ESD Control Experts

Electrical Overstress (EOS) and

Electrostatic Discharge (ESD) Event
© 2015 Desco Industries Inc. StaticControl.com
Agenda

• EOS/ESD Basics

• EOS/ESD Instrumentation

• Applications
EOS/ESD Basics
 EOS ESD

Fig 2: Transistor failure caused by Fig 3: ESD damage/short between

electrical overstress damage across the Emitter/Collector regions on a device.
die
Electrical Overstress (EOS)
EOS
Note – EOS
will be EMI

influenced by ESD EMF

Static
all signals Field

RFI E-
RFT
Field
Induced
Voltage
H-
Surge
Field

© 3M 2014. All Rights Reserved.

Important Terms
• EOS: Electrical Overstress
• Static Field: Electrostatic Field
• Induced Voltage: Voltage induced into the board or
component by contact
• ESD: Electrostatic Discharge
• EMI: Electromagnetic Interference
• EMF: Electromagnetic Field
• E-Field: Electric Field
• RFI: Radio Frequency Interference
• EFT: Electronics Fast Transients
• H-Field: Magnetic Field
• Surge: A sudden, sharp increase of electric current or
voltage in a circuit
What is Electrical Overstress (EOS)?

• EOS (Electrical
Overstress) is the
exposure of a
component or PCB
board to a current
or voltage beyond
its maximum
ratings. This
exposure may or Fig 4: EOS on a damaged RS232C transceiver
may not result in a
catastrophic failure.
How is Static Generated?

-
- -
- -
- -
+ +
+ +
+
+
Contact and Separation of +
Materials

© 3M 2014. All Rights Reserved.

What is Induced Voltage?

• Refers to voltage
being induced into
the board or
component by
contact, resulting in
current transfer
through the
component or Fig 5: Current flow resulting from Induced
Voltage
board.
What is Electrostatic Discharge (ESD)?

• ESD is a rapid, spontaneous

transfer of electrostatic charge
induced by a high electrostatic
field through a spark between
two bodies at different
electrostatic potentials as they
approach or are separated
from one another.
• There are three different ESD
models identified by the
standards presently:
− Charge Device Model (CDM)
− Machine Model (MM)
− Human Body Model (HBM)
Fig 6: ESD damage to a bi-polar
transistor
What is Electromagnetic Interference (EMI)?

• Electromagnetic
Interference is a
disturbance that
affects an electrical
circuit, due to either
electromagnetic
induction or
electromagnetic
radiation emitted from
Fig 7: Electromagnetic Interference
an external source.
What is Electromagnetic Field (EMF)?

• Electromagnetic Field is
a physical field produced
by electrically charged
objects. It affects the
behavior of charged
objects in the vicinity of
the field. The
electromagnetic field
extends indefinitely
Fig 8: Electromagnetic Field
throughout space. from a Cell Phone
What is Electric Field (E-Field)?

• Electric field
surrounds electrically
charged particles.
 Electric field exerts
a force on other
electrically charged
objects.

Fig 9: Electric Field from

positive and negative charge
What is Radio Frequency Interference (RFI)?

• Radio Frequency
Interference (RFI) refers
to the noise caused by
other Radio Frequency
that interferes with
information being
transmitted.

Fig 10: TDMA mobile phone caused false readings

in sensor of magnetic head tester and finally caused
error message after failing several good GMR
heads
What is Electrical Fast Transient (EFT)?

• An Electrical Fast
Transient event is a
short-lived burst of
energy in a system
caused by a sudden
change of state. The
source of the transient
energy may be an
internal event or a nearby
event.

Fig11: Single and bursts of EFT

What is a Magnetic Field (H-Field)?

• A magnetic field is a field

of force produced by
moving electric charges.
 Electric and magnetic
fields are two interrelated
aspects of a single
object, called
the electromagnetic field. Fig12: Magnetic Field penetrating a
superconductor
What is a Power Surge?

• A Power Surge is an
unexpected, temporary,
uncontrolled increase in
current or voltage in an
electrical circuit. Heavy
electrical equipment
being cycled on/off is
the most common cause
of power surge.

Fig 13: Power Surge and its effect

SCS Products Used for Each Parameter

• EOS: SCS Iron Man Plus Workstation Monitor

• Static Field: SCS Air Ionizer Tester/Field Meter and Charger 718 or
SCS EM Aware TNG ESD Event Monitor
• Induced Voltage: (from ground) SCS Ground Pro Ground Integrity
Meter, SCS Ground Master, and (by contact) SCS Charge
Analyzer/Charge Monitor 711
• ESD: EM Aware TNG ESD Event Monitor, SCS EM Eye Meter,
SCS ESD Pro Event Indicator
• EMI: EM Eye Meter
• EMF: EM Eye Meter
• E-Field: EM Eye, ScanEM-C
• RFI: EM Eye Meter
• EFT: EM Aware TNG ESD Event Monitor, EM Eye Meter
• H-Field: ScanEM-C
What Constitutes a Safe EOS/ESD Environment?

• The ultimate goal of an EOS/ESD program is to minimize EOS/ESD

exposure to components and its influence on the process.
• Without closed-loop control, the success of an EOS/ESD program
is always uncertain.
• Most current ESD controls are centered on performance of
individual components of ESD protection, such as grounding,
ionizers, materials, etc.
• If EOS/ESD occurred in your environment, performance of
individual protection components is lacking.

AN EOS/ESD Program is Only As Strong as its Weakest Link...

It Is Imperative to Address All Potential Areas of Damage
What Constitutes a Safe EOS/ESD Environment?

• The Most
A Safe EOS/ESD
Ionizers
+ Environment is One
• The Best Ground Where There is No
EOS/ESD Exposure
+ to Sensitive
• Everyone Wearing Wrist Straps Environments. This
+ Requires a Holistic
Approach.
• Compliance with ESD Standards

It is Important to Address Each Component of EOS/ESD Control…

It is Equally Important to Monitor Your EOS/ESD Environment
EOS/ESD Instrumentation:
Managing Your EOS/ESD
Environment by Results
Detecting EOS/ESD Events in Your Production

• Identify and measure EOS and ESD

• Instrumentation helps ensures compliance
• Products used:
− SCS Iron Man Plus Workstation Monitor
− SCS EM Aware TNG ESD Event Monitor
Starter Kit
− SCS EM Eye Meter
− SCS ESD Pro Event Indicator
SCS Iron Man™ Plus Workstation Monitor

• Monitors:
− Electrical Overstress on the
grounded board
− Dissipative Ground (bench mat)
− Operator Resistance and Body
Voltage
• Advantages:
− Ensures compliance with EOS
levels
− Operator Body Voltage
measurement
− 10^9 Mat resistance Set GNDIron Mat
U.S. Pat. 6,930,612
measurement
− Small and easy to use
SCS EM Aware TNG ESD Event Monitor

• Monitors:
− Electrostatic Discharge (ESD)
− Static Field or Ionization Balance
− Ionization Decay
• Advantages:
− Measures all parameters through one antenna
− Rejects non-ESD EMI events
− LCD display for easy local viewing
− MODBUS or 4-20mA output to FMS
− Software available for characterization of ESD Events
− Small footprint and Joystick for ease of use
− Used for continuous monitoring of ESD, Static Field
and Ionization Decay of production environment
3M™ EM Aware TNG ESD Event Monitor Starter Kit

• Diagnostic/Audit Tool:
− ESD
− Static Field or
Ionization Balance
− Ionization Decay

• Advantages:
− Measures multiple points (up to 6 units)
− Complete with data acquisition and software for recording
− Used as ESD diagnostic tool for different applications
− Supplies factual data during Diagnostic and ESD Audit
ESD Audit: Going by the Facts

ESD Audit Report ESD Audit Report

• Assumptions • Facts
− Wrist straps  − 12 ESD Events stronger
− Ground  than 200V CDM observed
− Ionizers  at tool # 5 during 8 hrs.
− Dissipative floors  shift
− Dissipative garments  − Maximum strength of ESD
− Static voltage levels  Event was 550V CDM
− Gloves  − ESD Events were
− Tweezers  correlated with new
− Packaging  materials arrival and
− Shelving  handling
− Correction and verification
to follow immediately
SCS EM Eye Meter

• Measuring Instrument:
− Electrostatic Discharge (ESD) – CDM, HBM, MM
− Electromagnetic Field (EMF)
− RF Signal
• Advantages:
− Portable, light weight, touch screen
− Open platform – use specific sensor for
specific parameter.
− Used as ESD diagnostic instrument
− Rejects non-ESD EMI events
− Supplies factual data during ESD Audit
− Uses directional antenna or remote antenna
− Supplied with Calibration Certificate
SCS ESD Pro ESD Event Indicator

• Diagnostic Tool:
− Electrostatic Discharge (ESD)
• Advantages:
− ESD Indicator
− Displays strength of ESD Event
− Used as ESD diagnostic tool for different
application
− Supplies factual data during ESD Audit
− Portable and easy to use
− Rejects non-ESD EMI events
Identifying Root Causes
At the Application Level
Finding the Root Causes of EOS/ESD

• Identify the Application Where EOS/ESD Events

are Being Created
• For Example…
− SMT Line
− Soldering
− Printer
− Repair
− Functional Test (Manual or Automatic Testing)
− Manual Applications

Must Know Where to Look…

3M Expertise and Technology Can Help
EMI influence on EOS

• Common Mode and Differential mode signals

• Powerful Linear Servo-Motors used to move feeders or
robotic arms on an Automated tool

No filter Servo
I=1.562 Filter
A I=0.0069A
IC Handlers

• Discharges Happen When:

− IC is picked up from the input tray
− IC is placed in the input shuttle
− IC is placed in the test socket
− IC is lifted from the test socket
− IC is placed in the exit shuttle
− IC is placed in the output tray
 Pick and Place

• Discharges Happen When:

− IC is picked up from the tape and reel
− IC is picked up from the tray
− IC is placed on the board
Mechanism of EOS/ESD Damage in Handlers
or Pick & Place

This Scenario Covers the

Discharge Resulting from
Io n iz e r
the Tribocharging of
Encapsulation of the IC

Io n iz e r
a tte m p ts to
d is s ip a te
c h a rg e o n th e
IC

IC is b e in g
m oved

T r ib o c h a r g e is
c r e a te d o n th e IC
w h e n IC is lifte d
IC r e ta in s
s ig n ific a n t D is c h a r g e w h e n IC
c h a rg e to u c h e s th e s u rfa c e
Soldering and Soldering Extract

• CDM or CBE Discharges Happen When:

− Board travels and touches a grounded
soldering wave
− Soldering tip touches the component or the
board
− Solder touches the board
− Component separation from board during
extract application
Data Received from Wire Bonding

Wire Bonder ESD

pattern with the same
spacing during
production.

Dual ESD Event other then

Wire Bonder pattern during
production.
Data Received from Multitester

• ESD Events Detected At:

− Multitest #6
Dispenser
− Multitest #6 Q-Test
• The lowest ESD Event
detected on channel 1
was 38V CDM and the
highest ESD Event
detected on channel 1
was >500VCDM
• The lowest ESD Event
detected on channel 3
was 19V CDM and the
highest ESD Event
detected on channel 3
was 240VCDM
• Static Voltage is higher
at the Q-Test area
• Static Voltage at the
dispenser area is
normally low with the
When operator is not testing the chips exception when parts are
put in the dispenser
no ESD Events are detected in the area
Safe EOS/ESD Environment Based on Results

• All EOS/ESD Protective Measures are

Designed to Prevent EOS/ESD Events
• By Managing EOS/ESD by Protective
Measures, You ASSUME that Your
EOS/ESD Problems are Solved
• By Monitoring Your Environment and
Managing EOS/ESD by End Results, You
KNOW that EOS/ESD Problems are Solved
SCS Products & Services: Putting it All Together

• Products
− Instrumentation for monitoring and detection of ESD/EOS events
− Workstation Products for prevention of ESD/EOS events during mfg
− Bags for prevention of ESD/EOS events during transit

• Services
− Step 1: Audit/Assessment of facilities by certified SCS ESD/EOS
expert
− Step 2: Detailed in-person training for your ESD managers and
coordinators
− Step 3: High-level training for operators and managers
− Step 4: Continuous monitoring and support by SCS ESD/EOS
experts

SCS is Not Just a Supplier, but a Collaborator…

…And Your Competitive Advantage