Introduction

Itcan be shortly called as PCB. PCB is a non

conductive substrate that mechanically
supports and electrically connects the
electronic components using tracks, pads and
other features etched on a laminated copper
sheet.
A PCB populated with electronic components is
called a printed circuit board assembly (PCBA)
PCBs can be a Single-sided (one copper layer),
Double-sided (two copper layers) and
Multilayer.
Instead of copper sometimes the conducting
material like aluminum, silver and Ni used.
ADVANTAGES OF PCB

Compact Size and Saving of Wire

Ease of Repair and Diagnostic
Saving of Time
Immune to Movement
Tight connections and Short
Circuits Avoided
Low Electronic Noise
Low Cost
Disadvantages of Printed
Circuit Boards
As the copper tracks are very
thin they can able to carry less
current hence a PCB cannot be
used for heavy currents because
in that case the strips will be
heated up and cause problems.
Soldering needs precautions on
the risk of strips being over
heated and destroyed are always
there.
Material in PCB:-
SUBSTRATE:-
The circuit board substrates are usually
dielectric composite materials.
The composites contain a matrix
(usually an epoxy resin) and a
reinforcement (usually a woven,
sometimes nonwoven, glass fibers,
sometimes even paper), and in some
cases a filler is added to the resin (e.g.
ceramics; titanate ceramics can be used
to increase the dielectric constant).
TYPES OF PCB:-
1. Single Layer PCB:-
2. Double Layer PCB:-
3. Multi Layer PCB:-
1)Single Layer PCB:-
Single layered boards have the
electronics components mounted on
the opposite side of the board where
the copper traces are exposed.
The conductive paths or traces were
created with the copper foil on one side
of the board and components located
on the opposite side.
PCB with non-plated through holes are
of course less expensive and take less
time to manufacture.
2) Double Layer PCB:-
Circuit boards can be single-
sided, but more often are double
– sided with copper circuit trace
and components on the side.
Surface mount technology allows
more components and circuits to
be placed on the same PCB since
they are attached on both sides
of the board.
In high volume manufacturing, a
robot will pick and place the
various electronic components
from assorted bins and place
them on PCBs at pre-
programmed location on the
board.
3) Multi Layer PCB:-
As electronic components have
reduced in size , so have the
methods used to connect them ,
principally through the evolution
of the printed circuit board to
multi-layer technology.
PCB Manufacturing
process:-
PREPARING THE ARTWORK
Firstly design the required circuit. The
best option is to design the circuit on a
computer and print or plot a 1:1 artwork
onto a transparent film. Ideally print the
artwork via a Laser printer onto Laser
Star film or on an Inkjet Printer with Jet
Star Premium film . If the software allows
print a mirror image of the circuit as this
will ensure the black areas of the
artwork will be in contact to the PCB's
Photo resist during UV exposure.
Pattern transfer:-
There are lots of people mentioned about
using Inkjet Glossy Paper to do Toner Transfer.
It can be done. But it is not easy to remove it
after ironing. You have soak the PCB in hot
water for more than ten minutes. It is quite
time consuming. If you cannot remove the
coating completely. It cannot be etched.
I have tried to use Konica Minolta Photo
Quality Matte Paper/ chromolin film. Then
design your own circuit and print it on the
Matte Paper. Remember, before printing it. You
need to mirror board. Otherwise, the circuit
will be inversed.
ETCHING
◦ The developed and washed board is then placed
into the Etching Tank.
◦ The removal of unwanted copper from the board to
give the final pattern of the circuit is known as
etching. The solution which is used for etching
process as etchant.
◦ The different etchants are used for etching process
like ferric chloride, cupric chloride , chromic acid
and alkaline ammonia. But out of these ferric
chloride is widely used because it has short
etching time and can be stored for long time.
◦ For very fine detail, the board should be turned
upside-down halfway through the etching cycle
(always spray wash the board before handling).
◦ When etching is completed, sprays wash as
before.
SCRUB CLEANING
The board is then thoroughly
dried and mechanically scrubbed
with a PC180 Polifix Silica Block.
This will ensure that the copper
circuit is perfectly clean by
removing any oxidization,
chlorides left by the water as well
as any other impurities.
DRILLING
Drilling of the component mounting holes
in to PCB’s operating in PCB production,
PCB’s holes are made by drills, whenever
the superior hole finish for the plated
through holes, process is required and
where the tooling constant for the
punching tool can’t be justified therefore
drilling is applied by all the professional
grade PCB manufacturers.
Holes through a PCB are typically drilled
with drill bits made of solid coated
tungsten carbide.
Drill Bits:
The drilling of the holes into PCB with
drill bit made of high speed does not
cause any difficulties. However, if the
same bit is used for glass epoxy
material it will cause difficulties.
Drill bits made up of tungsten carbide
are also preferred because very high
operation time between re-
sharpening also excellent qualities of
holes based on this fact.
MOUNTING:
Itis the process of mounting all
electronics components on PCB
with appropriate circuit diagram.
MOUNTING OF IC’s:
Components are basically
mounted on the one side of the
board. It is never expected to put
the IC’s on the PCB directly and
then solder if for the IC’s the
leads of the IC’s are fitted in IC
base and then base is soldered.
SOLDERING PROCESS:
Soldering is a process in which
two or more metal items are
joined together by melting.
The soldering helps to connect
the electronic components
permanently.
Types of soldering:-
1) Soft soldering:-
Itis a process for joining small
parts having low melting points
which damages when soldering
process is carried out at high
temperature. It uses tin-lead alloy
as filler material. The melting
point of the filler material should
be below 400 0C . It uses gas
torch as the heat source.
2) Hard soldering
Inthis process, hard solder
connects two pieces of metals by
expanding into the pores of the
work piece opened by high
temperature. The filler material
possess high temperature above
450 0C
3) Silver soldering
It is a clean process useful for
fabricating small fittings, doing
odd repairs and making tools. It
uses an alloy containing silver as
filler material. Silver provides free
flowing characteristics but silver
solder is not good at gap filling
hence, different fluxes are
recommended for précised silver
solder.
4) Brazing
Brazing is a process of joining
two pieces of base metals by
creating melted metallic filler
that flows by capillary attraction
across the joints and cools to
form a solid bond through atomic
attraction and diffusion. It creates
an extremely strong joint. It uses
brass alloy as filler material.
Soldering Tools:
A soldering iron should supply
sufficient heat to the metal
solder, heat transfer when the
iron tip is applied to the
connection to be soldered is
selected and controlled according
to artwork to be performed
normally controlled by variable
power supply occasionally by tip
selection.
Soldering Gun:

Soldering gun is usually heavier

and generates more heat than
that of average pencil soldering
heavy duty conductors and
connectors required. The use of
gun because it can generate
enough heat to quickly being a
heavy metal joint up to the
proper soldering tools is called as
gun.
Flux:

Sometimes to aid the PCB in soldering

process, another substance known as
flux. Flux is needed to avoid the
oxidation of the surface of metal to be
soldered, from a protective film that
prevents re-oxidation, which the solder
metal melts.
After the component mounting and
soldering extra part of the lid of
component coming out of the PCB
must be cut with the help of cutter.
TECHNOLOGIES FOR COMPONENTS PACKAGING:-

Electronic Packaging: Housing and

interconnection of integrated circuits
to form electronic systems
Electronic Packaging must provide

– Circuit support and protection

– Heat dissipation
– Signal distribution
– Manufacturability and serviceability
– Power distribution
1) Through (Thru) Hole
Mounting:-
Benefits

Easy to solder, either automatically

(wave) or by hand
Easy to de-solder and test
Drawbacks
Signals must necessarily go through
all PCB layers
Low density due to minimum pin
diameter and only one-sided
mounting
2) Surface-Mount
Technology (SMD) :-
The pins of the devices are mounted directly onto
the surface of the PCB
Benefits
Much higher density: pins can be thinner, devices
can be mounted on both sides of the PCB,
components do not block signals in inner layers
Higher degree in the automation of the mounting
process
Less parasitic inductance and capacitance
Reduced costs (½ to ¼) and size (¼ to one tenth)

Drawbacks
Poor manual solderability and reparability
Reliability issues due to thermal/mechanical
stress during soldering and operation (different
thermal expansion coefficients)