BIT 14 CPU abnormal ends.
abnormal end of CPU or program cannot work.

_SB_BASE_POW
%FX4143 BOOL BIT 15 Abnormal base power Base power off or power module error
ER_ER
Indicates that the program scan time exceeds the scan
%FX4144 _SB_WDT_ER BOOL BIT 16 Scan watchdog error
watchdog time specified by a parameter.

_SB_BASE_INFO
%FX4145 BOOL BIT 17 Base information error Base information is abnormal
_ER

_SB_BASE_DEE Extension base

%FX4150 BOOL BIT 22 Extension base is detached.
detachment error
R

_SB_DUPL_PRM Abnormal redundant

%FX4151 BOOL BIT 23 Redundant parameter is Abnormal
parameter
_ER

The module which can’t be inserted into main base is inserted

Module attachment
_SB_INSTALL_E in to main base or The module which can’t be inserted into
%FX4152 BOOL BIT 24 position error
R extension base is inserted in to extension base

%FX4153 _SB_BASE_ID_E BOOL BIT 25 Overlapped extension extension base number is overlapped

A1-4
 Appendix 1. Flag List

Address Flag name Type Bit position Contents Description

base number
R

_SB_DUPL_SYN Redundant operation Synchronization between master and standby CPU is

%FX4154 BOOL BIT 26
Sync. error
C_ER abnormal

_SB_CPU_RUN_ Standby CPU fails to join redundant operation when MASTER

%FX4156 BOOL BIT 28 Standby CPU run error
CPU is error
ER

Configure extension cable as Ring Topology and position

_SB_BASE_AB_E Base abnormal
%FX4158 BOOL BIT 30 detached base correctly.
configuration
R
For information of detached base, refer to CPU error log

A1-5
 Appendix 1. Flag List

Appendix 1.3 System Error Detail Flag

1. Master CPU system error detail flag
Address Flag name Type Writable Contents Description

ARRAY[0..31] Indicates slot and base where module mismatch error

%FW424 _IO_TYERR - Module type mismatch error occurs
OF WORD

ARRAY[0..31] Indicates slot and base where module detachment error

%FW456 _IO_DEERR - Module detachment error occurs
OF WORD
ARRAY[0..31]
%FW488 _FUSE_ERR - Fuse cutoff error Indicates slot and base where fuse cutoff error occurs
OF WORD

Extension base detachment

%FD83 _BASE_DEERR DWORD - Indicates base where extension base is detached
error

_BASE_POWER Information of base where

%FD574 DWORD - Indicates base where power module error occurs
_FAIL power module error occurs

Module type mismatch slot Indicates slot number where module type mismatch error
%FW416 _IO_TYER_N WORD - occurs. When two or more occurs, first slot is indicated
number

Module detachment slot Indicates slot number where module detachment error
%FW417 _IO_DEER_N WORD - occurs. When two or more occurs, first slot is indicated
number
Indicates slot number Fuse cutoff error occurs. When two
%FW418 _FUSE_ER_N WORD - Fuse cutoff slot number or more occurs, first slot is indicated
Classifies the type of user defined error and writes value
except 0. If detection of heavy fault is requested, it
Heavy fault information of
%FW1922 _ANC_ERR WORD Available develops an external heavy fault detection error. By
external device monitoring this flag, the user can know a reason of heavy
fault.

Status of Ignoring IO
%FX10849 _IO_ER_PMT BOOL - On when set to ignore IO module error
module error

Status of Ignoring

%FX10851 _CP_ER_PMT BOOL - communication module On when set to ignore communication module error

error

Status of Ignoring special

%FX10850 _SP_ER_PMT BOOL - On when set to ignore special module error
module error

%FX10848 _FUSE_ER_PMT BOOL - Status of Ignoring fuse error On when set to ignore fuse module error

A1-6
 Appendix 1. Flag List

2. Standby CPU system error detail flag

Address Flag name Type Writable Contents Description

Extension base detachment Indicates base where extension base is

%FD147 _SB_BASE_DEERR DWORD -
detached
error
Indicates slot and base where module
%FW588 _SB_IO_TYERR WORD - Module type mismatch error mismatch error occurs
Indicates slot and base where module
%FW589 _SB_IO_DEERR WORD - Module detachment error detachment error occurs

A1-7
 Appendix 1. Flag List

Appendix 1.4 System Warning Representative Flag

1. MASTER CPU System warning representative flag

Address Flag name Type Bit position Contents Description
Representative Representative flag displayed the system
%FD66 _CNF_WAR DWORD System warning
flag warning state

%FX2112 _RTC_ER BOOL BIT 0 RTC error Indicates that RTC data is abnormal

Warns there is base which doesn’t join

%FX2114 _BASE_EXIST_WAR BOOL BIT 2 Not joined base
operation

%FX2115 _AB_SD_ER BOOL BIT 3 Stop by operation error Stopped by abnormal operation

%FX2116 _TASK_ER BOOL BIT 4 Task collision It is collided to the task

%FX2117 _BAT_ER BOOL BIT 5 Battery error It is to the error in the battery state
Indicates that the light fault in the external
%FX2118 _ANNUM_WAR BOOL BIT 6 External device fault
device is detected.
BOOL BIT 8 High speed link Abnormal HS parameter
%FX2120 _HS_WAR
Redundant It is not single CPU RUN mode and
%FX2121 _REDUN_WAR BOOL BIT 9
configuration warning redundant configuration is not configured
OS versions between CPUs, extension
%FX2122 _OS_VER_WAR BOOL BIT 10 O/S version mismatch managers, extension drive modules are
different
Ring topology Configure an extension cable as the Ring
%FX2123 _RING_WAR BOOL BIT 11
configuration warning topology

BOOL BIT 20 P2P parameter Abnormal P2P parameter

%FX2132 _P2P_WAR
Extension redundancy system configuration
System configuration warning
%FX2138 _SYS_CON_WAR BOOL BIT 26
warning -Master/standby ring changes into line
-Master normal but standby error

%FX2140 _CONSTANT_ER BOOL BIT 28 Fixed cycle error Fixed cycle error

Power module error

%FX2141 _BASE_POWER_WAR BOOL BIT 29 One or two power module is error
warning

Base skip cancelation In case of canceling the base skip, base is

%FX2142 _BASE_SKIP_WAR BOOL BIT 30
warning different with IO parameter

Base number setting Base number of extension drive module is

%FX2143 _BASE_NUM_OVER_WAR BOOL BIT 31
error not 1~31

A1-8
 Appendix 1. Flag List

2. Standby CPU System warning representative flag

Address Flag name Type Bit position Contents Description
Represent Representative flag displayed the system
%FD130 _SB_CNF_WAR DWORD System warning
ative flag warning state

%FX4160 _SB_RTC_ER BOOL BIT 0 RTC error Indicates that RTC data is abnormal

_SB_BASE_EXIST_
%FX4162 BOOL BIT 2 Not joined base Warns there is base which doesn’t join operation
WAR

%FX4163 _SB_AB_SD_ER BOOL BIT 3 Stop by operation error Stopped by abnormal operation

%FX4164 _SB_TASK_ER BOOL BIT 4 Task collision It is collided to the task

%FX4165 _SB_BAT_ER BOOL BIT 5 Battery error It is to the error in the battery state
Indicates that the light fault in the external device is
%FX4166 _SB_ANNUM_WAR BOOL BIT 6 External device fault
detected.
BOOL BIT 8 High speed link Abnormal HS parameter
%FX4168 _SB_HS_WAR
OS versions between CPUs, extension managers,
%FX4170 _SB_OS_VER_WAR BOOL BIT 10 O/S version mismatch
extension drive modules are different
Ring topology
%FX4171 _SB_RING_WAR BOOL BIT 11 Configure an extension cable as the Ring topology
configuration warning

BOOL BIT 20 P2P parameter Abnormal P2P parameter

%FX4180 _SB_P2P_WAR

_SB_CONSTANT_E
BOOL BIT 28 Fixed cycle error Fixed cycle error
%FX4188 R

_SB_BASE_POWER Power module error

%FX4189 BOOL BIT 29 One or two power module is error
warning
_WAR

_SB_BASE_SKIP_W Base skip cancelation In case of canceling the base skip, base is different
%FX4190 BOOL BIT 30
warning with IO parameter
AR

_SB_BASE_NUM_O
%FX4191 BOOL BIT 31 Base number setting error Base number of extension drive module is not 1~31
VER_WAR

A1-9
 Appendix 1. Flag List

Appendix 1.5 System Warning Detail Flag

1. Master CPU system warning detail flag
Writab
Address Flag name Type Contents Description
le
ARRAY[0..11] OF Relevant flag is on in case Hs parameter is
%FX2624 _HS_WARN - Abnormal HS parameter abnormal
BOOL
Relevant flag is on in case P2P parameter is
%FX2640 _P2P_WARN - Abnormal P2P parameter abnormal P2P
ARRAY[0..7] OF BOOL

_BASE_ACPF_W Instantaneous power cutoff Indicates base where Instantaneous power

%FD587 DWORD - cutoff occurs
AR occurrence warning information

%FW164 _HS_WAR_W WORD - Abnormal HS parameter Indicates abnormal HS link number by bit

%FW165 _P2P_WAR_W - Abnormal P2P parameter Indicates abnormal P2P link number by bit
WORD
Classifies the type of user defined error and
writes value except 0. If detection of heavy
Light fault information external
%FW1923 _ANC_WAR WORD - fault is requested, it develops an external light
device fault detection error. By monitoring this flag,
the user can know a reason of light fault.
Indicates abnormal redundancy power
module
Ex) error in left power module on expansion
base 1(12slot) – %FW601(_BASE_INFO[1])
%FW600~ _BASE_INFO[0]~ 16#010C: 01  left power module
WORD - Abnormal base power module 0C  12-slot expansion base
%FW631 _BASE_INFO[31]
Ex) error in right power module on expansion
base 2(6slot) – %FW602(_BASE_INFO[2])
16#0206: 02  right power module
06  6-slot expansion base

2. Standby CPU system warning detail flag

Address Flag name Type Writable Contents Description

_SB_HS_WA ARRAY[0..11] OF Relevant flag is on in case Hs parameter is

%FX4672 - Abnormal HS parameter abnormal
RN BOOL

_SB_P2P_WA Relevant flag is on in case P2P parameter is

%FX4688 ARRAY[0..7] OF BOOL - Abnormal P2P parameter abnormal P2P
RN

_SB_HS_WA
%FW292 WORD - Abnormal HS parameter Indicates abnormal HS link number by bit
R_W

_SB_P2P_WA
%FW293 WORD - Abnormal P2P parameter Indicates abnormal P2P link number by bit
R_W

A1-10
 Appendix 1. Flag List

Appendix 1.6 System Operation Status Information Flag

1. Master CPU system operation status information flag
Address Flag name Type Bit position Contents Description
Representat PLC Mode and operation
%FD64 _SYS_STATE DWORD Indicates PLC mode and operation state of system.
ive flag state

%FX2048 _RUN BOOL BIT 0 RUN

%FX2049 _STOP BOOL BIT 1 STOP

Indicates CPU’s operation status
%FX2050 _ERROR BOOL BIT 2 ERROR

%FX2051 _DEBUG BOOL BIT 3 DEBUG

Indicates operation mode changeable state only by the
%FX2052 _LOCAL_CON BOOL BIT 4 Local control
Mode key and XG5000.

%FX2054 _REMOTE_CON BOOL BIT 6 Remote Mode On It is Remote control mode

_RUN_EDIT_DON Editing during Run

%FX2058 BOOL BIT 10 Indicates completion of editing during Run
completed
E
Editing during Run
%FX2059 _RUN_EDIT_NG BOOL BIT 11 Edit is ended abnormally during Run
abnormally completed
Operation mode change
%FX2060 _CMOD_KEY BOOL BIT 12 by key Indicates Operation mode change by key
Operation mode change
%FX2061 _CMOD_LPADT BOOL BIT 13 by local PADT Indicates operation mode change by local PADT
Operation mode change
%FX2062 _CMOD_RPADT BOOL BIT 14 by remote PADT Indicates operation mode change by remote PADT
Operation mode change
Indicates operation mode change by remote
%FX2063 _CMOD_RLINK BOOL BIT 15 by remote communication
module communication module

%FX2064 _FORCE_IN BOOL BIT 16 Forced Input Forced On/Off state about input contact

%FX2065 _FORCE_OUT BOOL BIT 17 Forced Output Forced On/Off state about output contact

%FX2066 _SKIP_ON BOOL BIT 18 Input/Output Skip I/O Skip on execution

%FX2067 _EMASK_ON BOOL BIT 19 Fault mask Fault mask on execution

Stopped by STOP Stopped after scan completion by ‘STOP’ function while
%FX2069 _USTOP_ON BOOL BIT 21 function RUN mode operation.
Stopped by ESTOP Instantly stopped by ‘ESTOP’ function while
%FX2070 _ESTOP_ON BOOL BIT 22 function RUN mode operation.

ARRAY[0..31] O/S version of extension

%FW192 _SL_OS_VER - Indicates O/S version of extension drive module
drive module
OF WORD

ARRAY[0..31]
%FW600 _BASE_INFO - Base information Indicates how many base is installed
OF WORD

ARRAY[0..7]
%FB12 _RTC_TIME - Current clock Indicates current clock
OF BYTE
Initialization task on
%FX2072 _INIT_RUN BOOL - User defined Initialization program on execution.
execution

%FX2074 _AB_SIDE BOOL - CPU position CPU position (A-SIDE: ON, B-SIDE: OFF)

A1-11
 Appendix 1. Flag List

Address Flag name Type Bit position Contents Description

%FX2076 _PB1 BOOL - Program Code 1 Program code 1 is selected

%FX2077 _PB2 BOOL - Program Code 2 Program code 1 is selected

If this flag is set by user’s initial program, it is started to
Initialization task execution
%FX30736 _INIT_DONE BOOL writable execution of scan program after initial program
completion
completion.

%FW584 _RTC_DATE DATE - RTC’s current date Indicates RTC’s current date

%FD67 _OS_VER DWORD - O/S version Indicates CPU O/S version

%FD68 _OS_DATE DWORD - O/S data Indicates CPU O/S data

Extension manager O/S
%FD69 _CP_OS_VER DWORD - Indicates extension manager O/S version
version

%FD573 _OS_TYPE DWORD - For PLC classification Whether it is provided to other division

%FW1081 _FALS_NUM INT - FALS number Indicates FALS number

TIME_OF_DA
%FD293 _RTC_TOD - RTC’s current clock Indicates RTC’s current clock RTC. (ms unit)
Y
The no. of editing during
%FD582 _RUN_EDIT_CNT UDINT - Indicates the no. of editing during Run
Run
The no. of instantaneous
%FW140 _AC_F_CNT UINT - Indicates the no. of instantaneous power cutoff
power cutoff

_POWER_OFF_C
%FW158 UINT - The no. of power cutoff Indicates the no. of power cutoff
NT

%FW386 _SCAN_MAX UINT writable Max. scan time Indicates max. scan time after(unit: 0.1ms)

%FW387 _SCAN_MIN UINT writable Min. scan time Indicates min. scan time after Run

%FW388 _SCAN_CUR UINT writable Current scan time Indicates current scan time (unit 0.1ms)

%FW585 _RTC_WEEK UINT - RTC’s current day Indicates RTC’s current day

%FW141 _CPU_TYPE WORD - CPU ID (XGR - 0xA801) Indicates CPU type

%FW633 _RBANK_NUM WORD - Currently used block no. Indicates currently used block no.

_BASE_SKIP_INF
%FD125 DWORD - Base skip information Indicates base skip information
O

_BASE_EMASK_I Base fault mask

%FD124 DWORD - Indicates base fault mask information
NFO information

_SLOT_EMASK_I ARRAY[0..31]
%FW1372 - Slot fault mask information Indicates slot fault mask information
NFO OF WORD

_SLOT_SKIP_INF ARRAY[0..31]
%FW1404 - Slot skip information Indicates slot skip information
O OF WORD
_CYCLE_TASK_SC ARRAY[0..31,
%FW1752 - Fixed cycle task scan time Indicates max./min./current scan time of fixed cycle task
AN_TIME 0..2] OF WORD

_HS_ENABLE_STAT ARRAY[0..11]
%FX19040 - - HS link enable/disable current state
E OF BOOL

A1-12
 Appendix 1. Flag List

Address Flag name Type Bit position Contents Description

ARRAY[0..11]
%FX31520 _HS_REQ - - HS link enable/disable request
OF BOOL
ARRAY[0..11]
%FX31536 _HS_REQ_NUM - - HS link enable/disable setting
OF BOOL
_P2P_ENABLE_STA ARRAY[0..7] OF
%FX19072 - - P2P enable/disable current state
TE BOOL
ARRAY[0..7] OF
%FX31552 _P2P_REQ - - P2P enable/disable request
BOOL
ARRAY[0..7] OF
%FX31568 _P2P_REQ_NUM - - P2P enable/disable setting
BOOL

%FW1436 _SOE_LOG_CNT WORD - - No. of SOE event

_SOE_LOG_ROTAT
%FW1437 WORD - - SOE event rotation information
E
_SOE_READ_LOG_
%FW1456 WORD - - No. of SOE event read by user
CNT
_SOE_READ_LOG_
%FW1457 WORD - - Rotation information of SOE event read by user
ROTATE

%FX2111 _SYS_CON_ER BOOL - - System configuration error

%FX2138 _SYS_CON_WAR BOOL - - System configuration warning

%FX2137 _REF_WAR BOOL - - PLC CPU refresh error warning

%FX30729 _REF_WAR_CLR BOOL - - PLC CPU refresh error warning clear

%FD197 _REF_NG_CNT DWORD - - PLC CPU refresh NG counter

%FD196 _REF_OK_CNT DWORD - - PLC CPU refresh OK counter

Indicates the bit map type.

_REFRESH_NG_BA ex) Extension Base No. 2 : 16#00000004
%FD753 DWORD - REFRESH NG BASE
SE (This occurs when there are no three consecutive
responses to the extension base.)

A1-13
 Appendix 1. Flag List

2. Standby CPU system operation status information flag

Address Flag name Type Bit position Contents Description
Represent
DWOR
%FD128 _SB_SYS_STATE ative flag System information Handles system information
D

%FX4096 _SB_RUN BOOL BIT 0 RUN

%FX4097 _SB_STOP BOOL BIT 1 STOP Indicates CPU’s operation status

%FX4098 _SB_ERROR BOOL BIT 2 ERROR

%FX4100 _SB_LOCAL_CON BOOL BIT 4 Local control Local control mode

_SB_REMOTE_CO
%FX4102 BOOL BIT 6 Remote mode On Remote control mode
N

_SB_RUN_EDIT_D Editing during Run

%FX4106 BOOL BIT 10 Indicates completion of editing during Run
completed
ONE

_SB_RUN_EDIT_N Editing during Run

%FX4107 BOOL BIT 11 Edit is ended abnormally during Run
abnormally completed
G
Operation mode change by
%FX4108 _SB_CMOD_KEY BOOL BIT 12 key Indicates Operation mode change by key

_SB_CMOD_LPAD Operation mode change by

%FX4109 BOOL BIT 13 local PADT Indicates operation mode change by local PADT
T

_SB_CMOD_RPAD Operation mode change by

%FX4110 BOOL BIT 14 remote PADT Indicates operation mode change by remote PADT
T
Operation mode change by
Indicates operation mode change by remote
%FX4111 _SB_CMOD_RLINK BOOL BIT 15 remote communication
module communication module

%FX4112 _SB_FORCE_IN BOOL BIT 16 Forced Input Forced On/Off state about input contact

%FX4113 _SB_FORCE_OUT BOOL BIT 17 Forced Output Forced On/Off state about output contact

%FX4114 _SB_SKIP_ON BOOL BIT 18 Input/Output Skip I/O Skip on execution

%FX4115 _SB_EMASK_ON BOOL BIT 19 Fault mask Fault mask on execution

Stopped after scan completion by ‘STOP’ function while
%FX4117 _SB_USTOP_ON BOOL - Stopped by STOP function
RUN mode operation.
Instantly stopped by ‘ESTOP’ function while
%FX4118 _SB_ESTOP_ON BOOL - Stopped by ESTOP function
RUN mode operation.

DWOR
%FD131 _SB_OS_VER - O/S version Indicates CPU O/S version
D

DWOR
%FD132 _SB_OS_DATE - O/S data Indicates CPU O/S data
D

DWOR O/S version of extension

%FD133 _SB_CP_OS_VER - Indicates O/S version of extension drive module
drive module
D

%FW286 _SB_POWER_OFF UINT - The no. of power cutoff Indicates the no. of power cutoff

A1-14
 Appendix 1. Flag List

Address Flag name Type Bit position Contents Description

_CNT

%FW269 _SB_CPU_TYPE WORD - CPU ID (XGR - 0xA801) Indicates CPU type

%FW632 _SB_BASE_INFO WORD - Base information Indicates how many base is installed.

A1-15
 Appendix 1. Flag List

Appendix 1.7 Redundant Operation Mode Information Flag

1. Redundant operation mode information
Address Flag name Type Bit position Contents Description
Represent Redundant operation Representative flag that indicates Redundant operation
DWOR
%FD0 _REDUN_STATE ative flag information
information
D

%FX0 _DUAL_RUN BOOL BIT 0 Redundant operation Now Redundant operation CPU A, CPU B are normal

_RING_TOPOLO
%FX1 BOOL BIT 1 Ring topology status Extension base is configure as ring
GY

_LINE_TOPOLO
%FX2 BOOL BIT 2 Line topology status Extension base is configure as line
GY

_SINGLE_RUN_
%FX4 BOOL BIT 4 A-SIDE single Run mode Indicates A-SIDE single Run mode
A

_SINGLE_RUN_
%FX5 BOOL BIT 5 B-SIDE single Run mode Indicates B-SIDE single Run mode
B

_MASTER_RUN_ A-SIDE is master Run mode

%FX6 BOOL BIT 6 Indicates A-SIDE is master Run mode
A (Incase standby CPU exists)

_MASTER_RUN_ B-SIDE is master Run mode

%FX7 BOOL BIT 7 Indicates B-SIDE is master Run mode
B (Incase standby CPU exists)
%FX2016 _EXT_REDUN BOOL - - Extension redundancy system

%FX2017 _SB_EXT_REDUN BOOL - - Standby: extension redundancy system

ARRAY[
%FW1458 _SL_OS_VER_B 0..31] OF - - Extension drive module OS version (B-side)
WORD
_SB_RING_TOPOL
%FX4080 BOOL - - Standby: ring topology state
OGY
_SB_LINE_TOPOL
%FX4081 BOOL - - Standby: line topology state
OGY

A1-16
 Appendix 1. Flag List

Appendix1.8 Operation Result Information Flag

1. Operation Result Information Flag
Address Flag name Type Writable Contents Description

Index range excess error in

%FX672 _ARY_IDX_ERR BOOL Writable In case of using array, index is out of setting value’s range
case of using array
Error occurred when index is out of setting value’s range, in
Index range excess error
%FX704 _ARY_IDX_LER BOOL Writable case of using array, is kept and the user erases this by
latch in case of using array program
As an operation error flag by unit of operation function (FN)
%FX6160 _ERR BOOL Writable Operation error flag or function block (FB), it is renewed every operation
Operation error latch flag by program block (PB) unit.
%FX6165 _LER BOOL Writable Operation error latch flag Error is kept until relevant program ends and the user erases
this by program

A1-17
 Appendix 1. Flag List

Appendix 1.9 Operation mode Key Status Flag

1. Operation mode key status flag
Address Flag name Type Writable Contents Description
Remote key status CPU key position status information- (remote: off, not
%FX291 _REMOTE_KEY BOOL - information remote: On)

%FX294 _STOP_KEY BOOL - Stop key status information CPU key position status information- (Stop: off, not stop: On)

%FX295 _RUN_KEY BOOL - Run key status information CPU key position status information- (Run: off, not Run: On)

A1-18
 Appendix 1. Flag List

Appendix 1.10 Link Flag (L) List

It describes data link (L) flag

[Table 1.10.1] Communication Flag List according to High speed link no. (High speed link no. 1 ~ 12)
Item Keyword Type Content Description
Indicates normal operation of all station according to parameter set in High
High speed link speed link, and On under the condition as below.
parameter “n” 1. In case that all station set in parameter is RUN mode and no error,
_HSn_RLINK Bit
normal operation 2. All data block set in parameter is communicated normally, and
of all station
3. The parameter set in each station itself is communicated normally.
Once RUN_LINK is On, it keeps On unless stopped by LINK_DISABLE.
In the state of _HSmRLINK flag On, if communication state of the station
set in the parameter and data block is as follows, this flag shall be On.
1. In case that the station set in the parameter is not RUN mode, or
Abnormal state
_HSn_LTRBL Bit after _HSn_RLINK 2. There is an error in the station set in the parameter, or
ON 3. The communication state of data block set in the parameter is not good.

LINK TROUBLE shall be On if the above 1, 2 & 3 conditions occur, and if

the condition return to the normal state, it shall be Off again.
Indicates the general state of communication information for each data
_HSn_STATE[k] Bit High speed link block of setting parameter.
parameter “n”, k
HS link (k=000~127) Array block general state HS1STATEk=HS1MODk&_HS1TR X k&(~_HSnERRk )

High speed link Indicates operation mode of station set in k data block of parameter.
_HSn_MOD[k] Bit parameter “n”, k
(k=000~127) Array block station RUN
operation mode
Normal Indicates if communication state of k data of parameter is communicated
_HSn_TRX[k] Bit communication smoothly according to the setting.
with High speed
(k=000~127) Array link parameter
“n”, k block station
High speed link Indicates if the error occurs in the communication state of k data block of
_HSn_ERR[k] Bit parameter “n”, k parameter.
block station
(k=000~127) Array operation error
mode
Indicates whether or not to set k data block of parameter.
_HSn_SETBLOCK[k High speed link
bit
] parameter “n”, k
Array block setting

A1-19
 Appendix 1. Flag List

Notes
High Speed
L area address Remarks
Link no.
Comparing with High speed link 1 from [Table 1], the flag address of different
1 L000000~L00049F
high speed link station no. is as follows by a simple calculation formula.
2 L000500~L00099F
3 L001000~L00149F ∗ Calculation formula : L area address =
L000000 + 500 x (High speed link no. – 1)
4 L001500~L00199F
5 L002000~L00249F
In case of using high speed line flag for Program and monitoring, you can use
6 L002500~L00299F
the flag map registered in XG5000 conveniently.
7 L003000~L00349F
8 L003500~L00399F
9 L004000~L00449F
10 L004500~L00499F
11 L005000~L00549F

k means block no. and appears 8 words by 16 per 1 word for 128 blocks from 000~127.
For example, mode information (_HS1MOD) appears from block 0 to block 15 for L00010, and block 16~31, 32~47, 48~63, 64~79,
80~95, 96~111, 112~127 information for L00011, L00012, L00013, L00014, L00015, L00016, L00017. Thus, mode information of block
no. 55 appears in L000137.

[Table 2] Communication Flag List according to P2P Service Setting

P2P parameter no.(n) : 1~8, P2P block(xx) :
0~63
No. Keyword Type Contents Description
P2P parameter n, xx
_P2Pn_NDRxx Bit Block service normal Indicates P2P parameter n, xx Block service normal end
end
P2P parameter n, xx
_P2Pn_ERRxx Bit Block service abnormal Indicates P2P parameter n, xx Block service abnormal end
end
P2P parameter n, xx
Indicates error code in case of P2P parameter n, xx Block
P2P _P2Pn_STATUSxx Word Block service abnormal
service abnormal end
end error Code
P2P parameter n, xx
Double
_P2Pn_SVCCNTxx Block service normal Indicates P2P parameter n, xx Block service normal count
word
count
P2P parameter n, xx
Double
_P2Pn_ERRCNTxx Block service abnormal Indicates P2P parameter n, xx Block service abnormal count
word
count

A1-20
 Appendix 1. Flag List

Appendix 1.11 Reserved Word

The reserved words are predefined words to use in the system.
Therefore, it is impossible to use them as the identifier.
Reserved Words
ACTION ... END_ACTION
ARRAY ... OF
AT
CASE ... OF ... ELSE ... END_CASE
CONFIGURATION ... END_CONFIGURATION
Name of Data Type
DATE#, D#
DATE_AND_TIME#, DT#
EXIT
FOR ... TO ... BY ... DO ... END_FOR
FUNCTION ... END_FUNCTION
FUNCTION_BLOCK ... END_FUNCTION_BLOCK
Names of Function Block
IF ... THEN ... ELSIF ... ELSE ... END_IF
OK
Operator (IL Language)
Operator (ST Language)
PROGRAM
PROGRAM ... END_PROGRAM
REPEAT ... UNTIL ... END_REPEAT
RESOURCE ... END_RESOURCE
RETAIN
RETURN
STEP ... END_STEP
STRUCTURE ... END_STRUCTURE
T#
TASK ... WITH
TIME_OF_DAY#, TOD#
TRANSITION ... FROM... TO ... END_TRANSITION
TYPE ... END_TYPE
VAR ... END_VAR
VAR_INPUT ... END_VAR
VAR_OUTPUT ... END_VAR
VAR_IN_OUT ... END_VAR
VAR_EXTERNAL ... END_VAR
VAR_ACCESS ... END_VAR
VAR_GLOBAL ... END_VAR
WHILE ... DO ... END_WHILE
WITH

A1-21
Appendix 1. Flag List

A1-22
 Warranty and Environmental Policy

Warranty

1. Warranty Period
The product you purchased will be guaranteed for 18 months from the date of manufacturing.

2. Scope of Warranty
Any trouble or defect occurring for the above-mentioned period will be partially replaced or repaired. However, please note the
following cases will be excluded from the scope of warranty.

(1) Any trouble attributable to unreasonable condition, environment or handling otherwise specified in the manual,
(2) Any trouble attributable to others’ products,
(3) If the product is modified or repaired in any other place not designated by the company,
(4) Due to unintended purposes
(5) Owing to the reasons unexpected at the level of the contemporary science and technology when delivered.
(6) Not attributable to the company; for instance, natural disasters or fire

3. Since the above warranty is limited to PLC unit only, make sure to use the product considering the safety for system configuration
or applications.

Environmental Policy

LS ELECTRIC Co., Ltd supports and observes the environmental policy as below.

Environmental Management About Disposal

LS ELECTRIC considers the environmental LS ELECTRIC’ PLC unit is designed to protect

preservation as the preferential management the environment. For the disposal, separate
subject and every staff of LS ELECTRIC use aluminum, iron and synthetic resin (cover) from
the reasonable endeavors for the pleasurably the product as they are reusable.
environmental preservation of the earth.

1
Warranty and Environment Policy

2
 www.ls-electric.com

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Disclaimer of Liability
LS ELECTRIC has reviewed the information in this publication to ensure consistency with the hardware and software described.
However, LS ELECTRIC cannot guarantee full consistency, nor be responsible for any damages or compensation, since variance
cannot be precluded entirely. Please check again the version of this publication before you use the product.
ⓒ LS ELECTRIC Co., Ltd 2015 All Right Reserved. 2023.06