A

TECHNICAL SEMINAR REPORT

ON
“Flexible Electronics”

Dissertation submitted in partial fulfillment of the requirement

for the award of degree of

BACHELOR OF TECHNOLOGY
IN
ELECTRICAL AND ELECTRONICS ENGINEERING
SUBMITTED BY
B. RANI (22C05A0205)
Under the esteemed guidance of
Mr. B. RAJESH
Assistant Professor

DEPARTMENT OF ELECTRICAL AND ELECTRONICS ENGINEERING

 DEPARTMENT OF ELECTRICAL AND ELECTRONICS ENGINEERING

CERTIFICATE
This is to certify that the technical report entitled “Flexible Electronics” being submitted
by B. RANI bearing H.T.NO: 22C05A0205 in partial fulfillment of the requirement for the
award of the degree of Bachelor of Technology in Electrical and Electronics Engineering,
Jawaharlal Nehru Technological University, Hyderabad, is a record of the bonafide work
carried out by them under our guidance and supervision during the time period 2024-25.
The results presented in this thesis have been verified and are found to be satisfactory.
The result embodied in this project has not been submitted to any other university or institute
for the award of any degree or diploma.

Internal Guide Head of the Department

Mr. B. RAJESH Mrs. V. Shrieesha

Assistant Professor, Assistant Professor,
Dept of EEE Dept of EEE
 DECLARATION

B. RANI bearing H.T.No: 22C05A0205 a bonafide student of SCIENT

INSTITUTE OF TECHNOLOGY, would like to declare that the project titled “Flexible
Electronics”. A partial fulfillment of BACHELOR OF TECHNOLOGY degree
course of Jawaharlal Nehru Technological University is my original work in the year 2024
under the guidance of Mr. B. RAJESH, Assistant Professor for the Department of Electrical
and Electronics Engineering.

B. RANI (22C05A0205)
 ACKNOWLEDGEMENT

Determination and dedication with sincerity and hard work will lead to the height of
success. In spite of the obstacles faced, the valuable suggestions and their best wishes helped
to complete project titled “Flexible Electronics” successfully.

I would like to express my gratitude to all the people behind the screen who have helped me

transform an idea into a real time application.

I would like to express my heart-felt gratitude to my parents without whom i would not have
been privileged to achieve and fulfill my dreams. A special thanks to our Secretary, K.C.
SHEKAR REDDY Garu, for having founded such an esteemed institution. I am also grateful
to our Principal, Dr.G. ANIL KUMAR Garu, who most ably run the institution and have had
the major hand in enabling me to do my project.
I profoundly thank Mrs.V. Shrieesha, Head of the Department, electrical and electronics
Engineering, who has been an excellent guide and also a great source of inspiration to my work.
I would also like to thank Mr.B.Rajesh, for her technical guidance & constant encouragement.
The satisfaction and euphoria that accompany the successful completion of the task
would be great, but incomplete without the mention of the people who made it possible, whose
constant guidance and encouragement crown all the efforts with success. In this context, I
would like to thank all the other staff members, both teaching and non-teaching, who had
extended their timely help and eased my task.
CONTENTS:
LIST OF FIGURES: ................................................................................................................... 1
TITLE: FLEXIBLE ELCTRONICS........................................................................................... 1
ABSTRACT ............................................................................................................................ 1
CHAPTER I ................................................................................................................................ 2
FLEXIBLE ELECTRONICS ..................................................................................................... 2
1.1 INTRODUCTION ............................................................................................................ 2
1.2 HISTORY.......................................................................................................................... 2
CHAPTER 2 ............................................................................................................................... 4
FLEXIBLE CIRCUIT STRUCTURES ...................................................................................... 4
2.1 INTRODUCTION ............................................................................................................ 4
2.2 TYPES OF FLEX CIRCUITS .......................................................................................... 4
2.2.1 Single-sided flex circuits ........................................................................................... 4
2.2.2 Double access or back bared flex circuits ................................................................. 4
2.2.3 Sculptured Ilex circuits .............................................................................................. 4
2.2.4 Double-sided flex circuits .......................................................................................... 4
2.2.5 Multilayer next circuits .............................................................................................. 5
2.2.6 Rigid-next circuits...................................................................................................... 5
2.2.7 Polymer thick film circuits ........................................................................................ 5
2.3MANUFACTURING......................................................................................................... 6
2.4 ADVANTAGE AND DISADVANTAGE OF FPSS ......................................................... 6
2.4.1 Advantage or FPCS.................................................................................................... 6
2.4.2 Disadvantages Of FPCS ............................................................................................ 6
2.5 APPLICATIONS ............................................................................................................... 7
CHAPTER 3 ............................................................................................................................... 9
MANUFACTURING TECHNIQUES ....................................................................................... 9
3.1 INTRODUCTION:- .......................................................................................................... 9
3.2 TYPES OF MANUFACTURING TECHNOLOGY ....................................................... 9
3-2.1 Amorphous Silicon Technology ................................................................................ 9
3.2.2 Polysilicon Technology.............................................................................................. 9
3.2.3 Organic Thin Film Transistors ................................................................................... 9
3.2.4 Single Crystal Silicon On Flexible Substrates......................................................... 10
3.2.5 Mixed Oxide Thin Film Transistors ........................................................................ 10
CHAPTER 4 ..............................................................................................................................11
FLEXIBLE CIRCUIT MATERIALS ........................................................................................11
4.1 INTRODUCTION ...........................................................................................................11
4.2 BASE MATERIAL ..........................................................................................................11
4.3 METAL ROIL ..................................................................................................................11
CHAPTER 5 ............................................................................................................................. 13
FLEXIBLE ELECTRONIC COMPONENTS ......................................................................... 13
5.1 INTRODUCTION .......................................................................................................... 13
5.2 RESISTORS AND CAPACITORS ................................................................................ 13
5.3 MEMORY, AMPLIFIERS AND RING OSCILLATORS .............................................. 14
5.4 BATTERIES ................................................................................................................... 15
CHAPTER 6 ............................................................................................................................. 18
FLEXIBLE DISPLAY .............................................................................................................. 18
6.1HISTROY ........................................................................................................................ 18
 6.2 FLEXIBLE DISPLAYS .................................................................................................. 19
6.3 FEATURES ..................................................................................................................... 21
CHAPTER 7 ............................................................................................................................. 22
WORKING PRINCIPLE OF E-PAPER ................................................................................... 22
7.1 INTRODUCTION .......................................................................................................... 22
7.2 APPLICATIONS OF E-PAPER...................................................................................... 23
7.3 FUTURE OR E-PAPER ................................................................................................. 24
CHAPTER 8 ............................................................................................................................. 25
APPLICATIONS OF FLEXIBLE ELECTRONICS ................................................................ 25
CHAPTER 9 ............................................................................................................................. 27
CHALLENGES ........................................................................................................................ 27
CHAPTER 10 ........................................................................................................................... 28
ADVANTAGE AND DISADVANTAGE OF FLEXIBLE ELECTRONICS .......................... 28
CHAPTER 11............................................................................................................................ 29
FUTURE ASPECTS ................................................................................................................. 29
CONCLUSION ......................................................................................................................... 30
REFERENCES ......................................................................................................................... 31
LIST OF FIGURES:
Figure 1.Raw io Row Process of Manufacturing ....................................................................... 8
Figure 2. Flexible Electronic Components ............................................................................... 13
Figure 3. Structure of resislor, Figure 4. Structure ofcapacitor……………………………….14
Figure 5. Flexible memories ..................................................................................................... 15
Figure 6. Flexible lithium ion battery ....................................................................................... 16
Figure 7. Technology liltegratiorl,hpplications ........................................................................ 17
Figure 8. Display Development ............................................................................................... 19
Figure 9. Illusion of flexible display, Figure 10. flexible display by Sony .............................. 20
Figure 11. Citizen E-JnkClock .................................................................................................. 24
Figure 12. Next Generation Flexible Electronics Systems and the Key Relevant Sectors ...... 25

1
 TITLE: FLEXIBLE ELCTRONICS
ABSTRACT
Flexible electronics is a new trend in electronics industry to handle the increasing burden on chips. It
is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrate.
This technology is mereasingly being used in a number ofapplications which benefit t'/om their light weight.
favourable dielectric properties, robust, high circuit density and conformable nature, Flexible cir-cults can be
rolled away when not required, TO replace glass, plastic substrate must offer properties like clarity.
dimensional stability, low coefficient Of thermal expansion. elasticity etc. Recent advances in Organic and
inorganic based electronics proceeds on flexible substrate, offer substantial rewards in terms of bemg able to
develop displays that are thinner , lighter and can be rolled when not in use. This paper will discuss about the
propertiesf preparation methods, applications and challenges in this rapidly growing industry,

Keywords Electronics, Flevible, Circuits, Silicon, Substrates

1
 CHAPTER I
FLEXIBLE ELECTRONICS
1.1 INTRODUCTION
Flexible electronics, also known as flex circui{st is a technology for assembling electronic circuits by mounting
electronic devices on flexible plastic substrates, such as PEEK or transparent conductive polyester film, Additionally,
ilex circuits can be screen printed silver circuits on polyester, Flexible electronic assemblies may be manufactured
using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape, or
to flex during its use. An alternative approach to flexible electronics suggests various etching techniques to thin down
the traditional silicon substrate to few tens of micrometers to gain reasonable flexibility, referred to as flexible silicon
(v 5 mm bending radius),

Flexible electronics have recently attracted much attention since they enable many promising applications such
as RIGID tags, solar cells ,bio-sensors0f wireless power and signal transmission sheets ,e-skin, e-paper and flexible
display, The characteristic of flexible electronics is not only reduced cost and they have light weight, thinner, non-
breakable new forms to create many new applications. It isan attractive candidate for next-generation consumer
electronics and they will soon be part of our daily lives. Development strategy of flexible electronics is dependent on
global technology progresses and market forecasts. Currently, it has been estimated that there are about 1500
worldwide researCh units working on various aspects offlexible electronics, Market analysis estimates the Of flexible
electronics Can reach 30 billion USD in 2017 and over 300 billion USD in 202

1.2 HISTORY
Patents issued at the turn of the 20th century show that early researchers were envisioning ways of making
nat conductors sandwiched between layers or insulating material to layout electrical circuits to serve in early
telephony switching applications. One of the earliest descriptions of what could be called a flex circuit was unearthed
by Dr Ken disclosed in an English patent by Albert Hansen in 1903 where Hansen described a construction
Consisting of flat metal conductors on paraffin coated paper, Thomas Edison's lab books from the same period also
indicate that he was thinking to coat patterns cellulose gum applied to linen paper with graphite powder to create

2
what would have clearly been flexible circuits. though there is no evidence ihat it was reduced to practice. In the
1947 publication "'Printed Circuit
Techniques" by Cledo Brunetti and Roger W. Curtist14J a brief discussion of creating circuits on What would have
been flexible insulating materials (e.g. paper) indicated that the idea was in place and in the 1950s Sanders Associates'
inventors (Nashua, NH) Victor Dahlgren and company founder Royden Sanders made significant strides developing
and patenting processes for printing and etching flat conductors on flexible base materials to replace wire harnesses,
An advertisement from the 1950 placed by Photoeircuits Corporation in New York demonstrated their active interest
in flexible circuits also.

Today, flexible circuits which are also variously known around the world variously asflexible printed Wii-ing,
flex flexi circuits, are used many products. Large credit is due to the effOrts of Japanese electronics packaging
engineers who have found countless new ways to employ flexible circuit technology. For the last decade. flexible
circuits have remained one of the fastest growing of all interconnection product market segments, A more recent
variation on flexible circuit technology is one called "flexible electronics" which commonly involves the integration
Of both active and passive functions in the processing.Chapter 2

3
 CHAPTER 2
FLEXIBLE CIRCUIT STRUCTURES
2.1 INTRODUCTION
There are a few basic constructions of flexible circuits but there is significant variation between the different
types in terms oftheir construction. Following is a review Of the most common types of flexible circuit constructions

2.2 TYPES OF FLEX CIRCUITS

2.2.1 Single-sided flex circuits
Single-sided flexible circuits have a single conductor layer made of either a metal or conductive (metal filled)
polymer on a flexible dielectric film. Component termination features are accessible only from one side. Holes may
be formed in the base film to allow component leads to pass through for mterconneciion, normally by soldering.
Single sided ilex circuits can be fabricated With oc Without such protective coatings as layers or Cover Coats,
however the use or a protective coating over circuits is the most common practice. The development of surface
mounted devices on sputtered conductive films has enabled the production of transparent LED Films, which is used
in LED Glass but also in flexible automotive lighting composites,

2.2.2 Double access or back bared flex circuits

Double access flex. also known as back bared flex, are flexible circuits having a single conductor layer but
which is processed so as to allow access to selected features of the conductor pattern from both sides, While this type
of circuit has certain benefits, the specialized processing requitetnents for accessing the features limits its use.
2.2.3 Sculptured Ilex circuits
Sculptured flex circuits are a novel subset of normal flexible circuit structures.
The manufacturing process involves a special flex circuit multi-step etching method which yields a flexible
circuit having finished copper conductors wherein the thickness of' the conductor differs at various places along
their length. (i.e., the conductors are thin in flexible areas and thick at interconnection points,

2.2.4 Double-sided flex circuits

Double-sided flex circuits are nex clrcuits having two conductor layers, These flex circuits can be fabricated
with or without plated through holes, though the plated through hole variation is much more When constructed
without plated through holes and connection features are accessed from one side only, the circuit is defined as a
"Type V according io military specifications. It is not a common practice but it is an option. Because of the plated
through hole, tenmnations for electrome components are provided for on both sides of the circuit, thus allowing
components to be placed on either Depending on design requirements, doublesided flex circuits can be fabricated

4
with protective coveclayers on one. both or neither side of the completed circuit but are most commonly produced
with the protective layer on both sides,
One mior advantage of this type of substrate is that it allows crossover connections to be made Very easy.
IVIåny single sided circuits are built on a double sided substrate just because they have one of two crossover
connections. An example or this use is the circuit connecting a mousepad to the motherboard ofa laptop. All
connections on that circuit are located on only one Side Of the substrate, except a very' small crossover connection
which uses the second side of the substrate.

2.2.5 Multilayer next circuits

Flex circuits having three or more layers Of conductors are known as multilayer flex circuits, Commonly the
layers are interconnected by means Of plated through holes, though this is not a requirement of the definition for it is
possible io provide openings to access lower circuit level features. The layers ofthe multilayer ilex circuit may or may
not be continuously laminated together throughout the Construction with the obvious exception of the areas occupied
by plated through-holese The practice of discontinuous lanunation is common in cases where maximum flexibility is
required. This is accomplished by leaving unbonded the areas where flexing or bending is to OCCUr.

2.2.6 Rigid-next circuits

Rigid-flex circuits are a hybrid construction flex circuit consisting of rigid and flexible substrates which are
laminated together into a single structure, Rigid-nex circuits should not be confused with rigidized flex
constructions, which are simply flex eircuits to which a stiffener is attached to support the weight of the electronic
components locally. A rigidized or stiffened flex circuit can have one or more conductor layers, Thus while the two
terms may sound similar, they represent products that are quite different.

The layers ora rigid flex are also normally electrically interconnected by means of plated through holes. Over
the years, rigid-flex circuits have enjoyed tremendous popularity among military product designer, however the
technology has found increased use in commercial products, While often considered a specialty product for low volume
applications because of the challenges, an impressive effort to use the technology was made by Compaq computer in
the production of boards for a laptop computer in the 1990s, While the computer's main rigid-flex PCBA did not flex
during use' subsequent designs by Compaq utilized rigid-flex circuits for the hinged display chble,. passing IOS Of
1000s of flexures during testing. By 2013, the use of rigidflex circuits in consumer laptop computers is now common,

Rigid-nex boards normally multilayer Structures; however, two metal layer constructions are sometimes used.

2.2.7 Polymer thick film circuits

Polymer thick film (PTF) fles circuits are true printed circuits in that the eonduetors are actually printed onto
a polymer base film. They are typically single conductor layer structures, however two Or more metal layers can be
printed sequentially with insulating layers printed between printed conductor layers, While lower in conductor
conductivity and thus not suitable for all applications, PIT circuits have successiülly served in a wide range of low-

5
power applications at slightly higher Voltages, Keyboards are a common application. howevert there are a wide
range potential applications ror this cost-effective approach to ilex circuit manufacture,

2.3MANUFACTURING
Flexible printed circuits (FPC) are made a photolithographic technology, An alternativeWay Of making flexible
foil circuits Of flexible flat cables (FFCS) is laminating Very thin (007 mm) copper strips in between two layers or
PET. These PET layers, typically (LOS mm thick. are coated with an adhesive which is thermosetting, and will be
activated during the lamination process. FPCs and FFCs have several advantages in many applications:
Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as cameras (static
application).

• Electrical connections where the assembly is required to flex during its normal use, such as folding cell phones
(dynamic application),

• Electrical connections between sub-assemblies to replace wire harnesses. which are heavier and bulkier. such as in
cars, rockets and satellites,

• Electrical connections where board thickness or Space constraints driving factors.

2.4 ADVANTAGE AND DISADVANTAGE OF FPSS

2.4.1 Advantage or FPCS

• Potential to replace multiple rigid boards and/or connectors

• Single-Sided Circuits are ideal for dynamic or high-flex applications Stacked F PCs in various configurations
2.4.2 Disadvantages Of FPCS

• Cost increase over rigid PCBs

• Increased risk Of damage during handling or use

• More difficult assembly process

Repair and rework is difficult or impossible

Generally Worse panel utilization resulting iti increased cost

6
 2.5 APPLICATIONS

Flex circuits are onen used as connectors in various applications where flexibility, space savings, or
production constraints limit the serviceability of rigid circuit boards or hand wiring. A common application of Ilex
Circuits is in computer keyboards; most keyboards use nex circuits for the switch matrix.

In LCD fabrication, glass is used as a substrate. If thin flexible plastic or metal foil is used as the substrate
instead, the entire system be flexible, us, the film deposited on top of the substrate is usually very thin, on the order
of a few micrometres.

Organic light-emitting diodes (OLEDs) are normally used instead of a back-light for flexible displays, making
a flexible organic light-emitting diode display.
Most flexible circuits are passive wiring structures that are used to interconnect electronic components such
as integrated circuits, resistor. capacitors and the like, however some are used only for making interconnections
between other electronic assemblies either directly or by means of connectors.

In the automotive field. flexible circuits are in instrument panels, under-hood controls, circuits to be
concealed within the headliner of the cabin, and in ABS systems. In computer peripherals flexible circuits are used
on the moving print head of printers, and to connect signals to the moving arm carrying the read/write heads Of disk
drives. Consumer electronics devices make use offlesible circuits in cameras, personal entertainment devices,
calculators, or exercise monitors.

Flexible eireuits are found in industrial and medical devices where many interconnections are required in a
compact package. Cellular telephones are another widespread example of flexible circuits,

Flexible solar cells have been developed for powering satellites, These cells are lightweight, can be rolled up for launch,
and are easily defrloyabJe, making ghem a good match for the application. They Can also be into backpacks or
outerwear.

7
Raw

Figure 1. Raw io Row Process of Manufacturing

8
 CHAPTER 3
MANUFACTURING TECHNIQUES
3.1 INTRODUCTION:-
Polydimethyl silioxane (PDMS) is ideal substrate and composite matrix material for flexible electronics. It is
optically transparent, visco elastie, chemically and thermally stable, highly flexible ,hydrophobic and can easily be
moulded with high resolution and aspect ratio. To avoid metallization Electrically Conductive Adhesive (ECA)are
used. ECAs are conductive composites composed of metallic fillers within a polymeric matrix. This technology is
coined as PDMS-in-PDMS electronics. Basically, flexible electronics deals with circuits developed using Thin Film
Transistors (TFT_)_ Different TET technologies are available today to develop circuits,

3.2 TYPES OF MANUFACTURING TECHNOLOGY

3-2.1 Amorphous Silicon Technology
Hydrogenated amorphous silicon(a are the workforce ortoday's active matrix LCD displays [2-4]. The main
driving force for OLEO display is its emissive characteristics, good colour saturation and clarity. It is also sunlight
readable- This technology is suitable for the bistable displays such as electrophoretic and cholesteric displays, a Si:H
TFT based integrated drivers can be used in application which require only occasional image updates such as
advertising, map applications, point of sale labels etc.

3.2.2 Polysilicon Technology

Polysilicon TFTs are processed at higher temperature using laser re-crystallisation ofa Si:H material and can
have mobilities greater than I OOcm2v-l s-l. The threshold voltages of these or TFTs are very poly.Si TFTS can be
used to develop display backplanes as well as
CMOS digital circuits However, the process and substrate costs are comparatively higher and thus restrict the use of
these TFTs in high resolution displays In smart phones and high end radio frequency tags,

3.2.3 Organic Thin Film Transistors

Organic TETS can be manufactured using a number of organic semiconductors such as Pentacene, TIPS
Pentaeene etc. These semiconductors can be processed at low temperatures using solution processes or vacuum
evaporated processes sueh as spin coating and ink-jet printing 161. Roll-to-Roll processing may bring down the Cost
Of production. -file OTFT is sensitive to air and hence its performance degrades over time when exposed to the
environment Barrier coating is required to protect it from exposure.

9
 3.2.4 Single Crystal Silicon On Flexible Substrates
It is possible to develop single crystal silicon circuits on flexible substrates with mobilities greater than
500cm2v•l and response frequencies greater than 500ME-lz.ln this techniques, a semiconducting micro/nanomaterial
known as microstructural silicon is printed using dry transfer or solution based techniques onto plastic substrates to
produce high performance TFTs

3.2.5 Mixed Oxide Thin Film Transistors

Mixed oxide thin film transistors such as IZO,IGZO provide better mobility, higher current densities and
better stability compared to a Si:H TFTs. Another feature ofmixed oxide TFT is that they are transparent, Hence,
there is much interest to develop transparent electronics on large area flexible substrate.

Hybrid (CMOS) Technology CMOS technology has several advantages over nMOS Or pMOS only
technologies, Speed Of' CMOS technology is considerably faster than anyother technology with much lesser power
loss. By including n-type and p-type TFTs on the same substrate,it is possible to implement CMOS circuits which
reduce power consumption, leakage currents and improve the gain of the digital logic circuits [12-13]. Research done
at Flexible Display Centre in collaboration With University of Texas ai Dallas shows that these CMOS logie circuits
are more stable compared to a Si:H TFT circuits. This is because the V(t) of the a Si:H TFT shifts in positive direction
with electrical stress while that oforganic TFTs shift negative as shown in fig, I lil this technology, a Si-l•l TFTs and
Pentacene TETs on PEN substrate and successfully demonstrated CMOS column driver ror electrophoreiic displays,

10
 CHAPTER 4
FLEXIBLE CIRCUIT MATERIALS
4.1 INTRODUCTION
Each element orthe Ilex circuit construction must be able to consistently meet the demands placed upon it for
the life of the product. In addition, the material must work reliably in concert with the other elements of the flexible
circuit construction to assure ease of manufacture and reliability, Following are brief descriptions of the basic elements
of ilex circuit construction and their functions.

4.2 BASE MATERIAL

The base material is the flexible polymer film which provides the foundation for the laminate. Under normål
the flex circuit base material provides most primary physical and electrical properties of the flexible circuit. In the
ease of adhesiveless circuit constructions, the base material provides all of the-characteristic propeniesw While a wide
range ofthiekness is possible, most flexible films are provided in a narrow range ofrelatively thin dimension from 12
gm to 125 pm (1/2 mil to mils) but thinner and thicker material are possible. Thinner materials are of course more
flexible and for most material, stiffness increase is proportional to the cube ofthiekness, Thus for example, means that
if the thickness is doubled, the material becomes eight times stiffer and Will only deflect 1/8 as touch under the same
load. There are a number of different materials used as base films inéludvng: polyester (PET), polyimide (PI),
polyethylene naphthalate (PEN), polyetherimide (PEI), along with various fluropolymers (FEP) and copolymers.
Polyimide films are most prevalent owing to their blend of advantageous electrical, mechanical, chemical and thermal
properties different polymer lies. However some newer thermoplastic polyimide adhesives are making important in-
roads, As with the base films, adhesives come in different thickness, Thickness selection is typically function Of the
application, For example, different adhesive thickness is commonly used in the creation of cover layers in order to
meet the fill demands of different copper foil thickness which may be encountered.
4.3 METAL ROIL
A metal foil is most commonly used as the conductive element of a flexible laminate, The metal foil is the
material from which the circuit paths are normally etched. A wide variety Of metal roils of varying thickness are
available from which to choose and create a flex circuit, however copper foils. serve the vast majority of all flexible
circuit applications. Copper's excellent balance of cost and physical and electricUl performance attributes make it an
excellent choice, There are actually many different types of copper foil. The IPC identities eight different types Of
copper foil for printed circuits divided into two much broader categories, electrodeposited and wrought, each having
four sub-types.) As a result, there are a number ofdifferent types of copper foil available for flex circuit applications to
serve the varied purposes of different end products. With most copper foil, a thin surface treatment is commonly applied
to one side orthe roil to improve its adhesion to the base film, Copper fOils are oftwo basic types: wrought (rolled) and

11
electrodeposited and their properties are quite different, Rolled and annealed foils are the most common choice,
however thinner films which are electroplated are becoming increasingly popular.

In certain non standard cases, the circuit manufacturer may be called upon to create a specialty laminate by
using a specified altemative metal foil, such as a special copper alloy or other metal foil in the construction. This is
accomplished by laminating the foil to a base film With or without an adhesive depending on the nature and properties
of the base film,

12
 CHAPTER 5
FLEXIBLE ELECTRONIC COMPONENTS
5.1 INTRODUCTION
Fast flexible electronics operating at radio frequencies GHz) are more attractive than traditional flexible
electronics because of their versatile capabilities, dramatic power savings when operating at reduced speed and
broader spectrum of applications. Transferable single crystalline Si nanomembranes (SiNNIs) are preferred to Other
materials for flexible electronics owing to their unique advantages. Further improvement of Si based device speed
implies significant technical and economic advantages. While the mobility Of bulk Si can be enhanced using strain
techniques, implementing these techniques into transferrable single-crystalline SiNMs has been challenging and not
demonstrated.

OLEO - LIGHTING

Figure 2.Flexible Electronic Components

5.2 RESISTORS AND CAPACITORS

The past approach presents severe challenges to achieve effective doping and desired material tppOlogy, Here
demonstrate the doping techniques with self-sustained strain sharing by applying a strain-sharing scheme between Si
and SiGe multiple epitaxial layers, to cleate strained print-transferrable SiNMs, We demonstrate a new speed record
of Si-based flexible electronics without using aggressively scaled critical device dimensions.

13
 Figure 3.Structure of resislor Figure 4. Structure ofcapacitor

The given figure aboves shows the structures of thin flim resistors and capacitors which are constructed on
flexible substrate and the conductive paths are made up of flexible materials such as silicon nanomembranes,
grapheme, carbon nanotubes etc. Nanotechnology is to a large for the manufacturing Of electronic
components

5.3 MEMORY, AMPLIFIERS AND RING OSCILLATORS

At the International Electron Devices Meeting (IEDM) last fall IBM researchers demonstrated CMOS circuits
—including SRAM memory and ring oscillators—on a flexible plastic substrate. The extremely thin silicon on
insulator devices had a body thiCkness ofjust 60 angstroms, IBM built them silicon and then used room-temperature
process called controlled spalling, which essentially flakes off the Si substrate. Then they transferred them to flexible
plastic tape. The devices had gate lengths of <30 run and gate pitch of 100 nm, The ring oscillators had a stage delay
ofjust 16 ps at 0.9 V, believed to be the best reported performance ror a flexible circuit,

lil a recent edition of the journal Nature Communications a team of researchers from the University of
Pennsylvania showed that nanoscale panicles, or nanocrystals, of the semiconductor cadmium selenide can be
"printed" or "coated" on ilefible JSlastics to Corm high.
performance electronics. Because the dispersed in an ink-like liquid, multiple types ofdeposition techniques ean be
used to make circuits, wrote the researchers. In their study, the researchers used spin coating; where centrifugal force

14
pulls a thin layer of the solution Over a surface, but the nanocrystals could be applied through dippmg, spraying or
inkjet printing as well, they reporti

Using this process, the researchers built three kinds of circuits to test the nanocrystal 's performance for
circuit applications; an inverter, an amplifier and a ring oscillator. All Of these circuits were reported to operate with
a couple ofvolts, according to the researchers an important point since If you want electronics for portable devices
that are going to work with batteries, they have to operate at low voltage or they won't be useful,

Figure 5. Flexible memories

5.4 BATTERIES
One of the things seemingly hampering advances in bendable electronics research is uncertainty surrounding
a product's power source. At the University of Delaware, Bingqung Wei and his colleagues are researching energy
sources that are scalable and stretchable, In a report published in Nano Letters, a journal of the American Chemical
Society, Wei's research team reported significant progress in developing scalable; stretchable power Sources using
carbon nanotube macrofilms, polyurethane membranes and organic electrolytes. According to Wei, the
supereapaeitor developed in his lab achieved excellent stability in testing and the results will provide important
guidelines for future design and testing of this leading-edge energy storage device,

Also in Nano Letters researchers from the Korea Advanced Institute of Science and Technology (KAIST) in
Daejeon, South Korea published a study on a new bendable Li-ion battery for fully flexible electronic systems.

15
 A Ithough the rechargeable lithium-ion battery has been regarded as a strong candidate for a high-
performance flexible energy source, compliant electrodes for bendable batteries are restricted to only a few materials,
and their performance has not been sufficient for them to be applied to flexible consumer electronics including
rollable displays.

Figure 6. Flexible lithium ion battery

The researchers presented a flexible thin-film lithium ion battery that enables the realization or diverse flexible
batteries regardless electrode chemistry, The result is flexible Li•ion battery that Can be made With almost any
electrode material. Here, the researchers used lithium cobalt oxide as the cathode materials which is currently the most
widely used cathode in non-flexible Li-ion batteries due to its high performance. For the anode, they used traditional
lithiumv

16
Figure 7. Technology integration Applications

17
 CHAPTER 6
FLEXIBLE DISPLAY
6.1HISTROY
The era of mobile devices began in the second halfofthe 1990s. As cell phones became widely used, the market
for mobile equipment grew at a rapid rate. The main area competition was in making devices smaller and improving
call quality, Once the ideal size and call quality was achieved it became harder to diffelentiate the products in the early
2000s.As a result, companies started competing to develop simple wireless telecom devices and added value for
customers by offering colour display, MP3 and camera functions, The landscape of the market changed quickly as
GSM and CDN'IA combined to form WCDMA or 3G.The market became more operator-driven as telecom companies
used a variety of marketing methods, including providing customers With subsidies and two-year contracts. By the
second half Of 200-S, most phones had svmilar design and timetions (camera, colour display, 3G) and with
differentiation becoming more difficult. commoditisation started and competitors focused on lowermg production
costs.

Table 1 The History Of Handset Industry

A 2005, competitors turned their attention to making cell phones essential in everyday life. As a result, products
with differentiated form factors, such as easing, keypad and slim form factor, were designed, The market for high-end
phones started to take off, Consumer interest in design was an opportunity for Samsung and LG to strengthen their
positions in market dominated by cost efticient companies, such Nokia.Then Apple's iPhone arrived, providing
completely new experiences, such as entertainment features and a highly distinctive design and customization options.
The handset market went through rapid change as Wi-Fi internet revolutionised the data side of the business, Apple
Was the dominant force until the advent Of Android-based phones, Differentiation has become even harder with most
companies using full HD panels, a standardized quad-core application process, touch Screen and the Android operating
system. In a commoditised market, design is the high-end market's main differentiating point, They believe flexible
18
display will take this to a new level as the new technology will see handheld digital devices become lighter *thinner
and more convenient for users. Display technology is advancing in four directions: I improving the sense of reality
through 3D TV 2) adopting additional functions, such as touch and internet connectivity, 3) enabling greater mobility
via lighter and thinner products, such as in smartphones and tablet PCs, and 4) expanding adaptability for displays in
homes and industries via thinner, larger products, such as UHD TV. Until recently, progress on flexible display
technology has been slow. The main reason is that companies have already made heavy investments in LCD, the
technology used in flat display panels.

Figure 8. Display Development

6.2 FLEXIBLE DISPLAYS

The desire for a display that has the flexibility and even 'Toldability" ofpaper, but with the capability to update
the information on the page almost instantly is what drives the interest and commercial funding of flexible
electrophoretic devices, Though the electronic paper application is probably in our near future, with some prototypes
already available, it is likely that Other applications Will be more interesting and social point of view. Large area
displays-smart cards, mobile phones, and automotive applications will be some of the targets tor flexible
electrophoretic displays.

For large area signage and displays, flexible elecrtrophoretic display technology holds promise for several
reasons, First, for applications where flexibility or even conformability is desired or useful, the strong optical contrast
at nearly all viewing and illumination angles is of interest. The compartmentalization Of the ink and the drive
electronics into physically separated pixels also allows for greater flexibility than polycrystalline or polymeric
materials.

19
Additionally this technology holds promise for remote or mobile display applications due to its low power usage and
relative toughness when built with polymeric substrates, The slow refresh time in these applications is a minimal issue
because most signs are updated on much longer time scales. At the same time, companies are making significant
strides towards higher refresh rates, nearing video speed.

Finally, the electrophoretic display technology is the only technology with which large area (up to 30 inches
Wide) displays have already been and are in the process Of commercialization, giving this technology a market
lead. With a higher refresh rate, electrophoretic displays will be able to break into the low end automotive and mobile
phone

Figure 9. Illusion of flexible display Figure 10. flexible display by Sony

While stability and environmental sensitivity are lower concern than for organic display materials, the addition
Of color capabilities, either through novel multi-filter stacking or through novel colored particle technology is more
challenging than with the organic display materials. The automotive and mobile phone markets are likely to fully
embrace the electrophoretic display when color becomes widely available due to its Wide viewing angles, robustness
and flexibility as well as the fact that the displays may be made in large volume with large areas and have relatively
IOW weight. Color capabilities Will be the largest challenge for electrophoretic displays, requiring innovative
approaches to overcome the inherent bi-color, bi-stable paradigm that the display technology has grown to embrace.
E-lnk has already made some progress toward this end by partnering with the Toppan Printing Company to make color
filters to overlay the electrophoretie display layer.

20
 6.3 FEATURES
Rigid Graphical User Interfaces (GUIs) Often feature input that is indirect, one-handed, and dependent on
visual cues. By contrast, paper documents, and presumably flexible displays, may: I. Be very thin, low-weight, yet
rugged, allowing superior portability over any current mobile computing form factor. 2. Have many form factors.
This allows for distinct physical affordances that relate to specific functionalities: reading a newspaper serves a
different purpose than reading a product label, and implies a different form factor. 3. Provide variable screen real
estate that fits the current context of use, 4. Have many Ohysical pages, each page pertanning only to a specific and
physically delineated task context, 5, Use physical bend gestures with strong tactile and kinesthetic feedback for
efficient navigation.

Prior simulations of flexible displays have already produced a library of paper-like interaction styles, most of
which focus on the use of bend gestures, A bend gesture is the physical, manual deformation of a display to form a
curvature for the purpose of triggering a software action. In this paper, we present an evaluation of user preferences
ror bend gestures in executing a real set of tasks. using an actual flexible display, We designed a study in which users
were asked to design their own bend gesture using a thin film E Ink display with integrated bend sensors. This approach
hus two distinct advantages over prior visual feedback is provided directly on the display itself: and (2) dynamic
material characteristics of bending layers of sandwiched flexible electronics were included, In the first part ofour studyi
we asked participants to defines bend gesture pairs. In the second part, we asked them to evaluate the appropriateness
oftheir bend gestures for us With multiple actions. Finally, users were asked to use and evaluate bend gestures in the
context of complete operating a music player). Results showed that users selected individual bend gestures and bend
gesture pairs that were conceptually simpler and less physically demanding, There was a strong agreement among
partlcipanis touse 3 bend gesture pairs in applications: (I ) side of display,up/down (2) top corner, up/down (3) bottom
corner, up/down. There was also Strong consensus on the polarity(physical bend direction: up or down) ofbend gesture
pairs for actions with clear directionality (e.g., navigating left and right to select an icon). lil the early stages. flexible
display will be used in small displays, such as Watches, Which can be mass producede Then, depending on how the
technology matures, it will be applied in smartphones and tablets,

21
 CHAPTER 7
WORKING PRINCIPLE OF E-PAPER
7.1 INTRODUCTION
E-paper comprises two different parts: the first is electronic ink, sometimes referred to as the front planel and
the second is the electronics required to generate the pattern of text and images on the page, called the —back planel.

Over the years, a number of methods for creating e-ink have been developed, The Gyeieon e-ilik developed in the 70s
by Nick Sheridon at Xerox is based on a thin sheet of flexible plastic containing a layer of tiny plastic beads, each
encapsulated in a little pocket of oil and thus able to freely rotate within the plastic sheet. Each hemisphere Olfa bead
has a different color and different electrical charge. When an electric field is applied by the backplane, the beads rotate,
creating a two-colored pattern. This method of creating e-ink was dubbed bichromal frontpiane. Originally, biChromal
frontplane had a number of limitations, including relatively low brightness and resolution and a lack of color. Although
these issues are still being tackled, other of eink, with improved properties compared to the original have been
developed the years.

One such technology is electrpphoretic frontplane' developed by the E Ink Corporation. Electrophoretic
froniplane consists of millions ortiny microcapsules, each approximately 100 microns in as wide as a human hair.
Each microcapsule is filled with a clear fluid containing positively charged white particles and negatively charged
black particles, When a negative electric fiéld is applied. the white particles move to the top ofthe microcapsule,
causing the area to appear to the viewer as a White dot, while the black particles move to the bottom of the capsule
and are thus hidden from view. When a positive electric field is applied, the black particles migrate to the top and the
whiteoarticles move to the bottom, generating black text or a picture

22
 7.2 APPLICATIONS OF E-PAPER
I. Clearly, gvat progress has been made in the field ore-paper since the invention ofGyrieon.
Companies such as E Ink, SiPix, and Polymervision, as well as such giants as Sony, IBM, Hewlett-Packard, Philips,
Fujitsu, Hitachi, Siemens, Epson, and many others, are continuing to develop e-paper technology, Founded in 1997
and based on research begun at the Massachusetts

Institute of Technology's Media Lab, E Ink developed proprietary e-paper technology that already has been
commercialized by a number ofcompanies, including iRex Technologies and Sony, both ofwhich already have
commercial e-paper readers on the market.

At this stage, some of the products based on E Ink's technology are little more than expensive gimmicks, such
as Seiko's limited-edition e-paper watch (priced at over S2.000).Other products to be marketed have more substantial
applications. E-paper thin color displays for packaging, currently under advanced development at Siemens, could
display prices on products dynamically; instantly altering product 's price When necessary (using low-power wireless
technology as radio-frequency identification, or REID, for example). A dynamic expiration date, which would
graphically display the amount of time remaining for food and drug consumption, is another potential application,

A completely different solution for creating e-paper; known as cholesteric liquid crystal
(ChLCD), is being developed by such companies as IBM and Philips, as well as HP and Fujitsu. which have
demonstrated actual devices. ChLCD technology is based on the well-known andWidespread technology of llquid
crystal displays (I-CDs), which work by applying a current to spiral-shaped liquid-crystal molecules that can change
from a vertical to a horizontal position,

Although other potential technologies for developing advanced color electronic paper exist such as Photonic
crystals (Psink) recently covered by TFOT, many analysts believe that ChLCD technology could become the dominant
e-paper technOlogy ofthe next decade, This assessment relates to the high level of maturity exemplified by the current
LCD industry; as well as to the fact that ChLCD technology currently offers what many analysts see as the ideal list
of features tor e•paper: flexibility and even bend ability; thinness, at approximately 0.8 millimeters; lightness; a bi-
stable nature, requiring no power to maintain an image and very little power to change it; good brightness, contrast,
and resolution; as well as vivid color and a decent refresh rate capable of displaying animation and possibly even
video.

2. Potential applications Of e-paper technology is staggering. In addition to a new method for labeling foods and
drugs, it could be used to label anything from shelves to office binders. One of the original uses ofthe Gyricon e-ink
was in advertising and billboards; the bi-stable nature of the technology made the Gyricon a useful and cost-effective
billboard technology, E-paper displays can also be used as low-power digital screens for a variety of electronic
appliances, from microwaves to MP3 players.

23
 Figure 10. Citizen E-JnkClock

3, Although many potential applications for e-paper technology exist, one of the more exciting products is the e-
paper reader, which may soon replace the age-old newspaper and possibly even certain types ofbooks; some
technical literature may be perfectly suited for e-paper. The next generation ore-paper readers will add color, include
improved hardware that can refresh pages more quickly, and have more advanced wireless capabilities-Existing
readers from Sony, iRex, and a number of other companies are still quite expensive and suffer from some of the
problems that plague early technology tnodels. The next generation Of Will also be flexible, making such
applications as digital maps an attractive option, especially when connected to GPS hardware and software.
Although e-paper readers like iRex's iLiad, are already equipped With wireless Internet communication, they are not
well suited as generalpurpose Web-surfing devices, Electronic readers of the future will one day become the ultimate
handheld mentioned in this article a Of potential applications for paper; it is possible that the most important
applications of this technology have not yet been invented.

7.3 FUTURE OR E-PAPER

The initial Gyrieon technology proved expensive and had poor resolution; it was really only usable in the sort
of message-board-display systems that were produced by Gyricon Media. The development Oftrue e-paper really Only
dates from about 1998, when E Ink first demonstrated their electrophoretic front plane display technology; this gave
a higher resolution and was potentially much cheaper.

Since then, Other companies, such as SiPix, have COiite out With electrophoretic display technologies. In the
last four years, we have also seen companies like HP and Fujitsu bring out flexible displays that use cholesteric LCD
technology. (Cholesterie refers to the phase ofa liquid crystal in which the molecules are aligned in a specific manner.
In Fujitsu's case, for example, up to 50 percent of incident light in specific wavelengths and colors is reflected), Epaper
has to be a Cheap, IOW power, and preferably bendable, or have display technology, and we are only just seeing the
development ofthe technologies that ean deliver this, namely an electrophoretic front plane bonded to a flexible
organic electronic backplane.
These are the displays currently on the verge of being launched by Plastic Logic and Polymer Vision,

24
 CHAPTER 8
APPLICATIONS OF FLEXIBLE ELECTRONICS
A large number of app lications have been developed including computational systems, in energy storage
and generation, health care, e-textiles etc.

Figure 11 Next Generation Flexible Electronics Systems and the Key Relevant Sectors

A. Healthcare
Flexibility in electronic materials is very attractive for medical and bioengineering. Some electronics have
been integrated into human bodies . For example ,bionic eye€ bionic ear, optic nerve ete .heat. humidity ,salt
or pressure sensor arrays can be used as bed sheet and monitor a patient real tiinee Flexible thin films could
also play a key role in deciphering the thought processes occurring in the brains,

B. Automotive Industry Intelligent roads Will be engineered With the aim of improving road safety; lowering
road congestion and energy consumption. The road and vehicle will also be able to interact dynamically. adjust
either party to energetically optimize their
Systems,
C. Displays and Human-Machine Interactivity As a user slide fingers on the surface, the applied time varying
potential includes intermittent attractive and repulsive electrostatic forces between the buried conducting layer
and the finger. This electrostatic attraction varies the normal contact forces between the user's skin and surface
and in turn, modulates the dynamic friction and touch perception.

D. Smart Textiles Recently, there is increase interest in Smart textiles for health monitoring, entertainment and
display applications. These smart textiles Can be embedded with multiple sensors and display devices for

25
 monitoring stress, toxic gases in environment. Eadll smart thread is basically a shift register with a small
display pixel and possibly a sensor ,which can be used to transfer data from one end to other.

Wireless Networking Stretchable antennas have been fabriCated using PDMS, which is usually cast on a photo-
resist mould with the desired design. The PDMS structure is then peeled away and holes introduced for
injection Ota liquid eutectic form the radiating elements. Another recently explored route ror fabrication Of
stretchable PIFA antennas uses direct deposition Of thinfilm gold onto elastomeric substrate.
F. Electronic Paper Currently, the most successful technology and industry is electronic paper, the main
applications are e-Readers, electronic shelflabels, smart cards, electronic posters and so 011 . Currently, the e-
Reader is not really flexible because it use a glass backplane. E-lnk Holdings and 'TRI includes organic
conductor and printing process, substrate is PET films which only can be processed at low temperature. ITRI
also develops a passive technology of cholesterol liquid crystal which can be manufactured using a fully roll-
to-roll technology,

26
 CHAPTER 9
CHALLENGES
There are some challenges that still need improvement.

A. Electrical Instability Reliability is critical for flexible circuit design to ensure that the circuit would operate
reliably throughout its lifetime. Thin film suffers from electrical instability, but threshold voltage shift ofa
single TFT can be modelled by analyzing its operating conditions and circuit lifetime can be predicted
accordingly using SPICE simulation,
B. Flexible Substrate Handling and Alignment The dimensional control of plastic substrate is very dilT1cult due
to temperature, humidity and tension variation, special rollto roll operation,
C. Flexible Conductor Conductivity and Work Function The operation for flexibility and conductivity are the
trade-off parameters and work always needs to modify,
D, Printing Quality The printing qualities are not easy to control due to liquid off-set or jetting operations,
special multilayer or large area film printing
E, Flexibility Operation The most practiced flexible operations like bending, folding or rolling is not easy
guarantee due to multilayer structurct Research is going on to provide reliable flexibility to the circuits.

27
 CHAPTER 10
ADVANTAGE AND DISADVANTAGE OF FLEXIBLE ELECTRONICS
ADVANTAGES

light weight
Smaller dimensions required Space saving
Foldable and bendable
Increased circuitry density
Wide Viewing Angle
DISADVANTAGES

Initiål investment may be expensive

integration of components would be challenge for engineers
Precision machines required
Lifetime
Manufacturing

28
 CHAPTER 11
FUTURE ASPECTS
Development strategy Of flexible electronics is dependent on global technology progresses and market
forecasts, The research and development is focused on big markets. Flexible electronics covers a wide spectrum of
applications including flexible display, flexible solar cell, printed RFID, flexible lighting and others, Currently, it has
been estimated that there are about 1500 worldwide research units working on various aspects of flexible electronics
Market analysis estimates the revenue of flexible electronics can reach 30 billion USD in 2017 and Over 300 USD
in 202* [19]. Region wise, the research activities in Europe cover a wide range oftopicfrom materials, process, to
system and applications. [n the US, research is primarily driven by military applications. Asian companies invest
heavily in flexible display. Today, flexible circuits which are also known around the world as flexible printed wiring.
ilex print, flexi circuits are used many products. Large credits goes to the efforts Of Japanese electronics packaging
engineers who have found a countless new ways to employ a flexible circuit technology (20]. For the last decade.
flexible circuits have remained one of the fastest growing of all interconnection product market segments. A more
recent variation on flexible circuit technology is one called flexible electronics which commonly involve the
integration Of both active and passive functions in the processing

29
 CONCLUSION

In this report. we have discussed some of the fabrication techniques. applications. challenges and future
socioeconomc trends of thin —film technology are likely to enhance the performance or the devices, Although this
field is growing and getting matured, it has been expanding rapidly and dynamically. The keys to success include
grasping the tempo, building up a complete value chain sand attracting the necessary entities to join the efforts and
cooperate. This paper gives a brief overview of how the field of flexible electronics has evolved over the years and
what the future holds for the large area, rugged, low power electronicsw Some Of the applications which can be
developed on flexible substrates have been introduced

30
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