Q3 ICT REVIEWER

Teacher: Ms. Teresa Esquierdo

INTRODUCTION TO SOLDERING 8.​ Solder sucker - “desoldering pump”

Soldering used to remove solder from PCBs

-​ Joins metal parts to create an 9.​ Solder preheater - gradually raises

electrical or mechanical bond the temperature of the materials

-​ Involves melting solder and applying 10.​ Soldering helping hands - holds wires

to the parts to be joined when soldering, allows you to creat

Soldering Tools and Equipments precision joints

1.​ Soldering Station - kit that contains 11.​ Soldering mat - heat resistant and

the essential tools for soldering protects your surface from damage

2.​ Soldering Iron - most basic, shaped 12.​ Soldering magnifying glass - used in

like a pen microelectronic soldering

3.​ Soldering Gun - shaped like a pistol, 13.​ Soldering absorber - absorbs solder

uses tin-based solder fumes

4.​ Desoldering Station - uses hot 14.​ Solder tape - used to hold the

air/vacuum to remove excess solder binding metal parts together while

from the iron soldering

5.​ Soldering Pencil - used to solder 15.​ Tweezers set - used to place

smaller metallic elements and components on the circuits

electrical components 16.​ Soldering Iron Tip Cleaner - made of

Soldering Tools and Accessories soft metal shavings coated in flux

1.​ Solder - filler material that melts to 17.​ Solder stand - used to safely keep

join two materials, has two types; the soldering tools when not in use

unleaded and leaded 18.​ Soldering tip thinner - made of mild

2.​ Solder Flux - used to clean the acid, prevents oxidation of tip

surface of the material 19.​ Wire cutter - cuts wire

3.​ Solder flux pen - used to apply flux on 20.​Soldering vise - can hold circuit

the metal surface in specific areas boards firmly

4.​ Solder seal wire connections - SAFETY PRECAUTIONS

connector shaped in the form of a ●​ Wear safety glasses and PPE
small tubes and used to join wires ●​ Avoid putting hands directly over the
5.​ Solder tips - part of soldering iron, soldering process
melts the solder, coated with iron or ●​ Never touch the soldering iron’s tip or
nickel element
6.​ Solder wick - desoldering tool made ●​ Use tweezers, pliers, or clamps to hold
of copper wires the wires you want to heat
7.​ Solder paste - used in PCB assembly ●​ Keep cleaning sponge wet while
for soldering using

1 | Made by: Micah Angeli H. Nivera

 Q3 ICT REVIEWER
Teacher: Ms. Teresa Esquierdo
●​ Work on solid, level surface ●​ 50’s and early 60’s - laminates were
●​ Return the soldering iron to its stand being introduced, using different
when you’re not using it types of resins (single-sided)
●​ Unplug iron/turn off iron when not in Multi-layered PCBs
use -​ Aqueous developed LPIs (liquid photo
●​ Keep electrical cords away from the imageable masks), introduced for
soldering iron’s tip screen processes, becoming the
●​ Read the manufacturer’s instructions global industry standard
and material safety data sheets for -​ Gerber Scientific introduces
all materials “RS-247-D” as a machine-based
●​ Wear gloves and wash your hands format for vector photo plottwes,
with soap and water after removing becoming a standard ASCII vector
the gloves format

HISTORY OF PCBs ●​ 80’s and 90’s - size reduction

Point-to-Point Construction continued, surface mount parts were

-​ Extremely bulky and unreliable introduced and product quality

designs increasing

-​ Required large sockets and regular ●​ 1986 - RS-274X released as

replacements enhancement to RS-274-D. This

First PCBs supported embedded aperture

●​ 1920’s - made of bakelite information

(plastic-like) and thin pieces of wood -​ Rigid-flex and flexible PCB options

wherein they drilled holes with rivets became more affordable bc of

of flat brass wires. Mostly used in multi-layer board meeting the needs

early tube-style radios and of rapidly growing tech.

gramophones ●​ Late 90’s - HDI (High Density

Interconnect) PCBs were developed
by using micro-via tech
HDIs and VIA
-​ HDI tech allowed shorter traces on
the board by reducing the time taken
for electrical signals to travel
●​ 1943 - Dr. Paul Eisner (Austrian
between components
inventor) started making the first
-​ Smaller vias helped reduce overall
operational PCBs
capacitance, reducing voltage
●​ 1947 - first double-sided PCBs were
(batteries), reduced heat generation
produced

2 | Made by: Micah Angeli H. Nivera

 Q3 ICT REVIEWER
Teacher: Ms. Teresa Esquierdo
-​ Inductance also reduced due to high Flexible
density design, lowering effects on -​ Made of materials that can flex and
leads and pins near move (plastic)

PCB DESIGNING -​ High fabrication costs, flexibility and

Printed Circuit Board designing weight savings

-​ Creating layout for PCB, physically Rigid

supports and electrically connects -​ Made of solid substrate material,

alatronic components in a circuit preventing the board from twisting

Steps in Designing a PCB -​ lower cost than flexible PCBs

1.​ Create the schematic Rigid-flex

2.​ Create Blank PCB Layout -​ Combines rigid and flexible boards

3.​ Schematic Capture: Linking to your Highfrequency

PCB -​ For special signal requirements into

4.​ Designing your PCB Stackup electronic circuits that offer a

5.​ Defining Design Rules and DFM frequency range of 500 MHz to 2GHz

Requirements Aluminumbacked

6.​ Place Components -​ Has aluminum backing

7.​ Insert Drill Holes -​ Has a highly thermally conductive

8.​ Route Traces dielectric layer and a standard circuit

9.​ Add Labels and Identifiers later

10.​ Generate Design Files PCB LAYOUT STANDARDS

PCB CLASSIFICATIONS IPC-2221

Single Layer -​ Generic standard that covers almost

-​ Made of base layer coated with a thin every aspect of PCB Design

metal layer -​ Helps ensure PCB is optimized for PCB

-​ Components are soldered on one manufacturing

side (both sides can be used) -​ Establishes standards for PCB design

-​ Low-cost option IPC-2222

Double Layer -​ Standard that dives deeper into

-​ Has conductive metal on both sides requirements for rigid organic printed

with drilled holes for interconnecting board design

circuits -​ Abt factors that enhance

-​ Lighter and smaller than single-layer manufacturability of rigid PCB,

Multi-layer material selection, hole size,

-​ Series of 3 or more double-layered interconnect and mechanical

PCBs properties

-​ Complex designs IPC-2223

3 | Made by: Micah Angeli H. Nivera

 Q3 ICT REVIEWER
Teacher: Ms. Teresa Esquierdo
-​ Focus on flex PCB structure design -​ Essential in PCB layout, provides
-​ Covers pad/via placement, bend electrical connections between
radius, coverlays and structural layers
specifications 1.​ Through-hole - connects top
IPC-2224 and bottom layer
-​ Designing PWBs with PC Cards 2.​ Blind - connects outer layers to
-​ Ensures faultless physical thermal inner layers
and electrical functions of different 3.​ Buried vias - connects inner
boards layers
IPC-2225 Thermal Management
-​ Regulations for designing and ●​ Thermal vias - strategically placed to
assembling bare chips on the improve heat transfer between layers
substrate and to external heat sinks or thermal
-​ Adhesive details, attached dias and pads.
microvia materials PCB LAYOUT
IPC-2226 Steps to Layout
-​ Design considerations for HDI boards 1.​ Understand electrical parameters
(power, ground, signal, and dielectric 2.​ Create a schematic
separation) 3.​ Use a schematic capture tool to
Spacing: Clearance create a PCB layout
-​ shortest distance between two 4.​ Design PCB stackup
conductive elements through air 5.​ Define rules and requirements
-​ depends on factors such as the 6.​ Place components
voltage level of the circuit, the type of 7.​ Insert drill holes
insulating material used, and the 8.​ Route traces
environmental conditions 9.​ Add labels and identifiers
Spacing: Creepage 10.​ Generate layout file
-​ shortest distance between two
PCB TRANSFER PROCEDURE
conductive elements along the
Transfer Procedure
surface of the insulating material
-​ Taking a circuit design and creating
-​ helps prevent the formation of
a physical PCB to ensure proper
conductive paths due to
functionality
contaminants, moisture, or other
-​ Starts with designing a circuit layout,
factors that can cause a short circuit
cleaning the copper-clad board
or leakage current
using sandpaper/alcohol
Via Deisgn
Printed Circuit Board (PCB)

4 | Made by: Micah Angeli H. Nivera

 Q3 ICT REVIEWER
Teacher: Ms. Teresa Esquierdo
-​ Platform that connects and supports -​ protective layer applied to the PCB to
components through conductive prevent soldering in undesired areas
copper paths
-​ Made of insulating materials with a
thin layer of conductive copper to
connect electronic components
(resistors, capacitors, microchips)
​
Gerber File
Soldering
-​ standard digital file format used to
-​ Joining electronic components to the
store and export the PCB layout
board using solder (metal alloy that
design for manufacturing.
melts and hardens)

PCB FABRICATION
Printed Circuit Board (PCBs)
-​ Printed Wiring Board
-​ Creates a compact and efficient
Copper-Clad Board
system for transmitting electrical
-​ board coated with a thin layer of
signals and power
copper on one or both sides, used as
PCB Fabrication
the base for PCB fabrication.
-​ Process of making PCBs
-​ Designing the circuit layout,
transferring onto copper-clad board,
drilling, etching, and plating
Significance of PCB

Toner Transfer Method -​ Create intricate circuits that connect

-​ DIY technique to transfer the circuit multiple components, making it

design onto a PCB using printed possible to build complex electronic

glossy paper and heat. devices like smartphones, computers,

UV Exposure Method and medical equipment

-​ uses photosensitive PCBs and UV -​ Miniaturization, packing more

light to harden the design onto the components into smaller spaces,

board. leading to smaller, more efficient

Etching devices

-​ removing unwanted copper from the -​ Very affordable

board using a chemical solution -​ Can be customized to meet specific

Solder Mask design requirements

5 | Made by: Micah Angeli H. Nivera

 Q3 ICT REVIEWER
Teacher: Ms. Teresa Esquierdo
PCB Fabrication Process ●​ Solder Mask - insulates copper
-​ Etching or removing excess copper traces and prevents oxidation
from inner layers to reveal traces and ●​ Silkscreen - used to print
pads component labels and
-​ Creating the PCB layer stackup by identifiers on the PCB surface
laminating (heating and pressing) ●​ Surface Finishes - proteccts
board materials at high exposed copper and ensure
temperatures good solderability
-​ Drilling holes for mounting holes, 4.​ Chemicals
through hole pins and vias ●​ Etching Solutions - removes
-​ Etching or removing excess copper excess copper
from the surface layer(s) to reveal ●​ Photoresists - used for
traces and pads transferring circuit patterns
-​ Plating pin holes and via holes during photolithography
-​ Adding protective coating to surface ●​ Plating Chemicals -
or solder masking electroplating copper on the
-​ Silkscreen printing reference and board
polarity indicators, logos or other 5.​ Other Materials
markings on the surface ●​ Adhesives - bonding
-​ Optionally, a finish may be added to components or layers
copper areas of surface ●​ Conductive Paste/Ink - printed
electronics or flexible circuits
Materials and Advancements
●​ Testing Materials - probe pins

1.​ Base Materials and jigs for quality testing

●​ Substrate - FR-4,
TYPES OF PCB
CEM-1/CEM-3, Polyimide, and
Cirtek Electronic Corp
Aluminum
-​ Independent complete solution
●​ Copper Foil
provider for subcontract
2.​ Laminate and Prepreg
manufacturing of semiconductor
●​ Laminates - gives mechanical
devices
strength and electrical
-​ provides a broad range of assembly
insulation
and testing services for various
●​ Prepeg - fiberglass cloth
product applications and industries
precoated w resin, used to
PCBWay
bond layer in multilayer PCBs
-​ Chinese-based PCB manufacturing
3.​ Conductive Materials
company that manufactures more

6 | Made by: Micah Angeli H. Nivera

 Q3 ICT REVIEWER
Teacher: Ms. Teresa Esquierdo
than 2100 PCBs daily that are sleection of cleaning materials, and
distributed worldwide equipment
-​ offer a broad spectrum of PCB IPC-610
prototyping, assembly, design, and -​ Standards of PCBAs like cleanliness
CNC/3D printing services requirements that list levels of
Unisem Philippines Inc. residue or other contaminants
-​ Based in the Philippines established IPC-J-STD-001
in 1989, which specializes in PCB -​ Provides guidance on the use of x-ray
manufacturing and assembly to inspect through hole solder
JLCPCB conditions that are not visible by any
-​ the largest PCB manufacturers other means
globally, known for its high-quality PCB Cleaning Goals
and cost-effective PCB solutions. 1.​ Removal of flux residue
DSBJ 2.​ Removal of contaminants
-​ Focuses on LED technology, printed 3.​ Aesthetics
circuit boards, and precision 4.​ Long-term reliability
manufacturing PCB INSPECTION
Shennan Circuit Co., Ltd. Inspection
-​ Offers comprehensive PCB and PCBA -​ Wensures the quality an reliability of
solutions, including design, each board before it becomes part of
manufacturing, and testing an electronic device
PCB CLEANING AND Types of Inspection

FUNCTIONALITY TEST 1.​ Visual Inspections - simplest form,

Cleaning done manually by technicians pr

-​ Having any leftover residues and high-resolution cameras, has its

contaminats removed with a limitations in speed and accuracy

comprehensive cleaning process 2.​ Automated Optical Inspection (AOI)

PCBA Cleaning Standards - uses high resolution cameras and

-​ PCBAs are cleaning before and after image processing sofware to

the assembly to meet requirements automatically inspect PCBs for

of industry acceptability standards defects

-​ Developed by IPC (Institute for Printed 3.​ X-ray Inspection - allows detection of

Circuits) aka Association Connecting hidden defects such as voids in

Electronics Industries solder joints, internal cracks, and

IPC-5704 misaligned layers

-​ Cleanliness requirements on bare 4.​ In-Circuit Testing (ICT) - tests the

PCBs like cleaning processes, electrical functionability of the PCB by

7 | Made by: Micah Angeli H. Nivera

 Q3 ICT REVIEWER
Teacher: Ms. Teresa Esquierdo
checking the resistance, voltage and
signal output. Utilizes a special test
fixture
Common Defects in PCBs
1.​ Solder Joint Defects
2.​ Component Misalignment
3.​ Trace Defects
4.​ Delamination
5.​ Voids in Solder Joints

PCB FUNCTIONALITY TEST

Functional Testing
-​ FCT testing
-​ Last manufacturing step of PCB
creation
-​ Examines the entire assembly
-​ Stimulates the final electrical
environment
Type of Functionality Testing
1.​ Voltage Meter Testing - ensures
voltage levels of PCB at appropriate
amounts
2.​ Load Testing - measures a board’s
capability to withstand pressures and
changes in other parameters
3.​ Quality Control Testing - ensures the
PCB meets the specifications and
regulations of the products

8 | Made by: Micah Angeli H. Nivera