1. Introduction
Recently, there is a growing interest in wearable, portable, and personal health monitoring. By detecting abnormal health conditions during daily monitoring, this approach provides a new method of preventive healthcare. Monitoring human biopotential and neural signals is also important for early diagnosis and medical treatment [
1]. Concerning the biopotential monitoring applications, sensors and their interfaces providing high-quality signals are of great importance. Besides, these sensor devices demand both long operating time and a compact form factor. A battery is widely used, however, it requires frequent battery recharging or replacement, and there is a limit in its size for some applications such as implantable sensors. To achieve a compact form factor by reducing the volume of the battery, low power consumption is in great demand for wearable and portable sensor devices.
Signals from humans have an amplitude of around 1 mV for an electrocardiogram (ECG) and from 10 to 100 µV for an electroencephalogram (EEG) over a frequency band from 0.5 to 150 Hz [
2]. The local field potential (LFP) has a typical amplitude of 1 mV over 1 to 200 Hz. These low-frequency signals must first be amplified before any signal processing can be applied. One issue with amplification is the overlap of these signals with 1/
f noise. To mitigate the effect of 1/
f noise, a chopping technique can be applied for instrumentation amplifiers (IAs) [
3,
4,
5,
6,
7,
8,
9,
10,
11,
12]. Another issue is the electrode offset voltage
VEOS generated at the tissue-electrode interface by electrochemical effects. To reject
VEOS, a DC servo loop (DSL) has been used in a capacitively-coupled chopper instrumentation amplifier (CCIA) [
3]. This approach has the advantage of removing bulky external capacitors. However, the DSL achieves the
VEOS rejection by increased input-referred noise (IRN). The IRN
of a CCIA can be expressed as [
3]
where
represents the input-referred noise of a transconductor. The
Cin,
Cfb, and
CP are the input, feedback, and parasitic capacitors that are connected to the input of the CCIA, respectively. The
Chp is the capacitor in the DSL which is used to create a high-pass corner to reject
VEOS. When a large
Chp is used, the result (1) shows that it increases the IRN by charge dividing, causing the DSL to be a high noise contributor; previous studies often neglected this important issue. For example, the IRN increases from 0.7 to 6.7 µV
rms [
4] and from 2.8 to 4.7 µV
rms [
6] when the DSL is enabled. Thus, in these cases, the DSL contributes 89.5% [
4] and 40.4% [
6] of the overall noise. The increased noise significantly degrades both the noise efficiency factor (NEF) [
7] and the power efficiency factor (PEF) [
10].
Several methods have been proposed to improve the DSL. In [
5], a digitally-assisted foreground calibration is used to allow the DSL to handle residual offset. In [
7], a dual DSL which consists of coarse and fine DSLs reduces the value of
Chp from 670 to 100 fF. In [
8], the output of a DSL is connected to the cascode branch of a transconductor to mitigate the charge dividing effect. Nevertheless, these CCIAs consume 3.48 µW [
7] and 2.13 µW [
8], which results in relatively high PEFs of 18.3 and 10.5 (over a 10-kHz bandwidth), respectively. The results indicate that previous work suffers from high noise contribution from the DSL and achieves a relatively low noise-power efficiency.
In this paper, we investigate two design techniques to realize a 0.6-μW chopper amplifier with a PEF of 11.4 over a 200-Hz bandwidth. The first technique optimizes noise performance using a squeezed-inverter (SQI) stage. Because the SQI stage allows for the reduction of the supply voltage to a saturation limit of 2VDSAT, its bias current can be increased to reduce noise. The second technique is to reduce the relatively high noise from the DSL. Unlike conventional DSLs, which are connected to the input of the CCIA through Chp, we apply the output of the DSL to the body of a transconductor. The proposed approach not only removes the charge dividing effect but also reduces the noise by the transconductance ratio and the open-loop gain. Furthermore, this approach solves the problem of interfacing the DSL to the SQI stage, which has a different supply voltage. Using this approach, the noise contribution of the DSL is reduced to 12.5%. The fabricated CCIA achieves a relatively low noise density of 88 nV/rtHz with an integrated noise of 1.5 μVrms. The result corresponds to a favorable NEF of 5.9 and a PEF of 11.4 by consuming only 0.68 μW, demonstrating a power-efficient low-noise amplifier.
2. Design
Figure 1 shows the schematic of the proposed CCIA. The input transconductor
Gm1 is realized using an SQI stage biased at
VDD,L = 0.2 V. The transconductors
Gm2,
Gm3, and
Gm4 are folded-cascode, two-stage opamp, and common source stages biased at
VDD,H = 0.8 V, respectively. Transconductor
Gm3 is used as the integrator in the DSL. We consider the input offset voltages
VOSi (
i = 1 to 3) for
Gmi. The input
Vin is up-modulated to chopping frequency
fCH by the chopper CH
in, then down-modulated to baseband by CH
out. The common-mode (CM) voltage
VCM2 =
VDD,H/2, which bypasses the chopper CH
out, is used to bias
Gm2 through pseudo-resistors
Rb1,2. A Miller capacitor
Cm1,2 is used for stability. The mid-band gain of the CCIA is defined by input capacitor
Cin1,2 and feedback capacitor
Cfb1.2. The current consumptions of
Gm1,
Gm2,
Gm3, and
Gm4 are 1.61 µA, 60 nA, 210 nA, and 80 nA, respectively.
Although the SQI stage provides low noise operation, interfacing it with the DSL poses a challenge. This is because the input range of the SQI stage is limited by
VDD,L = 0.2 V, while the DSL senses the output
Vout with a wide swing. We believe that this is one reason why previous studies do not implement a DSL [
10]. To solve this problem, we modify the conventional DSL by connecting the output
VO,DSL of the DSL to
Gm2 using the body terminal. We note that this approach is different from the previous approach wherein the output of the DSL is connected to the virtual ground node of the input transconductor through
Chp [
3,
4,
6]. The proposed approach offers several advantages: (1) because the proposed DSL uses
Gm2 instead of
Chp, the charge dividing effect is removed and noise from the DSL is reduced, (2) the noise from DSL is further reduced by the open-loop voltage gain
AV1 of
Gm1 as well as by the square of the transconductance ratio, and (3) by rejecting both
VEOS and
VOS2, output offset is suppressed.
Figure 2 shows the simplified model of the proposed CCIA. Offset voltage
VOS1 creates an output ripple due to finite amplifier bandwidth. The amplitude of the output ripple can be expressed as
Vout,ripple = (
VOS1AV1Gm2)/(2
Cm1,2fCH) [
4]. To suppress this ripple, we use capacitors
Cb1,2 in front of CH
out. Because
VOS1 is blocked by
Cb1,2, the residual ripple appearing at
fCH can be neglected. Both
VOS2 and
VEOS create output offset
Vout,OS at the output. The rejection of
VEOS and
VOS2 is explained as follows: When
VEOS is up-modulated to
fCH, it is partially suppressed by
Cfb1,2 at the virtual input node of
Gm1. The residual offset
VEOS,ω existing at
fCH can be expressed as
VEOS,ω =
VEOS Cin1,2/(
AVCfb1.2), where
AV is the overall open-loop voltage gain of the amplifier. This residual offset is amplified by
AV1. Simulation results show that
AV1 is 29 dB with a low-pass corner of 954 kHz. Additionally, a high-pass corner frequency of 1 Hz is created by
Cin1,2 and bias resistor
R1,2 inside
Gm1 (See
Figure 3). Then,
VEOS,ω is down-converted by CH
out to create an offset voltage
VEOS,Gm2 =
AV1VEOS,ω at the input of
Gm2. We observe the sum of offset voltages,
VOS2,tot =
VOS2 +
VEOS,Gm2, at the input of
Gm2. Transconductors
Gm2 and
Gm4 have a low-pass characteristic with a 3-dB frequency of about 10 Hz, and
VOS2,tot generates offset current
IO,Gm2 at the output of
Gm2. The offset current is integrated by
Gm4, which creates the output offset
Vout,OS. This is sensed by the DSL, then
VO,DSL is applied to the body of the differential pair of
Gm2. The generated current
IO,DSL =
Gmb2VO,DSL compensates
IO,Gm2. The DSL continues integrating, and
Vout,OS is suppressed by the amount 1/
LG(s), where the loop gain
LG can be expressed as
LG(s) =
gmb1,2/(
s2Cm1,2RDSL1,2 CDSL1,2).
The selection of
fCH involves considering the various tradeoff between input impedance, output ripple, and residual offset.
Vout,ripple can be reduced by increasing
fCH. One drawback of increasing
fCH is that it reduces the input impedance
Zin. Besides, there is greater charge injection and clock feed-through during the switching of the chopper [
13]. To determine suitable
fCH, we perform periodic steady-state (PSS) and periodic noise analysis (PNOISE) simulations. Considering the tradeoff and the amplifier bandwidth, we select
fCH = 10 kHz.
3. Circuit Implementation
Figure 3a shows a schematic of the
Gm1 implemented using an SQI stage [
10] modified to improve the common-mode rejection ratio (CMRR). The transistors in the SQI stage are biased in the subthreshold region using
VDD,L = 0.2 V. The IRN of the
Gm1 can be expressed as
where
IDC = 800 nA is the bias current,
gm,n and
gm,p are the transconductance of M
n1 and M
p1, respectively,
Uth = 26 mV is the thermal voltage, and
n = 1.5 is the subthreshold factor [
9]. The SQI stage reduces the noise by increasing
IDC. Because the supply voltage is reduced to a saturation limit of 2
VDSAT~0.2 V, both low noise and low power operation can be achieved.
To generate
IDC, bias voltages beyond supply rails are used for M
n1 and M
p1. The bias voltage for M
n1 is pushed above the supply rail by using a common-mode feedback (CMFB) loop. The bias voltage
VNEG for M
p1 is pushed below the ground by using a negative voltage generator, which is applied to the gate of M
p1 through a pseudo-resistor
R3,4. Because the transistors work in the subthreshold region without a tail current source, balancing the bias current for the input pair is challenging. To address this, we use a shared CMFB loop.
Figure 3b shows the schematic of the CMFB circuit for the SQI stage. It monitors the CM voltage of outputs
V1,ON and
V1,OP. Then, the output
VCMFB1 of the CMFB circuit is applied to the gate of M
n1,,2 through pseudo-resistors
R1,2. Because any change in
VCMFB1 affects the input pair by the same amount, this approach provides balanced bias currents for the SQI stage.
Figure 4a shows the schematic of the negative voltage generator. It consists of a 1/10-scaled current replica, two switched-capacitor (SC) paths, a level shifter, and a folded-cascode (FC) amplifier. The SC network consists of the main path and a low noise replica. The FC amplifier and the main SC path generate the bias voltage
VG for M
1B by regulating
VD to
VDD,L/2. The replica path is responsible for copying
VG to generate
VNEG. The current mirror defines an 80 nA through M
1B, which is the 1/10-scaled current of M
p1,2. The negative voltage generator draws 18 nA from V
DD,H and 80 nA from V
DD,L.
Figure 4b shows the statistical distribution of
VNEG obtained from Monte Carlo simulations. The result shows an average value of −177.3 mV with a standard deviation of 12.4 mV.
Figure 5a,b shows the statistical distributions of the bias current and the output CM voltage obtained from 200 Monte Carlo simulations. Both random mismatch and process variations are considered. The result shows an average bias current of 766 nA with a standard deviation of 62 nA. The output CM voltage shows an average value of 98.3 mV with a standard deviation of 3.4 mV. Compared to previous work which uses two separate CMFB loops [
10], the proposed approach increases the CMRR from 85 to 105 dB. This indicates that the proposed shared CMFB loop is effective in improving CMRR.
Figure 5c shows the gain of the SQI stage depending on temperatures as a function of
VDD,L. Because the transistors are biased in the subthreshold region, the increased threshold voltage with temperature reduces the gain [
10]. We note that the SQI stage still provides a gain >20 dB when
VDD,L is reduced to 0.15 V at 70 °C. At room temperature, the SQI stage achieves a gain of 29 dB with
VDD,L = 0.2 V.
Figure 6 shows a schematic of
Gm2 with the body-controlled DSL. The bias current of
Gm2 is 40 nA. The CMFB circuit (not shown) generates the output
VCMFB2 using a 20 nA bias current (See
Table 1 for the power consumed by the CMFB circuits). The overall current of
Gm2 is only 60 nA.
Figure 7a shows a schematic of the DSL. The
RDSL1,2 and
CDSL1,2 are the resistors and capacitors in the DSL, respectively.
RDSL1,2 is a variable pseudo-resistor controlled by
VPR, which is realized by cascading floating PMOS transistors. The input of
Gm3 is associated with offset
VOS3. Voltage
VOS3 can disturb
Vout of the CCIA similarly to other offsets (
VOS1,
VOS2,
VEOS,Gm2). To reduce the effect of
VOS3, two choppers, CH
D1 and CH
D2, are added to the integrator. Because the bandwidth of the integrator is relatively narrow (~30 mHz),
VOS3 is up-modulated to the outside of the integrator’s bandwidth by CH
D2.
Figure 7b shows a schematic of the two-stage opamp for
Gm3. The first stage is biased using 5 nA. The second stage is biased at 200 nA for enhanced swing. The CMFB circuit generates
VCMFB3 using a 5 nA bias current. The overall current is 210 nA.
The transfer function of the DSL has a low-pass characteristic for
Vout. It can be expressed as −
gmb1,2/(s
RDSL1,2CDSL1,2), where
gmb1,2 is the body transconductance integrated into
Gm2. Within the feedback loop, the DSL creates a high-pass corner to reject
VEOS. Using the condition
Cfb1,2 <<
Cin1,2, the transfer function of the CCIA can be expressed as
where
gm1,2 is the transconductance of the input pair of the
Gm2,
η = (
gmb1,2/
gm1,2) ≈ 0.25,
ωugb = 2
πfugb = 1/(
RDSL1,2CDSL1,2) is the unity-gain frequency of the integrator, and
β =
Cfb1,2/
Cin1,2 is the feedback factor. Using (2), we obtain a high-pass corner frequency
fhp = (
η/
βAV1)
fugb.
Because
fhp created by the DSL depends on the value of pseudo-resistor, we investigate the variability of
RDSL1,2.
Figure 8a shows the value of the
RDSL1,2 as a function of temperature for various
VPR. The resistance increases with
VPR while it decreases with temperature.
Figure 8b shows the statistical distribution of the resistance obtained from Monte Carlo simulations at 27 °C and
VPR = 0.4 V. The result shows that the average value of
RDSL1,2 is 34.1 GΩ with a standard deviation of 1.6 GΩ.
Figure 9 shows a schematic of the bias generator. It consists of a constant-g
m current reference and six branches to generate the bias voltages for the amplifier. Overall current consumption is 47.5 nA.
The proposed CCIA uses a narrow margin for the stacked transistors in the SQI stage. Therefore, we investigate the effect of supply and temperature on the performance of the amplifier.
Figure 10 shows the effect of
VDD,L on the bias current (SQI stage only), noise, and bandwidth. When
VDD,L is increased, it is tracked by
VD and
VG in the negative generator, which increases
VNEG to keep the bias current. When
VDD,L is reduced below 0.15 V, the two stacked transistors are driven in the deep subthreshold region, which reduces the current and the gain. We note that the CCIA still operates with an integrated noise < 1.5 μV
rms when
VDD,L is reduced to 0.15 V. The amplifier bandwidth gradually increases with
VDD,L, which agrees with the previous result [
10].
Because VDD,L is relatively low, an external electromagnetic interference can affect the sensor interface. In the proposed CCIA, the differential input signal VIN is up-modulated to fCH while the CM signal is not chopped. Therefore, chopping provides some means of rejection of external interference. In the case when the external interference exists at around fCH, it can affect the CCIA, however, this is well beyond the amplifier bandwidth (1–200 Hz). When the CCIA is used for the sensor readout, a theoretical input range calculated using a gain of 40 dB and the maximum output swing of 0.8 Vpp is 8 mVpp, which agrees with the measured value of 6 mV. Because the input is capacitively-coupled, it provides a relatively high DC blocking allowed by the voltage rating of Cin1,2.
Figure 11 shows the effect of temperature on the amplifier. The bias current increases with the temperature as expected from the constant-g
m current reference, which increases
VNEG. The two temperature-dependent parameters of the subthreshold current are mobility and the threshold voltage [
14]. The increased threshold voltage with temperature reduces the gain A
v. The bandwidth can be expressed as
BW = ω
p(1+
βA
v), where ω
p is the 3-dB frequency and
β is the feedback factor. Furthermore, the increased temperature reduces the bandwidth [
15,
16]. The amplifier achieves an integrated noise of less than 2 µV
rms over the temperature range from −5 °C to 45 °C.
The IRN of the CCIA,
, can be expressed as
where C
tot = C
in1,2 + C
fb1,2 + C
p,
and
are the input-referred noise of G
m1 and G
m2, respectively,
is the output-referred noise of the DSL, and
gmi represents the transconductance of the transistors in
Gm2. The noise from the DSL includes the thermal noise of
RDSL1,2 and the noise
= 1.8 nV/√Hz of the two-stage opamp. We note that
is not only multiplied by (
gmb1,2/
gm1,2)
2 << 1, but is also reduced by
AV1 = 29 dB. Using the values
gm1,2 = 0.7 µS,
gm3,4 = 0.35 µS,
gm9,10 = 0.7 µS,
Cin1,2 = 4 pF,
Cfb1,2 = 40 fF, and
Cp = 66.5 fF, we obtain
= 84.2 nV/√Hz. Using the shot noise model [
10], we obtain a similar value for
. Over the signal bandwidth of 200 Hz, the integrated noise contributions from
Gm1,
Gm2, DSL, and the other blocks are 44.9%, 39.1%, 12.5%, and 3.5%, respectively.
4. Measured Results
Figure 12 shows a microphotograph of the CCIA fabricated using a 180-nm CMOS process. The core area is 0.19 mm
2. The supply voltages
VDD,L and
VDD,H are generated using external power supplies.
Figure 13 shows the measured frequency response of the CCIA. The result shows a mid-band gain of 40 dB with a 3-dB bandwidth of 800 Hz. The high-pass corner
fhp was successfully created using the proposed DSL and varies from 0.36 to 2.4 Hz when
VPR is changed from 0.68 to 0.35 V.
Figure 14 shows that the measured low-frequency CMRR > 105 dB. The power supply rejection ratios (PSRRs) measured at
VDD,L and
VDD,H show that low-frequency PSRR
L > 80 dB and PSRR
H > 75 dB, respectively.
Figure 15 shows the measured noise spectral density. The input-referred noise density is 88 nV/rtHz, which is slightly higher than the calculated value of 84.2 nV/rtHz. When the DSL is enabled, the noise integrated from 1 to 200 Hz increases from 1.3 to 1.5 μV
rms. We note that the noise contribution from the DSL is just 12.5%, which is much lower than the previous results of 89.5% [
4] and 40.4% [
6].
Figure 16 shows the measured output of the CCIA for prerecorded human EEG (~100 μV) and ECG (~1 mV) input signals [
17].
Table 1 shows the power breakdown of the proposed CCIA.
Table 2 shows a performance comparison with the state of the art. The tradeoff between the noise and power can be evaluated using PEF as
where
Vni,rms is the input-referred root-mean-square (rms) noise voltage,
PDC is the power consumption, and
BW is the amplifier bandwidth. The previous approaches [
4,
7,
12] use relatively-high currents to reduce noise. Because a high supply voltage
VDD > 1 V is used except for in [
6], the large power consumption >1.8 µW leads to a relatively high PEF. By using the SQI stage with an ultra-low voltage, the proposed CCIA achieves a competitive noise performance of 1.5 μV
rms at a relatively low power of 0.61 µW (0.68 µW including bias generators). Our work achieves a good PEF of 10.2 (11.4 with bias generators) which is the lowest of the work shown in
Table 2. Besides, the proposed CCIA has the lowest noise contribution of 12.5% from the DSL. The work in [
10] achieves a good NEF/PEF = 2.1/1.6, however, their design does not include a DSL. Therefore, direct comparison is difficult. Although the dual power approach requires additional buck converter, a high-efficiency (>80%) converter consuming sub-nW can be used for voltage step-down [
18,
19].