VLSI & Microelectronics

Paper Code:EC601
(Module 1 : Lecture 1)
Intended Audience : B-Tech (ECE) , 3rd Year, (Section :A+B) , 6th Sem
Dr. Surajit Bari
Assistant Professor , ECE Department ,Narula Institute of Technology, An Autonomous
Institute Under JIS Group , Affiliated to MAKAUT, WB

Ph.D.(Tech-MAKAUT,WB) , M-Tech (JU), B.E.(BU)

MIEEE(CAS , EDS) ,MIEI
E-mail: surajit.bari@nit.ac.in , Mob No. 8240925284/9432128450
VLSI & Microelectronics

Module 1 : Lecture 1
Introduction
 Outlines

 About the Course

 Prerequisite
 Course Layout
 Course Outcomes (COs)
 Programme Outcomes (POs)
 Program Specific Outcomes (PSOs)
 Mapping of COs with POs and PSOs
 Conclusions
 Book and References
 About the Course

 VLSI & Microelectronics is one of the professional core(PC) course of the Programme B-Tech in
Electronics & Communication Engineering

 The course dealing with the design of Integrated Circuits (ICs) and it fabrication steps

 What is IC ? : Integrated circuit is a miniature low cost electronic circuits where active
components(like- transistors) and passive components (like-resistors , capacitors) are connected
together irreparably in a single die or wafer

 Wafer is a substrate material usually made of crystalline Silicon for wide applications . However
some other material like Ge , GaAs can also be used for wafers for some specific applications

 The acronym : VLSI stands for Very Large Scale Integration

 About the Course

 Now a day’s ,more than a million of components are integrated in VLSI chip

 Microelectronics Technology dealing with the fabrication of integrated circuits over the wafers

 Micro order or 1 micron =

 That mean Microelectronics dealing with the devices whose dimensions are of the order of
micron

 To realize micron ,one example : the diameter of human hair is around 100 micron. Therefore
components inside the ICs are not visible. With the help of ultra or ultrasonic microscope the
components can be viewed

 However recent electronics is based on nano dimension . 1nm= m

 About the Course

 Progression of present society stands on computations

 People are expecting maximum throughput from computations

 To meet this maximum throughput from a system high speed low power VLSI circuits
are very essentials

 Now a day’s VLSI circuits are used every where : microprocessors in a personal
computer or workstation, chips in a graphic card, digital camera or camcorder, chips in a
cell phone or a portable computing device, embedded processors in an automobile ,
navigations , medical applications , wired or wire-less communication , defence and
military applications e.t.c
 About the Course

 The course VLSI & Microelectronics will help students to accrue knowledge to design
VLSI circuits in digital and analog domain for such applications

 The objectives to design VLSI circuits are miniaturization of systems ,low power
consumption , high speed operation and reduction of the cost of ICs

 Through this course ,Students /Participants able to design VLSI circuits with low
power and high speed

 In addition, Participants will be familiarized with the fabrication steps of ICs

 Moreover this course helps student to get job in IC design industry in India and aboard
 About the Course

 Intended Audience : B-Tech (ECE) , 6th Sem

 Type of the Course : Professional Core
 Course Level : Under Graduate
 Prerequisite

 To understand the course , the basic concepts of MOSFETs , Digital

Electronics and Analog Electronics is sufficient
 Course Layout

 There are 5 Modules in the course , Credit :3, Contact Hours Per Week :3

 Around 36 Lectures would be delivered to cover the entire syllabus of the course

 On an average, one assignment(online/off line) per module would be given for formative
assessment for Cumulative Internal Evaluation (CIE)

 Two slot/class test would also be conducted ( online/off line mode) for CIE

 Moreover for group activity , quiz and presentation on particular topic would also be arranged
regarding formative assessment

 For summative assessment, Semester End Examination(SEE) would be conducted in usual manner
 Course Layout

Module –I: Introduction to IC

Integrated Circuits – Advantages, disadvantages , limitations ; Scale of Integration – SSI ,MSI ,LSI,VLSI
,ULSI ; Moor’s Law ; Scaling of MOSFET-Constant field scaling and constant voltage scaling , Short
Channel Effects; VLSI design flow, Y-Chart , IC Classification –Standard IC and ASIC , FPGA
Architecture, PAL ,PLA

Module-II : Digital VLSI Circuit Design

Inverter Characteristics (2L):Resistive load inverter – Voltage transfer characteristics(VTC,

significance of parameters(only expression , no derivation) –VIL , VIH , VOL , VOH , Vth ;CMOS
inverter - VTC , Noise margin and aspect ratio of symmetric CMOS inverter.

Combinational Logic Circuit Design : Circuit design using Static CMOS style –basic gates , design of
circuit for product of sum(POS) and sum of product (SOP)expression, Complex logic circuit , full
adder , Circuit design using pseudo NMOS logic ,DCVSL Logic , TG Logic , Pass Transistor Logic ,
Complementary pass transistor logic ,Dynamic logic , domino logic , NORA logic .
 Course Layout

Sequential Circuit and Semiconductor Memory Design : Bistable Circuit -Design of CMOS S-R & J-K Latch,
CMOS Clocked SR & JK Latch /Master –slave JK Flip-flop, CMOS D Flip-flop ; 6T SRAM cell and 3T DRAM cell
design

Module-III: Analog VLSI Circuit Design

Small Signal model of MOSFET; Analog sub-circuits -MOS Switch , Active resistors/MOS Diode , Current source
and Sink ,Current Mirror ; Current and voltage references-voltage divider , MOS equivalent of P-N junction
Voltage reference , Threshold voltage reference , Band gap reference (Basic Principle) ; Switch-Capacitor
Circuit – resistance emulation of series , parallel and series-parallel circuit , Switch capacitor integrator and
filter (1st orderonly) ;CMOS differential amplifier – design parameters ;Output amplifier (basic circuit) ; Two-
Stage CMOS OP-AMP design .

Module –IV: Layout Design Rules and Fabrication Steps of ICs Micron and lambda design rules ; Stick diagram
and Layout - CMOS Inverter , NAND and NOR gate ; Fabrications steps of IC – Wafer preparation , Oxidation ,
photolithography ,etching , diffusion , ion-implantation , metallization and packaging . CMOS N-Well
Process,overview of P-well and twin-tub process .
 Course Layout

Module-V: Introduction to Low Power and High Speed VLSI Circuit

Design
Dynamic power, short circuit power and leakage power in CMOS
Inverter; Timing parameters(concept only) –Critical path ,arrival time ,
slack , skew ,set-up time ,hold time , gate delay and path delay, delay
time expression of CMOS inverter(expression only),Adiabatic logic
(basic concept)
Course Layout
 Course Outcomes (COs)

CO1: Able to describe scale of integration – SSI, MSI, LSI, VLSI, Moor’s Law, scaling, short
channel effect, VLSI design flow, FPGA architecture and construct gate level circuit with PAL &
PLA concept.

CO2: Able to analyse CMOS inverter voltage transfer characteristics with the parameters – V IL ,
VIH , VOL , VOH , Vth and based on the knowledge of digital circuit design methodology like –
CMOS , Pass transistor , TG , DCVSL , dynamic logic , NORA , able to construct schematic of
combinational , sequential circuit , SRAM , DRAM cell using MOSFET

CO3: Based on the fundamental concept of MOSFET characteristics and model , able to calculate
value of resistance of current source ,MOS diode , current of current mirror circuit , voltage of
references (voltage divider , threshold voltage and band gap ), the value of parameters to design
CMOS differential amplifier and two stage OP-AMP , emulate resistance of switch capacitor
circuit , gain of switch capacitor integrator and 1st order switch capacitor filter
 Course Outcomes (COs)

CO4: Able to describe fabrication steps of IC and construct stick diagram & layout
of CMOS inverter and basic gates based on lambda and micron design rules

CO5: Able to calculate gate delay, dynamic power, short circuit power and leakage
power and total power consumption across CMOS inverter circuit based on the
derived expression of delay and power
 Programme Outcomes (POs)

1.Engineering knowledge: Apply the knowledge of mathematics, science, engineering fundamentals,

and an engineering specialization to the solution of complex engineering problems.

2.Problem analysis: Identify, formulate, review research literature, and analyze complex engineering
problems reaching substantiated conclusions using first principles of mathematics, natural sciences,
and engineering sciences.

3. Design/development of solutions: Design solutions for complex engineering problems and design
system components or processes that meet the specified needs with appropriate consideration for
the public health and safety, and the cultural, societal, and environmental considerations.

4.Conduct investigations of complex problems: Use research-based knowledge and research

methods including design of experiments, analysis and interpretation of data, and synthesis of the
information to provide valid conclusions.
 Programme Outcomes (POs)

5. Modern tool usage: Create, select, and apply appropriate techniques, resources, and modern
engineering and IT tools including prediction and modeling to complex engineering activities with an
understanding of the limitations.

6. The engineer and society: Apply reasoning informed by the contextual knowledge to assess
societal, health, safety, legal and cultural issues and the consequent responsibilities relevant to the
professional engineering practice.

7. Environment and sustainability: Understand the impact of the professional engineering solutions
in societal and environmental contexts, and demonstrate the knowledge of, and need for
sustainable development.

8. Ethics: Apply ethical principles and commit to professional ethics and responsibilities and norms
of the engineering practice.
 Programme Outcomes (POs)

9. Individual and team work: Function effectively as an individual, and as a member or leader in
diverse teams, and in multidisciplinary settings.

10. Communication: Communicate effectively on complex engineering activities with the engineering
community and with society at large, such as, being able to comprehend and write effective reports
and design documentation, make effective presentations, and give and receive clear instructions.

11. Project management and finance: Demonstrate knowledge and understanding of the engineering
and management principles and apply these to one’s own work, as a member and leader in a team, to
manage projects and in multidisciplinary environments.

12. Life-long learning: Recognize the need for, and have the preparation and ability to engage in
independent and life-long learning in the broadest context of technological change
 Program Specific Out Comes (PSO)

PSO1: Ability to Identify, Formulate & Solve problems of basics of Electronics &

Communication Engineering and to apply them to various areas like Analog &
digital Circuits, Signal & systems, Communication, VLSI, Embedded System etc.

PSO2: Ability to design the systems of Electronics & Communication Engineering

using advanced hardware and software tools with analytical skills to achieve the
Societal needs.

PSO3: Knowledge of social & environmental awareness along with ethical

responsibility to achieve a successful career addresses the real world applications
using optimal resources as an entrepreneur.
 Mapping of COs with POs
COs PO1 PO2 PO3 PO4 PO5 PO6 PO7 PO8 PO9 PO10 PO11 PO12
CO1 2 2 3 1 1 - - 1 2 1 1 2

CO2 3 3 3 3 1 - - 1 2 1 1 3

CO3 3 3 3 2 1 - - 1 2 1 1 3

CO4 3 3 3 1 1 - - 1 2 1 1 3

CO5 3 3 3 2 1 - - 1 2 1 1 2

CO 3 3 3 2 1 - - 1 2 1 1 3
 Mapping of COs with PSOs
COs PSO1 PSO2 PSO3

CO1 3 3 -

CO2 3 3 -

CO3 3 3 -

CO4 3 3 -

CO5 3 3 1

CO 3 3 1
 Conclusion

 Present society needs three things from Engineers

 Engineers should have Knowledge , Skill and Pleasant Attitude

 Therefore you are advised to accrue knowledge , develop skill and attitude through
different courses of programme

 All the students/participants are advised to actively involved in the course VLSI &
Microelectronics to accrue knowledge and develop skill for the design of high density
integrated circuit for low-power and high-speed applications

 Enjoy the course

 Best wishes for happy learning

 Book and References
1. VLSI Design, Debaprasad Das, Oxford University Press
2. Digital Integrated Circuit, J.M. Rabaey, Chandrakasan, Nicolic, Pearson
Education.
3. CMOS Digital Integrated Circuits Analysis and Design, S.M. Kang & Y.
Leblebici, TMH.
4. CMOS Analog Circuit Design, Allen & Holberg, Oxford
5. Design of Analog CMOS Integrated Circuits, Behzad Razavi
6. Microelectronic Circuits, Sedra & Smith, Oxford
7. Introduction to VLSI Circuits and System, Uyemura, Wiley
8. VLSI Design and EDA Tools, Angsuman Sarkar, Swapnadip De, C.K. Sarkar,
SciTech
9. VLSI Design Techniques for Analog and Digital Circuits, Geiger, Allen,
Strader, TMH
 Book and References
• Online References :NPTEL Lectures
Thank You