Hardware Engineer's Guide

CONNECTORS & CABLES

ByShimiCohen
Connectors and Cables

Connector Type Pins Pinout

1 USB Type-C 24

2 HDMI A 19

3 RJ45 8P8C 8

4 PWR Jack 5.5/2.1 2–3

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Connectors and Cables

Conn Type Pins Pinout

5 Audio Jack TRS 2-4

6 DisplayPort STD 24

7 SWD 20p 20

8 SMA SMA 1

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Connectors and Cables

Conn Type Pins Pinout

9 SD Mini/Micro 8-9

10 SATA Molex 5

11 BNC 50Ω/75Ω 2

12 RS232 D-SUB 9
DB-9

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Connectors and Cables

INTERCONNECT BASICS

Electrical interconnects serve as the circulatory system of electronic hardware.

They enable power distribution, signal transmission, and data transfer between

discrete components, PCBs, and subsystems.

PRIMARY FUNCTIONS:
• Signal path establishment between processing units
• Power delivery from sources to loads
• Grounding and EMI management
• Mechanical support and positioning
• Environmental protection of electrical connections

SYSTEM IMPACT ANALYSIS:

• Interconnects directly affect system reliability
• Signal integrity degradation increases with poor interconnect design
• Cost optimization requires balanced connector selection strategies
• Maintenance accessibility depends on interconnect architecture

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Connectors and Cables

BOARD-TO-WIRE CONFIGURATIONS:
• Direct PCB termination for fixed installations
• Removable connectors for serviceable systems
• Mixed architectures for modular designs
• Hybrid power/signal distribution schemes

BOARD-TO-BOARD CONFIGURATIONS:
• Parallel PCB stacking with vertical connectors
• Perpendicular board mounting with right-angle interfaces
• Flexible circuit interconnection for dynamic assemblies
• Backplane architectures for scalable systems

WIRE-TO-WIRE CONFIGURATIONS:
• In-line splicing for harness extensions
• Junction boxes for multi-branch distribution
• Sealed connectors for harsh environment applications
• Quick-disconnect systems for field maintenance

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Connectors and Cables

LEVEL 1: COMPONENT LEVEL

• IC package interconnects (BGA, QFP, LGA)
• Passive component terminations
• Test point accessibility
• Thermal management interfaces

LEVEL 2: PCB LEVEL

• On-board trace routing optimization
• Via placement and sizing strategies
• Layer stack-up for signal integrity
• Ground plane continuity maintenance

LEVEL 3: SYSTEM LEVEL

• Inter-PCB connection planning
• Cable harness architecture design
• Connector placement optimization

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Connectors and Cables

CONNECTOR STANDARDS

D-SUB CONNECTORS:
• Standard: DA-15, DB-25, DC-37, DD-50, DE-9
• Applications: Serial, parallel, control
• Current ratings: 5A (per), 13A (max)
• Voltage ratings: 250VAC/350VDC standard

USB CONNECTORS:
• USB-A: Host-side standard connector
• USB-B: Device-side square connector
• USB-C: Reversible, HP capable (100W)
• Micro-USB: Mobile device standard
• Mini-USB: Legacy mobile applications

HIROSE CONNECTORS:
• DF Series: 7.92mm pitch, 30A rating
• GT Series: 3.0mm pitch, 3A rating
• FX Series: 1.25mm pitch, 1A rating
• HR Series: 1-2.5mm pitch, 2-3A rating

MOLEX CONNECTOR SYSTEMS:

• Mini-Fit: 4.2mm pitch (8.5A)
• Micro-Fit: 3.0mm pitch (5A)
• KK: 2.54mm pitch (3A)
• Pico-Blade: 1.25mm pitch (1A)

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Connectors and Cables

SIGNAL CONNECTORS:
• Low-level analog signals (<1V)
• Digital logic levels (3.3V, 5V, 12V)
• High-speed differential pairs
• RF and microwave applications

POWER CONNECTORS:
• DC power distribution (12V, 24V, 48V systems)
• AC mains connections (120VAC, 240VAC)
• High-current applications (>10A per contact)
• Battery interconnections

HYBRID CONNECTORS:
• Combined power and signal in single housing
• Ethernet with PoE (Power over Ethernet)
• USB with power delivery capability
• Multi-function automotive connectors

HIGH-FREQUENCY CONNECTORS:
• Coaxial connectors (SMA, BNC, N-type)
• Board-mount RF connectors
• Millimeter-wave applications
• Impedance-controlled designs (50Ω, 75Ω)

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Connectors and Cables

IP RATING SYSTEM:

IP Code Dust Protection Water Protection Typical Applications

IP44 Protected against 1mm objects Splash resistant Indoor electronics

IP65 Dust tight Water jet resistant Outdoor equipment

IP67 Dust tight Immersion to 1m Marine applications

IP68 Dust tight Continuous immersion Underwater systems

MIL-STD ENVIRONMENTAL CLASSIFICATIONS:

• MIL-STD-810: Environmental testing procedures
• MIL-DTL-38999: Circular connector specifications
• MIL-DTL-83723: Rectangular connector standards
• MIL-STD-1344: Connector reliability testing
• Mating force: 10-50N typical for manual connections
• Insertion cycles: 10-10,000 depending on application
• Vibration resistance: 10-2000Hz, 20G acceleration
• Shock resistance: 50-100G peak acceleration
• Temperature cycling: -55°C to +125°C for military applications

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Connectors and Cables

CABLE TYPES

COAXIAL CABLES:
• Single center conductor with concentric shield
• Controlled impedance (50Ω, 75Ω standard)
• Applications: RF signals, high-speed digital, video
• Construction: Center conductor → Dielectric → Shield → Jacket

Common Coaxial Types:

Cable Type Impedance Center Conductor Dielectric Applications

RG-58 50Ω 20 AWG solid Polyethylene General purpose RF

RG-6 75Ω 18 AWG solid Foam PE Cable TV, satellite

RG-213 50Ω 13 AWG stranded Polyethylene High-power RF

TWISTED PAIR CABLES:

• Balanced transmission line
• Cat5e, Cat6, Cat6A, Cat7, Cat8
• Ethernet, telephony, industrial

Twisted Pair Performance:

Category Bandwidth Max Length Crosstalk (NEXT) Applications

Cat5e 100 MHz 100m 35.3 dB @ 100MHz 1 Gigabit Ethernet

Cat6 250 MHz 100m 39.9 dB @ 100MHz 1 Gigabit Ethernet

Cat6A 500 MHz 100m 42.4 dB @ 500MHz 10 Gigabit Ethernet

Cat7 600 MHz 100m 62.1 dB @ 600MHz 10 Gigabit Ethernet

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Connectors and Cables

SHIELDED CABLES:
• Overall shield (OS): Single shield around conductors
• Individual shield (IS): Shield per conductor pair
• Combined (S/FTP): Overall + individual shields

RIBBON CABLES:
• Multiple parallel conductors in flat configuration
• Standard pitches: 0.05", 0.1", 1.27mm, 2.54mm
• Internal computer connections, test equipment

FLEXIBLE FLAT CABLES & PCB(FFC&FPC):

• Ultra-thin profile (0.1-0.3mm typical)
• High conductor density (0.5mm pitch common)
• Construction: Copper traces on polyimide

IMPEDANCE CHARACTERISTICS:
• Characteristic impedance (Z₀): Function of conductor geometry & dielectric
• Coaxial cable: 𝑍₀ = 60 × 𝑙𝑛(𝐷/𝑑) / √𝜀ᵣ
• Twisted pair: 𝑍₀ = 120 × 𝑙𝑛(2𝑆/𝑑) / √𝜀ᵣ

CONDUCTOR SIZING:
AWG Size Diameter (mm) Resistance (Ω/km) Current Rating (A) Typical Applications

30 0.255 339 0.5 Signal wires

28 0.321 213 0.8 Signal wires

26 0.405 134 1.3 Signal wires

24 0.511 84.2 2.1 Signal/low power

22 0.644 53.0 3.3 Low power

20 0.812 33.3 5.2 Medium power

18 1.024 21.0 8.2 Medium power

16 1.291 13.2 13 High current

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INSULATION MATERIALS:
• PVC: General purpose, -10°C to +70°C, low cost
• Polyethylene: Low dielectric loss, -40°C to +80°C
• PTFE (Teflon): Chemical resistance, -200°C to +260°C
• Polyimide: High temperature, -269°C to +400°C
• XLPE: Cross-linked polyethylene, improved thermal properties

JACKETING MATERIALS:
• PVC: Indoor applications, flame retardant options
• Polyurethane: Flexibility, abrasion resistance
• TPE (Thermoplastic Elastomer): Oil resistance, flexibility
• Fluoropolymers: Chemical resistance, low smoke generation

SHIELDING EFFECTIVENESS:
• Braided shield: 85-95% coverage, 20-40 dB attenuation
• Foil shield: 100% coverage, 10-30 dB attenuation
• Combination: 90-95% braid over foil, 40-80 dB attenuation
• Spiral wrap: 60-80% coverage, 10-20 dB attenuation

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Connectors and Cables

SIGNAL INTEGRITY

PROPAGATION DELAY CALCULATION:

• Velocity of propagation (𝑉𝑝) = 𝑐 / √𝜀ᵣ
• Propagation delay = 𝐿𝑒𝑛𝑔𝑡ℎ / 𝑉𝑝
• Typical values: 1.5-2.0 ns/ft for common cables
• Critical for high-speed digital systems and timing analysis

REFLECTION ANALYSIS:
• Occurs at impedance discontinuities
• Reflection coefficient: 𝜌 = (𝑍₂ − 𝑍₁) / (𝑍₂ + 𝑍₁)
• Standing wave ratio: 𝑆𝑊𝑅 = (1 + |𝜌|) / (1 − |𝜌|)
• Target: 𝑆𝑊𝑅 < 1.5 for good signal quality

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Connectors and Cables

VOLTAGE DROP CALCULATION:

• Vₐᵣₒₚ = I × R × 2 (for DC circuits, round trip)
• R = ρ × L / A (resistance calculation)
• Where: ρ = resistivity, L = length, A = cross-sectional area

CURRENT DERATING FACTORS:

Condition Derating Factor Typical Applications

Single conductor in free air 1.0 Reference condition

Cable bundle (3-6 conductors) 0.8 Harness assemblies

Cable bundle (7-24 conductors) 0.7 Multi-conductor cables

Elevated temperature (+40°C) 0.82 Engine compartments

Elevated temperature (+60°C) 0.71 Industrial ovens

POWER DELIVERY DESIGN EXAMPLE:

• Load: 5V @ 10A
• Cable length: 3 meters
• Voltage drop budget: 2% (0.1V)
• Required wire resistance: 0.1V / 10A = 0.01Ω
• 18 AWG copper: 21.0 Ω/km × 0.006km = 0.126Ω (too high)
• 14 AWG copper: 8.29 Ω/km × 0.006km = 0.050Ω (too high)
• 12 AWG copper: 5.21 Ω/km × 0.006km = 0.031Ω (marginal)
• 10 AWG copper: 3.28 Ω/km × 0.006km = 0.020Ω (acceptable)

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Connectors and Cables

SIGNAL RISE TIME IMPACT:

• Transmission line effects become significant when:
• Cable length > Vp × tᵣᵢₛₑ / 6
• For 2ns rise time: Critical length ≈ 0.3m
• Faster signals require more careful cable design

DIFFERENTIAL PAIR IMPLEMENTATION:

• Common mode rejection improves EMI immunity
• Skew matching: <10% of rise time
• Impedance matching: 100Ω ±10% typical
• Length matching: <5mm for Gbps signals

HIGH-SPEED DESIGN GUIDELINES:

Data Rate Max Skew Impedance Tolerance Length Matching

100 Mbps 1ns ±20% ±10mm

1 Gbps 100ps ±10% ±5mm

10 Gbps 10ps ±5% ±1mm

25 Gbps 4ps ±3% ±0.5mm

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PINOUT & POLARIZATION

POWER PIN PLACEMENT:

• Corner pins for mechanical strength
• Adjacent pins for high current (parallel paths)
• Center pins for sensitive analog supplies
• Separate analog and digital supply pins

GROUND PIN STRATEGY:

• Multiple ground pins for low impedance
• Ground pins adjacent to high-speed signals
• Separate analog and digital grounds
• Shield connection to chassis ground

SIGNAL PIN ASSIGNMENT:

• Differential pairs on adjacent pins
• High-speed signals away from power switching
• Critical signals with dedicated ground returns
• Test points for key signals

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ASYMMETRIC HOUSING DESIGN:

• Trapezoidal profiles prevent 180° rotation
• Chamfered corners indicate proper orientation
• Color coding for visual confirmation
• Tactile feedback for blind mating

DEDICATED KEY FEATURES:

• Plastic keys in connector housing
• Metal guide pins for alignment
• Threaded fasteners for retention
• Bayonet locks for quick connection

KEYING IMPLEMENTATION METHODS:

Keying Type Advantages Disadvantages Applications

Housing shape Low cost, Limited config Simple 2-wire connections

Removable Multiple coding Additional part Modular systems

Pin presence Many combos Manufacturing complexity High-density connectors

size Obvious diff. Space requirements Power vs signal

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Connectors and Cables

PIN 1 IDENTIFICATION:
• Square pin vs round pins
• Colored pin (red for positive)
• Larger pin diameter
• Corner pin designation

HOUSING POLARIZATION:
• Chamfered corners
• Molded alignment features
• Color-coded housings
• Arrow indicators

PCB FOOTPRINT POLARIZATION:

• Silkscreen indicators
• Square pad for pin 1
• Asymmetric hole patterns
• Reference designator placement

CABLE ASSEMBLY POLARIZATION:

• Keyed connectors on both ends
• Wire color coding standards
• Cable marking every meter
• Unique connector types per function

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Connectors and Cables

BOARD-TO-WIRE DESIGN

TERMINAL BLOCKS:
• Screw terminals for field wiring
• Spring clamps for maintenance-free operation
• Rising clamps for solid/stranded wire versatility
• Push-in terminals for quick assembly

TERMINAL BLOCK SPECIFICATIONS:

Terminal Type Wire Range Current Rating Voltage Rating Applications

Screw 2.5mm² 0.2-2.5mm² 17A 300V Control panels

Spring 4mm² 0.2-4.0mm² 32A 500V Industrial automation

Push-in 1.5mm² 0.2-1.5mm² 13A 250V Building automation

PCB mount 6mm² 0.5-6.0mm² 41A 630V Power distribution

WIRE-TO-BOARD CONNECTORS:
• Crimp contacts for reliable connections
• Insulation displacement (IDC) for mass production
• Solderless terminals for prototyping
• Combination power/signal connectors

DIRECT PCB TERMINATION:

• Through-hole solder connections
• Surface mount pad termination
• Wire bonding for fine pitch
• Mechanical strain relief requirements

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Connectors and Cables

MECHANICAL CONSIDERATIONS:
• Component height clearance
• Mating direction accessibility
• PCB thickness compatibility
• Mounting hole placement

ELECTRICAL FOOTPRINT REQUIREMENTS:

• Pad size optimization for soldering
• Thermal relief connections
• Via placement for signal routing
• Ground plane continuity

STANDARD FOOTPRINT DIMENSIONS:

Connector Family Pin Pitch Pad Size Drill Size Applications

Terminal blocks 5.0-7.5mm 2.0mm diam 1.3mm Power connections

Molex KK 2.54mm 1.6mm diam 1.0mm General purpose

JST XH 2.5mm 1.4mm diam 0.9mm Signal connections

Phoenix COMBICON 5.08mm 2.2mm diam 1.4mm Industrial control

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Connectors and Cables

PCB MOUNTING METHODS:

• Through-hole mounting for mechanical strength
• Surface mount for automated assembly
• Mixed mounting for optimal performance
• Mechanical support posts

STRESS RELIEF IMPLEMENTATION:

• Strain relief boots at cable entry
• Cable tie mounting points
• Flexible service loops
• Mechanical decoupling from PCB

MOUNTING HARDWARE:
• Threaded standoffs for panel mounting
• Snap-fit clips for enclosure assembly
• Adhesive mounting for non-critical applications
• Vibration isolation considerations

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BOARD-TO-BOARD DESIGN

HEADERS AND SOCKETS:

• Standard 2.54mm pitch for prototyping
• 2.0mm and 1.27mm for higher density
• Single and double row configurations
• Right-angle variants for space constraints

STACKING CONNECTOR SPECIFICATIONS:

Connector Type Pitch Current Rating Height Range Applications

Standard header 2.54mm 3A per pin 8-25mm Development boards

Mini header 2.0mm 2A per pin 6-20mm Compact systems

Micro header 1.27mm 1A per pin 4-15mm High-density boards

Board-to-board 0.8mm 0.5A per pin 2-10mm Mobile devices

EDGE CONNECTORS:
• Card edge design for easy insertion
• Gold-plated contacts for reliability
• Keying slots for proper orientation
• Retention mechanisms for security

MEZZANINE CONNECTORS:
• High-density parallel connection
• Controlled impedance design
• Power and signal in single connector
• Low-profile configurations available

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MATING CYCLE RATINGS:

• Development/prototyping: 50-100 cycles
• Production testing: 100-500 cycles
• Field service: 500-1,000 cycles
• High-reliability: 10,000+ cycles

INSERTION FORCE CONSIDERATIONS:

• Manual insertion: 2-10N per contact
• Tool-assisted: 10-50N per contact
• Automatic assembly: Force feedback control
• Extraction force: 50-80% of insertion force

FORCE CALCULATION:
• Total force = Contact force × Number of contacts
• Example: 50-pin @ 5N = 250N total
• Consider connector housing friction
• Design for available insertion equipment

CONTACT DENSITY OPTIMIZATION:

• 0.4-0.8mm pitch for high-density applications
• Area array contacts for maximum density
• Multi-row configurations
• Micro-miniature contact technology

SIGNAL INTEGRITY IN HIGH-DENSITY DESIGNS:

• Controlled impedance pathways
• Ground contact placement strategy
• Power distribution architecture
• EMI containment methods

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HARNESS DESIGN

CABLE BUNDLING STRATEGY:

• Group by function (power, signal, data)
• Separate high-current from sensitive signals
• Maintain consistent bundle diameter

ROUTING OPTIMIZATION:
• Minimize cable length while maintaining service access
• Avoid sharp bends and stress concentrations
• Provide strain relief at all termination points

HARNESS ARCHITECTURE TYPES:

Architecture Advantages Disadvantages Applications

Point-to-point Simple, reliable Many individual cables Small systems

Star topology Centralized control Single point of failure Automotive body control

Bus topology Efficient wiring Protocol complexity Industrial fieldbus

Hybrid design Optimized Design complexity Complex systems

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Connectors and Cables

MINIMUM BEND RADIUS GUIDELINES:

• Single conductor: 4 × cable diameter
• Multi-conductor: 6 × cable diameter
• Coaxial cable: 5 × cable diameter
• Fiber optic: 10 × cable diameter

DYNAMIC BEND RADIUS (FLEXING APPLICATIONS):

• Continuous flexing: 10-20 × static bend radius
• Cycle life dependent on bend radius
• Temperature effects on flexibility
• Stress concentration at bend points

STRAIN RELIEF IMPLEMENTATION:

• Boot-style strain reliefs for standard cables
• Cord grips for panel-mount applications
• Service loops for equipment movement
• Mechanical decoupling from connectors

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HARNESS DOCUMENTATION REQUIREMENTS:

• Schematic diagram with pin assignments
• Assembly drawing with routing details
• Cable schedule with specifications
• Test procedures and acceptance criteria

WIRE IDENTIFICATION SYSTEMS:

• Color coding per application standards
• Printed markers at regular intervals
• Heat-shrink labels for permanent marking
• Cable tags for individual identification

STANDARD WIRE COLOR CODES:

Function IPC Standard Aerospace Industrial

Power (+) Red Red Brown

Power (-) Black Black Blue

Ground Green Green Green

Signal Various Various Various

MANUFACTURING SPECIFICATIONS:
• Strip length, strand count
• Crimp specifications, pull tests
• Routing sequence, bundle diameter
• Test Continuity, isolation etc.

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TERMINATION TECHNIQUES

CRIMPING SPECIFICATIONS:
Gauge Length Force Pull Contacts

30 AWG 2-3mm 200-400N 4.5kg Micro-miniature

26 AWG 3-4mm 400-800N 6.8kg Signal

22 AWG 4-5mm 800-1200N 11.3kg Power

18 AWG 5-6mm 1200-2000N 18.1kg Hi-Current

QUALITY FACTORS:
• Wire preparation: Proper strip length, strand control
• Crimp tool calibration: Force and dimensional control
• Contact selection: Wire gauge compatibility
• Inspection criteria: Visual and dimensional checks

SOLDERING TECHNIQUES:
• Thermal connection with metallurgical bond
• Flux selection for oxidation prevention
• Temperature and time control
• Joint inspection and rework procedures

SOLDER JOINT QUALITY:

• Wetting angle: <90°
• Fillet formation: Concave profile
• Intermetallic layer: 1-3μm thickness
• Void content: <25% for reliability

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CONNECTOR SELECTION

VOLTAGE RATINGS:
• Working voltage: Maximum continuous operating voltage
• Withstand voltage: Short-term overvoltage capability
• Breakdown voltage: Insulation failure threshold
• Altitude derating: Voltage reduction at high altitude

CURRENT RATINGS AND DERATING:

• Continuous current: Steady-state capability
• Peak current: Short-term overload capability
• Temperature derating: Current reduction at elevated temperature
• Contact resistance: Voltage drop at rated current

CURRENT DERATING FACTORS:

Ambient Temperature Derating Factor Altitude Derating Factor

+23°C 1.00 Sea level 1.00

+40°C 0.90 3,000m 0.95

+60°C 0.75 6,000m 0.85

+80°C 0.60 10,000m 0.70

INSULATION RESISTANCE:
• Minimum values: 1000 MΩ for low-voltage applications
• Environmental effects: Humidity, contamination
• Measurement conditions: Standard test voltage and time
• Aging effects: Degradation over time

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TEMPERATURE PERFORMANCE:
• Operating temperature range
• Storage temperature range
• Thermal shock resistance
• Thermal cycling endurance

VIBRATION AND SHOCK RESISTANCE:

• Sine wave vibration: Frequency and amplitude
• Random vibration: Power spectral density
• Shock resistance: Peak acceleration and duration
• Mechanical resonance considerations

CHEMICAL RESISTANCE:
• Fluid compatibility: Oils, solvents, cleaning agents
• Corrosion resistance: Salt spray, acidic environments
• Outgassing: Space and medical applications
• UV resistance: Outdoor applications

ENVIRONMENTAL TEST STANDARDS:

Test Parameter Test Standard Typical Requirements

Temperature cycling IEC 60068-2-14 -40°C to +85°C, 100 cycles

Humidity IEC 60068-2-78 85°C, 85% RH, 1000 hours

Vibration IEC 60068-2-6 10-2000Hz, 10G, 2 hours

Shock IEC 60068-2-27 50G, 11ms duration

Salt spray IEC 60068-2-11 5% NaCl, 96 hours

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