Hole Stress TNR
Hole Stress TNR
• Pre-processing
• Post-processing
• Analysis
The analysis process for a thin plate with a hole involves several key steps to understand
the stress concentration effects around the hole. First, we create a detailed CAD model of
the plate with accurate dimensions, including the central hole. To capture stress variations
effectively, we refine the mesh around the hole, as this is where stress concentrations are
likely to be highest. Next, we apply boundary conditions that simulate real-world loading,
such as tensile forces applied to the plate edges while ensuring the plate is fixed or supported
as needed. In the analysis phase, a static structural analysis is conducted to find the stress
distribution across the plate, focusing on the region around the hole. This includes calculating
the stress concentration factor, which quantifies the increase in stress due to the hole. During
post-processing, we examine the stress distribution around the hole, identifying regions with
the highest stress concentration. We calculate the factor of safety for these areas and assess
whether the design can withstand the applied loads without failure.
1
Figure 1: The plate geometry sketched on ABAQUS.
the plate is made of Aluminum alloy with the following properties 𝐸 = 70𝐺𝑃𝑎, 𝜐 = 0.33
Figure 2: Because the plate is fully symmetric , quarter plate can be used for analysis
2
1.2 Boundary conditions
The plate is symmetric in both x and y directions allowing the analysis to be done on only
quarter of the geometry, the bottom and the left edges are used to segment the model from the
plate Hence the edges are subjected to symmetric mechanical boundary conditions , and the
top and right edges are subjected to an axial load pointing outward.
In order to satisfy the the biaxial ration of 0.4 = 𝜎𝜎𝑟𝑡 , the load acting on the top edge and
right edge are respectively assumed to be equal to
𝜎𝑡 = 400𝑃𝑎, 𝜎𝑟 = 1000𝑃𝑎
Following the value of the radial stress as it reaches the maximum value of 2000 pa as this
value represent the true predicted stress value of on the outer elements of the plate. Increasing
the mesh no.of elements further will not effect the value of 𝜎𝑟𝑟 therefore at this point the mesh
convergence has occurred.
3
2 Post Processing
2.1 Distribution fields outputs
The figure suggest that the maximum radial stress is located at the center of the left and
right area of the plate given symmetric boundary condition. the minimum values for radial
stress occurs at around the hole and increase gradually when traveling far from the center.
This results suggest that the maximums tangential stress occurs right above and below
center of the hole at 𝜃 = [ 𝜋2 , 𝜋3 ] directions given symmetric boundary conditions. The minimum
values happen around 𝜃 = [0, 𝜋2 ] generally the tangential stress value increase gradually when
a point is located closer to the center of the hole.
The figure suggest that the maximum +𝑣𝑒𝜏𝑟𝜃 happens at the center of the four edges of the
plate top ,bottom , left and right 𝜃 = [0, 𝜋2 , 𝜋3 , 𝜋]. Minimum (compression) 𝜏𝑟𝜃 occurs along
4
𝜃 = [ 𝜋4 , 3𝜋 5𝜋 7𝜋
4 , 4 , 4 ] as the stress seems symmetric around these directions , if a point moves
further away in either direction the value of 𝜏𝑟𝜃 will increase.
5
2.2 Plot of stress at different angels
6
Figure 9: Normalized Radial stress against distance r at angle 90
the tangential stress component versus the distance from the center at different angles
7
Figure 12: Normalized tangential stress against distance r at angle 90
8
Figure 14: Normalized shear stress against distance r at angle 45
3 Final discussion
The location and maximum stress concentration factor is located on the radius of the hole
naturally , using FEA we can determine exactly where and the value of maximum stress
concentration.
The largest stress component that was found using tangential stress component is equal to
ℎ𝑜𝑙𝑒 = 2185𝑃𝑎 which results in the following stress concentration factor 𝑆.
𝜎𝑚𝑎𝑥
ℎ𝑜𝑙𝑒
𝜎𝑚𝑎𝑥
𝑆=
𝜎inf
2185𝑃𝑎
𝑆= = 2.185
1000𝑃𝑎
he highest stress component around a hole in a thin plate under tension typically occurs in
the 𝜃𝜃 direction (tangential stress), located at the edge of the hole along the axis perpendicular
to the load direction. which can be calculated theoretically to be in this particular example
where
𝑎2 𝑎4
1 1
𝜎𝜃𝜃 (𝜃 1 , 𝑟) = (𝜎1 + 𝜎2 ) 1 + 2 − (𝜎1 − 𝜎2 ) 1 + 3 4 cos 2𝜃 1
2 𝑟 2 𝑟
0.12 0.14
𝜋 1 1 𝜋
𝜎𝜃𝜃 ( , 0.1) = (1000 + 400) 1 + 2
− (1000 − 400) 1 + 3 4 cos 2( )
2 2 0.1 2 0.1 2
9
𝜎𝜃𝜃 = 2600𝑃𝑎
the Stress Concentration Factor
𝑆 = 2600𝑃𝑎/2000𝑃𝑎 = 2.6
Discrepancies and Differences between FEA results and theoretical predictions can arise
due to finite plate dimensions and mesh density. If the plate is not significantly larger than
the hole, boundary effects alter stress distribution, reducing the SCF compared to an infinitely
large plate.
When analyzing stress concentration in a finite plate with a hole, the plate’s dimensions
relative to the hole diameter significantly influence the SCF. or a finite plate with limited
width and height, the stress distribution around the hole is impacted by the proximity of the
plate edges.
As the plate dimensions decrease (closer to the hole size), the stress concentration factor
tends to reduce from the theoretical infinite plate value (3.0) due to edge constraints, which
redistribute the stresses more evenly.
In conclusion By performing an FEA on a finite plate with a hole, you can observe how the
finite dimensions and biaxiality ratio impact the SCF. Comparing FEA results with theoretical
predictions allows you to understand the effects of finite boundaries and biaxial stresses on
stress concentrations. These analyses reveal that SCFs for finite plates are generally lower
than the idealized 3.0 factor for an infinite plate, and that a higher biaxiality ratio can amplify
the SCF.
10
References
[1] Richard G. Budynas - 1998 The TEX Book, Advanced Strength and Applied Stress Anal-
ysis.
[2] Amar Khennane - 2013 Introduction to Finite Element Analysis Using MATLAB® and
Abaqus ,
[3] Bryan J. Mac Donald – 2016 Practical Stress Analysis with Finite Elements,
Appendix
11