Green

FZT869
25V NPN HIGH CURRENT TRANSISTOR IN SOT223

Features Mechanical Data

 BVCEO > 25V  Case: SOT223
 IC = 7A High Continuous Collector Current  Case Material: Molded Plastic. “Green” Molding Compound.
 ICM = 20A Peak Pulse Current UL Flammability Rating 94V-0
 Very Low Saturation Voltage VCE(SAT) < 110mV @ 1A  Moisture Sensitivity: Level 1 per J-STD-020
 RCE(SAT) = 36mΩ at 5A for a Low Equivalent On-Resistance  Terminals: Finish - Matte Tin Plated Leads.
 hFE Specified Up to 20A for a High Gain Hold Up Solderable per MIL-STD-202, Method 208 e3
 PTOT = 3W  Weight: 0.112 grams (Approximate)
 Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
 Halogen and Antimony Free. “Green” Device (Note 3)
 Qualified to AEC-Q101 Standards for High Reliability

SOT223 C

E
Top View
Top View Device Symbol Pin-Out

Ordering Information (Note 4)

Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel
FZT869TA AEC-Q101 FZT869 7 12 1,000
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.

Marking Information
SOT223

FZT 869 = Product Type Marking Code

YWW = Date Code Marking
YWW

FZT Y or Y = Last Digit of Year (ex: 7 = 2017)

869 WW or WW = Week Code (01–53)

FZT869 1 of 7 March 2017

Document Number DS33178 Rev. 4 - 2 www.diodes.com © Diodes Incorporated
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Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit
Collector-Base Voltage VCBO 60 V
Collector-Emitter Voltage VCEO 25 V
Emitter-Base Voltage VEBO 6 V
Continuous Collector Current IC 7 A
Peak Pulse Current ICM 20 A

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic Symbol Value Unit
3
(Note 5)
Power Dissipation 24 W
PD
Linear Derating Factor 1.6 mW/°C
(Note 6)
12.8
(Note 5) RθJA 42
Thermal Resistance, Junction to Ambient
(Note 6) RθJA 78 °C/W
Thermal Resistance Junction to Lead (Note 7) RθJL 8.8
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C

ESD Ratings (Note 8)

Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A
Electrostatic Discharge - Machine Model ESD MM 400 V C
Notes: 5. For a device mounted with the collector lead on 52mm x 52mm 2oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air
conditions whilst operating in steady-state.
6. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper.
7. Thermal resistance from junction to solder-point (at the end of the collector lead).
8. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

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Thermal Characteristics and Derating Information

10 VCE(sat) 3.0

Max Power Dissipation (W)

-IC Collector Current (A)

Limit
2.5 52mmX52mm
single sided 2 oz Cu
1 DC 2.0

1s 1.5
100ms
100m 10ms 1.0
Single Pulse. T amb=25°C
1ms 25mmX25mm
52mmX52mm 0.5
single sided 1 oz Cu
single sided 2oz Cu 100µs
10m 0.0
100m 1 10 100 0 20 40 60 80 100 120 140 160
-VCE Collector-Emitter Voltage (V) Temperature (°C)
Safe Operating Area Derating Curve

52mmX52mm Single Pulse. T amb=25°C

Max Power Dissipation (W)

40
Thermal Resistance (°C/W)

single sided 2 oz Cu 52mmX52mm

100
single sided 2oz Cu
30
D=0.5
20
10
D=0.2 Single Pulse
10
D=0.05
D=0.1
0 1
100µ 1m 10m 100m 1 10 100 1k 100µ 1m 10m 100m 1 10 100 1k
Pulse Width (s) Pulse Width (s)
Transient Thermal Impedance Pulse Power Dissipation

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Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic Symbol Min Typ Max Unit Test Condition

Collector-Base Breakdown Voltage BVCBO 60 120 — V IC = 100µA
Collector-Emitter Breakdown Voltage BVCER 60 120 — V IC = 1µA, RB ≤ 1kΩ
Collector-Emitter Breakdown Voltage (Note 9) BVCEO 25 35 — V IC = 10mA
Emitter-Base Breakdown Voltage BVEBO 6 8 — V IE = 100µA
50 nA VCB = 50V
Collector Cut-off Current ICBO — —
1 µA VCB = 50V, TA = +100°C
50 nA VCE = 50V, RB ≤ 1kΩ
Collector Cut-off Current ICER — —
1 µA VCE = 50V, TA = +100°C
Emitter Cut-off Current IEBO — — 10 nA VEB = 6V
300 450 — IC = 10mA, VCE = 1V
300 450 — IC = 1A, VCE = 1V
DC Current Gain (Note 9) hFE —
200 300 — IC = 7A, VCE = 1V
 100 — IC = 20A, VCE = 2V
— 35 50 IC = 0.5mA, IB = 10mA
— 67 110 IC = 1A, IB = 10mA
Collector-Emitter Saturation Voltage (Note 9) VCE(SAT) mV
— 168 215 IC = 2A, IB = 10mA
— — 350 IC = 6.5A, IB = 150mA
Base-Emitter Saturation Voltage (Note 9) VBE(SAT) — — 1.2 V IC = 6.5A, IB = 300mA
Base-Emitter Turn-On Voltage (Note 9) VBE(ON) — — 1.13 mV IC = 6.5A, VCE = 1V
IC = 100mA, VCE = 10V,
Current Gain-Bandwidth Product (Note 9) fT — 100 — MHz
f = 50MHz
Output Capacitance COBO — 70 — pF VCB = 10V, f = 1MHz
tON — 60 — IC = 1A, VCC = 10V,
Switching Times ns
tOFF — 680 — IB1 = -IB2 = 100mA
Note: 9. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.

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Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

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Document Number DS33178 Rev. 4 - 2 www.diodes.com © Diodes Incorporated
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Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT223

D
b1 Q
C

SOT223
Dim Min Max Typ
A 1.55 1.65 1.60
A1 0.010 0.15 0.05
E E1
b 0.60 0.80 0.70
b1 2.90 3.10 3.00
Gauge
Plane C 0.20 0.30 0.25
0.25 D 6.45 6.55 6.50
Seating E 3.45 3.55 3.50
Plane
L
E1 6.90 7.10 7.00
e1 b e - - 4.60
0°
-1
e 0° e1 - - 2.30
L 0.85 1.05 0.95
Q 0.84 0.94 0.89
A A1 7° All Dimensions in mm
7°

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT223
X1

Y1

Dimensions Value (in mm)

C 2.30
C1 Y2 C1 6.40
X 1.20
X1 3.30
Y 1.60
Y1 1.60
Y2 8.00
Y

X C

Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between
device terminals and PCB tracking.

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IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2017, Diodes Incorporated

www.diodes.com

FZT869 7 of 7 March 2017

Document Number DS33178 Rev. 4 - 2 www.diodes.com © Diodes Incorporated