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MOSFET

This document discusses two types of MOSFETs - depletion-type and enhancement-type. Depletion-type MOSFETs can operate in depletion or enhancement mode, while enhancement-type only operates in enhancement mode. The construction and operation of n-channel and p-channel MOSFETs are described. MOSFETs require special handling due to their static sensitivity.
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0% found this document useful (0 votes)
130 views17 pages

MOSFET

This document discusses two types of MOSFETs - depletion-type and enhancement-type. Depletion-type MOSFETs can operate in depletion or enhancement mode, while enhancement-type only operates in enhancement mode. The construction and operation of n-channel and p-channel MOSFETs are described. MOSFETs require special handling due to their static sensitivity.
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MOSFETs

MOSFETs have characteristics


similar to JFETs and additional
characteristics that make then
very useful.

There are 2 types:


1. Depletion-Type MOSFET
2. Enhancement-Type MOSFET
Depletion-Type MOSFET
Construction

The Drain (D) and Source (S) connect to the to n-doped regions. These N-doped
regions are connected via an n-channel. This n-channel is connected to the Gate (G) via
a thin insulating layer of SiO2. The n-doped material lies on a p-doped substrate that
may have an additional terminal connection called SS.
Depletion-Type MOSFET Construction
• VGS is set to 0V by the direct
connection from one terminal to the
other.
• VDS is applied across the drain-to-
source terminals.
• The result is an attraction for the
positive potential at the drain by the
free electron of the n-channel and a
current similar to that established
through the channel of the JFET.
• In the figure, VGS has been set at a
negative voltage (-1V)
Depletion-Type MOSFET Construction
• Negative potential at gate will tend to pressure
electron towards the p-type substrate and
attract holes from the p-type substrate.
• Depending on negative bias established by
VGS, a level recombination between
electron and hoes will occur.--- it will
reduce the number of free electron in the n-
channel available for conduction.
• The more negative bias, the higher the rate
of recombination
• ID decrease, negative bias for VGS increase
Basic Operation
A Depletion MOSFET can operate in two modes: Depletion or Enhancement mode.
Depletion-type MOSFET in Depletion Mode

Depletion mode
The characteristics are similar to the JFET.
When VGS = 0V, ID = IDSS
When VGS < 0V, ID < IDSS
The formula used to plot the Transfer VGS 2
Curve still applies: ID  IDSS (1 )
VP
Depletion-type MOSFET in
Enhancement Mode

Enhancement mode
VGS > 0V, ID increases above IDSS
The formula used to plot the
VGS 2
Transfer Curve still applies: ID  IDSS (1 )
VP
(note that VGS is now a positive polarity)
p-Channel Depletion-Type MOSFET
The p-channel Depletion-type MOSFET is similar to the n-channel except
that the voltage polarities and current directions are reversed.
Symbols
Enhancement-Type MOSFET
Construction

The Drain (D) and Source (S) connect to the to n-doped regions.
These n-doped regions are connected via an n-channel. The
Gate (G) connects to the p-doped substrate via a thin insulating
layer of SiO2. There is no channel. The n-doped material lies
on a p-doped substrate that may have an additional terminal
connection called SS.
Enhancement-Type MOSFET Construction
• VGS=0, VDS some value, the absence of an n-channel will result in a current
of effectively 0A
• VDS some positive voltage, VGS=0V, and terminal SS is directly connected
to the source, there are in fact 2 reversed-biased p-n junction between the
n-doped regions and p substrate to oppose any significant flow between
drain and source.
• VDS and VGS have been set at some positive voltage greater than 0V,
establishing the D and G at a positive potential with respect to the source
• The positive potential at the gate will pressure the holes in the p substrate
along the edge of the SiO2 layer to leave the area and enter deeper regions
of the p-substrate
• The result is a depletion region near the SiO2 insulating layer void of holes
Enhancement-Type MOSFET Construction
• The electrons will in the p substrate will be attracted to
the +G and accumulate in the region near the surface of
the SiO2 layer
• The SiO2 layer and its insulating qualities will prevent
the negative carriers from being absorbed at the gate
terminal
• VGS increase, the concentration of electrons near the
SiO2 surface increase until eventually the induced n-
type region can support a measurable flow between D
and S
• The level of VGS that results in the significant increase
in drain current is called the threshold voltage, VT.
• VGS increase beyond the VT level the density of the
carriers in the induced channel will increase and I D also
increase
Enhancement-Type MOSFET Construction
• If VGS constant and increase the level
of VDS, ID will eventually reach a
saturation level as occurred for the
JFET
• Applying Kirchoff’s voltage law to
the terminal voltage of the MOSFET
VDG = VDS- VGS
• If VGS fixed at some value, 8V, VDS
increased from 2 – 5V, the VDG will
drop from -6V to -3V and the gate
will become less and less positive
with respect to the drain
Enhancement-Type MOSFET Construction
The Enhancement-type MOSFET only operates in the enhancement mode.

VGS is always positive


As VGS increases, ID increases
But if VGS is kept constant and VDS is
increased, then ID saturates (IDSS) V Dsat  VGS VT
The saturation level, VDSsat is reached.
Enhancement-Type MOSFET Construction

To determine ID given VGS: I D  k (VGS VT ) 2

where VT = threshold voltage or voltage at which the MOSFET turns on.


k = constant found in the specification sheet. k can also be determined by using
ID(on)
values at a specific point and the formula: k
(VGS(ON)  VT) 2
VDSsat can also be calculated: V Dsat  VGS VT
p-Channel Enhancement-Type MOSFETs
The p-channel Enhancement-type MOSFET is similar to the n-
channel except that the voltage polarities and current directions
are reversed.
MOSFET Handling
• MOSFETs are very static sensitive. Because of the very thin
SiO2 layer between the external terminals and the layers of the
device, any small electrical discharge can stablish an
unwanted conduction.

Protection:
• Always transport in a static sensitive bag
• Always wear a static strap when handling MOSFETS
• Apply voltage limiting devices between the Gate and Source, such
as back-to-back Zeners to limit any transient voltage.

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